Display panels and electronic devices

Abstract

This application provides a display panel and electronic device, relating to the field of display technology. The display panel includes a substrate, an isolation structure, and multiple light-emitting units. The isolation structure encloses multiple isolation openings. At least a portion of the isolation structure enclosing the same isolation opening includes a first isolation portion, a second isolation portion, and a third isolation portion sequentially stacked along a direction away from the substrate. The second isolation portion is conductive. Each light-emitting unit includes a light-emitting functional portion and a first electrode. The light-emitting functional portion is spaced apart from the second isolation portion, and at least a portion of the first electrode overlaps with the second isolation portion. This application can reduce the likelihood of lateral leakage between adjacent light-emitting units, while the signal from the first electrode of adjacent light-emitting units can be effectively transmitted through the second isolation portion.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel and an electronic device. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is considered the most promising next-generation display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] In the traditional OLED display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision and high cost. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe relevant content regarding fine metal mask-less technology and are provided for reference.

[0004] However, there are still some problems with the display panel that need to be addressed. Summary of the Invention

[0005] To overcome the technical problems mentioned in the background, this application provides a display panel, which includes:

[0006] substrate;

[0007] An isolation structure is located on one side of the substrate. The isolation structure encloses and forms a plurality of isolation openings. At least a portion of the isolation structure enclosing and forming the same isolation opening includes a first isolation portion, a second isolation portion, and a third isolation portion that are sequentially stacked in a direction away from the substrate. The orthographic projection of the side of the second isolation portion away from the substrate on the substrate is located within the orthographic projection of the third isolation portion on the substrate. The second isolation portion is conductive.

[0008] A plurality of light-emitting units are provided, at least a portion of which is located within the isolation opening. Each light-emitting unit includes a light-emitting functional part and a first electrode that are sequentially stacked in a direction away from the substrate. The light-emitting functional part is spaced apart from the second isolation part, and at least a portion of the first electrode overlaps with the second isolation part.

[0009] In some possible implementations, the isolation structure further includes a fourth isolation portion located between the second isolation portion and the third isolation portion, wherein the orthographic projection of the side of the fourth isolation portion away from the substrate on the substrate is located within the orthographic projection of the third isolation portion on the substrate, and the orthographic projection area of ​​the side of the fourth isolation portion away from the substrate on the substrate is smaller than the orthographic projection area of ​​the third isolation portion on the substrate.

[0010] In some possible implementations, the thickness of the fourth isolation portion is greater than the thickness of the first isolation portion along the thickness direction of the substrate;

[0011] The first isolation portion has a first metal oxide on the side facing the isolation opening, and the fourth isolation portion has a second metal oxide on the side facing the isolation opening;

[0012] The material of the second metal oxide is the same as that of the first metal oxide;

[0013] The material of the second isolation part includes an alloy material, and the material of the second isolation part includes the material of the first isolation part and / or the fourth isolation part.

[0014] In some possible implementations, along the thickness direction of the substrate, the thickness of the first insulating portion is greater than the maximum thickness of the light-emitting functional portion but less than twice the maximum thickness of the light-emitting functional portion.

[0015] In some possible implementations, the area of ​​the side of the second isolation portion of the isolation structure near the substrate is the same as the area of ​​the side of the first isolation portion away from the substrate.

[0016] The area of ​​the side of the second isolation portion facing away from the substrate is smaller than the area of ​​the side of the fourth isolation portion facing the substrate.

[0017] In some possible implementations, the thickness of the second insulating portion is greater than the maximum thickness of the first electrode along the thickness direction of the substrate.

[0018] In some possible implementations, the orthographic projection of the side of the second isolation portion closer to the substrate onto the substrate lies within the orthographic projection of the side of the first isolation portion farther from the substrate onto the substrate.

[0019] On the side of the isolation structure facing the isolation opening, the side of the second isolation portion facing the isolation opening is recessed relative to the side of the first isolation portion facing the isolation opening.

[0020] The projected area of ​​the second isolation portion on the substrate is smaller than the projected area of ​​the first isolation portion on the substrate;

[0021] The orthographic projection of the second isolation portion on the substrate covers the orthographic projection of the first isolation portion on the substrate.

[0022] In some possible implementations, the fourth isolation portion covers a portion of the sidewall of the second isolation portion facing the isolation opening and extends to contact the side of the first isolation portion away from the substrate; or, the first isolation portion covers a portion of the sidewall of the second isolation portion facing the isolation opening and extends to contact the side of the fourth isolation portion facing the substrate.

[0023] In some possible implementations, the area of ​​the side of the first isolation portion away from the substrate is smaller than the area of ​​the side of the first isolation portion facing the substrate, and the sidewall of the first isolation portion is stepped.

[0024] In some possible implementations, the light-emitting functional part overlaps with at least a portion of the first insulating part;

[0025] Along the thickness direction of the substrate, the light-emitting functional part and the second isolation part are spaced apart on one side of the substrate.

[0026] In some possible implementations, the display panel further includes a pixel defining layer located between the substrate and the isolation structure, the pixel defining layer including a plurality of pixel openings, the pixel openings communicating with corresponding isolation openings, and the orthographic projection of the pixel openings on the substrate being located within the orthographic projection range of the isolation openings on the substrate;

[0027] The light-emitting unit further includes a second electrode located on the side of the light-emitting functional part near the substrate, and the pixel opening exposes a portion of the second electrode.

[0028] In some possible implementations, the display panel further includes:

[0029] Multiple encapsulation units are located on the side of the corresponding light-emitting unit away from the substrate, and a portion of the encapsulation unit extends from the side of the isolation structure toward the isolation opening to the side of the isolation structure away from the substrate.

[0030] In some possible implementations, the packaging unit extends from the side of the second isolation portion toward the isolation opening to the side of the isolation structure away from the substrate;

[0031] The multiple light-emitting units are spaced apart from each other;

[0032] The packaging unit located on the side of the isolation structure away from the substrate has a gap with the side of the isolation structure away from the substrate.

[0033] In some possible implementations, the display panel further includes a second encapsulation layer located on the side of the encapsulation unit away from the substrate and a third encapsulation layer located on the side of the second encapsulation layer away from the substrate;

[0034] Both the packaging unit and the third packaging layer are made of inorganic materials.

[0035] The material of the second encapsulation layer includes organic materials.

[0036] In some possible implementations, this application also provides an electronic device, which includes the display panel described in this application.

[0037] Compared with the prior art, this application has the following beneficial effects:

[0038] The present application provides a display panel and electronic device. By spaced apart the light-emitting functional part and the second isolation part, the charge carriers flowing through the light-emitting functional part are not easily transmitted through the second isolation part, thereby making it less likely for lateral leakage to occur between adjacent light-emitting units. At the same time, the signal of the first electrode of the adjacent light-emitting unit can be effectively transmitted through the second isolation part, thereby improving the display effect of the display panel. Attached Figure Description

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0040] Figure 1 A top view of the display panel provided in an embodiment of this application;

[0041] Figure 2 Provided for the embodiments of this application Figure 1 Schematic diagram of the cross section at point BB;

[0042] Figure 3A schematic cross-sectional view of the substrate provided in an embodiment of this application;

[0043] Figure 4 This is a schematic diagram of the pixel circuit provided in an embodiment of this application;

[0044] Figure 5 A cross-sectional schematic diagram showing a first metal oxide on a first insulating portion of a display panel provided in an embodiment of this application;

[0045] Figure 6 A cross-sectional schematic diagram of the light-emitting functional part provided in an embodiment of this application;

[0046] Figure 7a One of the cross-sectional schematic diagrams of a display panel having a second metal oxide on the fourth isolation portion provided in an embodiment of this application;

