A cleaning and drying apparatus for semiconductor wafers

Abstract

The application relates to the field of semiconductor processing, and discloses a cleaning and drying device for a semiconductor wafer, which comprises a box body, a sliding cover which is slidably connected to the upper portion of the box body, a gas supply mechanism which is fixedly installed in the interior of the box body, and a gas supply pipe which is communicated with the upper portion of the gas supply mechanism; a rotating table which is fixedly installed at the center of the interior of the box body, the upper surface of the rotating table being fixedly connected with a fixing seat, and the upper surface of the fixing seat being provided with an installation cavity. The upper telescopic rod is slowly elongated, the column body and the plurality of upper racks are driven to move downwards, the upper toothless gear is driven to rotate, the air outlet of the upper gas guide cover is slowly rotated to the edge of the semiconductor wafer, and thus the problem that the nitrogen gas ejection angle is fixed, different sizes or shapes of wafers cannot be adapted, some areas are dried too fast or liquid residues are caused, drying is uneven, and even water marks and spots are caused is solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to a cleaning and drying apparatus for semiconductor wafers. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single-crystal silicon. The single-crystal silicon is then cut into circular wafers. During the production process, micro-particles adhere to the surface of the wafer, requiring cleaning and drying.

[0003] The existing equipment for cleaning and drying wafers primarily utilizes the high-energy frequency vibration effect combined with the chemical reaction of the cleaning agent to clean the wafer. In operation, the wafer is first placed on a turntable and fixed. As the turntable rotates, a nozzle sprays cleaning agent onto the wafer surface, which cleans the wafer. Finally, heated nitrogen or air is sprayed onto the wafer surface through a gas tube to achieve drying. However, the current nitrogen spray angle is fixed, which cannot adapt to wafers of different sizes or shapes. This results in some areas drying too quickly or leaving residual liquid, leading to uneven drying and even problems such as watermarks and spots. Summary of the Invention

[0004] This application proposes a cleaning and drying device for semiconductor wafers, which has the advantages of uniform drying, high efficiency and no water marks. It solves the problem that the existing nitrogen spray angle is fixed and cannot adapt to wafers of different sizes or shapes, resulting in some areas drying too quickly or residual liquid, which leads to uneven drying and even water marks or spots.

[0005] To achieve the above objectives, this application adopts the following technical solution: a cleaning and drying device for semiconductor wafers, comprising a housing, a sliding cover slidably connected to the upper part of the housing, an air supply mechanism fixedly installed inside the housing, and an air supply pipe connected to the upper part of the air supply mechanism;

[0006] A rotating platform is fixedly installed inside the center of the housing. A fixed seat is fixedly connected to the upper surface of the rotating platform. An installation cavity is opened on the upper surface of the fixed seat. Multiple sealing rings are fixedly installed on the upper surface of the fixed seat. Multiple connecting air passages are opened on the upper part of the fixed seat.

[0007] An inner telescopic rod, the telescopic end of which is fixedly connected to a connecting plate, the upper surface of which is fixedly connected to multiple connectors, and the top of each connector is fitted with a sealing head;

[0008] A rotating arm is fixedly installed on the top of the housing, and an air guiding mechanism is fixedly installed on the front of the rotating arm;

[0009] The cleaning mechanism is arranged on the upper portion of the rotating table.

[0010] Preferably, the air guide mechanism comprises a mounting seat, an air cavity is formed in the mounting seat, an upper telescopic rod is fixedly installed on the upper portion of the mounting seat, a column body is fixedly connected to the telescopic end of the upper telescopic rod, a plurality of upper racks are fixedly connected to the side surface of the column body, a fan-shaped shell is fixedly connected to the lower surface of the mounting seat, an upper toothless gear is rotatably installed between two adjacent fan-shaped shells, an upper T-shaped channel is formed in the upper toothless gear, and an upper air guide cover is fixedly connected to the lower portion of the upper toothless gear.

