Probe station and test system

Abstract

The application relates to the technical field of semiconductor testing equipment, and proposes a probe station and a testing system. The probe station comprises a testing frame, a slide stage module, a probe module and an image acquisition module. The probe station comprises an integrally-formed frame body and a mounting table. In the Z-axis direction, the frame body is provided with a through accommodating cavity, the mounting table is provided with a through groove communicating with the accommodating cavity, and the mounting table is located on the upper side of the frame body and partially covers the accommodating cavity. The slide stage module is located in the accommodating cavity, the slide stage module comprises a first driving assembly and a slide stage, the first driving assembly is connected with the frame body, and the slide stage is connected with the first driving assembly. The probe module comprises a second driving assembly and a probe, the second driving assembly is connected with the mounting table, and the probe is connected with the second driving assembly. The image acquisition module is connected with the mounting table, and the image acquisition module comprises an acquisition part which is located above the through groove. The testing system comprises at least two probe stations. The probe station and the testing system can improve the testing precision and reliability.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor testing equipment, in particular to a probe station and a testing system. BACKGROUND

[0002] In the technical field of semiconductor testing, the electrodes of a wafer core particle are contacted by the probes of a probe station to realize powered testing of the core particle, so as to find and eliminate unqualified core particles in the wafer manufacturing stage and improve the packaging yield. However, the current probe station testing frame usually adopts a split type connection structure, which is prone to micro movement or deformation under external excitation or impact, resulting in misalignment of the contact position of the probe and the electrode, poor testing accuracy and reliability. SUMMARY

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a probe station capable of improving testing accuracy and reliability.

[0004] The present application also provides a testing system having the above probe station.

[0005] According to the probe station of the embodiments of the present application, the probe station comprises a testing frame, a slide stage module, a probe module and an image acquisition module;

[0006] The testing frame comprises an integrally formed frame body and a mounting table. In the Z-axis direction, the frame body is provided with a through accommodating cavity, and the mounting table is provided with a through slot. The mounting table is located on the upper side of the frame body and partially covers the accommodating cavity, and the through slot communicates with the accommodating cavity.

[0007] The slide stage module is located in the accommodating cavity. The slide stage module comprises a first driving assembly and a slide stage. The first driving assembly is connected with the frame body, and the slide stage is connected to the output end of the first driving assembly. The first driving assembly is used to drive the slide stage to move.

[0008] The probe module comprises a second driving assembly and a probe. The second driving assembly is connected with the mounting table, and the probe is connected to the output end of the second driving assembly. The second driving assembly is used to drive the probe to move in the Z-axis direction, so that the probe can enter or exit the accommodating cavity through the through slot.

[0009] The image acquisition module is connected with the mounting table. The image acquisition module comprises an acquisition part, and the acquisition part is located above the through slot.

[0010] According to the probe station provided in the embodiments of the present application, the following beneficial effects are achieved: the wafer table module can be arranged in the accommodating cavity from the bottom of the accommodating cavity, the wafer table is used for carrying a wafer, the first driving assembly is used for driving the wafer table to move in the accommodating cavity to carry the wafer to the lower side of the through slot, the second driving assembly is used for driving the probe to extend into the accommodating cavity through the through slot, so that the probe can contact the wafer on the wafer table to perform testing, and meanwhile, the image acquisition part can acquire an image of the wafer through the through slot. Based on this, the wafer table module is arranged on the frame body, the probe module and the image acquisition module are arranged on the mounting table, and the frame body and the mounting table are integrally formed, so that the test frame can more effectively resist slight movement or deformation caused by external excitation, vibration and other factors, thereby, during the testing operation, the relative positions of the wafer table module, the probe module and the image acquisition module are more determined, and then, stable image acquisition and precise contact between the probe and the electrode are facilitated, and the testing precision and reliability are improved.

[0011] According to some embodiments of the present application, the first driving assembly comprises an X-axis moving platform and a Y-axis moving platform, the wafer table is connected with the X-axis moving platform, the X-axis moving platform is movably connected with the Y-axis moving platform along the X-axis direction, the Y-axis moving platform is movably connected with the frame body along the Y-axis direction, and the X-axis moving platform is located between the Y-axis moving platform and the wafer table along the Z-axis direction.

[0012] According to some embodiments of the present application, along the X-axis direction, the opposite two sides of the Y-axis moving platform are movably connected with the opposite two sides of the frame body one by one.

[0013] According to some embodiments of the present application, the first driving assembly comprises an X-axis moving platform, and the wafer table is rotationally connected to the X-axis moving platform around the Z-axis direction.

[0014] According to some embodiments of the present application, the probe station comprises two probe modules, and along the X-axis direction, the probe modules are arranged at two ends of the through slot at intervals, and the X-axis direction is perpendicular to the Z-axis direction.

