A surface mount LED chip support structure

Abstract

This invention discloses a surface-mount LED chip support structure, belonging to the field of semiconductor component technology. The structure includes a soldering frame comprising a bottom plate and a top plate stacked vertically. One end of the top plate has a flat plate extending horizontally along its long side. The bottom plate is located below the flat plate and connected to a contact plate via an inclined plate. The contact plate has corrugated grooves parallel to its long side. This invention, through the arrangement of the soldering frame, positive electrode frame, negative electrode frame, and support frame, allows excess solder to be guided away from adjacent electrode frames during the mounting stage when the circuit board does not have solder pads designed for solder stripping. Furthermore, the shape variations of the soldering frame, positive electrode frame, and negative electrode frame create temporary cavities, preventing excess solder from causing short circuits between adjacent pads. After curing, the structure allows for interlocking connections between the solder and the electrode frames, increasing the strength of the solder joint.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor component technology, and specifically relates to a surface-mount LED lamp bead support structure. Background Technology

[0002] Surface mount LED chips are a heavy component in the lighting industry. They can be automatically mounted onto a circuit board that has been coated with solder using a pick-and-place machine. Then, a reflow soldering process is used to complete the electrical connection between the LED chip and the circuit board pads, resulting in a finished LED light board. The manufacturing efficiency of LED light boards is greatly improved compared to through-hole LED chips, and they are widely used in the field of low-power LED light boards.

[0003] A Chinese utility model patent with publication number CN216818367U discloses a surface mount LED chip with multiple pins. Each pin needs to be soldered onto a corresponding pad on a circuit board to complete the electrical connection. However, the bottom surface of each pin is flat, which will squeeze the solder onto the adjacent pads during mounting. Especially when the circuit board design does not include solder-stealing pads, if manual soldering or other low-precision soldering processes are used, excessive soldering combined with the disorderly squeezing and pushing of the solder can easily lead to short circuits between adjacent pads, resulting in a low product yield. In view of this, a surface mount LED chip bracket structure is provided. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a surface-mount LED bead support structure.

[0005] The technical solution adopted to solve the above technical problems is:

[0006] A surface-mount LED chip support structure includes:

[0007] A welding frame, comprising a bottom plate and a top plate stacked on top of each other, wherein a flat plate extends horizontally from one end of the top plate perpendicular to its own long side, and a contact plate is connected to the bottom plate below the flat plate via an inclined plate, and the contact plate is provided with a corrugated groove parallel to its own long side;

[0008] Positive electrode frame one and positive electrode frame two, the positive electrode frame one includes positive electrode sheet one and positive electrode sheet two stacked on top of each other, the positive electrode sheet two has a positive electrode straight extension plate extending horizontally at the end away from the welding frame, the positive electrode sheet one is located below the positive electrode straight extension plate and is connected to a positive electrode contact plate through a positive electrode oblique extension plate, and the positive electrode contact plate has a positive electrode solder groove parallel to its own long side.

[0009] The negative electrode frame includes a negative electrode sheet 1 and a negative electrode sheet 2 stacked on top of each other. The negative electrode sheet 2 has a negative electrode straight extension plate extending horizontally perpendicular to the long side of the base plate at the end away from the welding frame. The negative electrode sheet 1 is located below the negative electrode straight extension plate and is connected to a negative electrode contact plate through a negative electrode oblique extension plate. The negative electrode contact plate has a negative electrode solder groove parallel to the corrugated groove.

[0010] The support frame includes a main board located below the base plate. Side plate 1 and side plate 2 are symmetrically arranged on both sides of the main board. Side plate 1 is located above the contact plate and the negative electrode contact plate, and side plate 2 is located above the positive electrode contact plate, and respectively forms a hole.

[0011] Furthermore, the free ends of the contact plate, negative contact plate and positive contact plate extend vertically upward to form a support plate, a positive vertical plate 1 and a negative vertical plate 1, respectively, and the corrugated groove, positive solder groove and negative solder groove extend vertically upward along the support plate, the positive vertical plate 1 and the negative vertical plate 1, respectively.

[0012] Through the above technical solution, in order to effectively utilize the extruded excess solder, the support plate, positive electrode vertical plate 1, and negative electrode vertical plate 1 can increase the contact area between the support plate, positive electrode vertical plate 1, and negative electrode vertical plate 1 in the vertical direction. During mounting, this can increase the adhesion of the LED beads and prevent displacement and misalignment. The upward-extending corrugated groove, positive electrode solder groove, and negative electrode solder groove can increase the solder's capacity. During reflow soldering, the solder extruded from the bottom can melt and adhere to the grooved position. After the solder solidifies, it forms a corrugated contact surface on both the vertical and horizontal sidewalls of the support, which can maintain a firm weld when subjected to external force.

