Sensor assembly and sensor device

Abstract

A sensor module (12) is provided with: an intermediate member (18); a flexible substrate (16) wound around the intermediate member; and a sensor element (20) provided with a lead portion (34) penetrating through the flexible substrate and inserted into the intermediate member, the flexible substrate being wound around the intermediate member such that a first portion (24) of the flexible substrate and a second portion (26) different from the first portion overlap and come into contact with each other, and the lead portion penetrating through the first portion and the second portion and being inserted into the intermediate member.

Description

Technical Field

[0001] The present invention relates to a sensor assembly and a sensor device. Background Art

[0002] Japanese Patent Application Laid-Open No. 2000-165034 describes a flexible printed circuit board (flexible substrate) that is a printed circuit board having flexibility.

[0003] A technology for easily constructing a good sensor module using a flexible substrate is desired. Summary of the Invention

[0004] The present invention aims to solve the above-mentioned technical problems.

[0005] A first aspect of the present invention is a sensor assembly comprising: an intermediate member; a flexible substrate wound around the intermediate member; and a sensor element including a lead portion that passes through the flexible substrate and is inserted into the intermediate member, wherein the flexible substrate is wound around the intermediate member such that a first portion of the flexible substrate and a second portion of the flexible substrate, different from the first portion, overlap and contact each other, and the lead portion passes through the first portion and the second portion and is inserted into the intermediate member.

[0006] A second aspect of the present invention is a sensor assembly comprising: an intermediate member; a flexible substrate wound around the intermediate member; and a sensor element including a lead portion that passes through the flexible substrate and is inserted into the intermediate member, the flexible substrate being wound around the intermediate member such that a first end portion of the flexible substrate and a second end portion of the flexible substrate are adjacent to each other, the lead portion including a first lead and a second lead, the first lead passing through the first end portion and being inserted into the intermediate member, and the second lead passing through the second end portion and being inserted into the intermediate member.

[0007] A third aspect of the present invention is a sensor device including the sensor module according to the first aspect or the second aspect, and a housing that accommodates at least the flexible substrate and the intermediate member in the sensor module.

[0008] According to the present invention, it is possible to provide a sensor module and a sensor device that can be configured in an excellent and simple manner even when a flexible substrate is used. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a perspective view of the sensor device according to the first embodiment.

[0010] Figure 2 This is an exploded perspective view of the sensor device.

[0011] Figure 3 This is an exploded perspective view of the sensor assembly.

[0012] Figure 4 yes Figure 1 Cross-sectional view along line IV-IV.

[0013] Figure 5 yes Figure 4 VV line cross-sectional view.

[0014] Figure 6 is a perspective view of the sensor assembly.

[0015] Figure 7 It is a diagram for explaining the sensor module according to Modification 1-1.

[0016] Figure 8 It is a diagram for explaining the sensor device according to Modification 1-3.

[0017] Figure 9 It is a perspective view of a sensor module according to a second embodiment.

[0018] Figure 10 yes Figure 9 XX line cross-sectional view.

[0019] Figure 11 It is a perspective view showing a sensor module according to Modification 2-1.

[0020] Figure 12 yes Figure 11 Cross-sectional view along line XII-XII. DETAILED DESCRIPTION

[0021] When a sensor element is provided on a flexible substrate, it is difficult to position the sensor element due to the flexibility of the flexible substrate. If the sensor element is not reliably positioned, the performance of the sensor device may be adversely affected.

[0022] [First embodiment]

[0023] Figure 1 It is a perspective view of the sensor device 10 according to the first embodiment. Figure 2 : is an exploded perspective view of the sensor device 10. Figure 1 This is a perspective view of the upper side of the housing 14 described later. Figure 2 It is a bottom perspective view of the housing 14 .

[0024] The sensor device 10 includes a sensor assembly 12 and a housing 14. The sensor assembly 12 is accommodated in the housing 14. The sensor device 10 is, for example, an automatic switch (cylinder sensor) for detecting the position of a piston included in an air cylinder, but is not limited thereto.

