Test board and switch device test equipment

Abstract

The invention relates to the technical field of semiconductors, and discloses a test board and switching device test equipment, and the test board comprises a switching device test circuit disposed on a PCB substrate. The switching device test circuit comprises a control module, a first driving module, a second driving module, and a first switching device and a second switching device which are used for forming a bridge arm structure, the control module is used for driving the first switching device through the first driving module and driving the second switching device through the second driving module; wherein the first switching device and the second switching device are respectively arranged on different surfaces of the PCB substrate. According to the different-plane layout mode, drain-source parasitic inductance between the upper tube and the lower tube is greatly reduced, so that signal interference and driving oscillation caused by parasitic parameters are reduced, and a test result is more accurate; and meanwhile, the voltage spike during turn-on and turn-off can be reduced, and the working performance of the device is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a test board and switch device testing equipment. Background Art

[0002] In power device testing, double-pulse testing is a commonly used method for evaluating the dynamic characteristics of power devices. This method provides important data support for the optimized design of drive circuits by accurately measuring the device's key electrical parameters during steady-state and transient conditions. However, in actual testing, test results are often significantly affected by circuit parasitic parameters, including parasitic inductance and capacitance. This phenomenon is particularly prominent in the testing of new high-speed switching devices such as gallium nitride devices. Due to the extremely high switching speeds of these devices, when the parasitic parameters in the circuit exceed a certain threshold, significant drive oscillations can occur during the device's turn-on or turn-off process. This not only affects the accuracy of the test results but can also potentially damage the device itself. Summary of the Invention

[0003] In view of this, the embodiments of the present application provide a test board and a switching device testing device, which can effectively solve the problem in the prior art that due to the large parasitic parameters in the circuit, significant driving oscillation is caused during the opening or closing process of the device, affecting the accuracy of the test results of the device, and even causing potential damage to the device itself.

[0004] In a first aspect, an embodiment of the present application provides a test board, the test board including a switching device test circuit disposed on a PCB substrate, the switching device test circuit including: a control module, a first driving module, a second driving module, and a first switching device and a second switching device for forming a bridge arm structure;

[0005] The control module is configured to drive the first switching device through the first driving module, and drive the second switching device through the second driving module;

[0006] The first switching device and the second switching device are respectively arranged on different surfaces of the PCB substrate.

[0007] In some embodiments, the first switching device and the second switching device disposed on different surfaces of the PCB substrate are electrically connected via through holes and / or pads.

[0008] In some embodiments, the first driving module and the second driving module are respectively arranged adjacent to the control module on the test board.

[0009] In some embodiments, the first driving module and the second driving module both include magnetic beads, one end of each magnetic bead is used to electrically connect to the control module, and the other end of each magnetic bead is used to connect to the control end of each corresponding switching device.

[0010] In some embodiments, the first driving module and the second driving module both include diodes, the anode of each diode is respectively used to connect to one end of each corresponding magnetic bead, and the cathode of each diode is respectively used to connect to the control end of each corresponding switching device.

[0011] In some embodiments, the switching device test circuit further includes a sampling module, one end of the sampling module is used to input a power signal, and the other end of the sampling module is electrically connected to the bridge arm structure.

[0012] In some embodiments, the sampling module is arranged on the test board adjacent to the bridge arm structure.

[0013] In some embodiments, the switching device test circuit further includes: a filtering module, which is connected in parallel with the bridge arm structure and is disposed adjacent to the bridge arm structure.

[0014] In some embodiments, the switching device test circuit further includes an inductor connected in parallel with the first signal terminal and the second signal terminal of the first switching device.

[0015] In a second aspect, an embodiment of the present application provides a switching device testing device, wherein the switching device testing device includes at least one test board described in the first aspect.

[0016] The embodiments of the present application have the following beneficial effects:

[0017] The test board of the present application includes a switch device test circuit arranged on a PCB substrate, and the switch device test circuit includes: a control module, a first drive module, a second drive module, and a first switch device and a second switch device for forming a bridge arm structure; the control module is used to drive the first switch device through the first drive module, and drive the second switch device through the second drive module; wherein, the first switch device and the second switch device are respectively arranged on different surfaces of the PCB substrate. This eccentric layout method greatly reduces the drain-source parasitic inductance between the upper and lower tubes, thereby reducing signal interference and drive oscillation caused by parasitic parameters, improving the stability of the circuit under high-frequency working conditions, and making the test results more accurate. At the same time, it can reduce the voltage spikes during opening and closing, and improve the working performance of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A circuit diagram of a double pulse test circuit according to an embodiment of the present application is shown;

[0020] Figure 2 A schematic diagram of the PCB layout of a test board according to an embodiment of the present application is shown;

[0021] Figure 3 A schematic diagram of the component layout on one side of a PCB of a test board according to an embodiment of the present application is shown;

[0022] Figure 4 A schematic diagram showing the layout of the other side of the PCB of the test board according to an embodiment of the present application is shown;

[0023] Figure 5 A schematic diagram of the component layout on the other side of the PCB of the test board according to an embodiment of the present application is shown.

