Simulation auxiliary cleaning device for integrated circuit packaging design

Abstract

The invention provides an integrated circuit packaging design simulation auxiliary cleaning device, and relates to the technical field of integrated circuit packaging, the integrated circuit packaging design simulation auxiliary cleaning device comprises a bottom plate, a cleaning box, a control device and a simulation processing module, the cleaning box and the control device are located at the upper end of the bottom plate, the simulation processing module is installed in the control device, and a shell is arranged at the upper end in the cleaning box; a screw is arranged in the shell, threaded blocks are arranged on the two sides of the surface of the screw in a threaded sleeving mode, sliding blocks are arranged at the lower ends of the two threaded blocks, first connecting blocks are fixedly connected to the lower ends of the two sliding blocks, electric telescopic rods are fixedly connected to the lower ends of the two first connecting blocks, and second connecting blocks are fixedly connected to the lower ends of the two electric telescopic rods. Mounting plates are fixedly connected to the lower ends of the two second connecting blocks, and placing plates are fixedly arranged on the inner sides of the two mounting plates. The method has the advantages that by combining multiple cleaning technologies, pollutants on the surface and in the packaging body can be efficiently and thoroughly removed, and it is ensured that the cleaning process is efficient and accurate, and the packaging body cannot be damaged.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit packaging, and in particular to an integrated circuit packaging design simulation auxiliary cleaning device. Background Art

[0002] During the high-precision integrated circuit (IC) packaging process, dust, particulate matter, and packaging material residue often accumulate on the package surface. These contaminants can affect IC performance and even damage it. Currently, IC package cleaning relies primarily on manual labor or traditional, simple cleaning equipment. However, these methods are inefficient, unable to completely remove contaminants, and struggle to ensure accurate and consistent cleaning. Therefore, the development of an efficient, automated IC package cleaning device is an urgent need. Summary of the Invention

[0003] The present invention provides an integrated circuit package design simulation auxiliary cleaning device, which, by combining multiple cleaning technologies, can efficiently and thoroughly remove pollutants on the package surface and inside, ensuring that the cleaning process is efficient, accurate, and will not damage the package body.

[0004] In order to achieve the above-mentioned object of the invention, the technical solution adopted by the present invention is:

[0005] 18. The cleaning apparatus as claimed in claim 17, wherein the cleaning box is constructed so that the cleaning agent is readily available and can be used in conjunction with any one of the preceding claims. The cleaning apparatus as claimed in claim 17 is a computer program product and a computer program product. The cleaning apparatus as claimed in claim 17 is a computer program product and is readily available and can be used in conjunction with any one of the preceding claims. The cleaning box is provided with a plurality of cleaning plates, each of which has a first end fixedly connected to the bottom end of the cleaning plate, and a second end fixedly connected to the bottom end of the cleaning plate.

[0006] As an improvement, a number of through holes are provided on the two placement plates, a first sliding groove is provided on the upper ends of the two placement plates, a sliding rod is provided in the two first sliding grooves, a first slider is slidably sleeved on the surface of the two sliding rods, a first spring is provided on one side of the two first sliders, the two first sliders are respectively slidably matched with the two first sliding grooves, the upper ends of the two first sliders are respectively fixedly connected to the bottom ends of the two fixed plates, and a second spring is provided between the fixed plate and the mounting plate to clamp and fix the integrated circuit.

[0007] As an improvement, a high-pressure fan is provided on the right side of the cleaning box, and an air duct is connected to one side of the high-pressure fan. The air duct runs through the cleaning box and is connected to the first mounting bracket, and the loose particles and dirt on the surface of the integrated circuit package are blown away by the high-pressure airflow.

[0008] As an improvement, a first block is fixedly provided on both sides of the inner cavity of the cleaning box, a second block is provided at the lower end of the two first blocks, and a guide plate is rotatably connected to one side of the two first blocks. A hydraulic rod is provided on the lower side of the two guide plates, and the two hydraulic rods are tilted. The lower ends of the two hydraulic rods are respectively fixedly connected to the two second blocks, and the telescopic ends of the two hydraulic rods are respectively fixedly connected to the lower ends of the two guide plates. The pollutants on the surface of the integrated circuit fall on the guide plate and are cleaned by the vacuum head.

