Probe card test motherboard calibration method, device and system

Abstract

The application discloses a kind of probe card test motherboard's calibration method, device and system, the method includes when control first fixed piece drives the measuring head of measuring device insertion one first through-hole;Control test chuck motion, to make test chuck and measuring head contact and make measuring head produce displacement;Obtain the first measurement value of measuring device;Control first fixed piece drives the measuring head of measuring device sequentially insertion other at least two first through-holes, and sequentially obtain multiple first measurement values of measuring device;Based on all first measurement value control leveling mechanism probe card test motherboard is adjusted to parallel with test chuck.This application can improve the degree of parallelism of probe card test motherboard and test chuck by controlling leveling mechanism probe card test motherboard to be adjusted to parallel with test chuck based on all first measurement value, so as to reduce the subsequent test result distortion or probe card damage when using test chuck to test probe card.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of probe card testing, and particularly relates to a calibration method, device and system for a probe card test motherboard. BACKGROUND

[0002] In the current high-speed development of the chip industry, wafer detection is a crucial link in the chip production process. When the chip has not been packaged, in order to avoid invalid processing of unqualified wafers, detection work needs to be carried out on the wafers by means of a probe card. The probe card includes a plurality of probes, which realize the transmission of test signals by directly contacting the pads or bumps on the wafer, so as to determine whether the wafer is qualified.

[0003] The probe card itself also needs to be tested. In the testing process of the probe card, the commonly used method is to first fix the probe card on a probe card test motherboard, then place the probe card test motherboard on a probe test system, and then perform performance testing on the probes on the probe card through the probes on the test chuck of the probe test system, so as to ensure that the probe card can work normally when detecting wafers.

[0004] However, in the actual testing process, due to the influence of various factors such as installation errors, the probe card and the test chuck are often difficult to maintain a parallel state. This will cause the probes on the test chuck to fail to accurately align with the probes on the probe card, thereby causing the test results to be distorted, failing to truly reflect the performance of the probe card, and even possibly causing damage to the probe card during testing. At present, there is no calibration method in the industry that can effectively adjust the probe card test motherboard to maintain parallelism with the test chuck. SUMMARY

[0005] In view of the deficiencies of the prior art, the present application provides a calibration method, device and system for a probe card test motherboard, which inserts the measuring head of a measuring device into at least three first through holes of a calibration device through a first fixing member and obtains first measurement values, and adjusts the probe card test motherboard to be parallel to the test chuck based on all the first measurement values, thereby improving the degree of parallelism between the probe card test motherboard and the test chuck, and reducing the distortion of the test results or damage to the probe card when the test chuck is used to test the probe card.

[0006] To solve the above problems, the present application provides the following technical solutions:

[0007] In a first aspect, the present application provides a calibration method for a probe card test motherboard, and the calibration device for the probe card test motherboard includes a main body and at least three first through holes provided on the main body, and the first through holes are used to insert the measuring head of a measuring device.

[0008] The calibration method for the probe card test motherboard includes:

[0009] controlling the first fixing member to drive the measuring head of the measuring device to be inserted into one of the first through holes, wherein the first fixing member is configured to make the main body of the measuring device to be located on a plane parallel to the calibration device;

[0010] controlling a test chuck of a test device of the probe test system to move to make the test chuck contact the measuring head and make the measuring head to be displaced;

[0011] obtaining a first measurement value of the measuring device;

[0012] controlling the first fixing member to drive the measuring head of the measuring device to be inserted into other at least two of the first through holes in turn, and obtaining a plurality of first measurement values of the measuring device in turn;

[0013] controlling the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on all the first measurement values.

[0014] In some embodiments, the calibration device further comprises a second through hole configured to insert a test chuck calibration device, the test chuck calibration device comprising a calibration needle,

[0015] After the step of controlling the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on all the first measurement values, the method further comprises:

[0016] controlling a visual detection component of the test device to obtain an image of a needle tip of the calibration needle when the test chuck calibration device is inserted into the second through hole;

[0017] controlling the test chuck to move based on the image of the needle tip so that a probe of the test device contacts the calibration needle, the probe of the test device being provided through the test chuck;

[0018] obtaining first movement data of the test chuck when a first electrical signal indicating that the probe of the test device has contacted the calibration needle is detected;

[0019] determining a relative position of the probe to a reference position point of the test chuck based on the first movement data.

[0020] In some embodiments, the calibration device further comprises a third through hole, and before the step of controlling the visual detection component of the test device to obtain the image of the needle tip of the calibration needle when the test chuck calibration device is inserted into the second through hole, the method further comprises:

[0021] controlling the test chuck to move so that probes of the test device contact the conductive piece, the conductive piece exceeding a length of a surface of the test chuck facing the probe card test motherboard by a preset standard length when the conductive piece is inserted into the third through hole;

[0022] obtaining second movement data of the test chuck when a second electrical signal indicating that the surface of the test chuck has contacted the conductive piece is detected;

[0023] determining a relative distance between the surface of the test chuck and a surface of the probe card test motherboard facing the surface of the test chuck based on the second movement data and the preset standard length.

[0024] In some embodiments, the controlling the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on all the first measurement values comprises:

[0025] calculating a calibration measurement value based on all the first measurement values and a preset calculation manner;

[0026] controlling the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on the calibration measurement value.

[0027] In some embodiments, the at least three first through holes comprise at least three first measurement through holes and a second measurement through hole, the first measurement through holes being used for inserting measurement heads of the measurement device to obtain the first measurement values, and after the controlling the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on all the first measurement values, the method further comprises:

[0028] controlling the first fixing member to drive the measurement heads of the measurement device to be inserted into the second measurement through hole;

[0029] obtaining a second measurement value of the measurement device;

[0030] when a difference between the second measurement value and the calibration measurement value is less than a first preset difference value, determining that the probe card test motherboard is parallel to the test chuck, otherwise, controlling the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on all the first measurement values and the second measurement value.