[0025] The housing 14 is a shell that houses the sensor assembly 12. The housing 14 includes Figure 1 The upper portion 14u and Figure 2 The housing 14 also includes a substrate housing portion 141 and a sensor housing portion 142 .

[0026] The substrate housing portion 141 has a rectangular parallelepiped shape and houses the flexible substrate 16 and the intermediate member 18 described later. In this embodiment, the upper surface of the substrate housing portion 141 forms an upper portion 14u.

[0027] The sensor housing portion 142 protrudes downward from the substrate housing portion 141. In this embodiment, the sensor housing portion 142 is included in the lower portion 14b. The sensor housing portion 142 houses the sensor element 20 and the spacer 22, which will be described later. The sensor housing portion 142 can also function as a mounting portion for mounting the sensor device 10 on the air cylinder, for example, by engaging with a groove formed in the air cylinder.

[0028] The sensor module 12 includes a flexible substrate 16 , an intermediate member 18 , a sensor element 20 , and a spacer 22 .

[0029] Figure 3 It is an exploded perspective view of the sensor assembly 12 .

[0030] The flexible substrate 16 is a flexible circuit substrate. Although not shown in the figure, a predetermined circuit is formed on the flexible substrate 16. The sensor element 20 constitutes a part of the circuit. Figure 2 As shown, the flexible substrate 16 is wrapped around the intermediate member 18 . Figure 2 The winding direction DW shown indicates the direction in which the flexible substrate 16 is wound relative to the intermediate member 18. The winding direction DW of the flexible substrate 16 relative to the intermediate member 18 is along the length direction of the flexible substrate 16.

[0031] The flexible substrate 16 wound around the intermediate member 18 has two portions (24, 26) that overlap and contact each other. In this embodiment, one of these two portions is also referred to as the first portion 24. In this embodiment, the other of these two portions is also referred to as the second portion 26.

[0032] The first portion 24 is located at one end 16t of the flexible substrate 16. The second portion 26 is a portion different from the first portion 24. The second portion 26 is located at the other end of the flexible substrate 16. The first portion 24 and the second portion 26 overlap when viewed from above. The second portion 26 is covered by the first portion 24.

[0033] The intermediate member 18 is a member that is harder than the flexible substrate 16. The intermediate member 18 is made of a resin material such as acrylic. The shape of the intermediate member 18 is, for example, a plate. The intermediate member 18 has a locking portion 30 (see FIG. 1 ) to be described later. Figure 4 ) The engaging portion 28 is engaged.

[0034] Figure 4 yes Figure 1 Cross-sectional view along line IV-IV.

[0035] The engaging portion 28 is, for example, located in a portion of the intermediate member 18 that is not covered by the flexible substrate 16. The engaging portion 28 is, for example, formed as a recessed portion, but is not limited thereto. The intermediate member 18 may include multiple engaging portions 28. For example, the intermediate member 18 may include side portions 18s1 and 18s2 that are not covered by the flexible substrate 16. The engaging portion 28 may be provided on each of the side portions 18s1 and 18s2.

[0036] The engaging portion 28 engages with an engaging portion (engaged portion) 30 provided on the housing 14. The engaging portion 30 is formed, for example, by a protrusion, but is not limited thereto. The housing 14 may include a number of engaging portions 30 corresponding to the number of engaging portions 28. The engagement of the engaging portions 28 and 30 positions the intermediate component 18 relative to the housing 14.

[0037] Figure 5 yes Figure 4 In addition, Figure 5 Only a portion of the cross-section of the sensor assembly 12 is shown. Figure 6 is a perspective view of the sensor assembly 12. In addition, Figure 6 Only a portion of the sensor assembly 12 is shown.

