A semiconductor lead frame flipping and conveying device

Abstract

The present invention relates to the field of semiconductor production technology, and specifically discloses a semiconductor lead frame flipping and conveying device, comprising a supporting jig, the supporting jig being slidably connected to the lead frame, the supporting jig having a slideway for limiting the sliding direction of the lead frame, a flip assembly being rotatably connected to the lower portion of the supporting jig, a moving assembly being provided on one side of the supporting jig, the moving assembly being connected to a pusher claw, and the pusher claw being provided at one end of the supporting jig, the supporting jig having two channels for the pusher claws to extend into at the end near the pusher claw, the two channels being symmetrical about the axis of rotation of the lower portion of the supporting jig, and the pusher claws being driven into the channels by the moving assembly. The flipping and conveying device of the present invention can cooperate with front and rear end punching equipment to complete punching and forming of the front and back sides of the lead frame, flip the lead frame 180 degrees, and realize automatic conveying, thereby improving the efficiency of punching and forming of the front and back sides of the lead frame.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor production, in particular to a semiconductor lead frame flipping and conveying device. Background Art

[0002] With the rapid development of the semiconductor integrated circuit industry, the production capacity of integrated circuit products has increased significantly, and the emergence of a wide variety of types has made the original semiconductor equipment gradually unable to meet the needs of existing products. For example, the original lead frame chip cutting and forming process only required punching and forming on the front side of the lead frame. However, with the increasing complexity and increasing number of packaging forms, the lead frame chip after punching the front side, when forming from the front side, will cause the chip package to crack and the lead frame to deform, thus greatly increasing the product defect rate, directly affecting the production capacity, product quality and good industry reputation of each integrated circuit manufacturer, causing huge economic losses to them. Summary of the Invention

[0003] The purpose of the present invention is to provide a semiconductor lead frame flipping and conveying device, which cooperates with front and rear end punching equipment to complete the punching and forming of the front and back sides of the lead frame, flips the lead frame 180 degrees, and realizes automatic conveying, thereby improving the punching efficiency of the front and back sides of the lead frame.

[0004] The purpose of the present invention can be achieved through the following technical solutions:

[0005] A semiconductor lead frame flipping and conveying device includes a supporting jig, which is slidably connected to the lead frame, and the supporting jig has a slide for limiting the sliding direction of the lead frame. The lower part of the supporting jig is rotatably connected to a flip assembly, and a moving assembly is provided on one side of the supporting jig. The moving assembly is connected to a pusher claw, and the pusher claw is provided at one end of the supporting jig. The end of the supporting jig close to the pusher claw has two channels for the pusher claws to extend into, and the two channels are symmetrical about the axis of rotation of the lower part of the supporting jig. The pusher claw is driven by the moving assembly to extend into the channels.

[0006] In a further solution, the moving assembly includes a first telescopic cylinder and a screw sliding assembly, the screw of the screw sliding assembly is arranged horizontally on one side of the supporting fixture, the shell of the first telescopic cylinder is connected to the slider of the screw sliding assembly, the first telescopic cylinder moves horizontally through the screw sliding assembly, the piston of the first telescopic cylinder telescopes vertically, the upper part of the pusher claw and the piston of the first telescopic cylinder, the lower part of the pusher claw is used to extend into the channel, and the pusher claw moves vertically through the first telescopic cylinder.

[0007] In a further solution, the screw of the screw sliding assembly is rotatably connected to a fixed plate, the fixed plate is fixedly connected to a square frame, and the square frame is arranged on one side of the supporting fixture.

[0008] In a further solution, the flipping assembly includes a rotating platform, a rotating shaft, a fixed block, a synchronous belt, a rotating cylinder and a sliding plate, the sliding plate is slidably connected to the side of the square frame toward the supporting fixture, the cylinder body of the rotating cylinder is fixedly connected to the side of the sliding plate away from the supporting fixture, the cylinder body of the rotating cylinder is connected to one end of the synchronous belt, the other end of the synchronous belt is connected to one end of the rotating shaft, the other end of the rotating shaft is connected to the lower end of the rotating platform and is rotatably connected to one end of the fixed block, the other end of the fixed block is connected to the side of the sliding plate toward the supporting fixture, the upper end of the rotating platform is connected to the lower end of the supporting fixture, and the rotating platform is rotatably connected to the fixed block through the rotating shaft.