[0047] Figure 7b A second cross-sectional schematic diagram of a display panel having a second metal oxide on its fourth isolation portion, provided in an embodiment of this application;

[0048] Figure 7c A third cross-sectional schematic diagram of a display panel having a second metal oxide on its fourth isolation portion, provided in an embodiment of this application;

[0049] Figure 7d Fourth cross-sectional schematic diagram of a display panel having a second metal oxide on the fourth isolation portion provided in an embodiment of this application;

[0050] Figure 7e Fifth cross-sectional schematic diagram of a display panel having a second metal oxide on the fourth isolation portion provided in an embodiment of this application;

[0051] Figure 8a One of the cross-sectional schematic diagrams of the second isolation portion of the display panel provided in the embodiments of this application, which is recessed relative to the first isolation portion and the fourth isolation portion;

[0052] Figure 8b A second cross-sectional schematic diagram of the second isolation portion of the display panel provided in the embodiments of this application, which is recessed relative to the first isolation portion and the fourth isolation portion;

[0053] Figure 9 A cross-sectional schematic diagram of a display panel including a packaging unit, provided for an embodiment of this application;

[0054] Figure 10 A cross-sectional schematic diagram of the display panel provided in the embodiments of this application, including a second encapsulation layer and a third encapsulation layer;

[0055] Figure 11 A schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0056] Figure 12 A cross-sectional schematic diagram showing a first isolation material layer, a second isolation material layer, a fourth isolation material layer, and a third isolation material layer sequentially formed on one side of a substrate, provided for an embodiment of this application;

[0057] Figure 13 A cross-sectional schematic diagram showing the patterned third isolation material layer, fourth isolation material layer, second isolation material layer and first isolation material layer provided for embodiments of this application;

[0058] Figure 14 A cross-sectional schematic diagram showing the formation of a first metal oxide on the side of the first isolation portion facing the isolation opening, provided for an embodiment of this application;

[0059] Figure 15 This is a three-dimensional structural diagram of the electronic device provided in an embodiment of this application.

[0060] Reference numerals: 10, display panel; 100, electronic device; 11, substrate; 12, isolation structure; 121, first isolation section; 122, second isolation section; 123, third isolation section; 124, fourth isolation section; 12a, isolation opening; 12a1, first isolation opening; 12a2, second isolation opening; 12a3, third isolation opening; 13, light-emitting unit; 131, first electrode; 132, light-emitting functional part; 133, second electrode; 13a, first light-emitting unit; 13b, second light-emitting unit; 13c, Third light-emitting unit; 14, Encapsulation unit; 14a, First encapsulation unit; 14b, Second encapsulation unit; 14c, Third encapsulation unit; 15, Second encapsulation layer; 16, Third encapsulation layer; 17, Pixel defining layer; 171, Pixel aperture; 18, Transistor; 19, Planarization layer; 20, First metal oxide; 21, Second metal oxide; 22, Pixel defining material layer; 23, First isolation material layer; 24, Second isolation material layer; 25, Fourth isolation material layer; 26, Third isolation material layer. Detailed Implementation

[0061] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0062] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0063] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0064] For ease of understanding, the accompanying diagram shows the mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, a view where various elements are observed parallel to the plane containing the X and Y directions is called a top view. Alternatively, the planes in the X and Y directions can be planes parallel to the display surface of the display panel, and the Z-direction can be a direction parallel to the thickness direction of the display panel.

[0065] For certain elements, terms like "above" or "overhead" are sometimes used when describing the position of an element in the Z direction, and "below" or "under" are used when describing the position of an element in the opposite direction. Furthermore, when using terms like "above," "overhead," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly adjacent, but also the state where the two elements are separated by gaps or other elements. Additionally, terms like "first," "second," and "third" are used only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.

[0066] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0067] Increasing the density of light-emitting units (i.e., pixel density) in a display panel is a crucial way to improve display quality. However, current display panels manufactured using Fine Metal Mask (FMM) technology are limited by technological constraints that prevent further increases in light-emitting unit density. Extensive research has revealed that, to address this technical challenge, some display panels incorporate isolation structures. During the full-layer deposition of the light-emitting layer and the second electrode, the light-emitting layer and the second electrode can be disconnected at the isolation structure. Through multiple deposition and etching processes (i.e., light-emitting unit patterning), light-emitting units of different colors can be formed within different isolation openings.

[0068] The display panel in the related technology includes a substrate, an isolation structure located on one side of the substrate, and a light-emitting unit located within an isolation opening formed by the isolation structure. The light-emitting unit includes a light-emitting functional part and a first electrode stacked sequentially in a direction away from the substrate. The light-emitting functional part is prone to overlapping with the isolation structure, thereby causing lateral leakage between adjacent light-emitting units. In order to prevent the light-emitting functional part from overlapping with the isolation structure, it is easy to affect the overlapping effect between the first electrode and the isolation structure.

[0069] To address the aforementioned technical problems, the following innovative technical solutions are designed. The specific implementation schemes of this application will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the existing solutions are the result of practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below should be considered contributions made to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0070] See Figure 1-Figure 5 This embodiment provides a display panel 10, which includes a substrate 11, an isolation structure 12, and a plurality of light-emitting units 13.

[0071] Please see again Figure 1 , Figure 1 This is a schematic diagram of the structure of a display panel 10 according to one embodiment of this application. The display panel 10 may be an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting diode (QLED) display panel. The display panel 10 includes a display area AA with display function and a non-display area NA.

[0072] The display area AA of the display panel 10 can be rectangular, square, circular, elliptical, or other shapes.

[0073] The display area AA includes a plurality of pixels PX arranged in the X and Y directions. Each pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, each pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel SPX2, and the third sub-pixel SPX3 is a red sub-pixel SPX3. In some embodiments, in addition to sub-pixels SPX1, SPX2, and SPX3, each pixel PX also includes sub-pixels SPX that emit white or other colors of light.

[0074] The sub-pixel SPX includes a pixel circuit and a light-emitting unit 13 driven by the pixel circuit to emit light of a corresponding color. The first sub-pixel SPX1 includes a first light-emitting unit 13a, the second sub-pixel SPX2 includes a second light-emitting unit 13b, and the third sub-pixel SPX3 includes a third light-emitting unit 13c. One pixel circuit drives at least one light-emitting unit 13 to emit light. For example, the display area AA includes a normal display area and a light-transmitting display area. The light-transmitting display area is a display area set for a corresponding sensor and has light-transmitting properties. The normal display area is a display area not set for a corresponding sensor. In the normal display area, one pixel circuit drives one light-emitting unit 13 to emit light, and in the light-transmitting display area, one pixel circuit drives one or more light-emitting units 13 to emit light.

[0075] In one implementation, Figure 2 It shows Figure 1 A schematic diagram of the partial film layer cross-section structure in the BB direction of a local area of ​​the display panel 10.

[0076] Please see again Figure 3 The substrate 11 includes a pixel circuit layer and a planarization layer 19. The pixel circuit layer includes pixel circuits for driving the light-emitting unit 13 to emit light. Figure 3 A transistor 18 in a pixel circuit is shown. A via is provided in the planarization layer 19, through which the second electrode 133 is electrically connected to the transistor 18 in the pixel circuit layer. Furthermore, the pixel circuit layer includes at least one insulating layer, which may include at least one of an inorganic layer and an organic layer. Additionally, the substrate 11 includes scan lines providing a scan signal (Scan) and data lines providing a data signal (Data) to the pixel circuit.

