Wafer flatness measuring device and method

Abstract

The invention discloses a wafer flatness measuring device and method, relates to the technical field of wafer flatness measuring devices, and solves the problems that the thicknesses of the edges of some large-size wafer products are different, the thin parts of the edges are inconvenient to adsorb and fix, and the thin parts of the edges of the wafers lacking of support are in a suspended state, so that the wafer flatness measuring accuracy is poor. The technical problem that the measurement result is affected due to slight tremor in the flatness measurement process is solved. Comprising an equipment rack which is internally provided with a sucker group for adsorbing and fixing a wafer; the rotary filling mechanism is mounted on the outer side of the suction cup group and is used for supporting the wafer; according to the invention, the bottom of the suspended part of the edge of the wafer product can be filled without dead angles in the horizontal direction, so that the situation that the edge of the wafer product is suspended and vibrated in the measurement process of the wafer product to influence the flatness measurement result is avoided, and the measurement stability of the wafer product is improved; and the filling thickness of the edge can be adjusted according to the edge thickness of the wafer product and the suspension distance.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer flatness measurement devices, and in particular relates to a wafer flatness measurement device and method. Background Art

[0002] As the core carrier of semiconductor chips, the wafer's surface flatness directly affects chip performance, packaging yield, and product reliability. Therefore, wafer flatness measurement equipment is crucial. Appropriate optical measurement equipment is used to measure wafer flatness.

[0003] Some existing large-sized wafer products have different edge thicknesses. When placed on the suction cup of the optical measurement device, the thinner edge parts are not easy to be adsorbed and fixed. Forced adsorption will cause the large-sized edge to bend. The thinner edge part of the wafer without support is in a suspended state, which may cause slight vibration during the flatness measurement process, thereby affecting the measurement results. In addition, in the process of supporting the edge part of the wafer, particles falling from the wafer surface will also affect the measurement results. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art; to this end, the present invention provides a wafer flatness measurement device and method.

[0005] A wafer flatness measurement device and method, comprising:

[0006] An equipment rack, wherein a suction cup group for adsorbing and fixing the wafer is provided inside the equipment rack;

[0007] A rotary filling mechanism mounted on the outside of the suction cup assembly to support the wafer, the rotary filling mechanism comprising a filling member supporting the edge portion of the suspended wafer, a rotating member for changing the circumferential position of the filling member, and a guide slide slidably engaged with the rotating member;

[0008] The filling member includes a filling bottom plate supporting the bottom edge of the wafer, a first inclined surface is provided on the left upper surface of the filling bottom plate, and a rotating filling plate that cooperates with the first inclined surface is rotatably provided on the front and rear surfaces of the filling bottom plate;

[0009] The rotating component comprises an annular rail located outside the suction cup group, and the guide slide seat is slidably sleeved on the annular rail.

[0010] Preferably, the filling member for filling the gap between the wafer edge and the suction cup assembly further comprises:

[0011] A connecting rod installed between the right ends of the two rotating filling plates, wherein the connecting rod is provided with a rotating lug;

[0012] A rotary cylinder mounted on the right end of the filling base plate and driving the connecting rod to rotate;

[0013] A rotating shaft is vertically mounted on the front and rear surfaces of the left end of the filling bottom plate, and the rotating shaft is rotatably connected to the left end of the rotating filling plate.

[0014] Preferably, a rotating lug is sleeved on the connecting rod, a supporting transverse plate is provided at the right end of the filling bottom plate, the lower end of the rotating cylinder is rotatably connected to the supporting transverse plate, and the upper end of the rod inside the rotating cylinder is rotatably connected to the rotating lug.

[0015] Preferably, the rotating member for changing the circumferential direction of the filling member comprises:

[0016] An annular rail is horizontally sleeved on the outside of the suction cup group, and the outer circumferential surface of the annular rail is provided with an outer gear ring;

[0017] A driving gear meshed with the outer gear ring, the guide slide is sleeved on the top of the annular rail, and a driving motor connected to the driving gear is provided on the outer surface of the guide slide.

