Crystal bar supporting method, supporting combination, cutting combination and gypsum composite material

Abstract

The invention relates to a crystal bar supporting method, a supporting combination, a cutting combination and a gypsum composite material for crystal bar cutting. In one aspect, a crystal bar support method for crystal bar cutting is provided that includes filling a groove of a rigid support device for supporting a crystal bar with a gypsum composite material, where the groove is to receive the crystal bar; and before the gypsum composite material is completely solidified, the crystal bar is placed in the groove so that the crystal bar can be attached to the gypsum composite material. Therefore, the stress uniformity of the crystal bar in the cutting process can be improved, and the risk that defects such as edge breakage and microcracks occur in the cutting process of the crystal bar is reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor manufacturing technology, and in particular to a crystal rod supporting method, a supporting assembly, a truncation assembly, and a gypsum composite material for crystal rod cutting. Background Art

[0002] Wafers are the core material for manufacturing high-tech products such as integrated circuits and solar panels. Typically, wafers are cut from ingots produced through processes such as the Czochralski method using a cutting machine.

[0003] However, due to the influence of multiple complex factors during the crystal growth process, the grown crystal ingot may deform or its diameter may fluctuate. In this case, when the ingot is cut by a cutter, it is prone to quality problems such as edge chipping and cracking, which will affect the yield and performance of the wafers, and increase production costs and waste.

[0004] Furthermore, cutting machines typically require a support device that fits snugly against the ingot's surface. However, if the ingot's diameter fluctuates or undergoes slight deformation, the support device may not fully adhere to the ingot's surface. This incomplete fit results in uneven force applied to the ingot during cutting, increasing the risk of edge cracking. This is particularly pronounced when the ingot's diameter fluctuates or deformation is significant, impacting cutting quality and production efficiency. Summary of the Invention

[0005] This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.

[0006] The object of the present disclosure is to provide a crystal ingot supporting method for crystal ingot cutting that can improve the force uniformity of the crystal ingot during the cutting process.

[0007] To achieve the above objectives, in one aspect, a method for supporting a crystal ingot for crystal ingot cutting is provided, the method comprising: Filling a groove of a rigid support device for supporting a crystal rod with a gypsum composite material, wherein the groove is used to receive the crystal rod; and Before the gypsum composite material is completely solidified, the crystal rod is placed in the groove so that the crystal rod and the gypsum composite material fit together.

[0008] In some embodiments, the groove may be an arc-shaped groove, the curvature radius of the arc-shaped groove is consistent, and the absolute value of the difference between the curvature radius and the nominal radius of the crystal rod is greater than or equal to 1.0 mm and less than or equal to 3.0 mm.

[0009] In some embodiments, the gypsum composite material may be formed by compounding α-hemihydrate gypsum and water.

[0010] In some embodiments, the particle size of the α-hemihydrate gypsum may be greater than or equal to 200 mesh and less than or equal to 600 mesh.

[0011] In some embodiments, the mass ratio of water to α-hemihydrate gypsum may be greater than or equal to 0.29 and less than or equal to 0.55.

[0012] In some embodiments, a retarder may be added to the gypsum composite material.

[0013] In some embodiments, the retarder may be a citric acid retarder, and the added amount of the citric acid retarder is greater than or equal to 0.5% and less than or equal to 1.5% by mass.

[0014] In some embodiments, during the setting process of the gypsum composite material using a retarder, the ambient temperature may be controlled to be greater than or equal to 21° C. and less than or equal to 25° C., and the relative humidity may be controlled to be less than or equal to 60% RH (Relative Humidity).

[0015] In some embodiments, the method may further include: fixing the support device before placing the crystal ingot in the groove.

[0016] According to another aspect of the present disclosure, a support assembly for crystal ingot cutting is provided, comprising: A supporting device, used for supporting the crystal rod and having a groove for receiving the crystal rod; The gypsum composite material is used to fill the groove to fit the crystal rod placed in the groove.