[0009] As an improvement, second slide grooves are provided on both sides of the inner cavity of the ultrasonic cleaning tank, and second sliders are slidably provided in the two second slide grooves. A filter plate is provided in the ultrasonic cleaning tank, and the two second sliders are fixedly connected to the filter plate. Handles are provided on both sides of the upper end of the filter plate, and third sliders are fixedly connected on both sides of the two handles. Third slide grooves are provided on both sides of the inner cavity of the cleaning box, and the third sliders slide in cooperation with the third slide grooves to provide high-frequency ultrasonic waves, and use microbubbles generated by ultrasonic vibrations to remove pollutants on the surface and gaps of the integrated circuit package.

[0010] As an improvement, a solvent box and a collection box are respectively provided on both sides of the rear end of the cleaning box. The upper end of the solvent box is provided with a pump connected to the upper end of the pump. The solvent tube passes through the cleaning box and is connected to the second mounting bracket. The lower end of the collection box is connected to a vacuum cleaner, and the other end of the vacuum cleaner is connected to a dust suction pipe. The dust suction pipe passes through the cleaning box and is connected to the dust suction head, which is used to evenly spray the cleaning solvent to dissolve stubborn pollutants such as oil, resin, etc. on the packaging surface. The vacuum cleaner sends the pollutants to the collection box.

[0011] As an improvement, the control device is provided with a display screen and control buttons to control the device.

[0012] As an improvement, the simulation processing module can help design engineers simulate different cleaning processes, cleaning equipment configurations and parameter settings, and evaluate which cleaning methods are most effective for packaged integrated circuits to avoid unnecessary damage.

[0013] The beneficial effects of the present invention are: by combining ultrasonic, airflow and solvent cleaning methods, various pollutants on the surface of integrated circuit packages can be effectively removed; the simulation processing module can adjust parameters according to different cleaning requirements to ensure the efficiency and consistency of the cleaning process; the cleaning process has a high degree of automation, reducing manual intervention and improving production efficiency; and it can adapt to the cleaning needs of integrated circuit packages of different specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a front view of a simulation auxiliary cleaning device for integrated circuit packaging design according to the present invention;

[0015] Figure 2 This is a diagram showing the internal structure of a simulation auxiliary cleaning device for integrated circuit packaging design according to the present invention;

[0016] Figure 3 This is a rear view of a simulated auxiliary cleaning device for integrated circuit packaging design according to the present invention;

[0017] Figure 4 A top view of an ultrasonic cleaning tank of an integrated circuit packaging design simulation auxiliary cleaning device according to the present invention;

[0018] Figure 5 This is an enlarged view of point A of a simulation auxiliary cleaning device for integrated circuit packaging design according to the present invention.

[0019] Figure: 1, cleaning box; 2, box door; 3, handle; 4, control device; 5, bottom plate; 6, display screen; 7, control button; 8, simulation processing module; 9, dryer; 10, connecting pipe; 11, shell; 12, screw; 13, motor; 14, box; 15, threaded block; 16, sliding block; 17, sliding groove; 18, first connecting block; 19, electric telescopic rod; 20, second connecting block; 21, mounting plate; 22, second mounting bracket; 23, nozzle; 24, first mounting bracket; 25, air outlet; 26, placement plate; 27, through hole; 2 8. Fixed plate; 29. Second spring; 30. First slide; 31. Slide rod; 32. First spring; 33. First slider; 34. First block; 35. Guide plate; 36. Hydraulic rod; 37. Second block; 38. Cleaning head; 39. Third slide; 40. Third slider; 41. Ultrasonic cleaning tank; 42. Handle; 43. Second slide; 44. Second slider; 45. Solvent tube; 46. Pump; 47. Solvent tank; 48. Collecting tank; 49. Vacuum cleaner; 50. Duct; 51. Filter plate; 52. High-pressure fan; 53. Air duct. DETAILED DESCRIPTION

[0020] To make the contents of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Identical parts are denoted by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, and the terms "inward" and "outward" refer to directions toward or away from the geometric center of a particular component, respectively.