[0013] Furthermore, the free ends of the flat plate, the positive electrode straight extension plate, and the negative electrode straight extension plate extend vertically downward to form a folded plate, a second positive electrode vertical plate, and a second negative electrode vertical plate, respectively. The folded plate, the second positive electrode vertical plate, and the second negative electrode vertical plate are respectively attached to the slotted side of the support plate, the first positive electrode vertical plate, and the first negative electrode vertical plate, forming a temporary cavity with variable volume.

[0014] To further ensure the effective utilization of solder through the above technical solution, during mounting, the pressure-bearing support plate, positive electrode vertical plate one, and negative electrode vertical plate one will push the flat plate, positive electrode straight extension plate, and negative electrode straight extension plate upwards, causing the folding plate, positive electrode vertical plate two, and negative electrode vertical plate two to swing away from the support plate, positive electrode vertical plate one, and negative electrode vertical plate one. This can increase the volume of the temporary cavity and accommodate more of the squeezed and flowing solder. After mounting is completed, the flat plate, positive electrode straight extension plate, and negative electrode straight extension plate rebound, causing the folding plate, positive electrode vertical plate two, and negative electrode vertical plate two to reset. This can reduce the volume of the temporary cavity and push the intercepted solder to the vertical position of the corrugated groove, positive electrode solder groove, and negative electrode solder groove, further improving the effective utilization of the solder.

[0015] Furthermore, the top of the support plate, the first positive electrode vertical plate, and the first negative electrode vertical plate are all provided with a turning head. The turning head overlaps the root of the folded plate, the second positive electrode vertical plate, and the second negative electrode vertical plate. The folded plate, the second positive electrode vertical plate, and the second negative electrode vertical plate are respectively provided with through holes, positive electrode overflow holes, and negative electrode overflow holes at the top positions of the corrugated groove, the positive electrode solder groove, and the negative electrode solder groove.

[0016] Through the above technical solution, in order to increase the welding strength, the setting of the turn-around head can increase the contact area when the support plate, positive electrode vertical plate one and negative electrode vertical plate one press the flat plate, positive electrode straight extension plate and negative electrode straight extension plate upward. It also guides the solder moving to the turn-around head position to ensure that the solder gathers in the corrugated groove, positive electrode solder groove and negative electrode solder groove. When passing through the through hole, positive electrode overflow hole and negative electrode overflow hole, the solder can overflow the corrugated groove, positive electrode solder groove and negative electrode solder groove, which further expands the limit volume of the temporary cavity. After solidification, the solder in the through hole, positive electrode overflow hole and negative electrode overflow hole and the folded plate, positive electrode vertical plate two and negative electrode vertical plate two form an interlocking tenon and mortise structure, which improves the welding strength.

[0017] Furthermore, the bottom plate and the top plate are fixed at both ends by pins, and each of the two pins is provided with a light-emitting chip on its top surface. The main board is equipped with a repeater socket at the position corresponding to the bottom surface of the pin.

[0018] Through the above technical solution, the two pins fix the base plate and the top plate to each other, which can increase the structural strength and provide a mounting reference point for the light-emitting chip. The repeater is connected to the pins, making the position of the two pins more stable when the light-emitting chip is installed, ensuring that the light-emitting chip is installed firmly.

[0019] Furthermore, the first positive electrode and the second positive electrode are fixed through a positive electrode stud, and the first negative electrode and the second negative electrode are fixed through a negative electrode stud. The positive electrode stud and the negative electrode stud are respectively soldered to the light-emitting chip with gold wire.

[0020] Through the above technical solution, the gold wire supplies power to the light-emitting chip. The positive and negative electrode rivets increase the connection strength between positive electrode plate one and positive electrode plate two, and negative electrode plate one and negative electrode plate two, while providing an installation position for the gold wire, so that the gold wire can be firmly welded to the electrode frame and prevent it from falling off.

[0021] Furthermore, the support frame also includes partitions, and the middle of the first side plate and the second side plate are provided with horizontally extending slits. The first side plate and the second side plate are fixed with two partitions perpendicular to the long side of the main plate along the slits. The two adjacent partitions extend downwards and are flush with the bottom surface of the contact plate and are far apart from each other.

[0022] Through the above technical solution, in order to avoid short circuits caused by excessive solder, the spacer can block the flow of solder to adjacent electrode holders during mounting. When the solder is squeezed, it can block the solder flowing to adjacent electrode holders and make it easier for excess solder on the upper layer to enter the gaps. During soldering, it prevents the increased flow of solder from entering adjacent pads, effectively preventing short circuits. It can also increase the contact points between the carrier and the pads, allowing the heat of the LED to be dissipated more smoothly through the pads and the circuit board.

[0023] Furthermore, the support frame also includes support plate one, support plate two, support plate three and support plate four. The inclined plate, positive electrode inclined extension plate and negative electrode inclined extension plate are provided with through holes at the positions of support plate one, support plate two, support plate three and support plate four, and the ends of support plate one, support plate two, support plate three and support plate four are respectively embedded in the through holes.