[0024] Description of main component symbols:

[0025] 11: control module; 12: first driving module; 13: second driving module; 14: sampling module; 15: filtering module. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0027] The components of the embodiments of the present application generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but rather merely represents selected embodiments of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative effort are within the scope of protection of the present application.

[0028] Hereinafter, the terms "including", "having" and their cognates used in various embodiments of the present application are intended only to indicate specific features, numbers, steps, operations, elements, components or combinations of the aforementioned items, and should not be understood as excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the aforementioned items or adding the possibility of one or more features, numbers, steps, operations, elements, components or combinations of the aforementioned items. In addition, the terms "first", "second", "third" and the like are only used to distinguish descriptions and should not be understood as indicating or implying relative importance.

[0029] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which the various embodiments of the present application belong. The terms (such as those defined in generally used dictionaries) will be interpreted as having the same meaning as in the context of the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning unless clearly defined in the various embodiments of the present application.

[0030] In the embodiment of the present application, the control end of the power device may refer to the gate of the power device; in one possible embodiment, the first signal end of the power device may refer to the source, and the second signal end may refer to the drain; in another possible embodiment, the second signal end of the power device may refer to the source, and the first signal end may refer to the drain.

[0031] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0032] Power semiconductor devices are semiconductor devices specifically designed to control and convert electrical power. They are widely used in a wide range of fields, including power management, motor drives, renewable energy generation, and electric vehicles. They operate under high voltage and high current conditions and feature fast switching characteristics, enabling efficient energy conversion. Power devices include metal oxide field-effect transistors (MOSFETs), insulated gate bipolar transistors (IGBTs), bipolar junction transistors (BJTs), silicon carbide (SiC), and gallium nitride (GaN) devices.

[0033] Gallium nitride devices, a wide-bandgap semiconductor material, utilize a heterojunction structure between GaN and other materials to form a high-concentration, high-mobility "two-dimensional electron gas" at the interface, enabling high-speed, low-loss current control. Compared with traditional power devices, gallium nitride devices offer higher efficiency, faster switching speeds, and a smaller size. Due to their high frequency, low loss, and small size, gallium nitride devices are widely used in scenarios such as fast charging, 5G power supplies, and in-vehicle OBCs. However, their high-speed switching characteristics place higher demands on testing technology, requiring precise capture of dynamic processes and assessment of ultimate stress reliability.

[0034] The switching device in the embodiment of the present application may be a gallium nitride device. In one possible embodiment, the switching device may be a metal oxide field effect transistor; in another possible embodiment, the switching device may also be an insulated gate bipolar transistor; in another possible embodiment, the switching device may also be a silicon carbide device.

[0035] Specifically, dynamic characteristic testing of GaN devices is divided into single-pulse and double-pulse tests. Single-pulse testing only simulates a single switching process and cannot replicate the "inductive load freewheeling + reverse recovery" scenario in actual applications. GaN devices have lower parasitic capacitance and faster switching speeds. While single-pulse testing can provide a preliminary assessment of turn-off and turn-on characteristics, it cannot reflect the actual losses and stresses associated with high-frequency continuous switching.

[0036] The double-pulse test simulates a complete cycle of "on-off-on again" through two pulse triggering. Specifically, the GaN device is first turned on to charge the load inductor. After reaching the test current, the GaN device is turned off, and the load inductor current flows through the freewheeling diode of the GaN device to achieve inductive load freewheeling. Then the GaN device is turned on again. The freewheeling diode generates a reverse recovery current due to the carrier storage effect, realizing the reverse recovery process. The double-pulse test can collect the waveforms of the driving voltage, drain-source voltage, and drain current, and calculate the switching delay time, voltage / current rise / fall time, change rate, and switching loss.

[0037] However, the existing double-pulse test circuits contain parasitic inductance and capacitance, which may cause additional voltage oscillations. For GaN devices, the oscillations are more severe due to the high switching frequency, making the impact of parasitic inductance and capacitance on the test results non-negligible.