[0031] In a second aspect, an embodiment of the present application provides a calibration device of a probe card test motherboard, which is applied to the calibration method of the probe card test motherboard as described in the first aspect, and comprises a main body and at least three first through holes arranged on the main body, the first through holes being used for inserting measurement heads of a measurement device.

[0032] In some embodiments, the at least three first through holes include at least three first measurement through holes and a second measurement through hole, the first measurement through holes being used for inserting a measurement head of the measurement device to obtain first measurement values, and the second measurement through hole being used for inserting the measurement head of the measurement device to obtain a second measurement value.

[0033] The first measurement through holes are three, and the three first measurement through holes are three vertices of an equilateral triangle.

[0034] The second measurement through hole is one, and the second measurement through hole is the incenter of the equilateral triangle.

[0035] In some embodiments, the calibration device further includes a second through hole used for inserting a test chuck calibration device; and / or

[0036] The calibration device further includes a third through hole used for inserting a conductive piece.

[0037] In some embodiments, the calibration device further includes a groove used for placing a second fixing piece, the second fixing piece being used for fixing the test chuck calibration device when the test chuck calibration device is inserted into the second through hole.

[0038] In a third aspect, an embodiment of the present application provides a calibration system of a probe card test motherboard, including the calibration device of the probe card test motherboard, the measurement device, the first fixing piece, the test chuck calibration device and the second fixing piece of the second aspect, the measurement device including a main body and a measurement head, the first fixing piece being used for fixing the measurement device and making the main body of the measurement device located on a plane parallel to the calibration device, the test chuck calibration device including a calibration needle, and the second fixing piece being used for fixing the test chuck calibration device when the test chuck calibration device is inserted into the second through hole of the calibration device.

[0039] The present application provides a calibration method, device and system of a probe card test motherboard. The present application controls the first fixing piece to drive the measurement head of the measurement device to be inserted into the at least three first through holes of the calibration device and obtain first measurement values, controls the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on all the first measurement values, and can improve the degree of parallelism between the probe card test motherboard and the test chuck, thereby reducing the cases of test result distortion or probe card damage in subsequent testing of the probe card by using the test chuck. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 FIG. 1 is a schematic diagram of a first embodiment of a calibration device of a probe card test motherboard provided by an embodiment of the present application.

[0041] Figure 2is a flowchart of a first embodiment of a calibration method of a probe card test motherboard provided by the embodiments of the present application.

[0042] Figure 3 is a schematic diagram of a probe test system provided by the embodiments of the present application.

[0043] Figure 4 is a schematic diagram of a first fixing member and a measuring device provided by the embodiments of the present application.

[0044] Figure 5 is a schematic diagram of a second embodiment of a calibration device of a probe card test motherboard provided by the embodiments of the present application.

[0045] Figure 6 is a schematic diagram of a third embodiment of a calibration device of a probe card test motherboard provided by the embodiments of the present application.

[0046] Figure 7 is a structural schematic diagram of a test chuck calibration device provided by the embodiments of the present application.

[0047] Figure 8 is a flowchart of a second embodiment of a calibration method of a probe card test motherboard provided by the embodiments of the present application.

[0048] Figure 9 is a schematic diagram of a fourth embodiment of a calibration device of a probe card test motherboard provided by the embodiments of the present application.

[0049] Figure 10 is Figure 9 is an enlarged view of P in FIG. 11.

[0050] Figure 11 is a schematic diagram of a fifth embodiment of a calibration device of a probe card test motherboard provided by the embodiments of the present application.

[0051] Figure 12 is a structural schematic diagram of a calibration system of a probe card test motherboard provided by the embodiments of the present application.

[0052] Figure 13 is a structural schematic diagram of an electronic device provided by the embodiments of the present application.

[0053] Figure 14 is a structural block diagram of a computer readable storage medium provided by the embodiments of the present application. DETAILED DESCRIPTION

[0054] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0055] In addition, the terms "first", "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly and specifically limited.

[0056] The present application provides a calibration method, device and system for a probe card test motherboard. The measurement head of the measuring device is inserted into at least three first through holes of the calibration device by controlling the first fixing member, and the first measurement value is obtained. Based on all the first measurement values, the leveling mechanism is controlled to adjust the probe card test motherboard to be parallel to the test chuck, which can improve the degree of parallelism between the probe card test motherboard and the test chuck, thereby reducing the distortion of the test results or the damage of the probe card when the test chuck is used to test the probe card in the subsequent process.

[0057] The calibration method for the probe card test motherboard provided by the present application will be described in detail below with reference to the drawings.

[0058] Please refer to Figure 1 , Figure 1 is a schematic diagram of the first embodiment of the calibration device for the probe card test motherboard provided by the present application. As Figure 1 shown, in some embodiments, the calibration device for the probe card test motherboard 1 comprises a main body R and at least three first through holes 10 arranged on the main body R, and the first through holes 10 are used for inserting the measurement head of the measuring device.

[0059] As Figure 1 shown, optionally, the number of first through holes is 3, and the three first through holes 10 include a first through hole 10A, a first through hole 10B and a first through hole 10C.

[0060] Optionally, the number of first through holes can be 4, 5 or 6, etc.

[0061] Optionally, the shape of the first through hole can be any shape, for example, the first through hole can be circular, square or irregular, etc.

[0062] Optionally, the calibration device 1 further comprises a mounting hole K, and the mounting hole K is used for mounting a fastener, and the fastener is used for fixing the calibration device 1 and the probe card test motherboard.

[0063] Optionally, the fastener includes a screw, a rivet, or the like.

