Heat exchange device, vehicle-mounted electronic equipment and vehicle

Abstract

The invention relates to a heat exchange device, vehicle-mounted electronic equipment and a vehicle, the heat exchange device is used for forming heat exchange with a part to be subjected to heat exchange, and the heat exchange device comprises a base, a plurality of first-class fins and a plurality of second-class fins. The base is used for mounting a part to be subjected to heat exchange; the multiple first-type fins are arranged in the first area of the base at intervals so as to be suitable for heat exchange of the part, located in the first area, of the part to be subjected to heat exchange; the multiple second-type fins are arranged in the second area of the base at intervals so as to be suitable for heat exchange of the part, located in the second area, of the part to be subjected to heat exchange; the first type of fins and the second type of fins are manufactured by adopting different processes, so that the first type of fins and the second type of fins have different heat exchange parameters. According to the technical scheme, the first type of fins and the second type of fins can be used for conducting heat exchange with the first area and the second area in a concentrated mode respectively, and the heat exchange requirement of the part to be subjected to heat exchange can be met at low cost.

Description

Technical Field

[0001] The present invention relates to the technical field of heat exchangers, and in particular to a heat exchange device, an on-vehicle electronic device and a vehicle. Background Art

[0002] Air-cooled radiators are used in vehicles due to their simpler structure and easier maintenance compared to liquid cooling solutions. They are suitable for cooling electronic devices integrated into the vehicle, such as domain controllers and in-cabin displays. Air-cooled radiators typically consist of a fan and fins. The fins are placed between the fan and the device to dissipate heat, transferring the heat generated by the device during operation.

[0003] In the related art, in order to obtain better heat dissipation effect, the manufacturing cost of the fins used on the radiator is relatively high, while the lower-cost fins are difficult to use on devices with higher heat generation. When used in electronic equipment and other devices on vehicles, the use of fins on the radiator often cannot obtain heat exchange capacity that adapts to higher heat dissipation requirements at a lower manufacturing cost, which limits the application of air-cooled radiators in heat exchange of electronic equipment. Summary of the Invention

[0004] Embodiments of the present invention provide a heat exchange device, an on-vehicle electronic device, and a vehicle, which improve the safety of the heat exchange device and at least partially solve the above-mentioned technical problems.

[0005] In order to achieve the above-mentioned object, according to a first aspect of the present invention, there is provided a heat exchange device for performing heat exchange with a heat exchange component, comprising:

[0006] A base, used for mounting the heat exchange component;

[0007] a plurality of first-type fins, spaced apart in a first region of the base, suitable for exchanging heat with a portion of the heat-exchanged component located in the first region;

[0008] a plurality of second-type fins, spaced apart in the second region of the base, suitable for exchanging heat with a portion of the heat-exchanged component located in the second region;

[0009] The first type of fins and the second type of fins are manufactured using different processes, so that the first type of fins and the second type of fins have different heat exchange parameters.

[0010] In some embodiments, the thickness of the first type of fins ranges from 1 to 2 mm; the thickness of the second type of fins ranges from 0.2 mm to 0.5 mm; and / or,

[0011] The spacing between adjacent first-type fins ranges from 4 to 6 mm; the spacing between adjacent second-type fins ranges from 1 to 1.5 mm.

[0012] In some embodiments, the first type of fins and the second type of fins are arranged in parallel.

[0013] In some embodiments, the heat exchange device further comprises:

[0014] A heat exchange fan is provided on the base and is adapted to supply air to the first type of fins and / or the second type of fins during operation.

[0015] In some embodiments, the first type of fins and the second type of fins constitute a whole located between the heat exchange fan and the base.

[0016] In some embodiments, the heat exchange fan is disposed on a side close to the second type of fins relative to the entirety formed by the first type of fins and the second type of fins.

[0017] In some embodiments, the first type of fins and the second type of fins are arranged at one end of the base along a first direction; in a second direction different from the first direction, the second type of fins are arranged between the heat exchange fan and the first type of fins.

[0018] In some embodiments, the heat exchange device further comprises:

[0019] a plurality of diverter fins, arranged along the second direction between the second type of fins and the heat exchange fan;

[0020] Wherein, the spacing between adjacent diverter fins is greater than the spacing between adjacent second-type fins.

