Gluing device for electronic component manufacturing

Abstract

The invention discloses a gluing device for electronic component manufacturing, and relates to the technical field of electronic component manufacturing, the gluing device comprises a gluing mechanism, an auxiliary mechanism is arranged in the gluing mechanism, the auxiliary mechanism comprises a connecting block, a glue pump body and a collecting box, and a driving motor is installed at the position, close to the top, of one side of the connecting block; an annular groove is formed in the top of the top cover, an electric heating ring is arranged in the annular groove, a filter screen is mounted at a top opening of the top cover, and an air hole is formed in the top of the inner wall of the collecting box. Therefore, when glue is used for fixing the shell again in the later period, fixing is stable, and the use efficiency of the gluing device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component manufacturing, in particular to a glue coating device for electronic component manufacturing. Background Art

[0002] Electronic components are components of electronic elements and small machines and instruments. They are usually composed of several parts. They often refer to certain parts of industries such as electrical appliances, radios, and instruments. They are a general term for electronic devices such as capacitors, transistors, hairsprings, and mainsprings. When packaging and manufacturing existing electronic component chips, in order to protect the chip from damage, it is often necessary to encapsulate the integrated circuit chip in a plastic or metal shell. The chip and the shell are generally fixed together by a glue coating device.

[0003] Although the existing gluing device used in electronic component chip packaging manufacturing can use glue to fix the shell on the integrated circuit chip during actual use to protect the integrated circuit chip, it cannot process the glue lumps formed at the glue outlet of the glue tube after long-term contact with air. This causes unstable fixation when glue is used again to fix the shell later, affecting the fixing effect and reducing the efficiency of the gluing device.

[0004] Therefore, it is necessary to propose a new glue coating device for manufacturing electronic components in order to solve the problems raised above. Summary of the Invention

[0005] The purpose of the present invention is to provide a gluing device for manufacturing electronic components, so as to solve the problem that the existing gluing device cannot process the glue lumps formed at the glue outlet of the glue tube after being exposed to air for a long time, which leads to unstable fixation when the glue is used again to fix the shell later, affecting the fixing effect, and then reducing the efficiency of the gluing device.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a gluing device for manufacturing electronic components, comprising a gluing mechanism, wherein an auxiliary mechanism is provided inside the gluing mechanism; The auxiliary mechanism includes a connecting block, a glue pump body and a collecting box. A driving motor is installed on one side of the connecting block near the top. A cylindrical groove is provided on the top of the connecting block, and a funnel-shaped groove is provided at the bottom of the inner wall of the cylindrical groove. A discharge pipe is fixedly penetrated near the bottom of the other side of the connecting block. A circular groove is provided on the top of the connecting block, and an electric heating ring is provided inside the circular groove. A top cover is installed at the conveying end of the driving motor, and a filter is installed at the top opening of the top cover. A first connecting pipe is installed at the input end of the glue pump body, a circular pipe is fixedly penetrated on one side of the collecting box, and a second connecting pipe is installed at the output end of the glue pump body. An air vent is provided on the top of the inner wall of the collecting box, and a rectangular plate is installed at the outlet of the collecting box.

[0007] Preferably, the input end of the first connecting tube is connected to the output end of the discharge tube, the output end of the second connecting tube is connected to the input end of the circular tube, the bottom of the top cover is in contact with the top of the connecting block, and the input end of the discharge tube is connected to the inner wall of the funnel-shaped groove.

[0008] Preferably, the glue coating mechanism includes a double-slot box, the connecting block is fixed to the bottom of the inner wall of one of the grooves of the double-slot box, the glue pump body is installed at the bottom of the inner wall of the other groove of the double-slot box, and the collection box is fixed inside the other groove of the double-slot box. The front surface of the double-slot box is connected to a sealing plate by a hinge near the edge, and a hand screw is threaded through the front surface of the sealing plate near one side, and one end of the hand screw is threadedly connected to the front surface of the double-slot box.

[0009] Preferably, an observation hole is provided on the front surface of the sealing plate, and transparent glass is installed inside the observation hole. A mounting bracket is fixed on one side of the double-slot box near the top, and a controller is installed on the front surface of the mounting bracket. Two wire holes are provided on one side of the inner wall of one of the grooves of the double-slot box, and a slide groove is provided at the bottom of the inner wall of one of the grooves of the double-slot box, and the inner wall of the slide groove is rotatably connected to a first single-head screw rod through a first bearing.