[0038] The sensor element 20 includes a main body 32 and a lead portion 34. The sensor element 20 is, for example, a magnetic sensor, but is not limited thereto. The sensor element 20 may be, for example, a temperature sensor, a flow sensor, a semiconductor sensor, etc. The sensor element 20 constitutes a part of the aforementioned circuit.

[0039] The main body portion 32 is a portion of the sensor element 20 for detecting a predetermined physical quantity as a detection target. For example, when the sensor element 20 is a magnetic sensor, the main body portion 32 detects magnetic force.

[0040] The lead portion 34 electrically connects the flexible substrate 16 and the main body 32. More specifically, the lead portion 34 electrically connects a conductive pattern (not shown) that constitutes part of the circuit formed on the flexible substrate 16 to the main body 32. The lead portion 34 includes two leads 36 (361, 362) extending from the main body 32. Specifically, the lead portion 34 includes a first lead 361 and a second lead 362. Although not shown, the first lead 361 and the second lead 362 are each secured to the flexible substrate 16 by, for example, soldering, and are electrically connected to the conductive pattern. The number of leads 36 included in the lead portion 34 is not limited to two.

[0041] The sensor element 20 outputs a detection signal corresponding to a predetermined physical quantity via a conductor pattern formed on the flexible substrate 16. This detection signal is transmitted to the outside of the sensor device 10 via, for example, a wireless communication circuit (not shown) formed on the flexible substrate 16. The power used by the sensor element 20 to generate and output the detection signal can be supplied to the sensor element 20 from, for example, a battery, a capacitor, or the like, but is not limited thereto.

[0042] The spacer 22 is a component positioned between the main body 32 and the flexible substrate 16. The main body 32 of the sensor element 20 can be fixed to the spacer 22. The spacer 22 ensures a sufficient separation distance H32 between the main body 32 and the flexible substrate 16. The separation distance H32 is the distance in the normal direction of the main surface of the flexible substrate 16. The lead portion 34 passes through the spacer 22.

[0043] The overlapping portion of the first portion 24 and the second portion 26 and the spacer 22 are arranged to sandwich the intermediate member 18. The lead portion 34 penetrating the spacer 22 penetrates the intermediate member 18 and further penetrates the first portion 24 and the second portion 26.

[0044] More specifically, through-holes 38 are formed in the flexible substrate 16. In this embodiment, the number of through-holes 38 (381, 382) formed in the flexible substrate 16 corresponds to the number of leads 36 included in the lead portion 34. That is, in this embodiment, two through-holes 38 are formed in the flexible substrate 16. In the following description, one of the two through-holes 38 is also referred to as the first through-hole 381. The other of the two through-holes 38 is also referred to as the second through-hole 382. The first through-hole 381 penetrates the first portion 24 and the second portion 26. The second through-hole 382 also penetrates the first portion 24 and the second portion 26. Insertion holes 40 are formed in the intermediate member 18. In this embodiment, the number of insertion holes 40 (401, 402) corresponding to the number of leads 36 included in the lead portion 34 is formed in the intermediate member 18. That is, two insertion holes 40 are formed in the intermediate member 18. In the following description, one of the two insertion holes 40 is also referred to as the first insertion hole 401. The other of the two insertion holes 40 is also referred to as a second insertion hole 402. The first insertion hole 401 communicates with the first through-hole 381. The second insertion hole 402 communicates with the second through-hole 382. The first lead 361 of the lead portion 34 is inserted into the first through-hole 381 via the first insertion hole 401. The second lead 362 of the lead portion 34 is inserted into the second through-hole 382 via the second insertion hole 402.

[0045] The lead wire 36 is inserted into the intermediate member 18, thereby positioning the sensor element 20 relative to the intermediate member 18. The intermediate member 18 is positioned relative to the housing 14 by the engaging portion 28. Therefore, according to this embodiment, the sensor element 20 is positioned relative to the housing 14. Furthermore, according to this embodiment, the lead wire portion 34 protrudes from the portion where the first portion 24 and the second portion 26 overlap (see also FIG. Figure 5 、 Figure 6 Thus, the portion of the lead portion 34 that protrudes from the overlapping portion of the first portion 24 and the second portion 26 can be easily soldered to the flexible substrate 16 .