[0011] The above structure can work as follows: when working, the gas supply mechanism works, the temperature-appropriate nitrogen gas is supplied to the inside of the air cavity through the gas supply pipe, the nitrogen gas with appropriate temperature in the air cavity enters the fan-shaped shell and the upper T-shaped channel first, and is finally discharged from the upper air guide cover. Since the openings of the plurality of upper air guide covers are first aligned with the center of the semiconductor wafer, the discharged nitrogen gas first dries the center of the semiconductor wafer, then the upper telescopic rod slowly extends, driving the column body and the plurality of upper racks to move downward, so that the upper toothless gear is driven to rotate, thereby driving the gas outlets of the upper air guide covers to slowly rotate to the edge of the semiconductor wafer.

[0012] Preferably, the cleaning mechanism comprises a circular ring, a plurality of T-shaped pipes, and a plurality of sliding rails, two lower telescopic rods are fixedly installed on the lower surface of the circular ring, a lower toothless gear is rotatably installed between two adjacent T-shaped pipes, a lower T-shaped channel is formed in the lower toothless gear, a lower air guide cover is fixedly connected to the upper portion of the lower T-shaped channel, a lower rack is slidingly connected to the inside of each of the plurality of sliding rails, and an air ring is fixedly connected to the inner end of the plurality of T-shaped pipes.

[0013] The above structure can work as follows: when working, the nitrogen gas hot air entering the inside of the mounting cavity enters the inside of the air ring, then enters the inside of the T-shaped pipe and the lower T-shaped channel, and is finally discharged from the lower air guide cover. The lower telescopic rod slowly extends, driving the circular ring to move upward, the circular ring drives the lower rack to move upward, thereby driving the lower toothless gear to rotate, and the gas outlet of the lower toothless gear slowly rotates to the edge of the semiconductor wafer, thereby drying the bottom edge of the semiconductor wafer, thereby solving the problem that in the existing rotating process, liquid may move along the surface of the wafer to the edge and accumulate at the edge or the back surface (especially the part close to the edge), causing residue, and the temperature of the environment is increased due to the hot air, causing the liquid to evaporate, and water marks are easily formed on the back surface of the wafer.

[0014] Preferably, the middle part of the rotating table is provided with a through hole, the air supply pipe is in communication with the bottom end of the through hole and is rotationally connected, and the air supply pipe is in communication with the air cavity.

[0015] Preferably, the inner telescopic rod, the connecting disc, the connecting head and the sealing head are located in the interior of the mounting cavity, the sealing head is matched with the upper part of the mounting cavity, the air ring is in communication with the mounting cavity, the two ends of the connecting air channel are in communication with the upper part of the mounting cavity, and the inner telescopic rod is fixedly connected with the fixing seat.

[0016] Preferably, the mounting seat is fixedly connected with the rotating arm, the air cavity is in communication with the fan-shaped shell, the fan-shaped shell is in communication with the upper T-shaped channel, and the upper rack is in mesh with the upper toothless gear.

[0017] Preferably, the plurality of T-shaped pipes are in communication with the air ring, the air ring is rotationally connected with the curved surface of the fixing seat, the upper parts of the plurality of slide rails are fixedly connected with the curved surface of the air ring, and the bottom ends of the plurality of slide rails are fixedly connected with the box body.

[0018] Preferably, the lower toothless gear is in mesh with the lower rack, and the circular ring is fixedly connected with the plurality of lower racks.

[0019] Preferably, the plurality of slide rails are arranged at equal distances in a circle, and the lower telescopic rod is fixedly connected with the box body.

[0020] Preferably, the air supply pipe is made of soft material, and the sealing head and the sealing ring are made of rubber material, so that the semiconductor wafer to be dried can be placed on the upper surface of the fixing seat during operation, and the bottom surface of the semiconductor wafer is tightly attached to the upper surface of the fixing seat and the upper surface of the sealing ring.