[0018] Preferably, a moving member for adjusting the position of the filling bottom plate is provided between the filling bottom plate and the guide slide, and the moving member comprises:

[0019] A bow-shaped frame fixed on the guide slide, wherein the upper surface of the bow-shaped frame is provided with two guide rails;

[0020] A mobile motor is installed on the right side of the upper end of the bow frame, and a screw rod is connected to the left end of the mobile motor, and a nut seat is sleeved on the screw rod;

[0021] A guide slide block is fixed on the lower surface of the filling bottom plate and slidably sleeved on the guide rail.

[0022] Preferably, the upper end of the nut seat is fixed to the lower surface of the filling base plate, and the inner surface of the bow frame is provided with reinforcing ribs.

[0023] Preferably, the dust removal mechanism installed on the upper surface of the guide slide and cleaning the dust particles on the upper surface of the wafer includes:

[0024] An air delivery cylinder is horizontally located above the guide slide, and a stabilizing frame for supporting the air delivery cylinder is provided on the upper surface of the guide slide;

[0025] A telescopic tube is installed on the left side of the air delivery cylinder and is retractable. A plurality of air outlet pipes are provided on the lower surface of the telescopic tube;

[0026] a piston plate located vertically inside the air delivery cylinder;

[0027] And a driving cylinder located below the air cylinder that drives the piston plate to move.

[0028] Preferably, the driving cylinder is horizontally installed inside the stabilizing frame, a piston rod is provided on the right side of the piston plate and passes through the air supply cylinder and is exposed to the outside, and a connecting plate is provided between the inner rod inside the driving cylinder and the right end of the piston rod.

[0029] Preferably, a sealing plate is provided on the left side of the telescopic tube, an extension rod is provided between the left side of the piston plate and the sealing plate, and an air intake pipe is provided on the upper surface of the left end of the air delivery cylinder.

[0030] A method for measuring wafer flatness:

[0031] S1. Place the wafer product on the suction cup assembly through an external robot, and use the negative pressure suction cup set on the top of the suction cup assembly to adsorb and fix the wafer product;

[0032] S2. Using a rotating member located outside the suction cup assembly to drive the guide slide to rotate in a circumferential direction, thereby changing the position of the filling member on the guide slide, and using a moving member to drive the filling base plate to move toward the wafer product to fill and support the suspended position at the edge of the wafer product;

[0033] S3. Driving the dust removal mechanism to rotate in a circular motion during the rotation of the guide slide, and processing dust on the upper surface of the wafer product during the rotation, and adaptively changing the cleaning spacing of the multiple air outlet pipes on the upper surface of the wafer product during the cleaning process;

[0034] S4. Measure the flatness of the upper surface of the wafer product using the measurement group located above the suction cup group.

[0035] Compared with the prior art, the present invention has the following beneficial effects:

[0036] (1) The present invention can fill the bottom of the suspended edge of the wafer product without dead angle in the horizontal direction, so that the edge of the wafer product will not vibrate in the air during the measurement process of the wafer product, which will affect the flatness measurement result, thereby increasing the measurement stability of the wafer product, and the filling thickness of the edge can be adjusted according to the edge thickness of the wafer product and the suspension distance.

[0037] (2) The present invention utilizes a movable component to adjust the position of the filling base plate according to the overall size of the wafer, so as to facilitate the extension of the filling base plate to the appropriate position of the wafer edge. This can not only achieve stable support for the suspended position of the wafer edge, but also expand the support range for the edge of the wafer product without affecting the normal measurement of the wafer flatness by the measurement group.