[0015] According to some embodiments of the present application, the image acquisition module further comprises an image acquisition seat and an acquisition device, the image acquisition seat is connected with the mounting table, the acquisition device is connected with the image acquisition seat, the acquisition device comprises an image acquisition part, and the acquisition device is arranged in extension along the Y-axis direction, and the Y-axis direction is perpendicular to the Z-axis direction.

[0016] According to some embodiments of the present application, the probe station further comprises a testing module, the testing module is connected with the frame body, along the Z-axis direction, the first driving assembly is provided with a testing channel, and the wafer table covers one side of the testing channel away from the testing module.

[0017] The wafer table is of a transparent structure.

[0018] According to some embodiments of the present application, the test rack further comprises a support structure, the support structure comprising a first connecting rod, a second connecting rod, a third connecting rod, a fourth connecting rod and a connecting rod, one end of the connecting rod connecting the first connecting rod and the second connecting rod, the other end of the connecting rod connecting the third connecting rod and the fourth connecting rod, the first connecting rod, the second connecting rod, the third connecting rod and the fourth connecting rod being connected to the mounting table at one end away from the connecting rod, and the first connecting rod and the third connecting rod being arranged obliquely to the upper side of the mounting table, the second connecting rod being perpendicular to the upper side of the mounting table.

[0019] According to some embodiments of the present application, the test rack further comprises a docking portion, the docking portion being connected to the rack body and / or the upper side of the mounting table, and the docking portion being arranged extending towards the side away from the mounting table, the lower side of the rack body being provided with a docking hole, and the projection area of the docking portion along the Z-axis direction being arranged one-to-one corresponding to the docking hole.

[0020] According to the test system of the embodiments of the present application, the test system comprises at least two probe tables of any of the above embodiments;

[0021] Wherein, along the Z-axis direction, the probe tables are arranged in layers;

[0022] And / or, along the vertical direction of the Z-axis, the probe tables are arranged adjacently.

[0023] According to the test system of the embodiments of the present application, at least the following beneficial effects are achieved: the probe tables can be flexibly arranged in layers or adjacently, which is convenient for better adapting to different test environments, and the test system is more compact, which is beneficial to saving test space.

[0024] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0025] The present application will be further described below in conjunction with the drawings and embodiments, wherein:

[0026] Figure 1 FIG. 1 is a structural schematic diagram of a probe table according to an embodiment of the present application;

[0027] Figure 2 FIG. 2 is a side view of the probe table according to an embodiment of the present application;

[0028] Figure 3 FIG. 3 is a structural schematic diagram of a test rack according to an embodiment of the present application;

[0029] Figure 4 FIG. 4 is a structural schematic diagram of a slide table module according to an embodiment of the present application;

[0030] Figure 5 FIG. 5 is a structural schematic diagram of a probe module according to an embodiment of the present application;

[0031] Figure 6 is a front view of a probe station according to an embodiment of the present application;

[0032] Figure 7 is a structural schematic view of another perspective of a probe station according to an embodiment of the present application;

[0033] Figure 8 is a structural schematic view of a test system according to an embodiment of the present application.

[0034] Reference signs: test frame 100, frame body 110, accommodating cavity 111, docking hole 112, cavity opening 113, mounting table 120, through slot 121, mounting slot 122, support structure 130, first connecting rod 131, second connecting rod 132, third connecting rod 133, fourth connecting rod 134, connecting rod 135, docking part 140;

[0035] slide table module 200, first driving assembly 210, X-axis moving platform 211, Y-axis moving platform 212, test channel 213, slide table 220;

[0036] probe module 300, second driving assembly 310, probe 320;

[0037] image acquisition module 400, image acquisition seat 410, acquirer 420, acquisition part 421;

[0038] test module 500. DETAILED DESCRIPTION

[0039] Embodiments of the present application are described in detail below with reference to the accompanying drawings. Examples of the embodiments are shown in the drawings, in which the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are for the purpose of explaining the present application only, and are not to be understood as limiting the present application.

[0040] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings, and is only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as limiting the present application. The device or element indicated is necessarily constructed and operated in a particular orientation.

[0041] In the description of the present application, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, more than, etc. are understood as not including the number, above, below, etc. are understood as including the number. If it is described as first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of indicated technical features.

[0042] In the description of the present application, the words such as arrangement, installation, connection and the like should be understood in a broad sense, and the specific meanings of the words in the present application can be determined by the person skilled in the art in combination with the specific content of the technical solutions.