[0021] The beneficial effects of the present application are as follows:

[0022] 1、The nitrogen gas with appropriate temperature in the air cavity is supplied to the inside of the air cavity through the air supply pipe by the air supply mechanism, and the nitrogen gas with appropriate temperature in the air cavity enters the fan-shaped shell and the upper T-shaped channel first, and is finally discharged from the upper air guide cover, since the openings of the plurality of upper air guide covers are first aligned with the center of the semiconductor wafer, the discharged nitrogen gas first dries the center of the semiconductor wafer, then the upper telescopic rod slowly extends, drives the column and the plurality of upper racks to move downward, so that the upper toothless gear is driven to rotate, and in turn drives the air outlet of the upper air guide cover to slowly rotate to the edge of the semiconductor wafer, thereby solving the problem that the nitrogen gas ejection angle is fixed, and cannot adapt to wafers of different sizes or shapes, leading to that some areas are dried too quickly or liquid is left, and in turn causing uneven drying, and even water marks and spots.

[0023] 2、The nitrogen gas hot air entering the installation cavity is introduced into the air ring, and then passes through the inside of the T-shaped pipe and the lower T-shaped channel, and is finally discharged from the lower air guide cover, the lower telescopic rod slowly extends to drive the circular ring to move upward, the circular ring drives the lower rack to move upward, so that the lower toothless gear rotates, and the air outlet of the lower toothless gear slowly rotates to the edge of the semiconductor wafer, thereby drying the bottom edge of the semiconductor wafer, thereby solving the problem that in the existing rotating process, liquid may move along the surface of the wafer to the edge, and accumulate at the edge or the back surface (especially the part close to the edge), leading to residue, and due to the temperature rise of the environment caused by the hot air, the liquid evaporates, and water marks are easily formed on the back surface of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0024] The accompanying drawings, which constitute a part of this specification, illustrate embodiments of the present application and serve to explain the principles of the present application in a manner advantageous to understand the present application.

[0025] The present disclosure can be understood more clearly with reference to the following detailed description when considered in conjunction with the accompanying drawings, in which:

[0026] Figure 1 It is a schematic view of the appearance of the structure of the present application;

[0027] Figure 2 It is a schematic view of the box body of the present application;

[0028] Figure 3 It is a schematic view of the cleaning mechanism of the present application;

[0029] Figure 4 It is a half-section schematic view of the air guide mechanism of the present application;

[0030] Figure 5 It is a half-section schematic view of the fan-shaped shell of the present application;

[0031] Figure 6 It is a half-section schematic view of the rotating table of the present application;

[0032] Figure 7 It is a section view of the connecting air passage of the present application.

[0033] 1, box; 2, sliding cover; 3, air supply mechanism; 4, air supply pipe; 5, rotating table; 6, fixed seat; 7, mounting cavity; 8, sealing ring; 9, connecting air passage; 10, inner telescopic rod; 11, connecting disc; 12, connecting head; 13, sealing head; 14, rotating arm; 15, air guide mechanism; 151, mounting seat; 152, air cavity; 153, upper telescopic rod; 154, column; 155, upper rack; 156, fan-shaped shell; 157, upper missing tooth gear; 158, upper T-shaped passage; 159, upper air guide cover; 16, cleaning mechanism; 161, circular ring; 162, lower telescopic rod; 163, T-shaped pipe; 164, lower missing tooth gear; 165, lower T-shaped passage; 166, lower air guide cover; 167, sliding rail; 168, lower rack; 169, air ring. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0035] Please refer to Figures 1-7 , which discloses a cleaning and drying device for semiconductor wafers, comprising a box 1, a sliding cover 2 is slidingly connected to the upper part of the box 1, an air supply mechanism 3 is fixedly installed inside the box 1, an air supply pipe 4 is communicated with the upper part of the air supply mechanism 3;

[0036] A rotating table 5 is fixedly installed at the center inside the box 1, a fixed seat 6 is fixedly connected to the upper surface of the rotating table 5, a mounting cavity 7 is formed in the upper surface of the fixed seat 6, a plurality of sealing rings 8 are fixedly installed on the upper surface of the fixed seat 6, and a plurality of connecting air passages 9 are formed in the upper part of the fixed seat 6;

