Edge laser packaging and manufacturing method

Abstract

An edge laser package and method of manufacture wherein the edge laser package comprises: an edge laser chip for emitting laser; gold threads; the heat sink comprises a first surface and a second surface, the second surface is perpendicular to the first surface, a first bonding pad and a second bonding pad are arranged on the first surface, the heat sinks are arranged on the two sides of the plane where the first surface is located, and a first interface and a second interface are arranged on the second surface. The first interface is connected with the first bonding pad through the conductive metal in the heat sink, and the second interface is connected with the second bonding pad through the conductive metal in the heat sink; one electrode of the edge laser chip is mounted on the first bonding pad, and the other electrode of the edge laser chip is connected to the second bonding pad through the gold wire; the cover body is positioned above the heat sink, is connected with the heat sink in a sealing manner, and wraps the edge laser chip and the gold wire; and at least part of the cover body is transparent, so that the laser is emitted.

Description

Technical Field

[0001] The present invention relates to the technical field of laser packaging, and in particular to an edge laser packaging and a manufacturing method. Background Art

[0002] Edge lasers are widely used in many fields, including modern optical communications, laser processing, and medical treatment, due to their unique performance advantages. As the core component for laser generation, the stable and efficient operation of edge laser chips plays a decisive role in the performance of the entire system. However, edge laser chips generate a large amount of heat during operation. If heat is not dissipated promptly and effectively, the chip temperature will rise sharply, resulting in a decrease in laser output power, wavelength drift, deterioration in beam quality, and even chip damage, seriously affecting the service life and reliability of the edge laser.

[0003] At the same time, edge laser chips require stable electrical connections during operation to ensure that current is accurately and stably supplied to the positive and negative terminals of the chip, thereby ensuring normal laser emission. Traditional packaging methods have many shortcomings in terms of heat dissipation and electrical connections, making it difficult to meet the growing high-performance requirements of edge lasers. For example, some packaging methods cannot achieve an efficient heat dissipation path, causing the chip to be exposed to high temperatures for a long time; other packaging methods are prone to problems such as poor contact and excessive resistance in the electrical connections, affecting the stability and efficiency of laser emission.

[0004] Furthermore, edge laser chips face interference from external environmental factors such as dust and moisture during actual use, which can negatively impact chip performance. Therefore, it is imperative to develop an edge laser packaging technology solution that effectively addresses heat dissipation, electrical connections, and protection issues.

[0005] The disclosure of the above background technology content is only used to assist in understanding the inventive concept and technical solution of the present invention. It does not necessarily belong to the prior art of this patent application. In the absence of clear evidence that the above content has been disclosed on the filing date of this patent application, the above background technology should not be used to evaluate the novelty and creativity of this application. Summary of the Invention

[0006] To this end, the present invention proposes an airtight COS packaging solution based on edge-emitting lasers, which can enable the edge laser to emit vertically while having good heat dissipation conditions and airtightness, overcoming the shortcomings of the above-mentioned conventional laser packaging solutions and improving the service life and process mass production of the laser.

[0007] In a first aspect, the present invention provides an edge laser package, characterized by comprising:

[0008] Edge laser chip, used for emitting laser;

[0009] Gold thread;

[0010] A heat sink comprising a first surface and a second surface, the second surface being perpendicular to the first surface, a first solder pad and a second solder pad being provided on the first surface, a heat sink being provided on both sides of a plane on which the first surface is located, and a first interface and a second interface being provided on the second surface, the first interface being connected to the first solder pad via conductive metal within the heat sink, and the second interface being connected to the second solder pad via conductive metal within the heat sink;

[0011] One electrode of the edge laser chip is mounted on the first pad, and the other electrode of the edge laser chip is connected to the second pad via the gold wire;

[0012] The cover is located above the heat sink, is sealed with the heat sink, and wraps the edge laser chip and the gold wire; the cover is at least partially transparent to allow the laser to be emitted.

[0013] Optionally, the edge laser package is characterized in that the emission direction of the laser is perpendicular to the second surface and away from the second surface.

[0014] Optionally, the edge laser package is characterized in that the heat sink is L-shaped.

[0015] Optionally, the edge laser package is characterized in that the inner and outer side walls of the cover body on the laser emitting side have the same draft angle to avoid deflection of the direction of the laser.

[0016] Optionally, the edge laser package is characterized in that the inner surface or outer surface of the cover body located on the laser emitting side is coated with an anti-reflection film to improve transmittance.

[0017] Optionally, the edge laser package is characterized in that the heat sink includes a substrate, a first solder pad, a second solder pad, a first interface, a second interface, and a filling hole;

[0018] The substrate comprises at least a first surface, a second surface, and a third surface; the first surface and the third surface are located on opposite sides of the substrate; the first surface is perpendicular to the second surface; the second surface and the third surface are located on both sides of the first surface respectively;

[0019] The first pad and the second pad are located on the first surface;

[0020] The first interface and the second interface are located on the second surface;

[0021] The substrate has the filling hole inside;

[0022] Conductive metal is contained in the filling hole and is used to connect the first pad and the first interface, and the second pad and the second interface.

[0023] Optionally, the edge laser package is characterized in that a solder area is provided at the center of the first pad, and a size of the solder area is larger than that of the edge laser chip.

