High-thermal-conductivity epoxy resin copper-clad plate and manufacturing method thereof

Abstract

The invention provides a high-thermal-conductivity epoxy resin copper-clad plate. A resin glue solution used for manufacturing the high-thermal-conductivity epoxy resin copper-clad plate is prepared from the following raw materials in parts by weight: 52-56 parts of dicyclopentadiene phenol type epoxy resin, 0.3-0.6 part of an accelerant, 9-12 parts of a curing agent, 66-70 parts of filler, 7-10 parts of a toughening agent, 10-15 parts of a flame retardant and 78-82 parts of a solvent. The invention further provides a manufacturing method of the high-thermal-conductivity epoxy resin copper-clad plate. The high-thermal-conductivity epoxy resin copper-clad plate provided by the invention has relatively good dielectric property and thermal conductivity, and is suitable for high-frequency and high-temperature environments.

Description

Technical Field

[0001] The invention relates to a copper clad laminate, in particular to a high thermal conductivity epoxy resin copper clad laminate and a manufacturing method thereof. Background Art

[0002] With the advancement of technology, various electronic products are continuously moving towards high integration, high frequency, and diversified functionality. The higher the integration level of electronic products, the less easily heat can be dissipated, leading to heat accumulation within the circuit board and reducing its service life. Glass fiber cloth epoxy resin-based copper-clad laminates are currently the most commonly used copper-clad laminates in electronic products. Epoxy resins have excellent processing, bonding, and mechanical properties, making them widely used in the electronics field. However, conventional epoxy resins have poor dielectric properties, making them unsuitable for high-frequency applications. Furthermore, they have poor thermal conductivity and may decompose or even fail in high-temperature environments, leading to circuit failures. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a high thermal conductivity epoxy resin copper clad laminate, which has good dielectric properties and thermal conductivity and is suitable for high frequency and high temperature environments.

[0004] In order to solve the above technical problems, the technical solution of the present invention is:

[0005] A high thermal conductivity epoxy resin copper clad laminate is provided. The resin glue used in manufacturing the high thermal conductivity epoxy resin copper clad laminate is prepared from the following raw materials in parts by weight: 52-56 parts of dicyclopentadienol-type epoxy resin, 0.3-0.6 parts of accelerator, 9-12 parts of curing agent, 66-70 parts of filler, 7-10 parts of toughening agent, 10-15 parts of flame retardant, and 78-82 parts of solvent.

[0006] Furthermore, the accelerator of the present invention is 2-phenyl-4-methylimidazole.

[0007] Furthermore, the curing agent of the present invention is 4,4'-diaminodiphenyl ether.

[0008] Furthermore, the filler of the present invention is composed of aluminum nitride and a phosphorus-chromium-scandium composite in a weight ratio of 3:1.

[0009] Furthermore, the phosphorus-chromium-scandium composite of the present invention is prepared by the following steps:

[0010] Ammonium chromate, scandium nitrate, diammonium hydrogen phosphate, deionized water and malic acid were mixed evenly, aged at 90°C for 12-15 hours to obtain a mixed solution, dried in an oven to obtain a mixed powder, placed in a tube furnace, introduced with hydrogen and heated to 750°C, kept warm for 5-7 hours, and then naturally cooled to room temperature. The powder was taken out and ground through a 200-mesh sieve to obtain a phosphorus-chromium-scandium complex.

[0011] Furthermore, in the preparation steps of the phosphorus-chromium-scandium complex of the present invention, the ratio of ammonium chromate, scandium nitrate, diammonium hydrogen phosphate, deionized water, and malic acid is 1 mol:1 mol:0.2 mol:250 mL:100 mL, the drying temperature is 110°C, the drying time is 10 hours, the hydrogen flow rate is 50 mL / min, and the heating rate is 10°C / min.

[0012] Furthermore, the toughening agent of the present invention is pentamethyl monomethyl alcohol melamine.

[0013] Furthermore, the flame retardant of the present invention is aluminum hydroxide.

[0014] Furthermore, the solvent of the present invention is dimethyl sulfoxide.

[0015] Another technical problem to be solved by the present invention is to provide a method for manufacturing the above-mentioned high thermal conductivity epoxy resin copper clad laminate.