[0021] In some embodiments, the base is provided with:

[0022] An accommodating cavity, suitable for accommodating the heat-exchanged component;

[0023] The heat exchange device further comprises:

[0024] The heat-conducting adhesive layer is arranged in the accommodating cavity and is suitable for contacting the heat-exchanged component in the accommodating cavity.

[0025] In some embodiments, the heat exchange device further comprises:

[0026] a first connecting member, connecting a plurality of the first-type fins;

[0027] a second connecting member, connecting a plurality of the second-type fins;

[0028] Wherein, a plurality of the first type fins are formed on a side of the first connecting member away from the base; a plurality of the second type fins are formed on a side of the second connecting member away from the base;

[0029] At least one of the first connecting member and the second connecting member is provided with a heat-conducting boss; the heat-conducting boss is in contact with the heat-conducting adhesive layer.

[0030] According to a second aspect of the present invention, there is also provided an on-vehicle electronic device, comprising a component to be heat exchanged and the heat exchange device as described above, wherein the component to be heat exchanged is mounted on the base.

[0031] According to a third aspect of the present invention, a vehicle is further provided, comprising the heat exchange device as described above, or comprising the vehicle-mounted electronic device as described above.

[0032] In the heat exchange device of the embodiment of the present invention, through the above-mentioned technical scheme, the first type of fins and the second type of fins can be used respectively to concentrate on exchanging heat with the first area and the second area respectively. The heat exchange parameters of the first type of fins and the second type of fins are different, that is, the heat exchange capacities of the two are different. In the area with higher heat generation, fins with higher heat exchange capacity made by a relatively high-cost process are selected, and in the area with lower heat generation, fins with lower heat exchange capacity made by a relatively low-cost process are selected to match the different heat generation values of different areas on the heat exchange part, so as to meet the heat exchange requirements of the heat exchange part at a lower cost.

[0033] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0035] In order to more completely understand the present invention and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same reference numerals in the following description represent the same parts.

[0036] Figure 1 is a schematic diagram of the overall structure of an in-vehicle electronic device provided in an exemplary embodiment of the present invention;

[0037] Figure 2 yes Figure 1 a cutaway view of the interior of the vehicle's electronic equipment;

[0038] Figure 3 yes Figure 1A schematic diagram of the structure of the vehicle-mounted electronic equipment part at a first viewing angle is shown;

[0039] Figure 4 yes Figure 1 A schematic diagram of the structure of the vehicle-mounted electronic equipment part at a second viewing angle is shown;

[0040] Figure 5 is a schematic diagram of the overall structure of a heat exchange device provided in an exemplary embodiment of the present invention;

[0041] Figure 6 yes Figure 5 A schematic structural diagram of a partial structure of a heat exchange device shown;

[0042] Figure 7 yes Figure 6 A partial enlarged view of point A in the middle.

[0043] Description of reference numerals:

[0044] 10. On-board electronic equipment; 11. Parts to be heat-exchanged; 100. Heat exchange device; 110. Base; 110a. Accommodation cavity; 111. Housing; 120. First type fins; 120a. First channel; 130. Second type fins; 130a. Second channel; 140. Heat exchange fan; 150. Diverter fins; 160. Heat-conducting boss; 170. First connecting member; 180. Second connecting member; 190. Fairing. DETAILED DESCRIPTION

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0046] According to the first aspect of the present invention, referring to Figures 1 to 7 As shown, the present invention provides a heat exchange device 100 for performing heat exchange with a heat-exchange component 11. Specifically, the heat exchange device 100 can be configured to dissipate heat or heat the heat-exchange component 11 according to actual needs. The present invention mainly uses the heat exchange device 100 for dissipating heat from the heat-exchange component 11 as an example to illustrate the inventive concept.

[0047] The heat exchange device 100 provided by the present invention includes: a base 110 , a plurality of first-type fins 120 , and a plurality of second-type fins 130 .

[0048] Base 110 is used to mount heat exchange component 11. For example, if heat exchange component 11 is an electronic device integrated into a vehicle, base 110 can be used to position the circuit board on which the electronic device is mounted. Circuit boards often integrate chips, with different chips positioned at different locations on the board. Different chips may generate different amounts of heat. To accommodate scenarios where different areas of heat exchange component 11 generate varying amounts of heat, the present invention provides multiple first-type fins 120 and multiple second-type fins 130 on base 110.