[0024] Optionally, the edge laser package is characterized in that the size of the first solder pad is larger than the size of the first interface.

[0025] Optionally, the edge laser package is characterized in that the size of the first interface is equal to the size of the second interface.

[0026] In a second aspect, the present invention provides a method for manufacturing an edge laser package, characterized by comprising:

[0027] Step S1: Mounting one electrode of the edge laser chip to the first pad on the heat sink;

[0028] Step S2: connecting the other electrode of the edge laser chip and the second pad of the heat sink through a gold wire;

[0029] Step S3: placing the heat sink with the edge laser chip mounted thereon in an environment filled with nitrogen (N2) or clean dry air (CDA);

[0030] Step S4: In the environment filled with nitrogen (N2) or clean dry air (CDA), the cover is mounted on the heat sink by SMT or thermosetting adhesive to seal the edge laser chip and the gold wire.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] The edge laser chip of the present invention is mounted horizontally on the heat sink, which has a large contact surface and ensures good heat dissipation.

[0033] The edge laser chip of the present invention is mounted horizontally on the heat sink without changing the light emitting direction and light emitting surface size of the laser, making it easier to adapt to compact optical design.

[0034] The external power interface of the present invention is in the opposite direction to the outlet of the edge laser, and the installation direction of the edge laser can be flexibly changed without processing the optical path.

[0035] The surface of the laser of the present invention is provided with a cover body, which can protect the gold wire from external collision damage during production and use.

[0036] The laser of the present invention realizes airtight packaging, which can prevent dust in the air from being adsorbed on the laser cavity surface and causing damage.

[0037] The laser package airtight cavity of the present invention is filled with nitrogen or clean dry air, which can further prevent the influence of water vapor in the air and other volatile gases in the production environment on the laser, thereby increasing the service life of the laser.

[0038] In this invention, one electrode of the edge laser chip is directly mounted on the first pad, and the other electrode is connected to the second pad via gold wire. The conductive metal inside the heat sink ensures good conductivity from the interface to the pad. This design ensures a short and stable transmission path for current from the external interface to the positive and negative electrodes of the chip, with low contact resistance. This effectively reduces problems such as poor contact and excessive resistance that may arise in electrical connections, ensures accurate and stable current supply to the chip, and provides reliable electrical protection for the chip to emit laser light normally, thereby improving the stability and efficiency of laser emission.

[0039] In this invention, the cover is positioned above and sealed to the heat sink, completely encasing the edge laser chip and gold wires. The cover is at least partially transparent, which not only does not affect laser emission but also effectively blocks environmental factors such as dust and moisture from corroding the chip and gold wires, preventing these impurities from interfering with the chip's normal operation. This protects the chip's performance and enables stable operation of the edge laser even in complex environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without inventive work. Other features, purposes and advantages of the present invention will become more apparent by reading the detailed description of the non-limiting embodiments with reference to the following drawings:

[0041] Figure 1 This is a schematic structural diagram of an edge laser package according to an embodiment of the present invention;

[0042] Figure 2 1 is a side view schematic diagram of an edge laser package according to an embodiment of the present invention;

[0043] Figure 3 This is a side view of a cover body according to an embodiment of the present invention;

[0044] Figure 4 This is a side view of another cover body according to an embodiment of the present invention;

[0045] Figure 5This is a schematic structural diagram of a heat sink according to an embodiment of the present invention;

[0046] Figure 6 A schematic diagram of the structure of another heat sink in an embodiment of the present invention

[0047] Figure 7 The figure is a flowchart of the steps of a method for manufacturing an edge laser package according to an embodiment of the present invention.

[0048] 1- housing;

[0049] 2-sided laser chip;

[0050] 3-Gold thread;

[0051] 4-heat sink;

[0052] 5-Substrate;

[0053] 6-first pad;

[0054] 7-first interface;

[0055] 8- second pad;

[0056] 9- Second interface;

[0057] 10-Irrigation hole;

[0058] 11- conductive metal;

[0059] 41- first surface;

[0060] 42- second surface;

[0061] 43- third surface; DETAILED DESCRIPTION

[0062] The present invention will be described in detail below with reference to specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those skilled in the art, several variations and improvements can be made without departing from the scope of the present invention. These all fall within the scope of protection of the present invention.

[0063] The terms "first," "second," "third," "fourth," and the like (if any) in the description and claims of the present invention and in the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the invention described herein, for example, can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having," and any variations thereof, are intended to cover non-exclusive inclusions, for example, a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or apparatus.

[0064] An edge laser package provided by an embodiment of the present invention is intended to solve the problems existing in the prior art.

[0065] The present invention can package edge-emitting lasers into airtight SMT devices and prevent damage to laser chips and gold wires during production and use. It can enable edge lasers to emit vertically and increase the working life of the lasers. It is applicable to fields such as laser radar, 3D structured light, and TOF.

[0066] In some embodiments of this specification, the positive electrode of the edge laser chip is connected to the first pad, and the negative electrode of the edge laser chip is connected to the second pad. Those skilled in the art will understand that the first pad can be connected to either the positive electrode or the negative electrode of the edge laser chip, and the second pad can be connected to the other electrode accordingly.