[0010] Preferably, one end of the first single-head screw rod movably passes through one side of the inner wall of the slide groove, and a first motor is installed on one side of the double-slot box. Gears are installed on the output end of the first motor and the outer surface of the first single-head screw rod near one end, and the teeth of the two gears are engaged with each other. A guide rail is fixed to the inner wall of one of the grooves of the double-slot box, and the interior of the guide rail is slidably connected to the first slider, and the front surface of the inner wall of the guide rail is rotatably connected to the second single-head screw rod through a second bearing.

[0011] Preferably, one end of the second single-head screw rod is threaded through the surface of the first slider, and the other end of the second single-head screw rod is movably passed through the inner wall of one of the grooves of the double-slot box and extends to the inside of the other groove of the double-slot box. An electric push rod is installed at the bottom of the first slider, and a single-hole block is installed at the bottom end of the telescopic end of the electric push rod. A stabilizing frame is provided on the outer surface of the electric push rod, and the bottom of the stabilizing frame is fixed to the top of the single-hole block.

[0012] Preferably, a glue tube is installed inside the single-hole block, a delivery tube is installed at the input end of the glue tube, a hanging ring is provided on the outer surface of the delivery tube, the top of the hanging ring is fixed to the top of the inner wall of one of the grooves of the double-groove box, an annular hole is provided between the inner wall of one of the grooves of the double-groove box and the inner wall of the other groove of the double-groove box, a liquid outlet pipe is provided inside the annular hole, the output end of the liquid outlet pipe is connected to the input end of the delivery tube, and a liquid storage box is fixed inside the other groove of the double-groove box.

[0013] Preferably, a sealing cover is installed at the inlet of the liquid storage box, a dispensing pump is installed at the bottom of the inner wall of the other groove of the double-slot box, the output end of the dispensing pump is connected to the input end of the liquid outlet pipe, the input end of the dispensing pump is installed with a liquid inlet pipe, the input end of the liquid inlet pipe is connected to the glue output end of the liquid storage box, a second motor is installed on the inner wall of the other groove of the double-slot box, and the output end of the second motor is installed with an end of the second single-head screw rod close to the second motor.

[0014] Preferably, a cover plate is installed on the rear surface of the double-slot box, a processing table is provided at the bottom of the inner wall of one of the grooves of the double-slot box, a second slider is fixed to the bottom of the processing table, the second slider is slidably connected to the inside of the slide groove, and two symmetrical mounting grooves are provided on the top of the processing table, and single-head tubes are provided inside the two mounting grooves, and return springs are installed on the top of the inner walls of the two single-head tubes, and the bottom ends of the two return springs are respectively installed on the bottom of the inner walls of the two mounting grooves.

[0015] Preferably, a pressure strip is fixed on the top of the two single-head tubes, a protective shell is installed on one side of the double-slot box near the bottom, the two gears and the first motor are all inside the protective shell, and the end of the first single-head screw rod away from the protective shell is threaded through one side of the second slider, and the first motor, electric push rod, dispensing pump, second motor, drive motor, electric heating ring and glue pump body are all electrically connected to the controller.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention can automatically process the glue blocks formed after a long period of contact with air at the glue outlet of the glue tube by setting an auxiliary mechanism, thereby ensuring that the glue is stably fixed when the glue is used again to fix the shell in the future, that is, improving the efficiency of the gluing device. When it is necessary to process the glue blocks solidified at the glue tube outlet, the controller, glue dispensing pump, liquid inlet pipe, liquid outlet pipe, delivery pipe and glue tube are directly used to make a section of glue flow out of the glue tube, that is, the glue blocks are disconnected from the glue tube by their own weight and fall into the space composed of the cylindrical groove and the funnel-shaped groove.

[0017] 2. The present invention can melt the rubber block between the cylindrical groove and the funnel-shaped groove into liquid through the cooperation of the electric heating ring and the controller. Then, with the cooperation of the controller, the rubber pump body, the first connecting pipe, the discharge pipe, the second connecting pipe and the circular pipe, the melted liquid can be transported to the collection box for collection and storage.