[0077] Please see again Figure 4The pixel circuit includes a driving transistor T1 and a data transistor T2. The source of the data transistor T2 is connected to a data line that provides the data signal Data, and the gate of the data transistor T2 is connected to a scan line that provides the scan signal Scan. The drain of the data transistor T2 is connected to the gate of the driving transistor T1. The two ends of the storage capacitor C1 are respectively connected to the gate and the source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting unit 13. Figure 4 This is one implementation of a pixel circuit; the pixel circuit described in this application is not limited to... Figure 4 The 2T1C pixel circuit shown can also be other pixel circuits, such as 7T1C, 8T1C pixel circuits, etc.

[0078] Please see again Figure 5 The isolation structure 12 is located on one side of the substrate 11. The isolation structure 12 encloses and forms a plurality of isolation openings 12a. At least a portion of the isolation structure 12 enclosing and forming the same isolation opening 12a includes a first isolation portion 121, a second isolation portion 122, and a third isolation portion 123 that are sequentially stacked along a direction away from the substrate 11. The orthographic projection of the side of the second isolation portion 122 away from the substrate 11 on the substrate 11 is located within the orthographic projection of the third isolation portion 123 on the substrate 11. The second isolation portion 122 is conductive, and the conductivity of the first isolation portion 121 is weaker than that of the second isolation portion 122.

[0079] Please see again Figure 2The isolation structure 12 is located on one side of the substrate 11 and encloses a plurality of isolation openings 12a, including a plurality of first isolation openings 12a1, a plurality of second isolation openings 12a2, and a plurality of third isolation openings 12a3. A plurality of light-emitting units 13 are located on one side of the substrate 11 and include a plurality of first light-emitting units 13a, a plurality of second light-emitting units 13b, and a plurality of third light-emitting units 13c. The first light-emitting units 13a are disposed corresponding to the first isolation openings 12a1, the second light-emitting units 13b are disposed corresponding to the second isolation openings 12a2, and the third light-emitting units 13c are disposed corresponding to the third isolation openings 12a3. In one embodiment, one light-emitting unit 13 is disposed corresponding to one isolation opening 12a. For example, the first light-emitting units 13a are disposed one-to-one with the first isolation openings 12a1, the second light-emitting units 13b are disposed one-to-one with the second isolation openings 12a2, and the third light-emitting units 13c are disposed one-to-one with the third isolation openings 12a3. At least a portion of the first light-emitting unit 13a is disposed within the corresponding first isolation opening 12a1, at least a portion of the second light-emitting unit 13b is disposed within the corresponding second isolation opening 12a2, and at least a portion of the third light-emitting unit 13c is disposed within the corresponding third isolation opening 12a3. In another embodiment, a plurality of light-emitting units 13 are correspondingly disposed with one isolation opening 12a; for example, a plurality of light-emitting units 13 emitting the same color are corresponding to one isolation opening 12a.

[0080] Please see again Figure 5 At least a portion of the light-emitting unit 13 is located within the isolation opening 12a. The light-emitting unit 13 includes a light-emitting functional part 132 and a first electrode 131 that are sequentially stacked along a direction away from the substrate 11. The light-emitting functional part 132 is spaced apart from the second isolation part 122, and at least a portion of the first electrode 131 overlaps with the second isolation part 122.

[0081] The conductivity of the first isolation portion 121 is weaker than that of the second isolation portion 122. Therefore, even if the light-emitting functional portion 132 is in contact with the side of the first isolation portion 121 facing the isolation opening 12a, the charge carriers flowing through the light-emitting functional portion 132 are not easily transmitted through the first isolation portion 121. Therefore, it is not easy for lateral leakage to occur between adjacent light-emitting units 13.

[0082] The second isolation portion 122 has good conductivity. The first electrode 131 is connected to the second isolation portion 122. Therefore, the signal of the first electrode 131 of the adjacent light-emitting unit 13 can be effectively transmitted through the second isolation portion 122.

[0083] Based on the above design, this embodiment, by spaced apart the light-emitting functional part 132 and the second isolation part 122, makes it difficult for the charge carriers flowing through the light-emitting functional part 132 to be transmitted through the first isolation part 121, thereby making it less likely for lateral leakage to occur between adjacent light-emitting units 13. At the same time, the signal of the first electrode 131 of adjacent light-emitting units 13 can be effectively transmitted through the second isolation part 122, thereby improving the display effect of the display panel 10.

[0084] In some possible implementations, please refer again. Figure 2 and Figure 5 The display panel 10 further includes a pixel defining layer 17 located between the substrate 11 and the isolation structure 12. The isolation structure 12 is located on the side of the pixel defining layer 17 away from the substrate 11. The pixel defining layer 17 includes a plurality of pixel openings 171. The pixel openings 171 communicate with the corresponding isolation openings 12a. The orthographic projection of the pixel openings 171 on the substrate 11 is within the orthographic projection range of the isolation openings 12a on the substrate 11. The light-emitting unit 13 further includes a second electrode 133 located on the side of the light-emitting functional part 132 closer to the substrate 11. The pixel openings 171 expose a portion of the second electrode 133.

[0085] The pixel opening 171 includes a first pixel opening, a second pixel opening, and a third pixel opening. The first pixel opening is connected to the first isolation opening 12a1, the second pixel opening is connected to the second isolation opening 12a2, and the third pixel opening is connected to the third isolation opening 12a3. The areas of the orthographic projections of the first pixel opening, the second pixel opening, and the third pixel opening on the substrate 11 are the same or different.

[0086] The shapes of the orthographic projections of the pixel opening 171 and the corresponding isolation opening 12a on the substrate 11 may be the same or different. Generally, the area of ​​the orthographic projection of the isolation opening 12a on the substrate 11 is larger than the area of ​​the orthographic projection of the pixel opening 171 connected to the isolation opening 12a on the substrate 11. The orthographic projections of the pixel opening 171 of the light-emitting unit 13 on the substrate 11 overlap with the orthographic projections of the isolation opening 12a on the substrate 11. The pixel defining layer 17 is made of an inorganic material, such as an inorganic insulating material formed using at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0087] In another embodiment, the isolation structure 12 is disposed within the groove of the pixel defining layer 17. Alternatively, the pixel defining layer 17 may not be provided in the display panel 10, and the isolation structure 12 is disposed on one side of the substrate 11, with the isolation structure 12 in contact with one side of the substrate 11.

[0088] The first light-emitting unit 13a, the second light-emitting unit 13b, and the third light-emitting unit 13c emit light of different colors. Each of these units includes a second electrode 133, a light-emitting functional part 132, and a first electrode 131 stacked together. The second electrode 133 is disposed on the substrate 11, and the pixel defining layer 17 covers the end of the second electrode 133. The pixel defining layer 17 has a pixel opening 171 through which the first electrode 131 is exposed. The light-emitting functional parts 132 of the first light-emitting unit 13a, the second light-emitting unit 13b, and the third light-emitting unit 13c cover the sidewall of the pixel opening 171 of the pixel defining layer 17 and the side of the pixel defining layer 17 facing away from the substrate 11. Each light-emitting functional part 132 is located within the pixel opening 171 and is in contact with the second electrode 133.

[0089] The first electrodes 131 of the first light-emitting unit 13a, the second light-emitting unit 13b, and the third light-emitting unit 13c respectively cover the corresponding light-emitting functional parts 132. The second electrode 133 can be an anode, and the first electrode 131 can be a cathode. The second electrode 133 of each light-emitting unit 13 can be connected to the pixel circuit through the via, so that the pixel circuit drives the corresponding light-emitting unit 13 to emit light.

[0090] The second electrode 133 may include a multilayer structure, such as a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed, for example, using silver, a metal with excellent light reflectivity. Each conductive oxide layer can be formed, for example, from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The first electrode 131 is formed, for example, from a metallic material such as an alloy of magnesium and silver (MgAg).

