Electronic module

Abstract

The invention provides an electronic module capable of improving heat dissipation performance compared with a conventional electronic module. This electronic module (1) is provided with a first substrate (10), a first heat-generating component (12), and a molded resin, and is characterized by further comprising: a second substrate (20) disposed in a state separated from the first substrate (10) and the first heat-generating component (12); and a first heat transfer member (14) that transfers heat generated by the first heat generating component (12) to the second substrate (20). The surface of the first substrate (10) on the opposite side from the side on which the first heat generating component (12) is disposed and the surface of the second substrate (20) on the opposite side from the first substrate (10) are exposed to the outside of the electronic module (1). According to the electronic module (1), not only heat generated by the first heat generating component (12) can be dissipated through the first substrate (10), but also heat can be dissipated through the second substrate (20) through the first heat transfer member (14).

Description

Technical Field

[0001] The invention relates to an electronic module. Background Art

[0002] In the past, an electronic module was known, comprising: a substrate; a heat-generating component (for example, a semiconductor chip such as MOSFET) arranged on the substrate; and a molded resin for sealing the surface of the substrate on the side where the heat-generating component is arranged and the heat-generating component, wherein the surface of the substrate on the side opposite to the side where the heat-generating component is arranged is exposed outside the electronic model (see patent document 1).

[0003] According to the conventional electronic module, the surface of the substrate opposite to the side where the heat generating component is arranged is exposed to the outside of the electronic module. Therefore, heat generated by the heat generating component can be easily dissipated to the outside of the electronic module through the substrate.

[0004]

Prior Technical Literature

[0005] [Patent Document 1] International Publication No. 2020 / 208741

[0006] However, electronic components are the most common heat-generating components in electronic modules. Research on these components has advanced rapidly in recent years, with the practical application of next-generation electronic components using semiconductor materials such as SiC and GaN. While these components can be miniaturized (and thus, densified), they require greater attention to heat dissipation. Consequently, within the electronic module technology field, there is a need to improve their heat dissipation.

[0007] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an electronic module capable of improving heat dissipation performance compared with conventional electronic modules. Summary of the Invention

[0008] The electronic module of the present invention includes: a first substrate; a first heat-generating component, arranged on the first substrate; and a molded resin, used to seal the surface of the first substrate on the side where the first heat-generating component is arranged and the first heat-generating component, and is characterized in that it further includes: a second substrate, arranged on the side of the first substrate where the first heat-generating component is arranged in a state separated from the first substrate and the first heat-generating component; and a first heat transfer member, which transfers the heat generated by the first heat-generating component to the second substrate, wherein the surface of the first substrate opposite to the side where the first heat-generating component is arranged and the surface of the second substrate opposite to the first substrate side are exposed to the outside of the electronic module.

[0009] Effects of the Invention

[0010] The electronic module of the present invention includes: a second substrate, which is arranged on the side of the first substrate where the first heat-generating component is arranged in a state separated from the first substrate and the first heat-generating component; and a first heat transfer member, which transfers the heat generated by the first heat-generating component to the second substrate. In addition, the surface of the first substrate opposite to the side where the first heat-generating component is arranged and the surface of the second substrate opposite to the first substrate are exposed to the outside of the electronic module. Therefore, according to the electronic module of the present invention, the heat generated by the first heat-generating component can be dissipated not only through the first substrate, but also through the second substrate via the first heat transfer member. Therefore, the electronic module of the present invention is an electronic module that can improve heat dissipation compared with previous electronic modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a perspective view of the electronic module 1 according to this embodiment.

[0012] Figure 2 1 is an external view of the electronic module 1 according to the embodiment. Figure 2 (a) is a plan view of the electronic module 1. Figure 2 (b) is a left side view of the electronic module 1. Figure 2 (c) is a bottom view of the electronic module 1 .

[0013] Figure 3 It is a perspective view of the internal structure of the electronic module 1 according to this embodiment. Figure 3 Among the components of the electronic module 1 , the mold resin 40 is not shown.

[0014] Figure 4 1 is a plan view for explaining the internal structure of the electronic module 1 according to the embodiment. Figure 4 (a) and 4 (b) are plan views of the internal structure of the electronic module 1. Figure 4 In (a), the second substrate 20, the second heat generating component 22, the second spacer 25, and the mold resin 40 among the components of the electronic module 1 are not shown. Figure 4 (b), except Figure 4 In addition to the components not shown in (a), the first heat transfer member 14 , the first spacer 15 , the first internal connection terminal 16 , the first external connection terminal 30 , and the other external connection terminals 35 are not shown.

