Electronic module

Abstract

The invention provides an electronic module which can properly manage the distance between heat dissipation surfaces arranged on two surfaces of the electronic module and an external connection terminal. This electronic module (1) is provided with a first substrate (10), a first electronic component (13) disposed on the first substrate (10), a second substrate (20), a second electronic component (23) disposed on the second substrate (20), external connection terminals (32, 34), and an internal connection terminal (36) that fixes the external connection terminals (32, 34) at predetermined positions between the first substrate (10) and the second substrate (20) by inserting the external connection terminals (32, 34) therethrough, the internal connection terminal (36) is disposed between the first substrate (10) and the second substrate (20) or the second electronic component (23), or between the first electronic component (13) and the second substrate (20) or the second electronic component (23).

Description

Technical Field

[0001] The invention relates to an electronic module. Background Art

[0002] Conventionally, there is known an electronic module in which heat dissipation surfaces are arranged on both sides of the electronic module to dissipate heat from both sides of the electronic module. Patent document 1 describes an electronic module (semiconductor device) 900 comprising an electronic element (semiconductor element) 910, a pair of substrates 920 and 930 arranged to sandwich the electronic element 910, and a conductive spacer 940 interposed between the substrate 930 and the electronic element 910 (see Figure 7 Substrates 920 and 930 include insulating base materials 921 and 931, surface metal bodies 922 and 932 connected to corresponding electrodes, and heat dissipation members (back metal bodies) 923 and 933. Heat generated by electronic component 910 is dissipated from both sides of electronic module 900 via conductive spacer 940, surface metal bodies 922 and 932, and heat dissipation members 923 and 933.

[0003]

Prior Technical Literature

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2022-181822

[0005] However, when the electronic module 900 processes high voltage, in order to ensure the insulation distance between the heat dissipation components 923, 933 arranged on both sides of the electronic module 900 and the external connection terminals (power supply terminals, output terminals) 941, 942, it is desired to arrange the external connection terminals 941, 942 at the middle position in the thickness direction of the heat dissipation components 923, 933 arranged on both sides.

[0006] In the case where the external connection terminals 941 and 942 are arranged at the middle position in the thickness direction of the heat dissipation members 923 and 933 arranged on both sides of the electronic module 900, as a method of electrically connecting the external connection terminals 941 and 942 to the wiring (not shown) formed on the electronic element 910 or the substrates 920 and 930, as shown in FIG. Figure 7 As shown, there can be listed a method of bending the external connection terminal 941 toward the direction where the substrate 930 is configured to connect it to the wiring formed on the substrate 930, or a method of ensuring the insulation distance between the external connection terminals 941 and 942 and the heat dissipation surface by increasing the thickness of the substrate 920.

[0007] However, the method of bending the external connection terminals 941 makes it difficult to manage the distance between the external connection terminals 941 and the substrate 930, and sometimes the insulation distance between the external connection terminals 941 and the wiring arranged on the substrate 930 cannot be ensured. In addition, at the bent portion of the external connection terminals 941, the external connection terminals 941 may come into contact with other electronic components arranged on the substrate 930. On the other hand, the method of thickening the substrate 920 can ensure the insulation distance between the heat dissipation member 923 and the external connection terminals 942, but it is sometimes difficult to ensure the insulation distance between the wiring (not shown) and the external connection terminals 941.

[0008] Therefore, the present invention is completed in view of the above-mentioned problems. In an electronic module having heat dissipation surfaces on both sides of the electronic module and external connection terminals arranged between a first substrate and a second substrate, an electronic module is provided that can appropriately manage the distance between the heat dissipation surfaces arranged on both sides of the electronic module and the external connection terminals. Summary of the Invention

[0009] The electronic module of the present invention is characterized in that it includes: a first substrate; a first electronic component arranged on the first substrate; a second substrate; a second electronic component arranged on the second substrate; an external connection segment; and an internal connection terminal, which is inserted through the external connection terminal to fix the external connection terminal at a specified position between the first substrate and the second substrate, wherein the internal connection terminal is arranged between the first substrate and the second substrate or the second electronic component, or between the first electronic component and the second substrate or the second electronic component.

