Wafer feeding and discharging alignment equipment

Abstract

The invention discloses wafer feeding and discharging alignment equipment which comprises a feeding device, a wafer robot, a wafer alignment platform and a clamp containing device. The feeding device is used for accommodating wafers; the wafer robot is used for obtaining wafers from the feeding device and conveying the wafers to the wafer alignment platform. The clamp accommodating device is provided with an accommodating groove; the wafer alignment platform is used for placing a wafer in the wafer aging test fixture in an alignment manner and locking the wafer aging test fixture; and the wafer alignment platform is also used for pushing the locked wafer aging test fixture into the accommodating groove of the fixture accommodating device. According to the invention, the wafer can be automatically conveyed, aligned and placed in the wafer aging test fixture, and locked and pushed out of the wafer aging test fixture, manual participation is not needed in the whole process, the efficiency is remarkably improved, and the accuracy and efficiency of placing the wafer in the wafer aging test fixture can be improved to the maximum extent by optimizing the wafer alignment platform.

Description

Technical Field

[0001] The invention relates to wafer loading and unloading alignment equipment. Background Art

[0002] SiC (silicon carbide), a representative of third-generation wide-bandgap semiconductor materials, boasts high critical breakdown field strength, high thermal conductivity, high electron saturation drift velocity, a wide bandgap, and strong radiation resistance. It is widely used in the new energy sector. However, SiC wafers using SiC are generally subject to low yields due to current manufacturing processes. Screening through electrical performance testing using traditional wafer test probes alone is ineffective in identifying premature failures in the device itself. SiC wafers must undergo high-temperature and electrical stress aging before they can be effectively rejected. Consequently, they are often mounted in a wafer aging fixture for aging testing.

[0003] However, before the aging test, the operator needs to transport each wafer to the semi-automatic alignment platform, and manually adjust the alignment on the semi-automatic alignment platform to place the wafer into the wafer aging test fixture, and then perform the wafer aging test fixture locking operation. Since manual continuous adjustment of the alignment is time-consuming and the locking operation of the wafer aging test fixture is cumbersome, when a large number of wafers need to be tested for aging in wafer mass production, the labor intensity of the operators is high and the efficiency is low, which cannot meet the high requirements of the industry. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of the present invention is to provide a wafer loading and unloading alignment device, which can realize the transportation of wafers, the alignment of wafers in wafer aging test fixtures, the locking of wafer aging test fixtures, and the pushing out of wafer aging test fixtures, thereby greatly reducing the labor intensity of operators and significantly improving efficiency.

[0005] The purpose of the present invention is achieved by the following technical solutions:

[0006] A wafer loading and unloading alignment device, comprising a loading device, a wafer robot, a wafer alignment platform and a fixture accommodating device;

[0007] The loading device is used to accommodate wafers;

[0008] The wafer robot is used to obtain the wafer from the loading device and to transport the wafer to the wafer alignment platform;

[0009] The clamp accommodating device is provided with an accommodating groove;

[0010] The wafer alignment platform is used to align the wafer and place it in the wafer aging test fixture, and to lock the wafer aging test fixture; the wafer alignment platform is also used to push the locked wafer aging test fixture into the accommodating groove of the fixture accommodating device.

[0011] The wafer loading and unloading alignment equipment also includes an edge finder, and the wafer robot is also used to transport the wafer to the edge finder; the edge finder is used to pre-position the wafer; and the wafer robot is used to transport the pre-positioned wafer to the wafer alignment platform.

[0012] The wafer aging test fixture includes an upper needle holder and a lower chuck; the wafer alignment platform is provided with a first station and a second station; the wafer robot is used to transport the wafer to the first station of the wafer alignment platform; the wafer alignment platform includes a suction cup device, a wafer visual positioning system, a wafer transport device, a coupling device and a locking device;

[0013] The wafer transport device includes a transfer mechanism and a rotating device; the transfer mechanism is used to drive the rotating device to move and make the rotating device pass through the first station and the second station; the rotating device is used to carry the lower chuck and drive the lower chuck to rotate; the lower chuck is used to place the wafer;

[0014] The wafer visual positioning system is used to obtain the position information of the wafer on the lower chuck and to control the operation of the rotating device;

[0015] The suction cup device is located at the first station and is used to extract the wafer from the wafer robot; the suction cup device is also used to move the wafer to the lower chuck and is suitable for extracting the wafer from the lower chuck;

[0016] The coupling device is located at the second station, and the coupling device includes a positioning carrier device and a carrier lifting device; the carrier lifting device is used to drive the positioning carrier device to rise and fall; the positioning carrier device is used to carry the upper needle holder;

[0017] The locking device is used to lock the lower chuck on the upper needle chuck.

[0018] The wafer alignment platform also includes a fixture pushing device; the fixture pushing device is used to push the locked fixture from the positioning carrier device to the accommodating groove of the fixture accommodating device.

[0019] The upper needle holder is provided with a fastening screw, and the lower chuck is provided with a threaded portion. The locking device is used to thread the fastening screw into the threaded portion of the lower chuck, and the locking device includes a screw locking device and a first Z-axis linear module; the first Z-axis linear module is used to drive the screw locking device to rise and fall; the screw locking device is used to drive the fastening screw to rotate.

[0020] The locking device also includes a first X-axis linear module and a first Y-axis linear module; the first Y-axis linear module is connected to the first X-axis linear module, and drives the first Y-axis linear module to translate along a first direction through the first X-axis linear module; the first Z-axis linear module is connected to the first Y-axis linear module, and drives the first Z-axis linear module to translate along a second direction through the first Y-axis linear module; the second direction is perpendicular to the first direction and the lifting direction of the screw locking device.