[0024] Through the above technical solution, in order to increase the strength of the support structure, after the welding frame, two positive electrode frames and negative electrode frames are manufactured, the welding frame, two positive electrode frames and negative electrode frames are respectively embedded in the support plate one, support plate two, support plate three and support plate four positions to form a solid whole, reduce the number of individual parts, facilitate the later plastic sealing, and also provide stable support for the welding frame, two positive electrode frames and negative electrode frames to ensure smooth subsequent mounting.

[0025] Furthermore, the positive electrode frame one and the positive electrode frame two are completely identical in structure except for their different positions. The positive electrode frame one and the positive electrode frame two are arranged side by side. The negative electrode frame is located at the inner corner of the junction of the top plate and the flat plate. The contact plate, the negative electrode contact plate and the positive electrode contact plate are respectively arranged at the four corners of the support frame.

[0026] With the above technical solution, the two positive electrode holders supply power to different light-emitting chips, which can be used to make multi-color LED beads. Furthermore, the symmetrical arrangement of the contact plate, negative electrode contact plate and positive electrode contact plate can adapt to most circuit board pad designs, increasing applicability.

[0027] A surface-mount LED chip includes an encapsulating adhesive, which is located above the top surface of a carrier frame. The flat plate, the positive electrode straight extension plate, and the negative electrode straight extension plate are positioned above the top surface of the encapsulating adhesive.

[0028] With the above technical solution, during the molding process, the molding compound can be supported by a carrier frame to stably form pores. After molding, the flat plate, positive electrode straight extension plate and negative electrode straight extension plate have exposed top surfaces, which facilitates subsequent product quality inspection.

[0029] The beneficial effects of this invention are as follows:

[0030] (1) By setting up a soldering frame, a positive electrode frame, a negative electrode frame and a carrier frame, when the circuit board is not designed with solder-stealing pads, during the mounting stage, the excess solder is guided away from the adjacent electrode frame by the corrugated groove, the positive electrode solder groove and the negative electrode solder groove, and the shape changes of the soldering frame, the positive electrode frame and the negative electrode frame are used to form a temporary cavity, so that the excess solder will not cause short circuits to the adjacent pads. After curing, the connection structure between the solder and the electrode frame can be inter-embedded, increasing the welding firmness.

[0031] (2) The present invention uses a support frame design to connect multiple electrode frames to form an integral structure, which facilitates subsequent encapsulation operations. During the encapsulation process, the two side plates can also act as a barrier to the encapsulation adhesive, ensuring the smooth formation of pores. During mounting, the support plates reinforce and support the electrode frames, ensuring that they can be smoothly reset after deformation, ensuring stable welding and avoiding external short circuits. In subsequent use, the motherboard and side plates are exposed to the air and are directly connected to the light-emitting chip through the repeater, avoiding internal short circuits caused by high temperature at the light-emitting chip location. Attached Figure Description

[0032] Figure 1 This is an overall structural diagram of the present invention in its unencapsulated state;

[0033] Figure 2 This is a structural diagram of the present invention in its packaged state;

[0034] Figure 3 This is a front view of the present invention in its packaged state;

[0035] Figure 4 This is a top view of the present invention in its unencapsulated state;

[0036] Figure 5 This is a schematic diagram of the welding frame of the present invention;

[0037] Figure 6 This is a schematic diagram of the positive electrode frame of the present invention;

[0038] Figure 7 This is a schematic diagram of the negative electrode frame of the present invention;

[0039] Figure 8 This is a schematic diagram of the support frame of the present invention;

[0040] Figure 9 This is a schematic diagram of the state at the moment of mounting according to the present invention;

[0041] Figure 10 This is a schematic diagram of the structure of the present invention in the reflow soldering state.

[0042] Reference numerals: 1. Welding frame; 11. Base plate; 12. Top plate; 13. Pin; 14. Inclined plate; 15. Flat plate; 16. Contact plate; 17. Support plate; 18. Folding plate; 181. Through hole; 19. Corrugated groove; 2. Positive electrode frame one; 21. Positive electrode plate one; 22. Positive electrode plate two; 23. Positive electrode rivet; 24. Positive electrode inclined extension plate; 25. Positive electrode straight extension plate; 26. Positive electrode contact plate; 27. Positive electrode vertical plate one; 28. Positive electrode vertical plate two; 281. Positive electrode overflow hole; 29. ​​Positive electrode solder tank; 3. Positive electrode frame two; 4. Negative electrode frame; 41 42. Negative electrode sheet 1; 43. Negative electrode rivet; 44. Negative electrode inclined extension plate; 45. Negative electrode straight extension plate; 46. Negative electrode contact plate; 47. Negative electrode vertical plate 1; 48. Negative electrode vertical plate 2; 48. Negative electrode overflow hole; 49. Negative electrode solder groove; 5. Light-emitting chip; 6. Gold wire; 7. Support frame; 71. Main board; 72. Repeater socket; 73. Side plate 1; 74. Side plate 2; 75. Support plate 1; 76. Support plate 2; 77. Support plate 3; 78. Support plate 4; 79. Spacer; 8. Encapsulating adhesive; 9. Hole; 91. Temporary cavity. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0044] like Figures 1-10 As shown, this embodiment provides a surface-mount LED chip support structure. In the absence of additional solder pads in the circuit board design, to accommodate manual soldering or other low-precision soldering processes and avoid short circuits between adjacent pads caused by excessive soldering, a chip support structure is designed to compensate for this. This reduces the low finished product quality caused by design and process issues, minimizing losses for the assembly plant. A specific configuration is provided:

[0045] Regarding welding frame 1, refer to... Figure 1 and Figure 5 The welding frame 1 includes a bottom plate 11 and a top plate 12 stacked on top of each other. Both the bottom plate 11 and the top plate 12 are made of conductive metal. The stacking and fixing can reduce the occurrence of heat deformation. One end of the top plate 12 extends horizontally with a flat plate 15 perpendicular to its own long side. The bottom plate 11 is located below the flat plate 15 and is connected to a contact plate 16 through an inclined plate 14. A frame space gap is formed between the flat plate 15 and the contact plate 16. Since LED beads are generally small in size, the split design makes it easier to obtain the required configuration. The contact plate 16 has a corrugated groove 19 parallel to its own long side. The corrugated groove 19 is designed on the bottom surface of the contact plate 16 and extends horizontally away from the bottom plate 11.

[0046] Regarding positive electrode holder 1-2 and positive electrode holder 2-3, please refer to... Figure 1 and Figure 6 The positive electrode frame 2 includes a positive electrode sheet 21 and a positive electrode sheet 22 stacked on top of each other. The positive electrode sheet 22 extends horizontally from the end away from the welding frame 1 with a positive electrode straight extension plate 25. The positive electrode sheet 21 is located below the positive electrode straight extension plate 25 and is connected to the positive electrode contact plate 26 through the positive electrode inclined extension plate 24. Similar to the welding frame 1, the split design makes manufacturing easier. The upper and lower split positive electrode contact plate 26 and positive electrode straight extension plate 25 reduce the manufacturing difficulty. The positive electrode contact plate 26 has a positive electrode solder groove 29 parallel to its own long side. The direction of the positive electrode solder groove 29 is parallel to the extension direction of the corrugated groove 19 and the opening direction is opposite.

[0047] Regarding negative electrode holder 4, refer to... Figure 1 and Figure 7 The negative electrode frame 4 includes a negative electrode sheet 41 and a negative electrode sheet 42 stacked on top of each other. The negative electrode sheet 42 extends horizontally along the long side of the base plate 11 at the end away from the welding frame 1 with a negative electrode straight extension plate 45. The negative electrode sheet 41 is located below the negative electrode straight extension plate 45 and is connected to a negative electrode contact plate 46 through a negative electrode inclined extension plate 44. The negative electrode frame 4 is similar in structure to the positive electrode frame 2, except that the area of ​​the negative electrode sheet 41 and the negative electrode sheet 42 is enlarged to provide multiple negative electrode welding points. The negative electrode contact plate 46 is provided with a negative electrode solder groove 49 parallel to the corrugated groove 19. The negative electrode solder groove 49 and the corrugated groove 19 extend in the same direction and have the same opening direction.

[0048] Regarding support frame 7, refer to... Figure 8 The support frame 7 includes a main board 71, which is located below the base plate 11. The main board 71 has two symmetrical side plates 73 and 74 on both sides, which can be connected to the welding frame 1, positive electrode frame 2, positive electrode frame 3 and negative electrode frame 4 respectively to form a complete structure, increase structural strength and reduce the difficulty of plastic sealing. The side plate 73 is located above the contact plate 16 and the negative electrode contact plate 46, and the side plate 73 is located above the positive electrode contact plate 26 and respectively forms a hole 9. The hole 9 is located above the contact plate 16, the positive electrode contact plate 26 and the negative electrode contact plate 46.

[0049] The working principle of this embodiment is as follows:

[0050] During the production of the support frame, the welding frame 1, positive electrode frame 1 2, positive electrode frame 2 3 and negative electrode frame 4 are fixed together with sheet metal of different shapes to form the required configuration with space gaps between the frames, and are connected into a whole by the support frame 7, which reduces the number of independent parts and increases the firmness and spacing stability between the various electrode frames.

[0051] When preparing the LED, the light-emitting chip 5 is welded onto the welding frame 1. The positive electrode frame 1 2, the positive electrode frame 2 3 and the negative electrode frame 4 supply power to the light-emitting chip 5. The number of positive electrode frames is the same as the number of light-emitting chips 5. Only one negative electrode frame 4 needs to be set. The connection position between the bracket and the light-emitting chip 5 is wrapped by plastic encapsulation, and a hole 9 is formed above the contact plate 16, the positive electrode contact plate 26 and the negative electrode contact plate 46.