[0010] Effects of the Invention

[0011] The electronic module of the present invention includes: a first substrate, a second substrate, external connection terminals, and internal connection terminals inserted into the external connection terminals. The internal connection terminals are inserted into the external connection terminals to fix the external connection terminals at a predetermined position between the first substrate and the second substrate. In the electronic module of the present invention, the distance between the first substrate and the second substrate is limited by the length of the internal connection terminals. Therefore, by managing the length of the internal connection terminals, the distance between the first substrate and the second substrate can be properly managed without bending the external connection terminals or using thicker substrates. In addition, since the external connection terminals are fixed at a predetermined position between the first substrate and the second substrate by the internal connection terminals, the distance between the first substrate and the external connection terminals, as well as the distance between the second substrate and the external connection terminals, can also be properly managed. According to the present invention, an electronic module can be provided in which, in the electronic module having heat dissipation surfaces on both sides and the external connection terminals arranged between the first substrate and the second substrate, the distance between the heat dissipation surfaces arranged on both sides of the electronic module and the external connection terminals can be properly managed. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 : is a perspective view of the electronic module 1 of this embodiment. Figure 1 In FIG, the mold resin 40 among the components of the electronic module 1 is omitted from illustration.

[0013] Figure 2 1 is an external view of the electronic module 1 according to the embodiment.

[0014] Figure 3 1 is a side view for explaining the internal structure of the electronic module 1 of this embodiment. Figure 3 In FIG, the mold resin 40 and the internal connection terminals 36 a are omitted from illustration among the components of the electronic module 1 .

[0015] Figure 4 1 is a plan view for explaining the internal structure of the electronic module 1 according to the embodiment. Figure 4 (a) and 4 (b) are plan views of the internal structure of the electronic module 1. Figure 4 In (a), the second substrate 20, the second electronic element 23, and the mold resin 40 are omitted from the illustration of the components of the electronic module 1. Figure 4 (b), except Figure 4 In (a), not only the components shown in the figure are omitted, but also the internal connection terminals 36c and 36d and part of the external connection terminals 34a and 34b are omitted.

[0016] Figure 5 It is a bottom view for explaining the internal structure of the electronic module 1 according to the embodiment. Figure 5 (a) and 5 (b) are bottom views of the internal structure of the electronic module 1. Figure 5 In (a), the first substrate 10 , the first electronic element 13 , and the mold resin 40 among the components of the electronic module 1 are omitted from illustration. Figure 5 (b) except Figure 5 In (a), not only the components shown in the figure are omitted, but also the internal connection terminals 36b and 36d and part of the external connection terminals 34a and 34b are omitted.

[0017] Figure 6 It is a left side view for explaining creeping distances L3 and L4 of the electronic module 1 according to the embodiment.

[0018] Figure 7 1 is a diagram for explaining an electronic module 900 according to the conventional technology. DETAILED DESCRIPTION

[0019] Hereinafter, the electronic module of the present invention will be described based on the embodiments shown in the drawings. In addition, not all elements and combinations thereof described in the embodiments are essential to the solution means of the present invention.

[0020] [Implementation Method]

[0021] 1. Electronic module

[0022] like Figures 1 to 5 As shown, the electronic module 1 of the embodiment includes a first substrate 10, a first heat dissipation member 12, a first electronic component 13, a second substrate 20, a second heat dissipation member 22, a second electronic component 23, external connection terminals 32a, 32b, external connection terminals 34a, 34b, and internal connection terminals 36a, 36b, 36c, and 36d. The electronic module 1 may include other components in addition to the above. Each component is described below.

[0023] The first substrate 10 is a substrate having a first heat dissipating member 12 functioning as a heat dissipating surface arranged on one surface and a first electronic element 13 arranged on the other surface (see Figure 3 、 Figure 4 As the first substrate 10, a ceramic substrate can be used, and preferably a substrate (e.g., a DCB substrate) is used in which copper plates are arranged on both sides of the ceramic substrate. When a DCB substrate is used as the first substrate 10, the copper plate arranged on one side can be used as the first heat dissipation member 12. The first heat dissipation member 12 is exposed to the outside of the molded resin 40. The first substrate 10 has a wiring 11 (see Figure 3 、 Figure 4 ), the wiring 11 is electrically connected to an electrode (not shown) arranged on a surface of the first electronic element 13 opposite to the first substrate 10.

[0024] The term “electrically connected” in this specification includes not only a case where current-carrying portions between elements are in direct contact but also a case where elements are in contact via other conductive elements (eg, solder or pads).

