Wafer gap positioning device

Abstract

The invention provides a wafer gap positioning device, and belongs to the technical field of semiconductor manufacturing. Comprising a base, one side surface of which is provided with a limiting member; the positioning plate is installed on the base, and a scale line perpendicular to the horizontal plane is arranged on the first side face of the positioning plate; the positioning assembly comprises a fixing part, a rod piece and a positioning head, the fixing part is installed on the first side face, the rod piece vertically penetrates through the fixing part, the axis of the rod piece is parallel to the scale marks, the first end and the second end of the rod piece are both exposed out of the fixing part, and the positioning head is fixed to the second end; under the condition that the edge of the wafer abuts against the limiting piece and the surface of the wafer is attached to the first side face, the normal of the wafer is perpendicular to the scale line; the rod piece can move in the fixing part in the extending direction of the axis, the face, facing the wafer, of the positioning head is a curved face, and the curved face can abut against the edge of the wafer. According to the technical scheme, the positioning precision of the wafer gap can be effectively improved, and positioning errors caused by naked eye observation are avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a wafer notch positioning device. Background Art

[0002] In semiconductor manufacturing, the crystal orientation deviation of the wafer V-notch (V-Notch) directly affects the yield and performance of the product. Among the current mainstream V-Notch deviation measurement methods, the V-Notch center positioning method is mainly used to locate the wafer notch. This process requires the operator to manually install the positioning backplane and wafer, align the V-Notch center with the backplane center scale line (201) by visual observation, and then use X-ray diffraction to detect the crystal orientation deviation in the direction perpendicular to the V-Notch to characterize the crystal orientation deviation of the V-Notch.

[0003] However, since the V-Notch is small in width and shallow in depth, relying on visual judgment to determine whether the center of the V-Notch is aligned with the center scale line (201) of the backplane can easily lead to large positioning errors, which has a negative impact on the measurement accuracy of the crystal orientation deviation. Summary of the Invention

[0004] The present invention provides a wafer notch positioning device, which can effectively improve the positioning accuracy of the wafer notch and avoid positioning errors caused by naked eye observation.

[0005] In order to achieve the above objectives, the technical solution adopted in the embodiment of the present invention is:

[0006] A wafer notch positioning device, comprising:

[0007] A base, wherein a limiting member is provided on one side surface of the base;

[0008] a positioning plate, mounted on the base, wherein a first side surface of the positioning plate has a scale line perpendicular to a horizontal plane;

[0009] A positioning assembly is mounted on the first side of the positioning plate, and the positioning assembly includes: a fixing portion, a rod, and a positioning head, wherein the fixing portion is mounted on the first side of the positioning plate, the rod vertically passes through the fixing portion, the axis of the rod is parallel to the scale line, the first end and the second end of the rod are both exposed outside the fixing portion, and the positioning head is fixed to the second end, which is the end of the rod facing the limit member;

[0010] Wherein, when the edge of the wafer abuts against the limiting member and the surface of the wafer is in contact with the first side surface, the normal line of the wafer is perpendicular to the scale line;

[0011] The rod can move in the fixing portion along the extending direction of the axis. The surface of the positioning head facing the wafer is a curved surface, and the curved surface can abut against the edge of the wafer.

[0012] In some embodiments, the wafer notch positioning device further includes:

[0013] An elastic member, one end of which is fixed to the inner wall of the fixing portion, and the other end is connected to the rod member, and the rod member moves downward along the extension direction of the axis under the elastic force of the elastic member, so that the curved surface abuts the edge of the wafer.

[0014] In some embodiments, the radius of curvature of the curved surface is greater than or equal to the width of the notch of the wafer.

[0015] In some embodiments, the wafer notch positioning device further includes:

[0016] A driving assembly is provided, wherein the driving assembly can drive the first end of the rod to drive the rod to move in the fixing portion.

[0017] In some embodiments, a through channel is provided inside the fixing portion, the rod is movably inserted into the through channel, an accommodating groove is recessed along the vertical direction on the inner wall of the fixing portion, and the elastic member is provided in the accommodating groove.

[0018] In some embodiments, a clamping portion is protruded from the first end of the rod;

[0019] Wherein, when the elastic member is in a natural state, the clamping portion is clamped with the outer surface of the fixing portion.