[0018] 3. The present invention provides a glue coating mechanism, which can coat the surface of the integrated circuit chip with glue, thereby facilitating the fixing of the housing on the surface of the integrated circuit chip, that is, protecting the integrated circuit chip through the housing. When it is necessary to coat the surface of the integrated circuit chip with glue, the integrated circuit chip can be fixed on the processing table by first using the cooperation of the single-head tube, the mounting groove, the return spring and the pressure strip. Subsequently, the glue dispensing pump, the liquid inlet pipe, the liquid outlet pipe, the delivery pipe and the glue pipe can be used to coat the glue on the surface of the integrated circuit chip.

[0019] 4. The present invention can achieve coating a rectangular adhesive strip on the surface of the integrated circuit chip by utilizing the cooperation of the controller, the controller, the second motor, the first motor, the second single-head screw rod, the first single-head screw rod, the slide groove, the guide rail, the second slider, the first slider and the processing table, so as to facilitate the subsequent fixing of the shell to the integrated circuit chip with glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a three-dimensional diagram of a glue coating device for manufacturing electronic components according to the present invention; Figure 2 This is a partial perspective view of a glue coating device for manufacturing electronic components according to the present invention; Figure 3 A partial three-dimensional view from another angle of a glue coating device for manufacturing electronic components according to the present invention; Figure 4 This is a schematic diagram of the three-dimensional structure of a drive motor, a top cover and a filter screen of a glue coating device for manufacturing electronic components of the present invention; Figure 5 This is a partial three-dimensional diagram of the auxiliary mechanism of a glue coating device for electronic component manufacturing according to the present invention; Figure 6This is a partial perspective view from a side angle of a glue coating device for manufacturing electronic components of the present invention; Figure 7 The present invention is a glue coating device for manufacturing electronic components Figure 6 A magnified stereogram at center; Figure 8 This is a partial three-dimensional diagram of the gluing mechanism of a gluing device for manufacturing electronic components according to the present invention; Figure 9 This is a schematic diagram of the three-dimensional structure of a first single-head screw rod, a processing table and a second sliding block of a glue coating device for manufacturing electronic components of the present invention; Figure 10 This is a schematic diagram of the three-dimensional structure of a single-head tube, a return spring and a pressure strip of a glue coating device for manufacturing electronic components of the present invention; Figure 11 This is a partial perspective view from a rear angle of a glue coating device for manufacturing electronic components according to the present invention; Figure 12 This is a schematic diagram of the three-dimensional structure of a double-slot box, a wire hole and a slide slot of a glue coating device for manufacturing electronic components of the present invention; Figure 13 This is a schematic diagram of the three-dimensional structure of a processing table and a mounting groove of a glue coating device for manufacturing electronic components of the present invention.

[0021] In the figure: 1. Gluing mechanism; 101. Double-slot box; 102. Sealing plate; 103. Observation hole; 104. Transparent glass; 105. Thumb screw; 106. Mounting frame; 107. Controller; 108. Wire hole; 109. Slide; 110. First single-head screw rod; 111. First motor; 112. Gear; 113. Guide rail; 114. First slider; 115. Second single-head screw rod; 116. Electric push rod; 117. Single-hole block; 118. Stabilizing frame; 119. Glue tube; 120. Delivery tube; 121. Hanging ring; 122. Annular hole; 123. Liquid outlet pipe; 124. Liquid storage box; 125. Sealing cover; 126. Point Glue pump; 127, liquid inlet pipe; 128, second motor; 129, cover plate; 130, processing table; 131, second slider; 132, single-head pipe; 133, return spring; 134, pressure strip; 135, protective shell; 136, mounting groove; 2, auxiliary mechanism; 201, connecting block; 202, driving motor; 203, cylindrical groove; 204, funnel-shaped groove; 205, discharge pipe; 206, circular groove; 207, electric heating ring; 208, top cover; 209, filter screen; 210, glue pump body; 211, first connecting pipe; 212, collecting box; 213, circular pipe; 214, second connecting pipe; 215, air vent; 216, rectangular plate. DETAILED DESCRIPTION