[0025] The first electronic component 13 is an electronic component arranged in the first substrate 10. The first electronic component 13 is provided on the surface of the first substrate 10 opposite the second substrate 20 and is sealed with a molded resin 40. The first electronic component 13 has an electrode (not shown) arranged on the surface opposite the first substrate 10 and electrodes 13a and 13b arranged on the surface opposite the second substrate 20. The electrodes arranged on the surface opposite the first substrate 10 are electrically connected to the wiring 11 provided in the first substrate 10. The electrodes 13a and 13b are electrically connected to the internal connection terminals 36c and 36d. The first electronic device 13 can be, for example, a vertical MOSFET.

[0026] The second substrate 20 is disposed on the side of the first substrate 10 where the first electronic component 13 is disposed, in a state separated from the first substrate 10 and the first electronic component 13. Regarding the second substrate 20, "separated from the first substrate 10 and the first electronic component 13" means that the second substrate 20 is not in direct contact with the first substrate 10 and the first electronic component 13.

[0027] The second substrate 20 is a substrate having a second heat dissipation member 22 configured as a heat dissipation surface on one side and a second electronic component 23 on the other side. A ceramic substrate can be used as the second substrate 20, and preferably a substrate (e.g., a DCB substrate) can be used in which copper plates are configured on both sides of a ceramic substrate. When a DCB substrate is used as the second substrate 20, the copper plate configured on one side can be used as the second heat dissipation member 22. The second heat dissipation member 22 is exposed outside the molded resin 40 (see Figure 2 The second substrate 20 includes wiring 21 (see Figure 3 、 Figure 5 ), the wiring 21 is electrically connected to an electrode (not shown) arranged on a surface opposite to the second electronic element 23 and the second substrate 20.

[0028] The second electronic component 23 is an electronic component arranged on the second substrate 20. The second electronic component 23 is provided on the surface of the second substrate 20 opposite the first substrate 10 and is sealed with a molded resin 40. The second electronic component 23 includes an electrode (not shown) arranged on the surface opposite the second substrate 20 and electrodes 23a and 23b arranged on the surface opposite the first substrate 10. The electrode arranged on the surface opposite the second substrate 20 is electrically connected to the wiring 21 provided on the second substrate 20. The electrodes 23a and 23b are electrically connected to the internal connection terminals 36b and 36d. For example, a vertical MOSFET can be exemplified as the second electronic component 23.

[0029] Internal connection terminals 36a, 36b, 36c, 36d (hereinafter, sometimes "internal connection terminals 36a, 36b, 36c, 36d" are collectively referred to as "internal connection terminals 36") are connection terminals having a columnar shape and are arranged between the first substrate 10 and the second substrate 20 or the second electronic component 23, or between the first electronic component 13 and the second substrate 20 or the second electronic component 23.

[0030] The internal connection terminals 36 are inserted into holes formed in the external connection terminals 32a, 32b and / or the external connection terminals 34a, 34b to fix the external connection terminals 32a, 32b and / or the external connection terminals 34a, 34b at predetermined positions between the first substrate 10 and the second substrate 20.

[0031] Specifically, one end of the internal connection terminal 36 is arranged on the first substrate 10 or on the first electronic component 13 arranged on the first substrate 10 via a bonding material (e.g., solder). The other end of the internal connection terminal 36 is arranged on the second substrate 20 or on the second electronic component 23 arranged on the second substrate 20 via a bonding material (e.g., solder).

[0032] Here, the internal connection terminals 36 have a suitable length suitable for the arranged position.

[0033] Specifically, when the internal connection terminal 36 is arranged between the first electronic component 13 and the second substrate 20, the internal connection terminal 36 is shorter by one thickness of the first electronic component 13 than when the internal connection terminal 36 is arranged where the first electronic component 13 is not arranged.

[0034] When the internal connection terminal 36 is arranged between the first substrate 10 and the second electronic component 23 , the internal connection terminal 36 is shorter by one thickness of the second electronic component 23 than when the internal connection terminal 36 is arranged where the second electronic component 23 is not arranged.

[0035] Moreover, when the internal connection terminal 36 is arranged between the first electronic component 13 and the second electronic component 23, the internal connection terminal 36 used is shorter than the thickness of the first electronic component 13 and the second electronic component 23, compared to the case where the internal connection terminal 36 is arranged in a place where neither the first electronic component 13 or the second electronic component 23 is arranged.