[0064] Referring to Figure 2 , Figure 2 is a flowchart of a first embodiment of a calibration method of a probe card test motherboard provided by the present application. As shown in Figure 2 , the calibration method of the probe card test motherboard includes steps S100 to S500.

[0065] Step S100: When the probe card test motherboard, on which the probe card and the calibration device are installed, is fixed on the leveling mechanism of the probe test system, and the measuring device is fixed on the first fixing member, the first fixing member drives the measuring head of the measuring device to insert into a first through hole.

[0066] The first fixing member is used to make the main body of the measuring device located on a plane parallel to the calibration device.

[0067] Referring to Figure 3 , Figure 3 is a schematic diagram of a probe test system provided by an embodiment of the present application. As shown in Figure 3 , in some embodiments, the probe test system 2 includes a leveling mechanism 21, a base 22, and a test device. The test device is used to test the mechanical and electrical properties of the probe. The test device includes a test chuck 23. Figure 3 Part of the structure of the probe test system is omitted in

[0068] In some embodiments, the probe card test motherboard 3 includes a cover plate and a probe card fixing plate rotatably connected to the cover plate. The probe card fixing plate is used to install the probe card. The cover plate is provided with a calibration device fixing position 31 used to install the calibration device.

[0069] In some embodiments, the leveling mechanism is used to adjust and position the probe card fixing plate in the probe card test motherboard.

[0070] In some embodiments, the leveling mechanism 21 includes a fixing plate vacuum chuck 211 and a fixing plate turnover mechanism 212. The fixing plate vacuum chuck 211 is used to adsorb and fix the probe card test motherboard 3 in a vacuum adsorption manner.

[0071] In some embodiments, the probe test system 2 further includes a test device positioning mechanism (not shown in the figure). The test device positioning mechanism is used to drive the test device to move. The present application does not make any limitation on the specific structure of the test device positioning mechanism.

[0072] Exemplarily, the testing device is installed above the testing device positioning mechanism and can move with the testing device positioning mechanism. The testing device positioning mechanism comprises a first movement axis module, a second movement axis module and a third movement axis module arranged in sequence from bottom to top. The movement directions of the first movement axis module, the second movement axis module and the third movement axis module can be different from each other.

[0073] Optionally, the first movement axis module and the second movement axis module are used to drive the third movement axis module to move in the horizontal direction, and the third movement axis module is used to drive the testing device to move in the vertical direction.

[0074] In some embodiments, the testing device further comprises a plurality of probes penetrating through a testing chuck, a pressure testing mechanism and a visual detection assembly (not shown in the figure). The testing chuck is used to contact the to-be-tested probes of the probe card, so as to test the to-be-tested probes by the plurality of probes of the testing device. The visual detection assembly is used to visually detect the to-be-tested probes.

[0075] Optionally, the plurality of probes comprises electrical performance testing probes and pressure testing probes.

[0076] As shown in Figure 3 some embodiments, the testing chuck 23 comprises a testing through hole 231, and the probe of the testing device can penetrate through the testing chuck 23 through the testing through hole 231.

[0077] Optionally, the testing through hole 231 is a plurality of, for example, 2, 3 or 5, etc. Each testing through hole 231 can make a probe of a testing device penetrate through the testing chuck 23.

[0078] In some embodiments, the testing chuck 23 further comprises a visual window 232.

[0079] Optionally, the visual window 232 comprises a light-transmitting hole and a light-transmitting plate installed in the light-transmitting hole, and the visual detection assembly is arranged below the visual window 232, and the camera of the visual detection assembly acquires the image of the needle tip of the probe through the visual window 232.

[0080] Please refer to Figure 4 , Figure 4 is a schematic view of a first fixing member and a measuring device provided by the embodiments of the present application. As shown in Figure 4 some embodiments, the measuring device 4 comprises a main body and a measuring head 43, and the main body comprises a display part 41 and a measuring rod 42. When the measuring head 43 generates displacement relative to the measuring rod 42, the display part 41 can display the measurement value, i.e. the distance of the displacement of the measuring head 43.

[0081] In some embodiments, the display part 41 can send the measurement value to an electronic device.

[0082] Optionally, the electronic device can acquire the measurement value by acquiring an image of the measuring device 4.

[0083] Optionally, the measuring device comprises a micrometer.

[0084] In some embodiments, the first fixing member 5 comprises a first surface A1 which is in contact with the calibration device 1, a second surface A2 which is in contact with the measuring device 4, and a third measurement through hole 51 for inserting the measurement head 43 of the measuring device 4. Herein, the first surface A1 is opposite to and parallel to the second surface A2.

[0085] Optionally, the first fixing member 5 is a column, for example, the first fixing member 5 can be a prism or a cylinder, etc.

[0086] When the measurement rod 42 of the measuring device 4 is inserted into the third measurement through hole 51, the measuring device 4 is fixed to the first fixing member 5, and the measurement head 43 exceeds the first surface A1. At this time, the main body of the measuring device 4 is located in a plane parallel to the second surface A2.

[0087] In some embodiments, when the measuring device has been fixed to the first fixing member, the control mechanism moves the first fixing member to make the first fixing member drive the measurement head of the measuring device to insert into a first through hole.

[0088] In other embodiments, when the measuring device has been fixed to the first fixing member, the first fixing member is manually controlled to drive the measurement head of the measuring device to insert into a first through hole.

[0089] Optionally, the first fixing member can be placed on the calibration device, or the first surface A1 of the first fixing member is parallel to the surface of the probe card test motherboard which is in contact with the calibration device. Herein, the surface of the probe card test motherboard which is in contact with the calibration device is parallel to the surface of the probe card test motherboard which faces the test chuck. At this time, the main body of the measuring device 4 is located in a plane parallel to the surface of the probe card test motherboard which faces the test chuck.