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0023] See also Figures 1-13 As shown, the present invention provides a technical solution: a gluing device for manufacturing electronic components, comprising a gluing mechanism 1, wherein an auxiliary mechanism 2 is provided inside the gluing mechanism 1; The auxiliary mechanism 2 includes a connecting block 201, a glue pump body 210 and a collection box 212. A driving motor 202 is installed near the top of one side of the connecting block 201. A cylindrical groove 203 is opened on the top of the connecting block 201. A funnel-shaped groove 204 is opened at the bottom of the inner wall of the cylindrical groove 203. A discharge pipe 205 is fixedly passed through the other side of the connecting block 201 near the bottom. A circular groove 206 is opened on the top of the connecting block 201. The inside of the circular groove 206 is provided with a The electric heating ring 207 and the delivery end of the driving motor 202 are installed with a top cover 208, a filter screen 209 is installed at the top opening of the top cover 208, a first connecting pipe 211 is installed at the input end of the glue pump body 210, a round tube 213 is fixedly passed through one side of the collecting box 212, a second connecting pipe 214 is installed at the output end of the glue pump body 210, an air vent 215 is opened on the top of the inner wall of the collecting box 212, and a rectangular plate 216 is installed at the outlet of the collecting box 212.

[0024] according to Figure 2-Figure 5 As shown, the input end of the first connecting tube 211 is connected to the output end of the discharge tube 205, the output end of the second connecting tube 214 is connected to the input end of the circular tube 213, the bottom of the top cover 208 is in contact with the top of the connecting block 201, and the input end of the discharge tube 205 is connected to the inner wall of the funnel-shaped groove 204. Under the action of the discharge tube 205, the liquid glue between the funnel-shaped groove 204 and the cylindrical groove 203 can be diverted away.

[0025] according to Figure 1-Figure 3 、 Figure 5-Figure 7 、 Figure 11 and Figure 12As shown, the glue coating mechanism 1 includes a double-slot box 101, a connecting block 201 is fixed to the bottom of the inner wall of one of the grooves of the double-slot box 101, a glue pump body 210 is installed at the bottom of the inner wall of the other groove of the double-slot box 101, and a collecting box 212 is fixed inside the other groove of the double-slot box 101. The front surface of the double-slot box 101 is connected to a sealing plate 102 by a hinge near the edge, and a hand screw 105 is threaded through the front surface of the sealing plate 102 near one side. One end of the hand screw 105 is threadedly connected to the front surface of the double-slot box 101, so that the sealing plate 102 can be prevented from rotating under the action of the hand screw 105.

[0026] according to Figure 1-Figure 3 、 Figure 6 、 Figure 7 、 Figure 9 、 Figure 11 and Figure 12 As shown, an observation hole 103 is provided on the front surface of the sealing plate 102, and a transparent glass 104 is installed inside the observation hole 103. A mounting bracket 106 is fixed on one side of the double-slot box 101 near the top, and a controller 107 is installed on the front surface of the mounting bracket 106. Two wire holes 108 are provided on one side of the inner wall of one of the grooves of the double-slot box 101, and a slide groove 109 is provided at the bottom of the inner wall of one of the grooves of the double-slot box 101. The inner wall of the slide groove 109 is rotatably connected to the first single-head screw rod 110 through the first bearing. With the cooperation of the first single-head screw rod 110, the first motor 111, the slide groove 109 and the second slider 131, the processing table 130 can be moved back and forth horizontally.

[0027] according to Figure 1-Figure 3 、 Figure 6-Figure 9 、 Figure 11 and Figure 12 As shown, one end of the first single-headed screw rod 110 is movable through one side of the inner wall of the slide groove 109, and a first motor 111 is installed on one side of the double-slot box 101. Gears 112 are installed on the output end of the first motor 111 and the outer surface of the first single-headed screw rod 110 near one end, and the teeth of the two gears 112 are engaged with each other. A guide rail 113 is fixed to the inner wall of one of the grooves of the double-slot box 101, and the inner sliding connection of the guide rail 113 is connected to the first slider 114. The inner wall front surface of the guide rail 113 is rotatably connected to the second single-headed screw rod 115 through a second bearing, so that the first slider 114 can move back and forth horizontally with the cooperation of the second single-headed screw rod 115 and the guide rail 113.

[0028] according to Figure 1-Figure 3 、 Figure 6-Figure 8 and Figure 12As shown, one end of the second single-head screw rod 115 is threaded through the surface of the first slider 114, and the other end of the second single-head screw rod 115 is movable through the inner wall of one of the grooves of the double-slot box 101 and extends to the inside of the other groove of the double-slot box 101. An electric push rod 116 is installed at the bottom of the first slider 114, and a single-hole block 117 is installed at the bottom end of the telescopic end of the electric push rod 116. A stabilizing frame 118 is provided on the outer surface of the electric push rod 116, and the bottom of the stabilizing frame 118 is fixed to the top of the single-hole block 117. Under the action of the stabilizing frame 118, the electric push rod 116 can drive the glue tube 119 to perform a stable movement operation through the single-hole block 117.