[0017] According to another aspect of the present disclosure, a truncation assembly for crystal ingot cutting is provided, comprising: The support assembly for ingot cutting according to the above embodiment; and A cutting device is used to cut the crystal rod supported by the support assembly.

[0018] In some embodiments, the cutting device may include a fixing mechanism for fixing the supporting device.

[0019] In some embodiments, the fixing mechanism may include a clamping groove and a clamping slider, wherein the clamping groove is used to receive the supporting device therein, and the clamping slider is disposed in the clamping groove and is movable in the clamping groove to clamp and fix the supporting device in the clamping groove.

[0020] According to another aspect of the present disclosure, a gypsum composite material for crystal ingot cutting is provided. The gypsum composite material is used to fill a groove of a rigid support device for supporting a crystal ingot, so as to fit the crystal ingot placed in the groove before being completely solidified.

[0021] According to the above technical solution, by filling the groove of the rigid supporting device for supporting the crystal rod with gypsum composite material, and placing the crystal rod into the groove before the gypsum composite material is completely solidified, so that the crystal rod and the gypsum composite material fit together, the rigid support of the supporting device and the elastic fit of the gypsum composite material together form a composite structure that can provide both rigidity and elasticity. The composite structure can significantly improve the fit between the supporting device and the surface of the crystal rod, and can effectively absorb cutting vibrations while providing sufficient compressive strength for the crystal rod, so that the cutting force borne by the crystal rod during the cutting process is more evenly distributed, thereby reducing the risk of defects such as edge collapse and microcracks in the crystal rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The features and advantages of the embodiments of the present disclosure will become more readily understood through the following description with reference to the accompanying drawings. The drawings are not drawn to scale and some features may be exaggerated or minimized to show details of particular parts. In the drawings: Figure 1 A perspective view schematically shows a state in which a crystal ingot having a fluctuating diameter is supported by a supporting device according to the related art.

[0023] Figure 2 The present invention is a flowchart of a method for supporting a crystal ingot for crystal ingot cutting according to an embodiment of the present disclosure.

[0024] Figure 3 A state in which a crystal ingot is supported by a support assembly for crystal ingot cutting according to an embodiment of the present disclosure is schematically shown in an end view.

[0025] Figure 4 A side view schematically illustrates a situation in which a crystal ingot is cut using a truncation assembly for crystal ingot cutting according to an embodiment of the present disclosure.

[0026] Figure 5 The end view schematically shows the use of Figure 4 The truncation combination for crystal rod cutting shown in FIG.

[0027] Figure 6 for Figure 4 Schematic diagram of the structure of the fixing mechanism of the truncation combination shown in .

[0028] In the drawings, the same or corresponding technical features, parts or components are represented by the same or corresponding reference numerals. DETAILED DESCRIPTION

[0029] The present disclosure will be described in detail below with reference to the accompanying drawings by means of exemplary embodiments. It should be noted that the following detailed description of the present disclosure is only for illustrative purposes and is by no means limiting of the present disclosure.

[0030] It should be noted that, for the sake of clarity, not all features of a specific embodiment are described and shown in the specification and drawings. Moreover, in order to avoid unnecessary details that obscure the technical solutions focused on by the present disclosure, only the device structures and parts closely related to the technical solutions of the present disclosure are described and shown in the specification and drawings, while other details that are not closely related to the technical content of the present disclosure and are known to those skilled in the art are omitted.

[0031] As discussed previously, in actual production, the crystal rod may be deformed or have diameter fluctuations. For example, the crystal rod may undergo physical deformation as a whole or in part, such as bending, causing the shape of the crystal rod to deviate from the ideal cylindrical shape; or the diameter of a certain section of the crystal rod in the axial direction may deviate from the target diameter and become thicker or thinner.