[0049] Among them, reference Figure 1 and Figure 2 As shown, a plurality of first-type fins 120 are spaced apart in a first region of the base 110, and first channels 120a for airflow are formed between adjacent first-type fins 120, suitable for heat exchange with the portion of the heat exchange element 11 located in the first region. A plurality of second-type fins 130 are spaced apart in a second region of the base 110, and second channels 130a for airflow are formed between adjacent second-type fins 130, suitable for heat exchange with the portion of the heat exchange element 11 located in the second region.

[0050] It is understandable that the present invention mentions that the first type of fins 120 are suitable for heat exchange with the portion of the heat exchange component 11 located in the first area, which means that the first type of fins 120 are mainly used for heat exchange with the portion of the heat exchange component 11 located in the first area adjacent to it, rather than the first type of fins 120 can only exchange heat with the portion of the heat exchange component 11 located in the first area, that is, the heat exchange effect of the first type of fins 120 on the first area is higher than the heat exchange effect on the second area. Correspondingly, the present invention mentions that the second type of fins 130 are suitable for heat exchange with the portion of the heat exchange component 11 located in the second area, which means that the second type of fins 130 are mainly used for heat exchange with the portion of the heat exchange component 11 located in the second area adjacent to it, rather than the second type of fins 130 can only exchange heat with the portion of the heat exchange component 11 located in the second area, that is, the heat exchange effect of the second type of fins 130 on the second area is higher than the heat exchange effect on the first area.

[0051] The first type fins 120 and the second type fins 130 are manufactured using different processes so that the first type fins 120 and the second type fins 130 have different heat transfer parameters. The heat transfer parameters mentioned in the present invention refer to the dimensional parameters or thermal conductivity coefficients of the first type fins 120 or the second type fins 130 caused by their processing technology that affect the heat transfer efficiency. For example, the heat transfer parameters of the first type fins 120 can be the spacing between adjacent first type fins 120, the thickness of the first type fins 120, etc., and the heat transfer parameters of the first type fins 120 can be the spacing between adjacent second type fins 130, the thickness of the second type fins 130, etc.

[0052] In the related art, there are various processing techniques for manufacturing fins of a heat sink. These processing techniques may cause changes in the heat transfer parameters of the fins due to differences in processing equipment, processing conditions, etc.

[0053] For example, fins manufactured using a die-casting process have a lower manufacturing cost, but due to mold limitations, the die-cast heat dissipation fins cannot be densely packed, resulting in poor heat dissipation effects.

[0054] For example, the fins manufactured by the cold forging process have a higher manufacturing cost than the rubber die-casting process, but the molded fins have higher precision and better heat dissipation effect than the die-cast fins.

[0055] Another example is the fins manufactured using the stamping and then fin-locking process. The stamped fins are fixed in a custom mold, and a small protruding section on the fins is bent and locked together to form a neatly arranged, densely packed, parallel heat sink fin assembly. These fins are relatively thin, and the fin-locking process allows for closer spacing between the fins than die-cast fins, resulting in better heat dissipation than die-casting and cold-forging processes, but the manufacturing cost is higher.

[0056] In the present invention, the integration of first-type fins 120 and second-type fins 130 with different heat exchange parameters on the base 110 is suitable for adaptively exchanging heat between regions of the heat exchange component with different heat generation. For example, if the heat generation of the heat exchange component in the first region is lower than that of the second region, the first-type fins 120 can be configured as fins manufactured using a die-casting process, while the second-type fins 130 can be configured as fins manufactured using a stamping and then fin-fastening process, thereby adaptively meeting the heat exchange requirements of different regions of the heat exchange component 11.

[0057] By adopting the above scheme, the first type of fins 120 and the second type of fins 130 can be used respectively to concentrate on heat exchange with the first area and the second area. The heat exchange parameters of the first type of fins 120 and the second type of fins 130 are different, that is, the heat exchange capacities of the two are different. In areas with higher heat generation, fins with higher heat exchange capacity made by relatively high-cost processes are selected, and in areas with lower heat generation, fins with lower heat exchange capacity made by relatively low-cost processes are selected to match the different heat generation values of different areas on the heat exchange component 11, so that the heat exchange requirements of the heat exchange component 11 can be met at a lower cost.