[0036] In the electronic module 1 shown in the embodiment, the internal connection terminal 36a is arranged between the area of the first substrate 10 where the first electronic component 13 is not arranged and the area of the second substrate 20 where the second electronic component 23 is not arranged. On the other hand, the internal connection terminals 36c and 36d are arranged between the first electronic component 13 and the second substrate 20 (see Figure 4 ), the internal connection terminals 36b, 36d are arranged between the first substrate 10 and the second electronic component 23. The internal connection terminals 36b, 36c, 36d are formed shorter than the internal connection terminal 36a by one thickness of the first electronic component 13 or the second electronic component 23.

[0037] By using the internal connection terminals 36 having an appropriate length depending on the arrangement location, the distance between the first substrate 10 and the second substrate 20 can be appropriately managed, and the first substrate 10 and the second substrate 20 can be kept parallel.

[0038] Internal connection terminals 36 are components used for electrical exchange within electronic module 1, managing the distance between first substrate 10 and second substrate 20. One end of internal connection terminal 36 is electrically connected to wiring 11 on first substrate 10 or electrodes 13a, 13b of first electronic component 13. The other end of internal connection terminal 36 is electrically connected to wiring 21 on second substrate 20 or electrodes 23a, 23b of second electronic component 23. Internal connection terminal 36 is also electrically connected to external connection terminal 32 or external connection terminal 34.

[0039] The internal connection terminal 36 electrically connects the first electronic component 13 and the external connection terminals 34a and 34b. Figure 4 As shown in (a) and (b), internal connection terminal 36c, one end of which is disposed on first electronic element 13, electrically connects electrode 13a of first electronic element 13 to external connection terminal 34b. Internal connection terminal 36d also electrically connects electrode 13b of first electronic element 13 to external connection terminal 34a.

[0040] The internal connection terminal 36 electrically connects the second electronic component 23 and the external connection terminals 32b, 34a, and 34b. Figure 5 As shown in (a) and (b), internal connection terminal 36b, one end of which is disposed in second electronic component 23, electrically connects electrode 23a of second electronic component 23 to external connection terminals 32b and 34b. Internal connection terminal 36d also electrically connects electrode 23b of second electronic component 23 to external connection terminal 34a.

[0041] The internal connection terminals 36 can be connected to the wiring 11 of the first substrate 10 and / or the wiring 21 of the second substrate 20. Furthermore, the internal connection terminals 36 can also be connected to the external connection terminals 32 and 34. The internal connection terminals 36a of the electronic module 1 are electrically connected to the wiring 11 of the first substrate 10, the wiring 21 of the second substrate 20, and the external connection terminals 32a.

[0042] The cross-sectional area and material of the internal connection terminals 36, as well as the number of internal connection terminals 36 used, are preferably selected in consideration of the amount of current flowing therethrough. For example, to cope with high currents, the internal connection terminals 36 that electrically connect the electrode 23a of the second electronic component 23 to the external connection terminal 32b in the electronic module 1 include three thick internal connection terminals 36b.

[0043] External connection terminals 32a, 32b (in the following description, "external connection terminals 32a, 32b" are sometimes collectively referred to as "external connection terminals 32") are terminals that connect the wiring 11 of the first substrate 10, the electrodes 13a, 13b of the first electronic component 13, the wiring 21 of the second substrate 20 or the electrodes 23a, 23b of the second electronic component 23 to the outside of the electronic module 1 via the internal connection terminals 36.

[0044] The external connection terminal 32 is a power terminal capable of handling large currents. Figure 3 As shown, a portion of the external connection terminal 32 extends parallel to the first and second substrates 10 and 20 in the region between the first and second substrates 10 and 20. At least one end of the external connection terminal 32 is exposed outside the molded resin 40 and is configured to be connectable to an external terminal (not shown).

[0045] External connection terminals 34a, 34b (in the following description, "external connection terminals 34a, 34b" are sometimes collectively referred to as "external connection terminals 34". In addition, "external connection terminals 32a, 32b" and "external connection terminals 34a, 32b" are sometimes collectively referred to as "external connection terminals 32, 34") are terminals that connect the wiring 11 of the first substrate 10, the electrodes 13a, 13b of the first electronic component 13, the wiring 21 of the second substrate 20 and / or the electrodes 23a, 23b of the second electronic component 23 to the outside of the electronic module 1 via the internal connection terminals 36.

