Silicon carbide packaging structure and method

Abstract

The present invention relates to the field of silicon carbide technology, and specifically to a silicon carbide packaging structure and method, including a silicon carbide packaging structure main body, a pin is provided on the front side of the silicon carbide packaging structure main body, a first heat sink is installed on both side surfaces of the silicon carbide packaging structure main body, a second heat sink is installed on the upper and lower side surfaces of the silicon carbide packaging structure main body, a vertical plate is further provided on the front side of the silicon carbide packaging structure main body, a through-hole is opened on the vertical plate for the pin to pass through, inserts are provided on both sides of the vertical plate that can be inserted into the interior of the corresponding two first heat sinks, a clamping portion is provided on the end surface of the insert away from the vertical plate, and a plug-in slot that is clamped with the clamping portion is provided on the first heat sink. When the silicon carbide packaging structure main body in the present invention is not in use, the vertical plate is connected to the pin through the through-hole, and the end of the pin is restricted in the through-hole to prevent the pin from bending due to external factors.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon carbide, and in particular to a silicon carbide packaging structure, and more particularly to a packaging method for the silicon carbide packaging structure. Background Art

[0002] In the field of electronic devices, silicon carbide, with its unique advantages such as wide bandgap, high breakdown electric field strength, high current density, fast switching speed, low on-resistance, and radiation resistance, has gradually become a key material in power electronics, high-temperature electronics, photovoltaic inverters, and high-frequency electronics. Among them, silicon carbide power devices play an important role in practical applications, and their performance directly affects the operating efficiency and stability of the entire electronic equipment.

[0003] At present, Chinese patent CN221352751U discloses an ultra-high temperature and high reliability silicon carbide MOS packaging structure, including a silicon carbide MOS packaging structure main body, heat dissipation parts are installed on both end surfaces of the silicon carbide MOS packaging structure main body, a first heat sink is installed on the upper surface of the silicon carbide MOS packaging structure main body, and a plurality of first heat dissipation grooves are spaced apart along the horizontal direction on the upper surface of the first heat sink, and a second heat sink is installed on the lower surface of the silicon carbide MOS packaging structure main body, and a plurality of second heat dissipation grooves are spaced apart along the horizontal direction on the lower surface of the second heat sink. During use, the heat dissipation part, the first heat sink and the second heat sink can ensure the effect and efficiency of heat dissipation of the silicon carbide MOS packaging structure main body, avoid heat accumulation on the silicon carbide MOS packaging structure main body, facilitate the use of the silicon carbide MOS packaging structure main body, and facilitate ensuring the high temperature resistance and reliability of the silicon carbide MOS packaging structure main body.

[0004] However, in the actual production, transportation and use process, the pins, as the key components connecting the silicon carbide power device with the external circuit, are usually relatively thin and are easily bent and deformed by external forces such as collision and extrusion. Once the pins are bent, it will not only make the connection between the device and the external circuit difficult, resulting in poor contact and affecting the stability of current transmission, but may also cause the entire silicon carbide power device to fail to work properly. In severe cases, the entire device may even need to be replaced, greatly increasing maintenance costs and time costs. Therefore, there is an urgent need for a new silicon carbide packaging structure that can effectively solve the problem of easy bending of pins while ensuring other performance, so as to improve the stability and reliability of silicon carbide power devices in various links. Summary of the Invention

[0005] In response to the above problems, the present invention provides a silicon carbide packaging structure and method. When the main body of the silicon carbide packaging structure in the present invention is not in use, the vertical plate is connected to the pins through the through-hole, and the ends of the pins are restricted in the through-hole to prevent the pins from bending due to external factors.