[0009] In a further solution, a second telescopic cylinder is connected between the square frame and the sliding plate, and the sliding plate slides toward the supporting fixture through the second telescopic cylinder.

[0010] In a further solution, a support plate is connected to the lower portion of the square frame, and an avoidance hole is opened in the middle of the support plate for avoiding the movement of the supporting fixture.

[0011] In a further solution, two sensing holes are provided at one end of the supporting jig away from the channel, and the two sensing holes are symmetrical about the axis of rotation of the lower part of the supporting jig. Sensors are provided on the sensing holes close to the sliding plate and under the channel, and the sensors are used to sense the position signal of the lead frame.

[0012] In a further solution, a hydraulic buffer is installed on the contact surface between the sliding plate and the rotating platform; the supporting fixture and the sliding plate are respectively connected to an anti-collision plate and a buffer pad on one side close to each other, and the anti-collision plate and the buffer pad correspond to each other.

[0013] In a further solution, a limiting member is further included. The limiting member is arranged on a side of the supporting fixture away from the pusher claw, and the limiting member is used to stop the lead frame at one end of the slide.

[0014] In a further solution, the limiting member includes a baffle and a third telescopic cylinder. The third telescopic cylinder is arranged on the side of the supporting fixture away from the pusher claw. One end of the baffle is connected to the piston of the third telescopic cylinder, and the other end of the baffle is opposite to the end of the slide away from the pusher claw. The baffle blocks the slide through the extension of the third telescopic cylinder.

[0015] Beneficial effects of the present invention:

[0016] The semiconductor lead frame flipping and conveying device of the present invention can realize the flipping of the front and back sides of the lead frame, and is used for matching the input to the upstream and downstream punching and forming equipment, which effectively solves the problem of chip package cracking caused by only single-sided punching. The lead frame is loaded on the supporting jig, the supporting jig is flipped by the flipping component, and the pusher claw is moved by the moving component. The lead frame loaded on the supporting jig is transferred to the downstream by the pusher claw, which facilitates the automatic flipping and conveying of the lead frame and improves the flipping and conveying efficiency.

[0017] The pusher claw of the present invention is controlled by a screw slider assembly and a first telescopic cylinder, and participates in the loading and pushing of the lead frame by the supporting fixture. On the one hand, it can be compatible with the problem of different sizes of lead frame products without the need to replace different pusher claws. On the other hand, the speed of the motor screw assembly is adjustable, which can adapt to different production speed requirements.

[0018] The present invention provides a flipping mechanism consisting of a rotating platform, a rotating shaft, a fixed block, a synchronous wheel belt, a rotating cylinder and a sliding plate. The rotating platform can improve the rigidity of the supporting fixture. Compared with motor control, the synchronous wheel belt and the rotating cylinder can reduce the control difficulty and cost of flipping the supporting fixture, and also increase the space, which is convenient for the arrangement of the supporting fixture and the moving components.

[0019] The present invention can effectively mitigate the hard collision of the supporting fixture and reduce the loss of the lead frame by arranging the hydraulic buffer.