[0038] (3) The present invention is provided with a dust removal mechanism, which can cooperate with the rotating component to change the position of the air outlet pipe and the spacing between the multiple air outlet pipes in the circumferential direction. The continuously changing spacing between the multiple air outlet pipes can adapt to the area of the wafer product, expand the dust removal area of the wafer product, and reduce the impact of dust particles on the flatness measurement of the wafer product. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 Schematic diagram of the structure of the wafer flatness measurement device of the present invention;

[0040] Figure 2 This is a schematic structural diagram of an internal measuring platform of a wafer flatness measuring device according to the present invention;

[0041] Figure 3 A schematic diagram of the internal suction cup structure of the wafer flatness measurement device of the present invention;

[0042] Figure 4 For the present invention Figure 3 A rear view schematic diagram of the rotary filling mechanism;

[0043] Figure 5 For the present invention Figure 4 Schematic diagram of the structure of the filling component;

[0044] Figure 6 For the present invention Figure 4 Schematic diagram of the structure of the rotating component;

[0045] Figure 7 For the present invention Figure 4 Structural diagram of the moving component;

[0046] Figure 8 For the present invention Figure 3 Schematic diagram of the structure of the dust removal mechanism;

[0047] Figure 9 For the present invention Figure 8 Cross-sectional view of the dust removal mechanism;

[0048] Figure 10 For the present invention Figure 9 Enlarged view of area A in the middle;

[0049] In the figure: 100, equipment frame; 200, measuring table; 201, horizontal movement group; 202, vertical movement group; 203, base; 300, measuring group; 400, rotating filling mechanism; 401, rotating member; 4011, ring rail; 4012, outer ring gear; 4013, driving gear; 4014, driving motor; 4015, motor frame; 402, guide slide; 403, filling member; 4031, filling bottom plate; 4032, rotating filling plate; 4033, rotating cylinder; 4034, connecting rod; 4035, rotating lug; 4036, supporting horizontal plate; 403 7. Rotating shaft; 4038. First inclined plane; 404. Moving member; 4041. Bow frame; 4042. Moving motor; 4043. Nut seat; 4044. Guide slider; 4045. Guide rail; 500. Dust removal mechanism; 501. Air delivery cylinder; 502. Piston plate; 503. Telescopic tube; 504. Piston rod; 505. Drive cylinder; 506. Air inlet pipe; 507. Air outlet pipe; 508. Sealing plate; 509. Stabilizing frame; 510. Extension rod; 511. One-way valve; 512. Connecting plate; 600. Suction cup group; 601. Negative pressure suction cup; 700. Workbench. DETAILED DESCRIPTION

[0050] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0051] Example 1

[0052] See also Figure 1 - Figure 6 , the present application provides a wafer flatness measurement device and method, comprising:

[0053] The equipment rack 100 is provided with a suction cup group 600 for adsorbing and fixing the wafer inside the equipment rack 100. The suction cup group 600 is fixed to the upper surface of the workbench 700, and a measuring table 200 is provided at the bottom of the workbench 700. The measuring table 200 includes a longitudinal moving group 202 fixed inside the equipment rack 100, a transverse moving group 201 located above the longitudinal moving group 202, and a base 203 installed at the bottom of the longitudinal moving group 202. The longitudinal moving group 202 and the transverse moving group 201 can change the transverse and longitudinal directions of the workbench 700. Position, convenient for measuring wafer products, and the specific structures of the longitudinal moving group 202 and the lateral moving group 201 can refer to the moving member 404, a vertical pole located at the rear side of the suction cup group 600 is vertically provided on the upper surface of the workbench 700, a mounting seat is provided on the upper end of the pole, and a measuring group 300 is provided on the lower surface of the front end of the mounting seat. The measuring group 300 is a measuring instrument for measuring the flatness of the wafer, which is a prior art and will not be described in detail in this application, and a plurality of negative pressure suction cups 601 for adsorbing and fixing the wafer products are provided on the top circumference of the suction cup group 600;

[0054] A rotating filling mechanism 400, mounted on the outside of the suction cup assembly 600 and supporting the wafer, can be used to fill the bottom of the suspended edge of the wafer product horizontally without blind spots. This prevents the suspended edge of the wafer product from vibrating during measurement and affecting the flatness measurement results, thereby increasing wafer measurement stability. Furthermore, the filling thickness at the edge can be adjusted based on the wafer product edge thickness and the suspended distance. The rotating filling mechanism 400 includes a filling member 403 that supports the suspended wafer edge portion, a rotating member 401 that changes the circumferential position of the filling member 403, and a guide slide 402 that slidably cooperates with the rotating member 401.