[0006] In order to solve the problems of the existing technology, the present invention provides a silicon carbide packaging structure, including a silicon carbide packaging structure main body, the front side of the silicon carbide packaging structure main body is provided with pins, both side surfaces of the silicon carbide packaging structure main body are installed with first heat dissipation plates, and both upper and lower side surfaces of the silicon carbide packaging structure main body are installed with second heat dissipation plates. The two first heat dissipation plates and the two second heat dissipation plates form an installation groove for accommodating the silicon carbide packaging structure main body, the front side of the silicon carbide packaging structure main body is also provided with a vertical plate that can move along the horizontal direction of the pins, the vertical plate is provided with a through hole for the pins to pass through, and both sides of the vertical plate are provided with plugs that can be inserted into the corresponding two first heat dissipation plates, the end surface of the plug away from the vertical plate is provided with a clamping portion, and the first heat dissipation plate is provided with a plug groove that is clamped with the clamping portion.

[0007] Preferably, the inner wall of the opening of the vertical plate is wrapped with an insulating rubber layer that slides with the outside of the pin.

[0008] Preferably, a channel for inserting the plug is provided on the first heat dissipation plate, and sliding seats are mirror-imaged on the upper and lower sides of the channel. The adjacent sides of the two sliding seats are respectively provided with slots for sliding fit of the upper and lower sides of the plug, and the gap between the two slots constitutes a space for inserting the plug.

[0009] Preferably, the plug-in slot on the first heat dissipation plate includes a first snap-fitting slot and a second snap-fitting slot that can be snap-fitted with the snap-fitting portion, the first snap-fitting slot is opened on the side of the channel close to the pin, and the second snap-fitting slot is opened on the side of the channel away from the pin.

[0010] Preferably, the clamping portion includes an elastic arc-shaped spring piece, which is arranged on the insert piece, and the protrusion of the arc-shaped spring piece can be inserted into the first clamping groove and the second clamping groove. The edges of the first clamping groove and the second clamping groove are provided with arc surfaces for allowing the arc-shaped spring piece to enter the first clamping groove and the second clamping groove.

[0011] Preferably, a limit block is provided at each corner of the side of the vertical plate close to the main body of the silicon carbide packaging structure, and a socket for plugging and mating with the limit block is provided on the side of each first heat dissipation plate close to the vertical plate. The insertion end of the limit block is provided with an iron block, and the inner wall of the socket is provided with a magnet that is magnetically attracted to the iron block.

[0012] Preferably, a third heat dissipation plate abutting against the main body of the silicon carbide packaging structure is provided on one side of the vertical plate close to the main body of the silicon carbide packaging structure, and a plurality of first heat dissipation grooves arranged at intervals are provided on the surface of the third heat dissipation plate close to the main body of the silicon carbide packaging structure.

[0013] Preferably, second heat dissipation grooves are respectively provided on outer surfaces of the first heat dissipation plate and the second heat dissipation plate.

[0014] Preferably, a first connection port is provided at each corner of the second heat dissipation plate, a second connection port corresponding to each first connection port is provided on the first heat dissipation plate, and the first connection port and the second connection port are connected by a precision screw.

[0015] The present invention also provides a packaging method for a silicon carbide packaging structure, which is applied to the above-mentioned silicon carbide packaging structure and includes the following steps:

[0016] S1. Install two first heat sinks on both sides of the silicon carbide packaging structure body, and two second heat sinks on the upper and lower sides of the silicon carbide packaging structure body, and connect and fix them through the first connecting port, the second connecting port, and the precision screw to form a mounting groove for accommodating the silicon carbide packaging structure body;

[0017] S2. Wrap the interior of the riser opening with an insulating rubber layer, install a limit block at the corner of the riser close to the main body of the silicon carbide packaging structure, install inserts with curved spring clip clamping portions on both sides of the riser, and install a third heat sink on the side of the riser close to the main body of the silicon carbide packaging structure;

[0018] S3. Align the hole of the vertical board with the pin, so that the end of the pin is at the hole. At this time, the vertical board plays the role of protecting the pin;

[0019] S4. Push the vertical plate so that the insert is inserted along the channel of the first heat sink. The raised portion of the arc-shaped spring piece is snapped into the first snap-fit ​​groove or the second snap-fit ​​groove. At the same time, the limit block is inserted into the corresponding socket on the first heat sink. The iron block and the magnet are used to fix the pins. The through-hole on the vertical plate is moved horizontally along the pins to be close to the front side of the main body of the silicon carbide packaging structure so that the pins are completely exposed.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. When the main body of the silicon carbide packaging structure of the present invention is not in use, the vertical plate is connected to the pins through the through-holes, and the ends of the pins are restricted within the through-holes to prevent the pins from bending due to external factors.