[0032] In this case, when the cutter uses a cutting tool, such as a cutting wire, to cut the crystal ingot, the distribution of the cutting force applied by the cutting tool on the crystal ingot will be significantly uneven, affecting the cutting effect and causing quality problems. For example, for areas with a smaller actual diameter, the cutting force per unit area will increase, which can easily cause defects such as edge chipping or microcracks in the crystal ingot. At the same time, the increase in cutting force will in turn accelerate the wear of the cutting tool and reduce the service life of the cutting tool. On the other hand, for areas with a larger actual diameter, the cutting force per unit area will decrease, which can easily cause the cutting path to deviate, leading to increased roughness of the cut surface.

[0033] Furthermore, deformation or diameter fluctuations of the ingot can cause problems with ingot support during the cutting process. Figure 1 , which shows in perspective view a situation where a supporting device 10' of the related art is used to support a crystal ingot 2' having a fluctuating diameter. The supporting device 10' has a groove 110' for receiving the crystal ingot 2', so as to support the crystal ingot 2' by receiving the crystal ingot 2' in the groove 110'. Figure 1 The flat surface 1101' at the lowest point of the groove 110' is shown in dashed lines, and the surface 21' of the portion of the crystal ingot 2' received in the groove 110' is also shown in dashed lines. It can be clearly observed that when the crystal ingot 2' is deformed or its diameter fluctuates, the flat surface 1101' of the support device 10' does not completely fit with the surface 21' of the crystal ingot 2'. In this case, when the crystal ingot 2' is cut by a cutter, the cutting force on the crystal ingot 2' will be uneven, at least in the fitting and non-fitting areas of the crystal ingot 2'. The uneven force may also cause the crystal ingot 2' to tilt or wobble during cutting, thereby increasing the risk of defects such as edge chipping and microcracks in the crystal ingot 2'.

[0034] In this regard, according to an embodiment of the present disclosure, a method for supporting a crystal rod for cutting a crystal rod is provided. Figure 2 and Figure 3 , the crystal rod supporting method is described in detail.

[0035] The crystal rod supporting method includes: Filling a groove of a rigid support device for supporting a crystal rod with a gypsum composite material, wherein the groove is used to receive the crystal rod; Before the gypsum composite material is completely solidified, the crystal rod is placed in the groove so that the crystal rod and the gypsum composite material fit together.

[0036] The support device 10 is typically rigid and can be, for example, a resin plate or metal support plate. During the cutting process, the ingot 2 must remain in a relatively stable position so that the cutting tool can follow the intended path. The rigid support device 10 provides stable and rigid support for the ingot 2, preventing it from shifting or shaking during cutting due to unstable support.

[0037] Support device 10 is provided with a groove 110 for receiving crystal ingot 2 in groove 110 to support crystal ingot 2. By filling groove 110 with gypsum composite material 120, when crystal ingot 2 is placed in groove 110 before gypsum composite material 120 is completely solidified, gypsum composite material 120 is located between groove 110 and the surface of crystal ingot 2. Due to the micro-expansion characteristics of gypsum composite material 120, the surface of crystal ingot 2 is closely attached to the gypsum composite material 120.

[0038] The gypsum composite material 120 exhibits excellent fluidity when in an uncured slurry state. When the crystal ingot 2 is placed in the groove 110, the gypsum composite material 120 can adaptively conform to the surface of the crystal ingot 2 due to its micro-expansion properties. For example, if the crystal ingot 2 deforms or its diameter fluctuates, the shape of the uncured gypsum composite material 120 can fully adapt to the contours of the crystal ingot 2's surface, allowing the gypsum composite material 120 to fit tightly against the crystal ingot 2. Furthermore, after curing and hardening, the gypsum composite material 120 possesses a certain strength and hardness, providing sufficient support for the crystal ingot 2 during the cutting process, preventing excessive deformation, cracking, or damage due to the ingot 2's own weight or the impact of external loads.