[0055] The filling member 403 includes a filling base plate 4031 for supporting the bottom edge of the wafer. The lower surface of the filling base plate 4031 is flush with the upper surface of the negative pressure suction cup 601, which is convenient for the subsequent filling base plate 4031 to move toward the wafer product to fill the edge of the suspended part. The left upper surface of the filling base plate 4031 is provided with a first inclined surface 4038. The inclination of the first inclined surface 4038 can be set according to actual production requirements to facilitate better support for the edge of the wafer product. A layer of film can be attached to the upper surface of the first inclined surface 4038. The material of this film is not limited to a specific One, a film of suitable material can be selected according to actual needs, such as PVC film, so that the lower surface of the wafer product will not be worn when the filling base plate 4031 supports the wafer product. The front and rear surfaces of the filling base plate 4031 are rotatably provided with a rotating filling plate 4032 that cooperates with the first inclined surface 4038. The initial angle of the rotating filling plate 4032 is flush with the inclination of the first inclined surface 4038, so that it can extend to the bottom edge of the wafer product. The inclination angle of the rotating filling plate 4032 is adjustable, so as to increase the filling thickness of the overhanging portion of the wafer product edge.

[0056] The rotating component 401 includes an annular rail 4011 located outside the suction cup assembly 600 . The longitudinal cross-section of the annular rail 4011 is T-shaped, which facilitates sliding connection with the guide slide 402 . The guide slide 402 is slidably sleeved on the annular rail 4011 .

[0057] In this embodiment, preferably, the filling member 403 for filling the gap between the wafer edge and the suction cup assembly 600 further includes:

[0058] A connecting rod 4034 is installed between the right ends of the two rotating filling plates 4032 to facilitate the synchronous rotation of the two rotating filling plates 4032. A rotating lug 4035 is sleeved on the connecting rod 4034;

[0059] A rotating cylinder 4033 is installed at the right end of the filling base plate 4031 and drives the connecting rod 4034 to rotate;

[0060] The rotating shaft 4037 is vertically installed on the front and rear surfaces of the left end of the filling base plate 4031. The rotating shaft 4037 is rotatably connected to the left end of the rotating filling plate 4032, which does not affect the rotation of the rotating filling plate 4032 around the rotating shaft 4037 and changes the angle of the rotating filling plate 4032 with the horizontal direction.

[0061] In this embodiment, preferably, a rotating lug 4035 is provided on the connecting rod 4034, and a supporting cross plate 4036 is provided at the right end of the filling bottom plate 4031. The supporting cross plate 4036 supports the rotating cylinder 4033. The lower end of the rotating cylinder 4033 is rotatably connected to the supporting cross plate 4036, and the upper end of the rod inside the rotating cylinder 4033 is rotatably connected to the rotating lug 4035. The overall setting of the rotating cylinder 4033 is convenient for adapting to the rotation of the rotating filling plate 4032.

[0062] In this embodiment, preferably, the rotating member 401 for changing the circumferential direction of the filling member 403 includes:

[0063] The annular rail 4011 is horizontally sleeved on the outside of the suction cup assembly 600, with a space left between the two so as not to affect the sliding of the guide slide 402 along the annular rail 4011. The outer circumferential surface of the annular rail 4011 is provided with an outer gear ring 4012, which is located below the guide slide 402 and does not affect the sliding of the guide slide 402.