[0022] 2. When the silicon carbide packaging structure body of the present invention is in use, the vertical plate can move horizontally along the pins and engage with the engaging groove of the first heat sink through the engaging portion on the insert. It is easy to operate, stable to install and convenient to disassemble, thereby improving the efficiency of installation and maintenance.

[0023] 3. The present invention increases the heat dissipation area by respectively arranging a first heat dissipation plate and a second heat dissipation plate on both sides and the upper and lower surfaces of the silicon carbide packaging structure body, and opening a second heat dissipation groove on the surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1It is a three-dimensional structure of silicon carbide packaging structure Figure 1 .

[0025] Figure 2 It is a three-dimensional structure of silicon carbide packaging structure Figure 2 .

[0026] Figure 3 yes Figure 2 Enlarged view of point A in the middle.

[0027] Figure 4 This is a front view of a silicon carbide packaging structure.

[0028] Figure 5 yes Figure 4 Cross-sectional view along BB.

[0029] Figure 6 It is a schematic diagram of the three-dimensional structure of a silicon carbide packaging structure.

[0030] Figure 7 yes Figure 6 Enlarged view of point C in the middle.

[0031] Figure 8 This is a structural breakdown diagram of a silicon carbide packaging structure.

[0032] Figure 9 yes Figure 8 Enlarged view of point D in the middle.

[0033] Figure 10 It is a schematic diagram of the partial three-dimensional structure of a vertical plate of a silicon carbide packaging structure.

[0034] The numbers in the figure are: 1. Silicon carbide packaging structure body; 11. Pin; 2. First heat sink; 21. Channel; 22. Sliding seat; 221. Slot; 23. First clamping groove; 24. Second clamping groove; 241. Arc surface; 25. Second connection port; 3. Second heat sink; 31. First connection port; 32. Precision screw; 33. Second heat sink; 4. Vertical plate; 41. Through-hole; 411. Insulating rubber layer; 42. Insert; 421. Clamping part; 4211. Arc-shaped spring piece; 43. Limit block; 431. Iron block; 44. Socket; 441. Magnet; 45. Third heat sink; 451. First heat sink. DETAILED DESCRIPTION

[0035] In order to further understand the features, technical means, specific objectives and functions achieved by the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] Reference Figures 1 to 6 and Figures 8 to 10As shown: A silicon carbide packaging structure includes a silicon carbide packaging structure main body 1, a pin 11 is provided on the front side of the silicon carbide packaging structure main body 1, a first heat dissipation plate 2 is installed on both side surfaces of the silicon carbide packaging structure main body 1, and a second heat dissipation plate 3 is installed on the upper and lower side surfaces of the silicon carbide packaging structure main body 1. The two first heat dissipation plates 2 and the two second heat dissipation plates 3 form an installation groove for accommodating the silicon carbide packaging structure main body 1, and the front side of the silicon carbide packaging structure main body 1 is further provided with a vertical plate 4 that can move horizontally along the pin 11, and the vertical plate 4 is provided with a through hole 41 for the pin 11 to pass through. Inserts 42 that can be inserted into the corresponding two first heat dissipation plates 2 are provided on both sides of the vertical plate 4, and a clamping portion 421 is provided on the end surface of the insert 42 away from the vertical plate 4. The first heat dissipation plate 2 is provided with a plug-in slot that engages with the clamping portion 421.

[0037] The silicon carbide packaging structure main body 1 generates heat during operation, and the heat is transferred to the first heat sink 2 and the second heat sink 3 in close contact with it. Since the first heat sink 2 and the second heat sink 3 are distributed on both sides and the upper and lower surfaces of the silicon carbide packaging structure main body 1, an enclosed heat dissipation structure is formed, which increases the heat dissipation area.