[0020] The present invention is provided with a second telescopic cylinder and a sliding plate, and the sliding plate is driven to slide by the second telescopic cylinder, which can well accommodate the problem of inconsistent heights between the semiconductor lead frame flipping and conveying device and upstream and downstream equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 This is an axonometric diagram of a semiconductor lead frame flipping and conveying device according to an embodiment of the present invention;

[0023] Figure 2 This is a front view schematic diagram of a semiconductor lead frame flipping and conveying device according to an embodiment of the present invention;

[0024] Figure 3 It is a side view schematic diagram of a semiconductor lead frame flipping and conveying device according to an embodiment of the present invention;

[0025] Figure 4It is a top view schematic diagram of a semiconductor lead frame flipping and conveying device according to an embodiment of the present invention;

[0026] In the figure: 1. Support fixture; 101. Slide; 102. Channel; 103. Sensing hole; 2. Flip assembly; 21. Rotating platform; 22. Rotating axis; 23. Fixed block; 24. Synchronous belt; 25. Rotating cylinder; 26. Sliding plate; 3. Moving assembly; 31. First telescopic cylinder; 32. Screw sliding assembly; 4. Pusher claw; 5. Fixed plate; 6. Square frame; 7. Second telescopic cylinder; 8. Support plate; 81. Avoidance hole; 9. Anti-collision plate; 10. Buffer pad; 11. Limiting piece; 111. Baffle; 112. Third telescopic cylinder. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0028] like Figure 1 As shown, a semiconductor lead frame flipping and conveying device includes a supporting jig 1, which is slidably connected to the lead frame. The supporting jig 1 has a slide 101 for limiting the sliding direction of the lead frame. The lower part of the supporting jig 1 is rotatably connected to the flip assembly 2. A moving assembly 3 is provided on one side of the supporting jig 1. The moving assembly 3 is connected to a pusher claw 4, and the pusher claw 4 is provided at one end of the supporting jig 1. The end of the supporting jig 1 close to the pusher claw 4 has two channels 102 for the pusher claw 4 to extend into. The two channels 102 are symmetrical about the axis of rotation of the lower part of the supporting jig 1, and the pusher claw 4 is driven by the moving assembly 3 to extend into the channel 102.

[0029] Its working principle is that the lead frame flows from the upstream punching equipment into the slide 101 of the supporting jig 1. After being flipped 180° by the flipping component 2, the lead frame can be flipped 180°. The movable component 3 drives the pusher claw 4 to push the lead frame from the slide 101 of the supporting jig 1 to the punching equipment below, thereby realizing the 180° flip of the lead frame required for front and back punching. This principle and structure are simple and easy to realize the automatic flipping of the lead frame. It can be imagined that the control flipping component 2 can also be used to realize the flipping of the supporting jig 1 at more required angles. By providing a quickly detachable supporting jig 1, it can well adapt to products of different appearances and sizes, and achieve multiple varieties to be switched according to demand.

[0030] In some embodiments, as Figure 2As shown, the moving assembly 3 includes a first telescopic cylinder 31 and a screw sliding assembly 32. The screw of the screw sliding assembly 32 is arranged horizontally on one side of the supporting fixture 1. The shell of the first telescopic cylinder 31 is connected to the slider of the screw sliding assembly 32. The first telescopic cylinder 31 moves horizontally through the screw sliding assembly 32. The piston of the first telescopic cylinder 31 telescopes vertically. The upper part of the pusher claw 4 is connected to the piston of the first telescopic cylinder 31, and the lower part of the pusher claw 4 is used to extend into the channel 102. The pusher claw 4 moves vertically through the first telescopic cylinder 31.

[0031] The screw motor of the screw slide assembly 32 drives the screw to rotate, thereby driving the screw sleeve and the sliding block on the screw to slide along the slide rail set according to the required position, thereby driving the first telescopic cylinder 31 located on the slide to move left and right. During the movement, the first telescopic cylinder 31 can be controlled to extend and retract, which is used to push the lead frame from the slide 101 of the support jig 1 to the punching device below and to allow the lead frame to flow from the upstream punching device into the slide 101 of the support jig 1 along the channel 102, thereby achieving the transition of the lead frame to the support jig 1 and controlling its sliding in the support jig 1. This makes it easy to control the position of the lead frame during the automatic docking process with the upstream and downstream punches to meet the docking requirements.