[0016] To solve the above technical problems, the technical solution is:

[0017] A method for manufacturing a high thermal conductivity epoxy resin copper clad laminate comprises the following steps:

[0018] S1 weighed the raw materials in parts by weight, the dicyclopentadienol type epoxy resin, filler, toughening agent, flame retardant, solvent mixed, heated to 75-80 ℃ after 600-800 rpm stirring speed for 20-30 minutes, then add other raw materials, stirring until mixed to obtain a resin glue;

[0019] S2. The glass fiber cloth is impregnated with the resin glue obtained in step S1 and placed in an oven and dried at 170-180°C for 5-10 minutes to obtain a prepreg;

[0020] S3. Stack eight prepregs obtained in step S2 together to obtain a multilayer sheet, cover the upper and lower surfaces of the multilayer sheet with a copper foil, and place the sheet in a hot press at 190-210°C and 2-4 MPa pressure for 2-4 hours to obtain a high thermal conductivity epoxy resin copper clad laminate.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] (1) The epoxy resin used in the present invention is a dicyclopentadiene phenol type epoxy resin, which has a dicyclopentadiene structure, does not contain polar groups, has good processing performance and low dielectric constant, dielectric loss and water absorption rate, so that the high thermal conductivity epoxy resin copper clad laminate prepared by the present invention has good dielectric properties and water resistance, and can be used in high-frequency environments.

[0023] (2) The aluminum nitride in the filler used in the present invention has high thermal conductivity, hardness and melting point, so that the high thermal conductivity epoxy resin copper clad laminate prepared by the present invention has good thermal conductivity and heat resistance, and can be used in high temperature environments.

[0024] (3) The phosphorus-chromium-scandium composite filler used in the present invention is prepared by first forming a complex with ammonium chromate, scandium nitrate and diammonium hydrogen phosphate under the complexation action of malic acid, and then reducing and roasting the complex with hydrogen to obtain a phosphorus-chromium-scandium composite having a scandium-doped chromium phosphide structure. The chromium phosphide in the phosphorus-chromium-scandium composite can effectively improve the corrosion resistance of the prepreg and the copper-clad laminate, and scandium can effectively improve the toughness of the copper-clad laminate. In addition, the toughening agent used in the present invention, pentamethyl monomethyl alcohol melamine, can also effectively improve the toughness of the copper-clad laminate. DETAILED DESCRIPTION

[0025] The present invention will be described in detail below with reference to specific embodiments. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention but are not intended to limit the present invention.

[0026] Example 1

[0027] A high thermal conductivity epoxy resin copper clad laminate is provided. The resin glue used in manufacturing the high thermal conductivity epoxy resin copper clad laminate is made of the following raw materials in parts by weight: 54 parts of dicyclopentadienol-type epoxy resin, 0.5 parts of 2-phenyl-4-methylimidazole, 10 parts of 4,4'-diaminodiphenyl ether, 69 parts of a filler composed of an aluminum nitride and a phosphorus chromium scandium complex in a weight ratio of 3:1, 9 parts of pentamethyl monomethyl alcohol melamine, 12 parts of aluminum hydroxide, and 80 parts of dimethyl sulfoxide.

[0028] The phosphorus-chromium-scandium complex is prepared by the following steps:

[0029] Ammonium chromate, scandium nitrate, diammonium hydrogen phosphate, deionized water, and malic acid were uniformly mixed in a ratio of 1 mol: 1 mol: 0.2 mol: 250 mL: 100 mL, and aged at 90° C. for 14 hours to obtain a mixed solution. The mixed solution was placed in an oven and dried at 110° C. for 10 hours to obtain a mixed powder. The mixed powder was placed in a tubular furnace, and hydrogen was introduced at a flow rate of 50 mL / min. The temperature was then increased to 750° C. at a heating rate of 10° C. / min. After keeping warm for 6 hours, it was naturally cooled to room temperature. After being taken out, it was ground through a 200-mesh sieve to obtain a phosphorus-chromium-scandium complex.