[0046] The external connection terminal 34 is a terminal corresponding to a smaller current than the external connection terminal 32. Figure 3 As shown, a portion of the external connection terminal 34 is arranged in the region between the first substrate 10 and the second substrate 20, extending parallel to the first substrate 10 and the second substrate 20. The external connection terminal 34 is configured so that at least one end is exposed to the outside of the molded resin 40 and can be connected to an external terminal not shown. In addition, the external connection terminal 32 and the external connection terminal 34 may also be arranged as shown in FIG. Figure 5 In (a), the external connection terminal 32b and the external connection terminal 34b are connected to each other as shown.

[0047] Holes are formed in the external connection terminals 32 and 34. Internal connection terminals 36 are inserted through the holes. Furthermore, the external connection terminals 32 and 34 are fixed at predetermined positions between one end and the other end of the internal connection terminals 36 inserted into the holes. This allows for the distances between the first substrate 10, first electronic component 13, second substrate 20, second electronic component 23, and the external connection terminals 32 and 34 to be managed.

[0048] The length of the internal connection terminals 36 and the positions at which the external connection terminals 32 and 34 are connected to the internal connection terminals 36 are configured so that the distance between the external connection terminals 32 and 34 and any one of the first substrate 10 and the first electronic component 13, which are arranged near the external connection terminals 32 and 34, is longer than a predetermined insulation distance. Furthermore, the length of the internal connection terminals 36 and the positions at which the external connection terminals 32 and 34 are connected to the internal connection terminals 36 are configured so that the distance between the external connection terminals 32 and 34 and any one of the second substrate 20 and the second electronic component 23, which are arranged near the external connection terminals, is longer than a predetermined insulation distance.

[0049] Specifically, the length of the internal connection terminals 36 and the positions at which the external connection terminals 32 and 34 are connected to the internal connection terminals 36 are configured so that the distance between the external connection terminals 32 and 34 and any one of the first substrate 10 and the first electronic component 13, which are arranged near the external connection terminals 32 and 34, is longer than the insulation distance. Furthermore, the length of the internal connection terminals 36 and the positions at which the external connection terminals 32 and 34 are connected to the internal connection terminals 36 are configured so that the distance between the external connection terminals 32 and 34 and any one of the second substrate 20 and the second electronic component 23, which are arranged near the external connection terminals 32 and 34, is longer than the insulation distance.

[0050] The distance between the first substrate 10 and the external connection terminals 32, 34, and the distance between the first electronic component 13 and the external connection terminals 32, 34 can be adjusted by adjusting the length of the internal connection terminal 36 arranged between the first substrate 10 or the first electronic component 13 and the external connection terminals 32, 34, and adjusting the position in the internal connection terminal 36 where the external connection terminals 32, 34 are connected to the internal connection terminal 36.

[0051] In addition, the distance between the second substrate 20 and the external connection terminals 32, 34, and the distance between the second electronic component 23 and the external connection terminals 32, 34 can be adjusted by adjusting the length of the internal connection terminal 36 arranged between the second substrate 20 or the second electronic component 23 and the external connection terminals 32, 34, and adjusting the position in the internal connection terminal 36 where the external connection terminals 32, 34 are connected to the internal connection terminal 36.

[0052] In the electronic module 1 of this embodiment, the first electronic component 13 is arranged at a position closer to the external connection terminals 32 and 34 than the first substrate 10. The distance between the first electronic component 13 and the external connection terminals 32 and 34 is L1. In addition, the second electronic component 23 is arranged at a position closer to the external connection terminals 32 and 34 than the second substrate 20. The distance between the second electronic component 23 and the external connection terminals 32 and 34 is L2 (see Figure 3 ).

[0053] The distance L1 between the first electronic component 13 and the external connection terminals 32 and 34 is configured to be longer than the insulation distance. Furthermore, the distance L2 between the second electronic component 23 and the external connection terminals 32 and 34 is configured to be longer than the insulation distance. Here, the insulation distance refers to the distance at which a short circuit does not occur between the external connection terminals 32 and 34 and the first substrate 10 or the second substrate 20.

[0054] By configuring the distance L1 between the first electronic component 13 and the external connection terminals 32 and 34 and the distance L2 between the second electronic component 23 and the external connection terminals 32 and 34 to be longer than the insulation distance, short circuits between the external connection terminals 32 and 34 and the first electronic component 13, and between the external connection terminals 32 and 34 and the second electronic component 23 can be suppressed.

[0055] When the first substrate 10 is arranged closer to the external connection terminals 32 and 34 than the first electronic component 13 , the first electronic component 13 described above is replaced by the first substrate 10 , thereby suppressing a short circuit between the external connection terminals 32 and 34 and the first substrate 10 .