[0064] A driving gear 4013 meshing with the outer gear ring 4012, and a guide slide 402 is sleeved on the top of the annular rail 4011. A driving motor 4014 connected to the driving gear 4013 is provided on the outer surface of the guide slide 402, and a motor frame 4015 is provided between the driving motor 4014 and the guide slide 402.

[0065] In summary, when in use, the external robot places the wafer product on the suction cup group 600, and it is adsorbed and fixed by the negative pressure suction cup 601, and the driving motor 4014 works to drive the driving gear 4013 to rotate, and the driving gear 4013 is engaged with the outer ring gear 4012, so the driving gear 4013 rotates and moves along the outer ring gear 4012. Since the guide slide 402 and the annular rail 4011 are slidably matched, the two are limited, so that the driving motor 4014 moves stably along the annular rail 4011, thereby driving the components on the guide slide 402 to move until it moves to the appropriate position of the edge of the wafer product, that is, the edge of the wafer product and the negative pressure suction cup 601 are suspended in the air, and the moving component 404 is used to drive the left end of the filling base plate 4031 to move toward the suspended position of the edge of the wafer product until the first inclined Surface 4038 rests against the bottom edge of the wafer product to support it. If the suspended distance is large and exceeds the thickness of the left end of the filling base plate 4031, and the lateral distance of the edge suspension is short, in order to prevent the filling base plate 4031 from continuing to move toward the center of the wafer product, the rotating cylinder 4033 can be operated, and the internal inner rod is extended to drive the rotating filling plate 4032 to rotate upward around the rotating axis 4037, thereby expanding the angle between the rotating filling plate 4032 and the horizontal direction until the rotating filling plate 4032 contacts the bottom edge of the wafer to support the edge of the wafer, so that the filling base plate 4031 does not need to extend to a deeper position inside the edge of the wafer, will not cause wear on the edge of the wafer, expand the support range for the edge of the wafer, increase the stability of the wafer flatness measurement, and prevent the edge of the wafer from vibrating in the air.

[0066] Example 2

[0067] Reference Figure 5 and Figure 7 , which is the second embodiment of the present invention.

[0068] In this embodiment, preferably, a movable member 404 for adjusting the position of the filling base plate 4031 is provided between the filling base plate 4031 and the guide slide 402. The movable member 404 can be used to adjust the position of the filling base plate 4031 according to the overall size of the wafer, thereby achieving stable support for the suspended position of the wafer edge and expanding the support range for the edge of the wafer product without affecting the normal flatness measurement of the wafer by the measurement group 300. The movable member 404 includes:

[0069] A bow frame 4041 is fixed to the guide slide 402. A distance sensor facing the wafer product can be embedded on the left side of the bow frame 4041 to monitor the suspended distance between the wafer edge and the negative pressure suction cup 601, so that the guide slide 402 can be kept at a suitable position outside the wafer edge. The distance sensor is a prior art and will not be described in detail in this application. Two guide rails 4045 are provided on the upper surface of the bow frame 4041.

[0070] A moving motor 4042 is mounted on the right side of the upper end of the bow frame 4041. A screw rod is connected to the left end of the moving motor 4042. A nut seat 4043 is sleeved on the screw rod. As the screw rod rotates, the nut seat 4043 can be driven to move.

[0071] The guide slider 4044 is fixed on the lower surface of the filling base plate 4031 and slidably sleeved on the guide rail 4045. The two are slidably connected to play a stable guiding role in the movement of the filling base plate 4031.

[0072] In this embodiment, preferably, the upper end of the nut seat 4043 is fixed to the lower surface of the filling base plate 4031, and the inner surface of the bow frame 4041 is provided with reinforcing ribs to increase the use strength of the bow frame 4041.