[0038] Considering the existing problems of large parasitic parameters in the circuit, which lead to significant drive oscillation during the device's opening or closing process, affecting the accuracy of the device's test results and even causing potential damage to the device itself, the present application provides a test board and switch device test equipment. This off-plane layout method greatly reduces the drain-source parasitic inductance between the upper and lower tubes, thereby reducing signal interference and drive oscillation caused by parasitic parameters, improving the circuit's stability under high-frequency operating conditions, and making the test results more accurate. At the same time, it can reduce voltage spikes during opening and closing, improving the device's operating performance.

[0039] The test board is described below with reference to some specific embodiments.

[0040] As an optional solution, Figure 1 The figure shows a circuit diagram of a double pulse test circuit. Figure 2 and Figure 4 Shown Figure 1 A PCB layout diagram of a pulse test circuit; Figure 3 and Figure 5 Shown Figure 1 A component layout diagram of a pulse test circuit.

[0041] PCB, short for printed circuit board, is a fundamental component used to support and connect electronic components in electronic devices. Comprising a substrate, copper layer, solder mask, and silkscreen, PCBs achieve electrical connections by creating conductive patterns on an insulating substrate. These patterns, typically etched from copper foil, can form complex circuit networks. PCBs make connections between electronic components more stable and reliable, and greatly simplify the assembly process of electronic products.

[0042] PCB layout design is a critical step in the manufacturing process of electronic devices. It involves arranging the positions of various electronic components on the PCB and connecting these components with wires to achieve the desired circuit functions.

[0043] The PCB layout diagram includes the position of each component, signal routing, vias, etc., and can be drawn using software such as AltiumDesigner, Cadence Allegro, KiCad, etc.

[0044] Exemplarily, the test board includes a switching device test circuit provided on a PCB substrate, the switching device test circuit including: a control module 11, a first driving module 12, a second driving module 13, and a first switching device Q1 and a second switching device Q2 for forming a bridge arm structure;

[0045] Among them, the control module 11 can be a control chip U1, and the control module 11 is electrically connected to the input end of the first driving module 12 and the input end of the second driving module 13 respectively. The output end of the first driving module 12 is connected to the control end of the first switching device Q1, and the output end of the second driving module 13 is connected to the control end of the second switching device Q2. The second signal end of the first switching device Q1 is connected to the first signal end of the second switching device Q2 to form a bridge arm structure. The first signal end of the first switching device Q1 and the second signal end of the second switching device Q2 serve as the input ends of the bridge arm structure for inputting power signals. It can be understood that the power supply providing the power signal can be set on the test board to power the bridge arm structure; or, the power supply providing the power signal is connected to the test board as an external power supply to power the bridge arm structure.

[0046] It is understood that the switching device test circuit further includes an inductor L connected in parallel with the first signal terminal and the second signal terminal of the first switching device Q1. The inductor L is used to store and release energy, thereby effectively evaluating the performance of the power device.

[0047] Exemplarily, the PCB substrate is a double-sided board, wherein the first switching device Q1 and the second switching device Q2 are respectively arranged on different sides of the PCB substrate. Figure 2 As shown, the first switching device Q1 is arranged on one side of the PCB substrate, and the second switching device Q2 is arranged on the other side of the PCB substrate. The first switching device Q1 and the second switching device Q2 can be connected through the interlayer wiring of the PCB substrate, and the first switching device Q1 can also be directly connected to the second switching device Q2 through a through hole or a pad.

[0048] Among them, a through hole refers to a small hole used to connect the conductive paths between different layers. It realizes the function of internal electrical connection of a multi-layer PCB board by physically connecting the circuit on one layer with the circuit on another layer. The soldering pad is used to connect electronic components and circuits in surface mounting technology and through-hole technology. The soldering pad provides a soldering point so that the electronic component can be firmly fixed on the PCB through the soldering process and realize electrical connection. Exemplarily, the S1 pin of the first switching device Q1 is connected through various through holes (such as Figure 2 Vio3) is connected to the D2 pin of the second switching device Q2.

[0049] Specifically, the S1 pin of the first switching device Q1 can be connected to the D2 pin of the second switching device Q2 through a through hole; the S1 pin of the first switching device Q1 can be connected to the D2 pin of the second switching device Q2 through a pad; the S1 pin of the first switching device Q1 can be connected to the D2 pin of the second switching device Q2 through a through hole and a pad.