[0032] The screw sliding assembly 32 can adopt a linear moving mechanism composed of a commonly used motor, ball screw, slider and slide rail, etc., which is used for the lateral movement of the first telescopic cylinder 31. It is conceivable that other linear moving mechanisms such as gear rack linear moving mechanisms can also be used. The first telescopic cylinder 31 can adopt a commonly used pneumatic cylinder, or other telescopic parts structures such as an electric cylinder.

[0033] In some embodiments, as Figure 3 As shown, the screw of the screw slide assembly 32 is rotatably connected to the fixed plate 5, which is fixedly connected to the square frame 6. The square frame 6 is provided on one side of the support fixture 1. The square frame 6 and the fixed plate 5 are used to install the screw slide assembly 32. Since the square frame 6 is hollow inside, it is convenient to flip the flip assembly 2 and can easily add detection parts at the required position after installation.

[0034] In some embodiments, the flip assembly 2 includes a rotating platform 21, a rotating shaft 22, a fixed block 23, a synchronous belt 24, and a rotating shaft 22. Figure 3 The rotating cylinder 25 and the sliding plate 26 are shown. The sliding plate 26 is slidably connected to the side of the square frame 6 facing the supporting fixture 1. The cylinder body of the rotating cylinder 25 is fixedly connected to the side of the sliding plate 26 away from the supporting fixture 1. The cylinder body of the rotating cylinder 25 is connected to one end of the synchronous belt 24, as shown in FIG. Figure 4The other end of the synchronous belt 24 shown is connected to one end of the rotating shaft 22, the other end of the rotating shaft 22 is connected to the lower end of the rotating platform 21 and is rotatably connected to one end of the fixed block 23, the other end of the fixed block 23 is connected to the sliding plate 26 toward the side connected to the supporting fixture 1, the upper end of the rotating platform 21 is connected to the lower end of the supporting fixture 1, and the rotating platform 21 is rotatably connected to the fixed block 23 through the rotating shaft 22.

[0035] The rotating cylinder 25 is controlled to rotate, for example, 180 degrees, and the rotating shaft 22 and the rotating platform 21 can be driven to rotate 180 degrees through the synchronous pulley, and then the rotating platform 21 drives the supporting fixture 1 to rotate, thereby driving the lead frame in the supporting fixture 1 to rotate to achieve the flipping requirement.

[0036] The rotating platform 21 in the flip assembly 2 can also be connected to the supporting fixture 1 in an integrated or multi-part combination. The rotating cylinder 25 in the flip assembly 2 can also be replaced with a rotating motor to control the rotation.

[0037] In some embodiments, as Figure 2 As shown, a second telescopic cylinder 7 is connected between the rectangular frame 6 and the sliding plate 26. The sliding plate 26 slides on the sliding plate 26 toward the support fixture 1 via the second telescopic cylinder 7. The second telescopic cylinder 7 is used to match the height of the output end or input end of the support fixture 1, facilitating its height connection with upstream and downstream punching equipment. The second telescopic cylinder 7 can also be implemented with other lifting mechanisms, such as screw lifting mechanisms, which are also covered by the scope of protection of this invention.

[0038] In some embodiments, as Figure 3 As shown, the lower portion of the square frame 6 is connected to a support plate 8, with a clearance hole 81 defined in the middle of the support plate 8 to allow for the movement of the support jig 1. The support plate 8 supports the entire semiconductor lead frame turning and conveying apparatus, connecting it between the upstream and downstream punching equipment. When the docking height needs to be adjusted, the support jig 1 can be turned or raised through the clearance hole 81 to avoid interference with the support plate 8.

[0039] In some embodiments, as Figure 1 As shown, two sensing holes 103 are provided at the end of the support jig 1 away from the channel 102. These two sensing holes 103 are symmetrical about the axis of rotation of the lower portion of the support jig 1. Sensors are provided in the sensing holes 103 near the sliding plate 26 and below the channel 102 to detect the lead frame's position. The sensors can be photoelectric sensors, which facilitate automatic control of the lead frame's rotation and ejection timing within the support jig 1.