[0056] When the second substrate 20 is arranged closer to the external connection terminals 32 and 34 than the second electronic component 23 , the second electronic component 23 described above is replaced by the second substrate 20 , thereby suppressing a short circuit between the external connection terminals 32 and 34 and the second substrate 20 .

[0057] The mold resin 40 seals the surface of the first substrate 10 on the side where the first electronic element 13 is arranged and the first electronic element 13 (see Figure 2 ) In addition, the mold resin 40 seals the surface of the second substrate 20 on the side where the second electronic element 23 is arranged and the second electronic element 23 .

[0058] The heat dissipation surface of the first substrate 10 , ie, the surface on which the first heat dissipation member 12 is arranged, and the heat dissipation surface of the second substrate 20 , ie, the surface on which the second heat dissipation member 22 is arranged, are exposed from the mold resin 40 .

[0059] The molded resin 40 has a first recessed portion 41 and a second recessed portion 42 .

[0060] The first recessed portion 41 is provided in the electronic module 1 on a surface 43 of the molded resin 40 where the first heat dissipating member 12 is exposed (see Figure 6 ) in the figure, between the boundary between the exposed portion of the first heat dissipation component 12 and the portion of the first heat dissipation component 12 covered by the molded resin 40, and the outer edge of the outer shape of the molded resin 40 and the outer edge of the outer shape in the direction in which the external connection terminal 32 or the external connection terminal 34 extends.

[0061] The second recessed portion 42 is provided in the electronic module 1 on a surface 44 of the molded resin 40 where the second heat dissipating member 22 is exposed (see Figure 2 、 Figure 6 ) in the figure, between the boundary between the exposed portion of the second heat dissipation component 22 and the portion of the second heat dissipation component 22 covered by the molded resin 40, and the outer edge of the outer shape constituting the resin molded portion 40 and constituting the outer edge of the outer shape in the direction in which the external connection terminal 32 or the external connection terminal 34 extends.

[0062] like Figure 2 and Figure 6 As shown, in electronic module 1, first recess 41 is formed by digging (digging) the exposed surface 43 of first heat dissipating member 12 out of molded resin 40. Second recess 42 is formed by exposing surface 44 of second heat dissipating member 22 from molded resin 40 in electronic module 1.

[0063] The first recessed portion 41 and / or the second recessed portion 42 may be formed by recessing the molded resin 50 over the entire circumference, so that the first recessed portion 41 and the second recessed portion 42 are combined together and the molded resin 40 is formed into a tapered shape, such as Figure 2 shown.

[0064] The first recessed portion 41 is configured to have a distance L3 between the external connection terminals 32, 34 and the first heat dissipating component 12 along the outer surface of the molded resin 50 (hereinafter, “the distance L3 between the external connection terminals 32, 34 and the first heat dissipating component 12 along the outer surface of the molded resin 50” is referred to as “the surface distance L3”), which is longer than the prescribed insulation distance.

[0065] The second recessed portion 42 is configured to be longer than the prescribed insulation distance, L4, between the external connection terminals 32, 34 and the first heat dissipation component 12 and the outer surface of the molded resin 50 (hereinafter, "the distance L4 between the external connection terminals 32, 34 and the second heat dissipation component 22 and the outer surface of the molded resin 50" is referred to as "the surface distance L4").

[0066] This can suppress short circuits of the molded resin 40 along the outer surface between the first heat dissipating member 12 and the external connection terminals 32 and 34. Also, short circuits of the molded resin 40 along the outer surface between the second heat dissipating member 22 and the external connection terminals 32 and 34 can be suppressed.

[0067] Furthermore, the external connection terminals 32 and 34 are arranged at the midpoint of the thickness direction of the first heat dissipation member 12 arranged on the first substrate 10 and the second heat dissipation member 22 arranged on the second substrate 20. Figure 6 As shown, the external connection terminals 32 , 34 are arranged at positions where the creepage distance L3 between the external connection terminals 32 , 34 and the first heat dissipation member 12 and the creepage distance L4 between the external connection terminals 32 , 34 and the second heat dissipation member 22 are the same.

[0068] Thus, when the creepage distance L3 between the external connection terminals 32 and 34 and the first heat dissipation member 12 and the creepage distance L4 between the external connection terminals 32 and 34 and the second heat dissipation member 22 are longer than the insulation distance, the thickness of the electronic module 1 can be reduced while preventing short circuits.