[0046] Furthermore, the sensor element 20 mounted on the intermediate member 18 via the flexible substrate 16 functions as a fixture that secures the flexible substrate 16 to the intermediate member 18. This helps position the flexible substrate 16 relative to the intermediate member 18. Consequently, the flexible substrate 16 is also positioned relative to the housing 14. Because the sensor element 20 secures the flexible substrate 16 relative to the intermediate member 18, screws, etc., are no longer required to secure the flexible substrate 16 to the intermediate member 18. Therefore, according to this embodiment, the number of parts required to manufacture the sensor assembly 12 can be reduced.

[0047] The through-hole 38 is formed at a predetermined position in the flexible substrate 16 before the sensor element 20 is mounted on the flexible substrate 16. Furthermore, the insertion hole 40 is formed at a predetermined position in the intermediate member 18 before the sensor element 20 is mounted on the intermediate member 18 via the flexible substrate 16. In this case, the through-hole 38 and the insertion hole 40 also serve as markers for aligning the intermediate member 18 with the flexible substrate 16. Specifically, by wrapping the flexible substrate 16 around the intermediate member 18 so that the through-hole 38 and the insertion hole 40 communicate, the flexible substrate 16 is more accurately positioned relative to the intermediate member 18. Furthermore, by inserting the lead wires 36 of the sensor element 20 into the pre-formed insertion hole 40, the sensor element 20 is more accurately positioned relative to the intermediate member 18.

[0048] Furthermore, the diameter L38 (L381, L382) of the through-hole 38 is preferably larger than the diameter L36 (L361, L362) of the lead wire 36 inserted into the through-hole 38. In other words, the diameter L381 of the first through-hole 381 is preferably larger than the diameter L361 of the first lead wire 361. Furthermore, the diameter L382 of the second through-hole 382 is preferably larger than the diameter L362 of the second lead wire 362. This facilitates insertion of the lead wire 36 into the through-hole 38.

[0049] The diameter L40 (L401, L402) of the insertion hole 40 is also preferably larger than the diameter L36 of the lead wire 36 to be inserted into the insertion hole 40. In other words, the diameter L401 of the first insertion hole 401 is preferably larger than the diameter L361 of the first lead wire 361. Similarly, the diameter L402 of the second insertion hole 402 is preferably larger than the diameter L362 of the second lead wire 362. This facilitates insertion of the lead wire 36 into the insertion hole 40.

[0050] In this embodiment, the diameter L381 of the first through hole 381 is equal to the diameter L401 of the first insertion hole 401, but the present invention is not limited thereto. Similarly, in this embodiment, the diameter L382 of the second through hole 382 is equal to the diameter L402 of the second insertion hole 402, but the present invention is not limited thereto.

[0051] The lead wire 36 preferably penetrates the end portion 16t of the flexible substrate 16. In other words, at least one of the first through hole 381 and the second through hole 382 is preferably located at the end portion 16t of the flexible substrate 16. This secures the end portion 16t to the sensor element 20. As a result, the end portion 16t is prevented from curling up.

[0052] In this embodiment, the overlapping portion of the first portion 24 and the second portion 26 is described as being penetrated by two lead wires 36. However, the present invention is not limited to this embodiment. Alternatively, the overlapping portion of the first portion 24 and the second portion 26 may be penetrated by at least one of the two lead wires 36 included in the sensor element 20.

[0053] [Modifications of the First Embodiment]

[0054] The following describes a modified example of the first embodiment. Note that descriptions of matters already described in the first embodiment are omitted as appropriate. Elements already described in the first embodiment are denoted by the same reference numerals as in the first embodiment.

[0055] (Variation 1-1)

[0056] Figure 7 It is a diagram for explaining the sensor module 121 according to the modification 1-1.