[0043] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0044] The embodiments of the present application are described below in combination with the accompanying drawings:

[0045] Reference Figures 1 to 5 According to the probe station of the embodiments of the present application, the test frame 100 includes an integrally formed frame body 110 and a mounting table 120. Along the Z-axis direction, the frame body 110 is provided with a through accommodating cavity 111, and the mounting table 120 is provided with a through groove 121. The mounting table 120 is located on the upper side of the frame body 110 and covers part of the accommodating cavity 111, and the through groove 121 communicates with the accommodating cavity 111. The slide table module 200 is located in the accommodating cavity, and the slide table module 200 includes a first driving assembly 210 and a slide table 220. The first driving assembly 210 is connected with the frame body 110, and the slide table 220 is connected to the output end of the first driving assembly 210. The slide table 220 is used for carrying a workpiece to be tested (such as a wafer), and the first driving assembly 210 is used for driving the slide table 220 to move to adjust the position of the slide table 220. The probe module 300 includes a second driving assembly 310 and a probe 320. The second driving assembly 310 is connected with the mounting table 120, and the probe 320 is connected to the output end of the second driving assembly 310. The second driving assembly 310 is used for driving the probe 320 to move along the Z-axis direction, so that the probe 320 can enter or exit the accommodating cavity 111 through the through groove 121. The image acquisition module 400 is connected with the mounting table 120, and the image acquisition module 400 includes an acquisition part 421. The acquisition part 421 is located above the through groove 121.

[0046] Compared with the split test rack structure, the rack body 110 and the mounting table 120 of the test rack 100 are integrally formed, which can effectively resist the micro movement or deformation caused by external excitation, vibration and other factors, so that the relative positions of the slide table module 200, the probe module 300 and the image acquisition module 400 are more stable and determined during the working process. During the test process, the slide table module 200, the probe module 300 and the image acquisition module 400 cooperate with the integrally formed rack body 110 and mounting table 120, on the one hand, the stable rack body 110 structure provides guarantee for the contact precision of the probe 320 and the wafer electrode and the positioning precision of the image acquisition, on the other hand, the modules work cooperatively based on the stable relative position relationship, which is beneficial to improve the stability of the electrical signal transmission and the accuracy of the image auxiliary data during the test process of the probe table, and is beneficial to improve the test precision and reliability of the probe table.

[0047] Reference Figures 1 to 5 Specifically, along the Z-axis direction, the mounting table 120 covers a part of the upper side of the accommodating cavity 111, and the area of the accommodating cavity 111 not covered by the mounting table 120 can facilitate the wafer pick-and-place operation, and the slide table module 200 can be loaded into the accommodating cavity 111 on the lower side of the accommodating cavity 111, thereby ensuring the assembly between the slide table module 200 and the integrally formed test rack 100. During the wafer core particle power-on test, the slide table 220 carries the wafer, the first driving assembly 210 drives the slide table 220 to move along the X-axis direction and / or the Y-axis direction, moves the slide table 220 to the lower side of the mounting table 120, and aligns the wafer test part with the through slot 121, so that the second driving assembly 310 drives the probe 320 to move along the Z-axis, and the probe 320 enters the accommodating cavity 111 through the through slot 121 and contacts the electrode of the wafer core particle. The slide table module 200 can be a structure composed of a slide rail and a slide block mechanism and a slide table carrying plate, the slide rail and slide block mechanism can provide stable movement guidance for the slide table carrying plate, and the power source of the first driving assembly 210 and the second driving assembly 310 can be a motor and a screw nut combination structure, or a driving structure composed of a pneumatic cylinder or an electric push rod.

[0048] The acquisition part 421 can be an acquisition structure composed of an industrial camera and a lens. During the above-mentioned position adjustment of the slide table 220 and the position adjustment of the probe 320, the image information acquired by the acquisition part 421 can provide real-time position feedback for the position adjustment of the slide table 220 and the probe 320, which is beneficial to the calibration of the positions of the slide table 220 and the probe 320 by the operator or the control system, so that the contact position of the probe 320 and the wafer electrode is more in line with the test requirements, and the movement and positioning of the slide table 220 are more accurate.

[0049] It should be noted that the Z-axis direction can be a vertical direction, along the Z-axis direction, each structure can include opposite upper side and lower side, upper and lower, the X-axis direction and the Y-axis direction are horizontal directions, the X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other.

[0050] Reference Figure 3 And Figure 4 In some embodiments, the first driving assembly 210 includes an X-axis moving platform 211 and a Y-axis moving platform 212 for realizing position adjustment of the wafer table 220 in the plane direction. The wafer table 220 is connected with the X-axis moving platform 211 along the X-axis direction, the X-axis moving platform 211 is movably connected with the Y-axis moving platform 212 along the Y-axis direction, the Y-axis moving platform 212 is movably connected with the frame body 110 along the Z-axis direction, the X-axis moving platform 211 is located between the Y-axis moving platform 212 and the wafer table 220, and the X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other.