[0069] When the thicknesses of the external connection terminals 32 and 34 are different, arranging the external connection terminals 32 and 34 at the "midpoint of the thickness direction of the first heat dissipation component 12 and the second heat dissipation component 22" means that the external connection terminals 32 and 34 that will affect the determination of the insulation distance, that is, the thickest external connection terminals 32 and 34 are arranged at the midpoint of the thickness direction of the first heat dissipation component 12 and the second heat dissipation component 22.

[0070] Regarding the external connection terminals 32 and 34 , it is also preferable to select the cross-sectional area (width, thickness) of the external connection terminals 32 and 34 in consideration of the amount of current flowing.

[0071] Next, the effects of the electronic module 1 according to the present embodiment will be described.

[0072] The electronic module 1 of this embodiment includes a first substrate 10, a second substrate 20, external connection terminals 32 and 34, and internal connection terminals 36 inserted through the external connection terminals 32 and 34. The internal connection terminals 36 are inserted through the external connection terminals 32 and 34 to secure the external connection terminals 32 and 34 at a predetermined position between the first substrate 10 and the second substrate 20. The distance between the first substrate 10 and the second substrate 20 of the electronic module 1 of this embodiment is controlled by the length of the internal connection terminals 36. Therefore, by controlling the length of the internal connection terminals 36, the distance between the first substrate 10 and the second substrate 20 can be controlled without bending the external connection terminals 32 and 34 or using thicker substrates. Furthermore, since the external connection terminals 32 and 34 are secured at predetermined positions between the first substrate 10 and the second substrate 20 by the internal connection terminals 36, the distance between the first substrate 10 and the external connection terminals 32 and 34, and the distance between the second substrate 20 and the external connection terminals 32 and 34 can also be appropriately controlled. According to the embodiment, the electronic module 1 has heat dissipation surfaces on both sides of the electronic module 1 and the external connection terminals 32 and 34 are arranged between the first substrate 10 and the second substrate 20. Therefore, it is an electronic module that can appropriately manage the distance between the first substrate 10 and the external connection terminals 32 and 34 and the distance between the second substrate 20 and the external connection terminals 32 and 34.

[0073] In the electronic module 1 of this embodiment, the internal connection terminal 36 electrically connects the first electronic element 13 and the external connection terminals 32 and 34. According to the electronic module 1 of this embodiment, current can flow from the external connection terminals 32 and 34 to the first electronic element 13 through the internal connection terminal 36.

[0074] In the electronic module 1 of this embodiment, the internal connection terminal 36 electrically connects the second electronic component 23 and the external connection terminals 32 and 34. According to the electronic module 1 of this embodiment, current can flow from the external connection terminals 32 and 34 to the second electronic component 23 through the internal connection terminal 36.

[0075] In the electronic module 1 of this embodiment, the length of the internal connection terminals 36 and the positions at which the external connection terminals 32 and 34 of the internal connection terminals 36 are connected to the internal connection terminals 36 are configured so that the distance between the external connection terminals 32 and 34 and any one of the first substrate 10 and the second electronic component 13, which are positioned near the external connection terminals 32 and 34, is longer than a predetermined insulation distance. Furthermore, the distance between the external connection terminals 32 and 34 and any one of the second substrate 20 and the second electronic component 23, which are positioned near the external connection terminals 32 and 34, is longer than a predetermined insulation distance. This prevents short circuits between the external connection terminals 32 and 34 and the first and second substrates 10 and 20, resulting in a highly reliable electronic module.

[0076] The electronic module 1 of the embodiment further includes a molded resin 40. The first electronic component 13, the surface of the first substrate 10 on which the first electronic component 13 is arranged, the second electronic component 23, and the surface of the second substrate 20 on which the second electronic component 23 is arranged are sealed by the molded resin 40. The heat dissipation surface of the first substrate 10 and the heat dissipation surface of the second substrate 20 are exposed from the molded resin 40. With this electronic module 1, the insulation voltage can be increased without compromising heat dissipation characteristics, and the reliability of the electronic module 1 can also be improved.