[0057] like Figure 7 As shown, spacer 22 can be placed in the area where first portion 24 and second portion 26 overlap. In other words, sensor element 20 can be placed in the area where first portion 24 and second portion 26 overlap, via spacer 22. Lead portion 34, which passes through spacer 22, further passes through first portion 24 and second portion 26 and is inserted into intermediate member 18. More specifically, first lead 361 of lead portion 34 is inserted into first insertion hole 401 via first through-hole 381. Second lead 362 of lead portion 34 is inserted into second insertion hole 402 via second through-hole 382.

[0058] (Variation 1-2)

[0059] exist Figure 2 In the illustrated example, the engaging portion 28 of the intermediate member 18 is configured as a recessed portion, but the present invention is not limited thereto. The engaging portion 28 of the intermediate member 18 may also be configured as a convex portion protruding from the intermediate member 18. In this case, the engaging portion 30 of the housing 14 may include, for example, a recessed portion that engages with the convex portion.

[0060] (Variation 1-3)

[0061] Figure 8 It is a diagram for explaining the sensor device 103 according to Modification 1-3.

[0062] The sensor device 103 includes a sensor element 203. Figure 8As shown, the main body 323 of the sensor element 203 is not housed in the housing 143 but is exposed. The main body 323 exposed from the housing 143 is arranged in the flow path 46 through which the fluid FL flows. Thus, the main body 323 contacts the fluid FL flowing in the flow path 46, and can detect the flow rate, pressure, temperature, etc. of the fluid FL.

[0063] The housing 143 has an opening 48. The main body 323 of the sensor element 203 protrudes from the housing 143 to the outside through the opening 48. The housing 143 accommodates at least the flexible substrate 16 and the intermediate member 18.

[0064] Furthermore, when opening 48 is formed in housing 143, fluid FL may enter housing 143 through opening 48. Fluid FL entering housing 143 may adversely affect flexible substrate 16 (circuit) and intermediate member 18 housed therein.

[0065] Therefore, in this modification, the opening 48 is closed by the spacer 223. This can reduce the risk of the fluid FL entering the housing 143.

[0066] Furthermore, the housing 143 and the spacer 223 may have thermal insulation properties. This can prevent heat from the fluid FL from being transferred to the interior of the housing 143. This reduces the risk that the heat from the fluid FL may adversely affect the flexible substrate 16 (circuit) and the intermediate member 18 disposed within the housing 143.

[0067] (Variation 1-4)

[0068] The above-mentioned multiple modified examples can be appropriately combined within a range without contradiction.

[0069] [Second embodiment]

[0070] The second embodiment will be described below. Explanations that overlap with those of the first embodiment will be omitted as appropriate. Elements described in the first embodiment are denoted by the same reference numerals in this embodiment unless otherwise specified.

[0071] Figure 9 : is a perspective view of the sensor assembly 42 according to the second embodiment. Figure 9 A portion of the sensor assembly 42 is shown in FIG.

[0072] The sensor assembly 42 includes the flexible substrate 16, the intermediate member 18, the sensor element 20, and the spacer 22, similarly to the sensor assembly 12 of the first embodiment. The sensor assembly 42 can be housed in the housing 14 (see Figure 1 、 Figure 2 ).

[0073] The flexible substrate 16 has a first end portion 16t1 and a second end portion 16t2. The first end portion 16t1 is one end portion 16t in the longitudinal direction of the flexible substrate 16. The second end portion 16t2 is the other end portion 16t in the longitudinal direction of the flexible substrate 16.

[0074] In this embodiment, the first end portion 16t1 and the second end portion 16t2 are wound around the intermediate member 18 so as to be close to each other. The first end portion 16t1 and the second end portion 16t2 do not overlap each other when viewed from above. Thus, the flexible substrate 16 of this embodiment is wound around the intermediate member 18 differently from the first embodiment.

[0075] Figure 10 yes Figure 9 XX line cross-sectional view.