[0067] The following describes in detail the technical solutions of the present invention and how the technical solutions of this application solve the above-mentioned technical problems using specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments. The following embodiments of the present invention are described in conjunction with the accompanying drawings.

[0068] like Figure 1 and Figure 2 As shown, an edge laser package in an embodiment of the present invention includes:

[0069] The edge laser chip 2 is used for emitting laser light.

[0070] Specifically, the edge laser chip, as the core component of the entire package, primarily functions to emit laser light. Laser light emitted by edge laser chips plays a key role in numerous optical applications, such as signal transmission in optical communications, cutting and welding materials in laser processing, and medical treatment. Through its specific internal structure and materials, driven by electrical signals, it generates stimulated radiation, producing laser light with a specific wavelength, power, and beam quality. The chip's performance directly determines the overall output characteristics of the edge laser and also plays a key role in guiding the design of other package components.

[0071] Gold wire 3.

[0072] Specifically, the gold wire performs the crucial electrical connection function within this package. It connects the cathode of the edge laser chip to the second pad on the first surface of the heat sink. Due to its excellent electrical conductivity and chemical stability, the gold wire ensures stable, low-resistance current transmission. This stable electrical connection is crucial for the proper functioning of the chip, ensuring reliable and stable laser emission when receiving electrical signals, and avoiding current fluctuations caused by poor electrical connections, which can affect the stability and consistency of the laser output.

[0073] A heat sink 4 includes a first surface 41 and a second surface 42, the second surface being perpendicular to the first surface. A first solder pad 6 and a second solder pad 8 are provided on the first surface, and a heat sink is provided on both sides of the plane where the first surface is located. A first interface 7 and a second interface 9 are provided on the second surface. The first interface is connected to the first solder pad via a conductive metal 11 within the heat sink, and the second interface is connected to the second solder pad via a conductive metal 11 within the heat sink.

[0074] Specifically, the heat sink is not a simple planar structure. The heat sink structure in this embodiment is complex and functionally critical. It includes a first surface and a second surface that are perpendicular to each other. A first solder pad and a second solder pad are provided on the first surface for connecting the positive and negative electrodes of the edge laser chip. At the same time, there are heat sink structures on both sides of the plane where the surface is located, which greatly increases the heat dissipation area. When the edge laser chip generates a large amount of heat during operation, the heat sink can quickly absorb the heat. The first interface and the second interface on the second surface are respectively connected to the first solder pad and the second solder pad on the first surface through the conductive metal inside the heat sink. This design not only realizes electrical connection, but also builds an efficient path for heat transfer. While conducting current, the conductive metal inside the heat sink can also assist in the rapid conduction of heat from the chip end to the outside of the heat sink, ultimately achieving efficient heat dissipation, ensuring that the chip operates in an appropriate temperature range, and maintaining its stable performance.

[0075] The cover 1 is located above the heat sink, is sealed with the heat sink, and wraps the edge laser chip and the gold wire; the cover is at least partially transparent to allow the laser to be emitted.

[0076] Specifically, the cover is installed above the heat sink and is sealed with the heat sink. Its main function is to protect the edge laser chip and gold wire inside. On the one hand, the cover is at least partially made of transparent material, which allows the laser emitted by the chip to be emitted smoothly without affecting the normal use of the edge laser. On the other hand, the sealed cover can effectively block external environmental impurities such as dust and water vapor, and prevent these impurities from adhering to the chip and gold wire. Dust may affect the optical performance of the chip, and water vapor may cause corrosion to the electrical connection parts, while the protective effect of the cover can protect the chip and gold wire, ensuring that the edge laser can operate stably in various complex environments and extend its service life. Figure 3 and Figure 4 As shown, the shape of the cover can be different, and the shape and size of the cover are adapted to the heat sink to meet the sealing requirements.

[0077] In some embodiments, the emission direction of the laser is perpendicular to the second surface and away from the second surface. From the overall structural point of view, the second surface of the heat sink is in a specific position, and the laser is perpendicular to the surface and emitted in a direction away from it. This design is based on many considerations. In addition to being provided with a positive second interface for electrical connection, the second surface of the heat sink also plays a key role in heat dissipation. The laser is emitted perpendicular to the surface, which can avoid unnecessary interference of the heat sink on the laser propagation. Because the main function of the heat sink is to absorb and conduct the heat generated by the chip, its structure and material may have adverse effects such as scattering or absorption on the laser. Vertical emission can minimize such problems.

[0078] Considering practical applications, for example, in optical communications, optical signals must be accurately transmitted in a specific direction. This clear laser emission direction ensures that the signal is accurately captured by the receiver. In laser processing, vertical and directional laser emission enables precise cutting or welding of materials, improving processing accuracy and quality. In the medical field, precise laser emission direction is crucial to therapeutic effectiveness, enabling precise targeting of the target area while minimizing the impact on surrounding healthy tissue.

[0079] In this embodiment, the emission direction of the laser light of the edge laser is perpendicular to the external interface, so that the edge laser can achieve a vertical emission effect.