[0021] The positioning carrier device includes a lifting carrier and a pressing device; the carrier lifting device is used to drive the lifting carrier to move up and down; the pressing device is installed on the lifting carrier and is used to press the upper needle holder against the lifting carrier.

[0022] A first matching portion is provided on the side of the upper needle holder; the positioning carrier device also includes a lateral positioning device; the lateral positioning device is installed on the lifting carrier and is used to be inserted and matched with the first matching portion of the upper needle holder to position the upper needle holder.

[0023] The wafer visual positioning system includes a wafer shooting device; the wafer shooting device is used to shoot images of the lower chuck and the wafer thereon; the wafer visual positioning system is used to obtain the position information of the wafer on the lower chuck based on the image shot by the wafer shooting device; the wafer visual positioning system is also used to compare the position information of the wafer on the lower chuck with the reference position information stored in the wafer visual positioning system, and control the operation of the rotating device according to the comparison result.

[0024] The feeding device includes a material box, a positioning seat, a mounting platform and a protective cover; the positioning seat is used for detachable installation of the material box; the mounting platform is provided with an open end facing the material box; the protective cover is hinged on the mounting platform and is used to close the open end; a nitrogen spring is connected between the protective cover and the mounting platform.

[0025] Compared with the existing technology, the beneficial effect of the present invention is that the present invention provides a wafer loading and unloading alignment equipment, which can realize the transportation of wafers, the alignment placement of wafers in wafer aging test fixtures, the locking of wafer aging test fixtures, and the pushing out of wafer aging test fixtures by adopting a combination of loading devices, wafer robots, wafer alignment platforms and fixture accommodating devices, thereby greatly reducing the participation of operators, reducing the labor intensity of operators, and significantly improving efficiency. Moreover, by optimizing the wafer alignment platform, the accuracy and efficiency of wafer placement in the wafer aging test fixture can be improved, the operation is stable and reliable, and it is suitable for large-scale production. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the structure of the wafer loading and unloading alignment equipment of the present invention;

[0027] Figure 2 A top view of the wafer loading and unloading alignment device of the present invention (with the upper protective cover removed);

[0028] Figure 3 A schematic diagram of the wafer loading and unloading alignment device of the present invention from another direction (with the upper protective cover removed);

[0029] Figure 4 It is a structural diagram of the feeding device;

[0030] FIG5 is a schematic structural diagram of a wafer alignment platform;

[0031] FIG6 is a schematic diagram of the wafer alignment platform from another direction, omitting the marble platform and screw locking device;

[0032] FIG7 is a schematic diagram of a screw locking device and a coupling device;

[0033] FIG8 is a schematic structural diagram of the clamp pushing device;

[0034] FIG9 is a schematic diagram of the clamp pushing device in another direction;

[0035] Figure 10 is a schematic structural diagram of the coupling device;

[0036] FIG11 is a schematic diagram of the coupling device in another direction;

[0037] FIG12 is a schematic structural diagram of a wafer transport device;

[0038] Figure 13 is a schematic structural diagram of the locking device;

[0039] Figure 14 is a schematic structural diagram of the suction cup device;

[0040] FIG15 is a cross-sectional view of a wafer aging test fixture;

[0041] Figure 16 is an exploded view of the wafer aging test fixture;

[0042] FIG17 is a schematic structural diagram of a clamp accommodating device;

[0043] Figure 18 It is a structural diagram of the material frame lifting device;

[0044] Among them, 10, rack platform; 20, upper cover; 30, loading device; 31, installation platform; 32, protective cover; 33, hinge; 35, positioning seat; 37, nitrogen spring; 38, hydraulic buffer; 39, material box; 40, wafer robot; 50, edge finder; 60, alignment platform; 61, marble platform; 62, wafer transport device; 621, second linear motor; 622, first linear motor; 623, rotating device; 63, chuck carrier; 64, lock Tightening device; 641, first Y-axis linear module; 642, first X-axis linear module; 643, first Z-axis linear module; 644, screw locking device; 65, fixture pushing device; 652, hook plate lifting device; 653, fixture hook plate; 654, QR code reader; 66, coupling device; 661, carrier frame lifting device; 662, guide rail; 663, lifting carrier frame; 664, horizontal guide wheel group; 665, lateral guide wheel group; 666, limit Positioning plate; 667, lateral positioning device; 668, top pressure device; 67, suction cup device; 671, second Z-axis linear module; 672, suction cup mounting plate; 673, vacuum suction cup; 68, upper camera; 69, lower camera; 70, material frame lifting device; 71, mounting base plate; 72, linear guide; 73, ball screw; 74, screw drive device; 75, first synchronous pulley; 76, synchronous belt; 77, second synchronous pulley; 78, lifting platform; 79, screw Nut; 80, turnover fixture material frame; 81, accommodating groove; 90, carrying assembly; 91, hook plate drive motor; 92, transmission shaft; 93, transmission unit; 94, first driving wheel; 95, first driven wheel; 96, first transmission belt; 97, carrying plate; 98, power output device; 99, support frame device; 100, second driving wheel; 101, second driven wheel; 102, second transmission belt; 110, upper needle holder; 120, lower chuck; 131, threaded portion; 144, fastening screw; 150, wafer visual positioning system; 161, screwdriver; 162, rotation drive component; 171, first side portion; 172, second side portion; 173, penetration groove; 180, fixture accommodating device; 190, wafer aging test fixture. DETAILED DESCRIPTION

[0045] The present invention will be further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0046] like Figure 1-18 As shown, a wafer loading and unloading alignment device includes a loading device 30, a wafer robot 40, a wafer alignment platform 60 and a fixture receiving device 180;

[0047] The loading device 30 is used to accommodate wafers;

[0048] The wafer robot 40 is used to obtain the wafer from the loading device 30 and to transport the wafer to the wafer alignment platform 60;

[0049] The clamp receiving device 180 is provided with a receiving groove 81;

[0050] The wafer alignment platform 60 is used to align the wafer and place it in the wafer aging test fixture 190, and to lock the wafer aging test fixture 190; the wafer alignment platform 60 is also used to push the locked wafer aging test fixture 190 into the accommodating groove 81 of the fixture accommodating device 180.