[0091] Figure 6 This is a schematic diagram of a light-emitting functional unit 132 according to one embodiment of this application. The light-emitting functional unit 132 of at least one of the first light-emitting unit 13a, the second light-emitting unit 13b, and the third light-emitting unit 13c includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked along a direction away from the substrate 11 (i.e., the Z direction). The light-emitting functional unit 132 may include one light-emitting material layer EML, or a stacked light-emitting functional unit 132 including multiple light-emitting material layers EML.

[0092] In order for the light-emitting functional unit 132 to emit light, a pixel voltage is provided to the second electrode 133 and a common voltage is provided to the first electrode 131, respectively. A potential difference is formed between the first electrode 131 and the second electrode 133, causing the light-emitting functional unit 132 disposed between the first electrode 131 and the second electrode 133 to emit light. In one embodiment, if a potential difference is formed between the first electrode 131 and the second electrode 133 of the first light-emitting unit 13a, the light-emitting material layer EML of the light-emitting functional unit 132 emits blue light; if a potential difference is formed between the first electrode 131 and the second electrode 133 of the second light-emitting unit 13b, the light-emitting material layer EML of the light-emitting functional unit 132 emits green light; and if a potential difference is formed between the first electrode 131 and the second electrode 133 of the third light-emitting unit 13c, the light-emitting material layer EML of the light-emitting functional unit 132 emits red light.

[0093] In this configuration, the pixel voltage of the second electrode 133 is provided by the pixel circuit, and the common voltage of the first electrode 131 is provided by the isolation structure 12. Specifically, the first electrode 131 is electrically connected to the isolation structure 12, and by providing a common voltage to the isolation structure 12, the common voltage is supplied to the first electrode 131. That is, the isolation structure 12 has the function of supplying a common voltage to the first electrode 131.

[0094] The isolation structure 12 allows the display panel 10 to form film layers of different color light-emitting units 13 in different isolation openings 12a without the need for a fine mask. Specifically, since the third isolation portion 123 is located on the side of the second isolation portion 122 away from the substrate 11, and the lateral width of the third isolation portion 123 is greater than the lateral width of the second isolation portion 122 (i.e., the two ends of the third isolation portion 123 protrude compared to the sides of the second isolation portion 122), this shape of the isolation structure 12 is also called a hanging shape. Therefore, when forming the light-emitting material layer, the light-emitting material layer is separated by the isolation structure 12 to form multiple spaced light-emitting functional portions 132. When forming the first electrode material layer, the first electrode material layer is separated by the isolation structure 12 to form multiple spaced first electrodes 131. The isolation structure 12 includes a conductive material, and the first electrodes 131 are electrically connected to the isolation structure 12. One first electrode 131, one light-emitting functional portion 132, and one second electrode 133 form one light-emitting unit 13.

[0095] In this way, the different light-emitting units 13 can be made independent of each other, thereby reducing crosstalk between adjacent light-emitting units 13 and improving the display effect of the display panel 10. At the same time, due to the presence of the isolation structure 12, the light-emitting material layer and the first electrode material layer in each color light-emitting unit 13 in the display panel 10 can be prepared as a whole before patterning, thereby eliminating the need for a fine mask and saving the manufacturing cost of the display panel 10.

[0096] Optionally, the side of the first isolation portion 121 facing the isolation opening 12a has a first metal oxide 20. The first metal oxide 20 is non-conductive or has very poor conductivity. Therefore, even if the light-emitting functional portion 132 is in contact with the side of the first isolation portion 121 facing the isolation opening 12a, the charge carriers flowing through the light-emitting functional portion 132 are not easily transferred through the first isolation portion 121. Therefore, lateral leakage between adjacent light-emitting units 13 is less likely to occur.

[0097] For some possible implementations, please refer to Figure 7aThe isolation structure 12 further includes a fourth isolation portion 124 located between the second isolation portion 122 and the third isolation portion 123. The orthographic projection of the side of the fourth isolation portion 124 away from the substrate 11 on the substrate 11 is located within the orthographic projection of the third isolation portion 123 on the substrate 11. The orthographic projection area of ​​the side of the fourth isolation portion 124 away from the substrate 11 on the substrate 11 is smaller than the orthographic projection area of ​​the third isolation portion 123 on the substrate 11.

[0098] In this embodiment, a hanging structure is formed between the third isolation portion 123 and the fourth isolation portion 124. The hanging structure formed between the third isolation portion 123 and the fourth isolation portion 124 separates the light-emitting material layer into the light-emitting functional portion 132 and separates the first electrode material layer into the first electrode 131.

[0099] In this embodiment, even if the light-emitting functional part 132 is in contact with the side of the first isolation part 121 facing the isolation opening 12a, it is not easy for lateral leakage to occur between adjacent light-emitting units 13, and the signal of the first electrode 131 of the adjacent light-emitting unit 13 can be effectively transmitted through the second isolation part 122.

[0100] In the first embodiment, please refer again. Figure 7a Along a cross section perpendicular to the substrate 11, the first electrode 131 overlaps with the second isolation portion 122 on both sides, while the light-emitting functional portion 132 does not overlap with the second isolation portion 122.

[0101] In the second embodiment, please refer to Figure 7b Along a cross section perpendicular to the substrate 11, the isolation structure 12 that encloses the same isolation opening 12a has a second isolation portion 122 on one side and no second isolation portion 122 on the other side. In this way, even if the light-emitting functional portion 132 overlaps with the second isolation portion 122, the overlap area between the light-emitting functional portion 132 and the second isolation portion 122 can be reduced, thereby improving the problem of lateral leakage between adjacent light-emitting units 13.

[0102] In the third embodiment, please refer to Figure 7c Along a cross-section perpendicular to the substrate 11, the first electrode 131 overlaps with the second isolation portion 122 on one side, while the light-emitting functional portion 132 does not overlap with the second isolation portion 122. This makes it easier to form the light-emitting functional portion 132 and the first electrode 131.

[0103] In the fourth embodiment, please refer to Figure 7dThe first electrode 131 overlaps with the second isolation portion 122 on one side, and along a cross-section perpendicular to the substrate 11, the isolation structure 12 forming the same isolation opening 12a has the second isolation portion 122 on one side and not on the other. This not only makes it easier to form the light-emitting functional portion 132 and the first electrode 131, but also reduces the overlap area between the light-emitting functional portion 132 and the second isolation portion 122 even when they overlap, thereby improving the problem of lateral leakage between adjacent light-emitting units 13.

[0104] In some possible implementations, please refer again. Figure 7a Along the thickness direction Z of the substrate 11, the thickness H1 of the fourth isolation portion 124 is greater than the thickness H2 of the first isolation portion 121. This makes it easier for the first electrode 131 to connect with the second isolation portion 122, while making it less likely for the light-emitting functional portion 132 to overlap with the second isolation portion 122.

[0105] Optionally, along the thickness direction Z of the substrate 11, the thickness H2 of the first isolation portion 121 is greater than the maximum thickness of the light-emitting functional portion 132 but less than twice the maximum thickness of the light-emitting functional portion 132. This makes it less likely for the light-emitting functional portion 132 to overlap with the second isolation portion 122, thereby further improving the problem of lateral leakage between adjacent light-emitting units 13.

[0106] Optionally, please see again Figure 7e The area of ​​the side of the second isolation portion 122 of the isolation structure 12 that is close to the substrate 11 is the same as the area of ​​the side of the first isolation portion 121 that is away from the substrate 11.

[0107] The area of ​​the side of the second isolation portion 122 facing away from the substrate 11 is smaller than the area of ​​the side of the fourth isolation portion 124 facing the substrate 11.