[0039] In this way, the rigid support of the support device 10 and the elastic fit of the gypsum composite material 120 together form a composite structure that provides both rigidity and elasticity. This composite structure significantly improves the fit between the support device 10 and the surface of the crystal ingot 2 (for example, reducing the porosity to less than or equal to 0.5%), provides sufficient compressive strength for the crystal ingot 2 (for example, increasing the compressive strength to greater than or equal to 20 MPa), and effectively absorbs cutting vibrations. This allows for a more even distribution of the cutting force applied to the crystal ingot 2 during cutting, thereby reducing the risk of defects such as chipping and microcracks in the crystal ingot 2. Furthermore, it reduces wear on the cutting tool, extending its service life.

[0040] In some embodiments, as Figure 3 As shown in , the groove 110 may be an arc-shaped groove, the curvature radius of the arc-shaped groove is consistent, and the absolute value of the difference between the curvature radius and the nominal radius of the crystal rod 2 is greater than or equal to 1.0 mm and less than or equal to 3.0 mm.

[0041] The crystal ingot 2 is typically cylindrical and has a predetermined ideal radius, i.e., a nominal radius, during design or production. However, during actual production, the radius of the crystal ingot 2 may vary due to various factors, resulting in a certain deviation from the nominal radius.

[0042] By setting the absolute value of the deviation between the curvature radius of the groove 110 and the nominal radius of the crystal rod 2 within the range of 1.0~3.0mm, the groove 110 of the supporting device 10 can be matched with the crystal rod 2 as much as possible to provide a larger area of contact with the surface of the crystal rod 2 and more stable rigid support, so that in the above-mentioned composite structure finally formed, not only can a close fit be achieved to effectively absorb the cutting vibration, but the rigid supporting device 10 can also be used to provide a larger proportion of rigid support for the crystal rod 2, further improving the stability of the support, thereby further reducing the risk of defects such as edge collapse and microcracks in the crystal rod 2.

[0043] In some embodiments, the gypsum composite material 120 may be composed of α-hemihydrate gypsum and water.

[0044] α-hemihydrate gypsum (α-CaSO4•0.5H2O) is formed by dehydrating dihydrate gypsum (CaSO4•2H2O) under specific conditions. α-hemihydrate gypsum is a dry powder. When mixed with water, it undergoes a hydration reaction, transforming the gypsum from a dry powder into a fluid slurry. As the hydration reaction proceeds, dihydrate gypsum crystals form, and the gypsum hardens from a fluid slurry into a hardened form with a certain strength.

[0045] In this way, by using a gypsum composite material 120 composed of α-type hemihydrate gypsum and water, the gypsum composite material 120 can be in a fluid slurry state before solidification, and have a certain strength after hardening, thereby achieving elastic fitting of the gypsum composite material 120 to the crystal rod 2 and improving the fit with the surface of the crystal rod 2.

[0046] In some embodiments, the particle size of the α-hemihydrate gypsum may be greater than or equal to 200 mesh and less than or equal to 600 mesh.

[0047] The particle size of α-hemihydrate gypsum is set between 200 mesh and 600 mesh, which falls between coarse particles and ultrafine powder, representing an appropriate particle size distribution. When α-hemihydrate gypsum within this particle size range is combined with water to form gypsum composite material 120, coarser particles (e.g., 200 mesh particles) provide skeletal support for gypsum composite material 120, while finer particles (e.g., 600 mesh particles) fill micro-voids, reducing porosity and increasing the density and compressive strength of gypsum composite material 120. Medium particles (e.g., 400 mesh particles) balance the fluidity of gypsum composite material 120 in a slurry state.

[0048] Therefore, the gypsum composite material 120 formed within this particle size range can form a relatively dense microstructure, further improving the compressive strength of the hardened gypsum composite material 120 and enhancing the supporting capacity of the crystal rod 2 .