[0051] During use, the wafer robot 40 obtains the wafer from the loading device 30 and transports the wafer to the wafer alignment platform 60 through the wafer robot 40. The wafer alignment platform 60 aligns the wafer and places it in the wafer aging test fixture 190, locks the wafer aging test fixture 190, and then pushes the locked wafer aging test fixture 190 into the accommodating slot 81 of the fixture accommodating device 180 for use in subsequent aging test links. Therefore, the present invention provides a wafer loading and unloading alignment device, which can realize the transportation of wafers, the alignment placement of wafers in the wafer aging test fixture 190, the locking of the wafer aging test fixture 190, and the pushing out of the wafer aging test fixture 190 by adopting the combination of the loading device 30, the wafer robot 40, the wafer alignment platform 60 and the fixture accommodating device 180, thereby minimizing the participation of operators, reducing the labor intensity of operators, and significantly improving efficiency.

[0052] The wafer loading and unloading alignment equipment also includes an edge finder 50. The wafer robot 40 is used to transport wafers to the edge finder 50; the edge finder 50 is used to pre-position the wafers; and the wafer robot 40 is used to transport the pre-positioned wafers to the wafer alignment platform 60. During use, the wafer robot 40 retrieves the wafers from the loading device 30, then transports the wafers to the edge finder 50. The edge finder 50 then pre-positions the wafers. The wafer robot 40 then removes the pre-positioned wafers from the edge finder 50 and transports the pre-positioned wafers to the wafer alignment platform 60. By adopting this structure, the edge finder 50 can pre-position the wafers, facilitating the subsequent alignment and placement of the wafers by the wafer alignment platform 60 within the wafer burn-in test fixture 190.

[0053] The edge finder 50 is used to pre-position the wafer in the horizontal direction. The edge finder 50 of the wafer loading and unloading alignment device can be any edge finder currently available on the market, as long as it can be used to pre-position the wafer.

[0054] The wafer aging test fixture 190 includes an upper needle holder 110 and a lower chuck 120; the wafer alignment platform 60 is provided with a first station and a second station; the wafer robot 40 is used to transport the wafer to the first station of the wafer alignment platform 60; the wafer alignment platform 60 includes a suction cup device 67, a wafer visual positioning system 150, a wafer transport device 62, a coupling device 66, and a locking device 64;

[0055] The wafer transport device 62 includes a transfer mechanism and a rotating device 623; the transfer mechanism is used to drive the rotating device 623 to move and allow the rotating device 623 to pass through the first station and the second station; the rotating device 623 is used to carry the lower chuck 120 and drive the lower chuck 120 to rotate; the lower chuck 120 is used to place the wafer;

[0056] The wafer visual positioning system 150 is used to obtain the position information of the wafer on the lower chuck 120 and to control the operation of the rotating device 623;

[0057] The suction cup device 67 is located at the first station and is used to extract the wafer from the wafer robot 40; the suction cup device 67 is also used to move the wafer to the lower chuck 120 and is suitable for extracting the wafer from the lower chuck 120;

[0058] The coupling device 66 is located at the second station, and the coupling device 66 includes a positioning carrier device and a carrier lifting device 661; the carrier lifting device 661 is used to drive the positioning carrier device to rise and fall; the positioning carrier device is used to carry the upper needle holder 110;

[0059] The locking device 64 is used to lock the lower chuck 120 on the upper needle holder 110 .

[0060] When in use, after the wafer robot 40 transports the wafer to the first workstation of the wafer alignment platform 60, the suction cup device 67 extracts the wafer from the wafer robot 40, and the transfer mechanism drives the rotating device 623 to move and moves the rotating device 623 to the first workstation, and the suction cup device 67 moves the wafer to the lower chuck 120. With the help of the wafer vision positioning system 150, the position information of the wafer on the lower chuck 120 can be obtained, and the rotating device 623 can be controlled to work. Therefore, when the position information of the wafer on the lower chuck 120 does not meet the requirements, the suction cup device 67 can extract the wafer from the lower chuck 120, and the rotating device 623 is controlled by the wafer vision positioning system 150 to work so that the rotating device 623 drives the lower chuck 120 to rotate. After the lower chuck 120 rotates, the wafer is moved to the lower chuck 120 by the suction cup device 67. In this way, the alignment of the wafer and the lower chuck 120 can be dynamically adjusted to ensure alignment accuracy. The transfer mechanism drives the rotating device 623 to move and moves the rotating device 623 to the second workstation, and the carrier lifting device 661 of the coupling device 66 drives the positioning carrier device to descend to the upper needle holder 110 and cooperate with the lower chuck 120, and then the lower chuck 120 is locked on the upper needle holder 110 through the locking device 64. At this time, the lower chuck 120 and the upper needle holder 110 are locked together to form a wafer aging test fixture 190 in a locked state. Therefore, the wafer can be placed in the wafer aging test fixture 190 and the wafer aging test fixture 190 can be locked by the above method. Therefore, by adopting the combination of the suction cup device 67, the wafer vision positioning system 150, the wafer conveying device 62, the coupling device 66, and the locking device 64 on the wafer alignment platform 60, by using the suction cup device 67, the wafer vision positioning system 150, the wafer conveying device 62, the coupling device 66, and the locking device 64, The positioning system 150 and the wafer transport device 62 can dynamically adjust the alignment of the wafer and the lower chuck 120 to ensure the alignment accuracy, which helps to quickly and accurately align the wafer and place it in the lower chuck 120. Through the cooperation of the wafer transport device 62, the coupling device 66, and the locking device 64, the lower chuck 120 with the wafer placed thereon and the upper needle holder 110 can be coordinated, and the locking device 64 is used to lock the lower chuck 120 on the upper needle holder 110. Therefore, the automatic transfer of the wafer, the alignment of the wafer and the lower chuck 120, and the automatic locking of the wafer aging test fixture 190 composed of the lower chuck 120 and the upper needle holder 110 can be achieved, thereby eliminating the need for operators to carry wafers and constantly adjust the alignment, reducing manual participation, reducing the labor intensity of operators, saving time, improving efficiency, and ensuring stable and reliable operation.