[0021] like Figure 1 and Figure 5As shown, an integrated circuit packaging design simulation auxiliary cleaning device includes a base plate 5, a cleaning box 1, a control device 4 and a simulation processing module 8, characterized in that the control device 4 is provided with a display screen 6 and a control button 7 to control the device, the cleaning box 1 and the control device 4 are both located at the upper end of the base plate 5, the simulation processing module 8 is installed in the control device 4, a shell 11 is provided at the upper end of the cleaning box 1, a screw 12 is provided in the shell 11, one end of the screw 12 is rotatably connected to the inner wall of one side of the shell 11, a box body 14 is provided at the upper right end of the cleaning box 1, a motor 13 is provided in the box body 14, the other end of the screw 12 passes through the shell 11 and the cleaning box 1, and is connected to the output end of the motor 13 , the surface of the screw rod 12 is provided with threaded blocks 15 on both sides, and the lower ends of the two threaded blocks 15 are fixedly connected to the sliding blocks 16, and the lower end of the housing 11 is provided with a sliding groove 17, and the sliding groove 17 slides with the sliding block 16, and the lower ends of the two sliding blocks 16 are fixedly connected to the first connecting block 18, and the lower ends of the two first connecting blocks 18 are fixedly connected to the electric telescopic rod 19, and the lower ends of the two electric telescopic rods 19 are fixedly connected to the second connecting block 20, and the lower ends of the two second connecting blocks 20 are fixedly connected to the mounting plate 21, and the inner sides of the two mounting plates 21 are fixed with a placement plate 26, and the upper ends of the two placement plates 26 are provided with a fixing plate 28, and the two placement plates 26 are provided with a plurality of through holes 27. The upper ends of the two placement plates 26 are each provided with a first slide groove 30, and the two first slide grooves 30 are each provided with a slide rod 31. The surfaces of the two slide rods 31 are slidably sleeved with a first slider 33, and one side of the two first sliders 33 is provided with a first spring 32. The two first sliders 33 are respectively slidably matched with the two first slide grooves 30, and the upper ends of the two first sliders 33 are respectively fixedly connected to the bottom ends of the two fixed plates 28. A second spring 29 is provided between the fixed plate 28 and the mounting plate 21 to clamp and fix the integrated circuit. An ultrasonic cleaning pool 41 is provided at the bottom end of the inner cavity of the cleaning box 1, and second slide grooves 43 are provided on both sides of the inner cavity of the ultrasonic cleaning pool 41. Second sliders 4 are slidably provided in the two second slide grooves 43. 4. A filter plate 51 is provided in the ultrasonic cleaning tank 41. The two second sliders 44 are fixedly connected to the filter plate 51. Handles 42 are provided on both sides of the upper end of the filter plate 51. The two handles 42 are fixedly connected to the third slider 40 on both sides. A third slide 39 is provided on both sides of the inner cavity of the cleaning box 1. The third slider 40 slides with the third slide 39 to provide high-frequency ultrasonic waves. The microbubbles generated by ultrasonic vibrations are used to remove pollutants on the surface and gaps of the integrated circuit package. A dust collection head 38 is provided on the rear side wall of the inner cavity of the cleaning box 1. A first mounting bracket 24 is provided above the dust collection head 38. An air outlet 25 is provided at the lower end of the first mounting bracket 24. A second mounting bracket 22 is provided above the first mounting bracket 24.A nozzle 23 is provided at the lower end of the second mounting frame 22. A dryer 9 is provided on the left side of the cleaning box 1. A connecting pipe 10 is connected to the lower end of the dryer 9. The connecting pipe 10 passes through the cleaning box 1 and extends into the cleaning box 1. A door 2 is provided on the front of the cleaning box 1, and a handle 3 is provided on the door 2.

[0022] A high-pressure fan 52 is provided on the right side of the cleaning box 1. A wind duct 53 is connected to one side of the high-pressure fan 52. The wind duct 53 runs through the cleaning box 1 and is connected to the first mounting bracket 24. The loose particles and dirt on the surface of the integrated circuit package are blown away by the high-pressure airflow.

[0023] A first block 34 is fixedly provided on both sides of the inner cavity of the cleaning box 1, and a second block 37 is provided at the lower end of the two first blocks 34. A guide plate 35 is rotatably connected to one side of the two first blocks 34. A hydraulic rod 36 is provided on the lower side of the two guide plates 35. The two hydraulic rods 36 are tilted, and the lower ends of the two hydraulic rods 36 are respectively fixedly connected to the two second blocks 37. The telescopic ends of the two hydraulic rods 36 are respectively fixedly connected to the lower ends of the two guide plates 35. The pollutants on the surface of the integrated circuit fall on the guide plate 35 and are cleaned by the dust collector 38.