[0037] An inner telescopic rod 10 is fixedly connected at the telescopic end of the inner telescopic rod 10, a connecting disc 11 is fixedly connected to the upper surface of the connecting disc 11, a plurality of connecting heads 12 are fixedly connected to the upper surface of the connecting disc 11, and a sealing head 13 is sleeved at the top end of the connecting head 12;

[0038] A rotating arm 14 is fixedly installed on the top of the box body 1, and a gas guide mechanism 15 is fixedly installed on the front of the rotating arm 14;

[0039] A cleaning mechanism 16 is arranged on the upper portion of the rotating table 5.

[0040] The gas guide mechanism 15 comprises a mounting seat 151, the inside of the mounting seat 151 is provided with a gas cavity 152, the upper portion of the mounting seat 151 is fixedly provided with an upper telescopic rod 153, the telescopic end of the upper telescopic rod 153 is fixedly connected with a column body 154, the side surface of the column body 154 is fixedly connected with a plurality of upper gear racks 155, the lower surface of the mounting seat 151 is fixedly connected with a plurality of fan-shaped shells 156, two adjacent fan-shaped shells 156 are rotationally installed with an upper toothless gear 157, the inside of the upper toothless gear 157 is provided with an upper T-shaped channel 158, and the lower portion of the upper toothless gear 157 is fixedly connected with an upper gas guide cover 159.

[0041] The nitrogen gas with the appropriate temperature in the gas cavity 152 will first enter the fan-shaped shell 156 and the upper T-shaped channel 158, and finally be discharged from the upper gas guide cover 159. Since the openings of the plurality of upper gas guide covers 159 are first aligned with the center of the semiconductor wafer, the discharged nitrogen gas will first dry the center of the semiconductor wafer, and then the upper telescopic rod 153 slowly extends, driving the column body 154 and the plurality of upper gear racks 155 to move downward, so that the upper toothless gear 157 is driven to rotate, thereby driving the gas outlet of the upper gas guide cover 159 to slowly rotate to the edge of the semiconductor wafer, thereby solving the problem that the existing nitrogen gas ejection angle is fixed and cannot adapt to wafers of different sizes or shapes, resulting in that some areas are dried too quickly or liquid residues are left, thereby causing uneven drying, and even water marks and spots.

[0042] The cleaning mechanism 16 comprises a circular ring 161, a plurality of T-shaped pipes 163, a plurality of sliding rails 167, the lower surface of the circular ring 161 is fixedly provided with two lower telescopic rods 162, two adjacent T-shaped pipes 163 are rotationally installed with a lower toothless gear 164, the inside of the lower toothless gear 164 is provided with a lower T-shaped channel 165, the upper portion of the lower T-shaped channel 165 is fixedly connected with a lower gas guide cover 166, the inside of each of the plurality of sliding rails 167 is slidably connected with a lower gear rack 168, and the inner end of each of the plurality of T-shaped pipes 163 is fixedly connected with a gas ring 169.

[0043] The role is, through the nitrogen hot air entering the inside of the installation cavity 7 into the inside of the gas ring 169, and then through the T-shaped pipe 163, the inside of the lower T-shaped channel 165, and finally discharged from the lower gas guide cover 166, the lower telescopic rod 162 will slowly extend and drive the circular ring 161 to move upwards, the circular ring 161 will drive the lower rack 168 to move upwards, so that the lower toothless gear 164 rotates, and the air outlet of the lower toothless gear 164 slowly rotates to the edge of the semiconductor wafer, thereby drying the bottom edge of the semiconductor wafer, thereby solving the problem that in the existing rotating process, liquid may move along the wafer surface to the edge and accumulate at the edge or the back (especially the part close to the edge), causing residue, and due to the temperature rise of the environment caused by the hot air, the liquid evaporates, and water marks are easily formed on the back of the wafer.