[0108] Thus, the second isolation portion 122 is recessed relative to the side of the fourth isolation portion 124 closest to the substrate 11, and the first electrode 131 extends through the recessed sidewall of the second isolation portion 122 to overlap with the fourth isolation portion 124. This can improve the stability of the overlap between the first electrode 131 and the isolation structure 12.

[0109] Optionally, along the thickness direction Z of the substrate 11, the thickness H3 of the second insulating portion 122 is greater than the maximum thickness of the first electrode 131. This allows for more effective contact between the first electrode 131 and the second insulating portion 122, thereby improving the conductivity of the first electrode 131.

[0110] Optionally, along the thickness direction Z of the substrate 11, the thickness H1 of the first isolation portion 121 is greater than 0 and less than or equal to 0.15 μm. For example, the thickness H1 can be 0.05 μm, 0.1 μm, or 0.15 μm, etc.

[0111] Optionally, along the thickness direction Z of the substrate 11, the thickness H2 of the fourth isolation portion 124 is greater than 0 and less than or equal to 0.65 μm. For example, the thickness H2 can be 0.05 μm, 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, or 0.65 μm, etc.

[0112] Optionally, along the thickness direction Z of the substrate 11, the thickness H3 of the second isolation portion 122 is greater than or equal to 0.025 μm and less than or equal to 0.4 μm. For example, the thickness H3 can be 0.025 μm, 0.05 μm, 0.1 μm, 0.2 μm, 0.3 μm, 0.35 μm, or 0.4 μm, etc.

[0113] By reasonably setting the thicknesses H1, H2, and H3, the first electrode 131 can be more easily connected to the second isolation part 122, making it less likely for the light-emitting functional part 132 to overlap with the second isolation part 122. This reduces the likelihood of lateral leakage between adjacent light-emitting units 13 and allows for more effective signal transmission between the first electrodes 131 of adjacent light-emitting units 13, thereby further improving the display effect of the display panel 10.

[0114] In some possible implementations, please refer again. Figure 7a The fourth isolation portion 124 has a second metal oxide 21 on its side facing the isolation opening 12a.

[0115] Optionally, the material of the second metal oxide 21 is the same as the material of the first metal oxide 20.

[0116] Optionally, the material of the second isolation portion 122 includes molybdenum, copper, or a molybdenum-aluminum alloy; and / or the material of the third isolation portion 123 includes titanium or molybdenum.

[0117] Optionally, the material of the first isolation section 121 is the same as the material of the fourth isolation section 124.

[0118] Optionally, the material of the first isolation portion 121 includes aluminum.

[0119] The material of the first isolation portion 121 is the same as that of the fourth isolation portion 124. Specifically, both the first isolation portion 121 and the fourth isolation portion 124 can be made of aluminum. Aluminum is easily oxidized, therefore, the side of the first isolation portion 121 and the fourth isolation portion 124 facing the isolation opening 12a is easily oxidized to form aluminum oxide. Thus, the metal oxides on the side of the first isolation portion 121 and the fourth isolation portion 124 facing the isolation opening 12a can be formed by oxidation with oxygen in the air, eliminating the need for a special process and reducing the process cost of forming the first metal oxide 20 and the second metal oxide 21.

[0120] In some possible implementations, the material of the second isolation portion 122 includes an alloy material, and the material of the second isolation portion 122 includes the material of the first isolation portion 121 and / or the fourth isolation portion 124.

[0121] Optionally, the ratio of the mass of the material of the first isolation portion 121 and / or the fourth isolation portion 124 to the mass of the second isolation portion 122 is greater than or equal to 0.5 and less than 1.

[0122] Optionally, the material of the second isolation section 122 includes a molybdenum-aluminum alloy.

[0123] When the material of the second isolation portion 122 includes an alloy material, the second isolation portion 122 includes the material of the first isolation portion 121 and / or the fourth isolation portion 124, and the ratio of the mass of the material of the first isolation portion 121 and / or the fourth isolation portion 124 included in the second isolation portion 122 to the mass of the second isolation portion 122 is greater than or equal to 0.5 and less than 1. For example, the ratio can be 0.5, 0.6, 0.7, 0.8 or 0.9, etc.

[0124] Generally, the adhesion between film layers of the same material is greater. In this embodiment, the second isolation portion 122 includes the material of the first isolation portion 121 and / or the fourth isolation portion 124, which can improve the adhesion between the second isolation portion 122 and the first isolation portion 121 and / or the fourth isolation portion 124, thereby improving the stability between the second isolation portion 122 and the first isolation portion 121 and / or the fourth isolation portion 124, and further improving the overall stability of the isolation structure 12.

[0125] For some possible implementations, please refer to Figure 8aThe orthographic projection of the side of the second isolation portion 122 near the substrate 11 on the substrate 11 is located within the orthographic projection of the side of the first isolation portion 121 away from the substrate 11 on the substrate 11.

[0126] Optionally, on the side of the isolation structure 12 facing the isolation opening 12a, the side of the second isolation portion 122 facing the isolation opening 12a is recessed relative to the side of the first isolation portion 121 facing the isolation opening 12a.

[0127] Optionally, the orthographic projection area of ​​the second isolation portion 122 on the substrate 11 is smaller than the orthographic projection area of ​​the first isolation portion 121 on the substrate 11; the orthographic projection of the second isolation portion 122 on the substrate 11 covers part of the orthographic projection of the first isolation portion 121 on the substrate 11.

[0128] Optionally, the orthographic projection of the side of the second isolation portion 122 away from the substrate 11 onto the substrate 11 is located within the orthographic projection of the side of the fourth isolation portion 124 near the substrate 11 onto the substrate 11.

[0129] Optionally, the first electrode 131 extends through the second isolation portion 122 toward the side of the isolation opening 12a to overlap with a portion of the fourth isolation portion 124.

[0130] Under the same etching solution, the etching rate of the second isolation portion 122 is greater than that of the first isolation portion 121 and the fourth isolation portion 124. Therefore, the second isolation portion 122 will be recessed relative to the first isolation portion 121 and the fourth isolation portion 124.

[0131] In this embodiment, the first electrode 131 extends from the second isolation portion 122 toward the side of the isolation opening 12a to overlap with a portion of the fourth isolation portion 124. This increases the contact area between the first electrode 131 and the isolation structure 12, which is more conducive to the first electrode 131 climbing on the isolation structure 12, and further improves the overlap effect between the first electrode 131 and the isolation structure 12.

[0132] In some embodiments, see Figure 7b The fourth isolation portion 124 covers a portion of the sidewall of the second isolation portion 122 away from the isolation opening 12a and extends to contact the side of the first isolation portion 121 away from the substrate 11. That is, the cross-sectional width of the second isolation portion 122 is smaller than the width of the side of the first isolation portion 121 and the fourth isolation portion 124 away from the substrate 11. The exposed side of the second isolation portion 122 is used to overlap the first electrode 131.

[0133] In some embodiments, the first isolation portion 121 covers a portion of the sidewall of the second isolation portion 122 away from the isolation opening 12a and extends to contact the side of the fourth isolation portion 124 near the substrate 11. That is, the cross-sectional width of the second isolation portion 122 is smaller than the width of the side of the first isolation portion 121 and the fourth isolation portion 124 away from the substrate 11. A groove is formed on the surface of the first isolation portion 121, and the second isolation portion 122 is located in the groove.

[0134] By enclosing one side of the second isolation part 122 with the first isolation part 121 and the fourth isolation part 124, it is possible to avoid the second isolation part 122 being made of different materials than the first isolation part 121 or the fourth isolation part 124. In the process of manufacturing the light-emitting unit 13, temperature, stress, etc. may cause film separation, resulting in the failure of the light-emitting unit 13 encapsulation and the appearance of dark spots.