[0040] In some embodiments, a hydraulic buffer is installed on the contact surface between the sliding plate 26 and the rotating platform 21; Figure 1As shown, the support fixture 1 and the sliding plate 26 are connected to the side close to each other with the anti-collision plate 9 and the buffer pad 10, respectively, and the anti-collision plate 9 and the buffer pad 10 correspond to each other. This prevents the sliding plate 26 from colliding with the rotating platform 21, while also improving the position limiting capability of the rotating platform 21, improving safety, and reducing the impact of the support fixture 1 on the lead frame caused by vibration.

[0041] In some embodiments, as Figure 1 As shown, the semiconductor lead frame flipping and conveying device further includes a stopper 11, which is disposed on the side of the support fixture 1 away from the pusher claw 4. The stopper 11 is used to stop the lead frame at one end of the slide 101. This can control the lead frame to be located within the slide 101 and prevent it from sliding too far and falling.

[0042] In some embodiments, the stopper 11 includes a baffle 111 and a third telescopic cylinder 112. The third telescopic cylinder 112 is positioned on the side of the support fixture 1 away from the pusher claw 4. One end of the baffle 111 is connected to the piston of the third telescopic cylinder 112, and the other end of the baffle 111 faces the end of the slideway 101 away from the pusher claw 4. The baffle 111 is extended and retracted by the third telescopic cylinder 112 to block the slideway 101. This allows the baffle 111 to be released from its blocking position when the lead frame is delivered to the downstream punching equipment by retracting the piston of the third telescopic cylinder 112, allowing the lead frame to pass through. It is conceivable that the third telescopic cylinder 112 can also be mounted via another bracket to achieve the above-mentioned function.

[0043] In a specific embodiment, see Figure 1 As shown, when the first telescopic cylinder 31 is in the retracted state, the lead frame flows into the supporting fixture 1 from the upstream punching equipment. At this time, the third telescopic cylinder 112 is in the extended state and is limited by the baffle 111 so that it is located in the slide 101. The rotary cylinder 25 controls the rotation of the rotating platform 21 and the supporting fixture 1, thereby driving the lead frame in the slide 101 to rotate 180°. After flipping, the second telescopic cylinder 7 drives the sliding plate 26 and the supporting fixture 1 to reach the conveying height, so that the conveying height adjustment is consistent with the punching height below. At this time, the first telescopic cylinder 31 is controlled to be in the extended state, and the third telescopic cylinder 112 is in the retracted state, and the screw sliding assembly 32 is controlled to drive the pusher claw 4 to move horizontally, pushing the lead frame from the slide 101 to the punching equipment below, thereby realizing the 180° flipping and conveying of the lead frame that needs to be punched on the front and back sides.

[0044] It should be noted that the terms "first," "second," etc., in this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so as to facilitate the embodiments of the present application described herein.

[0045] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0046] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the invention as claimed.

Claims

1. A semiconductor lead frame flipping and conveying device, characterized in that: The invention comprises a supporting jig (1), wherein the supporting jig (1) is slidably connected to the lead frame, the supporting jig (1) has a slideway (101) for limiting the sliding direction of the lead frame, the lower part of the supporting jig (1) is rotatably connected to a flip assembly (2), a moving assembly (3) is provided on one side of the supporting jig (1), the moving assembly (3) is connected to a pusher claw (4), and the pusher claw (4) is provided at one end of the supporting jig (1), and the end of the supporting jig (1) close to the pusher claw (4) has two channels (102) for the pusher claw (4) to extend into, the two channels (102) are symmetrical about the axis of rotation of the lower part of the supporting jig (1), and the pusher claw (4) is driven by the moving assembly (3) to extend into the channels (102).