[0030] The manufacturing method of Example 1 comprises the following steps:

[0031] S1. Weigh the raw materials in parts by weight, and mix the dicyclopentadienol-type epoxy resin, a filler composed of aluminum nitride and a phosphorus-chromium-scandium complex in a weight ratio of 3:1, pentamethylol melamine monomethyl alcohol, aluminum hydroxide, and dimethyl sulfoxide. After heating to 78 ° C, stir at 700 rpm for 25 minutes, then add the other raw materials and stir until uniformly mixed to obtain a resin glue;

[0032] S2. The 2116 glass fiber cloth was impregnated with the resin solution obtained in step S1 and dried in an oven at 175°C for 8 minutes to obtain a prepreg;

[0033] S3. Stack eight prepregs obtained in step S2 together to obtain a multilayer sheet, cover the upper and lower surfaces of the multilayer sheet with a copper foil, and place the sheet in a hot press at 200°C and 3 MPa for 3 hours to obtain a high thermal conductivity epoxy resin copper clad laminate.

[0034] Example 2

[0035] A high thermal conductivity epoxy resin copper clad laminate is provided. The resin glue used in manufacturing the high thermal conductivity epoxy resin copper clad laminate is made of the following raw materials in parts by weight: 56 parts of dicyclopentadienol-type epoxy resin, 0.6 parts of 2-phenyl-4-methylimidazole, 12 parts of 4,4'-diaminodiphenyl ether, 70 parts of a filler composed of an aluminum nitride and a phosphorus chromium scandium complex in a weight ratio of 3:1, 10 parts of pentamethyl monomethyl alcohol melamine, 15 parts of aluminum hydroxide, and 82 parts of dimethyl sulfoxide.

[0036] The phosphorus-chromium-scandium complex is prepared by the following steps:

[0037] Ammonium chromate, scandium nitrate, diammonium hydrogen phosphate, deionized water, and malic acid were evenly mixed in a ratio of 1 mol: 1 mol: 0.2 mol: 250 mL: 100 mL, and aged at 90° C. for 15 hours to obtain a mixed solution. The mixed solution was placed in an oven and dried at 110° C. for 10 hours to obtain a mixed powder. The mixed powder was placed in a tubular furnace, and hydrogen was introduced at a flow rate of 50 mL / min. The temperature was then increased to 750° C. at a heating rate of 10° C. / min. After keeping warm for 7 hours, it was naturally cooled to room temperature. After being taken out, it was ground through a 200-mesh sieve to obtain a phosphorus-chromium-scandium complex.

[0038] The manufacturing method of Example 2 comprises the following steps:

[0039] S1. Weigh the raw materials in parts by weight, and mix the dicyclopentadienol-type epoxy resin, a filler composed of aluminum nitride and a phosphorus-chromium-scandium complex in a weight ratio of 3:1, pentamethylol melamine monomethyl alcohol, aluminum hydroxide, and dimethyl sulfoxide. After heating to 75 ° C, stir at 800 rpm for 30 minutes, then add the other raw materials and stir until uniformly mixed to obtain a resin glue;

[0040] S2. The 2116 glass fiber cloth was impregnated with the resin solution obtained in step S1 and dried in an oven at 170°C for 10 minutes to obtain a prepreg;

[0041] S3. Stack eight prepregs obtained in step S2 together to obtain a multilayer sheet, cover the upper and lower surfaces of the multilayer sheet with a copper foil, and place the sheet in a hot press at 190°C and 4 MPa for 4 hours to obtain a high thermal conductivity epoxy resin copper clad laminate.

[0042] Example 3

[0043] A high thermal conductivity epoxy resin copper clad laminate is provided. The resin glue used in manufacturing the high thermal conductivity epoxy resin copper clad laminate is made of the following raw materials in parts by weight: 52 parts of dicyclopentadienol-type epoxy resin, 0.3 parts of 2-phenyl-4-methylimidazole, 9 parts of 4,4'-diaminodiphenyl ether, 66 parts of a filler composed of an aluminum nitride and a phosphorus chromium scandium complex in a weight ratio of 3:1, 7 parts of pentamethyl monomethyl alcohol melamine, 10 parts of aluminum hydroxide, and 78 parts of dimethyl sulfoxide.