[0020] In some embodiments, the wafer notch positioning device further includes:

[0021] A switch and an air pump, wherein the switch and the air pump are connected;

[0022] Among them, an adsorption hole is provided on the first side of the positioning plate, and the air inlet of the air pump is connected to the adsorption hole. When the switch is on, the air pump inhales gas from the air inlet, so that the adsorption hole adsorbs the wafer on the first side.

[0023] In some embodiments, the stopper is a cam bearing follower.

[0024] In some embodiments, the positioning plate is detachably mounted on the base.

[0025] In some embodiments, the positioning head is made of metal.

[0026] The beneficial effects of the present invention are:

[0027] In this embodiment, the rod can move in the fixed part along the axis of the rod. When positioning the wafer notch, the rod can be pulled up first, one side of the wafer is pressed against the positioning plate and placed on the limiter, and then the rod is lowered so that the positioning head on the rod abuts against the edge of the wafer. After that, the wafer is rotated so that the notch of the wafer rotates in the direction close to the positioning head. When both sides of the notch of the wafer contact the curved surface of the positioning head, it indicates that the notch of the wafer is aligned with the scale line of the positioning plate. In this way, it can assist manual work to quickly and accurately align the notch of the wafer with the scale line of the positioning plate, thereby achieving the purpose of wafer notch positioning and effectively avoiding measurement errors caused by naked eye observation. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 One schematic diagram showing wafer notch positioning by the wafer notch positioning device according to an embodiment of the present invention;

[0029] Figure 2 A second schematic diagram showing wafer notch positioning by the wafer notch positioning device according to an embodiment of the present invention;

[0030] Figure 3 A third schematic diagram showing wafer notch positioning by the wafer notch positioning device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present invention.

[0032] In order to solve the above technical problems, an embodiment of the present invention provides a wafer notch positioning device, which can effectively improve the positioning accuracy of the wafer notch and avoid positioning errors caused by naked eye observation.

[0033] An embodiment of the present invention provides a wafer notch positioning device, comprising: a base 1 , a positioning plate 2 and a positioning assembly 3 .

[0034] Among them, the base 1 has a limiting member 101 provided on one side surface of the base 1.

[0035] The positioning plate 2 is mounted on the base 1 , and a scale line 201 perpendicular to the horizontal plane is provided on a first side surface of the positioning plate 2 .

[0036] The positioning component 3 is installed on the first side of the positioning plate 2, and the positioning component 3 includes: a fixing part 301, a rod 302 and a positioning head 303, wherein the fixing part 301 is installed on the first side of the positioning plate 2, the rod 302 vertically passes through the fixing part 301, the axis of the rod 302 is parallel to the scale line 201, the first end and the second end of the rod 302 are both exposed outside the fixing part 301, and the positioning head 303 is fixed at the second end, and the second end is the end of the rod 302 facing the limit member 101.

[0037] When the edge of the wafer 4 abuts against the limiting member 101 and the surface of the wafer 4 is in contact with the first side surface, the normal of the wafer 4 is perpendicular to the scale line 201 .

[0038] The rod 302 can move in the fixing portion 301 along the extending direction of the axis. The surface of the positioning head 303 facing the wafer 4 is a curved surface, which can abut against the edge of the wafer 4. In some specific embodiments, the positioning head 303 is made of metal.

[0039] It should be noted that, in some specific embodiments, the positioning plate 2 is detachably mounted on the base 1. When the wafer notch positioning device provided by the embodiment of the present invention is used to position the wafer notch, as shown in FIG. Figure 1 As shown, the positioning plate 2 can be installed on the base 1 first, and then the rod 302 in the positioning assembly 3 can be pulled up. At this time, one side of the wafer 4 can be pressed against the positioning plate 2 and placed on the limiting member 101. Here, the limiting member 101 has a limiting effect on the wafer 4. In some specific embodiments, the limiting member 101 is a cam bearing follower, such as Figure 1 As shown, the number of the cam bearing followers can be two, and the two cam bearing followers cooperate with each other to limit the wafer 4.