[0090] In some embodiments, the probe card test motherboard is provided with a through hole corresponding to the position of the first through hole on the calibration device, so that the measurement head of the measuring device is inserted into the corresponding through hole on the probe card test motherboard at the same time when it is inserted into the first through hole, and then the measurement head penetrates the probe card test motherboard and exceeds the surface of the probe card test motherboard which is close to the test chuck, so that the measurement head can contact the test chuck.

[0091] Step S200: control the test chuck of the test device of the probe test system to move, so that the test chuck contacts the measurement head and makes the measurement head produce displacement.

[0092] Optionally, when the first fixing member 5 is placed on the calibration device 1, or the first surface A1 of the first fixing member is parallel to the surface of the probe card test motherboard contacted by the probe card test motherboard, the measurement head 43 contacts the test chuck 23, and thus the plane where the measurement head 43 is located is the plane where the surface of the test chuck 23 is located.

[0093] Step S300: Obtain a first measurement value of the measurement device.

[0094] The first measurement value of the measurement device is the distance between the plane where the surface of the current test chuck is located and the plane where the surface of the probe card test motherboard is located, minus a standard distance, which is the distance beyond the surface of the probe card test motherboard when the measurement head is not in contact with the test chuck.

[0095] Step S400: Control the first fixing member to sequentially insert the measurement head of the measurement device into other at least two first through holes, and sequentially obtain a plurality of first measurement values of the measurement device.

[0096] Step S500: Control the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on all the first measurement values.

[0097] In some embodiments, when all the first measurement values are not the same value or the difference between every two first measurement values is not less than a first preset difference value, it can be judged that the probe card test motherboard is not parallel to the test chuck, and the leveling mechanism can be controlled to adjust the probe card test motherboard to be parallel to the test chuck based on all the first measurement values.

[0098] In some embodiments, when all the first measurement values are the same value or the difference between every two first measurement values is less than the first preset difference value, it can be judged that the probe card test motherboard is parallel to the test chuck, and the position of the probe card test motherboard does not need to be adjusted.

[0099] In some embodiments, step S500 includes steps S510 to S520.

[0100] Step S510: Calculate a calibration measurement value based on all the first measurement values and a preset calculation method.

[0101] In some embodiments, the calibration measurement value is the average, median, mode, or the like of all the first measurement values.

[0102] Optionally, the calibration measurement value is any one of the first measurement values.

[0103] Step S520: Control the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on the calibration measurement value.

[0104] As described above, the first measurement value of the measuring device is the distance between the plane where the surface of the test chuck close to the probe card test board and the plane where the surface of the probe card test board close to the test chuck, minus the standard distance, which is the distance between the measuring head and the surface of the probe card test board when the measuring head does not contact the test chuck.

[0105] In some embodiments, the plane where the surface of the test chuck close to the probe card test board is defined as the calibration plane, the plane where the surface of the probe card test board close to the test chuck is defined as the test plane, and adjusting the probe card test board to be parallel to the test chuck means adjusting the test plane to be parallel to the calibration plane.

[0106] In some embodiments, the first difference between the calibration measurement value and all the first measurement values is calculated, the adjustment distance of the leveling mechanism is calculated based on all the first measurement values, and the leveling mechanism is controlled to adjust the probe card test board to be parallel to the test chuck based on the adjustment distance of the leveling mechanism.

[0107] Exemplarily, the adjustment distance of the leveling mechanism can include the adjustment height of the fixed plate vacuum chuck 211.

[0108] In some embodiments, after step S500, it can be verified whether the probe card test board has been adjusted to be parallel to the test chuck.

[0109] Please refer to Figure 5 , Figure 5 is a schematic diagram of a second embodiment of the calibration device of the probe card test board provided by the embodiments of the present application. As shown in Figure 5 some embodiments, the at least three first through holes include at least three first measurement through holes and a second measurement through hole 10D. The at least three first measurement through holes include a first through hole 10A, a second through hole 10B, and a first through hole 10C. The first measurement through hole is used for inserting the measuring head of the measuring device to obtain the first measurement value. The second measurement through hole is used for inserting the measuring head of the measuring device to obtain the second measurement value.

[0110] In some embodiments, after step S500, the calibration method of the probe card test board further includes steps S501 to S503.

[0111] Step S501: Control the first fixing member to drive the measuring head of the measuring device to insert into the second measurement through hole.

[0112] The content of step S501 refers to the content of step S100.

[0113] Step S502: Obtain the second measurement value of the measuring device.

[0114] Step S502 refers to the content of step S300.

[0115] Step S503: When the difference between the second measurement value and the calibration measurement value is less than the first preset difference, it is determined that the probe card test motherboard is parallel to the test chuck, otherwise the leveling mechanism is controlled based on all the first measurement values and the second measurement values to adjust the probe card test motherboard to be parallel to the test chuck.

[0116] When steps S501 to S503 are performed, the test chuck is stationary, so the calibration plane is fixed. The content of step S503 refers to the content of step S500.

[0117] In this way, it can be ensured that the probe card test motherboard is adjusted to be parallel to the test chuck.

[0118] Referring to Figure 6 , Figure 6 is a schematic diagram of a third embodiment of the calibration device of the probe card test motherboard provided by the embodiments of the present application. As shown in Figure 6 , in some embodiments, the calibration device 1 further comprises a second through hole 20. The second through hole 20 is used for inserting the test chuck calibration device 6.

[0119] Optionally, the shape of the second through hole can be any shape, for example, the first through hole can be circular, square or irregular, etc.

[0120] As shown in Figure 6 , optionally, the shape of the second through hole 20 can be heart-shaped.

[0121] Referring to Figure 7 , Figure 7 is a structural schematic diagram of the test chuck calibration device provided by the embodiments of the present application. As shown in Figure 7 , in some embodiments, the test chuck calibration device 6 comprises a calibration needle 61.