[0061] The wafer alignment platform 60 also includes a fixture pushing device 65, which is used to push the upper needle holder 110 locked with the lower chuck 120 (that is, the locked wafer aging test fixture 190) from the positioning carrier device to the accommodating groove 81 of the fixture accommodating device 180.

[0062] The upper needle holder 110 is provided with a fastening screw 144, and the lower chuck 120 is provided with a threaded portion 131. The locking device 64 is used to thread the fastening screw 144 onto the threaded portion 131 of the lower chuck 120, and the locking device 64 includes a screw locking device 644 and a first Z-axis linear module 643; the first Z-axis linear module 643 is used to drive the screw locking device 644 to rise and fall; the screw locking device 644 is used to drive the fastening screw 144 to rotate. During use, the carrier lifting device 661 of the coupling device 66 drives the positioning carrier device to descend to the upper needle holder 110 and cooperate with the lower chuck 120, and drives the screw locking device 644 to descend to the position of the fastening screw 144 through the first Z-axis linear module 643 of the locking device 64, and then drives the fastening screw 144 to rotate through the screw locking device 644. During this process, the first Z-axis linear module 643 drives the screw locking device 644 to descend, so that the fastening screw 144 is screwed into the threaded portion 131 of the lower chuck 120.

[0063] The locking device 64 also includes a first X-axis linear module 642 and a first Y-axis linear module 641; the first Y-axis linear module 641 is connected to the first X-axis linear module 642, and drives the first Y-axis linear module 641 to translate along a first direction X through the first X-axis linear module 642; the first Z-axis linear module 643 is connected to the first Y-axis linear module 641, and drives the first Z-axis linear module 643 to translate along a second direction Y through the first Y-axis linear module 641; the second direction is perpendicular to the first direction and the lifting direction of the screw locking device 644. During use, the first X-axis linear module 642 can drive the first Y-axis linear module 641 to translate along the first direction, thereby driving the screw locking device 644 to translate along the first direction, and the first Y-axis linear module 641 can drive the first Z-axis linear module 643 to translate along the second direction, thereby driving the screw locking device 644 to translate along the second direction, so as to facilitate flexible adjustment of the position of the screw locking device 644 to meet the locking requirements of the fastening screws 144 in different positions.

[0064] In this embodiment, the upper needle holder 110 is provided with a plurality of fastening screws 144 arranged in a circumferential pattern, and the lower chuck 120 is provided with a plurality of threaded portions 131 corresponding to the plurality of fastening screws 144, thereby enhancing the securement of the upper needle holder 110 and the lower chuck 120. The threaded portions 131 are lock nuts provided on the lower chuck 120.

[0065] The screw-locking device 644 includes a screwdriver 161 and a rotary drive component 162; the rotary drive component 162 is used to drive the screwdriver 161 to rotate; the screwdriver 161 is used to cooperate with the fastening screw 144 to drive the fastening screw 144 to rotate when the screwdriver 161 rotates. During use, after the first Z-axis linear module 643 drives the screwdriver 161 to descend and engage with the fastening screw 144, the rotary drive component 162 is activated, driving the screwdriver 161 to rotate. The first Z-axis linear module 643 drives the screwdriver 161 to continuously move downward, and the fastening screw 144 can be tightened by the screwdriver 161.

[0066] The positioning carrier assembly includes a lifting carrier 663 and a pressing device 668. The carrier lifting device 661 is used to drive the lifting carrier 663 to move up and down. The pressing device 668 is mounted on the lifting carrier 663 and is used to press the upper needle holder 110 against the lifting carrier 663. A first mating portion is provided on the side of the upper needle holder 110. The positioning carrier assembly also includes a lateral positioning device 667. The lateral positioning device 667 is mounted on the lifting carrier 663 and is used to engage with the first mating portion of the upper needle holder 110 to position the upper needle holder 110. During use, the lifting carrier 663 is driven down by the carrier lifting device 661, which can drive the upper needle holder 110 carried by the lifting carrier 663 to descend to cooperate with the lower chuck 120, and the upper needle holder 110 is pressed against the lifting carrier 663 by the pressing device 668, and the lateral positioning device 667 is inserted and cooperated with the first matching part of the upper needle holder 110 to position the upper needle holder 110, which can realize the vertical and horizontal positioning of the upper needle holder 110, so as to improve the stability of the positioning of the upper needle holder 110 on the lifting carrier 663, avoid the displacement of the upper needle holder 110, and avoid affecting the locking of the upper needle holder 110 and the lower chuck 120 due to the displacement of the upper needle holder 110, so as to ensure the smooth progress of the locking work.

[0067] The lateral positioning device 667 includes a positioning block and a lateral positioning cylinder; the lateral positioning cylinder is used to drive the positioning block to move horizontally, and the first matching part is a positioning groove arranged on the upper needle holder 110 and for the positioning block to be embedded. When in use, the positioning block is driven by the lateral positioning cylinder to move toward the positioning groove, and the positioning block is embedded in the positioning groove, which can play a lateral positioning role on the upper needle holder 110.