[0052] During mounting, a pick-and-place machine is used to pick up the LEDs and mount them onto the pads of the circuit board. Because the solder is a thixotropic fluid, when the bracket squeezes the solder, the corrugated groove 19, the positive solder groove 29, and the negative solder groove 49 squeeze the excess solder in the horizontal direction. The direction in which the solder is squeezed out between different electrode brackets is opposite, which reduces the excess solder on adjacent pads from being squeezed together and brought closer to the final contact. By improving the bracket, the short circuit between circuit boards without solder pads can be overcome. When used in assembly plants with low precision in circuit board design and soldering process, it can achieve a higher yield than using other bracket types for surface mount LEDs.

[0053] During reflow soldering, the fluidity of the solder increases after heating. The upper layer of solder enters the gap 9 and wraps around the contact plate 16, the positive electrode contact plate 26 and the negative electrode contact plate 46. The solidified solder is not dotted but ring-shaped, which can effectively increase the contact area and the strength of the weld.

[0054] In a further embodiment, to effectively utilize the extruded excess solder, refer to Figure 5 , Figure 6 , Figure 7 and Figure 10 The free ends of contact plate 16, negative contact plate 46, and positive contact plate 26 extend vertically upward to form support plate 17, positive vertical plate 27, and negative vertical plate 47, respectively. Support plate 17, positive vertical plate 27, and negative vertical plate 47 can increase the contact area with the solder in the vertical direction, which can increase the adhesion of the LED beads during mounting and prevent displacement and misalignment. Corrugated groove 19, positive solder groove 29, and negative solder groove 49 extend vertically upward along support plate 17, positive vertical plate 27, and negative vertical plate 47, respectively. The upwardly extending corrugated groove 19, positive solder groove 29, and negative solder groove 49 can increase the space for solder to be contained. During reflow soldering, the solder squeezed out from the bottom can melt and adhere to the groove position. After the solder solidifies, it forms a corrugated contact surface on both the vertical and horizontal sidewalls of the bracket, which can maintain a firm weld when subjected to external force.

[0055] In a further embodiment, to further ensure the effective utilization of solder, refer to Figure 9The free ends of the flat plate 15, the positive electrode straight extension plate 25, and the negative electrode straight extension plate 45 extend vertically downwards to form a folded plate 18, a second positive electrode vertical plate 28, and a second negative electrode vertical plate 48, respectively. The folded plates 18, 28, and 48 are respectively attached to one side of the slotted sections of the support plate 17, 27, and 47, forming a variable-volume temporary cavity 91. During mounting, the pressure on the support plate 17, 27, and 47 pushes the flat plate 15, 25, and 45 upwards, causing the folded plates 18, 28, and 48 to swing away from the support plate 17, 27, and 47, thus increasing the volume of the temporary cavity 91 and accommodating more of the squeezed solder. (Refer to...) Figure 10 After mounting, the flat plate 15, the positive electrode straight extension plate 25, and the negative electrode straight extension plate 45 spring back, causing the folded plate 18, the positive electrode vertical plate 28, and the negative electrode vertical plate 48 to reset. This reduces the volume of the temporary cavity 91, pushing the intercepted solder to the vertical position of the corrugated groove 19, the positive electrode solder groove 29, and the negative electrode solder groove 49. This fills the corrugated groove 19, the positive electrode solder groove 29, and the negative electrode solder groove 49 with solder, preventing air bubbles and gaps in the solder from causing excessive local resistance and further making effective use of the solder.

[0056] In a further embodiment, to increase the weld strength, refer to Figure 3 and Figure 9The tops of support plate 17, positive electrode vertical plate 27, and negative electrode vertical plate 47 are all equipped with turn-around heads. These turn-around heads increase the contact area when support plate 17, positive electrode vertical plate 27, and negative electrode vertical plate 47 press upwards against plate 15, positive electrode straight extension plate 25, and negative electrode straight extension plate 45. During reflow soldering, the folded plate 18, positive electrode vertical plate 28, and negative electrode vertical plate 48 heat up synchronously with support plate 17, positive electrode vertical plate 27, and negative electrode vertical plate 47, thus facilitating the temporary cavity... The solder in cavity 91 melts rapidly, and the return turn overlaps at the base of the folding plate 18, the positive electrode vertical plate 28, and the negative electrode vertical plate 48. Together with the folding plate 18, the positive electrode vertical plate 28, and the negative electrode vertical plate 48, the space above the temporary cavity 91 gradually narrows, guiding the solder that has moved to the return turn position. This ensures that the solder gathers at the positions of the corrugated groove 19, the positive electrode solder groove 29, and the negative electrode solder groove 49. The folding plate 18, the positive electrode vertical plate 28, and the negative electrode vertical plate 48 correspond to the corrugated groove 19. The positive solder bath 29 and the negative solder bath 49 are respectively provided with through holes 181, positive overflow holes 281 and negative overflow holes 481 at their top positions. When the solder rises through the through holes 181, positive overflow holes 281 and negative overflow holes 481, the solder can overflow from the corrugated groove 19, the positive solder bath 29 and the negative solder bath 49, which further horizontally expands the limit volume of the temporary cavity 91, allowing the solder to overflow horizontally and avoiding contact between the front and rear overflows and adjacent electrode frames. Subsequently, the solder in the through hole 181, the positive electrode overflow hole 281, and the negative electrode overflow hole 481, together with the folding plate 18, the positive electrode vertical plate 28, and the negative electrode vertical plate 48, form an interlocking tenon and mortise structure. That is, the solder in the through hole 181, the positive electrode overflow hole 281, and the negative electrode overflow hole 481 can be embedded in the middle of the folding plate 18, the positive electrode vertical plate 28, and the negative electrode vertical plate 48, or adhere to the outer surface of the folding plate 18, the positive electrode vertical plate 28, and the negative electrode vertical plate 48, thereby improving the welding firmness.