[0122] Optionally, the calibration needle 61 comprises a needle body and a needle tip, and the needle body and the needle tip can have a bending angle therebetween, which can be 80 degrees or 90 degrees, etc.

[0123] Optionally, the needle tip can be located or approximately located in the vertical direction, and the needle body can be located or approximately located in the horizontal direction.

[0124] Optionally, the test chuck calibration device 6 further comprises a fixing rod 62 and a bracket 63. The fixing rod 62 is installed on the bracket 63, and the end of the fixing rod 62 is fixedly connected with the calibration needle 61.

[0125] Optionally, the material of the fixing rod 62 can be conductive.

[0126] Optionally, the bracket 63 further comprises a claw spring 631, and the claw spring 631 is used for fixedly installing the fixing rod 62.

[0127] Optionally, the test chuck calibration device 6 further comprises a support 64, a first end of the support 64 is fixedly connected with the end of the fixed rod 62, and a second end of the support 64 is connected with one end of the needle body of the calibration needle 61, and the support 64 is used to keep the calibration needle 61 stable.

[0128] Optionally, the material of the support 64 is conductive.

[0129] Optionally, the support 64 can be an iron sheet or an iron wire.

[0130] Please refer to Figure 8 , Figure 8 is a flowchart of a second embodiment of the calibration method of the probe card test motherboard provided by the embodiment. As Figure 8 shown, in some embodiments, after step S500 or step S503, the calibration method of the probe card test motherboard further comprises steps S600 to S900.

[0131] Step S600: When the test chuck calibration device is inserted into the second through hole, the visual detection component of the test device acquires a needle tip image of the calibration needle.

[0132] Step S700: Based on the needle tip image, the test chuck is controlled to move so that the probe of the test device contacts the calibration needle.

[0133] In some embodiments, one needle tip image is acquired first, based on the needle tip image, the test chuck is controlled to move so that the needle tip in the needle tip image is located at the center point of the needle tip image, and the standard coordinates of the reference position point of the test chuck at this time are recorded. Then, the needle tip image is continuously acquired, and based on multiple needle tip images, the test chuck is controlled to move so that the probe of the test device contacts the calibration needle.

[0134] In some embodiments, one needle tip image is acquired first and the standard coordinates of the reference position point of the test chuck are determined and recorded based on the needle tip image, and then the needle tip image is continuously acquired, and based on multiple needle tip images, the test chuck is controlled to move so that the probe of the test device contacts the calibration needle.

[0135] Step S800: When a first electrical signal indicating that the probe of the test device has contacted the calibration needle is detected, first movement data of the test chuck is acquired.

[0136] When the probe of the test device contacts the calibration needle, the probe card test system can receive the first electrical signal.

[0137] Optionally, the first movement data of the test chuck comprises standard coordinates and moved coordinates of the reference position point of the test chuck in a preset coordinate system.

[0138] Optionally, the reference position point of the test chuck is the center point of the visual window of the test chuck.

[0139] Step S900: determining the relative position of the probe and the reference position point of the test chuck based on the first movement data.

[0140] In some embodiments, the motion vector of the test chuck can be determined based on the standard coordinate and the coordinate after movement of the reference position point of the test chuck in the preset coordinate system in the first movement data, the coordinate of the probe can be determined based on the motion vector and the standard coordinate of the reference position point of the test chuck, and then the relative position of the probe and the reference position point of the test chuck can be determined.

[0141] In some embodiments, when the probe of the test device is multiple, steps S600 to S900 are performed on each probe to determine the relative position of each probe and the reference position point of the test chuck.

[0142] In the above manner, when the test chuck is moved to test the to-be-tested probe of the probe card by the probe of the test device in the test process, the probe of the test device can be accurately aligned with the to-be-tested probe of the probe card, thereby improving the accuracy of the test.

[0143] Please refer to Figure 9 and Figure 10 , Figure 9 is a schematic diagram of a fourth embodiment of the calibration device of the probe card test motherboard provided by the embodiments of the present application, Figure 10 is Figure 9 an enlarged view of P in FIG. 8. As shown in Figure 9 and Figure 10 , in some embodiments, the calibration device 1 further comprises a third through hole 30. The third through hole 30 is used for inserting a conductive piece.

[0144] Optionally, the shape of the third through hole can be any shape, for example, the third through hole can be circular, square or irregular, etc.

[0145] In some embodiments, before step S600, the calibration method of the probe card test motherboard further comprises steps S901 to S903.

[0146] Step S901: when the conductive piece is inserted into the third through hole, the test chuck is controlled to move so that the probe of the test device contacts the conductive piece.

[0147] wherein the length of the conductive piece beyond the surface of the probe card test motherboard facing the test chuck is a preset standard length.

[0148] Optionally, the conductive piece is a column, for example, the conductive piece is a prism or a cylinder, etc.

[0149] Optionally, the material of the conductive piece is iron or copper, etc.

[0150] In some embodiments, only the movement of the test chuck in the vertical direction is controlled in step S901.

[0151] Step S902: When the second electrical signal indicating that the surface of the test chuck has contacted the conductive part is detected, second movement data of the test chuck is obtained.

[0152] Optionally, the second movement data of the test chuck includes the coordinates of a preset reference point of the surface of the test chuck at the initial position and the coordinates of the surface of the test chuck when the surface of the test chuck has contacted the conductive part.

[0153] Step S903: The relative distance between the surface of the test chuck and the surface of the probe card test motherboard facing the surface of the test chuck is determined based on the second movement data and the preset standard length.

[0154] When the surface of the test chuck has contacted the conductive part, the current relative distance between the surface of the test chuck and the surface of the probe card test motherboard facing the surface of the test chuck is the preset standard length.