[0049] In addition, the gypsum composite material 120 formed within this particle size range has good fluidity when in a slurry state, and can fully fit the surface contour of the crystal rod 2, further improving the degree of fit with the surface of the crystal rod 2.

[0050] If the particle size of α-hemihydrate gypsum is less than 200 mesh, the particles are coarse and the gaps between the particles increase, resulting in an increased porosity of the gypsum composite material 120 and lower strength after hardening, which leads to insufficient support for the crystal rod 2, thereby causing defects such as edge collapse and microcracks in the crystal rod 2. In addition, the coarse particles within this particle size range will cause the gypsum composite material 120 to have poor fluidity in the slurry state and fail to fully adhere to the surface of the crystal rod 2. If the particle size of α-hemihydrate gypsum is greater than 600 mesh, the particles are too fine, the water requirement increases, and the mass ratio of water to α-hemihydrate gypsum is large, which will reduce the strength of the gypsum composite material 120 after hardening and also lead to insufficient support for the crystal rod 2. In addition, overly fine particles are prone to agglomeration, which may cause the gypsum composite material 120 to be filled unevenly in the groove 110.

[0051] For example, the particle size ratio of α-type hemihydrate gypsum can be 30% 200 mesh + 50% 400 mesh + 20% 600 mesh.

[0052] The gypsum composite material 120 formed by combining α-type hemihydrate gypsum with water using this particle size ratio has 30% coarse particles (200 mesh) forming the skeleton of the gypsum composite material 120, 50% medium particles (400 mesh) filling the medium voids, and 20% fine particles (600 mesh) filling the micropores. This achieves the densest packing and further reduces the porosity of the gypsum composite material 120. Furthermore, the 50% proportion of medium particles (400 mesh) ensures that the gypsum composite material 120 has good fluidity in the slurry state, allowing it to adhere fully to the surface of the crystal ingot 2.

[0053] In this way, the gypsum composite material 120 formed under this particle size distribution has a relatively dense structure, which can evenly disperse the cutting stress during cutting, reduce local stress concentration, and thus reduce the risk of edge collapse.

[0054] In some embodiments, the mass ratio of water to α-hemihydrate gypsum may be greater than or equal to 0.29 and less than or equal to 0.55.

[0055] The mass ratio of water to α-hemihydrate gypsum is the water-to-paste ratio. If the water-to-paste ratio is set to less than 0.29, the amount of water used is relatively small, making it difficult to mix the α-hemihydrate gypsum evenly during the mixing process. This results in poor fluidity of the gypsum composite material 120 in the slurry state, which can lead to incomplete filling in the groove 110. Unfilled gaps can form filling defects, which can cause quality problems such as edge chipping and cracking in the crystal ingot 2 during cutting.

[0056] If the water-to-cement ratio is set to greater than 0.55, the amount of water used is high. This excess water will result in more pores within the hardened gypsum composite material 120, significantly reducing the compressive strength of the gypsum composite material 120. During the cutting process, the gypsum composite material 120 may be unable to withstand the weight of the crystal ingot 2 and the impact of external loads due to insufficient strength, resulting in cracks or damage, affecting the cutting process and cutting quality.

[0057] By setting the water-paste ratio between 0.29 and 0.55, the gypsum composite material 120 formed within this range has suitable fluidity in the slurry state, can adapt to the slight fluctuations in the surface profile of the crystal rod 2, and fit tightly to the surface of the crystal rod 2. This tight fit can prevent the crystal rod 2 from shifting or shaking during the cutting process, thereby keeping the crystal rod 2 stable during the cutting process, and making the supporting force on the crystal rod 2 more evenly distributed, thereby avoiding edge cracking caused by local stress concentration.

[0058] Furthermore, by setting the water-to-cement ratio between 0.29 and 0.55, the gypsum composite material 120 formed within this range can achieve a compressive strength of 20 MPa or greater 20 minutes after final setting. This allows the gypsum composite material 120 to withstand significant pressure in a short period of time. Under the weight of the crystal ingot 2 and the impact of external loads, the gypsum composite material 120 will not deform or damage, providing stable support for the crystal ingot 2.