2. The semiconductor lead frame flipping and conveying device according to claim 1, characterized in that: The moving assembly (3) includes a first telescopic cylinder (31) and a screw sliding assembly (32), the screw of the screw sliding assembly (32) is arranged transversely on one side of the supporting fixture (1), the housing of the first telescopic cylinder (31) is connected to the slider of the screw sliding assembly (32), the first telescopic cylinder (31) moves transversely through the screw sliding assembly (32), the piston of the first telescopic cylinder (31) telescopes vertically, the upper part of the pusher claw (4) is in contact with the piston of the first telescopic cylinder (31), and the lower part of the pusher claw (4) is used to extend into the channel (102), and the pusher claw (4) moves vertically through the first telescopic cylinder (31).

3. The semiconductor lead frame flipping and conveying device according to claim 2, characterized in that: The screw of the screw sliding assembly (32) is rotatably connected to a fixed plate (5), and the fixed plate (5) is fixedly connected to a square frame (6). The square frame (6) is provided on one side of the supporting fixture (1).

4. The semiconductor lead frame flipping and conveying device according to claim 3, characterized in that: The flip assembly (2) includes a rotating platform (21), a rotating shaft (22), a fixed block (23), a synchronous belt (24), a rotating cylinder (25) and a sliding plate (26), wherein the sliding plate (26) is slidably connected to the side of the square frame (6) facing the supporting fixture (1), the cylinder body of the rotating cylinder (25) is fixedly connected to the side of the sliding plate (26) away from the supporting fixture (1), the cylinder body of the rotating cylinder (25) is connected to one end of the synchronous belt (24), and the synchronous belt The other end of the belt (24) is connected to one end of the rotating shaft (22), the other end of the rotating shaft (22) is connected to the lower end of the rotating platform (21) and is rotatably connected to one end of the fixed block (23), the other end of the fixed block (23) is connected to the sliding plate (26) toward the side connected to the supporting fixture (1), the upper end of the rotating platform (21) is connected to the lower end of the supporting fixture (1), and the rotating platform (21) is rotatably connected to the fixed block (23) via the rotating shaft (22).

5. The semiconductor lead frame flipping and conveying device according to claim 4, characterized in that: A second telescopic cylinder (7) is connected between the square frame (6) and the sliding plate (26), and the sliding plate (26) slides on the sliding plate (26) toward one side of the supporting fixture (1) via the second telescopic cylinder (7).

6. The semiconductor lead frame flipping and conveying device according to claim 4, characterized in that: The lower portion of the square frame (6) is connected to a support plate (8), and a middle portion of the support plate (8) is provided with an avoidance hole (81) for avoiding movement of the supporting fixture (1).

7. The semiconductor lead frame flipping and conveying device according to claim 4, characterized in that: Two sensing holes (103) are provided at one end of the supporting jig (1) away from the channel (102), and the two sensing holes (103) are symmetrical about the axis of rotation of the lower part of the supporting jig (1). Sensors are provided under the sensing holes (103) on the side close to the sliding plate (26) and the channel (102), and the sensors are used to sense the position signal of the lead frame.

8. The semiconductor lead frame flipping and conveying device according to claim 4, characterized in that: A hydraulic buffer is installed on the contact surface between the sliding plate (26) and the rotating platform (21); the support fixture (1) and the sliding plate (26) are respectively connected to an anti-collision plate (9) and a buffer pad (10) on one side close to each other, and the anti-collision plate (9) and the buffer pad (10) correspond to each other.

9. A semiconductor lead frame flipping and conveying device according to any one of claims 1 to 8, characterized in that: It also includes a limiting member (11), which is arranged on a side of the supporting fixture (1) away from the pusher claw (4), and is used to stop the lead frame at one end of the slideway (101).

10. The semiconductor lead frame flipping and conveying device according to claim 9, characterized in that: The limiting member (11) comprises a baffle (111) and a third telescopic cylinder (112). The third telescopic cylinder (112) is arranged on a side of the supporting fixture (1) away from the pusher claw (4). One end of the baffle (111) is connected to a piston of the third telescopic cylinder (112). The other end of the baffle (111) faces the end of the slideway (101) away from the pusher claw (4). The baffle (111) blocks the slideway (101) by being telescopically extended by the third telescopic cylinder (112).

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