[0068] The pressing device 668 includes a pressing cylinder, the piston rod of which is vertically arranged, and the piston rod of the pressing cylinder is connected to a pressing block. When in use, the pressing block is driven downward by the pressing cylinder, and the pressing block is used to press on the upper needle holder 110.

[0069] The lifting carriage 663 includes a first side portion 171 and a second side portion 172. A slot 173 for the lower chuck 120 to pass through is formed between the first and second side portions 171, 172. Both the first and second side portions 171, 172 are provided with a horizontal guide wheel assembly 664 for supporting the upper needle holder 110. As the lifting mechanism 661 drives the lifting carriage 663 downward, the upper needle holder 110 descends relative to the lower chuck 120 along with the lifting carriage 663. After the upper needle holder 110 descends to a predetermined position, the lower chuck 120 passes through the slot 173 and engages with the upper needle holder 110.

[0070] The positioning carrier device further includes a guide rail 662 , and the lifting carrier 663 is provided with a matching slider that slidably cooperates with the guide rail 662 to improve the stability of the lifting carrier 663 during lifting.

[0071] The horizontal guide wheel assembly 664 includes a rotatable horizontal guide wheel for supporting the upper needle holder 110, with the central axis of the horizontal guide wheel being horizontally disposed. Both the first and second side portions 171, 172 are provided with a lateral guide wheel assembly 665 for rolling engagement with the upper needle holder 110. The lateral guide wheel assembly 665 includes a rotatable lateral guide wheel for supporting the upper needle holder 110, with the central axis of the lateral guide wheel being vertically disposed. During the process of the clamp pushing device 65 pushing the upper needle holder 110, the upper needle holder 110 rolls in contact with the horizontal guide wheel of the horizontal guide wheel assembly 664 and the lateral guide wheels of the lateral guide wheel assembly 665. Thus, the lateral guide wheel assembly 665 serves to limit the upper needle holder 110 during the pushing process, preventing the upper needle holder 110 from moving skewed and reducing friction.

[0072] The lifting carrier 663 is further provided with a limit plate 666 .

[0073] The wafer vision positioning system 150 includes a wafer shooting device; the wafer shooting device is used to shoot images of the lower chuck 120 and the wafer thereon; the wafer vision positioning system 150 is used to obtain the position information of the wafer on the lower chuck 120 based on the image shot by the wafer shooting device; the wafer vision positioning system 150 is also used to compare the position information of the wafer on the lower chuck 120 with the reference position information stored in the wafer vision positioning system 150, and control the operation of the rotation device 623 according to the comparison result. When in use, the lower chuck 120 and the wafer thereon can be photographed by the wafer photographing device; the wafer visual positioning system 150 is used to obtain the position information of the wafer on the lower chuck 120 based on the image photographed by the wafer photographing device, and compare the position information of the wafer on the lower chuck 120 with the reference position information stored in the wafer visual positioning system 150. If there is a position error between the two, the suction cup device 67 extracts the wafer from the lower chuck 120, and the wafer visual positioning system 150 controls the rotating device 623 to drive the lower chuck 120 to rotate to adjust the rotation angle value of the lower chuck 120. After the adjustment is completed, the suction cup device 67 moves the wafer to the lower chuck 120, and the wafer photographing device photographs the lower chuck 120 and the wafer thereon. After the wafer visual positioning system 150 compares and analyzes the position information of the wafer on the lower chuck 120 obtained from the image with the reference position information and determines that the positioning is qualified without error, the transfer mechanism drives the rotating device 623 to move to the second workstation. By adopting the above-mentioned setting for the wafer vision positioning system 150, the wafer position information can be obtained through the image captured by the wafer shooting device. The wafer vision positioning system 150 calculates the position deviation between the wafer position information and the reference position information and drives the rotating device 623 to rotate the correction angle, so as to automatically and accurately align the wafer and reduce the labor intensity of the operator.

[0074] The wafer visual positioning system 150 can adopt an existing visual positioning system to obtain the position information of the wafer on the lower chuck 120 and to control the operation of the rotating device 623. However, the wafer visual positioning system 150 includes a wafer shooting device; the wafer shooting device is used to capture images of the lower chuck 120 and the wafer thereon; and the wafer visual positioning system 150 is used to obtain the position information of the wafer on the lower chuck 120 based on the image captured by the wafer shooting device, and to compare the position information of the wafer on the lower chuck 120 with the reference position information stored in the wafer visual positioning system 150, and to control the operation of the rotating device 623 based on the comparison result. This is the most preferred embodiment of the present invention, which can automatically and accurately align and reduce the labor intensity of the operator.

[0075] The wafer photographing device includes an upper camera 68 and a lower camera 69. The lower camera 69 is mounted on the wafer transport device 62, and the upper camera 68 is located on one side of the suction cup device 67. When the transfer device drives the rotating device 623 to move to the position corresponding to the upper camera 68, the upper camera 68 can be used to photograph the lower chuck 120 and the wafer thereon.