[0024] A solvent tank 47 and a collection tank 48 are respectively provided on both sides of the rear end of the cleaning box 1. The upper end of the solvent box 47 is provided with a pump 46, and the upper end of the pump 46 is connected to a solvent tube 45. The solvent tube 45 passes through the cleaning box 1 and is connected to the second mounting bracket 22. The lower end of the collection box 48 is connected to a dust collector 49, and the other end of the dust collector 49 is connected to a dust suction pipe 50. The dust suction pipe 50 passes through the cleaning box 1 and is connected to the dust suction head 38, and is used to evenly spray the cleaning solvent to dissolve stubborn pollutants such as oil, resin, etc. on the packaging surface. The dust collector 49 delivers the pollutants to the collection box.

[0025] The simulation processing module 8 can help design engineers simulate different cleaning processes, cleaning equipment configurations and parameter settings, and evaluate which cleaning methods are most effective for packaged integrated circuits to avoid unnecessary damage.

[0026] When in use, the integrated circuit board that needs to be cleaned is placed on the placement plate 26. The simulation processing module 8 can help design engineers simulate different cleaning processes, cleaning equipment configurations and parameter settings, evaluate which cleaning methods are most effective for the packaged integrated circuit, and avoid unnecessary damage. The device is started by the control button 7, and the start motor 13 drives the screw 12 to rotate, drives the two threaded blocks 15 to move in opposite directions, and drives the two placement plates 26 to move in opposite directions to fix the integrated circuit board. The two electric telescopic rods 19 drive the integrated circuit board to move downward into the ultrasonic cleaning tank 41, and the ultrasonic cleaning tank 41 is started to provide high-frequency ultrasonic waves. The microbubbles generated by ultrasonic vibrations are used to remove pollutants on the surface and gaps of the integrated circuit package. After the cleaning is completed, the two electric telescopic rods 19 retract and drive The integrated circuit board moves upward, and after moving to the specified position, the two hydraulic rods 36 are started, driving the two guide plates 35 to close, and the high-pressure fan 52 is started to blow out through the air duct 53 and the air outlet 25, and the loose particles and dirt on the surface of the integrated circuit package are swept away by the high-pressure airflow. The pump 46 is started to send the solvent in the solvent tank 47 to the nozzle 23 for spraying, and the cleaning solvent is evenly sprayed on the integrated circuit board to dissolve stubborn pollutants such as oil and resin on the package surface. The cleaned waste falls on the guide plate 35, and the vacuum cleaner 49 is started. The waste enters the collection box 48 through the vacuum head 38 and the vacuum pipe 50, and then the dryer 9 is started to dry the cleaned integrated circuit board through the connecting pipe 10. After cleaning, the ultrasonic cleaning tank 41 can be taken out, and the filter plate 51 can be taken out by the handle 42 for cleaning.

[0027] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. An integrated circuit package design simulation auxiliary cleaning device, comprising a base plate (5), a cleaning box (1), a control device (4) and a simulation processing module (8), characterized in that: The cleaning box (1) and the control device (4) are both located at the upper end of the base plate (5), the simulation processing module (8) is installed in the control device (4), a shell (11) is provided at the upper end of the cleaning box (1), a screw (12) is provided in the shell (11), one end of the screw (12) is rotatably connected to the inner wall of one side of the shell (11), a box (14) is provided at the upper end of the right side of the cleaning box (1), a motor (13) is provided in the box (14), and the other end of the screw (12) passes through the shell (1 1) and a cleaning box (1), and connected to the output end of the motor (13), the surface of the screw (12) is provided with a threaded block (15), the lower ends of the two threaded blocks (15) are fixedly connected to a sliding block (16), the lower end of the housing (11) is provided with a sliding groove (17), the sliding groove (17) and the sliding block (16) are slidably matched, the lower ends of the two sliding blocks (16) are fixedly connected to a first connecting block (18), and the lower ends of the two first connecting blocks (18) are fixedly connected to an electric telescopic rod (19) The lower ends of the two electric telescopic rods (19) are fixedly connected to the second connecting blocks (20), the lower ends of the two second connecting blocks (20) are fixedly connected to the mounting plates (21), the inner sides of the two mounting plates (21) are fixedly provided with placement plates (26), the upper ends of the two placement plates (26) are provided with fixing plates (28), the bottom end of the inner cavity of the cleaning box (1) is provided with an ultrasonic cleaning pool (41), the rear side wall of the inner cavity of the cleaning box (1) is provided with a dust collecting head (38), and the upper part of the dust collecting head (38) is provided with a first mounting bracket (2 4), an air outlet (25) is provided at the lower end of the first mounting frame (24), a second mounting frame (22) is provided above the first mounting frame (24), a nozzle (23) is provided at the lower end of the second mounting frame (22), a dryer (9) is provided on the left side of the cleaning box (1), a connecting pipe (10) is connected to the lower end of the dryer (9), the connecting pipe (10) passes through the cleaning box (1) and extends into the cleaning box (1), a box door (2) is provided on the front of the cleaning box (1), and a handle (3) is provided on the box door (2).