[0155] In some embodiments, based on the coordinates of the preset reference point of the surface of the test chuck at the initial position and the coordinates of the surface of the test chuck when the surface of the test chuck has contacted the conductive part, a motion vector of the test chuck can be determined, and based on the preset standard length and the motion vector of the test chuck, the relative distance between the surface of the test chuck and the surface of the probe card test motherboard facing the surface of the test chuck at the initial position can be calculated.

[0156] In some embodiments, the current relative distance between the surface of the test chuck and the surface of the probe card test motherboard facing the surface of the test chuck can be directly determined based on the preset standard length, and the current coordinates of the test chuck in the second movement data can be determined as the origin of the coordinate system.

[0157] In some embodiments, in the calibration method of the probe card test motherboard, steps S901 to S903 are located after step S500 or step S503 and before step S600.

[0158] Optionally, steps S600 to S900 are performed after steps S901 to S903 are performed, and after the relative position of the probe and the reference position point of the test chuck is determined, the relative distance between the probe and the surface of the probe card test motherboard facing the surface of the test chuck can be further determined according to the relative distance between the surface of the test chuck and the surface of the probe card test motherboard facing the surface of the test chuck in step S903. The distance between the reference position point of the test chuck and the surface of the test chuck is known.

[0159] By the above manner, when the test chuck moves in the test process and the probes of the test device test the to-be-tested probes of the probe card, the to-be-tested probes of the probe card can be further accurately aligned with the probes of the test device, so that the test accuracy is further improved.

[0160] As shown in Figure 1 , Figure 5 , Figure 6 and Figure 9 , the present application provides a calibration device 1 of a probe card test motherboard, which is applied to the calibration method of the probe card test motherboard as described above, and the calibration device 1 comprises a main body R and at least three first through holes 10 arranged on the main body, and the first through holes 10 are used for inserting the measuring head of a measuring device.

[0161] As shown in Figure 1 , in some embodiments, the at least three first through holes comprise at least three first measuring through holes and a second measuring through hole, the first measuring through holes are used for inserting the measuring head of the measuring device to obtain a first measurement value, and the second measuring through hole is used for inserting the measuring head of the measuring device to obtain a second measurement value.

[0162] As shown in Figure 1 , in some embodiments, the first measuring through holes are three, the at least three first measuring through holes comprise a first through hole 10A, a second through hole 10B and a first through hole 10C, and the three first measuring through holes are three vertices of an equilateral triangle T.

[0163] In some embodiments, the second measuring through hole is one, and the second measuring through hole is the incenter of the equilateral triangle T.

[0164] As shown in Figure 5 , in some embodiments, the first measuring through holes are three, the at least three first measuring through holes comprise a first through hole 10A, a second through hole 10B and a first through hole 10C, the three first measuring through holes are three vertices of an equilateral triangle T, and the second measuring through hole 10D is one, and the second measuring through hole 10D is the incenter of the equilateral triangle T. In this way, the measuring through holes can be uniformly distributed, so as to reduce the measurement error.

[0165] As shown in Figure 6 , in some embodiments, the calibration device 1 further comprises a second through hole 20, and the second through hole 20 is used for inserting a test chuck calibration device 6.

[0166] In some embodiments, the calibration device further comprises a third through hole, and the third through hole is used for inserting a conductive part.

[0167] As shown in Figure 9 , in some embodiments, the calibration device 1 further comprises a second through hole 20 and a third through hole 30.

[0168] Please refer to Figure 11 , Figure 11 FIG. 5 is a schematic diagram of a fifth embodiment of the calibration device of the probe card test motherboard provided by the embodiments of the present application. As shown in Figure 11 some embodiments, the calibration device 1 further comprises a recess 40 for placing a second fixing member. The second fixing member is used to fix the test chuck calibration device 6 when the test chuck calibration device 6 is inserted into the second through hole 20.

[0169] In some embodiments, the second fixing member has magnetism, and the material of the bracket 63 of the test chuck calibration device 6 is a magnetic material. When the test chuck calibration device 6 is inserted into the second through hole 20, and the second fixing member is placed in the recess 40, the bracket 63 is adsorbed by the second fixing member, so that the test chuck calibration device 6 is fixed.

[0170] Optionally, the second fixing member is a magnet, and the material of the bracket 63 is iron.

[0171] Optionally, the shape of the recess can be any shape, for example, the recess can be circular, square or irregular, etc.

[0172] Please refer to Figure 12 , Figure 12 FIG. 7 is a structural schematic diagram of a calibration system of a probe card test motherboard provided by the embodiments of the present application. As shown in Figure 12 the present application provides a calibration system 7 of a probe card test motherboard, which comprises the calibration device 1 of the probe card test motherboard, the measuring device 4, the first fixing member 5, the test chuck calibration device 6 and the second fixing member 8 as described above. The first fixing member 5 is used to fix the measuring device 4 and make the main body of the measuring device 4 located on a plane parallel to the calibration device 1.

[0173] In summary, the calibration method of the probe card test motherboard provided by the embodiments of the present application has the following advantages:

[0174] 1. By controlling the first fixing member to drive the measuring head of the measuring device to be inserted into at least three first through holes of the calibration device and obtaining first measurement values, and based on all the first measurement values, controlling the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck, the degree of parallelism between the probe card test motherboard and the test chuck can be improved, so as to reduce the cases of test result distortion or probe card damage in subsequent testing of the probe card by using the test chuck.

[0175] 2. By judging that the probe card test motherboard is parallel to the test chuck when the difference between the second measurement value and the calibration measurement value is less than the first preset difference, otherwise, based on all the first measurement values and the second measurement values, controlling the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck, the adjustment of the probe card test motherboard to be parallel to the test chuck can be ensured.