[0058] Based on the above, the present invention dissipates heat from the heat exchange element 11 by flexibly configuring the first and second fins 120, 130. This utilizes different heat exchange parameters to achieve differential heat dissipation in different areas of the heat exchange element 11. Specifically, the heat exchange parameters can be limited to match the heat dissipation effects of the first and second fins 120, 130 on the heat exchange element 11.

[0059] As an example, the first type of fins 120 and the second type of fins 130 can have different heat exchange parameters by limiting the value range of the thickness of the first type of fins 120 and the value range of the thickness of the second type of fins 130. At the same time, or optionally, the first type of fins 120 and the second type of fins 130 can have different heat exchange parameters by limiting the value range of the spacing between adjacent first type fins 120 and the value range of the spacing between adjacent second type fins 130. As a result, the first type of fins 120 and the second type of fins 130 have different heat exchange capabilities to meet the differentiated heat dissipation requirements of different areas of the heat exchange component 11.

[0060] In some optional embodiments, referring to Figure 3 and Figure 7 As shown, the thickness a of the first type of fins ranges from 1 to 2 mm; the thickness b of the second type of fins ranges from 0.2 mm to 0.5 mm. That is, the heat transfer parameters of the first type of fins 120 include the thickness of the first type of fins 120, and the heat transfer parameters of the second type of fins 130 include the thickness of the second type of fins 130. To achieve the aforementioned thickness limitation of the first type of fins 120, for example, a die-casting process can be used to manufacture the first type of fins 120; to achieve the aforementioned thickness limitation of the second type of fins 130, for example, a stamping and post-finning process can be used to manufacture the second type of fins 130.

[0061] For example, refer to Figures 3 to 7 As shown, in some other optional embodiments, the spacing c between adjacent first-type fins ranges from 4 to 6 mm; the spacing d between adjacent second-type fins ranges from 1 to 1.5 mm. To achieve the aforementioned spacing limit between adjacent first-type fins 120, for example, the first-type fins 120 can be manufactured using a die-casting process; to achieve the aforementioned spacing limit between adjacent second-type fins 130, for example, the second-type fins 130 can be manufactured using a stamping and then finning process.

[0062] It is understandable that the first type fins 120 can be manufactured by a die casting process to simultaneously achieve a thickness range of 1-2 mm for the first type fins 120 and a spacing range of 4-6 mm between adjacent first type fins 120 .

[0063] Accordingly, the second type fins 130 can be manufactured by a stamping and then buckling Fin process, so as to simultaneously achieve a thickness range of 0.2mm-0.5mm for the second type fins 130 and a spacing range of 1-1.5mm between adjacent second type fins 130.

[0064] Accordingly, by limiting the sizes of the first type of fins 120 and the second type of fins 130 , the sizes of the first type of fins 120 and the second type of fins 130 can be adapted to the heat dissipation of different parts of the heat exchange element 11 .

[0065] Considering the impact of the relative positions of the first type fins 120 and the second type fins 130 on the heat exchange capacity of the heat exchange device 100, the first type fins 120 and the second type fins 130 can be specifically arranged in parallel. For example, as shown in the figure, the first type fins 120 and the second type fins 130 are spaced apart in the left-right direction as shown, and both the first type fins 120 and the second type fins 130 extend in the left-right direction, so that the first type fins 120 and the second type fins 130 are arranged in parallel.

[0066] It is understood that the parallel arrangement of the first-type fins 120 and the second-type fins 130 mentioned in the present invention includes both a scheme in which the first-type fins 120 and the second-type fins 130 extend in the same direction and are spaced apart in a front-to-back direction perpendicular to the left-right direction, and a scheme in which the first-type fins 120 and the second-type fins 130 extend in the same direction and are located on the same straight line. This arrangement facilitates simplifying the flow path for airflow formed by the first channel 120a and the second channel 130a, thereby reducing the resistance of airflow through the first channel 120a or the second channel 130a. When airflow passes through the first channel 120a and the second channel 130a, it exchanges heat with the first-type fins 120 and the second-type fins 130, respectively. Both the first-type fins 120 and the second-type fins 130 exchange heat with the heat exchange component 11, thereby improving the heat dissipation effect of the heat exchange component 11 and facilitating a relatively rapid cooling of the heat exchange component 11.