[0080] The setting of this laser emission direction cooperates with other components in the packaging structure. The edge laser chip generates laser light, the gold wire is responsible for electrical connection to ensure the normal operation of the chip, the heat sink efficiently dissipates heat to ensure chip performance, and the cover body provides protection without hindering the laser from emitting in the predetermined direction, jointly ensuring the stable and efficient operation of the edge laser in different application scenarios.

[0081] In some embodiments, Figure 5 As shown, the heat sink is L-shaped. The L-shaped heat sink has two surfaces (i.e., the first surface and the second surface) that are perpendicular to each other. Such a structure can significantly increase the heat dissipation area. There are heat sink parts on both sides of the plane where the first surface is located, which are in direct contact with the edge laser chip and can quickly absorb the heat generated when the chip is working. The vertical second surface further expands the spatial dimension of heat dissipation, allowing heat to be more efficiently conducted and dissipated to the surrounding environment along the L-shaped structure. Compared with heat sinks of traditional shapes, L-shaped heat sinks can provide more direct and diverse heat dissipation paths, effectively reduce the operating temperature of the chip, ensure its stable performance, and can also change the installation direction of the edge laser emitter, thereby expanding more application scenarios.

[0082] First and second solder pads are placed on the first surface of the L-shaped heat sink to facilitate the mounting and connection of the positive and negative terminals of the edge laser chip. The first and second interfaces on the second surface are connected to the solder pads on the first surface via conductive metal within the heat sink. This layout makes the electrical connection more compact and organized. The L-shaped structure provides space for the placement of conductive materials, shortens the current transmission path, reduces resistance, and improves the stability and reliability of the electrical connection, ensuring that the chip receives a stable current supply and can emit laser light normally.

[0083] The L-shaped heat sink's shape facilitates efficient packaging within limited space. It cleverly utilizes space, integrating heat dissipation and electrical connection functions into a compact structure. Components such as the edge laser chip, gold wires, and housing can be strategically arranged around the L-shaped heat sink, making the overall package more compact and reducing package size. This is crucial for space-critical applications such as miniaturized optical communications equipment or portable laser instruments, helping to improve device integration and portability.

[0084] The L-shaped heat sink and the cover are also more coordinated. The cover is located above the heat sink, sealed with the heat sink, and wraps around the edge laser chip and gold wire. The shape of the L-shaped heat sink provides a stable foundation for the installation of the cover, and can better ensure the overall sealing during the sealing process, effectively blocking the entry of external dust, water vapor and other impurities, and protecting the internal chip and gold wire. At the same time, the laser emission direction is perpendicular to the second surface and away from the second surface. The structure of the L-shaped heat sink will not block or interfere with the emission of the laser, ensuring that the laser can be emitted smoothly and realize the normal function of the edge laser.

[0085] The L-shaped heat sink design in the edge laser package provides strong support for the performance improvement and practical application of edge lasers by optimizing heat dissipation, rationally arranging electrical connections, improving space utilization, and enhancing coordination with other components.

[0086] In some embodiments, the draft angles of the inner and outer walls of the cover on the side where the laser is emitted are the same to avoid deflection of the direction of the laser. After the laser is emitted from the edge laser chip, it will be emitted through the cover. If the draft angles of the inner and outer walls of the cover on the side where the laser is emitted are different, when the laser passes through the cover, due to the principle of refraction, the incident angle and refraction angle of the light on the interfaces of different media (cover material and air) will undergo complex changes. Different draft angles will cause inconsistent refraction of the laser on the side wall of the cover, thereby deflecting the propagation direction of the laser. When the draft angles of the inner and outer walls are the same, the refraction of the laser on the side wall during the process of passing through the cover is relatively stable and symmetrical, which can ensure that the laser propagates in the original emission direction to the greatest extent, avoid directional deviation caused by refraction differences, and ensure the accuracy and stability of the laser output.

[0087] Many applications, such as high-precision laser processing and optical communications, place extremely high demands on the laser's directional accuracy. Deflection in the laser's direction can lead to problems such as deviations in processing position and errors in optical signal transmission. By ensuring the same draft angles on the inner and outer walls of the housing on the emission side, this deflection is effectively avoided, ensuring high-quality laser output. For example, in laser cutting, accurate laser direction ensures the precision and quality of the cut lines, improving processing efficiency and product quality. Similarly, in optical communications, stable laser direction helps accurately transmit optical signals to the receiving end, improving communication reliability and stability.

[0088] This design works in conjunction with the rest of the edge laser package to guarantee laser performance. The heat sink dissipates heat and maintains electrical connections, ensuring the chip operates properly and produces stable laser light. The gold wires provide reliable electrical connections. The housing, in addition to providing protection, utilizes a specific draft angle design to ensure the proper laser emission direction without compromising the protective effect. These components work together to ensure that the entire edge laser package meets the essential requirements of heat dissipation, electrical connections, and protection, while also achieving high-quality laser output.

[0089] From a manufacturing perspective, maintaining the same draft angle for the inner and outer walls of the housing's emission side is relatively easy to achieve and control. During mold manufacturing, a unified draft angle design can simplify the mold structure and processing, reducing manufacturing difficulty and cost. This design also helps improve housing production efficiency and quality stability, ensuring consistency in laser emission direction control across each housing, thereby ensuring consistent performance across the entire edge laser package.