[0038] The silicon carbide package structure body 1 in this embodiment has different working modes at different use stages, mainly used to protect the pins 11, specifically:

[0039] When the main body 1 of the silicon carbide packaging structure is not put into use, the vertical plate 4 plays a protective role. At this time, the vertical plate 4 is connected to the pin 11 through the through-hole 41, and the end of the pin 11 is located at the through-hole 41 of the vertical plate 4. Since the pin 11 is relatively slender, it is easy to bend and deform due to external collisions, extrusion and other factors during transportation and storage. The bent pin 11 may not be able to connect normally with the external circuit, affecting the use of the entire packaging structure. The vertical plate 4 is equivalent to a protective barrier, which restricts the end of the pin 11 within the through-hole 41, reducing the chance of direct contact between the pin 11 and external objects, thereby effectively avoiding the bending of the pin 11 due to external factors, ensuring that the pin 11 maintains a good physical shape, and laying the foundation for subsequent normal use.

[0040] When the silicon carbide packaging structure main body 1 needs to be used, the vertical plate 4 is first pushed so that the inserts 42 on both sides are inserted into the corresponding two first heat dissipation plates 2. During the insertion process of the inserts 42, the clamping portion 421 on the inserts 42 will gradually approach the plug-in slot on the first heat dissipation plate 2. As the vertical plate 4 is continuously pushed forward, the clamping portion 421 will eventually accurately engage with the plug-in slot, thereby playing a role in preliminarily fixing the vertical plate 4. At the same time, the through-hole 41 on the vertical plate 4 moves horizontally along the pin 11 and gradually approaches the front side of the silicon carbide packaging structure main body 1. In this process, the pin 11 is completely exposed from the state originally partially blocked by the vertical plate 4. After the pin 11 is fully exposed, it can be easily connected to the external circuit to achieve the normal operation of the silicon carbide packaging structure main body 1. The clamping of the inserts 42 and the first heat dissipation plate 2 and the state of the vertical plate 4 close to the front side of the silicon carbide packaging structure main body 1 together ensure the stability of the entire silicon carbide packaging structure main body 1 during use, preventing the riser 4 from accidentally moving and affecting the connection effect of the pin 11 with the external circuit.

[0041] Reference Figure 10 As shown, the inner wall of the through hole 41 of the vertical plate 4 is wrapped with an insulating rubber layer 411 that slides with the outside of the pin 11.

[0042] When the main body 1 of the silicon carbide packaging structure is working, the pin 11 will transmit current. If there is direct contact between the pin 11 and the vertical plate 4, it may cause current leakage, short circuit and other problems, affecting the normal operation of the equipment and even damaging electronic components. The insulating rubber layer 411, as a good insulating material, isolates the pin 11 from the vertical plate 4, effectively preventing the current from being transmitted from the pin 11 to the vertical plate 4, avoiding various faults caused by leakage, and ensuring the electrical safety of the packaging structure.

[0043] During the horizontal movement of the vertical plate 4 along the pin 11, friction or collision may occur between the vertical plate 4 and the pin 11 due to vibration, external force and other factors. The pin 11 is usually fragile, and frequent friction or collision may cause the surface of the pin 11 to wear and deform, thereby affecting its conductivity and connection stability. The insulating rubber layer 411 has a certain elasticity and softness, and can play a buffering role between the vertical plate 4 and the pin 11, reducing the damage to the pin 11 caused by friction and collision generated during movement, and extending the service life of the pin 11.

[0044] Reference Figure 3 、 Figure 9 and Figure 10 As shown: the first heat sink 2 is provided with a channel 21 for inserting the plug 42, and the sliding seats 22 are mirror-imaged on the upper and lower sides of the channel 21. The adjacent sides of the two sliding seats 22 are respectively provided with slots 221 for sliding fit on the upper and lower sides of the plug 42, and the gap between the two slots 221 constitutes a space for inserting the plug 42.

[0045] When the vertical plate 4 needs to be fixed on the first heat dissipation plate 2, the channel 21 set on the first heat dissipation plate 2 provides a clear insertion path for the plug 42. The plug 42 can be inserted along the channel 21, avoiding offset or misalignment during the insertion process, making the installation process more convenient and accurate.