[0051] Specifically, the Y-axis moving platform 212 and the frame body 110 are provided with a guide groove and a guide rail at corresponding positions, the guide rail is slidably arranged in the guide groove of the Y-axis moving platform 212, forming a sliding guide cooperation, and a motor and a screw nut transmission mechanism are connected on the frame body 110, and the nut pair of the screw nut transmission mechanism is fixedly connected with the Y-axis moving platform 212. When the motor is started and drives the screw to rotate, the screw nut pair moves linearly along the Y-axis direction, thereby driving the Y-axis moving platform 212 to move relative to the frame body 110 along the Y-axis direction. Similarly, the X-axis moving platform 211 and the Y-axis moving platform 212 also use the screw nut mechanism to realize relative movement, specifically, the X-axis moving platform 211 is matched with the guide groove on the Y-axis moving platform 212 through the guide rail, or the Y-axis moving platform 212 is matched with the guide groove on the X-axis moving platform 211 through the guide rail, and the relative displacement in the X-axis direction is realized through the screw nut transmission.

[0052] Therefore, when the Y-axis moving platform 212 moves relative to the frame body 110, since the wafer table 220 is connected with the X-axis moving platform 211, and the X-axis moving platform 211 is connected with the Y-axis moving platform 212, the wafer table 220 can be driven to adjust the position along the Y-axis direction. When the X-axis moving platform 211 moves relative to the Y-axis moving platform 212, the position adjustment of the wafer table 220 along the X-axis direction can be realized. Through the coordinated action of the X-axis moving platform 211 and the Y-axis moving platform 212, the plane position of the wafer table 220 can be adjusted, so that the to-be-measured position of the wafer carried by the wafer table 220 is aligned with the through slot 121 on the mounting table 120, and the detection of the wafer core particles at different positions on the wafer is realized.

[0053] Reference Figure 3 And Figure 4In some embodiments, the rack body 110 is provided with opposite left and right side walls along the X-axis direction or the Y-axis direction, and at least one side wall (e.g., the left side wall or the right side wall) of the rack body 110 is provided with a cavity opening 113 communicating with the accommodating cavity 111, the cavity opening 113 being sized to match the outer shape of the wafer table module 200 and allowing the wafer table module 200 to pass in and out of the accommodating cavity 111 through the cavity opening 113. Specifically, the wafer table module 200 includes a wafer table 220, an X-axis moving platform 211, and a Y-axis moving platform 212. When assembled, the wafer table 220 can be first connected to the X-axis moving platform 211, and the X-axis moving platform 211 can be then connected to the Y-axis moving platform 212 to form the complete wafer table module 200, and then the wafer table module 200 can be moved as a whole into the accommodating cavity 111 through the cavity opening 113. During the moving-in process, the guide rail of the Y-axis moving platform 212 is engaged with the guide groove on the rack body 110 (or the guide rail of the rack body 110 is engaged with the guide groove of the Y-axis moving platform 212), so that the wafer table module 200 is stably installed in the accommodating cavity 111. When the wafer table module 200 needs to be maintained or replaced, the wafer table module 200 can also be moved as a whole out of the accommodating cavity 111 through the cavity opening 113.

[0054] In addition, the X-axis moving platform 211 and the Y-axis moving platform 212 act in coordination to drive the wafer table 220 to move along the X-axis and / or the Y-axis direction, so that the wafer table 220 is partially moved out of the accommodating cavity 111 through the cavity opening 113, facilitating the loading and unloading of the wafer.

[0055] Reference Figure 6 In some embodiments, along the X-axis direction, opposite two sides of the Y-axis moving platform 212 are movably connected to opposite two sides of the rack body 110. Specifically, the connection between the Y-axis moving platform 212 and the rack body 110 can be achieved by a guide groove and a guide rail. Along the X-axis direction, a guide rail or a guide groove is arranged on each of the left and right sides of the Y-axis moving platform 212, and a guide groove or a guide rail is correspondingly arranged on the left and right side walls of the rack body 110, so that the guide rail of the Y-axis moving platform 212 is slidably connected to the guide groove of the rack body 110, or the guide groove of the Y-axis moving platform 212 is slidably connected to the guide rail of the rack body 110. Thus, along the Z-axis direction, the guide rail and the guide groove are integrated with the Y-axis moving platform 212 in the thickness range of the left and right side walls of the Y-axis moving platform 212 in the Z-axis direction, without occupying additional external space along the Z-axis direction. Compared with the movable connection between the upper side or the lower side of the Y-axis moving platform 212 along the Z-axis direction and the rack body 110, the thickness overlap is avoided, which is beneficial to reduce the overall height of the probe table along the Z-axis direction.