[0076] In this embodiment, a first through-hole 441 is formed in the first end portion 16t1 of the flexible substrate 16. The first through-hole 441 is formed at a predetermined position in the first end portion 16t1 before the sensor element 20 is mounted on the flexible substrate 16. The first through-hole 441 communicates with the first insertion hole 401 formed in the intermediate member 18. The first lead 361 of the sensor element 20 is inserted into the first through-hole 441 via the first insertion hole 401.

[0077] Furthermore, a second through-hole 442 is formed in the second end portion 16t2 of the flexible substrate 16. The second through-hole 442 is formed at a predetermined position in the second end portion 16t2 before the sensor element 20 is mounted on the flexible substrate 16. The second through-hole 442 communicates with the second insertion hole 402 formed in the intermediate member 18. The second lead 362 of the sensor element 20 is inserted into the second through-hole 442 via the second insertion hole 402.

[0078] In this manner, the first lead wire 361 is inserted into the intermediate member 18, and the second lead wire 362 is inserted into the intermediate member 18. Thus, the sensor element 20 is positioned relative to the intermediate member 18.

[0079] The sensor element 20 also functions as a fixture that secures the first end 16t1 and second end 16t2 of the flexible substrate 16 to the intermediate member 18. This helps position the flexible substrate 16 relative to the intermediate member 18. Furthermore, the first lead 361 protrudes from the first end 16t1. Therefore, soldering the first lead 361 to the first end 16t1 facilitates connection between the first lead 361 and the flexible substrate 16. Furthermore, the second lead 362 protrudes from the second end 16t2. Therefore, soldering the second lead 362 to the second end 16t2 facilitates connection between the second lead 362 and the flexible substrate 16.

[0080] The diameter L441 of the first through-hole 441 is preferably larger than the diameter L361 of the first lead 361. This facilitates insertion of the first lead 361 into the first through-hole 441. Similarly, the diameter L442 of the second through-hole 442 is preferably larger than the diameter L362 of the second lead 362. This facilitates insertion of the second lead 362 into the second through-hole 442.

[0081] In addition, in this embodiment, the diameter L441 of the first through hole 441 is the same as the diameter L401 of the first insertion hole 401, but the present invention is not limited thereto. Similarly, in this embodiment, the diameter L442 of the second through hole 442 is the same as the diameter L402 of the second insertion hole 402, but the present invention is not limited thereto.

[0082] [Modification of the Second Embodiment]

[0083] The following describes a modified example of the second embodiment. Note that descriptions of matters already described in the second embodiment are omitted as appropriate. Elements already described in the second embodiment are denoted by the same reference numerals as in the second embodiment.

[0084] (Variation 2-1)

[0085] Figure 11 It is a perspective view showing a sensor module 421 according to Modification 2-1. Figure 12 yes Figure 11 Cross-sectional view along line XII-XII.

[0086] In this modification, the first lead wire 361 passes through the first end portion 16t1 and further passes through the intermediate member 18. The first lead wire 361 is fixed to the first end portion 16t1 by, for example, soldering.

[0087] The second lead wire 362 passes through the second end portion 16t2 and further passes through the intermediate member 18. The second lead wire 362 is fixed to the second end portion 16t2 by, for example, soldering.

[0088] (Variation 2-2)

[0089] exist Figure 9 In the illustrated example, the engaging portion 28 of the intermediate member 18 is formed by a recessed portion, but the present invention is not limited thereto. The engaging portion 28 of the intermediate member 18 may also be formed by a convex portion protruding from the intermediate member 18. In this case, the engaging portion 30 of the housing 14 may include, for example, a recessed portion that engages with the convex portion.

[0090] (Variation 2-3)

[0091] The above-mentioned multiple modified examples can be appropriately combined within a range without contradiction.

[0092] [Inventions that can be understood from the embodiments]

[0093] The invention that can be grasped based on the above-mentioned embodiment and modified examples will be described below.