[0057] In a further embodiment, refer to Figure 4 and Figure 5The bottom plate 11 and top plate 12 are fixed at both ends by pins 13. The two pins 13 are connected at the ends to ensure a tight fit and assembly strength. They can also provide mounting reference points for the light-emitting chip 5. For example, using a different color from the top plate 12 can facilitate equipment identification and improve the pressing accuracy of the light-emitting chip 5. The top surface of both pins 13 is equipped with the light-emitting chip 5. The light-emitting chip 5 is directly fixed to the top of the pin 13 with an interface agent. When installing the light-emitting chip 5, the pin 13 has high structural strength. The main board 71 is equipped with a repeater 72 at the corresponding position on the bottom surface of the pin 13, which can prevent bottom damage when pressing the light-emitting chip 5. The deformation of plate 11 and top plate 12, and the simultaneous application of interface agent and heating during the pressing of light-emitting chip 5 to improve the pressing firmness, can be achieved by directly transferring heat to the bottom plate 11 and top plate 12 by the heat pin 13, instead of transferring it to the bottom plate 11 first and then to the top plate 12. Similarly, in subsequent use, the heat generated by the light-emitting chip 5 can also be transferred outward directly through the bottom plate 11 and top plate 12 by the pin 13, or it can be transferred to the entire support frame 7 through the relay seat 72, increasing the heat conduction path, improving heat dissipation capacity, and preventing the light-emitting chip 5 from being damaged by high temperature.

[0058] In a further embodiment, to ensure the structural stability of the electrode holder, refer to Figure 4 , Figure 6 and Figure 7 Positive electrode 1 21 and positive electrode 22 are fixed together by positive electrode rivet 23, and negative electrode 1 41 and negative electrode 2 42 are fixed together by negative electrode rivet 43. This riveting fixation makes the connection between the two layers of metal sheets more stable, and the gold wire 6 is less prone to deformation when subjected to pressure and heat. Furthermore, the positive electrode rivet 23 and negative electrode rivet 43 are respectively welded to the light-emitting chip 5 by gold wire 6, which supplies power to the light-emitting chip 5. The positive electrode rivet 23 and negative electrode rivet 43 increase the connection strength between positive electrode 1 21 and positive electrode 22, and between negative electrode 1 41 and negative electrode 2 42. At the same time, to provide an installation position for the gold wire 6, the gold wire 6 is directly welded to the positive electrode post 23 and the negative electrode post 43, which can avoid the possibility of heat deformation of the electrode sheet. The positive electrode post 23 and the negative electrode post 43 can also connect the upper and lower electrode sheets at the same time, increasing the effective contact area of ​​the contact position and reducing the resistance. When pressing the positive electrode post 23 and the negative electrode post 43, the top surface of the positive electrode post 23 and the negative electrode post 43 is deformed by the tool to form a rough plane, which further increases the effective welding area and the roughness of the contact surface, so that the gold wire 6 can be firmly welded to the electrode frame and prevent it from falling off.

[0059] In a further embodiment, to avoid short circuits caused by excessive solder, refer to Figure 8The support frame 7 also includes four spacers 79, arranged in pairs in the middle of side plate 1 73 and side plate 2 74. A horizontally extending slit is formed in the middle of side plate 1 73 and side plate 2 74. Two spacers 79 perpendicular to the long side of the main plate 71 are fixed along the slit in side plate 1 73 and side plate 2 74. Two adjacent spacers 79 are spaced far apart. During mounting, the spacers 79 can block solder from flowing towards adjacent electrode frames, preventing solder from flowing towards adjacent electrode frames when the solder is squeezed and allowing the solder to flow along the spacers 79. The parallel and rotating flow allows excess solder from the upper layer to more easily enter the pores 9. After subsequent curing, the pores 9 are filled with solder, increasing the weld strength and effective conductive area. During welding, the increased flow of solder prevents it from entering adjacent pads, effectively preventing short circuits. Since the two adjacent spacers 79 extend downwards and are flush with the bottom surface of the contact plate 16, they will directly contact the pads after welding. This also increases the contact points between the support frame 7 and the pads in subsequent use, allowing the heat from the LED to be dissipated more smoothly by dragging it across the pads and the circuit board.