[0040] Next, if Figure 2 As shown, lower the rod 302 so that the positioning head 303 on the rod 302 abuts against the edge of the wafer 4, and then slowly turn (rotate) the wafer 4 so that the notch of the wafer 4 rotates toward the direction of the positioning head 303; Figure 3 As shown, when both sides of the notch of wafer 4 contact the curved surface of positioning head 303, it indicates that the notch of wafer 4 is aligned with the center scale line (i.e., scale line 201) of positioning plate 2. This can assist in quickly and accurately aligning the notch of wafer 4 with the center scale line of positioning plate 2, achieving the purpose of wafer notch positioning and effectively avoiding measurement errors caused by naked eye observation.

[0041] In this embodiment, by setting up a positioning plate 2 and a positioning component 3, it is possible to assist humans in quickly and accurately aligning the center of the wafer's V-Notch groove (that is, the wafer notch) with the center scale line of the positioning plate 2, thereby avoiding V-Notch groove positioning errors caused by naked eye observation.

[0042] In some embodiments, the wafer notch positioning device also includes: an elastic member 5, one end of the elastic member 5 is fixed to the inner wall of the fixed portion 301, and the other end is connected to the rod member 302, and the rod member 302 moves downward along the extension direction of the axis under the elastic force of the elastic member 5, so that the curved surface abuts against the edge of the wafer 4.

[0043] It should be noted that when the rod 302 is pulled upward, the elastic member 5 is deformed. Therefore, in order to restore the deformation, the elastic member 5 will generate an elastic force on the rod 302. In other words, during the tightening process, the elastic member 5 will cause the rod 302 to move downward along the extension direction of the axis until the curved surface abuts the edge of the wafer 4. In this way, a certain degree of fit can be maintained between the curved surface and the edge of the wafer 4, facilitating the positioning of the wafer notch.

[0044] In some embodiments, the radius of curvature of the curved surface is greater than or equal to the width of the notch of the wafer 4 .

[0045] It can be understood that in the embodiment of the present invention, the curved surface of the positioning head 303 can be reasonably designed so that its size matches the size of the notch of the wafer 4, that is, the curved surface of the positioning head 303 and the surface of the notch of the wafer 4 can have a good contact effect, avoiding the difficulty in effectively contacting the notch of the wafer 4 due to the small curvature radius of the curved surface, thereby improving the overall positioning effect.

[0046] In some embodiments, the wafer notch positioning device further includes: a driving component, which is capable of driving the first end of the rod 302 to drive the rod 302 to move in the fixing portion 301 .

[0047] It should be noted that before positioning the wafer notch, the rod 302 can be pulled upward along the extension direction of the axis through the driving assembly to place the wafer 4 (that is, the wafer 4 is placed on the limit member 101, and the wafer 4 is fit with the first side of the positioning plate 2).

[0048] In some embodiments, a through channel is provided inside the fixing portion 301 , and the rod 302 is movably inserted into the through channel. An accommodating groove is provided on the inner wall of the fixing portion 301 in a vertical direction, and the elastic member 5 is provided in the accommodating groove.

[0049] Here, the through channel and the accommodating groove are interconnected, and the accommodating groove can play a limiting and guiding role on the elastic member 5.

[0050] In some embodiments, a clamping portion is protruded from the first end of the rod 302 ; wherein, when the elastic member 5 is in a natural state, the clamping portion is clamped with the outer surface of the fixing portion 301 .

[0051] It should be noted that when the elastic member 5 is in a natural state, the clamping portion of the rod 302 is clamped on the outer surface of the fixing portion 301. In this way, the fixing portion 301 can support the rod 302, and the elastic member 5 is in a natural state rather than a deformed state. This can prevent the elastic member 5 from becoming loose due to being in a deformed state for a long time, thereby protecting the elastic member 5 and extending the service life of the elastic member 5.

[0052] In some specific examples, the elastic member 5 may be a spring or other elastic component.

[0053] In some embodiments, the wafer notch positioning device also includes: a switch and an air pump (not shown in the figure), and the switch and the air pump are connected; wherein, an adsorption hole 6 is provided on the first side surface of the positioning plate 2, and the air inlet of the air pump is connected to the adsorption hole 6. When the switch is in the on state, the air pump inhales gas from the air inlet, so that the adsorption hole 6 adsorbs the wafer 4 on the first side surface.