[0059] In some embodiments, a retarder may be added to the gypsum composite material 120 .

[0060] A retarder is an additive that prolongs the setting time of gypsum. By mixing α-hemihydrate gypsum, water, and the retarder in a certain proportion, a fluid slurry of gypsum composite material 120 is formed. The retarder prolongs the setting time of the gypsum composite material 120. During the process of filling the slurry of gypsum composite material 120 into the groove 110, ample time is available for filling and trimming the gypsum composite material 120, allowing it to better adapt to the surface contour of the crystal ingot 2, reducing filling defects, further improving its fit with the surface of the crystal ingot 2, and enhancing cutting quality and production efficiency.

[0061] In some embodiments, the retarder may be a citric acid retarder, and the added amount of the citric acid retarder is greater than or equal to 0.5% and less than or equal to 1.5% by mass.

[0062] Citric acid is used as a retarder, and its addition amount is controlled within the range of 0.5wt.% to 1.5wt.%. This can effectively delay the setting time of the gypsum composite material 120, and control the initial setting time of the gypsum composite material 120 to between 10 minutes and 15 minutes, so that the gypsum composite material 120 in a slurry state has sufficient time to fill the groove 110 and flow between the crystal rod 2 and the groove 110, and closely adhere to the surface of the crystal rod 2. If the setting time is too short, the gypsum composite material 120 will begin to solidify before it is evenly distributed and adhered to the surface of the crystal rod 2, and a good bonding effect cannot be achieved. If the setting time is too long, the gypsum composite material 120 in a slurry state may flow excessively in the groove 110, fail to solidify in time, and fail to achieve a good bonding effect with the surface of the crystal rod 2.

[0063] Furthermore, the addition of the citric acid retarder optimizes the setting and hardening process of the gypsum composite material 120. Specifically, the addition of the citric acid retarder moderately delays the hydration reaction of the gypsum composite material 120, thereby ensuring a more complete and orderly growth of the hydration products, reducing internal defects, and improving the density and compressive strength of the gypsum composite material 120, further enhancing its ability to support the crystal ingot 2.

[0064] It is conceivable that the crystal ingot 2 can be placed in the groove 110 within 15 minutes after the gypsum composite material 120 is prepared, so that the crystal ingot 2 is adjusted to fit tightly with the gypsum composite material 120 .

[0065] In some embodiments, during the setting process of the gypsum composite material 120 by the retarder, the ambient temperature may be controlled to be greater than or equal to 21° C. and less than or equal to 25° C., and the relative humidity may be controlled to be less than or equal to 60% RH.

[0066] During the setting process of the gypsum composite material 120 using the retarder, a suitable process environment enables the hydration reaction of the gypsum composite material 120 to proceed normally. By controlling the ambient temperature during the setting process of the gypsum composite material 120 using the retarder between 21°C and 25°C and the relative humidity to 60% or less, the hydration reaction rate of the gypsum composite material is more uniform, allowing the gypsum composite material 120 in the slurry state to maintain appropriate fluidity during the operation time, thereby achieving a close fit with the surface of the crystal ingot 2.

[0067] In addition, by controlling the ambient temperature between 21 and 25°C and the relative humidity to less than or equal to 60%RH, the retarder can better play its role, better controlling the setting process of the gypsum composite material 120, making the setting time of the gypsum composite material 120 more stable and making it more closely fitted with the crystal rod 2.

[0068] In some embodiments, the crystal ingot supporting method for crystal ingot cutting further includes fixing the supporting device 10 before placing the crystal ingot 2 in the groove 110 .