[0029] according to Figure 1-Figure 3 、 Figure 6-Figure 8 、 Figure 11 and Figure 12 As shown, a glue tube 119 is installed inside the single-hole block 117, and a delivery tube 120 is installed at the input end of the glue tube 119. A hanging ring 121 is provided on the outer surface of the delivery tube 120. The top of the hanging ring 121 is fixed to the top of the inner wall of one of the grooves of the double-slot box 101. An annular hole 122 is provided between the inner wall of one of the grooves of the double-slot box 101 and the inner wall of the other groove of the double-slot box 101. A liquid outlet pipe 123 is provided inside the annular hole 122. The output end of the liquid outlet pipe 123 is connected to the input end of the delivery tube 120. A liquid storage box 124 is fixed inside the other groove of the double-slot box 101, which can provide glue supply for the glue tube 119 with the cooperation of the liquid storage box 124 and the sealing cover 125.

[0030] according to Figure 1-Figure 3 、 Figure 6-Figure 8 、 Figure 11 and Figure 12 As shown, a sealing cover 125 is installed at the inlet of the liquid storage box 124, and a dispensing glue pump 126 is installed at the bottom of the inner wall of another groove of the double-slot box 101. The output end of the dispensing glue pump 126 is connected to the input end of the liquid outlet pipe 123, and the input end of the dispensing glue pump 126 is installed with a liquid inlet pipe 127. The input end of the liquid inlet pipe 127 is connected to the glue output end of the liquid storage box 124. A second motor 128 is installed on the inner wall of another groove of the double-slot box 101, and the output end of the second motor 128 is installed with the end of the second single-head screw rod 115 close to the second motor 128, so that the electric push rod 116 can be driven to move back and forth horizontally with the cooperation of the second motor 128, the second single-head screw rod 115, the guide rail 113 and the first slider 114.

[0031] according to Figure 1-Figure 3 、 Figure 6 、 Figure 7 、 Figure 9 and Figure 10-13As shown, a cover plate 129 is installed on the rear surface of the double-slot box 101, and a processing table 130 is provided at the bottom of the inner wall of one of the grooves of the double-slot box 101. A second slider 131 is fixed to the bottom of the processing table 130, and the second slider 131 is slidably connected to the inside of the slide groove 109. Two symmetrical mounting grooves 136 are provided on the top of the processing table 130, and single-headed tubes 132 are provided inside the two mounting grooves 136. Return springs 133 are installed on the top of the inner walls of the two single-headed tubes 132, and the bottom ends of the two return springs 133 are respectively installed on the bottom of the inner walls of the two mounting grooves 136, so that the integrated circuit chip that needs to be packaged in the shell can be fixed on the processing table 130 with the cooperation of the return springs 133, the single-headed tubes 132, the mounting grooves 136 and the pressure strips 134.

[0032] according to Figures 1-8 and Figure 10-12 As shown, a pressure strip 134 is fixed to the top of the two single-head tubes 132, and a protective shell 135 is installed on one side of the double-slot box 101 near the bottom. The two gears 112 and the first motor 111 are all inside the protective shell 135. The end of the first single-head screw rod 110 away from the protective shell 135 is threaded through one side of the second slider 131. The first motor 111, the electric push rod 116, the dispensing pump 126, the second motor 128, the drive motor 202, the electric heating ring 207 and the glue pump body 210 are all electrically connected to the controller 107, so that under the action of the controller 107, it is convenient to control whether the components electrically connected to the controller 107 are opened and closed.