[0076] The clamp pushing device 65 includes a carrying assembly 90, a carrying plate 97, a hook plate lifting device 652 and a clamp hook plate 653; the carrying assembly 90 includes a support frame device 99, a transmission shaft 92, a power output device 98 and two relative transmission units 93; the transmission shaft 92 is rotatably mounted on the support frame device 99, the power output device 98 is mounted on the support frame device 99, and is used to drive the transmission shaft 92 to rotate, the transmission unit 93 includes a first driving wheel 94, a first driven wheel 95 and a first transmission belt 96, the first driving wheel 94 is fixed on the transmission shaft 92, the first driven wheel 95 is rotatably mounted on the support frame device 99, the first transmission belt 96 is wound around the first driving wheel 94 and the first driven wheel 95 of the transmission unit 93, One end of the carrier plate 97 is connected to the first transmission belt 96 of one of the transmission units 93, and the other end of the carrier plate 97 is connected to the first transmission belt 96 of one of the transmission units 93. The hook plate lifting device 652 is mounted on the carrier plate 97 and is used to lift and lower the fixture hook plate 653. During use, the hook plate lifting device 652 drives the fixture hook plate 653 downward, and the power output device 98 drives the transmission shaft 92 to rotate forward. At this time, the first driving wheels 94 of the two transmission units 93 are driven to rotate, thereby driving the first transmission belts 96 of the two transmission units 93, thereby driving the carrier plate 97 forward, and the fixture hook plate 653 is driven forward to push the upper needle holder 110 locked with the lower chuck 120 out of the positioning carrier device. The above structure makes the movement of the fixture hook plate 653 more stable, and improves the stability of the wafer burn-in test fixture 190.

[0077] Of course, the fixture pushing device 65 is not limited to the above structure, and various pushing devices currently available on the market can also be used. However, adopting the above structure for the fixture pushing device 65 is a better embodiment of the present invention, which can improve the stability of pushing the wafer aging test fixture 190.

[0078] Preferably, the fixture pushing device 65 also includes a QR code reader 654, which can identify the QR code label of the wafer aging test fixture through the QR code reader 654 to obtain specific information of the wafer aging test fixture 190, which is used for the life management of the wafer aging test fixture 190. At the same time, it can realize the record management of the number of times and duration of use of the key components of the wafer aging test fixture 190, such as the probe, locking screw, needle card board, and thermocouple sensor, to facilitate the timely replacement of key components.

[0079] Specifically, two hook plate lifting devices 652 are installed on the carrying plate 97 , and the two-dimensional code reader 654 is located between the two hook plate lifting devices 652 .

[0080] The hook plate lifting device 652 includes a hook plate driving cylinder, the cylinder body of the hook plate driving cylinder is installed on the carrier plate 97, and the clamp hook plate 653 is connected to the piston rod of the hook plate driving cylinder. By adopting the above structure, the clamp hook plate 653 can be driven to rise and fall at the same time, and it is convenient for installation.

[0081] The power output device 98 includes a hook plate drive motor 91, a second driving wheel 100, a second driven wheel 101, and a second transmission belt 102. The second driving wheel 100 is fixed to the output shaft of the hook plate drive motor 91, the second driven wheel 101 is fixed to the transmission shaft 92, and the second transmission belt 102 is wound around the second driving wheel 100 and the second driven wheel 101. During use, the hook plate drive motor 91 drives the second driving wheel 100 to rotate, which in turn drives the second driven wheel 101 to rotate via the second transmission belt 102, thereby driving the transmission shaft 92 to rotate. By adopting the above structure, it is convenient to drive the transmission shaft 92 to rotate, and it is also convenient to install and reasonably set the installation position of the transmission shaft 92.

[0082] Specifically, the support frame device 99 is further provided with a transverse guide rail, and the carrying plate 97 is provided with a transverse slider that slides with the transverse guide rail to improve the smoothness of the sliding of the carrying plate 97.

[0083] The transfer mechanism includes a first linear motor 622 and a second linear motor 621. The first linear motor 622 drives the second linear motor 621 to translate in a first direction, while the second linear motor 621 drives the second linear motor 623 to translate in a second direction. The rotation device 623 includes a chuck drive motor. This structure allows for flexible movement of the rotation device 623 and facilitates installation.

[0084] The rotating device 623 further includes a chuck carrier 63 . The chuck carrier 63 is fixed on the output shaft of the chuck driving motor. The chuck carrier 63 is used to carry the lower chuck 120 .

[0085] The structure of the chuck carrier 63 can be configured according to actual needs, as long as it can be used to support the lower chuck 120 .

[0086] The suction cup device 67 includes a second Z-axis linear module 671, a suction cup mounting plate 672 and a vacuum suction cup 673. The vacuum suction cup 673 is arranged on the suction cup mounting plate 672. The second Z-axis linear module 671 is used to drive the suction cup mounting plate 672 to rise and fall. The vacuum suction cup 673 is used to connect to an external vacuum pump. When in use, the wafer robot 40 transports the pre-positioned wafer to the first station of the wafer alignment platform 60, drives the suction cup mounting plate 672 to descend through the second Z-axis linear module 671, and the vacuum suction cup 673 vacuum-adsorbs the wafer from the wafer robot 40, and the second Z-axis linear module 671 drives the suction cup mounting plate 672 to rise, and the wafer robot 40 exits the first station, and the transfer mechanism drives the rotating device 623 to move and move the rotating device 623 to the first station, drives the suction cup mounting plate 672 to descend through the second Z-axis linear module 671, and the vacuum suction cup 673 releases the wafer onto the lower chuck 120, and the second Z-axis linear module 671 drives the suction cup mounting plate 672 to rise, and the transfer mechanism drives the rotating device 623 to move and move the rotating device 623 until the wafer is directly below the upper camera 68, and the wafer shooting device shoots images of the lower chuck 120 and the wafer thereon, and the wafer vision positioning system 150 obtains the position of the wafer on the lower chuck 120 After the wafer is moved from the lower chuck 120 to the lower chuck 120, the wafer is moved to the lower chuck 120 by the suction cup device 671. The transfer mechanism drives the rotating device 623 to move and moves the rotating device 623 to the first station, and drives the suction cup mounting plate 672 to descend through the second Z-axis linear module 671. After the vacuum suction cup 673 absorbs the wafer from the lower chuck 120, the suction cup mounting plate 672 is driven to rise through the second Z-axis linear module 671. The wafer visual positioning system 150 controls the rotating device 623 to work so that the rotating device 623 drives the lower chuck 120 to rotate. After the lower chuck 120 rotates, the wafer is moved to the lower chuck 120 through the suction cup device 67. The transfer mechanism drives the rotating device 623 to move and moves the rotating device 623 until the wafer is directly below the upper camera 68. The wafer shooting device is used to shoot images of the lower chuck 120 and the wafer thereon. After the alignment is confirmed to be qualified, the transfer mechanism drives the rotating device 623 to move and moves the rotating device 623 to the second station.