[0069] The support device 10 is fixed before the crystal rod 2 is placed in the groove 110, so that the crystal rod 2 can be accurately positioned before cutting and the crystal rod 2 can be fixed at the cutting position during the cutting process to prevent the crystal rod 2 and the support device 10 from moving or shaking during the cutting process, thereby affecting the cutting accuracy.

[0070] According to another aspect of the present disclosure, referring to Figure 3 , a support assembly 100 for cutting a crystal ingot is also provided. The support assembly 100 includes a support device 10 and a gypsum composite material 120.

[0071] The support device 10 is used to support the crystal ingot 2 and has a groove 110 for receiving the crystal ingot 2 .

[0072] The gypsum composite material 120 is used to fill the groove 110 so as to fit the crystal rod 2 in the groove 110 .

[0073] According to another aspect of the present disclosure, referring to Figures 4 to 6, a cutting assembly 1 for cutting a crystal rod is also provided. The cutting assembly 1 includes a support assembly 100 and a cutting device 20.

[0074] The support assembly 100 is used to support the crystal ingot 2 , and the cutting device 20 is used to cut the crystal ingot 2 supported by the support assembly 100 .

[0075] For example, referring to Figure 4 and Figure 5 The cutting device 20 may include a cutting mechanism 210 and a driving mechanism 220. The driving mechanism 220 drives the cutting mechanism 210 to cut the crystal ingot 2 supported by the support assembly 100. The cutting mechanism 210 may be a cutting wheel, and the driving mechanism 220 may be a driving motor.

[0076] In addition, other implementation forms of the cutting mechanism 210 and the driving mechanism 220 can also be envisioned, which are not limited here.

[0077] In some embodiments, reference Figure 4 and Figure 5 The cutting device 20 may include a fixing mechanism 230 , and the fixing mechanism 230 is used to fix the supporting device 10 .

[0078] In this way, by using the fixing mechanism 230, the support device 10 can be fixed before the crystal rod 2 is placed in the groove 110, so that the crystal rod 2 can be accurately positioned before cutting, avoiding the crystal rod 2 from moving or shaking during the cutting process, thereby preventing the resulting chipping or cracks.

[0079] For example, referring to Figure 6 The fixing mechanism 230 may include a clamping groove 2310 and a clamping slider 2320. The clamping groove 2310 may receive the support device 10 therein, and the clamping slider 2320 is disposed in the clamping groove 2310 and is movable in the clamping groove 2310 to fix the support device 10 in the clamping groove 2310. For example, locking bolts may be disposed on both sides of the clamping slider 2320. The locking bolts drive the clamping slider 2320 to move in the clamping groove 2310 to fix the support device 10 in the clamping groove 2310.

[0080] In addition, other fixing forms of the fixing mechanism 230 can also be envisioned. For example, a clamping slider 2320 can be set only on one side of the clamping groove 2310, and the clamping slider 2320 can be driven by a compression spring to fix the support device 10. This is not limited here.

[0081] According to yet another aspect of the present disclosure, a gypsum composite material for crystal rod cutting is provided.

[0082] The gypsum composite material is used to fill a groove of a rigid supporting device for supporting a crystal rod, so as to be fitted with the crystal rod placed in the groove before being completely solidified.

[0083] It is contemplated that the gypsum composite material may be the gypsum composite material 120 in any of the above-mentioned embodiments.

[0084] For example, it is contemplated that the gypsum composite material may be composed of α-hemihydrate gypsum and water. It is contemplated that the particle size of the α-hemihydrate gypsum may be greater than or equal to 200 mesh and less than or equal to 600 mesh. It is contemplated that the mass ratio of water to α-hemihydrate gypsum may be greater than or equal to 0.29 and less than or equal to 0.55. It is contemplated that a retarder may be added to the gypsum composite material. It is also contemplated that the retarder may be a citric acid retarder, with the amount of the citric acid retarder added being greater than or equal to 0.5% and less than or equal to 1.5% by mass.