[0033] The effect achieved by the entire mechanism is: when it is necessary to carry out electronic component chip packaging and manufacturing, first loosen the hand screw 105, let one end of the hand screw 105 move out of the thread on the front surface of the double-slot box 101, then rotate the sealing plate 102, then connect the controller 107 to the external power supply, then remove the cover plate 129, then remove the sealing cover 125, then quickly inject a proper amount of glue into the interior of the liquid storage box 124, then promptly install the sealing cover 125 back to the initial position, then install the cover plate 129 back to the initial position, finally turn on the controller 107, set the use program, and at the same time, fix the integrated circuit chip that needs to be glued by using the reset spring 133, the single-head tube 132, the pressure strip 134 and the installation slot 136. At the top of the processing table 130, when everything is ready, the sealing plate 102 is first reset and fixed by hand with the screws 105, and then the second motor 128 is directly started by the control. The started second motor 128 will directly drive the second single-head screw rod 115 connected thereto to rotate, and the rotating second single-head screw rod 115 will directly drive the first slider 114 to move with the cooperation of the guide rail 113. At this time, the moving first slider 114 will directly drive the glue tube 119 to move through the cooperation of the electric push rod 116 and the single-hole block 117. When it is observed through the transparent glass 104 that the glue tube 119 reaches the top gluing position of the integrated circuit chip, the controller 107 will directly pause the second motor 128 and then control The controller 107 will directly start the electric push rod 116. At this time, the started electric push rod 116 will directly drive the glue tube 119 to move downward under the cooperation of the stabilizing frame 118 and the single hole block 117. When the output end of the glue tube 119 is about to touch the top of the integrated circuit wire sheet, the controller 107 will directly turn off the electric push rod 116. Then the controller 107 will directly start the dispensing pump 126. At this time, the started dispensing pump 126 will directly extract the glue in the liquid storage box 124 under the cooperation of the liquid inlet pipe 127, the liquid outlet pipe 123 and the delivery pipe 120, and then introduce it into the interior of the glue tube 119, and then output it from the output end of the glue tube 119 and pour it on the integrated circuit chip. When the glue reaches the integrated circuit chip, the controller 107 will The second motor 128 is started again. The second motor 128 started at this time will drive the glue tube 119 to move again. When the glue tube 119 moves, a line of glue can be applied to the integrated circuit chip. When the first slider 114 moves to a point where it cannot move, the controller 107 will directly turn off the second motor 128. Then the controller 107 will directly start the first motor 111. The first motor 111 started at this time will directly drive the second slider 131 to move under the cooperation of the two gears 112, the slide 109 and the first single-head screw rod 110. When the second slider 131 moves, the moving second slider 131 will directly cooperate with the processing table 130, the single-head tube 132, the pressure strip 134, the return spring 133 and the mounting groove 136.Directly drive the fixed integrated circuit chip to move, and continue to apply glue to the surface of the integrated circuit chip. When the processing table 130 moves to a point where it cannot move, the controller 107 will directly turn off the first motor 111, and then the controller 107 will start the second motor 128 again and reverse it, so that the glue tube 119 continues to apply glue to the surface of the integrated circuit chip. When the first slider 114 is reset to the initial position, the controller 107 will directly turn off the second motor 128, and then the controller 107 will control the first motor 111 to start and reverse it again, so that the glue tube 119 continues to apply glue to the surface of the integrated circuit chip. When the processing table 130 moves back to the initial position, the controller 107 will directly turn off the second motor 128. The first motor 111 then controls the electric push rod 116 to start, allowing the glue tube 119 to reset to the initial position. When the glue tube 119 is reset to the initial position, the controller 107 will directly close the electric push rod 116. At this time, the surface of the integrated circuit chip is also just coated with a rectangular adhesive strip. At this time, the shell is placed on the rectangular adhesive strip on the surface of the integrated circuit chip using a tool to fix the shell on the surface of the integrated circuit chip, thereby protecting the integrated circuit chip with the shell. The packaged integrated circuit chip can then be removed from between the two pressure strips 134. When there is glue remaining at the output end of the glue tube 119, it will take a long time before the next integrated circuit chip shell packaging is performed. At this time, the controller 107 is directly used to start the glue dispensing pump 126, so that the output end of the glue tube 119 is poured a little, and then the glue dispensing pump 126 is controlled to be closed, so that the glue block that has become a solidified state after being exposed to the air for a long time can be separated from the semi-solid glue by weight, and fall into the inside of the cylindrical groove 203, and then fall into the inside of the funnel-shaped groove 204 for collection and storage, and then the integrated circuit chip shell packaging operation can be performed again. When more glue blocks are collected in the space formed by the funnel-shaped groove 204 and the cylindrical groove 203, the controller 107 is directly used to control the electric heating ring 207 and the drive motor 202 to start. At this time, the started drive motor 202 will directly drive the top cover 208 connected thereto to rotate The rotating top cover 208 will directly drive the filter screen 209 to rotate. When the top cover 208 rotates to the top of the connecting block 201, the controller 107 will directly turn off the drive motor 202, and the started electric heating ring 207 will directly heat the glue block inside the above space. When the glue block inside the above space is completely melted into liquid, the controller 107 will directly turn off the electric heating ring 207, and then start the glue pump body 210. At this time, the started glue pump body 210 will directly pump away the melted liquid glue with the cooperation of the first connecting pipe 211, the discharge pipe 205, the circular pipe 213 and the second connecting pipe 214, and transport it to the space composed of the collection box 212 and the rectangular plate 216.When the liquid glue is in the space formed by the collection box 212 and the rectangular plate 216 and cools naturally, the liquid glue will directly cool and become solid, and the gas transported will be directly discharged from the air vents 215 and finally discharged from the heat dissipation holes on the cover plate 129. At the same time, during the heating and melting process of the glue block, the glue block will also emit harmful gases. The harmful gases generated at this time will directly pass through the filter 209 and then float into one of the grooves of the double-slot box 101, and then spread into the environment. The harmful gases in the gas that passes through the filter 209 will be directly adsorbed and removed. When it is necessary to remove the cooled large glue block from the interior of the collection box 212, the cover plate 129 is directly removed first, and then the rectangular plate 216 is removed to remove the large glue block inside the collection box 212.