[0073] In summary, during use, when it is necessary to support the bottom edge of the wafer product, the moving motor 4042 works, driving the screw to rotate in place, and the nut seat 4043 threadedly connected to the screw rotates and moves accordingly, driving the filling base plate 4031 and the guide slider 4044 to move along the guide rail 4045 until the left end of the filling base plate 4031 extends to the suspended position of the wafer edge, and the first bevel 4038 or the bevel of the rotating filling plate 4032 rests on the bottom edge of the wafer, providing stable support for the wafer edge, so that the wafer edge will not vibrate in the air during the measurement process, and the moving component 404 can adapt to wafer products of different sizes and different suspension distances between the edge of the wafer product and the negative pressure suction cup 601.

[0074] Example 3

[0075] Reference Figures 8-10 , which is the third embodiment of the present invention.

[0076] In this embodiment, preferably, a dust removal mechanism 500 is provided to cooperate with the rotating member 401 to change the position of the air outlet pipe 507 and the spacing between the multiple air outlet pipes 507 in the circumferential direction. The continuously changing spacing between the multiple air outlet pipes 507 can adapt to the area of the wafer product, thereby expanding the dust removal area for the wafer product and reducing the impact of dust particles on the flatness measurement of the wafer product. The dust removal mechanism 500 is installed on the upper surface of the guide slide 402 and cleans the dust particles on the upper surface of the wafer, including:

[0077] The air delivery cylinder 501 is horizontally located above the guide slide 402. The upper surface of the guide slide 402 is provided with a stabilizing frame 509 for supporting the air delivery cylinder 501.

[0078] A telescopic tube 503 is mounted on the left side of the air delivery cylinder 501 and is retractable. When the telescopic tube 503 is expanded or retracted, the spacing between the multiple air outlet pipes 507 is changed. Multiple air outlet pipes 507 are provided on the lower surface of the telescopic tube 503.

[0079] A piston plate 502 vertically located inside the air delivery cylinder 501;

[0080] And a driving cylinder 505 located below the air supply cylinder 501 drives the piston plate 502 to move. The driving cylinder 505 can change the position of the piston plate 502.

[0081] In this embodiment, preferably, the driving cylinder 505 is horizontally installed inside the stabilizing frame 509, and a piston rod 504 is provided on the right side of the piston plate 502, which passes through the air supply cylinder 501 and is exposed to the outside. A connecting plate 512 is provided between the inner rod inside the driving cylinder 505 and the right end of the piston rod 504, which can drive the piston rod 504 and the piston plate 502 to move as the inner rod moves.

[0082] In this embodiment, preferably, a sealing plate 508 is provided on the left side of the telescopic tube 503, and an extension rod 510 is provided between the left side of the piston plate 502 and the sealing plate 508. The extension rod 510 is used to change the length of the telescopic tube 503 without affecting the movement of the piston plate 502. An air inlet pipe 506 is provided on the upper surface of the left end of the air supply cylinder 501, and a one-way valve 511 is provided on the air inlet pipe 506 and the air outlet pipe 507. The air inlet pipe 506 can only take in air but not out air, and the air outlet pipe 507 can only out air but not take in air.

[0083] In summary, when in use, the driving motor 4014 works, driving the guide slide 402 to move along the annular rail 4011, driving the dust removal mechanism 500 thereon to move in the circumferential direction. As the dust removal mechanism 500 moves in the circumference, the driving cylinder 505 works, and the inner rod inside it retracts to drive the piston rod 504 and the piston plate 502 to move to the left, driving the extension rod 510 to move to the left, pushing the sealing plate 508 to move to the left, and the telescopic tube 503 is unfolded. The spacing between the multiple air outlet pipes 507 gradually increases until the multiple air outlet pipes 507 extend to the wafer product beyond the center of the circle. The number of air outlet pipes 507, the size of the telescopic tube 503 and the size of the extension rod 510 can all be set according to actual needs. When the sealing plate 508 moves to the left, it squeezes the left side. The air is discharged from multiple outlet pipes 507, and the discharged gas acts on the upper surface of the wafer product, blowing away the dust particles on the surface of the wafer product, and the inner rod inside the driving cylinder 505 is extended, driving the piston rod 504 and the piston plate 502 to move to the right, and sucking air through the air inlet pipe 506. A filter can be set inside the air inlet pipe 506 as needed, and the telescopic tube 503 becomes shorter as the extension rod 510 moves to the right, is in a folded state and is located on the outside of the wafer product, and does not affect the measurement group 300 of the wafer flatness. The whole process is repeated, and as the guide slide 402 moves in a circle, it drives the air outlet pipe 507 to blow the dust on the surface of the wafer product in a circular direction, so that the dust is separated from the surface of the wafer product, reducing the factors affecting the flatness measurement result of the wafer product.