[0090] The design of the cover with the same draft angles on the inner and outer walls on the laser output side has a positive impact on the performance and application of edge lasers from multiple aspects, including optical principles, improving laser output quality, coordination with the overall structure, manufacturing process and cost.

[0091] In some embodiments, the inner or outer surface of the cover body on the side where the laser is emitted is coated with an anti-reflection film to improve the transmittance. When the laser enters another medium (cover material) from one medium (such as air), or is emitted from the cover material into the air, reflection and refraction will occur at the interface. Due to the different refractive indices of the cover material and the air, part of the laser will be reflected back at the interface, resulting in laser energy loss. The role of the anti-reflection film is to coat one or more layers of thin films with a specific refractive index and thickness on the surface of the cover body so that the light reflected from the upper and lower surfaces of the film interferes with each other. When certain conditions are met, the reflected light cancels each other out, thereby reducing the intensity of the reflected light, correspondingly increasing the intensity of the transmitted light of the laser, and increasing the proportion of the laser passing through the cover body, that is, improving the transmittance.

[0092] For edge lasers, increasing the transmittance of the laser through the housing means more laser energy can be emitted, effectively increasing the laser's output power. In industrial processing applications requiring high laser power, such as laser welding and laser drilling, any increase in laser output power can significantly improve processing efficiency and quality. By applying an anti-reflection coating to the housing surface, laser energy loss at the housing is reduced, allowing more energy to be used for actual processing operations, thereby improving the efficiency of edge lasers.

[0093] Reducing laser reflection on the housing surface not only increases transmittance but also improves laser beam quality. Reflected light can generate stray light, which can interfere with the main laser beam, reducing beam stability and uniformity. Antireflection coating reduces reflected light and stray light generation, resulting in a purer and more stable output laser beam, improving the precision and effectiveness of lasers in various applications. For example, in laser cutting, stable beam quality ensures a neater, smoother cut edge.

[0094] Edge lasers may require different laser transmittance in different application scenarios. By applying an antireflection coating to the inner or outer surface of the housing (on the laser emission side), flexible selection and adjustment can be made based on specific needs. For applications requiring higher protection, an antireflection coating on the outer surface may be chosen to both improve transmittance and protect the interior of the housing. For more stringent requirements on the internal environment, an antireflection coating on the inner surface may be chosen. This flexibility allows edge lasers to better adapt to different operating conditions and application requirements.

[0095] This design works in conjunction with the other components of the edge laser package to enhance the performance of the device. The heat sink ensures heat dissipation and electrical connections for the chip, the gold wires ensure reliable circuit conduction, the housing itself provides protection, and the application of an antireflection coating further optimizes the housing's transparency to the laser. These components work together to ensure that the edge laser not only provides excellent heat dissipation, stable electrical connections, and effective protection, but also achieves higher-quality laser output, enhancing the market competitiveness and application value of edge lasers.

[0096] The design of coating the inner or outer surface of the cover with an anti-reflection film on the laser emitting side is of great significance to the performance improvement and application expansion of edge lasers from multiple aspects, such as optical principles, power enhancement, beam quality optimization, adaptation to different scenarios, and coordination with the overall packaging.

[0097] In some embodiments, Figure 5 and Figure 6 As shown, the heat sink 4 includes a substrate 5, a first pad 6, a second pad 8, a first interface 7, a second interface 9, and a filling hole 10;

[0098] The substrate 5 includes at least a first surface 41, a second surface 42, and a third surface 43; the first surface 41 and the third surface 43 are located on opposite sides of the substrate 5; the first surface 41 is perpendicular to the second surface 42; the second surface 42 and the third surface 43 are located on both sides of the first surface 41 respectively;

[0099] The first pad 6 and the second pad 8 are located on the first surface 41;

[0100] The first interface 7 and the second interface 9 are located on the second surface 42;

[0101] The base plate 5 has the filling hole 10 inside;

[0102] The via 10 contains a conductive metal 11 for connecting the first pad 6 and the first interface 7 , and the second pad 8 and the second interface 9 .

[0103] Specifically, as the basic structure of the heat sink, the substrate plays a key role in supporting and integrating other components. It has at least three surfaces. The first surface is used to support the positive second pad of the edge laser chip, providing a basis for electrical connection for the chip; the third surface is opposite to the first surface, maintaining mechanical balance in the entire heat sink structure, ensuring the stability of the heat sink under various working conditions. The second surface is perpendicular to the first surface and is distributed on both sides of the first surface with the third surface. It is provided with a positive second interface and is an important part for connecting the heat sink to the external circuit. The material of the substrate is usually selected from materials with good thermal conductivity, such as ceramics, to ensure that the heat generated by the chip can be efficiently conducted away to prevent the chip from overheating and performance degradation.

[0104] The first and second pads are located on the first surface of the substrate and are directly connected to the positive and negative electrodes of the edge laser chip. The first pad is attached to the positive electrode of the chip, and the second pad is connected to the negative electrode of the chip via gold wire. Their main function is to provide a stable current input to the chip, ensuring that the chip can operate normally and emit laser light. The electrode material is generally made of a highly conductive and chemically stable metal such as gold or silver to reduce resistance and energy loss during current transmission. It also prevents oxidation or corrosion of the electrode during long-term use, which would affect the reliability of the electrical connection.