[0087] The alignment platform 60 further includes a marble platform 61 , on which a wafer transport device 62 , a locking device 64 , a fixture moving device 65 , a coupling device 66 , a suction cup device 67 , and a camera on the wafer are mounted.

[0088] The first X-axis linear module 642, the first Y-axis linear module 641, the first Z-axis linear module 643, the second Z-axis linear module 671, and the carrier lifting device 661 can adopt various linear modules currently available in the market, such as ball screw linear modules, synchronous belt linear modules, etc. The rotary drive component 162 can adopt a screwdriver drive motor, a rotary cylinder, etc.

[0089] The loading device 30 includes a magazine 39, a positioning base 35, a mounting platform 31, and a shield 32. The positioning base 35 is used to removably mount the magazine 39. The mounting platform 31 has an open end facing the magazine 39. The shield 32 is hinged to the mounting platform 31 and serves to close the open end. A nitrogen spring 37 is installed between the shield 32 and the mounting platform 31. The wafer robot 40 retrieves wafers from the magazine 39 of the loading device 30. During operation, the shield 32 is rotated upward relative to the mounting platform 31 to open the open end. When the shield 32 is open, the nitrogen spring 37 prevents it from falling, making it easier for operators to inspect. When the shield 32 is rotated downward relative to the mounting platform 31, the open end is sealed. When the shield 32 is closed, the nitrogen spring 37 prevents it from opening easily.

[0090] The positioning seat 35 is provided with a positioning groove, and the lower end of the magazine 39 is provided with an insert that fits into the positioning groove. During use, the insert of the magazine 39 is manually inserted into the positioning groove of the positioning seat 35 to achieve rapid positioning of the magazine 39. Two positioning seats 35 are adjustably mounted on the mounting platform 31. The inserts on both sides of the lower end of the magazine 39 fit into the positioning grooves of the two positioning seats 35 in a one-to-one correspondence. The magazine 39 can be a wafer boat. By adjusting the installation position of the two positioning seats 35, it can accommodate the installation of magazines 39 of various sizes.

[0091] Specifically, the shield 32 is hinged to the mounting platform 31 via a hinge 33. A detection sensor is provided on the mounting platform 31 for detecting the open or closed state of the shield 32. A hydraulic buffer 38 is also provided on the mounting platform 31 for cushioning the impact of the shield 32 when it is closed.

[0092] As a preferred embodiment of the present invention, the fixture accommodating device 180 includes a turnover fixture material frame 80 and a material frame lifting device 70. The turnover fixture material frame 80 is provided with the accommodating slot 81 extending along its height direction and used to accommodate the wafer aging test fixture 190; the material frame lifting device 70 is used to drive the turnover fixture material frame 80 to be lifted and lowered. When in use, the turnover fixture material frame 80 can be driven to be lifted and lowered by the material frame lifting device 70 so that each accommodating slot 81 is sequentially opposite to the fixture pushing device 65. The fixture pushing device 65 can sequentially push each wafer aging test fixture 190 that has been locked out from the positioning carrier device into each accommodating slot 81, which is convenient for the storage and placement of multiple wafer aging test fixtures 190 to meet subsequent large-scale production.

[0093] The material frame lifting device 70 includes a mounting base 71, a linear guide 72, a ball screw 73, a screw drive 74, a synchronous belt 76, a first synchronous pulley 75, a second synchronous pulley 77, a lifting platform 78, and a limit sensor. The screw drive 74 is used to drive the first synchronous pulley 75 to rotate. The ball screw 73 is rotatably mounted on the mounting base 71, the second synchronous pulley 77 is fixed to the ball screw 73, the synchronous belt 76 is wound around the first synchronous pulley 75 and the second synchronous pulley 77, and a screw nut 79 that matches the ball screw 73 is fixed to the lifting platform 78. The lifting platform 78 is slidably mounted on the linear guide 72. The turnover fixture material frame 80 is mounted and fixed on the lifting platform 78 of the material frame lifting device 70. The screw drive 74 includes a screw drive motor. When in use, the first synchronous wheel 75 is driven to rotate by the screw drive device 74, and the synchronous belt 76 drives the second synchronous wheel 77 together with the ball screw 73 to rotate, thereby prompting the lifting platform 78 to rise and fall along the linear guide rail 72 to drive the turnover fixture material frame 80 to rise and fall.

[0094] The structure of the turnover fixture frame 80 can be set according to actual needs, as long as it is provided with a receiving slot 81 for receiving the wafer aging test fixture 190 .

[0095] The wafer loading and unloading alignment equipment also includes an upper cover 20 and a frame platform 10. The upper cover 20, loading device 30, wafer robot 40, edge finder 50, alignment platform 60, and material frame lifting device 70 are mounted and fixed on the frame platform 10. Shock-absorbing pads are installed between the alignment platform 60 and the frame platform 10 to isolate the impact of vibration from the frame platform 10 on the accuracy of the alignment platform 60.