[0015] Figure 5 It is a side view for explaining the internal structure of the electronic module 1 according to the embodiment. Figure 5 (a) is a left side view of the internal structure of the electronic module 1. Figure 5 (b) is an enlarged representation Figure 5 (a) is a diagram showing the vicinity of the first heat transfer member 14 . Figure 5 (c) is a right side view of the internal structure of the electronic module 1. Figure 5 (d) is an enlarged representation Figure 5 (c) is a diagram of the vicinity of the second heat transfer member 24. Figure 5 (a)~ Figure 5 In (d), the first internal connection terminal 18 , the second internal connection terminal 28 , the other external connection terminals 34 and 37 , and the mold resin 40 among the components of the electronic module 1 are not shown. Figure 5 (b) and Figure 5 Arrows H1 to H4 indicated by dotted lines in (d) indicate heat transfer (heat dissipation) during operation.

[0016] Figure 6 It is a bottom view for explaining the internal structure of the electronic module 1 according to the present embodiment. Figure 6 (a) and Figure 6 (b) is a bottom view of the internal structure of the electronic module 1. Figure 6 In (a), the first substrate 10, the first heat generating component 12, the first spacer 15, and the mold resin 40 among the components of the electronic module 1 are not shown. Figure 6 (b), except Figure 6 In addition to the components not shown in (a), the second heat transfer member 24 , the second spacer 25 , the second internal connection terminal 26 , the second external connection terminals 32 a and 32 b , and the other external connection terminal 36 are not shown. DETAILED DESCRIPTION

[0017] The electronic module of the present invention is described below based on the embodiments shown in the accompanying drawings. The embodiments described below do not limit the inventions involved in the claims. In addition, not all elements and their combinations described in the embodiments are essential to the solutions of the present invention.

[0018] like Figures 1 to 6 As shown, the electronic module 1 of the embodiment includes: a first substrate 10, a first heat-generating component 12, a first heat-transfer member 14, a first spacer 15, first internal connecting terminals 16 and 18, a second substrate 20, a second heat-generating component 22, a second heat-transfer member 24, a second spacer 25, second internal connecting terminals 26 and 28, a first external connecting terminal 30, second external connecting terminals 32a and 32b, other external connecting terminals 34, 35, 36, and 37, and a molded resin 40. The electronic module 1 may include other components in addition to the above components. Each component is described below.

[0019] The first substrate 10 is a substrate on which the first heat generating component 12 is disposed. The first substrate 10 is formed by disposing copper plates on both sides of a ceramic substrate (e.g., a DCB substrate). The surface of the first substrate 10 opposite to the side on which the first heat generating component 12 is disposed is exposed to the outside of the electronic module 1 (the outside of the molded resin 40) (see Figure 2 (c) The first substrate 10 has a first heat generating component 12 and is electrically connected to a first drain electrode (first and second electrodes, described later).

[0020] The term “electrically connected” in this specification includes not only a case where current-carrying portions between elements are in direct contact but also a case where elements are in contact via other conductive elements (for example, solder or spacers).

[0021] The first heat-generating component 12 is disposed on the first substrate 10. In this specification, a "heat-generating component" refers to an electronic component that generates heat when in use (when powered on). Examples of heat-generating components include, but are not limited to, electronic elements (typically semiconductor chips), resistors, coils, and capacitors.

[0022] The first heat-generating component 12 is a vertical electronic component having a first electrode and a first second electrode. In this specification, a "vertical electronic component" refers to an electronic component having at least two electrodes (a first electrode and a second electrode) on its surface, with the first electrode disposed on the side opposite to the second electrode. A "vertical electronic component" can also be referred to as an "electronic component having electrodes on both sides."

[0023] Specifically, the first heat generating component 12 is a vertical MOSFET (refer to FIG. 1 ) having: a first source electrode (first first electrode) 12a arranged on the side of the second substrate 20, a first drain electrode (first second electrode) arranged on the side of the first substrate 10. Not shown. ,) and a first gate electrode 12b arranged on the same side as the first source electrode 12a. Figure 4 (b) In addition, the first heat generating component 12 has three first source electrodes 12a.