[0044] The middle part of the rotating table 5 is provided with a through hole, the gas supply pipe 4 is in communication with the bottom end of the through hole and is rotationally connected, the gas supply pipe 4 is in communication with the air cavity 152, and the role is that the gas supply mechanism 3 works, and the temperature suitable nitrogen gas is supplied to the inside of the installation cavity 7 through the gas supply pipe 4 and the through hole. The nitrogen hot air entering the inside of the installation cavity 7 will enter the inside of the gas ring 169, and then pass through the T-shaped pipe 163 and the inside of the lower T-shaped channel 165, and finally be discharged from the lower gas guide cover 166.

[0045] The inner telescopic rod 10, the connecting disc 11, the connecting head 12, and the sealing head 13 are all located in the inside of the installation cavity 7, the sealing head 13 is matched with the upper part of the installation cavity 7, the gas ring 169 is in communication with the installation cavity 7, the two ends of the connecting gas channel 9 are in communication with the upper part of the installation cavity 7, and the inner telescopic rod 10 is fixedly connected with the fixed seat 6. The role is that the bottom surface of the semiconductor wafer is closely attached to the upper surface of the fixed seat 6 and the upper surface of the sealing ring 8, and then the inner telescopic rod 10 is shortened, the connecting disc 11 is driven to move downwards, the connecting disc 11 drives the upper connecting head 12 and the sealing head 13 to move downwards, the pressure in the space between the upper surface of the sealing head 13 and the bottom surface of the semiconductor wafer will be reduced, and the space above the plurality of sealing heads 13 will be communicated through the connecting gas channel 9 during the downward movement of the sealing head 13, so that the pressure in the space above the plurality of sealing heads 13 is reduced, thereby adsorbing and fixing the semiconductor wafer on the upper surface of the fixed seat 6.

[0046] The mounting seat 151 is fixedly connected with the rotating arm 14, the air cavity 152 is in communication with the fan-shaped shell 156, the fan-shaped shell 156 is in communication with the upper T-shaped channel 158, and the upper rack 155 is engaged with the upper toothless gear 157. The role is that the rotating arm 14 can drive the gas guide mechanism 15 to rotate, and when the gas guide mechanism 15 is located on the left side or the right side, the installation and disassembly of the wafer can be facilitated.

[0047] Wherein, the plurality of T-shaped tubes 163 are communicated with the gas ring 169, the gas ring 169 is rotationally connected with the curved surface of the fixed seat 6, the upper portions of the plurality of slide rails 167 are fixedly connected with the curved surface of the gas ring 169, and the bottom ends of the plurality of slide rails 167 are fixedly connected with the box body 1.

[0048] Wherein, the lower toothless gear 164 is engaged with the lower toothed bar 168, and the circular ring 161 is fixedly connected with the plurality of lower toothed bars 168, and the action is that the lower telescopic rod 162 is slowly elongated to drive the circular ring 161 to move upwards, the circular ring 161 drives the lower toothed bar 168 to move upwards, so that the lower toothless gear 164 is rotated, and the gas outlet of the lower toothless gear 164 is slowly rotated to the edge of the semiconductor wafer, in the process, the wafer is driven to rotate by the rotating table 5, so that the wafer is dried more uniformly.

[0049] Wherein, the plurality of slide rails 167 are arranged at equal intervals in a circle, and the lower telescopic rod 162 is fixedly connected with the box body 1.

[0050] Wherein, the gas supply pipe 4 is made of soft material, and the sealing head 13 and the sealing ring 8 are made of rubber material, and the action is that the semiconductor wafer to be dried is placed on the upper surface of the fixed seat 6, so that the bottom surface of the semiconductor wafer is tightly attached to the upper surface of the fixed seat 6 and the upper surface of the sealing ring 8.