[0060] In a further embodiment, to increase the strength of the support structure, refer to Figure 1 and Figure 8 The support frame 7 also includes support plate 1 75, support plate 2 76, support plate 3 77, and support plate 4 78. Through holes are provided at the positions corresponding to support plate 1 75, support plate 2 76, support plate 3 77, and support plate 4 78. The ends of support plate 1 75, support plate 2 76, support plate 3 77, and support plate 4 78 are respectively embedded in the through holes. After the welding frame 1, the two positive electrode frames, and the negative electrode frame 4 are manufactured, the welding frame 1, the two positive electrode frames, and the negative electrode frame 4 are respectively embedded in support plate 1 75, support plate 2 76, support plate 3 77, and support plate 4 78. The positions of plate 2 (76), support plate 3 (77), and support plate 4 (78) form a solid whole, reducing the number of individual parts and facilitating subsequent molding. Support plates 1 (75), 2 (76), 3 (77), and 4 (78) are respectively attached to the bottom surfaces of inclined plate 14, positive electrode inclined extension plate 24, and negative electrode inclined extension plate 44 for stable support. At the same time, they can also provide stable support for welding frame 1, the two positive electrode frames, and negative electrode frame 4, ensuring smooth subsequent mounting.

[0061] In a further embodiment, to form a complete LED chip, refer to... Figure 4Positive electrode holder 1 (2) and positive electrode holder 2 (3) are identical in structure except for their arrangement. They are arranged side by side with the positive electrode holder on the same side and the negative electrode holder on the other side. This arrangement is more consistent with the conventional electrode plate wiring method and has greater adaptability. The negative electrode holder 4 is located at the inner corner of the junction of the top plate 12 and the flat plate 15. The contact plate 16, negative electrode contact plate 46, and positive electrode contact plate 26 are arranged at the four corners of the support frame 7. The two positive electrode holders supply power to different light-emitting chips 5, which can be made into multi-color LED beads. Furthermore, the symmetrical arrangement of the contact plate 16, negative electrode contact plate 46, and positive electrode contact plate 26 can adapt to the conventional design of most circuit board pads, further increasing applicability.

[0062] A surface-mount LED bead, as shown in the reference Figure 2 and Figure 3 The encapsulation includes an encapsulating adhesive 8, which is located above the top surface of the carrier frame 7. The plate 15, the positive electrode straight extension plate 25, and the negative electrode straight extension plate 45 are positioned above the top surface of the encapsulating adhesive 8. During molding, the carrier frame 7 can support the encapsulating adhesive 8. With the corresponding molding mold, the encapsulating adhesive 8 can only exist above the encapsulating adhesive 8 and will not enter below the carrier frame 7, stably forming the pores 9 for subsequent deformation mounting and firm soldering. After molding, the plate 15, the positive electrode straight extension plate 25, and the negative electrode straight extension plate 45 have exposed top surfaces, which can provide testing contact surfaces. When checking for external and internal short circuits, the testing equipment can be directly pressed onto the testing contact surfaces of the positive and negative electrode frames to detect internal short circuits. The testing equipment can be directly pressed onto the testing contact surfaces of the pad and the corresponding electrode frame to detect the soldering between the electrode frame and the pad, thus checking for external short circuits and facilitating subsequent product quality inspection.

[0063] The above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention.