[0054] It should be noted that before positioning the wafer notch, the switch can be turned off. In this way, the adsorption hole 6 will not adsorb the wafer 4, making it convenient to rotate the wafer 4 to position the wafer notch; when the wafer 4 needs to be fixed, the switch can be turned on. At this time, the air pump starts working and sucks in external air from the air inlet, thereby causing the wafer 4 to be adsorbed on the first side of the positioning plate 2 to fix the wafer 4.

[0055] In this embodiment, by setting up a positioning plate 2 and a positioning component 3, it is possible to assist humans in quickly and accurately aligning the center of the wafer's V-Notch groove (that is, the wafer notch) with the center scale line of the positioning plate 2, thereby avoiding V-Notch groove positioning errors caused by naked eye observation.

[0056] It should be noted that the various embodiments in this specification are described in a progressive manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences from other embodiments. In particular, since the embodiments are generally similar to the product embodiments, the description is relatively simple. For relevant parts, refer to the partial description of the product embodiments.

[0057] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0058] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0059] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0060] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A wafer notch positioning device, characterized in that: include: A base (1), wherein a limiting member (101) is provided on one side surface of the base (1); A positioning plate (2) is mounted on the base (1), and a scale line (201) perpendicular to a horizontal plane is provided on a first side surface of the positioning plate (2); A positioning assembly (3) is mounted on the first side of the positioning plate (2), and the positioning assembly (3) comprises: a fixing portion (301), a rod (302) and a positioning head (303), wherein the fixing portion (301) is mounted on the first side of the positioning plate (2), the rod (302) vertically passes through the fixing portion (301), the axis of the rod (302) is parallel to the scale line (201), the first end and the second end of the rod (302) are both exposed outside the fixing portion (301), and the positioning head (303) is fixed to the second end, and the second end is the end of the rod (302) facing the limiting member (101); Wherein, when the edge of the wafer (4) abuts against the limiting member (101) and the surface of the wafer (4) is in contact with the first side surface, the normal of the wafer (4) is perpendicular to the scale line (201); The rod (302) can move in the fixing portion (301) along the extension direction of the axis, and the surface of the positioning head (303) facing the wafer (4) is a curved surface, and the curved surface can abut against the edge of the wafer (4).

2. The wafer notch positioning device according to claim 1, characterized in that: Also includes: An elastic member (5), one end of the elastic member (5) is fixed to the inner wall of the fixing portion (301), and the other end is connected to the rod member (302), and the rod member (302) moves downward along the extension direction of the axis under the elastic force of the elastic member (5), so that the curved surface abuts against the edge of the wafer (4).

3. The wafer notch positioning device according to claim 1, characterized in that: The curvature radius of the curved surface is greater than or equal to the width of the notch of the wafer (4).

4. The wafer notch positioning device according to claim 1, characterized in that: Also includes: A driving assembly is provided, wherein the driving assembly is capable of driving the first end of the rod (302) to drive the rod (302) to move in the fixing portion (301).

5. The wafer notch positioning device according to claim 2, characterized in that: A through channel is provided inside the fixing portion (301), and the rod (302) is movably inserted into the through channel. The inner wall of the fixing portion (301) is provided with a receiving groove in a vertical direction, and the elastic member (5) is provided in the receiving groove.

6. The wafer notch positioning device according to claim 2, characterized in that: A clamping portion is convexly provided on the first end of the rod (302); Wherein, when the elastic member (5) is in a natural state, the clamping portion is clamped with the outer surface of the fixing portion (301).

7. The wafer notch positioning device according to claim 1, characterized in that: Also includes: A switch and an air pump, wherein the switch and the air pump are connected; A suction hole (6) is provided on the first side of the positioning plate (2), and the air inlet of the air pump is connected to the suction hole (6). When the switch is turned on, the air pump inhales gas from the air inlet, so that the suction hole (6) adsorbs the wafer (4) on the first side.

8. The wafer notch positioning device according to claim 1, characterized in that: The limiting member (101) is a cam bearing follower.

9. The wafer notch positioning device according to claim 1, characterized in that: The positioning plate (2) is detachably mounted on the base (1).

10. The wafer notch positioning device according to claim 1, characterized in that: The positioning head (303) is made of metal.

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