[0051] Working principle:

[0052] Before use, the inner telescopic rod 10 is in an elongated state, at this time, the sealing head 13 is in contact with the lower surface of the sealing ring 8, and the rotating arm 14 drives the air guide mechanism 15 to be located on the left side or the right side.

[0053] When the present application is used, the two sliding covers 2 are opened by sliding to the two sides, the semiconductor wafer to be dried is placed on the upper surface of the fixed seat 6, the bottom surface of the semiconductor wafer is tightly attached to the upper surface of the fixed seat 6 and the upper surface of the sealing ring 8, then the sliding cover 2 is closed, the inner telescopic rod 10 is shortened, the connecting disc 11 is driven to move downwards, the connecting head 12 and the sealing head 13 above are driven downwards, the space between the upper surface of the sealing head 13 and the bottom surface of the semiconductor wafer will be reduced in pressure, and in the process of moving downwards of the sealing head 13, the spaces above the plurality of sealing heads 13 are communicated through the connecting air channel 9, so that the pressure of the spaces above the plurality of sealing heads 13 is reduced.

[0054] The space between the upper surface of the sealing head 13 and the bottom surface of the semiconductor wafer is reduced in pressure, thereby attracting and fixing the semiconductor wafer to the upper surface of the fixing seat 6. The rotating table 5 rotates to drive the fixing seat 6 and the semiconductor wafer to rotate. Then, the rotating arm 14 drives the air guide mechanism 15 to rotate to the upper side of the fixing seat 6. The air supply mechanism 3 works to supply temperature-appropriate nitrogen to the air cavity 152 and the inside of the mounting cavity 7 through the air supply pipe 4. The temperature-appropriate nitrogen in the air cavity 152 enters the fan-shaped shell 156 and the upper T-shaped channel 158 first, and is finally discharged from the upper air guide cover 159. Since the openings of the plurality of upper air guide covers 159 are first aligned with the center of the semiconductor wafer, the discharged nitrogen first dries the center of the semiconductor wafer. Then, the upper telescopic rod 153 slowly extends to drive the cylinder 154 and the plurality of upper racks 155 to move downward, so that the upper toothless gear 157 is driven to rotate, thereby driving the air outlet of the upper air guide cover 159 to slowly rotate to the edge of the semiconductor wafer, so as to avoid the nitrogen hot air from drying a certain place of the semiconductor wafer all the time.

[0055] The nitrogen hot air entering the inside of the mounting cavity 7 enters the inside of the air ring 169, and then passes through the inside of the T-shaped pipe 163 and the lower T-shaped channel 165, and is finally discharged from the lower air guide cover 166. The lower telescopic rod 162 slowly extends to drive the circular ring 161 to move upward, and the circular ring 161 drives the lower rack 168 to move upward, so that the lower toothless gear 164 rotates. The air outlet of the lower toothless gear 164 slowly rotates to the edge of the semiconductor wafer, thereby drying the bottom edge of the semiconductor wafer.

[0056] Under the rotation of the rotating table 5, the nitrogen hot air discharged from the upper air guide cover 159 and the lower air guide cover 166 changes slowly from the middle part of the semiconductor wafer to the edge, thereby quickly drying the semiconductor wafer.

[0057] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not limited. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present application, and they should be covered in the scope of the claims of the present application.