[0067] In some embodiments, reference Figure 1 and Figure 5 As shown, the heat exchange device 100 further includes a heat exchange fan 140 .

[0068] The heat exchange fan 140 is disposed on the base 110 and is adapted to supply air to the first type fins 120 and / or the second type fins 130 during operation. Specifically, the heat exchange fan 140 provides airflow to the first type fins 120 and / or the second type fins 130, allowing the airflow to pass through the first channel 120a and / or the second channel 130a to dissipate heat from the heat exchange element 11.

[0069] In actual application, the relative positions of the heat exchange fan 140 , the first type of fins 120 , and the second type of fins 130 can be adaptively adjusted as needed.

[0070] As an optional embodiment, the entirety formed by the first type fins 120 and the second type fins 130 is located between the heat exchange fan 140 and the base 110. Specifically, the heat exchange fan 140 is disposed on a side of the entirety formed by the first type fins 120 and the second type fins 130, away from the base 110, in the vertical direction as shown. When in use, the heat exchange fan 140 provides airflow to the first channel 120a and the second channel 130a, so that the airflow flows in the vertical direction and then is diverted to the left and right directions where the first and second fins are located, thereby achieving heat dissipation of the heat exchange element 11.

[0071] For more specific solutions, refer to Figure 4 As shown, the heat exchange fan 140 is arranged on a side close to the second type of fins 130 relative to the whole formed by the first type of fins 120 and the second type of fins 130. When the heat generation of the part of the heat exchange component 11 located in the second area is large, this configuration is conducive to quickly dissipating the heat of the part of the heat exchange component 11 located in the second area, thereby matching the difference in heat generation of different areas of the heat exchange component 11 to configure the heat exchange effect of the heat exchange device 100.

[0072] In some embodiments, the heat exchange fan 140 may also be suitable for generating negative pressure on the side of the whole formed by the first type of fins 120 and the second type of fins 130 away from the base 110, that is, the air flow may flow from the whole formed by the first type of fins 120 and the second type of fins 130 to the fan, and the present invention does not limit this.

[0073] As another alternative embodiment, refer to Figures 5 to 7 As shown, the first type of fins 120 and the second type of fins 130 are disposed at one end of the base 110 along a first direction. In a second direction different from the first direction, the second type of fins 130 are disposed between the heat exchange fan 140 and the first type of fins 120. In a specific embodiment, the first direction corresponds to, for example, the up-down direction shown in the figure, and the second direction corresponds to, for example, the left-right direction shown in the figure. The heat exchange fan 140 is disposed to the left of the second type of fins 130, and the first type of fins 120 are disposed to the right of the second type of fins 130. When the heat generation of the heat exchange element 11 located in the second region is relatively high, the above embodiment causes the airflow provided by the heat exchange fan 140 to flow from the second channel 130a to the first channel 120a, thereby fully dissipating heat from the heat exchange element 11 located in the second region and meeting the heat dissipation requirements of the heat exchange element 11 located in the first region.

[0074] In some embodiments, the heat exchange fan 140 may also be suitable for generating negative pressure on one side of the whole formed by the first type of fins 120 and the second type of fins 130 along the second direction, that is, the air flow may flow from the whole formed by the first type of fins 120 and the second type of fins 130 to the fan. At this time, the heat exchange fan 140 may be adaptively set on the side of the first type of fins 120 away from the second type of fins 130 along the second direction, so that the air flow flows from the second channel 130a to the first channel 120a.

[0075] For more specific solutions, refer to Figure 6 and Figure 7 As shown, the heat exchange device 100 further includes: a plurality of diverter fins 150 .

[0076] The plurality of diverter fins 150 are disposed along the second direction between the second type fins 130 and the heat exchange fan 140. The spacing e between adjacent diverter fins is greater than the spacing d between adjacent second type fins. The diverter fins 150 can be used to divert airflow directed toward the second type fins 130, thereby more evenly distributing the airflow to the plurality of first channels 120a and improving heat dissipation.