[0034] Among them, the first motor 111, the electric push rod 116, the dispensing pump 126, the second motor 128, the drive motor 202, the electric heating ring 207, the glue pump body 210 and the controller 107 (PLC controller) are all existing technologies and will not be explained in detail here.

[0035] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A glue coating device for manufacturing electronic components, characterized by: It comprises a gluing mechanism (1), wherein an auxiliary mechanism (2) is provided inside the gluing mechanism (1); The auxiliary mechanism (2) comprises a connecting block (201), a glue pump body (210) and a collecting box (212); a driving motor (202) is installed near the top of one side of the connecting block (201); a cylindrical groove (203) is provided on the top of the connecting block (201); a funnel-shaped groove (204) is provided at the bottom of the inner wall of the cylindrical groove (203); a discharge pipe (205) is fixedly passed through the other side of the connecting block (201) near the bottom; a circular groove (206) is provided on the top of the connecting block (201); a An electric heating ring (207) is provided. A top cover (208) is installed at the delivery end of the driving motor (202). A filter screen (209) is installed at the top opening of the top cover (208). A first connecting pipe (211) is installed at the input end of the glue pump body (210). A round pipe (213) is fixedly passed through one side of the collecting box (212). A second connecting pipe (214) is installed at the output end of the glue pump body (210). An air vent (215) is provided at the top of the inner wall of the collecting box (212). A rectangular plate (216) is installed at the outlet of the collecting box (212).

2. The adhesive coating device for manufacturing electronic components according to claim 1, characterized in that: The input end of the first connecting tube (211) is connected to the output end of the discharge tube (205), the output end of the second connecting tube (214) is connected to the input end of the circular tube (213), the bottom of the top cover (208) is in contact with the top of the connecting block (201), and the input end of the discharge tube (205) is connected to the inner wall of the funnel-shaped groove (204).

3. The adhesive coating device for manufacturing electronic components according to claim 1, characterized in that: The glue coating mechanism (1) includes a double-slot box (101), the connecting block (201) is fixed to the bottom of the inner wall of one of the grooves of the double-slot box (101), the glue pump body (210) is installed at the bottom of the inner wall of the other groove of the double-slot box (101), and the collecting box (212) is fixed inside the other groove of the double-slot box (101). The front surface of the double-slot box (101) is connected to a sealing plate (102) by a hinge near the edge, and a hand screw (105) is threaded through the front surface of the sealing plate (102) near one side, and one end of the hand screw (105) is threadedly connected to the front surface of the double-slot box (101).

4. The adhesive coating device for manufacturing electronic components according to claim 3, characterized in that: An observation hole (103) is provided on the front surface of the sealing plate (102), and a transparent glass (104) is installed inside the observation hole (103). A mounting bracket (106) is fixed on one side of the double-slot box (101) near the top, and a controller (107) is installed on the front surface of the mounting bracket (106). Two wire holes (108) are provided on one side of the inner wall of one of the grooves of the double-slot box (101), and a slide groove (109) is provided at the bottom of the inner wall of one of the grooves of the double-slot box (101), and the inner wall of the slide groove (109) is rotatably connected to a first single-head screw rod (110) through a first bearing.