Claims

1. A cleaning and drying device for semiconductor wafers, comprising a box (1), a sliding cover (2) is slidingly connected to the upper part of the box (1), a gas supply mechanism (3) is fixedly installed in the inside of the box (1), characterized in that, The upper part of the air supply mechanism (3) is communicated with an air supply pipe (4); A rotating table (5) is fixedly installed at the center of the inside of the box (1), the upper surface of the rotating table (5) is fixedly connected with a fixing seat (6), the upper surface of the fixing seat (6) is provided with an installation cavity (7), the upper surface of the fixing seat (6) is fixedly installed with a plurality of sealing rings (8), and the upper part of the fixing seat (6) is provided with a plurality of connecting air channels (9); An inner telescopic rod (10) is fixedly connected with a connecting disc (11) at the telescopic end, the upper surface of the connecting disc (11) is fixedly connected with a plurality of connecting heads (12), and the top end of the connecting head (12) is sleeved with a sealing head (13); A rotating arm (14) is fixedly installed at the top of the box (1), and a gas guide mechanism (15) is fixedly installed at the front of the rotating arm (14); A cleaning mechanism (16) is arranged at the upper part of the rotating table (5); The gas guide mechanism (15) comprises a mounting seat (151), the inside of the mounting seat (151) is provided with an air cavity (152), the upper part of the mounting seat (151) is fixedly installed with an upper telescopic rod (153), the telescopic end of the upper telescopic rod (153) is fixedly connected with a column body (154), the side surface of the column body (154) is fixedly connected with a plurality of upper gear racks (155), the lower surface of the mounting seat (151) is fixedly connected with a fan-shaped shell (156), two adjacent fan-shaped shells (156) are rotatably installed with an upper toothless gear (157), the inside of the upper toothless gear (157) is provided with an upper T-shaped channel (158), and the lower part of the upper toothless gear (157) is fixedly connected with an upper gas guide cover (159); The middle part of the rotating table (5) is provided with a through hole, the air supply pipe (4) is in communication with the bottom end of the through hole and is rotatably connected, and the air supply pipe (4) is in communication with the air cavity (152); The inner telescopic rod (10), the connecting disc (11), the connecting head (12) and the sealing head (13) are all located in the inside of the installation cavity (7), the sealing head (13) is matched with the upper part of the installation cavity (7), the inner end of the plurality of T-shaped pipes (163) is fixedly connected with an air ring (169), the air ring (169) is in communication with the installation cavity (7), the two ends of the connecting air channel (9) are in communication with the upper part of the installation cavity (7), and the inner telescopic rod (10) is fixedly connected with the fixing seat (6).

2. The cleaning and drying apparatus for a semiconductor wafer according to claim 1, wherein The cleaning mechanism (16) comprises a circular ring (161), a plurality of T-shaped pipes (163) and a plurality of sliding rails (167), the lower surface of the circular ring (161) is fixedly installed with two lower telescopic rods (162), two adjacent T-shaped pipes (163) are rotatably installed with a lower toothless gear (164), the inside of the lower toothless gear (164) is provided with a lower T-shaped channel (165), the upper part of the lower T-shaped channel (165) is fixedly connected with a lower gas guide cover (166), and the inside of the plurality of sliding rails (167) is slidably connected with a lower gear rack (168).

3. The cleaning and drying apparatus for a semiconductor wafer according to claim 2, wherein The mounting base (151) is fixedly connected with the rotating arm (14), the air cavity (152) is communicated with the fan-shaped shell (156), the fan-shaped shell (156) is communicated with the upper T-shaped channel (158), and the upper rack (155) is engaged with the upper toothless gear (157).

4. The cleaning and drying apparatus for a semiconductor wafer according to claim 3, wherein A plurality of the T-shaped pipes (163) are communicated with the air ring (169), the air ring (169) is rotationally connected with the curved surface of the fixed base (6), the upper portions of a plurality of the slide rails (167) are fixedly connected with the curved surface of the air ring (169), and the bottom ends of the slide rails (167) are fixedly connected with the box body (1).

5. The cleaning and drying apparatus for a semiconductor wafer according to claim 4, wherein The lower toothless gear (164) is engaged with the lower rack (168), and the circular ring (161) is fixedly connected with a plurality of the lower racks (168).

6. The cleaning and drying apparatus for a semiconductor wafer according to claim 5, wherein A plurality of the slide rails (167) are circumferentially equidistantly arranged, and the lower telescopic rod (162) is fixedly connected with the box body (1).

7. The cleaning and drying apparatus for a semiconductor wafer according to claim 6, wherein The air supply pipe (4) is made of soft material, and the sealing head (13) and the sealing ring (8) are made of rubber material.

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