[0024] The first heating component 12 and the second heating component 22 have different heating timings. If the timings of the increase and decrease in heating of the first heating component and the second heating component are inconsistent during actual use, the condition of "different heating timings" in this specification is satisfied. In addition, the above-mentioned "heating timing" is preferably "maximum heating timing". In this case, the above-mentioned feature can also be expressed as "when the electronic module 1 is in use, the first heating component 12 and the second heating component 22 are controlled to have different timings of maximum heating". The electronic module 1 of this embodiment is used to form a half-bridge circuit, with the first heating component 12 used as the high side and the second heating component 22 used as the low side.

[0025] The first heat transfer member 14 is a member that transfers the heat generated in the first heat generating component 12 to the second substrate 20 (see Figure 5 (a) and Figure 5 (b)). The first heat transfer member 14 is a roughly columnar member that is connected to the first heat-generating component 12 and the second substrate 20 in a manner that enables heat exchange, and the main part is formed integrally. The first heat transfer member "connected in a manner that enables heat exchange" includes not only the case where the first heat transfer member is in direct contact with the target member, but also the case where the first heat transfer member is connected to the target member through other members (for example, solder or gasket). The above-mentioned "other members" are preferably composed of a material with good thermal conductivity (for example, a metal material). The same applies to the second heat transfer member.

[0026] Here, use Figure 5 (b) The following describes heat transfer (heat dissipation) related to the first heat-generating component 12 in the electronic module 1. The first heat-generating component 12 is disposed on the first substrate 10. Therefore, the heat generated by the first heat-generating component 12 is dissipated outside the electronic module 1 via the first substrate 10 (see arrow H1).

[0027] Furthermore, the electronic module 1 includes a first heat transfer member 14 that transfers heat generated by the first heat-generating component 12 to the second substrate 20. Therefore, heat generated by the first heat-generating component 12 is dissipated outside the electronic module 1 via a path through the first heat transfer member 14 and the second substrate 20, in addition to the path through the first substrate 10 (see arrow H2).

[0028] The first heat transfer member 14 is made of a conductive material and is electrically connected to the electrode of the first heat-generating component 12. In other words, the first heat transfer member 14 can also be said to have the function of being a member that exists inside the electronic module 1 and is used for electrical exchange, i.e., an internal connection terminal. The first heat transfer member 14 is electrically connected to the first source electrode (first first electrode) 12a. The electronic module 1 and the first heat-generating component 12 have three first source electrodes 12a and are provided with three first heat transfer members 14 accordingly. In addition, the end of the first heat transfer member 14 on the side opposite to the first heat-generating component 12 is electrically connected to the wiring pattern of the second substrate 20.

[0029] The first spacer 15 is a tray-shaped member made of a conductive material and interposed between the first source electrode 12a of the first heat-generating component 12 and the first heat transfer member 14. Although not shown, the first source electrode 12a and the first spacer 15 are joined together by a conductive bonding material (e.g., solder). Furthermore, the first spacer 15 and the first heat transfer member 14 are also joined together by a conductive bonding material.

[0030] First internal connection terminals 16 and 18 are components present within electronic module 1 and used for electrical exchange. First internal connection terminal 16 is electrically connected to first gate electrode 12b of first heat generating component 12 and other external connection terminals 35. First internal connection terminal 18 is electrically connected to first substrate 10 and other external connection terminals 34.

[0031] The second substrate 20 is a substrate that is arranged on the side of the first substrate 10 on which the first heat-generating component 12 is arranged, in a state separated from the first substrate 10 and the first heat-generating component 12. With respect to the second substrate, "a state separated from the first substrate and the first heat-generating component" means a state in which the second substrate is not in direct contact with the first substrate and the first heat-generating component. Therefore, if the second substrate is not in direct contact with the first substrate and the first heat-generating component, then even if the component in contact with the second substrate is also in contact with the first substrate or the first heat-generating component, it can be said that the second substrate is "in a state separated from the first substrate and the first heat-generating component."

[0032] The second substrate 20 is formed by placing copper plates on both sides of a ceramic substrate (e.g., a DCB substrate). The surface of the second substrate 20 opposite to the first substrate 10 is exposed to the outside of the electronic module 1 (the outside of the molded resin 40) (see Figure 2 (a) The second substrate 20 has a second drain electrode (second electrode, described later) of the second heat generating component 22 and is electrically connected thereto.