[0176] 3. By determining the relative position of the probe and the reference position point of the test chuck, when the test chuck is moved during the test process and the probe is used to test the probe to be tested on the probe card, the probe of the test device can be accurately aligned with the probe to be tested on the probe card, thereby improving the accuracy of the test.

[0177] 4. By determining the relative distance between the surface of the test chuck and the surface of the probe card test motherboard facing the test chuck based on the second movement data and the preset standard length, when the test chuck is moved during the test process and the probe is used to test the probe to be tested of the probe card, the probe of the test device can be further accurately aligned with the probe to be tested of the probe card, thereby further improving the accuracy of the test.

[0178] See also Figure 13 , Figure 13 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 13 As shown, the electronic device 400 includes: one or more processors 410 and a memory 420, Figure 13 A processor 410 is taken as an example.

[0179] In some embodiments, the processor 410 and the memory 420 may be connected via a bus or other means. Figure 13 The bus connection is taken as an example.

[0180] In some embodiments, the processor 410, a calibration device for a probe card test motherboard includes a main body and at least three first through holes arranged on the main body, the first through holes being used to insert a measuring head of a measuring device; a calibration method for the probe card test motherboard includes: when the probe card test motherboard on which the probe card and the calibration device are installed is fixed on a leveling mechanism of a probe test system, and the measuring device is fixed to a first fixing member, controlling the first fixing member to drive the measuring head of the measuring device to be inserted into a first through hole, wherein the first fixing member is used to make the main body of the measuring device located on a plane parallel to the calibration device; controlling the movement of a test chuck of a test device of the probe test system so that the test chuck contacts the measuring head and causes the measuring head to be displaced; obtaining a first measurement value of the measuring device; controlling the first fixing member to drive the measuring head of the measuring device to be inserted into at least two other first through holes in sequence, and obtaining multiple first measurement values ​​of the measuring device in sequence; and controlling the leveling mechanism based on all the first measurement values ​​to adjust the probe card test motherboard to be parallel to the test chuck.

[0181] In some embodiments, the memory 420 can be configured to store non-volatile software programs, non-volatile computer-executable programs and modules, such as program instructions / modules of the method for calibrating a probe card test motherboard according to the embodiments of the present application. The processor 410 can execute various functional applications and data processing of the electronic device 400 by running the non-volatile software programs, instructions and modules stored in the memory 420, i.e., implement the method for calibrating a probe card test motherboard according to the method embodiments described above.

[0182] In some embodiments, the memory 420 can include a program storage area and a data storage area, wherein the program storage area can store an operating system and at least one application required by a function; and the data storage area can store data created according to the use of the electronic device 400, etc. In addition, the memory 420 can include a high-speed random access memory, and can further include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other non-volatile solid-state memory device. In some embodiments, the memory 420 can optionally include a memory remotely disposed relative to the processor 410, and these remote memories can be connected to the controller through a network. Examples of the network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0183] In some embodiments, one or more modules are stored in the memory 420, and when executed by the one or more processors 410, perform the method for calibrating a probe card test motherboard in any of the method embodiments described above, for example, perform the method steps S100 to S500 in the method described above. Figure 1

[0184] Please refer to Figure 14 , Figure 14 is a structural block diagram of a computer readable storage medium according to an embodiment of the present application. The computer readable storage medium 500 stores program code 510, and the program code 510 can be invoked by a processor to execute the method for calibrating a probe card test motherboard described in the method embodiments described above.

[0185] ​The computer readable storage medium 500 can be an electronic storage such as a flash memory, an Electrically Erasable Programmable read only memory (EEPROM), a hard disk, or a Read-Only Memory (ROM). Alternatively, the computer readable storage medium includes a non-volatile computer readable medium. The computer readable storage medium 500 has a storage space for storing program codes for performing any of the method steps of the calibration method of the probe card test board described above. The program codes can be read from or written to one or more computer program products. The program codes can be compressed in an appropriate form, for example.

[0186] The present application also provides a computer program product comprising a computer program which, when executed by a processor, implements the calibration method of the probe card test board described above.

[0187] In summary, the present application provides a calibration method, device and system of a probe card test board. The calibration method of the probe card test board comprises: the calibration device of the probe card test board comprises a main body and at least three first through holes provided on the main body, and the first through holes are used for inserting a measurement head of a measurement device; the calibration method of the probe card test board comprises: when the probe card test board on which the probe card and the calibration device have been installed is fixed on a leveling mechanism of a probe test system, and the measurement device has been fixed on a first fixing member, the first fixing member is controlled to drive the measurement head of the measurement device to be inserted into one of the first through holes, wherein the first fixing member is used for enabling the main body of the measurement device to be located on a plane parallel to the calibration device; a test chuck of a test device of the probe test system is controlled to move, so that the test chuck is in contact with the measurement head and the measurement head is displaced; a first measurement value of the measurement device is obtained; the first fixing member is controlled to drive the measurement head of the measurement device to be inserted into the other at least two first through holes in turn, and a plurality of first measurement values of the measurement device are obtained in turn; and the leveling mechanism is controlled to adjust the probe card test board to be parallel to the test chuck based on all the first measurement values. By controlling the first fixing member to drive the measurement head of the measurement device to be inserted into the at least three first through holes of the calibration device and obtaining the first measurement values, and controlling the leveling mechanism to adjust the probe card test board to be parallel to the test chuck based on all the first measurement values, the degree of parallelism between the probe card test board and the test chuck can be improved, so that the distortion of the test result or the damage of the probe card in the subsequent test of the probe card by using the test chuck can be reduced.