[0077] In some embodiments, reference Figure 2 As shown, the base 110 is provided with a receiving cavity 110 a, which is suitable for receiving the heat-exchanged component 11 , that is, at least part of the heat-exchanged component 11 is arranged in the receiving cavity 110 a, so that the base 110 provides isolation protection for the heat-exchanged component 11 .

[0078] For a solution in which the heat exchange component 11 is accommodated in the accommodating cavity 110a, the heat exchange device 100 may further include a thermally conductive adhesive layer. The thermally conductive adhesive layer is disposed in the accommodating cavity 110a and is adapted to contact the heat exchange component 11 in the accommodating cavity 110a. The thermally conductive adhesive layer may be, for example, thermally conductive silicone grease applied to the surface of the heat exchange component 11. In a more specific solution, the heat exchange component 11 may be, for example, a circuit board, and the thermally conductive silicone grease may be applied to at least the surface of the chip integrated with the circuit board, and may be used to fill the gap between the heat exchange component 11 and the heat exchange device 100, so as to conduct heat to the first type fins 120 and / or the second type fins 130 using the thermally conductive silicone grease.

[0079] In some embodiments, reference Figure 2 As shown, the heat exchange device 100 further includes a first connecting member 170 and a second connecting member 180 .

[0080] Among them, the first connector 170 connects a plurality of first-class fins 120, and the plurality of first-class fins 120 are formed on a side of the first connector 170 away from the base 110. The first connector 170 is, for example, a substrate used to form the first-class fins 120 when manufacturing the first-class fins 120, that is, the substrate is integrally formed with the plurality of first-class fins 120. The second connector 180 connects a plurality of second-class fins 130, and the plurality of second-class fins 130 are formed on a side of the second connector 180 away from the base 110. The second connector 180 is, for example, a substrate used to form the second-class fins 130 when manufacturing the second-class fins 130, that is, the substrate is integrally formed with the plurality of second-class fins 130. In a further embodiment, the first connector 170 and the second connector 180 may be integrally formed.

[0081] Reference Figure 2 As shown, at least one of the first connecting member 170 and the second connecting member is provided with a heat-conducting boss 160; the heat-conducting boss 160 can be embedded in the accommodating cavity 110a, and the heat-conducting boss 160 is in contact with the heat-conducting adhesive layer, thereby utilizing the full contact between the heat-conducting boss 160 and the heat-conducting adhesive layer to conduct the heat of the heat-exchange component 11 more quickly to the first type of fins 120 or the second type of fins 130, thereby ensuring the heat exchange effect.

[0082] Reference Figure 1 and Figure 5 As shown, the heat exchange device 100 further includes a fairing 190. A housing 111 is provided on the base 110. The housing covers the heat exchange fan 140, the first type of fins 120, and the second type of fins 130 to protect these components. The housing has an opening for airflow, and the heat exchange fan 140 is disposed at the opening. The fairing 190 is fixedly disposed at the opening and is located around the heat exchange fan 140 to protect the heat exchange fan 140 and adjust the distribution of the airflow entering the housing 111.

[0083] According to the second aspect of the present invention, referring to Figure 1 As shown, a vehicle-mounted electronic device 10 is also provided, comprising a component to be heat exchanged 11 and the heat exchange device 100 described above. The component to be heat exchanged 11 is mounted on the base 110. This vehicle-mounted electronic device 10 has the beneficial effects of the heat exchange device 100 described above, and the present invention will not be further described here.

[0084] In a specific embodiment, the heat exchange component 11 is, for example, a circuit board with multiple integrated chips. Different chips may generate different amounts of heat. In this case, the chip with higher heat generation relative to other components can be arranged in the first or second area, and the chip with higher heat generation can be placed in the area corresponding to the first or second type of fin 120, 130, which has a higher heat exchange capacity. By configuring the first and second type of fins 120, 130, heat can be adaptively dissipated from different chips, thus meeting the heat dissipation requirements of the in-vehicle electronic device 10 while controlling manufacturing costs.

[0085] According to a third aspect of the present invention, a vehicle is provided, comprising the heat exchange device 100 described above, or comprising the vehicle-mounted electronic device 10 described above. The vehicle has the beneficial effects of the heat exchange device 100 or the vehicle-mounted electronic device 10 described above, and the present invention will not be further described here.