[0033] The second heat generating component 22 is arranged on the surface of the second substrate 20 on the side of the first substrate 10. The second heat generating component 22 is a vertical electronic component having a second first electrode and a second second electrode. Specifically, the second heat generating component 22 is a vertical MOSFET (refer to FIG. 1 ) having: a second source electrode (second first electrode) 22a arranged on the side of the first substrate 10, a second drain electrode (second second electrode) arranged on the side of the second substrate 20. (Not shown), and a second gate electrode 22b arranged on the same side as the second source electrode 22a. Figure 6 (b) In addition, the second heat generating component 22 has three second source electrodes 22a.

[0034] The second heat transfer member 24 is a member that transfers the heat generated in the second heat generating component 22 to the first substrate 10 (see Figure 5 (c) and Figure 5 (d) The second heat transfer member 24 is a substantially columnar member connected to the second heat generating component 22 and the first substrate 10 so as to be able to exchange heat with each other, and the main portion thereof is integrally formed.

[0035] Here, use Figure 5(d) The following describes the heat transfer (heat dissipation) associated with the second heat-generating component 22 in the electronic module 1. The second heat-generating component 22 is disposed on the second substrate 20. Therefore, the heat generated by the second heat-generating component 22 is dissipated outside the electronic module 1 via the second substrate 20 (see arrow H3).

[0036] The electronic module 1 also includes a second heat transfer member 24 that transfers heat generated by the second heat-generating component 22 to the first substrate 10. Therefore, heat generated by the second heat-generating component 22 is dissipated outside the electronic module 1 through a path that passes through the second heat transfer member 24 and the first substrate 10, in addition to the path that passes through the second substrate 20 (see arrow H4).

[0037] The second heat transfer member 24 is made of a conductive material and is electrically connected to the electrode of the second heat generating component 22. In other words, the second heat transfer member 24 can be said to also have the function of an internal connection terminal of a member that exists inside the electronic module 1 and is used for electrical exchange. The second heat transfer member 24 is electrically connected to the second source electrode (second first electrode) 22a. The electronic module 1 and the second heat generating component 22 have three second source electrodes 22a and are provided with three second heat transfer members 24 correspondingly. In addition, the end of the second heat transfer member 24 on the opposite side to the second heat generating component 22 is connected to the wiring pattern of the first substrate 10.

[0038] The second spacer 25 is made of a conductive material and is a tray-shaped member interposed between the second source electrode 22a of the second heat-generating component 22 and the second heat transfer member 24. Although not shown, the second source electrode 22a and the second spacer 25 are joined by a conductive bonding material (e.g., solder). Furthermore, the second spacer 25 and the second heat transfer member 24 are also joined by a conductive bonding material.

[0039] The second internal connection terminals 26 and 28 are components present inside the electronic module 1 and used for electrical exchange. The second internal connection terminal 26 is electrically connected to the second gate electrode 22b of the second heat-generating component 22 and the other external connection terminal 36. The second internal connection terminal 28 is electrically connected to the second substrate 20 and the other external connection terminal 37.

[0040] The first external connection terminal 30 is electrically connected to the first heat transfer member 14 between the first substrate 10 and the second substrate 20, and has at least one end exposed to the outside of the molded resin 40. In the electronic module 1, the first external connection terminal 30 is a detection terminal for the first source electrode 12a of the first heat generating component 12.

[0041] The second external connection terminals 32a and 32b are electrically connected to the second heat transfer member 24 between the first substrate 10 and the second substrate 20, and have at least one end exposed to the outside of the molded resin 40. The second external connection terminal 32a in the electronic module 1 is a power terminal capable of handling large currents. Furthermore, the second external connection terminal 32b in the electronic module 1 is a detection terminal for the second source electrode 22a of the second heat-generating component 22. Furthermore, the second external connection terminals 32a and 32b are integrally formed.

[0042] The other external connection terminals 34, 35, 36, and 37 are electrically connected to components other than the first heat transfer member 14 and the second heat transfer member 24, and are members with at least one end exposed to the outside of the molded resin 40. The other external connection terminal 34 is a power terminal electrically connected to the first internal connection terminal 18. The other external connection terminal 35 is a control terminal electrically connected to the first internal connection terminal 16. The other external connection terminal 36 is a control terminal electrically connected to the second internal connection terminal 26. The other external connection terminal 37 is a power terminal electrically connected to the second internal connection terminal 28.

[0043] The mold resin 40 seals the surface of the first substrate 10 on the side where the first heat generating component 12 is arranged and the first heat generating component 12 (see Figure 1 and Figure 2 )) In addition, the mold resin 40 also seals the surface of the second substrate 20 on the side where the second heat generating component 22 is arranged and the second heat generating component 22 .