Claims

1. A patch LED lamp bead support structure, characterized in that, The utility model relates to a welding frame (1) comprising a bottom plate (11) and a top plate (12) stacked vertically, a flat plate (15) horizontally extending from one end of the top plate (12) perpendicularly to its long side, a contact plate (16) connected to the bottom plate (11) below the flat plate (15) through an inclined plate (14), and a corrugated groove (19) provided on the contact plate (16) parallel to its long side. The utility model relates to a positive electrode frame (2) and a positive electrode frame (3) comprising a positive electrode sheet (21) and a positive electrode sheet (22) stacked vertically, a positive electrode straight extension plate (25) horizontally extending from one end of the positive electrode sheet (22) away from the welding frame (1), a positive electrode contact plate (26) connected to the positive electrode sheet (21) below the positive electrode straight extension plate (25) through a positive electrode inclined extension plate (24), and a positive electrode solder groove (29) provided on the positive electrode contact plate (26) parallel to its long side. The utility model relates to a negative electrode frame (4) comprising a negative electrode sheet (41) and a negative electrode sheet (42) stacked vertically, a negative electrode straight extension plate (45) horizontally extending from one end of the negative electrode sheet (42) away from the welding frame (1) perpendicularly to the long side of the bottom plate (11), a negative electrode contact plate (46) connected to the negative electrode sheet (41) below the negative electrode straight extension plate (45) through a negative electrode inclined extension plate (44), and a negative electrode solder groove (49) provided on the negative electrode contact plate (46) parallel to the corrugated groove (19). The utility model relates to a bearing frame (7) comprising a main plate (71) below the bottom plate (11), a side plate (73) and a side plate (74) symmetrically provided on both sides of the main plate (71), the side plate (73) above the contact plate (16) and the negative electrode contact plate (46), the side plate (73) above the positive electrode contact plate (26), and the side plate (73) and the side plate (74) respectively forming an aperture (9). The free ends of the contact plate (16), the negative electrode contact plate (46), and the positive electrode contact plate (26) vertically extend upwards to form a support plate (17), a positive electrode vertical plate (27), and a negative electrode vertical plate (47), respectively, and the corrugated groove (19), the positive electrode solder groove (29), and the negative electrode solder groove (49) vertically extend upwards along the support plate (17), the positive electrode vertical plate (27), and the negative electrode vertical plate (47), respectively.

2. The patch LED lamp bead support structure according to claim 1, wherein, The free ends of the flat plate (15), the positive electrode straight extension plate (25), and the negative electrode straight extension plate (45) vertically extend downwards to form a folding plate (18), a positive electrode vertical plate (28), and a negative electrode vertical plate (48), respectively, and the folding plate (18), the positive electrode vertical plate (28), and the negative electrode vertical plate (48) are attached to one side of the aperture of the support plate (17), the positive electrode vertical plate (27), and the negative electrode vertical plate (47), respectively, and form a temporary storage cavity (91) with variable volume.

3. The patch LED lamp bead support structure according to claim 2, wherein, ​ 4. The patch LED lamp bead support structure according to claim 3, wherein, The top of the branch plate (17), the positive vertical plate one (27) and the negative vertical plate one (47) is equipped with a rotary elbow, which is overlapped at the root of the folding plate (18), the positive vertical plate two (28) and the negative vertical vertical plate two (48), and the top of the folding plate (18), the positive vertical plate two (28) and the negative vertical plate two (48) is respectively provided with a through hole (181), a positive overflow hole (281) and a negative overflow hole (481) corresponding to the corrugated groove (19), the positive solder groove (29) and the negative solder groove (49).

5. The patch LED lamp bead support structure according to claim 1, wherein, The bottom plate (11) and the top plate (12) are fixed by the pin column (13) at both ends, and the top surface of the two pin columns (13) is equipped with a light emitting chip (5), and the main plate (71) is installed with a relay seat (72) corresponding to the bottom surface of the pin column (13).

6. The patch LED lamp bead support structure according to claim 5, wherein, The positive sheet one (21) and the positive sheet two (22) are fixed by the positive rivet column (23), the negative sheet one (41) and the negative sheet two (42) are fixed by the negative rivet column (43), and the positive rivet column (23) and the negative rivet column (43) are respectively welded by gold wire (6) between the light emitting chip (5).

7. The patch LED lamp bead support structure according to claim 1, wherein, The carrier frame (7) further comprises a spacer (79), the side plate one (73) and the side plate two (74) are provided with a horizontal slit in the middle, the side plate one (73) and the side plate two (74) are fixed with two spacers (79) perpendicular to the long side of the main plate (71) along the slit, and the two adjacent spacers (79) extend downward and contact the bottom surface of the contact plate (16) and are away from each other.

8. The patch LED lamp bead support structure according to claim 7, wherein, The carrier frame (7) further comprises a support plate one (75), a support plate two (76), a support plate three (77) and a support plate four (78), the inclined plate (14), the positive inclined extension plate (24) and the negative inclined extension plate (44) are provided with through holes corresponding to the support plate one (75), the support plate two (76), the support plate three (77) and the support plate four (78), and the support plate one (75), the support plate two (76), the support plate three (77) and the support plate four (78) are embedded in the through hole.

9. The patch LED lamp bead support structure according to claim 8, wherein, The positive frame one (2) and the positive frame two (3) are completely same in structure except different arrangement position, the positive frame one (2) and the positive frame two (3) are arranged side by side, the negative frame (4) is located at the inner corner position of the intersection of the top plate (12) and the flat plate (15), and the contact plate (16), the negative contact plate (46) and the positive contact plate (26) are arranged at the four corner positions of the carrier frame (7) respectively.

10. A patch LED lamp bead having the patch LED lamp bead support structure of claim 1, characterized in that, The packaging glue (8) is located above the top surface of the carrier frame (7), and the flat plate (15), the positive straight extension plate (25) and the negative straight extension plate (45) are higher than the top surface of the packaging glue (8).

Images