[0046] The sliding seats 22 and the corresponding slots 221 on the upper and lower sides of the channel 21 are mirror-imaged and support and guide the upper and lower sides of the insert 42. The upper and lower sides of the insert 42 slide with the slots 221 respectively. During the insertion process, the slots 221 provide a stable sliding track for the insert 42, ensuring that the insert 42 can be smoothly inserted along the channel 21, preventing the insert 42 from shaking or tilting during insertion, and ensuring the accuracy and reliability of the installation.

[0047] The gap between the two slots 221 constitutes a space for the insert 42 to be inserted. After the insert 42 is inserted, its upper and lower surfaces are in close contact with the slot 221, which not only limits the movement of the insert 42 in the horizontal direction, but also prevents the insert 42 from shaking in the vertical direction to a certain extent, thereby increasing the friction between the insert 42 and the first heat sink 2 and the stability of the connection, making the vertical plate 4 and the first heat sink 2 more firmly connected, thereby ensuring the stability of the entire silicon carbide packaging structure body 1 during use, and avoiding the normal operation of the pin 11 affected by the looseness of the vertical plate 4.

[0048] like Figure 3 as well as Figure 5 As shown: the plug-in slot on the first heat sink 2 includes a first snap-fitting slot 23 and a second snap-fitting slot 24 that can be snap-fitted with the snap-fitting portion 421. The first snap-fitting slot 23 is opened on the side of the channel 21 close to the pin 11, and the second snap-fitting slot 24 is opened on the side of the channel 21 away from the pin 11.

[0049] When the insert 42 of the vertical plate 4 is inserted into the channel 21 of the first heat sink 2, since the first heat sink 2 is provided with a first snap-fitting groove 23 and a second snap-fitting groove 24, the snap-fitting portion 421 on the insert 42 can be snap-fitted with different snap-fitting grooves according to actual needs. The first snap-fitting groove 23 is opened on the side of the channel 21 close to the pin 11. When the snap-fitting portion 421 is snap-fitted with the first snap-fitting groove 23, the vertical plate 4 will be close to the end of the pin 11, which is suitable for situations where the vertical plate 4 is required to protect the pin 11; the second snap-fitting groove 24 is opened on the side of the channel 21 away from the pin 11. If the snap-fitting portion 421 is snap-fitted with the second snap-fitting groove 24, the vertical plate 4 is relatively away from the pin 11. At this time, the pin 11 passes through the through opening 41 for use by the silicon carbide packaging structure main body 1.

[0050] No matter whether the engaging portion 421 is engaged with the first engaging groove 23 or the second engaging groove 24 , the inserting piece 42 can be effectively fixed in the first heat dissipation plate 2 , thereby stabilizing the position of the vertical plate 4 .

[0051] Reference Figure 3 As shown: the clamping portion 421 includes an elastic arc-shaped spring piece 4211, which is arranged on the inserting piece 42, and the protrusion of the arc-shaped spring piece 4211 can be inserted into the first clamping groove 23 and the second clamping groove 24. The edges of the first clamping groove 23 and the second clamping groove 24 are provided with an arc surface 241 for allowing the arc-shaped spring piece 4211 to better enter the first clamping groove 23 and the second clamping groove 24.

[0052] When the insert 42 of the riser 4 needs to be inserted into the channel 21 of the first heat dissipation plate 2, the arc-shaped spring piece 4211 on the insert 42 will move together with the insert 42. Since the arc-shaped spring piece 4211 is elastic, during the insertion process, even if it has a slight collision or friction with the edge of the channel 21 and the clamping groove, it can still be deformed to a certain extent due to its own elasticity. When the arc-shaped spring piece 4211 moves to the position of the first clamping groove 23 or the second clamping groove 24, the raised part of the arc-shaped spring piece 4211 will be quickly clamped into the first clamping groove 23 or the second clamping groove 24 under the action of the elastic restoring force.