[0105] The first and second interfaces, located on the second surface of the substrate, connect the heat sink to the external circuitry. Through these two electrodes, the heat sink draws current from an external power source and transmits it through the conductive metal within the substrate to the first and second pads, ultimately powering the edge laser chip. The first and second interfaces must be designed to exhibit excellent solderability and mechanical stability, ensuring a secure connection to the external circuitry while withstanding mechanical stress to prevent loosening or damage during device assembly and operation.

[0106] Filled vias, located within the substrate, are a key structure for achieving internal electrical connections. Filled with conductive metal, such as copper, these vias connect electrodes located on different surfaces. Specifically, the conductive metal within the vias connects the first pad to the first interface, and also connects the second pad to the second interface, thereby establishing a complete current transmission path. The design of the vias requires precise control of their diameter, depth, and position to ensure uniform filling with conductive metal, forming a stable and reliable electrical connection without compromising the overall structural strength and thermal conductivity of the substrate.

[0107] like Figure 5 and Figure 6 As shown in the figure, when the substrate is ceramic, it is difficult to make holes inside it. Usually, only a straight hole can be made, and a curved channel cannot be achieved. Therefore, simply relying on hole filling cannot achieve the connection between the first pad and the first interface, nor can it achieve the connection between the second pad and the second interface. In this case, conductive metal needs to be set outside the hole filling to achieve the above connection. The conductive metal of different hole fillings can be on the same surface or on different surfaces. Figure 5 As shown, the conductive metal connecting the first pad 6 and the first interface 7 is connected through the first surface 41 ; the conductive metal connecting the second pad 8 and the second interface 9 is also connected through the second surface 42 and the third surface 43 .

[0108] Figure 5 The heat sink in the is L-shaped. Figure 5 , Figure 6 A heat sink is added in the vertical plane between the first surface and the second surface to achieve better heat dissipation effect.

[0109] In some embodiments, there is a solder area in the center of the first pad, and the size of the solder area is larger than the edge laser chip. In the heat sink structure, the larger solder area can provide a wider contact area for the positive electrode mounting of the edge laser chip. When the positive electrode of the chip is connected to the solder area, the larger contact area means lower contact resistance. During the current transmission process, low contact resistance can effectively reduce energy loss, ensure that the current flows stably and efficiently from the first pad to the positive electrode of the chip, and ensure that the chip can emit lasers under stable electrical signal drive, avoiding problems such as unstable laser output and power fluctuations due to poor contact or excessive resistance.

[0110] Because the solder area is larger than the chip, more solder surrounds the chip's positive terminal during the soldering process. This not only increases the mechanical strength of the solder joint but also better protects against external mechanical stresses such as vibration and impact. During device operation, even when subjected to certain vibrations, the connection between the chip and the first solder pad remains secure, reducing the risk of loosening or disconnection due to mechanical stress, thereby ensuring the overall stability and reliability of the edge laser package.

[0111] Solder typically has a certain degree of thermal conductivity. Large solder areas not only achieve electrical and mechanical connections but also serve as additional heat dissipation channels. Part of the heat generated by the edge laser chip can be conducted away through the first solder pad, while the remaining portion can be transferred to the surrounding heat sink structure through the solder area. This helps further improve the heat dissipation efficiency of the heat sink, dissipating the heat generated by the chip more quickly, maintaining the chip within an appropriate operating temperature range, and preventing performance degradation or even damage due to overheating.

[0112] For edge laser package assembly, a soldering area larger than the chip facilitates operation. In actual production, workers can more easily place the chip's positive terminal accurately in the center of the soldering area for soldering, reducing assembly difficulty and errors, improving production efficiency and product yield. Furthermore, a larger soldering area provides greater flexibility for adjusting soldering process parameters, helping to optimize soldering quality and ensure that each packaged product meets high quality standards.

[0113] In some embodiments, the size of the first pad is larger than the size of the first interface. The first pad is directly connected to the positive electrode of the edge laser chip, and the larger size means that it has a larger contact area with the positive electrode of the chip. This can effectively reduce the contact resistance, so that the current can be transmitted more smoothly from the first pad to the positive electrode of the chip, reducing the energy loss during the current transmission process. The first interface is mainly used as an interface for connecting the heat sink to the external circuit. Its size is relatively small, but as long as it can meet the requirements of stable connection with the external circuit. By reasonably setting the size difference between the two, while ensuring stable connection with the external circuit, the electrical connection performance of the chip end is optimized to ensure that the chip can obtain a stable and efficient current supply, thereby emitting lasers normally.

[0114] The first pad has multiple functions such as providing electrical connection for the chip and assisting in heat dissipation. The larger size is not only conducive to electrical connection, but also increases its heat dissipation area. The edge laser chip generates a lot of heat when working. The first pad can conduct part of the heat away, and cooperate with the overall heat dissipation structure of the heat sink to better ensure that the operating temperature of the chip is within a reasonable range. In contrast, the main function of the first interface is to achieve connection with the external circuit, and its heat dissipation requirements are relatively small, so the size can be relatively small. This method of designing the electrode size according to different functional requirements can make the various parts of the heat sink play a more reasonable role and improve the overall performance of the heat sink.