[0056] Therefore, the reduction of the overall height of the probe station makes the center of gravity of the entire test system correspondingly lower, so that the test system can maintain a more stable posture when subjected to external excitation or vibration, reducing the shaking or displacement caused by the high center of gravity, and benefiting the improvement of the stability of the position of the wafer stage 220 and the precision of the cooperation of each module during the test process. In addition, when multiple probe stations need to be stacked on the production line, the reduction of the height of a single probe station can significantly reduce the vertical space occupied when stacked, so that more equipment can be deployed in the limited height of the production line, which is beneficial to saving the space of the production line.

[0057] Reference Figure 4 In some embodiments, the first driving assembly 210 includes an X-axis moving platform 211, and the wafer stage 220 is rotationally connected to the X-axis moving platform 211 around the Z-axis direction to realize the rotational movement of the wafer stage 220 around the Z-axis direction, further improving the flexibility of the position adjustment of the wafer stage 220.

[0058] Reference Figure 4 And Figure 5 Specifically, the upper surface of the X-axis moving platform 211 is provided with a circular groove matching the outer periphery of the wafer stage 220 along the Z-axis direction, and the bottom area of the wafer stage 220 is embedded in the circular groove, so that the wafer stage 220 can rotate relative to the X-axis moving platform 211 around the Z-axis. The outer peripheral wall of the wafer stage 220 is provided with an annular tooth structure, and a driving motor is fixedly installed on the X-axis moving platform 211. The output shaft of the motor is in transmission connection with the outer peripheral wall of the wafer stage 220 through a synchronous belt. The tension of the synchronous belt is adjusted by a tension bearing arranged on the X-axis moving platform to ensure that the synchronous belt always maintains effective tension during transmission.

[0059] When the motor is started, the driving wheel drives the synchronous belt to rotate, and the synchronous belt drives the wafer stage 220 to rotate around the Z-axis direction through meshing, so as to adjust the angular position of the wafer on the wafer stage 220. Therefore, the position adjustment of the wafer stage 220 includes translational adjustment along the X-axis direction and along the Y-axis direction, and rotational adjustment around the Z-axis direction, i.e. having both position and angle adjustment capabilities in a two-dimensional plane, further improving the flexibility of the position adjustment of the wafer stage 220, so that the chip particles to be tested on the wafer can be adjusted to the optimal angle through rotation, and the probes 320 of the probe module 300 can be more accurately aligned.

[0060] When the wafer core particle is subjected to electrical testing, the stage 220 is adjusted to a target position by the X-axis moving platform 211 and the Y-axis moving platform 212, and then the angle of the wafer is further adjusted by rotating the stage 220 around the Z-axis direction, so that the electrode of the wafer core particle is completely aligned with the axis of the probe 320, which is beneficial to improve the stability of electrical signal transmission and the reliability of test results, and can compensate for the small mounting deviation of the wafer by active adjustment, thereby improving the adaptability of the probe station to complex test scenarios.

[0061] Reference Figure 4 In some embodiments, in order to detect the moving stroke and rotating stroke of the stage 220, photoelectric sensors are arranged at the ends of the guide rails or the circumference of the stage 220. Specifically, the photoelectric sensor includes a transmitting end and a receiving end, and can be designed in a reflection type or a transmission type. For detection of linear motion, photoelectric sensors are installed at the ends of the guide rails of the X-axis moving platform 211 or the Y-axis moving platform 212 (i.e. stroke limit positions), and the transmitting end and the receiving end are arranged on the two sides or the same side of the guide rail. When the stage 220 moves to the end of the guide rail with the moving platform, the edge of the stage 220 or the moving platform triggers the sensor, so that an electrical signal change is generated. For detection of rotating stroke, a ring-shaped sensing area is arranged on the circumferential edge of the stage 220, and photoelectric sensors are installed on the X-axis moving platform 211. By detecting the scale or mark of the ring-shaped area, the rotating angle of the stage 220 can be monitored in real time.

[0062] Reference Figure 5 And Figure 6 In some embodiments, the probe station includes two probe modules 300, which are arranged at the two ends of the through slot 121 along the X-axis direction, and the X-axis direction is perpendicular to the Z-axis direction, so as to facilitate the independent driving and cooperative operation of the double probes 320, and the probes 320 can be more accurately aligned with the electrodes of the wafer core particle.

[0063] Reference Figures 1 to 5 Specifically, the through slot 121 penetrates the mounting table 120 and communicates with the containing cavity 111, and is used to expose the wafer on the stage 220. Along the X-axis direction, the left end and the right end of the through slot 121 are respectively provided with mounting slots 122, and the second driving assemblies 310 of the two probe modules 300 are respectively installed in the mounting slots 122. Each second driving assembly 310 independently drives one probe 320 to move along the Z-axis direction, so that the position adjustment of the two probes 320 in the Z-axis direction is decoupled (i.e. the two probes 320 can have different Z-axis positions), so as to adapt to the differences in height or spatial position of the electrodes of the wafer core particle.