[0135] In other embodiments, please refer to Figure 8b The first isolation portion 121 covers a portion of the sidewall of the second isolation portion 122 facing the isolation opening 12a and extends to contact the side of the fourth isolation portion 124 facing the substrate 11.

[0136] In the two embodiments described above, the first electrode 131 overlaps with the isolation structure 12 on one side. In this way, while improving the overlap effect between the first electrode 131 and the isolation structure 12, the risk of overlap between the light-emitting functional part 132 and the second isolation part 122 can be reduced.

[0137] Optionally, the area of ​​the side of the first isolation portion 121 facing away from the substrate 11 is smaller than the area of ​​the side of the first isolation portion 121 facing the substrate 11, and the sidewall of the first isolation portion 121 is stepped. This not only increases the distance between the light-emitting functional portion 132 and the second isolation portion 122, making it less likely for the light-emitting functional portion 132 to overlap with the second isolation portion 122, but also improves the encapsulation effect.

[0138] In some possible implementations, please refer again. Figure 8a The distance D1 between the edge of the orthographic projection of the side of the second isolation portion 122 near the substrate 11 and the edge of the orthographic projection of the side of the first isolation portion 121 away from the substrate 11 on the substrate 11 is greater than or equal to 0 and less than or equal to 0.3 μm. For example, the distance D1 can be 0, 0.1 μm, 0.2 μm or 0.3 μm, etc.

[0139] Optionally, please see Figure 9The distance D2 between the edge of the orthographic projection of the side of the second isolation portion 122 away from the substrate 11 and the edge of the orthographic projection of the side of the fourth isolation portion 124 near the substrate 11 is greater than or equal to 0 and less than or equal to 0.3 μm. For example, the distance D2 can be 0, 0.1 μm, 0.2 μm or 0.3 μm, etc.

[0140] By setting appropriate distances D1 and D2, the bonding effect between the first electrode 131 and the isolation structure 12 can be further improved.

[0141] In some possible implementations, please refer again. Figure 9 The light-emitting functional part 132 is at least partially connected to the first isolation part 121.

[0142] Because the first metal oxide 20 is present on the side of the first isolation portion 121 facing the isolation opening 12a, even if the light-emitting functional portion 132 is in contact with the side of the first isolation portion 121 facing the isolation opening 12a, the charge carriers flowing through the light-emitting functional portion 132 are not easily transferred through the first isolation portion 121. Therefore, lateral leakage is less likely to occur between adjacent light-emitting units 13. Thus, when depositing the light-emitting material layer, it is not necessary to excessively restrict the deposition angle of the light-emitting material layer, making it easier to deposit the light-emitting material layer.

[0143] Optionally, along the thickness direction Z of the substrate, the light-emitting functional part 132 and the second isolation part 122 are spaced apart on one side facing the substrate 11. In this way, the light-emitting functional part 132 does not overlap with the second isolation part 122.

[0144] In some possible implementations, please refer again. Figure 2 and Figure 9 The display panel 10 also includes a plurality of encapsulation units 14, which are located on the side of the corresponding light-emitting unit 13 away from the substrate 11. A portion of the encapsulation unit 14 extends from the side of the isolation structure 12 toward the isolation opening 12a to the side of the isolation structure 12 away from the substrate 11.

[0145] Optionally, the packaging unit 14 extends from the second isolation portion 122 toward the side of the isolation opening 12a to the side of the isolation structure 12 away from the substrate 11.

[0146] Optionally, the plurality of encapsulation units 14 corresponding to the plurality of light-emitting units 13 are spaced apart, and there is a gap between the encapsulation unit 14 located on the side of the isolation structure 12 away from the substrate 11 and the side of the isolation structure 12 away from the substrate 11.

[0147] The encapsulation unit 14 is located on the side of the second electrode 133 facing away from the substrate 11, and extends through the sidewall of the isolation structure 12 to the side of the isolation structure 12 facing away from the substrate 11. The plurality of encapsulation units 14 include a plurality of first encapsulation units 14a corresponding to a plurality of first light-emitting units 13a, a plurality of second encapsulation units 14b corresponding to a plurality of second light-emitting units 13b, and a plurality of third encapsulation units 14c corresponding to a plurality of third light-emitting units 13c. The first encapsulation unit 14a is disposed on the side of the corresponding first light-emitting unit 13a facing away from the substrate 11, the second encapsulation unit 14b is disposed on the side of the corresponding second light-emitting unit 13b facing away from the substrate 11, and the third encapsulation unit 14c is disposed on the side of the corresponding third light-emitting unit 13c facing away from the substrate 11.

[0148] During the patterning process of the light-emitting unit 13, the first encapsulation material layer is broken at the isolation structure 12 to form an encapsulation unit 14. The encapsulation unit 14 can completely and independently encapsulate the corresponding light-emitting unit 13, thereby improving the display characteristics of the display panel 10.

[0149] For some possible implementations, please refer to Figure 10 The display panel 10 further includes a second encapsulation layer 15 located on the side of the encapsulation unit 14 away from the substrate 11 and a third encapsulation layer 16 located on the side of the second encapsulation layer 15 away from the substrate 11.

[0150] Optionally, the materials of both the encapsulation unit 14 and the third encapsulation layer 16 include inorganic materials.

[0151] Optionally, the material of the second encapsulation layer 15 includes organic materials.

[0152] Both the encapsulation unit 14 and the third encapsulation layer 16 are inorganic materials. The materials of the first encapsulation layer and the third encapsulation layer 16 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 15 is an organic insulating material, such as epoxy resin, acrylic resin, or other resin materials. The second encapsulation layer 15 and the third encapsulation layer 16 are continuously disposed at least on the entire display area AA, with a portion also disposed on the border area NA.

[0153] For example, the encapsulation unit 14 and the third encapsulation layer 16 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 15 can be formed by inkjet printing (IJP). The second encapsulation layer 15 and the third encapsulation layer 16 can achieve a better encapsulation effect on the light-emitting unit 13, thereby further improving the encapsulation quality of the display panel 10.

[0154] In some possible implementations, the display panel 10 may further include at least one film layer such as a touch layer, a polarizer, a color filter substrate, and a protective cover. This film layer may also be bonded to the display panel 10 via an adhesive layer such as OCA (Optical Clear Adhesive).

[0155] In summary, by providing a first metal oxide 20 on the side of the first isolation portion 121 facing the isolation opening 12a, this application makes it difficult for charge carriers flowing through the light-emitting functional portion 132 to be transmitted through the first isolation portion 121, thereby making it less likely for lateral leakage to occur between adjacent light-emitting units 13. At the same time, the signal of the first electrode 131 of the adjacent light-emitting units 13 can be effectively transmitted through the second isolation portion 122, thereby improving the display effect of the display panel 10.

[0156] For some possible implementations, please refer to Figure 8a and Figure 11 This application also provides a method for manufacturing a display panel 10, the method comprising:

[0157] S10: Provide substrate 11.

[0158] Please see again Figure 3 The substrate 11 includes a pixel circuit layer and a planarization layer 19. The pixel circuit layer includes pixel circuits for driving the light-emitting unit 13 to emit light. Figure 3 A transistor 18 in a pixel circuit is shown. A via is provided in the planarization layer 19, through which the first electrode 131 is electrically connected to the transistor 18 in the pixel circuit layer. Furthermore, the pixel circuit layer includes at least one insulating layer, which may include at least one of an inorganic layer and an organic layer. Additionally, the substrate 11 includes scan lines providing a scan signal (Scan) and data lines providing a data signal (Data) to the pixel circuit.