2. The integrated circuit package design simulation auxiliary cleaning device according to claim 1, characterized in that: A plurality of through holes (27) are provided on the two placement plates (26), a first slide groove (30) is provided on the upper end of the two placement plates (26), a slide rod (31) is provided in the two first slide grooves (30), a first slider (33) is slidably sleeved on the surface of the two slide rods (31), a first spring (32) is provided on one side of the two first sliders (33), the two first sliders (33) are respectively slidably matched with the two first slide grooves (30), the upper ends of the two first sliders (33) are respectively fixedly connected to the bottom ends of the two fixed plates (28), and a second spring (29) is provided between the fixed plate (28) and the mounting plate (21).

3. The integrated circuit package design simulation auxiliary cleaning device according to claim 1, characterized in that: A high-pressure blower (52) is provided on the right side of the cleaning box (1), and an air duct (53) is connected to one side of the high-pressure blower (52). The air duct (53) passes through the cleaning box (1) and is in communication with the first mounting bracket (24).

4. The integrated circuit package design simulation auxiliary cleaning device according to claim 1, characterized in that: A first block (34) is fixedly provided on both sides of the inner cavity of the cleaning box (1), a second block (37) is provided at the lower end of the two first blocks (34), a guide plate (35) is rotatably connected to one side of the two first blocks (34), a hydraulic rod (36) is provided at the lower side of the two guide plates (35), the two hydraulic rods (36) are tilted, the lower ends of the two hydraulic rods (36) are respectively fixedly connected to the two second blocks (37), and the telescopic ends of the two hydraulic rods (36) are respectively fixedly connected to the lower ends of the two guide plates (35).

5. The integrated circuit package design simulation auxiliary cleaning device according to claim 1, characterized in that: Second chutes (43) are provided on both sides of the inner cavity of the ultrasonic cleaning tank (41), and second sliders (44) are slidably provided in the two second chutes (43). A filter plate (51) is provided in the ultrasonic cleaning tank (41), and the two second sliders (44) are fixedly connected to the filter plate (51). Handles (42) are provided on both sides of the upper end of the filter plate (51), and third sliders (40) are fixedly connected on both sides of the two handles (42). Third chutes (39) are provided on both sides of the inner cavity of the cleaning box (1), and the third slider (40) is slidably matched with the third chutes (39).

6. The integrated circuit package design simulation auxiliary cleaning device according to claim 1, characterized in that: A solvent box (47) and a collection box (48) are respectively provided on both sides of the rear end of the cleaning box (1); the upper end of the solvent box (47) is provided with a pump (46); the upper end of the pump (46) is connected to a solvent pipe (45); the solvent pipe (45) passes through the cleaning box (1) and is in communication with the second mounting frame (22); the lower end of the collection box (48) is connected to a dust collector (49); the other end of the dust collector (49) is connected to a dust collection pipe (50); the dust collection pipe (50) passes through the cleaning box (1) and is connected to the dust collection head (38).

7. The integrated circuit package design simulation auxiliary cleaning device according to claim 1, characterized in that: The control device (4) is provided with a display screen (6) and control buttons (7).

8. The integrated circuit package design simulation auxiliary cleaning device according to claim 1, characterized in that: The simulation processing module (8) can help design engineers simulate different cleaning processes, cleaning equipment configurations and parameter settings, and evaluate which cleaning methods are most effective for packaged integrated circuits to avoid unnecessary damage.

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