[0096] The above embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and replacements made by technicians in this field on the basis of the present invention fall within the scope of protection required by the present invention.

Claims

1. A wafer loading and unloading alignment device, characterized by: It comprises a loading device (30), a wafer robot (40), a wafer alignment platform (60) and a fixture accommodating device (180); The loading device (30) is used to accommodate wafers; The wafer robot (40) is used to obtain a wafer from the loading device (30) and to transport the wafer to the wafer alignment platform (60); The clamp accommodating device (180) is provided with an accommodating groove; The wafer alignment platform (60) is used to align the wafer and place it in the wafer aging test fixture (190), and to lock the wafer aging test fixture (190); the wafer alignment platform (60) is also used to push the locked wafer aging test fixture (190) into the accommodating groove of the fixture accommodating device (180).

2. The wafer loading and unloading alignment device according to claim 1, characterized in that: The wafer loading and unloading alignment device further comprises an edge finder (50); the wafer robot (40) is further used to transport the wafer to the edge finder (50); the edge finder (50) is used to pre-position the wafer; and the wafer robot (40) is used to transport the pre-positioned wafer to the wafer alignment platform (60).

3. The wafer loading and unloading alignment device according to claim 1 or 2, characterized in that: The wafer aging test fixture (190) includes an upper needle holder (110) and a lower chuck (120); the wafer alignment platform (60) is provided with a first station and a second station; the wafer robot (40) is used to transport the wafer to the first station of the wafer alignment platform (60); the wafer alignment platform (60) includes a suction cup device (67), a wafer visual positioning system (150), a wafer transport device (62), a coupling device (66) and a locking device (64); The wafer transport device (62) comprises a transfer mechanism and a rotating device (623); the transfer mechanism is used to drive the rotating device (623) to move and make the rotating device (623) pass through the first station and the second station; the rotating device (623) is used to carry the lower chuck (120) and to drive the lower chuck (120) to rotate; the lower chuck (120) is used for placing wafers; The wafer visual positioning system (150) is used to obtain position information of the wafer on the lower chuck (120) and to control the operation of the rotating device (623); The suction cup device (67) is located at the first station and is used to extract the wafer from the wafer robot (40); the suction cup device (67) is also used to move the wafer to the lower chuck (120) and is suitable for extracting the wafer from the lower chuck (120); The coupling device (66) is located at the second workstation, and the coupling device (66) includes a positioning carrier device and a carrier lifting device (661); the carrier lifting device (661) is used to drive the positioning carrier device to rise and fall; the positioning carrier device is used to carry the upper needle holder (110); The locking device (64) is used to lock the lower chuck (120) on the upper needle chuck (110).

4. The wafer loading and unloading alignment device according to claim 3, characterized in that: The wafer alignment platform (60) also includes a fixture pushing device (65); the fixture pushing device (65) is used to push the locked fixture from the positioning carrier device to the accommodating groove of the fixture accommodating device (180).

5. The wafer loading and unloading alignment device according to claim 4, characterized in that: The upper needle holder (110) is provided with a fastening screw (144), and the lower chuck (120) is provided with a threaded portion (131). The locking device (64) is used to thread the fastening screw (144) onto the threaded portion (131) of the lower chuck (120), and the locking device (64) includes a screw locking device (644) and a first Z-axis linear module (643); the first Z-axis linear module (643) is used to drive the screw locking device (644) to rise and fall; and the screw locking device (644) is used to drive the fastening screw (144) to rotate.

6. The wafer loading and unloading alignment device according to claim 5, characterized in that: The locking device (64) further comprises a first X-axis linear module (642) and a first Y-axis linear module (641); the first Y-axis linear module (641) is connected to the first X-axis linear module (642), and drives the first Y-axis linear module (641) to translate along a first direction via the first X-axis linear module (642); the first Z-axis linear module (643) is connected to the first Y-axis linear module (641), and drives the first Z-axis linear module (643) to translate along a second direction via the first Y-axis linear module (641); the second direction is perpendicular to the first direction and the lifting direction of the screw locking device (644).

7. The wafer loading and unloading alignment device according to claim 3, characterized in that: The positioning carrier device comprises a lifting carrier (663) and a pressing device (668); the carrier lifting device (661) is used to drive the lifting carrier (663) to move up and down; the pressing device (668) is installed on the lifting carrier (663) and is used to press the upper needle holder (110) against the lifting carrier (663).

8. The wafer loading and unloading alignment device according to claim 7, characterized in that: A first matching portion is provided on the side of the upper needle holder (110); the positioning carrier device also includes a lateral positioning device (667); the lateral positioning device (667) is installed on the lifting carrier (663) and is used to be inserted and matched with the first matching portion of the upper needle holder (110) to position the upper needle holder (110).

9. The wafer loading and unloading alignment device according to claim 3, characterized in that: The wafer visual positioning system (150) includes a wafer photographing device; the wafer photographing device is used to photograph images of the lower chuck (120) and the wafer thereon; the wafer visual positioning system (150) is used to obtain position information of the wafer on the lower chuck (120) based on the image photographed by the wafer photographing device; the wafer visual positioning system (150) is also used to compare the position information of the wafer on the lower chuck (120) with the reference position information stored in the wafer visual positioning system (150), and control the operation of the rotating device (623) according to the comparison result.

10. The wafer loading and unloading alignment device according to claim 1, characterized in that: The feeding device (30) comprises a material box (39), a positioning seat (35), a mounting platform (31) and a shield (32); the positioning seat (35) is used for detachably mounting the material box (39); the mounting platform (31) is provided with an open end facing the material box (39); the shield (32) is hinged on the mounting platform (31) and is used to close the open end; a nitrogen spring (37) is connected between the shield (32) and the mounting platform (31).

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