[0064] Each second driving assembly 310 comprises a driving motor, a transmission belt, a screw nut mechanism and a probe base. The driving motor is fixed to the probe base, the motor output shaft is connected to a driving wheel, the transmission belt is arranged around the driving wheel and a driven wheel at the end of the screw rod, forming a transmission connection. When the driving motor rotates, the transmission belt drives the screw rod to rotate, and the screw nut pair converts the rotary motion into linear motion along the Z-axis direction, thereby driving the probe 320 connected with the screw nut pair to move up and down independently, realizing accurate adjustment of the respective Z-axis position, and effectively adapting to the electrode height difference caused by factors such as warping and uneven thickness of the wafer surface.

[0065] The probe base can adopt a precision sliding table structure, and the fine adjustment function is realized through a screw micrometer mechanism. The fixed base plate of the precision sliding table is connected with the bottom of the mounting groove 122, the sliding table body is slidably connected with the fixed base plate through a linear guide rail, the screw micrometer is installed on one side of the fixed base plate, and the screw rod end of the screw micrometer is fixed with the sliding table body, so as to realize the position fine adjustment of the probe 320 along the X-axis direction or the Y-axis direction, so as to compensate for the wafer placement deviation or mechanical assembly error.

[0066] Reference Figures 1 to 4 In some embodiments, the image acquisition module 400 further comprises an image acquisition seat 410 and an acquirer 420. The image acquisition seat 410 is connected with the mounting table 120, and the acquirer 420 is connected with the image acquisition seat 410. The acquirer 420 comprises an acquisition part 421, and the acquirer 420 is arranged in extension along the Y-axis direction which is perpendicular to the Z-axis direction, so as to reduce the height occupation of the acquirer 420 in the Z-axis direction, and further reduce the height of the probe table in the Z-axis direction.

[0067] Specifically, the image acquisition seat 410 can adopt a precision sliding table structure to realize the fine adjustment of the position of the acquirer 420 along the X-axis direction and / or the Y-axis direction, so that the acquisition part 421 of the acquirer 420 can be aligned with the through groove 121 along the Z-axis direction, thereby clearly acquiring the wafer image. The acquirer 420 can be a horizontal CCD (Charge-Coupled Device, charge-coupled device). When the probe module 300 is arranged in two intervals along the X-axis direction, the acquirer 420 extends to the space between the two probe modules 300 along the Y-axis direction, so that the acquisition part 421 is located in the region between the two probe modules 300, and the probes 320 of the two probe modules 300 are both within the image acquisition range of the acquisition part 421.

[0068] During the test process, the collector 421 collects images of the wafer on the wafer table 220 through the through slot 121 to provide visual feedback for the position adjustment of the wafer table 220 and the probe 320. Since the collector 420 is arranged in extension along the Y-axis direction, the height of the collector 420 in the Z-axis direction is significantly reduced, so that the center of gravity of the image collection module 400 is closer to the mounting table 120, thereby helping to reduce the center of gravity of the probe table as a whole. This design can enhance the stability of the probe table during the test process and reduce the shaking caused by the high center of gravity, thereby providing a more stable mechanical environment for the contact test between the probe 320 and the wafer.

[0069] With reference to Figure 6 and Figure 7 In some embodiments, the probe table further comprises a test module 500 connected with the frame 110, and along the Z-axis direction, the first driving assembly 210 is provided with a test passage 213, and the wafer table 220 covers a side of the test passage 213 away from the test module 500, wherein the wafer table 220 is configured as a transparent structure. Specifically, along the Z-axis direction, the first driving assembly 210 is internally provided with the through test passage 213 perpendicular to the bearing plane of the wafer table 220, the wafer table 220 covers a side of the test passage 213 away from the test module 500, and the wafer table 220 is configured as a transparent structure, for example, made of transparent materials such as glass and quartz, to ensure that the detection signal can penetrate the wafer table 220.

[0070] The test module 500 can be a spectrometer, a radiation test system or other equipment with optical or radiation detection function. When the wafer table module 200 is moved to the directly below the mounting table 120 by the driving of the first driving assembly 210, the detection signal (such as light, radiation, etc.) emitted by the test module 500 passes through the test passage 213 along the Z-axis direction upward and penetrates the transparent wafer table 220 to irradiate the wafer surface, thereby realizing the non-contact detection of the optical properties, material properties and other parameters of the wafer.