5. The adhesive coating device for manufacturing electronic components according to claim 4, characterized in that: One end of the first single-head screw rod (110) is movable through one side of the inner wall of the slide groove (109), and a first motor (111) is installed on one side of the double-slot box (101). A gear (112) is installed at the output end of the first motor (111) and the outer surface of the first single-head screw rod (110) near one end, and the teeth of the two gears (112) are engaged with each other. A guide rail (113) is fixed to the inner wall of one of the grooves of the double-slot box (101), and the interior of the guide rail (113) is slidably connected to a first slider (114), and the inner wall front surface of the guide rail (113) is rotatably connected to a second single-head screw rod (115) through a second bearing.

6. The adhesive coating device for manufacturing electronic components according to claim 5, characterized in that: One end of the second single-head screw rod (115) is threadedly inserted into the surface of the first slider (114), and the other end of the second single-head screw rod (115) is movable through the inner wall of one of the grooves of the double-slot box (101) and extends to the inside of the other groove of the double-slot box (101). An electric push rod (116) is installed at the bottom of the first slider (114), and a single-hole block (117) is installed at the bottom of the telescopic end of the electric push rod (116). A stabilizing frame (118) is provided on the outer surface of the electric push rod (116), and the bottom of the stabilizing frame (118) is fixed to the top of the single-hole block (117).

7. The adhesive coating device for manufacturing electronic components according to claim 6, characterized in that: A glue tube (119) is installed inside the single-hole block (117), and a delivery tube (120) is installed at the input end of the glue tube (119). A hanging ring (121) is provided on the outer surface of the delivery tube (120), and the top of the hanging ring (121) is fixed to the top of the inner wall of one of the grooves of the double-grooved box (101). An annular hole (122) is provided between the inner wall of one of the grooves of the double-grooved box (101) and the inner wall of the other groove of the double-grooved box (101). A liquid outlet tube (123) is provided inside the annular hole (122), and the output end of the liquid outlet tube (123) is connected to the input end of the delivery tube (120). A liquid storage box (124) is fixed inside the other groove of the double-grooved box (101).

8. The adhesive coating device for manufacturing electronic components according to claim 7, characterized in that: A sealing cover (125) is installed at the inlet of the liquid storage box (124), a dispensing pump (126) is installed at the bottom of the inner wall of the other groove of the double-slot box (101), the output end of the dispensing pump (126) is connected to the input end of the liquid outlet pipe (123), the input end of the dispensing pump (126) is installed with a liquid inlet pipe (127), the input end of the liquid inlet pipe (127) is connected to the glue output end of the liquid storage box (124), and a second motor (128) is installed on the inner wall of the other groove of the double-slot box (101), and the output end of the second motor (128) is installed with one end of the second single-head screw rod (115) close to the second motor (128).

9. The adhesive coating device for manufacturing electronic components according to claim 8, characterized in that: A cover plate (129) is installed on the rear surface of the double-slot box (101), a processing table (130) is provided at the bottom of the inner wall of one of the grooves of the double-slot box (101), a second slider (131) is fixed to the bottom of the processing table (130), the second slider (131) is slidably connected to the inside of the slide groove (109), two symmetrical mounting grooves (136) are opened on the top of the processing table (130), a single-head tube (132) is provided inside the two mounting grooves (136), and a return spring (133) is installed on the top of the inner wall of the two single-head tubes (132), and the bottom ends of the two return springs (133) are respectively installed on the bottom of the inner wall of the two mounting grooves (136).

10. The adhesive coating device for manufacturing electronic components according to claim 9, characterized in that: A pressure strip (134) is fixed on the top of each of the two single-head tubes (132), a protective shell (135) is installed on one side of the double-slot box (101) near the bottom, the two gears (112) and the first motor (111) are both inside the protective shell (135), and the end of the first single-head screw rod (110) away from the protective shell (135) is threadedly passed through one side of the second slider (131), and the first motor (111), the electric push rod (116), the dispensing pump (126), the second motor (128), the drive motor (202), the electric heating ring (207) and the glue pump body (210) are all electrically connected to the controller (107).

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