[0044] Next, the effects of the electronic module 1 according to this embodiment will be described.

[0045] The electronic module 1 of the present embodiment includes: a second substrate 20 that is arranged on a side of the first substrate 10 where the first heat-generating component 12 is arranged, in a state separated from the first substrate 10 and the first heat-generating component 12; and a first heat transfer member 14 that transfers heat generated by the first heat-generating component 12 to the second substrate 20. In addition, the surface of the first substrate 10 opposite to the side where the first heat-generating component 12 is arranged and the surface of the second substrate 20 opposite to the first substrate 10 are exposed to the outside of the electronic module 1. Therefore, according to the electronic module 1 of the present embodiment, the heat generated from the first heat-generating component 12 can be dissipated not only via the first substrate 10, but also via the first heat transfer member 14 and the second substrate 20. Therefore, the electronic module 1 of the present embodiment is an electronic module that can improve heat dissipation compared with conventional electronic modules.

[0046] Furthermore, in the electronic module 1 of this embodiment, the first heat-generating component 12 has electrodes, and the first heat-conducting member 14 is made of a conductive material and is electrically connected to the electrodes of the first heat-generating component 12. Therefore, according to the electronic module 1 of this embodiment, the first heat-conducting member 14 can be used for electrical exchange between the first heat-generating component 12 and other components, allowing for functional concentration and miniaturization of the electronic module 1.

[0047] Furthermore, in the electronic module 1 of this embodiment, the first heat-generating component 12 is a vertical electronic component having a first source electrode (first-first electrode) 12a and a first drain electrode (first-second electrode). The first heat transfer member 14 is electrically connected to the first source electrode 12a, and the first substrate 10 is electrically connected to the first drain electrode. Therefore, according to the electronic module 1 of this embodiment, by using a vertical electronic component having electrodes on both sides as the first heat-generating component 12, it is possible to simultaneously achieve improved heat dissipation and reduced size.

[0048] The electronic module 1 of this embodiment includes first external connection terminals 30 electrically connected to the first heat transfer member 14 between the first substrate 10 and the second substrate 20 .

[0049] Furthermore, the electronic module 1 of this embodiment includes a second heat-generating component 22 disposed on a surface of the second substrate 20 on the first substrate 10 side, and a second heat-transfer member 24 that transfers heat generated by the second heat-generating component 22 to the first substrate 10. Therefore, according to the electronic module 1 of this embodiment, the second heat-generating component 22 can be disposed on the second substrate 20 to increase mounting density, and heat dissipation of the second heat-generating component 22 can also be improved.

[0050] Furthermore, in the electronic module 1 of this embodiment, the second heat-generating component 22 has electrodes, and the second heat-transfer member 24 is made of a conductive material and is electrically connected to the electrodes of the second heat-generating component 22. Therefore, according to the electronic module 1 of this embodiment, the second heat-transfer member 24 can be used for electrical exchange between the second heat-generating component 22 and other components, allowing for functional concentration and miniaturization of the electronic module 1.

[0051] Furthermore, in the electronic module 1 of the embodiment, the second heat-generating component 22 is a vertical electronic component having a second source electrode (second-first electrode) 22a and a second drain electrode (second-second electrode). The second heat transfer member 24 is electrically connected to the second source electrode 22a, and the second substrate 20 is electrically connected to the second drain electrode. Therefore, according to the electronic module 1 of this embodiment, by using a vertical electronic component having electrodes on both sides as the second heat-generating component 22, it is possible to simultaneously achieve improved heat dissipation and reduced size.

[0052] Furthermore, the electronic module 1 of this embodiment includes second external connection terminals 32 a and 32 b electrically connected to the second heat transfer member 24 between the first substrate 10 and the second substrate 20 . Therefore, the electronic module 1 of this embodiment can directly draw current from the second heat transfer member 24 via the second external connection terminals 32 a and 32 b.

[0053] Furthermore, in the electronic module 1 of this embodiment, the first heat generating component 12 and the second heat generating component 22 generate heat at different times. Therefore, according to the electronic module 1 of this embodiment, the timing at which heat is generated in the first heat generating component 12 and the second heat generating component 22 can be staggered, thereby reducing the amount of heat temporarily generated within the electronic module 1.

[0054] Furthermore, in the electronic module 1 of this embodiment, the first substrate 10 and the second substrate 20 are formed by placing copper plates on both sides of a ceramic plate. Therefore, the electronic module 1 of this embodiment can further improve heat dissipation by using substrates having high thermal conductivity.