[0159] Please see again Figure 4The pixel circuit includes a driving transistor T1 and a data transistor T2. The source of the data transistor T2 is connected to a data line that provides the data signal Data, and the gate of the data transistor T2 is connected to a scan line that provides the scan signal Scan. The drain of the data transistor T2 is connected to the gate of the driving transistor T1. The two ends of the storage capacitor C1 are respectively connected to the gate and the source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting unit 13. Figure 4 This is one implementation of a pixel circuit; the pixel circuit described in this application is not limited to... Figure 4 The 2T1C pixel circuit shown can also be other pixel circuits, such as 7T1C, 8T1C pixel circuits, etc.

[0160] S11: An isolation structure 12 is formed on one side of the substrate 11. The isolation structure 12 encloses a plurality of isolation openings 12a. At least a portion of the isolation structure 12 enclosing the same isolation opening 12a includes a first isolation portion 121, a second isolation portion 122, and a third isolation portion 123 sequentially stacked in a direction away from the substrate 11. The orthographic projection of the side of the second isolation portion 122 away from the substrate 11 on the substrate 11 is located within the orthographic projection of the third isolation portion 123 on the substrate 11. The side of the first isolation portion 121 facing the isolation opening 12a has a first metal oxide 20, and the second isolation portion 122 is conductive.

[0161] S12: A plurality of light-emitting units 13 are formed, at least a portion of the light-emitting units 13 being located within the isolation opening 12a. Each light-emitting unit 13 includes a light-emitting functional part 132 and a first electrode 131 sequentially stacked along a direction away from the substrate 11. The light-emitting functional part 132 is spaced apart from the second isolation part 122, and at least a portion of the first electrode 131 overlaps with the second isolation part 122.

[0162] In the display panel 10 formed by the above method, a first metal oxide 20 is formed on the side of the first isolation portion 121 facing the isolation opening 12a. The first metal oxide 20 is non-conductive or has very poor conductivity. Therefore, even if the light-emitting functional portion 132 is in contact with the side of the first isolation portion 121 facing the isolation opening 12a, the charge carriers flowing through the light-emitting functional portion 132 are not easily transferred through the first isolation portion 121. Therefore, it is not easy for lateral leakage to occur between adjacent light-emitting units 13.

[0163] The second isolation portion 122 has good conductivity. The first electrode 131 is connected to the second isolation portion 122. Therefore, the signal of the first electrode 131 of the adjacent light-emitting unit 13 can be effectively transmitted through the second isolation portion 122.

[0164] In some possible implementations, the step of forming the isolation structure 12 on one side of the substrate 11 includes:

[0165] See Figure 12 A pixel defining material layer 22, a first isolation material layer 23, a second isolation material layer 24, a fourth isolation material layer 25 and a third isolation material layer 26 are sequentially formed on one side of the substrate 11.

[0166] See Figure 13 The pixel defining material layer 22, the third isolation material layer 26, the fourth isolation material layer 25, the second isolation material layer 24 and the first isolation material layer 23 are respectively patterned to form the pixel defining layer 17 and the third isolation portion 123, the fourth isolation portion 124, the second isolation portion 122 and the first isolation portion 121 of the isolation structure 12.

[0167] The orthographic projection of the side of the fourth isolation portion 124 away from the substrate 11 onto the substrate 11 is located within the orthographic projection of the third isolation portion 123 onto the substrate 11, and the orthographic projection area of ​​the side of the fourth isolation portion 124 away from the substrate 11 onto the substrate 11 is smaller than the orthographic projection area of ​​the third isolation portion 123 onto the substrate 11.

[0168] The orthographic projection of the side of the second isolation portion 122 near the substrate 11 on the substrate 11 is located within the orthographic projection of the side of the first isolation portion 121 away from the substrate 11 on the substrate 11. The orthographic projection of the side of the second isolation portion 122 away from the substrate 11 on the substrate 11 is located within the orthographic projection of the side of the fourth isolation portion 124 near the substrate 11 on the substrate 11.

[0169] See Figure 14 The first metal oxide 20 is formed on the side of the first isolation portion 121 facing the isolation opening 12a, and the second metal oxide 21 is formed on the side of the fourth isolation portion 124 facing the isolation opening 12a.

[0170] The material of the first isolation portion 121 is the same as that of the fourth isolation portion 124. Specifically, both the first isolation portion 121 and the fourth isolation portion 124 can be made of aluminum. Aluminum is easily oxidized, therefore, the side of the first isolation portion 121 and the fourth isolation portion 124 facing the isolation opening 12a is easily oxidized to form aluminum oxide. Thus, the metal oxides on the side of the first isolation portion 121 and the fourth isolation portion 124 facing the isolation opening 12a can be formed by oxidation with oxygen in the air, eliminating the need for a special process and reducing the process cost of forming the first metal oxide 20 and the second metal oxide 21.

[0171] Please see again Figure 8a Multiple light-emitting units 13 are formed, and at least a portion of the light-emitting units 13 are located within the isolation opening 12a.

[0172] A suspension structure is formed between the third isolation portion 123 and the fourth isolation portion 124. The suspension structure formed between the third isolation portion 123 and the fourth isolation portion 124 separates the light-emitting material layer into the light-emitting functional portion 132 and separates the first electrode material layer into the first electrode 131.

[0173] In this embodiment, even if the light-emitting functional part 132 is in contact with the side of the first isolation part 121 facing the isolation opening 12a, it is not easy for lateral leakage to occur between adjacent light-emitting units 13, and the signal of the first electrode 131 of the adjacent light-emitting unit 13 can be effectively transmitted through the second isolation part 122.

[0174] Optionally, the first electrode 131 extends through the second isolation portion 122 toward the side of the isolation opening 12a to overlap with a portion of the fourth isolation portion 124.

[0175] Under the same etching solution, the etching rate of the second isolation portion 122 is greater than that of the first isolation portion 121 and the fourth isolation portion 124. Therefore, the second isolation portion 122 will be recessed relative to the first isolation portion 121 and the fourth isolation portion 124.

[0176] In this embodiment, the first electrode 131 extends from the second isolation portion 122 toward the side of the isolation opening 12a to overlap with a portion of the fourth isolation portion 124. This increases the contact area between the first electrode 131 and the isolation structure 12, which is more conducive to the first electrode 131 climbing on the isolation structure 12, and further improves the overlap effect between the first electrode 131 and the isolation structure 12.

[0177] Specifically, please see again Figure 8a The distance D1 between the edge of the orthographic projection of the side of the second isolation portion 122 near the substrate 11 and the edge of the orthographic projection of the side of the first isolation portion 121 away from the substrate 11 on the substrate 11 is greater than or equal to 0 and less than or equal to 0.3 μm. For example, the distance D1 can be 0, 0.1 μm, 0.2 μm or 0.3 μm, etc.

[0178] Please see again Figure 9 The distance D2 between the edge of the orthographic projection of the side of the second isolation portion 122 away from the substrate 11 and the edge of the orthographic projection of the side of the fourth isolation portion 124 near the substrate 11 is greater than or equal to 0 and less than or equal to 0.3 μm. For example, the distance D2 can be 0, 0.1 μm, 0.2 μm or 0.3 μm, etc.

[0179] By setting appropriate distances D1 and D2, the bonding effect between the first electrode 131 and the isolation structure 12 can be further improved.

[0180] Please see again Figure 9 While forming the light-emitting unit 13, a corresponding encapsulation unit 14 can also be formed on the side of the light-emitting unit 13 away from the substrate 11. The encapsulation unit 14 is located on the side of the corresponding light-emitting unit 13 away from the substrate 11, and a portion of the encapsulation unit 14 extends from the side of the isolation structure 12 toward the isolation opening 12a to the side of the isolation structure 12 away from the substrate 11.

[0181] Optionally, the packaging unit 14 extends from the second isolation portion 122 toward the side of the isolation opening 12a to the side of the isolation structure 12 away from the substrate 11.