[0084] Example 4

[0085] This embodiment is obtained by combining the first embodiment, the second embodiment and the third embodiment.

[0086] A method for measuring wafer flatness:

[0087] S1. Place the wafer product on the suction cup assembly 600 through an external robot, and use the negative pressure suction cup 601 set on the top of the suction cup assembly 600 to adsorb and fix the wafer product;

[0088] S2. Use the rotating member 401 located outside the suction cup assembly 600 to drive the guide slide 402 to rotate in the circumferential direction, change the position of the filling member 403 on the guide slide 402, and use the moving member 404 to drive the filling base 4031 to move toward the wafer product to fill and support the suspended position at the edge of the wafer product. Different suspension distances can be adjusted according to the filling member 403 to adjust the filling thickness to suit different suspension distances;

[0089] S3. During the rotation of the guide slide 402, the dust removal mechanism 500 is driven to rotate in a circular manner, and dust on the upper surface of the wafer product is processed during the rotation. During the cleaning process, the cleaning spacing of the multiple air outlet pipes 507 on the upper surface of the wafer product can be adaptively changed to expand the cleaning area of the dust on the surface of the wafer product;

[0090] S4. Utilize the measurement group 300 located above the chuck group 600 to measure the flatness of the upper surface of the wafer product.

[0091] The above embodiments are only used to illustrate the technical method of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical method of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the present invention.

Claims

1. A wafer flatness measurement device, characterized in that: include: An equipment rack (100), wherein a suction cup group (600) for adsorbing and fixing wafers is provided inside the equipment rack (100); A rotating filling mechanism (400) is installed outside the suction cup group (600) to support the wafer, the rotating filling mechanism (400) comprising a filling component (403) supporting the edge portion of the suspended wafer, a rotating component (401) changing the circumferential position of the filling component (403), and a guide slide (402) in sliding cooperation with the rotating component (401); The filling member (403) comprises a filling base plate (4031) supporting the bottom edge of the wafer, a first inclined surface (4038) is provided on the left upper surface of the filling base plate (4031), and a rotating filling plate (4032) is rotatably provided on the front and rear surfaces of the filling base plate (4031) to cooperate with the first inclined surface (4038); The rotating component (401) comprises an annular rail (4011) located outside the suction cup group (600), and the guide slide (402) is slidably sleeved on the annular rail (4011).

2. The wafer flatness measuring device according to claim 1, wherein: The filling member (403) for filling the gap between the wafer edge and the suction cup assembly (600) further comprises: A connecting rod (4034) is installed between the right ends of the two rotating filling plates (4032), and a rotating lug (4035) is sleeved on the connecting rod (4034); A rotating cylinder (4033) is installed at the right end of the filling base plate (4031) and drives the connecting rod (4034) to rotate; A rotating shaft (4037) is vertically mounted on the front and rear surfaces of the left end of the filling bottom plate (4031), and the rotating shaft (4037) is rotatably connected to the left end of the rotating filling plate (4032).

3. The wafer flatness measuring device according to claim 2, wherein: The connecting rod (4034) is provided with a rotating lug (4035), the right end of the filling bottom plate (4031) is provided with a supporting transverse plate (4036), the lower end of the rotating cylinder (4033) is rotatably connected to the supporting transverse plate (4036), and the upper end of the rod inside the rotating cylinder (4033) is rotatably connected to the rotating lug (4035).