[0094] <Note 1>

[0095] The sensor assembly 12 includes an intermediate member 18, a flexible substrate 16 wound around the intermediate member, and a sensor element 20 having a lead portion 34 that passes through the flexible substrate and is inserted into the intermediate member. The flexible substrate is wound around the intermediate member such that a first portion 24 of the flexible substrate and a second portion 26, different from the first portion, of the flexible substrate overlap and contact each other. The lead portion passes through the first and second portions and is inserted into the intermediate member. This provides a sensor assembly that can be constructed in an excellent and simple manner even when using a flexible substrate.

[0096] <Note 2>

[0097] In the sensor assembly described in Supplementary Note 1, the lead wire 36 of the lead portion may be inserted into an insertion hole 40 formed in the intermediate member, and a diameter L36 of the lead wire may be smaller than a diameter L40 of the insertion hole. This facilitates insertion of the lead wire into the insertion hole.

[0098] <Note 3>

[0099] In the sensor assembly described in Supplement 1 or 2, the lead wire 36 included in the lead portion may be inserted into a through hole 38 formed in the flexible substrate, and the diameter L36 of the lead wire may be smaller than the diameter L38 of the through hole. This facilitates insertion of the lead wire into the through hole.

[0100] <Note 4>

[0101] A sensor assembly 42 includes: an intermediate member 18; a flexible substrate 16 wound around the intermediate member; and a sensor element 20 having a lead portion 34 extending through the flexible substrate and inserted into the intermediate member. The flexible substrate is wound around the intermediate member such that a first end portion 16t1 of the flexible substrate and a second end portion 16t2 of the flexible substrate are adjacent to each other. The lead portion includes a first lead 361 extending through the first end portion and inserted into the intermediate member, and a second lead 362 extending through the second end portion and inserted into the intermediate member. This provides a sensor assembly that can be constructed in an excellent and simple manner even when using a flexible substrate.

[0102] <Note 5>

[0103] The sensor assembly described in Supplementary Note 4 may be configured such that the first lead wire is inserted into a first insertion hole 401 formed in the intermediate member, and the second lead wire is inserted into a second insertion hole 402 formed in the intermediate member, wherein the diameter L361 of the first lead wire is smaller than the diameter L401 of the first insertion hole, and the diameter L362 of the second lead wire is smaller than the diameter L402 of the second insertion hole. This facilitates insertion of the first lead wire into the first insertion hole and the second lead wire into the second insertion hole.

[0104] <Note 6>

[0105] In the sensor assembly described in Supplementary Note 4 or 5, the first lead wire may be inserted into a first through-hole 441 formed in the flexible substrate, and the second lead wire may be inserted into a second through-hole 442 formed in the flexible substrate. The diameter L361 of the first lead wire may be smaller than the diameter L441 of the first through-hole, and the diameter L362 of the second lead wire may be smaller than the diameter L442 of the second through-hole. This facilitates the insertion of the first lead wire through the first through-hole and the insertion of the second lead wire through the second through-hole.

[0106] <Note 7>

[0107] In the sensor assembly according to any one of Supplementary Notes 1 to 6, the lead portion may not penetrate the intermediate member. This ensures that the distal end of the lead portion is reliably insulated.

[0108] <Note 8>

[0109] The sensor assembly according to any one of Supplementary Notes 1 to 7 may further include a spacer 22 disposed between the main body 32 of the sensor element and the flexible substrate. This spacer can maintain the distance between the flexible substrate and the main body at a predetermined distance or greater.

[0110] <Note 9>

[0111] In the sensor assembly described in any one of Supplementary Notes 1 to 8, the intermediate member may include an engaging portion 28 that engages with the housing 14 that accommodates the sensor assembly. This allows the intermediate member to be fixed to the housing.

[0112] <Note 10>

[0113] The sensor device 10 includes: the sensor module described in any one of Supplementary Notes 1 to 9; and a housing 14 or 143 that houses at least the flexible substrate and the intermediate member in the sensor module.