[0050] The control module 11 is used to drive the first switching device Q1 through the first driving module 12, and drive the second switching device Q2 through the second driving module 13. It can be understood that the high-voltage isolation probe obtains the drain-source voltage, and the current probe is used to obtain the current flowing through the second switching device Q2.

[0051] Specifically, when using a dual-pulse test circuit to evaluate switching losses, two pulse signals are required to be provided to the second switching device Q2 to be tested. The first pulse signal is used to test the turn-off loss, and the second pulse signal is used to test the turn-on loss. Specifically, the control module 11 controls the second switching device Q2 to be turned on through the driver module, and the first switching device Q1 to be turned off. The inductor connected in parallel with the first signal terminal and the second signal terminal of the first switching device Q1 is charged. After reaching the required test current, the second switching device Q2 is controlled to be turned off. At the moment when the second switching device Q2 is turned off, that is, at the falling edge of the pulse signal input to the second switching device Q2, the turn-off loss is tested. The inductor current is freewheeled through the freewheeling diode of the first switching device Q1, achieving freewheeling of the inductive load. Then, the second switching device Q2 is turned on again. The freewheeling diode generates a reverse recovery current due to the carrier storage effect, achieving a reverse recovery process. At the moment when the second switching device Q2 is turned on, that is, at the rising edge of the pulse signal input to the second switching device Q2, the turn-on loss is tested.

[0052] In this embodiment, the first switching device Q1 and the second switching device Q2 are placed on different layers of the PCB, and their source and drain electrodes are directly connected via vias or pads. This significantly shortens the connection path, reduces the parasitic inductance between the drain and source of the switching devices, reduces voltage spikes during switching and shutting off, and improves device performance. Furthermore, by reducing parasitic inductance, the device's stability under high-frequency operating conditions is enhanced, reducing signal interference and drive oscillation caused by parasitic parameters.

[0053] In one embodiment, if Figure 1 As shown, the first driver module 12 and the second driver module 13 have the same structure, both including a magnetic bead, a diode, and a resistor. One end of each magnetic bead is electrically connected to the control module 11, and the other end of each magnetic bead is connected to the control terminal of each corresponding switching device. The anode of each diode is connected to one end of each corresponding magnetic bead, and the cathode of each diode is connected to the control terminal of each corresponding switching device.

[0054] Specifically, the first driving module 12 includes a magnetic bead FB1, a diode Diode1, a resistor R1 and a resistor R2, wherein one end of the magnetic bead FB1 is connected to the control end of the first switching device Q1, the other end of the magnetic bead FB1 is connected to the positive electrode of the diode Diode1, the negative electrode of the diode Diode1 is connected to one end of the resistor R1, the other end of the resistor R1 is electrically connected to the control module 11, one end of the resistor R2 is connected to the other end of the magnetic bead FB1, and the other end of the resistor R2 is connected to the other end of the resistor R1; the second driving module 13 includes a magnetic bead FB2, a diode Diode2, a resistor R3 and a resistor R4, wherein one end of the magnetic bead FB2 is connected to the control end of the first switching device Q1, the other end of the magnetic bead FB2 is connected to the positive electrode of the diode Diode2, the negative electrode of the diode Diode2 is connected to one end of the resistor R3, the other end of the resistor R3 is electrically connected to the control module 11, one end of the resistor R4 is connected to the other end of the magnetic bead FB2, and the other end of the resistor R4 is connected to the other end of the resistor R3.

[0055] Diodes Diode1 and Diode2 are fast-recovery diodes. They provide a low-impedance path, allowing parasitic current to flow through the diodes to the reference point, preventing spike voltages from damaging power devices or affecting circuit stability. Resistors limit gate current, preventing damage to control module 11 due to overcurrent and protecting power devices from gate overvoltage. Magnetic beads also suppress high-frequency oscillations, reducing parasitic parameters in the drive circuit.

[0056] The first driver module 12 and the second driver module 13 are respectively arranged adjacent to the control module 11 on the test board. The components of each driver module are placed as close as possible to the control module 11, thereby shortening the distance between the control module 11 and the first switching device Q1 and the second switching device Q2, reducing the overall length of the drive circuit, and significantly reducing parasitic parameters.

[0057] Furthermore, the switching device test circuit also includes a sampling module 14. One end of the sampling module 14 is used to input a power signal, and the other end of the sampling module 14 is electrically connected to the bridge arm structure. Specifically, a single resistor or multiple resistors can be provided in the sampling module 14. The sampling module 14 is formed by connecting the multiple resistors in series or in parallel. Exemplarily, the sampling module 14 includes a sampling resistor RS1, a sampling resistor RS2, a sampling resistor RS3, a sampling resistor RS4, and a sampling resistor RS5. The sampling resistors are connected in parallel to form the sampling module 14.