[0085] Although the present disclosure has been described with reference to exemplary embodiments, it should be understood that the present disclosure is not limited to the specific embodiments described and illustrated in detail herein. Those skilled in the art may make various changes to the exemplary embodiments without departing from the scope defined by the claims of the present disclosure.

[0086] The features mentioned and / or illustrated in the above description of the exemplary embodiments of the present disclosure may be incorporated into one or more other embodiments in the same or similar manner, combined with features in other embodiments, or substituted for corresponding features in other embodiments. The technical solutions obtained by such combination or substitution shall also be deemed to be included within the scope of protection of the present disclosure.

Claims

1. A method for supporting a crystal ingot for cutting a crystal ingot, characterized in that: include: Filling a gypsum composite material into a groove of a rigid supporting device for supporting the crystal rod, wherein the groove is used to receive the crystal rod; as well as Before the gypsum composite material is completely solidified, the crystal rod is placed in the groove so that the crystal rod and the gypsum composite material are in contact with each other.

2. The method for supporting a crystal ingot for crystal ingot cutting according to claim 1, wherein: The groove is an arc-shaped groove, the curvature radius of the arc-shaped groove is consistent, and the absolute value of the difference between the curvature radius and the nominal radius of the crystal rod is greater than or equal to 1.0 mm and less than or equal to 3.0 mm.

3. The method for supporting a crystal ingot for crystal ingot cutting according to claim 1 or 2, characterized in that: The gypsum composite material is compounded from α-type hemihydrate gypsum and water.

4. The method for supporting a crystal ingot for crystal ingot cutting according to claim 3, wherein: The particle size of the α-type hemihydrate gypsum is greater than or equal to 200 meshes and less than or equal to 600 meshes.

5. The method for supporting a crystal ingot for crystal ingot cutting according to claim 3, wherein: The mass ratio of the water to the α-hemihydrate gypsum is greater than or equal to 0.29 and less than or equal to 0.

55.

6. The method for supporting a crystal ingot for crystal ingot cutting according to claim 1 or 2, characterized in that: A retarder is added into the gypsum composite material.

7. The method for supporting a crystal ingot for crystal ingot cutting according to claim 6, wherein: The retarder is a citric acid retarder, and the added amount of the citric acid retarder is greater than or equal to 0.5% and less than or equal to 1.5% by mass.

8. The method for supporting a crystal ingot for crystal ingot cutting according to claim 6, wherein: During the solidification process of the gypsum composite material by the retarder, the ambient temperature is controlled to be greater than or equal to 21° C. and less than or equal to 25° C., and the relative humidity is controlled to be less than or equal to 60% RH.

9. The method for supporting a crystal ingot for crystal ingot cutting according to claim 1 or 2, characterized in that: Also includes: Before placing the crystal ingot in the groove, the supporting device is fixed.

10. A support assembly for cutting a crystal ingot, characterized in that: include: A supporting device, used for supporting the crystal rod and having a groove for receiving the crystal rod; The gypsum composite material is used to fill the groove to fit the crystal rod placed in the groove.

11. A cutting assembly for cutting a crystal rod, characterized in that: include: The support assembly for crystal ingot cutting according to claim 10; as well as A cutting device is used for cutting the crystal rod supported by the support assembly.

12. The cutting assembly for crystal ingot cutting according to claim 11, characterized in that: The cutting device includes a fixing mechanism, and the fixing mechanism is used to fix the supporting device.

13. The cutting assembly for crystal ingot cutting according to claim 12, characterized in that: The fixing mechanism includes a clamping groove and a clamping slider. The clamping groove is used to receive the supporting device therein. The clamping slider is arranged in the clamping groove and can move in the clamping groove to clamp and fix the supporting device in the clamping groove.

14. A gypsum composite material for crystal rod cutting, characterized in that: The gypsum composite material is used to fill a groove of a rigid supporting device used to support the crystal rod, so as to fit the crystal rod placed in the groove before being completely solidified.

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