[0114] In addition, the present invention is not limited to the above disclosure, and various structures can be adopted without departing from the gist of the present invention.

[0115] Explanation of symbols

[0116] 10, 103… equipment

[0117] 12, 42, 121, 421…sensor components

[0118] 14, 143...housing 16...flexible substrate

[0119] 16t…end 16t1…first end

[0120] 16t2 ...Second end 18 ...Intermediate member

[0121] 20, 203...sensor element 22, 221, 223...spacer

[0122] 24…first part 26…second part

[0123] 28, 30... Engaging portion 32, 323... Main body

[0124] 34...lead portion 36...lead

[0125] 38...Through hole 40...Insert hole

[0126] 46...Flow path 48...Opening part

[0127] 361…first lead 362…second lead

[0128] 381 ...first through hole 382 ...second through hole

[0129] 401 ...first insertion hole 402 ...second insertion hole

[0130] 441…first through hole 442…second through hole

[0131] FL…fluid.

Claims

1. A sensor assembly (12), characterized in that have: middle member (18); a flexible substrate (16) wound around the intermediate member; and A sensor element (20) includes a lead portion (34) that passes through the flexible substrate and is inserted into the intermediate member. The flexible substrate is wound around the intermediate member in such a manner that a first portion (24) of the flexible substrate and a second portion (26) of the flexible substrate, which is different from the first portion, overlap and contact each other. The lead portion passes through the first portion and the second portion and is inserted into the intermediate member.

2. The sensor assembly according to claim 1, wherein The lead wire (36) provided in the lead wire portion is inserted into an insertion hole (40) formed in the intermediate member. The diameter (L36) of the lead wire is smaller than the diameter (L40) of the insertion hole.

3. The sensor assembly according to claim 1, wherein: The lead (36) provided in the lead portion is inserted into a through hole (38) formed in the flexible substrate. The diameter (L36) of the lead wire is smaller than the diameter (L38) of the through hole.

4. A sensor assembly (42), characterized in that have: middle member (18); a flexible substrate (16) wound around the intermediate member; and A sensor element (20) includes a lead portion (34) that passes through the flexible substrate and is inserted into the intermediate member. The flexible substrate is wound around the intermediate member in such a manner that a first end portion (16t1) of the flexible substrate and a second end portion (16t2) of the flexible substrate are close to each other. The lead portion includes a first lead (361) and a second lead (362). The first lead passes through the first end portion and is inserted into the middle component, and the second lead passes through the second end portion and is inserted into the middle component.

5. The sensor assembly according to claim 4, wherein: The first lead wire is inserted into a first insertion hole (401) formed in the middle component, and the second lead wire is inserted into a second insertion hole (402) formed in the middle component. The diameter (L361) of the first lead wire is smaller than the diameter (L401) of the first insertion hole, and the diameter (L362) of the second lead wire is smaller than the diameter (L402) of the second insertion hole.

6. The sensor assembly according to claim 4, wherein: The first lead is inserted into a first through hole (441) formed in the flexible substrate, and the second lead is inserted into a second through hole (442) formed in the flexible substrate. The diameter (L361) of the first lead wire is smaller than the diameter (L441) of the first through hole, and the diameter (L362) of the second lead wire is smaller than the diameter (L442) of the second through hole.

7. The sensor assembly according to any one of claims 1 to 6, characterized in that: The lead portion does not penetrate the intermediate member.

8. The sensor assembly according to any one of claims 1 to 6, characterized in that: A spacer (22) is also provided, and the spacer is arranged between the main body (32) of the sensor element and the flexible substrate.

9. The sensor assembly according to any one of claims 1 to 6, characterized in that: The intermediate component is provided with an engaging portion (28) which engages with a housing (14) accommodating the sensor assembly.

10. A sensor device, characterized in that: have: The sensor assembly according to claim 1 or 4; and A housing (14, 143) accommodates at least the flexible substrate and the intermediate component in the sensor assembly.

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