[0182] Optionally, the plurality of encapsulation units 14 corresponding to the plurality of light-emitting units 13 are spaced apart, and there is a gap between the encapsulation unit 14 located on the side of the isolation structure 12 away from the substrate 11 and the side of the isolation structure 12 away from the substrate 11.

[0183] Please see again Figure 2The encapsulation unit 14 is located on the side of the second electrode 133 facing away from the substrate 11, and extends through the sidewall of the isolation structure 12 to the side of the isolation structure 12 facing away from the substrate 11. The plurality of encapsulation units 14 include a plurality of first encapsulation units 14a corresponding to a plurality of first light-emitting units 13a, a plurality of second encapsulation units 14b corresponding to a plurality of second light-emitting units 13b, and a plurality of third encapsulation units 14c corresponding to a plurality of third light-emitting units 13c. The first encapsulation unit 14a is disposed on the side of the corresponding first light-emitting unit 13a facing away from the substrate 11, the second encapsulation unit 14b is disposed on the side of the corresponding second light-emitting unit 13b facing away from the substrate 11, and the third encapsulation unit 14c is disposed on the side of the corresponding third light-emitting unit 13c facing away from the substrate 11.

[0184] During the patterning process of the light-emitting unit 13, the first encapsulation material layer is broken at the isolation structure 12 to form an encapsulation unit 14. The encapsulation unit 14 can completely and independently encapsulate the corresponding light-emitting unit 13, thereby improving the display characteristics of the display panel 10.

[0185] In summary, in the display panel 10 formed by the above method, a first metal oxide 20 is formed on the side of the first isolation portion 121 facing the isolation opening 12a. The first metal oxide 20 is non-conductive or has very poor conductivity. Therefore, even if the light-emitting functional portion 132 is in contact with the side of the first isolation portion 121 facing the isolation opening 12a, the charge carriers flowing through the light-emitting functional portion 132 are not easily transferred through the first isolation portion 121. Therefore, it is not easy for lateral leakage to occur between adjacent light-emitting units 13.

[0186] For some possible implementations, please refer to Figure 15 This application also provides an electronic device 100, which includes the display panel 10 described in this application, or a display panel 10 prepared by the method described in this application. The electronic device 100 may include devices with image processing capabilities, such as mobile phones, desktop computers, laptops, tablets, automotive displays, wearable devices, etc. Because the electronic device 100 includes the display panel 10 described in this application, its display effect is better.

[0187] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0188] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: substrate; An isolation structure is located on one side of the substrate. The isolation structure encloses and forms a plurality of isolation openings. At least a portion of the isolation structure enclosing and forming the same isolation opening includes a first isolation portion, a second isolation portion, and a third isolation portion that are sequentially stacked in a direction away from the substrate. The orthographic projection of the side of the second isolation portion away from the substrate on the substrate is located within the orthographic projection of the third isolation portion on the substrate. The second isolation portion is conductive. A plurality of light-emitting units are provided, at least a portion of which is located within the isolation opening. Each light-emitting unit includes a light-emitting functional part and a first electrode that are sequentially stacked along a direction away from the substrate. The light-emitting functional part is spaced apart from the second isolation part, and at least a portion of the first electrode overlaps with the second isolation part. The isolation structure further includes a fourth isolation portion located between the second isolation portion and the third isolation portion, the side of the fourth isolation portion facing the isolation opening having a second metal oxide.

2. The display panel according to claim 1, characterized in that, The orthographic projection of the side of the fourth isolation portion away from the substrate onto the substrate is located within the orthographic projection of the third isolation portion onto the substrate, and the orthographic projection area of ​​the side of the fourth isolation portion away from the substrate onto the substrate is smaller than the orthographic projection area of ​​the third isolation portion onto the substrate.

3. The display panel according to claim 1, characterized in that, Along the thickness direction of the substrate, the thickness of the fourth isolation portion is greater than the thickness of the first isolation portion; The side of the first isolation portion facing the isolation opening has a first metal oxide; The material of the second metal oxide is the same as that of the first metal oxide; The material of the second isolation part includes an alloy material, and the material of the second isolation part includes the material of the first isolation part and / or the fourth isolation part.

4. The display panel according to claim 1, characterized in that, Along the thickness direction of the substrate, the thickness of the first isolation portion is greater than the maximum thickness of the light-emitting functional portion but less than twice the maximum thickness of the light-emitting functional portion.

5. The display panel according to claim 1, characterized in that, The area of ​​the side of the second isolation portion of the isolation structure that is close to the substrate is the same as the area of ​​the side of the first isolation portion that is away from the substrate. The area of ​​the side of the second isolation portion facing away from the substrate is smaller than the area of ​​the side of the fourth isolation portion facing the substrate.

6. The display panel according to claim 1, characterized in that, Along the thickness direction of the substrate, the thickness of the second insulating portion is greater than the maximum thickness of the first electrode.

7. The display panel according to claim 1, characterized in that, The orthographic projection of the side of the second isolation portion closer to the substrate onto the substrate is located within the orthographic projection of the side of the first isolation portion farther from the substrate onto the substrate. On the side of the isolation structure facing the isolation opening, the side of the second isolation portion facing the isolation opening is recessed relative to the side of the first isolation portion facing the isolation opening. The projected area of ​​the second isolation portion on the substrate is smaller than the projected area of ​​the first isolation portion on the substrate; The orthographic projection of the second isolation portion on the substrate covers the orthographic projection of the first isolation portion on the substrate.

8. The display panel according to claim 1, characterized in that, The fourth isolation portion covers a portion of the sidewall of the second isolation portion facing the isolation opening and extends to contact the side of the first isolation portion away from the substrate; or, the first isolation portion covers a portion of the sidewall of the second isolation portion facing the isolation opening and extends to contact the side of the fourth isolation portion facing the substrate.

9. The display panel according to claim 1, characterized in that, The area of ​​the side of the first isolation portion away from the substrate is smaller than the area of ​​the side of the first isolation portion facing the substrate, and the sidewall of the first isolation portion is stepped.

10. The display panel according to claim 1, characterized in that, The light-emitting functional part overlaps with at least a portion of the first isolation part; Along the thickness direction of the substrate, the light-emitting functional part and the second isolation part are spaced apart on one side of the substrate.

11. The display panel according to claim 1, characterized in that, The display panel further includes a pixel defining layer located between the substrate and the isolation structure. The pixel defining layer includes a plurality of pixel openings, which are connected to the corresponding isolation openings. The orthographic projection of the pixel openings on the substrate is located within the orthographic projection range of the isolation openings on the substrate. The light-emitting unit further includes a second electrode located on the side of the light-emitting functional part near the substrate, and the pixel opening exposes a portion of the second electrode.

12. The display panel according to any one of claims 1-11, characterized in that, The display panel also includes: Multiple encapsulation units are located on the side of the corresponding light-emitting unit away from the substrate, and a portion of the encapsulation unit extends from the side of the isolation structure toward the isolation opening to the side of the isolation structure away from the substrate.

13. The display panel according to claim 12, characterized in that, The packaging unit extends from the second isolation portion toward the isolation opening to the side of the isolation structure away from the substrate; The multiple light-emitting units are spaced apart from each other; The packaging unit located on the side of the isolation structure away from the substrate has a gap with the side of the isolation structure away from the substrate.

14. The display panel according to claim 12, characterized in that, The display panel further includes a second encapsulation layer located on the side of the encapsulation unit away from the substrate and a third encapsulation layer located on the side of the second encapsulation layer away from the substrate; Both the packaging unit and the third packaging layer are made of inorganic materials. The material of the second encapsulation layer includes organic materials.

15. An electronic device, characterized in that, The electronic device includes the display panel as described in any one of claims 1-14.

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