[0053] After the arc-shaped spring piece 4211 is inserted into the first clamping groove 23 or the second clamping groove 24, the protrusion of the arc-shaped spring piece 4211 is tightly fitted with the first clamping groove 23 or the second clamping groove 24, and the extrusion force generated by the elasticity forms a stable connection between the insert 42 and the first heat sink 2.

[0054] The arc surface 241 provided at the edge of the first engaging groove 23 and the second engaging groove 24 is to better guide the arc-shaped spring piece 4211 into the groove. When the inserting piece 42 is inserted into the channel 21, the arc surface 241 can guide the arc-shaped spring piece 4211, thereby reducing the hard collision between the spring piece and the groove edge and reducing the risk of damage to the spring piece.

[0055] Reference Figure 3 and Figure 7 As shown: a limit block 43 is provided at each corner of the side of the vertical plate 4 close to the silicon carbide packaging structure body 1, and a socket 44 for the limit block 43 to be plugged in is provided on the side of each first heat dissipation plate 2 close to the vertical plate 4. The insertion end of the limit block 43 is provided with an iron block 431, and the inner wall of the socket 44 is provided with a magnet 441 that is magnetically attracted to the iron block 431.

[0056] When the vertical plate 4 moves horizontally along the pin 11 and is inserted into the first heat sink 2, the limit block 43 will gradually approach and align with the socket 44. When the vertical plate 4 reaches the appropriate position, the limit block 43 can be accurately inserted into the socket 44, providing a clear position for the installation of the vertical plate 4, avoiding the installation deviation of the vertical plate 4 affecting the performance of the entire packaging structure, such as preventing the vertical plate 4 from blocking the pin 11 or interfering with other components. The iron block 431 set at the insertion end of the limit block 43 cooperates with the magnet 441 set on the inner wall of the socket 44, further enhancing the stability of the connection. In the process of inserting the limit block 43 into the socket 44, the iron block 431 will be affected by the magnetic attraction of the magnet 441. During the operation of the equipment, even if it encounters vibration, shaking, etc., the magnetic attraction force can ensure the stable position of the vertical plate 4, avoid the shaking of the vertical plate 4 causing unstable connection of the pin 11, and ensure that the silicon carbide packaging structure main body 1 can operate reliably in various working environments.

[0057] Reference Figure 7 As shown: a third heat dissipation plate 45 is provided on one side of the vertical plate 4 close to the silicon carbide packaging structure body 1 and abuts against the silicon carbide packaging structure body 1. A plurality of first heat dissipation grooves 451 are provided on the surface of the third heat dissipation plate 45 close to the silicon carbide packaging structure body 1.

[0058] The silicon carbide packaging structure main body 1 will generate a large amount of heat during operation. The third heat sink 45 is directly in contact with the silicon carbide packaging structure main body 1, providing an additional path for heat transfer. The third heat sink 45 is close to the surface of the silicon carbide packaging structure main body 1 and is provided with a plurality of first heat dissipation grooves 451 arranged at intervals, which increases the heat dissipation area. The increase in the heat dissipation area can cover a wider area for heat exchange with the surrounding air. After the heat is conducted from the silicon carbide packaging structure main body 1 to the third heat sink 45, it will be quickly dissipated into the surrounding air through these heat dissipation grooves. The heat dissipation grooves arranged at intervals can also promote air flow, so that hot air can be replaced by cold air more quickly, further improving the heat dissipation effect.

[0059] Reference Figure 8 As shown, the outer surfaces of the first heat dissipation plate 2 and the second heat dissipation plate 3 are respectively provided with second heat dissipation grooves 33 .

[0060] When the silicon carbide packaging structure body 1 generates heat during operation, the heat will be transferred to the first heat sink 2 and the second heat sink 3 connected to it, and the heat dissipation area will be increased through the second heat dissipation groove 33. The larger the heat dissipation area, the more heat can be dissipated in the same time, which helps to maintain the thermal stability of the entire silicon carbide packaging structure body 1.