[0115] During manufacturing, the first pad directly connects to the chip. Its larger size makes alignment and manipulation easier during soldering, reducing assembly complexity and improving production efficiency. The smaller size of the first interface, which connects to the external circuit, also facilitates wiring and connection within limited space, making the entire heat sink more compact. This size difference not only meets functional requirements but also takes into account ease of manufacturing and assembly, helping to reduce production costs and improve product quality and consistency.

[0116] The larger first pad provides more stable support for the chip. During edge laser operation, the chip is subject to mechanical stress. The larger first pad better distributes this stress, reducing the risk of chip displacement or damage due to mechanical stress and improving the mechanical stability of the connection between the chip and the heat sink. While the first interface is smaller, its rational design and mounting ensures a stable connection to the external circuit. The two work together to ensure the heat sink's stability, both in terms of electrical connection and mechanical structure.

[0117] The design of the first pad size being larger than the first interface size takes into account multiple factors such as electrical connection, functional requirements, manufacturing assembly, and mechanical stability. The reasonable size difference optimizes the performance of the heat sink and provides a strong guarantee for the stable operation of the edge laser.

[0118] In some embodiments, the size of the first interface is equal to the size of the second interface. The first interface and the second interface are key interfaces connecting the heat sink to the external circuit. Their equal size helps ensure that the electrical characteristics of the positive and negative electrodes are symmetrical and consistent when connected to the external circuit. In the circuit, symmetrical connection can make the current transmission between the positive and negative electrodes more balanced, reducing the uneven current distribution caused by differences in electrode size, thereby ensuring that the edge laser can obtain a stable power supply during operation and avoiding the adverse effects of current imbalance on chip performance.

[0119] When the first and second interfaces are of equal size, the same mold and processing technology can be used to produce both electrodes during the manufacturing process. This reduces the number of mold types and manufacturing complexity, lowering production costs. During assembly, since the electrodes are of the same size, operators do not need to distinguish between the size differences of the positive and negative electrodes, enabling faster and more accurate installation and connection, improving assembly efficiency while also reducing the possibility of assembly errors caused by size confusion, helping to improve product yield.

[0120] In the area where the heat sink connects to the external circuit, the equal-sized first and second interfaces facilitate wiring and layout design. Designers can more flexibly plan the routing and connection of wires. Because the two electrodes have the same size and shape, space utilization is more regular, facilitating a compact circuit layout. This regular layout not only helps improve circuit reliability but also reduces problems such as electromagnetic interference, enhancing the overall performance of the edge laser package.

[0121] In addition to electrical connection considerations, electrode size also affects mechanical performance. When the first and second interfaces are of equal size, the stress distribution on the positive and negative electrodes is more even when the heat sink is subjected to external mechanical stress. This helps prevent local stress concentration caused by differences in electrode size, thereby preventing the electrodes from loosening, deforming, or damaging under mechanical stress. This ensures the mechanical stability of the connection between the heat sink and the external circuit, extending the service life of the edge laser.

[0122] The design that the size of the first interface is equal to the size of the second interface optimizes the heat sink structure of the edge laser package in terms of electrical connection, manufacturing process, wiring layout and mechanical stability, which helps to improve the overall performance and reliability of the edge laser.

[0123] like Figure 7 As shown, this specification also provides a method for manufacturing an edge laser package, which is characterized by comprising:

[0124] Step S1: Mount one electrode of the edge laser chip to a first pad on a heat sink.

[0125] In this step, high-precision placement equipment is used to accurately place the edge laser chip on the first pad on the first surface of the heat sink. The "one pole" in this step can be either the positive or negative pole, but the following explanation uses the positive pole as an example. During this process, strict control of placement accuracy is required to ensure precise alignment between the chip's positive pole and the pad.

[0126] This step establishes the critical electrical connection between the edge laser chip and the heat sink. The heat sink's first pad provides a stable current input to the chip, enabling it to operate normally and emit laser light. Furthermore, the heat sink quickly dissipates heat generated by the chip, preventing performance degradation due to overheating. Accurate placement is crucial for subsequent gold wire connections and overall package performance, and is fundamental to achieving stable edge laser operation.

[0127] Step S2: connecting the other electrode of the edge laser chip and the second pad of the heat sink via a gold wire.

[0128] In this step, the "other pole" is a pole different from that in step S1. When the positive pole is used in step S1, the corresponding pole is used in this step. When the negative pole is used in step S1, the corresponding pole is used in this step. The negative pole will be used as an example to illustrate this step. Using ultrasonic gold wire bonding and other technologies, one end of the gold wire is bonded to the negative pole of the edge laser chip, and the other end is bonded to the second pad on the first surface of the heat sink. During the bonding process, the bonding parameters, such as temperature, pressure and ultrasonic power, must be precisely controlled to ensure a strong and low-resistance connection between the gold wire and the negative pole and pad of the chip.

[0129] This step completes the electrical connection between the negative terminal of the edge laser chip and the negative terminal of the heat sink, establishing a complete current loop. Gold wire has excellent conductivity and can stably transmit current, ensuring that the chip drives laser emission reliably when receiving electrical signals. The low-resistance connection reduces energy loss during current transmission and improves the efficiency of the edge laser.