[0044] The phosphorus-chromium-scandium complex is prepared by the following steps:

[0045] Ammonium chromate, scandium nitrate, diammonium hydrogen phosphate, deionized water, and malic acid were evenly mixed in a ratio of 1 mol: 1 mol: 0.2 mol: 250 mL: 100 mL, and aged at 90° C. for 12 hours to obtain a mixed solution. The mixed solution was placed in an oven and dried at 110° C. for 10 hours to obtain a mixed powder. The mixed powder was placed in a tubular furnace, and hydrogen was introduced at a flow rate of 50 mL / min. The temperature was then increased to 750° C. at a heating rate of 10° C. / min. After keeping warm for 5 hours, it was naturally cooled to room temperature. After being taken out, it was ground through a 200-mesh sieve to obtain a phosphorus-chromium-scandium complex.

[0046] The manufacturing method of Example 3 comprises the following steps:

[0047] S1. Weigh the raw materials in parts by weight, a dicyclopentadienol-type epoxy resin, a filler composed of aluminum nitride and a phosphorus-chromium-scandium complex in a weight ratio of 3:1, pentamethylol melamine monomethyl alcohol, aluminum hydroxide, and dimethyl sulfoxide. The mixture was heated to 80 ° C and stirred at 600 rpm for 20 minutes, and then the other raw materials were added and stirred until uniformly mixed to obtain a resin glue.

[0048] S2. The 2116 glass fiber cloth was impregnated with the resin glue obtained in step S1 and dried in an oven at 180°C for 5 minutes to obtain a prepreg;

[0049] S3. Stack eight prepregs obtained in step S2 together to obtain a multilayer sheet, cover the upper and lower surfaces of the multilayer sheet with a copper foil, and place the sheet in a hot press at 210°C and 2 MPa for 3 hours to obtain a high thermal conductivity epoxy resin copper clad laminate.

[0050] Example 4

[0051] A high thermal conductivity epoxy resin copper clad laminate is provided. The resin glue used in manufacturing the high thermal conductivity epoxy resin copper clad laminate is made of the following raw materials in parts by weight: 55 parts of dicyclopentadienol-type epoxy resin, 0.4 parts of 2-phenyl-4-methylimidazole, 11 parts of 4,4'-diaminodiphenyl ether, 68 parts of a filler composed of an aluminum nitride and a phosphorus chromium scandium complex in a weight ratio of 3:1, 8 parts of pentamethyl monomethyl alcohol melamine, 14 parts of aluminum hydroxide, and 81 parts of dimethyl sulfoxide.

[0052] The phosphorus-chromium-scandium complex is prepared by the following steps:

[0053] Ammonium chromate, scandium nitrate, diammonium hydrogen phosphate, deionized water, and malic acid were evenly mixed in a ratio of 1 mol: 1 mol: 0.2 mol: 250 mL: 100 mL, and aged at 90° C. for 13 hours to obtain a mixed solution. The mixed solution was placed in an oven and dried at 110° C. for 10 hours to obtain a mixed powder. The mixed powder was placed in a tubular furnace, and hydrogen was introduced at a flow rate of 50 mL / min. The temperature was then increased to 750° C. at a heating rate of 10° C. / min. After keeping warm for 6 hours, it was naturally cooled to room temperature. After being taken out, it was ground through a 200-mesh sieve to obtain a phosphorus-chromium-scandium complex.

[0054] The manufacturing method of Example 4 comprises the following steps:

[0055] S1. Weigh the raw materials in parts by weight, and mix the dicyclopentadienol-type epoxy resin, a filler composed of aluminum nitride and a phosphorus-chromium-scandium complex in a weight ratio of 3:1, pentamethylol melamine monomethyl alcohol, aluminum hydroxide, and dimethyl sulfoxide. After heating to 77 ° C, stir at 700 rpm for 30 minutes, then add the other raw materials and stir until uniformly mixed to obtain a resin glue;

[0056] S2. The 2116 glass fiber cloth was impregnated with the resin glue obtained in step S1 and dried in an oven at 170°C for 7 minutes to obtain a prepreg;

[0057] S3. Stack 8 prepregs obtained in step S2 together to obtain a multilayer sheet, cover the upper and lower surfaces of the multilayer sheet with a copper foil, and place it in a hot press at 200°C and 4 MPa pressure for 2 hours to obtain a high thermal conductivity epoxy resin copper clad laminate.

[0058] Comparative Example 1

[0059] The difference from Example 1 is that the filler in the resin glue raw material is replaced by a phosphorus-chromium-scandium complex, that is, the filler does not include aluminum nitride.