[0061] Reference Figure 8 and Figure 9As shown: a first connection port 31 is provided at each corner of the second heat dissipation plate 3, and a second connection port 25 corresponding to each first connection port 31 is provided on the first heat dissipation plate 2, and the first connection port and the second connection port 25 are connected by a precision screw 32.

[0062] When installing the silicon carbide packaging structure main body 1, the first connection port 31 at the corner of the second heat sink 3 and the corresponding second connection port 25 on the first heat sink 2 provide installation positions for the precision screw 32. The precision screw 32 is passed through the first connection port 31 and the second connection port 25. By rotating the precision screw 32, it is gradually tightened under the action of the thread. In this way, the first heat sink 2 and the second heat sink 3 are tightly connected together to form a stable frame structure, which firmly fixes the silicon carbide packaging structure main body 1 in the middle.

[0063] The present invention also provides a packaging method for a silicon carbide packaging structure, which is applied to the above-mentioned silicon carbide packaging structure and includes the following steps:

[0064] S1. Install two first heat sinks 2 on both sides of the silicon carbide package structure main body 1, and two second heat sinks 3 on the upper and lower sides of the silicon carbide package structure main body 1. Connect and fix them through the first connecting port 31, the second connecting port 25 and the precision screw 32 to form a mounting groove for accommodating the silicon carbide package structure main body 1;

[0065] S2. Wrap the opening of the riser 4 with an insulating rubber layer 411, install a limit block 43 at the corner of the riser 4 close to the silicon carbide packaging structure body 1, install an insert 42 with a curved spring 4211 and a clamping portion 421 on both sides of the riser 4, and install a third heat sink 45 on the side of the riser 4 close to the silicon carbide packaging structure body 1;

[0066] S3, align the opening 41 of the vertical plate 4 with the pin 11 so that the end of the pin 11 is located at the opening 41. At this time, the vertical plate 4 plays a role in protecting the pin 11;

[0067] S4. Push the vertical plate 4 so that the insert 42 is inserted along the channel 21 of the first heat sink 2. The raised portion of the arc-shaped spring piece 4211 is snapped into the first snap-fit ​​groove 23 or the second snap-fit ​​groove 24. At the same time, the limit block 43 is inserted into the corresponding socket 44 on the first heat sink 2. The iron block 431 and the magnet 441 are used to fix the pins 41. The through-hole 41 on the vertical plate 4 is moved horizontally along the pins 11 to be close to the front side of the silicon carbide packaging structure body 1, so that the pins 11 are completely exposed.

[0068] The above embodiments merely represent one or more embodiments of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, and all such modifications and improvements fall within the scope of protection of the present invention.

Claims

1. A silicon carbide packaging structure, comprising a silicon carbide packaging structure body (1), wherein a pin (11) is provided on the front side of the silicon carbide packaging structure body (1), characterized in that: The first heat sink (2) is installed on both side surfaces of the silicon carbide packaging structure main body (1), and the second heat sink (3) is installed on both upper and lower side surfaces of the silicon carbide packaging structure main body (1). The two first heat sinks (2) and the two second heat sinks (3) form a mounting groove for accommodating the silicon carbide packaging structure main body (1). The front side of the silicon carbide packaging structure main body (1) is also provided with a vertical plate (4) that can move along the horizontal direction of the pin (11), and the vertical plate (4) is provided with a through hole (41) for the pin (11) to pass through. The two sides of the vertical plate (4) are provided with inserts (42) that can be inserted into the corresponding two first heat sinks (2), and the end surface of the insert (42) away from the vertical plate (4) is provided with a clamping portion (421). The first heat sink ( 2) is provided with a plug-in slot that is engaged with the engaging portion (421); the first heat dissipation plate (2) is provided with a channel (21) for inserting the insert (42), and the upper and lower sides of the channel (21) are mirror-imaged with sliding seats (22), and the adjacent sides of the two sliding seats (22) are respectively provided with slots (221) for sliding engagement with the upper and lower sides of the insert (42), and the gap between the two slots (221) constitutes a space for inserting the insert (42); the plug-in slot on the first heat dissipation plate (2) includes a first engaging slot (23) and a second engaging slot (24) that can be engaged with the engaging portion (421), the first engaging slot (23) is opened on the side of the channel (21) close to the pin (11), and the second engaging slot (24) is opened on the side of the channel (21) away from the pin (11).