[0130] Step S3: placing the heat sink with the edge laser chip mounted thereon in an environment filled with nitrogen (N2) or clean dry air (CDA).

[0131] In this step, the heat sink, after die attachment and gold wire bonding, is transferred to a sealed environment filled with nitrogen or clean, dry air. This environment is typically a package chamber with a gas purification and circulation system to ensure that the gas purity and dryness meet the requirements.

[0132] Nitrogen and clean, dry air both have excellent chemical stability and drying properties. Performing subsequent packaging operations in this environment effectively prevents oxidation and moisture from forming on the edge laser chip and gold wire. Oxidation and moisture can increase resistance in electrical connections, affecting current flow and even damaging the chip. This environment also reduces interference from impurities such as dust, ensuring that the performance of the chip and gold wire is unaffected by external factors, thereby improving the reliability and service life of the edge laser package.

[0133] Step S4: In the environment filled with nitrogen (N2) or clean dry air (CDA), the cover is mounted on the heat sink by SMT or thermosetting adhesive to seal the edge laser chip and the gold wire.

[0134] In this step, if SMT (surface mount technology) is used, the cover, pre-printed with solder paste on the edge of the cover or at the corresponding position on the heat sink, is accurately mounted on the heat sink through processes such as reflow soldering. If thermosetting adhesive is used, the adhesive is evenly applied to the mating surface of the cover and the heat sink, and then the cover is placed on the heat sink and heated to cure the adhesive. During the mounting process, the seal between the cover and the heat sink must be ensured to prevent any gaps.

[0135] The cover is attached to the heat sink to create a sealed space, further protecting the edge laser chip and gold wires within. The cover blocks the ingress of dust, moisture, and other impurities while maintaining internal environmental stability within a sealed nitrogen or clean, dry air environment. This sealed structure also protects the chip and gold wires from external mechanical shock, ensuring stable operation of the edge laser in a variety of environments and enhancing its protection and reliability.

[0136] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. The above description of the disclosed embodiments enables professionals and technicians in this field to implement or use the present invention. Various modifications to these embodiments will be apparent to professionals and technicians in this field, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

[0137] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art may make various variations or modifications within the scope of the claims, which do not affect the essence of the present invention.

Claims

1. An edge laser package, characterized in that: include: Edge laser chip, used for emitting laser; Gold thread; A heat sink comprising a first surface and a second surface, the second surface being perpendicular to the first surface, a first solder pad and a second solder pad being provided on the first surface, a heat sink being provided on both sides of a plane on which the first surface is located, and a first interface and a second interface being provided on the second surface, the first interface being connected to the first solder pad via conductive metal within the heat sink, and the second interface being connected to the second solder pad via conductive metal within the heat sink; One electrode of the edge laser chip is mounted on the first pad, and the other electrode of the edge laser chip is connected to the second pad via the gold wire; The cover is located above the heat sink, is sealed with the heat sink, and wraps the edge laser chip and the gold wire; the cover is at least partially transparent to allow the laser to be emitted.

2. The edge laser package according to claim 1, characterized in that: The emission direction of the laser is perpendicular to the second surface and away from the second surface.

3. The edge laser package according to claim 1, characterized in that: The heat sink is L-shaped.

4. The edge laser package according to claim 1, characterized in that: The inner and outer side walls of the cover body on the laser emitting side have the same draft angle to avoid deflection of the direction of the laser.

5. The edge laser package according to claim 1, characterized in that: The inner surface or outer surface of the cover body on the laser emitting side is coated with an anti-reflection film to improve transmittance.

6. The edge laser package according to claim 1, characterized in that: The heat sink includes a substrate, a first pad, a second pad, a first interface, a second interface, and a filling hole; The substrate comprises at least a first surface, a second surface, and a third surface; the first surface and the third surface are located on opposite sides of the substrate; the first surface is perpendicular to the second surface; the second surface and the third surface are located on both sides of the first surface respectively; The first pad and the second pad are located on the first surface; The first interface and the second interface are located on the second surface; The substrate has the filling hole inside; Conductive metal is contained in the filling hole and is used to connect the first pad and the first interface, and the second pad and the second interface.

7. The edge laser package according to claim 6, characterized in that: A solder area is defined at the center of the first pad, and a size of the solder area is larger than that of the edge laser chip.

8. The edge laser package according to claim 6, characterized in that: The size of the first pad is larger than that of the first interface.

9. The edge laser package according to claim 6, characterized in that: The size of the first interface is equal to the size of the second interface.

10. A method for manufacturing an edge laser package, characterized in that: include: Step S1: Mounting one electrode of the edge laser chip to the first pad on the heat sink; Step S2: connecting the other electrode of the edge laser chip and the second pad of the heat sink through a gold wire; Step S3: placing the heat sink with the edge laser chip mounted thereon in an environment filled with nitrogen (N2) or clean dry air (CDA); Step S4: In the environment filled with nitrogen (N2) or clean dry air (CDA), the cover is mounted on the heat sink by SMT or thermosetting adhesive to seal the edge laser chip and the gold wire.

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