[0060] Comparative Example 2

[0061] The difference from Example 1 is that the filler in the resin glue raw material is replaced by aluminum nitride, that is, the filler does not include the phosphorus-chromium-scandium complex, and the preparation step of the phosphorus-chromium-scandium complex is omitted.

[0062] Comparative Example 3

[0063] The difference from Example 1 is that scandium nitrate is not used in the preparation step of the phosphorus-chromium-scandium complex, that is, the phosphorus-chromium-scandium complex in the filler is replaced by chromium phosphide not doped with scandium.

[0064] Comparative Example 4

[0065] The difference from Example 1 is that the resin glue raw material does not include pentamethyl monomethyl alcohol melamine.

[0066] Experimental Example 1: Dielectric Performance Test

[0067] Test reference standard / method: IPC-TM-650 standard, split-cavity resonant method, room temperature, cavity resonant frequency 10 GHz.

[0068] Test instrument: vector network analyzer.

[0069] Test object and target: Dielectric constant of the copper clad laminates prepared in Examples 1-4.

[0070] The test results are shown in Table 1:

[0071]

[0072]

[0073] Table 1

[0074] It can be clearly seen from Table 1 that the dielectric constants of Examples 1-4 of the present invention are all relatively low, indicating that the high thermal conductivity epoxy resin copper clad laminate prepared by the present invention has good dielectric properties and is suitable for high-frequency environments.

[0075] Experimental Example 2: Thermal Conductivity Test

[0076] Test reference standard / method: ASTM D5470-2006 standard.

[0077] Testing instrument: thermal conductivity tester.

[0078] Test object and target: thermal conductivity of the copper clad laminates prepared in Examples 1-4 and Comparative Example 1.

[0079] The higher the thermal conductivity, the better the thermal conductivity. The test results are shown in Table 2:

[0080] Thermal conductivity (W / m·K) Example 1 1.58 Example 2 1.61 Example 3 1.60 Example 4 1.55 Comparative Example 1 0.46

[0081] Table 2

[0082] As can be seen from Table 2, the thermal conductivities of Examples 1-4 of the present invention are all high, indicating that the high thermal conductivity epoxy resin copper-clad laminates produced by the present invention have good thermal conductivity and are suitable for use in high-temperature environments. Comparative Example 1 uses some different raw materials and preparation steps than Example 1. Compared with Example 1, the thermal conductivity of Comparative Example 1 is significantly lower, indicating that the aluminum nitride used in the present invention is the key to improving the thermal conductivity of the copper-clad laminates.

[0083] Experimental Example 3: Toughness Test

[0084] Test reference standard / method: ASTM D256-2010.

[0085] Test object and target: impact strength of the copper clad laminates prepared in Examples 1-4 and Comparative Examples 3-4, with sample size of 80 mm×10 mm×2.5 mm.

[0086] The higher the impact strength, the better the toughness. The test results are shown in Table 3:

[0087] <![CDATA[Impact strength (KJ / m 2 )]]> Example 1 6.25 Example 2 6.28 Example 3 6.22 Example 4 6.18 Comparative Example 3 6.01 Comparative Example 4 5.96

[0088] Table 3

[0089] As can be seen from Table 3, the impact strength of Examples 1-4 of the present invention is relatively high, indicating that the present invention has good toughness. Comparative Examples 3-4 use some different raw materials and preparation steps from Example 1. Compared with Example 1, the impact strength of Comparative Example 3 is reduced, indicating that the phosphorus-chromium-scandium composite prepared by the present invention has a better effect on improving the toughness of the copper-clad laminate than chromium phosphide undoped with scandium. Compared with Example 1, the impact strength of Comparative Example 4 is also reduced, indicating that the pentamethyl monomethyl alcohol melamine used in the present invention can effectively improve the toughness of the copper-clad laminate.

[0090] Experimental Example 4: Corrosion Resistance Test

[0091] Test method: Weigh the prepreg and record it as the weight of the prepreg before the test. Then, spray a 10% nitric acid aqueous solution evenly on the surface of the prepreg in a 40°C environment. After 24 hours, weigh it again and record it as the weight of the prepreg after the test.

[0092] Test object, target: weight loss rate of the prepregs prepared in Examples 1-4 and Comparative Example 2, weight loss rate = (weight of prepreg before test - weight of prepreg after test) / weight of prepreg before test × 100%.