2. The silicon carbide packaging structure according to claim 1, characterized in that: The inner wall of the through opening (41) of the vertical plate (4) is wrapped with an insulating rubber layer (411) that is slidably matched with the outside of the pin (11).

3. The silicon carbide packaging structure according to claim 1, characterized in that: The clamping portion (421) comprises an elastic arc-shaped spring piece (4211), the arc-shaped spring piece (4211) being arranged on the inserting piece (42), the protrusion of the arc-shaped spring piece (4211) being capable of being inserted into the first clamping groove (23) and the second clamping groove (24), and the edges of the first clamping groove (23) and the second clamping groove (24) being provided with an arc surface (241) for allowing the arc-shaped spring piece (4211) to enter the first clamping groove (23) and the second clamping groove (24).

4. The silicon carbide packaging structure according to claim 1, characterized in that: A limiting block (43) is provided at each corner of the side of the vertical plate (4) close to the silicon carbide packaging structure body (1), and a socket (44) for plugging and mating with the limiting block (43) is provided on the side of each first heat dissipation plate (2) close to the vertical plate (4), an iron block (431) is provided at the insertion end of the limiting block (43), and a magnet (441) that is magnetically engaged with the iron block (431) is provided on the inner wall of the socket (44).

5. The silicon carbide packaging structure according to claim 1, characterized in that: A third heat dissipation plate (45) is provided on one side of the vertical plate (4) close to the silicon carbide packaging structure body (1) and is in contact with the silicon carbide packaging structure body (1). A plurality of first heat dissipation grooves (451) are provided on a surface of the third heat dissipation plate (45) close to the silicon carbide packaging structure body (1).

6. The silicon carbide packaging structure according to claim 1, characterized in that: Second heat dissipation slots (33) are respectively provided on the outer surfaces of the first heat dissipation plate (2) and the second heat dissipation plate (3).

7. The silicon carbide packaging structure according to claim 1, characterized in that: Each corner of the second heat sink (3) is provided with a first connection port (31), and the first heat sink (2) is provided with a second connection port (25) corresponding one-to-one to each first connection port (31), and the first connection port and the second connection port (25) are connected via a precision screw rod (32).

8. A packaging method for a silicon carbide packaging structure, applied to a silicon carbide packaging structure according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1. Install two first heat dissipation plates (2) on both sides of the silicon carbide packaging structure body (1), and install two second heat dissipation plates (3) on the upper and lower sides of the silicon carbide packaging structure body (1), and connect and fix them through the first connection port (31), the second connection port (25) and the precision screw rod (32) to form a mounting groove for accommodating the silicon carbide packaging structure body (1); S2. Wrap the inside of the opening of the vertical plate (4) with an insulating rubber layer (411), install a limit block (43) at the corner of the vertical plate (4) close to the silicon carbide packaging structure body (1), install an insert (42) with an arc-shaped spring (4211) clamping portion (421) on both sides of the vertical plate (4), and install a third heat dissipation plate (411) on the side of the vertical plate (4) close to the silicon carbide packaging structure body (1). 5); S3, align the through-hole (41) of the vertical plate (4) with the pin (11), so that the end of the pin (11) is located at the through-hole (41), and the vertical plate (4) plays the role of protecting the pin (11); S4, push the vertical plate (4), so that the insert (42) is inserted along the channel (21) of the first heat dissipation plate (2), and the raised portion of the arc-shaped spring piece (4211) is snapped into the first snap-fit ​​groove (23) or the second snap-fit ​​groove (24), and at the same time, the limit block (43) is inserted into the corresponding socket (44) on the first heat dissipation plate (2), and is fixed by the magnetic attraction of the iron block (431) and the magnet (441), and the through-hole (41) on the vertical plate (4) is moved horizontally along the pin (11) to be close to the front side of the silicon carbide packaging structure body (1), so that the pin (11) is completely exposed.

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