[0058] Exemplarily, sampling module 14 is disposed between the source of second switching device Q2 and the negative power supply terminal to collect the current waveform flowing through second switching device Q2. Sampling module 14 is positioned adjacent to the bridge arm structure on the test board. Each sampling resistor is placed near the source of second switching device Q2 to reduce parasitic parameters between the sampling resistor and the source, thereby improving the accuracy of the test results.

[0059] The switch device test circuit further includes a filter module 15, which is connected in parallel with the bridge arm structure and is arranged in a position adjacent to the bridge arm structure. Figure 1 As shown, the filtering module 15 includes capacitor C1, capacitor C2, capacitor C3 and capacitor C4, wherein capacitor C1 and capacitor C2 are connected in parallel to form a capacitor group, capacitor C3 and capacitor C4 are connected in parallel to form a capacitor group, and the two capacitor groups are connected in series to form the filtering module 15. Connecting the two capacitors in parallel can increase the local capacity and enhance the filtering effect. By connecting the capacitor groups in series, the voltage can be shared, the pressure on each capacitor can be reduced, and the capacitor can be ensured to work stably under high voltage and high frequency conditions, thereby improving the reliability and performance of the entire circuit.

[0060] The capacitors of each filter module 15 are placed close to the drain of the first switching device Q1 and the source of the second switching device Q2, which can further reduce parasitic parameters in the power loop.

[0061] The present application also provides a switching device testing device. Exemplarily, the switching device testing device includes the above-mentioned test board. It can be understood that the switching device testing device can set a power supply to power the test board, and the switching device testing device can also be connected to an external power supply to power the test board.

[0062] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and structure diagrams in the accompanying drawings show the possible architectures, functions and operations of the devices, methods and computer program products according to the multiple embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of the code, and the module, program segment or a part of the code contains one or more executable instructions for implementing the specified logical functions. It should also be noted that in an alternative implementation, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the structure diagram and / or flowchart, and the combination of boxes in the structure diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified function or action, or can be implemented using a combination of dedicated hardware and computer instructions.

[0063] In addition, the functional modules or units in the various embodiments of the present application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0064] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for enabling a computer device (which can be a smart phone, personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application.

[0065] The above is only a specific implementation method of the present application, but the scope of protection of the present application is not limited thereto. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed in this application, which should be covered by the scope of protection of the present application.

Claims

1. A test board, characterized in that: The test board includes a switch device test circuit provided on a PCB substrate, wherein the switch device test circuit includes: a control module, a first drive module, a second drive module, and a first switch device and a second switch device for forming a bridge arm structure; The control module is configured to drive the first switching device through the first driving module, and drive the second switching device through the second driving module; The first switching device and the second switching device are respectively arranged on different surfaces of the PCB substrate.

2. The test board according to claim 1, characterized in that The first switching device and the second switching device, which are arranged on different surfaces of the PCB substrate, are electrically connected through through holes and / or pads.

3. The test board according to claim 1, characterized in that The first driving module and the second driving module are respectively arranged adjacent to the control module on the test board.

4. The test board according to claim 1, characterized in that The first driving module and the second driving module both include magnetic beads, one end of each magnetic bead is used to be electrically connected to the control module, and the other end of each magnetic bead is used to be connected to the control end of each corresponding switching device.

5. The test board according to claim 4, characterized in that The first driving module and the second driving module both include diodes, the anode of each diode is respectively used to connect to one end of each corresponding magnetic bead, and the cathode of each diode is respectively used to connect to the control end of each corresponding switching device.

6. The test board according to claim 1, characterized in that The switching device test circuit further includes a sampling module, one end of the sampling module is used to input a power supply signal, and the other end of the sampling module is electrically connected to the bridge arm structure.

7. The test board according to claim 6, characterized in that The sampling module is arranged on the test board adjacent to the bridge arm structure.

8. The test board according to claim 1, characterized in that The switching device test circuit further includes a filter module, which is connected in parallel with the bridge arm structure and is arranged in a position adjacent to the bridge arm structure.

9. The test board according to claim 1, wherein: The switching device test circuit further includes an inductor connected in parallel with the first signal terminal and the second signal terminal of the first switching device.

10. A switching device testing device, characterized in that: The switching device testing equipment comprises: a testing board according to any one of claims 1-9.

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