[0093] The lower the weight loss rate, the better the corrosion resistance. The test results are shown in Table 4:

[0094] Weight loss rate (%) Example 1 0.62 Example 2 0.58 Example 3 0.59 Example 4 0.67 Comparative Example 2 1.96

[0095] Table 4

[0096] As can be seen from Table 4, the weight loss rates of Examples 1-4 of the present invention are all low, indicating that the present invention has good corrosion resistance. Comparative Example 2 uses some different raw materials and preparation steps from Example 1. Compared with Example 1, the weight loss rate of Comparative Example 2 is significantly higher, indicating that the phosphorus-chromium-scandium composite used in the present invention can effectively improve the corrosion resistance of the copper-clad laminate.

[0097] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A high thermal conductivity epoxy resin copper clad laminate, characterized by: The resin glue used in manufacturing the high thermal conductivity epoxy resin copper clad laminate is prepared from the following raw materials in parts by weight: 52-56 parts of dicyclopentadienol epoxy resin, 0.3-0.6 parts of accelerator, 9-12 parts of curing agent, 66-70 parts of filler, 7-10 parts of toughening agent, 10-15 parts of flame retardant and 78-82 parts of solvent.

2. The high thermal conductivity epoxy resin copper clad laminate according to claim 1, characterized in that: The accelerator is 2-phenyl-4-methylimidazole.

3. The high thermal conductivity epoxy resin copper clad laminate according to claim 1, characterized in that: The curing agent is 4,4'-diaminodiphenyl ether.

4. The high thermal conductivity epoxy resin copper clad laminate according to claim 1, characterized in that: The filler consists of aluminum nitride and a phosphorus-chromium-scandium composite in a weight ratio of 3:

1.

5. The high thermal conductivity epoxy resin copper clad laminate according to claim 4, characterized in that: The phosphorus-chromium-scandium composite is prepared by the following steps: Ammonium chromate, scandium nitrate, diammonium hydrogen phosphate, deionized water and malic acid were mixed evenly, aged at 90°C for 12-15 hours to obtain a mixed solution, dried in an oven to obtain a mixed powder, placed in a tube furnace, introduced with hydrogen and heated to 750°C, kept warm for 5-7 hours, and then naturally cooled to room temperature. The powder was taken out and ground through a 200-mesh sieve to obtain a phosphorus-chromium-scandium complex.

6. The high thermal conductivity epoxy resin copper clad laminate according to claim 5, characterized in that: In the preparation steps of the phosphorus-chromium-scandium complex, the ratio of ammonium chromate, scandium nitrate, diammonium hydrogen phosphate, deionized water, and malic acid is 1 mol:1 mol:0.2 mol:250 mL:100 mL, the drying temperature is 110° C., the drying time is 10 hours, the hydrogen flow rate is 50 mL / min, and the heating rate is 10° C. / min.

7. The high thermal conductivity epoxy resin copper clad laminate according to claim 1, characterized in that: The toughening agent is pentamethyl monomethyl alcohol melamine.

8. The high thermal conductivity epoxy resin copper clad laminate according to claim 1, characterized in that: The flame retardant is aluminum hydroxide.

9. The high thermal conductivity epoxy resin copper clad laminate according to claim 1, characterized in that: The solvent is dimethyl sulfoxide.

10. The method for manufacturing a high thermal conductivity epoxy resin copper clad laminate according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1 weighed the raw materials in parts by weight, the dicyclopentadienol type epoxy resin, filler, toughening agent, flame retardant, solvent mixed, heated to 75-80 ℃ after 600-800 rpm stirring speed for 20-30 minutes, then add other raw materials, stirring until mixed to obtain a resin glue; S2. The glass fiber cloth is impregnated with the resin glue obtained in step S1 and placed in an oven and dried at 170-180°C for 5-10 minutes to obtain a prepreg; S3. Stack eight prepregs obtained in step S2 together to obtain a multilayer sheet, cover the upper and lower surfaces of the multilayer sheet with a copper foil, and place the sheet in a hot press at 190-210°C and 2-4 MPa pressure for 2-4 hours to obtain a high thermal conductivity epoxy resin copper clad laminate.

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