[0188] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the same; although the present application has been described in detail with reference to the foregoing examples, those of ordinary skill in the art will understand that they can still modify the technical solutions described in the foregoing examples, or make equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A calibration method for a probe card testing motherboard, characterized in that: The calibration device for testing a motherboard with a probe card comprises a main body and at least three first through holes provided on the main body, wherein the first through holes are used for inserting a measuring head of a measuring device; The calibration method of the probe card testing motherboard includes: When the probe card test motherboard on which the probe card and the calibration device are mounted is fixed to the leveling mechanism of the probe test system, and the measuring device is fixed to the first fixing member, controlling the first fixing member to drive the measuring head of the measuring device to insert into one of the first through holes, wherein the first fixing member is used to position the main body of the measuring device on a plane parallel to the calibration device; controlling the movement of a test chuck of a test device of the probe test system so that the test chuck contacts the measuring head and causes the measuring head to be displaced; Obtaining a first measurement value of the measuring device, wherein the first measurement value is a distance between a plane where the current test chuck is close to the surface of the probe card test motherboard and a plane where the probe card test motherboard is close to the test chuck minus a standard distance, wherein the standard distance is a distance beyond the surface of the probe card test motherboard when the measuring head is not in contact with the test chuck; controlling the first fixing member to drive the measuring head of the measuring device to sequentially insert into the other at least two first through holes, and sequentially obtaining a plurality of first measurement values ​​of the measuring device; The leveling mechanism is controlled based on all the first measurement values ​​to adjust the probe card test mother board to be parallel to the test chuck.

2. The calibration method for testing a motherboard using a probe card according to claim 1, wherein: The calibration device further comprises a second through hole for inserting a test chuck calibration device, wherein the test chuck calibration device comprises a calibration needle. After controlling the leveling mechanism to adjust the probe card test mother board to be parallel to the test chuck based on all the first measurement values, the method further includes: When the test chuck calibration device is inserted into the second through hole, controlling the visual detection component of the test device to obtain a needle tip image of the calibration needle; controlling the movement of the test chuck based on the needle tip image so that the probe of the test device contacts the calibration needle and the probe of the test device penetrates the test chuck; acquiring first movement data of the test chuck when a first electrical signal indicating that the probe of the test device has contacted the calibration pin is detected; The relative position of the probe and a reference position point of the test chuck is determined based on the first movement data.

3. The calibration method for testing a motherboard using a probe card according to claim 2, wherein: The calibration device further includes a third through hole. Before controlling the visual inspection component of the test device to acquire the needle tip image of the calibration needle when the test chuck calibration device is inserted into the second through hole, the method further includes: When the conductive member is inserted into the third through hole, the test chuck is controlled to move so that the probe of the test device contacts the conductive member, and the length of the conductive member extending beyond the surface of the probe card test motherboard facing the test chuck is a preset standard length; acquiring second movement data of the test chuck when a second electrical signal indicating that the surface of the test chuck has contacted the conductive member is detected; A relative distance between a surface of the test chuck and a surface of the probe card test mother board facing the test chuck is determined based on the second movement data and the preset standard length.

4. The calibration method for testing a motherboard using a probe card according to claim 1, wherein: The step of controlling the leveling mechanism to adjust the probe card test motherboard to be parallel to the test chuck based on all the first measurement values ​​comprises: Calculate a calibration measurement value based on all the first measurement values ​​and a preset calculation method; The leveling mechanism is controlled based on the calibration measurement value to adjust the probe card test mother board to be parallel to the test chuck.

5. The calibration method for testing a motherboard using a probe card according to claim 4, wherein: The at least three first through holes include at least three first measurement through holes and a second measurement through hole. The first measurement through holes are used to insert a measurement head of the measurement device to obtain the first measurement values. After controlling the leveling mechanism to adjust the probe card test mother board to be parallel to the test chuck based on all the first measurement values, the method further includes: Controlling the first fixing member to drive the measuring head of the measuring device to insert into the second measuring through hole; obtaining a second measurement value of the measuring device; When the difference between the second measurement value and the calibration measurement value is less than a first preset difference, it is determined that the probe card test motherboard is parallel to the test chuck; otherwise, based on all the first measurement values ​​and the second measurement values, the leveling mechanism is controlled to adjust the probe card test motherboard to be parallel to the test chuck.

6. A calibration device for a probe card testing motherboard, applied to the calibration method for a probe card testing motherboard according to any one of claims 1 to 5, characterized in that: The calibration device includes a main body and at least three first through holes provided on the main body, wherein the first through holes are used for inserting a measuring head of a measuring device.

7. The calibration device for testing a motherboard using a probe card according to claim 6, wherein: The at least three first through holes include at least three first measurement through holes and second measurement through holes, wherein the first measurement through holes are used to insert a measurement head of the measurement device to obtain a first measurement value, and the second measurement through holes are used to insert a measurement head of the measurement device to obtain a second measurement value; There are three first measurement through holes, and the three first measurement through holes are three vertices of an equilateral triangle; There is one second measuring through hole, and the second measuring through hole is the center of the equilateral triangle.

8. The calibration device for testing a motherboard using a probe card according to claim 7, wherein: The calibration device further comprises a second through hole, wherein the second through hole is used for inserting the test chuck calibration device; and / or The calibration device further includes a third through hole, wherein the third through hole is used for inserting a conductive member.

9. The calibration device for testing a motherboard using a probe card according to claim 8, wherein: The calibration device further includes a groove for accommodating a second fixing member, and the second fixing member is used to fix the test chuck calibration device when the test chuck calibration device is inserted into the second through hole.

10. A calibration system for a probe card test motherboard, comprising a calibration device for a probe card test motherboard as described in any one of claims 6 to 9, a measuring device, a first fixing member, a test chuck calibration device, and a second fixing member, wherein the measuring device comprises a main body and a measuring head, the first fixing member is used to fix the measuring device and make the main body of the measuring device located on a plane parallel to the calibration device, the test chuck calibration device comprises a calibration needle, and the second fixing member is used to fix the test chuck calibration device when the test chuck calibration device is inserted into the second through hole of the calibration device.

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