[0071] Therefore, the probe table of the present application can realize diversified detection of the wafer through the cooperation of the test module 500 and the transparent wafer table 220 without removing the wafer table 220. Since the wafer table 220 is made of transparent material and covers the test passage 213, the detection signal can directly penetrate the wafer table 220 without complex optical path adjustment or wafer table 220 avoiding action, thereby reducing signal attenuation and position deviation in the detection process and being beneficial to improve the detection efficiency and data accuracy. The provision of the test passage 213 provides a dedicated transmission path for the detection signal, avoids interference with other components, and ensures the stability of the detection process.

[0072] With reference to Figure 2 and Figure 3In some embodiments, the test rack 100 further comprises a support structure 130, which comprises a first link 131, a second link 132, a third link 133, a fourth link 134, and a connecting rod 135, one end of the connecting rod 135 being connected to the first link 131 and the second link 132, the other end of the connecting rod 135 being connected to the third link 133 and the fourth link 134, the first link 131, the second link 132, the third link 133, and the fourth link 134 being connected to the mounting table 120 away from one end of the connecting rod 135, and the first link 131 and the fourth link 134 being arranged obliquely to the upper side of the mounting table 120, the second link 132 and the third link 133 being perpendicular to the upper side of the mounting table 120, the support structure 130 being used to reinforce the mounting table 120, which is beneficial to increase the anti-deformation capability of the mounting table 120, and when different probe tables are arranged in a stacked manner along the Z-axis direction, the support structure 130 can also support the upper probe table to ensure the stability of the stacking.

[0073] Specifically, the second link 132 and the third link 133 are arranged in a spaced manner along the X-axis direction and are both perpendicular to the upper side of the mounting table 120, and together with the connecting rod 135 and the upper side of the mounting table 120, they enclose a rectangular structure, the projection of which along the Y-axis direction is a rectangle. The first link 131 and the fourth link 134 are arranged obliquely to the upper side of the mounting table 120, i.e., the first link 131 extends obliquely upward from the upper side of the mounting table 120 to one end of the connecting rod 135, and the fourth link 134 extends obliquely upward from the upper side of the mounting table 120 to the other end of the connecting rod 135, so that the first link 131, the second link 132, and the upper side of the mounting table 120 form a triangular structure, and the third link 133, the fourth link 134, and the upper side of the mounting table 120 also form a symmetrical triangular structure, and the projection of the entire support structure 130 along the Y-axis direction presents a combined form of a rectangle and a triangle.

[0074] Therefore, through the combination of the triangular and rectangular structures, it is beneficial to further increase the anti-deformation capability of the mounting table 120, and when multiple probe tables are arranged in a stacked manner along the Z-axis direction, the support structure 130 of the lower probe table can be docked with the upper probe table, and the obliquely arranged first link 131 and the fourth link 134 can act as support pivots to uniformly transmit the weight of the upper device to the rack body 110 of the lower probe table, forming a stable mechanical transmission path, avoiding structural shaking or load concentration caused by uneven support when stacking, and ensuring that the test operations of the probe tables of different layers do not interfere with each other.

[0075] Reference Figure 6 and Figure 7In some embodiments, the test rack 100 further comprises a docking portion 140 connected to the upper side of the rack body 110 and / or the mounting table 120 along the Z-axis direction, and the docking portion 140 extends towards the side away from the mounting table 120, the lower side of the rack body 110 is provided with a docking hole 112, and the projection area of the docking portion 140 along the Z-axis direction is arranged in one-to-one correspondence with the docking hole 112, and the docking portion 140 is used to realize the stacking arrangement between different probe tables.

[0076] Specifically, the docking portion 140 can be integrally formed with the rack body 110 and / or the mounting table 120, and the docking portion 140 can adopt a plurality of column structures, and the cross-sectional shape of the column can be a regular geometric shape such as a circle or a square, so as to facilitate cooperation with the docking hole 112. When two probe tables need to be stacked along the Z-axis direction, the docking portion 140 (column structure) of the upper probe table can be aligned with the docking hole 112 of the lower probe table, so that a part of the column is embedded in the docking hole 112 to form a mechanical positioning cooperation. The relative position of the upper and lower probe tables is ensured to be accurate when stacked, which can effectively improve the convenience and stability of the stacking arrangement of the probe tables. At the same time, the docking portion 140 also has a supporting effect, so that the weight of the upper probe table can be transmitted to the rack body 110 of the lower probe table through the column, reducing the shaking or deformation of the whole equipment after stacking, and ensuring that the probe tables do not interfere with each other during the test operation.

[0077] Reference Figures 1 to 8 According to the test system of the embodiments of the present application, at least the probe table in any of the above embodiments is stacked along the Z-axis direction, and / or adjacent along the vertical direction of the Z-axis direction, so that in the test system, the probe tables can be flexibly stacked or arranged adjacent to each other, which is convenient for better adapting to different test environments, and the test system is more compact, which is beneficial to saving test space.