4. The wafer flatness measuring device according to claim 1, wherein: The rotating member (401) for changing the circumferential direction of the filling member (403) comprises: An annular rail (4011) is horizontally sleeved on the outside of the suction cup assembly (600), and an outer gear ring (4012) is provided on the outer circumferential surface of the annular rail (4011); A driving gear (4013) meshed with the outer gear ring (4012), the guide slide (402) is sleeved on the top of the annular rail (4011), and a driving motor (4014) connected to the driving gear (4013) is provided on the outer surface of the guide slide (402).

5. The wafer flatness measuring device according to claim 1, wherein: A moving member (404) for adjusting the position of the filling bottom plate (4031) is provided between the filling bottom plate (4031) and the guide slide (402), and the moving member (404) comprises: A bow-shaped frame (4041) fixed on the guide slide (402), wherein the upper surface of the bow-shaped frame (4041) is provided with two guide rails (4045); A movable motor (4042) is installed on the right side of the upper end of the bow frame (4041), wherein the left end of the movable motor (4042) is connected to a screw rod, and a nut seat (4043) is sleeved on the screw rod; A guide slider (4044) is fixed on the lower surface of the filling base plate (4031) and is slidably sleeved on the guide rail (4045).

6. The wafer flatness measuring device according to claim 5, wherein: The upper end of the nut seat (4043) is fixed to the lower surface of the filling base plate (4031), and the inner surface of the bow frame (4041) is provided with reinforcing ribs.

7. The wafer flatness measurement device according to claim 1, wherein: A dust removal mechanism (500) installed on the upper surface of the guide slide (402) and used to clean dust particles on the upper surface of the wafer includes: An air supply cylinder (501) is horizontally located above the guide slide (402), and a stabilizing frame (509) for supporting the air supply cylinder (501) is provided on the upper surface of the guide slide (402); A telescopic tube (503) is installed on the left side of the air delivery cylinder (501) and is telescopic. A plurality of air outlet pipes (507) are provided on the lower surface of the telescopic tube (503); A piston plate (502) vertically located inside the air delivery cylinder (501); and a driving cylinder (505) located below the air supply cylinder (501) for driving the piston plate (502) to move.

8. The wafer flatness measuring device according to claim 7, wherein: The driving cylinder (505) is horizontally mounted inside the stabilizing frame (509), and a piston rod (504) is provided on the right side of the piston plate (502) and penetrates the air supply cylinder (501) and is exposed to the outside. A connecting plate (512) is provided between the inner rod inside the driving cylinder (505) and the right end of the piston rod (504).

9. The wafer flatness measuring device according to claim 8, wherein: A sealing plate (508) is provided on the left side of the telescopic tube (503), an extension rod (510) is provided between the left side of the piston plate (502) and the sealing plate (508), and an air inlet pipe (506) is provided on the upper surface of the left end of the air delivery cylinder (501).

10. A wafer flatness measurement method, using the wafer flatness measurement device according to any one of claims 1 to 9, characterized in that: S1. Place the wafer product on the suction cup group (600) through an external robot, and use the negative pressure suction cup (601) provided on the top of the suction cup group (600) to adsorb and fix the wafer product; S2, using a rotating member (401) located outside the suction cup group (600) to drive the guide slide (402) to rotate in a circumferential direction, changing the position of the filling member (403) on the guide slide (402), and using a moving member (404) to drive the filling base plate (4031) to move toward the wafer product, thereby filling and supporting the suspended position at the edge of the wafer product; S3, driving the dust removal mechanism (500) to rotate in a circular motion during the rotation of the guide slide (402), and processing dust on the upper surface of the wafer product during the rotation, and adaptively changing the cleaning spacing of the plurality of air outlet pipes (507) on the upper surface of the wafer product during the cleaning process; S4. Utilize the measurement group (300) located above the suction cup group (600) to measure the flatness of the upper surface of the wafer product.

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