[0077] like Figure 6 As shown, the electronic module 1 according to this embodiment further includes a first recessed portion 41 disposed on a surface 43 of the first heat dissipating member 12 exposed from the molded resin 40, and a second recessed portion 42 disposed on a surface 44 of the second heat dissipating member 22 exposed from the molded resin 40. The first recessed portion 41 is configured such that a creepage distance L3 along the outer surface of the molded resin 40 between the external connection terminals 32, 34 and the first heat dissipating member 12 is longer than a predetermined insulation distance. The second recessed portion 42 is configured such that a creepage distance L4 along the outer surface of the molded resin 40 between the external connection terminals 32, 34 and the second heat dissipating member 22 is longer than a predetermined insulation distance. This allows the edge surface distances L3 and L4 to be longer than in the absence of the recessed portions 41 and 42. As a result, creepage short circuits along the molded resin 40 between the first heat dissipating member 12 and the external connection terminals 32, 34, and between the second heat dissipating member 22 and the external connection terminals 32, 34, can be suppressed.

[0078] The present invention has been described above based on the above embodiment, but the present invention is not limited to the above embodiment and can be implemented in various forms within the scope of the present invention. For example, the following modifications are possible.

[0079] (1) The shape, number, size, position, etc. of the components of the present invention are not limited to those described above or shown in the drawings, and may be modified as appropriate without impairing the characteristics of the present invention.

[0080] For example, in the above embodiment, the number of first electronic component 13 and the number of second electronic component 23 are each one, but the present invention is not limited to this. The number of first electronic component 13 and the number of second electronic component 23 can also be multiple. Alternatively, the electronic components can be arranged on only one of the first substrate 10 and the second substrate 20.

[0081] (2) The electronic module of the present invention may further include electronic components and structures other than the first electronic component 13 on the first substrate 10 . Also, electronic components and structures other than the second electronic component 23 may further include electronic components and structures on the second substrate 20 .

[0082] (3) As the first electronic component 13 in the electronic module of the present invention, electronic components other than MOSFET (for example, various diodes, transistors other than vertical MOSFET, thyristors) may be used. This also applies to the second electronic component 23.

[0083] Explanation of symbols

[0084] 1…electronic module; 10…first substrate; 12…first heat dissipation member; 13…first electronic component; 20…second substrate; 22…second heat dissipation member; 23…first electronic component; 32, 32a, 32b, 34, 34a, 34b…external connection terminals; 36, 36a, 36b, 36c, 36d…internal connection terminals; 40…molded resin; 41…first recess; 42…second recess.

Claims

1. An electronic module, characterized in that: include: a first substrate; a first electronic component disposed on the first substrate; a second substrate; a second electronic component disposed on the second substrate; External connection segment; as well as an internal connection terminal inserted through the external connection terminal to fix the external connection terminal at a predetermined position between the first substrate and the second substrate; The internal connection terminal is configured between the first substrate and the second substrate or the second electronic component, or between the first electronic component and the second substrate or the second electronic component.

2. The electronic module according to claim 1, wherein: The internal connection terminal electrically connects the first electronic component and the external connection terminal.

3. The electronic module according to claim 1, wherein: The internal connection terminal electrically connects the second electronic component and the external connection terminal.

4. The electronic module according to claim 1, wherein: The length of the internal connection terminal and the position in the internal connection terminal where the external connection terminal is connected to the internal connection terminal are configured so that the distance between the external connection terminal and any one of the first substrate and the first electronic component arranged at a position close to the external connection terminal is longer than a prescribed insulation distance, and the distance between the external connection terminal and any one of the second substrate and the second electronic component arranged at a position close to the external connection terminal is longer than a prescribed insulation distance.

5. The electronic module according to any one of claims 1 to 4, characterized in that: The electronic module further comprises a molding resin, The first electronic component, the surface of the first substrate on which the first electronic component is arranged, the second electronic component, and the surface of the second substrate on which the second electronic component is arranged are sealed by the mold resin, and the heat dissipation surface of the first substrate and the heat dissipation surface of the second substrate are exposed from the mold resin.

6. The electronic module according to claim 5, characterized in that: The electronic module further includes: a first heat dissipation member disposed on the first substrate; a second heat dissipation member disposed on the second substrate; a first recessed portion disposed on a surface of the molded resin exposed to the first heat dissipation member; and a second recessed portion disposed on a surface of the molded resin exposed to the second heat dissipation member. The first recessed portion is configured such that a creepage distance along the outer surface of the molded resin between the external connection terminal and the first heat dissipating member is longer than a predetermined insulation distance. The second recessed portion is arranged such that a creepage distance along the outer surface of the mold resin between the external connection terminal and the second heat dissipating member is longer than a predetermined insulation distance.

Images