[0078] Specifically, along the Z-axis direction, a plurality of probe tables can be stacked by cooperation of the docking portion 140 and the docking hole 112 on the test rack 100, for example, the docking portion 140 of the lower probe table is embedded in the docking hole 112 of the upper probe table to form mechanical positioning and support, and adjacent probe tables along the vertical direction of the Z-axis direction (along the X-axis direction and / or the Y-axis direction) can be connected through the connecting structure (such as bolts, buckles, etc.) on the side of the rack body 110, so that the probe tables are closely arranged in the horizontal direction.

[0079] Reference Figures 1 to 8 In other embodiments, the test system can further comprise a material moving device for realizing automatic feeding and discharging operation of the probe table, and the material moving device can adopt a structure form such as a rail trolley, a trackless trolley, a crown system or a mechanical hand, etc.

[0080] The embodiments of the present application are described in detail above with reference to the drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A probe station, characterized in that, The utility model provides a test frame, including: a test frame, including an integral frame body and a mounting table, along the Z axis direction, the frame body is equipped with the accommodation cavity that penetrates, the mounting table is equipped with the through groove, the mounting table is located the upper side of frame body and partly covers the accommodation cavity, the through groove communicates the accommodation cavity; a slide glass table module located in the accommodation cavity, the slide glass table module includes a first drive assembly and a slide glass table, the first drive assembly includes an X-axis moving platform and a Y-axis moving platform, the slide glass table is connected with the X-axis moving platform, along the X-axis direction, the X-axis moving platform is movably connected with the Y-axis moving platform, along the Y-axis direction, the Y-axis moving platform is movably connected with the frame body, along the Z-axis direction, the X-axis moving platform is located between the Y-axis moving platform and the slide glass table, along the X-axis direction, the opposite sides of the Y-axis moving platform correspondingly movably connected with the opposite sides of the frame body, the X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other in pairs; two probe modules, along the X-axis direction, both ends of the through groove are provided with mounting grooves respectively, the probe module includes a second drive assembly and a probe, the second drive assembly is connected with the mounting table, two the second drive assembly is installed in the mounting groove in one-to-one correspondence, the probe is connected to the output end of the second drive assembly, and the second drive assembly is used for driving the probe to move along the Z-axis direction, so that the probe can enter or exit the accommodation cavity from the through groove; an image acquisition module connected with the mounting table, the image acquisition module includes an acquisition part, and the acquisition part is located above the through groove.

2. The probe station of claim 1, wherein, The slide glass table is rotatably connected to the X-axis moving platform around the Z-axis direction.

3. The probe station of claim 1, wherein, The image acquisition module further includes an image acquisition seat and an acquisition device, the image acquisition seat is connected with the mounting table, the acquisition device is connected with the image acquisition seat, the acquisition device includes the acquisition part, the acquisition device is arranged along the Y-axis direction, and the Y-axis direction is perpendicular to the Z-axis direction.

4. The probe station of claim 1, wherein, The probe table further includes a test module, the test module is connected with the frame body, along the Z-axis direction, the first drive assembly is provided with a test channel, and the slide glass table covers one side of the test channel away from the test module; The slide glass table is a transparent structure.

5. The probe station of claim 1, wherein, The test frame further includes a support structure, the support structure includes a first connecting rod, a second connecting rod, a third connecting rod, a fourth connecting rod and a connecting rod, one end of the connecting rod is connected with the first connecting rod and the second connecting rod, the other end of the connecting rod is connected with the third connecting rod and the fourth connecting rod, one end of the first connecting rod, the second connecting rod, the third connecting rod and the fourth connecting rod away from the connecting rod is connected with the mounting table, and the first connecting rod and the third connecting rod are inclinedly arranged relative to the upper side of the mounting table, and the second connecting rod and the third connecting rod are perpendicular to the upper side of the mounting table.

6. The probe station of claim 1, wherein, The test rack further comprises a docking portion connected to the upper side of the rack body and / or the mounting table, and the docking portion is arranged extending towards the side away from the mounting table, and the lower side of the rack body is provided with a docking hole, and the projection area of the docking portion along the Z-axis direction is arranged one-to-one corresponding to the docking hole.

7. A test system, characterized by The test rack comprises at least two probe tables according to any one of claims 1-6; Wherein, each of the probe tables is arranged in a stacked manner along the Z-axis direction. And / or, each of the probe tables is arranged adjacent along the vertical direction of the Z-axis direction. The test rack further comprises a docking portion connected to the upper side of the rack body and / or the mounting table, and the docking portion is arranged extending towards the side away from the mounting table, and the lower side of the rack body is provided with a docking hole, and the projection area of the docking portion along the Z-axis direction is arranged one-to-one corresponding to the docking hole.

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