[0055] The present invention has been described above based on the above embodiment, but the present invention is not limited to the above embodiment and can be implemented in various forms within the scope of the present invention. For example, the following modifications are possible.

[0056] (1) The shape, number, size, position, etc. of the components of the present invention are not limited to those described above or shown in the drawings, and may be modified as appropriate without impairing the characteristics of the present invention.

[0057] For example, in the above embodiment, the number of the first heat generating component 12 is one, but the present invention is not limited thereto. The number of the first heat generating component may be multiple. The above matters also apply to the second heat generating component.

[0058] (2) The electronic module of the present invention may further include a heat-generating component other than the first heat-generating component (a heat-generating component without a corresponding first heat transfer member) and other structures on the first substrate. Furthermore, the electronic module of the present invention may further include a heat-generating component other than the second heat-generating component (a heat-generating component without a corresponding second heat transfer member) and other structures on the second substrate.

[0059] (3) The electronic module of the present invention may not include the second heat-generating component and the second heat transfer member.

[0060] (4) The electronic module of the present invention may not include the first spacer and the second spacer.

[0061] (5) Although the first external connection terminal 30 is a detection terminal, the second external connection terminal 32a is a power terminal, and the second external connection terminal 32b is a detection terminal, the present invention is not limited thereto. The function of each external connection terminal can be appropriately set according to the structure of the electronic module, etc.

[0062] (6) As the first heat-generating component of the electronic module of the present invention, a heat-generating component other than a vertical MOSFET may be used. Examples of heat-generating components other than a vertical MOSFET include electronic components other than a vertical MOSFET (diodes, transistors, thyristors, etc.), resistors, coils, and capacitors. The same applies to the second heat-generating component.

[0063] Explanation of symbols

[0064] 1…electronic module; 10…first substrate; 12…first heat-generating component; 12a…first source electrode (first first electrode); 12b…first gate electrode; 14…first heat transfer member; 20…second substrate; 22…second heat-generating component; 22a…second source electrode (second first electrode); 22b…second gate electrode; 24…second heat transfer member; 30…first external connection terminal; 32a…second external connection terminal; 32b…second external connection terminal; 40…molded resin.

Claims

1. An electronic module comprising: a first substrate; A first heat-generating component is disposed on the first substrate; and a molded resin for sealing the surface of the first substrate on the side where the first heat-generating component is disposed and the first heat-generating component, characterized in that it further comprises: a second substrate disposed on a side of the first substrate where the first heat-generating component is disposed, in a state separated from the first substrate and the first heat-generating component; and a first heat transfer member, transferring heat generated by the first heat generating component to the second substrate; The surface of the first substrate opposite to the side where the first heat-generating component is arranged and the surface of the second substrate opposite to the first substrate side are exposed to the outside of the electronic module.

2. The electronic module according to claim 1, wherein: The first heat-generating component has an electrode. The first heat transfer member is made of a conductive material and is electrically connected to the electrode of the first heat generating component.

3. The electronic module according to claim 2, wherein: The first heat-generating component is a vertical electronic component having a first electrode and a first second electrode. The first heat transfer member is electrically connected to the first first electrode, The first substrate is electrically connected to the first and second electrodes.

4. The electronic module according to claim 2, characterized in that Further including: The first external connection terminal is electrically connected to the first heat transfer member between the first substrate and the second substrate.

5. The electronic module according to claim 1, characterized in that Further including: a second heat-generating component disposed on a surface of the second substrate on the first substrate side; as well as The second heat transfer member transfers heat generated by the second heat-generating component to the first substrate.

6. The electronic module according to claim 5, characterized in that: The second heat-generating component has an electrode, The second heat transfer member is made of a conductive material and is electrically connected to the electrode of the second heat generating component.

7. The electronic module according to claim 6, wherein: The second heat-generating component is a vertical electronic component having a second first electrode and a second second electrode. The second heat transfer member is electrically connected to the second first electrode, The second substrate is electrically connected to the second electrode.

8. The electronic module according to claim 6, characterized in that Further including: The second external connection terminal is electrically connected to the second heat transfer member between the first substrate and the second substrate.

9. The electronic module according to claim 5, characterized in that: The first heat-generating component generates heat at a different timing than the second heat-generating component.

10. The electronic module according to claim 1, wherein: The first substrate and the second substrate are formed by placing copper plates on both surfaces of a ceramic plate.

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