[0086] The vehicle may be a fuel vehicle, a plug-in hybrid vehicle, a new energy vehicle, etc., and the present invention does not make any specific limitation on this.

[0087] It should be noted that the description of the first direction, the second direction, the up and down direction, the left and right direction, and the front and back directions in the present invention is intended to define the relative positional relationship of the base, the first type of fins, the second type of fins, the heat exchange fan and other structures related to these directions, and is not the only restriction on these directions themselves.

[0088] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0089] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0090] The embodiments, implementation methods and related technical features of the present invention can be combined and replaced with each other without conflict.

[0091] The above are merely preferred embodiments of the present invention and do not constitute any form of limitation to the present invention. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A heat exchange device for exchanging heat with a heat exchange component, characterized in that: include: A base, used for mounting the heat exchange component; a plurality of first-type fins, spaced apart in a first region of the base, suitable for exchanging heat with a portion of the heat-exchanged component located in the first region; a plurality of second-type fins, spaced apart in the second region of the base, suitable for exchanging heat with a portion of the heat-exchanged component located in the second region; The first type of fins and the second type of fins are manufactured using different processes, so that the first type of fins and the second type of fins have different heat exchange parameters.

2. The heat exchange device according to claim 1, characterized in that: The value range of the thickness of the first type of fins is set differently from the value range of the thickness of the second type of fins, so that the first type of fins and the second type of fins have different heat exchange parameters, and / or, The value range of the spacing between adjacent first-type fins is set differently from the value range of the spacing between adjacent second-type fins, so that the first-type fins and the second-type fins have different heat exchange parameters.

3. The heat exchange device according to claim 2, characterized in that: The thickness of the first type of fins ranges from 1 to 2 mm; the thickness of the second type of fins ranges from 0.2 to 0.5 mm; and / or, The spacing between adjacent first-type fins ranges from 4 to 6 mm; the spacing between adjacent second-type fins ranges from 1 to 1.5 mm.

4. The heat exchange device according to any one of claims 1 to 3, characterized in that: The heat exchange device further comprises: A heat exchange fan is provided on the base and is adapted to supply air to the first type of fins and / or the second type of fins during operation.

5. The heat exchange device according to claim 4, characterized in that: The first type of fins and the second type of fins constitute a whole located between the heat exchange fan and the base.

6. The heat exchange device according to claim 5, characterized in that: The heat exchange fan is arranged on a side close to the second type of fins relative to the whole formed by the first type of fins and the second type of fins.

7. The heat exchange device according to claim 4, characterized in that: The first type of fins and the second type of fins are arranged at one end of the base along a first direction; in a second direction different from the first direction, the second type of fins are arranged between the heat exchange fan and the first type of fins.

8. The heat exchange device according to claim 7, characterized in that: The heat exchange device further comprises: a plurality of diverter fins, arranged along the second direction between the second type of fins and the heat exchange fan; Wherein, the spacing between adjacent diverter fins is greater than the spacing between adjacent second-type fins.

9. The heat exchange device according to any one of claims 1 to 3, characterized in that: The base is provided with: An accommodating cavity, suitable for accommodating the heat-exchanged component; The heat exchange device further comprises: The heat-conducting adhesive layer is arranged in the accommodating cavity and is suitable for contacting the heat-exchanged component in the accommodating cavity.

10. The heat exchange device according to claim 9, characterized in that: The heat exchange device further comprises: a first connecting member, connecting a plurality of the first-type fins; a second connecting member, connecting a plurality of the second-type fins; Wherein, a plurality of the first type fins are formed on a side of the first connecting member away from the base; a plurality of the second type fins are formed on a side of the second connecting member away from the base; At least one of the first connecting member and the second connecting member is provided with a heat-conducting boss; the heat-conducting boss is in contact with the heat-conducting adhesive layer.

11. An in-vehicle electronic device, characterized in that: It comprises a heat-exchange component and the heat exchange device according to any one of claims 1 to 10; wherein the heat-exchange component is mounted on the base.

12. A vehicle, characterized in that: The heat exchange device comprises the heat exchange device according to any one of claims 1 to 10, or the vehicle-mounted electronic device according to claim 11.

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