Methods, systems, storage media, and computer program products for damage monitoring of high-intensity optical components

Abstract

This application discloses a method, system, storage medium, and computer program product for damage monitoring of high-intensity optical components, relating to the field of high-energy laser technology. The method includes: irradiating the high-intensity optical component to be monitored with a laser, and acquiring the component temperature, spot power, and spot image of the component during irradiation through a data acquisition module; generating a spot analysis map, a temperature spatial distribution map, and a temperature-power temporal distribution map based on the component temperature, the spot power, and the spot image; and performing damage monitoring on the high-intensity optical component based on the spot analysis map, the temperature spatial distribution map, and the temperature-power temporal distribution map. By simultaneously acquiring multiple parameters, the state of the high-intensity optical component under laser irradiation is comprehensively reflected from different perspectives, avoiding misjudgments or omissions that may be caused by monitoring a single parameter, thereby improving the comprehensiveness and accuracy of the monitoring.

Description

Technical Field

[0001] This application relates to the field of high-energy laser technology, and in particular to methods, systems, storage media and computer program products for damage monitoring of high-intensity laser components. Background Technology

[0002] High-intensity laser elements (HIXI) are key components of high-energy laser systems. Due to their high manufacturing costs, long processing cycles, and difficulty in monitoring after system integration, monitoring their performance is of paramount importance. However, current damage monitoring methods for HIXI are mostly limited to a single parameter, temperature, which cannot comprehensively reflect damage characteristics such as beam deformation and power fluctuations, making it difficult to accurately determine the real-time status of the HIXI. Furthermore, relying solely on temperature as a single parameter fails to reveal the synergistic effects of temperature field, beam deformation, and power changes, thus hindering in-depth analysis of the damage mechanisms of HIXI.

[0003] Therefore, improving the accuracy and comprehensiveness of damage monitoring for high-intensity light components is a problem that this application urgently needs to solve.

[0004] The above content is only used to help understand the technical solution of this application and does not represent an admission that the above content is prior art. Summary of the Invention

[0005] The main objective of this application is to provide a method, system, storage medium, and computer program product for monitoring damage to high-intensity light components, aiming to improve the accuracy and comprehensiveness of monitoring the damage status of high-intensity light components.

[0006] To achieve the above objectives, this application proposes a method for monitoring damage to high-intensity optical components, applied to a high-intensity optical component damage monitoring system. The high-intensity optical component damage monitoring system includes a laser, a data acquisition module, and a data analysis module. The method includes:

[0007] The laser is activated to irradiate the high-intensity light element to be monitored, and the element temperature, spot power, and spot image of the high-intensity light element to be monitored are collected through the data acquisition module during the irradiation process.

[0008] Generate a spot analysis map, a temperature spatial distribution map, and a temperature power temporal distribution map based on the component temperature, the spot power, and the spot image;

[0009] Damage monitoring is performed on the high-intensity light element to be monitored based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature-power time distribution diagram.

[0010] In one embodiment, before the step of irradiating the high-intensity light element to be monitored with the laser and acquiring the element temperature, spot power, and spot image of the high-intensity light element during the irradiation process via the data acquisition module, the method further includes:

[0011] The laser is activated according to the preset laser parameters to irradiate the debugging high-intensity light element, and the light spot status on the debugging high-intensity light element is observed by the light spot analyzer.

[0012] Adjust the focusing lens located in front of the laser until the light spot condition meets the preset light spot quality conditions.

[0013] In one embodiment, the data acquisition module includes an infrared thermometer, a spot analyzer with an attenuator, and an interface-type laser power meter. The step of acquiring the element temperature, spot power, and spot image of the high-intensity light element to be monitored during irradiation through the data acquisition module includes:

[0014] The infrared thermometer is controlled to measure the temperature of the high-intensity light element on the central axis of the high-intensity light element to be monitored, thereby obtaining the temperature of the element;

[0015] The spot image of the high-intensity light element to be monitored is acquired by the spot analyzer.

[0016] The laser power meter collects the spot power of the high-intensity light element to be monitored through the interface.

[0017] In one embodiment, the step of generating a spot analysis map, a temperature spatial distribution map, and a temperature-power temporal distribution map based on the element temperature, the spot power, and the spot image includes:

[0018] The size of the spot image is calibrated according to the photosensitive area and resolution of the spot analyzer. The size parameters of the calibrated spot image are identified using an image processing algorithm, and the spot intensity distribution data is extracted.

[0019] The size parameters and the intensity distribution data of the spot are comprehensively displayed on the spot image after size calibration to form a spot analysis map;

[0020] The temperature of the component is mapped onto the two-dimensional plane where the high-intensity light component to be monitored is located, generating a temperature spatial distribution map;

[0021] The element temperature and the spot power are correlated with the time axis to generate a temperature-power time distribution map.

[0022] In one embodiment, the step of performing damage monitoring on the high-intensity light element based on the light spot analysis map, the temperature spatial distribution map, and the temperature-power time distribution map further includes:

[0023] The time axis linkage control unifies the data timestamps of the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature power time distribution diagram;

[0024] The spot analysis diagram, temperature spatial distribution diagram, and temperature-power time distribution diagram after unifying the data timestamps are integrated into the same visualization interface.

[0025] In one embodiment, the step of damage monitoring of the high-intensity light element based on the light spot analysis map, the temperature spatial distribution map, and the temperature-power time distribution map includes:

[0026] The degree of light spot deformation in the light spot analysis diagram is calculated based on the ellipse fitting algorithm, and the matching degree between the high temperature region in the temperature spatial distribution diagram and the light spot position in the light spot analysis diagram is analyzed.

[0027] The overall performance status of the high-intensity light element under monitoring is analyzed by combining the degree of light spot deformation, the matching degree, and the slope change of the temperature-power time distribution diagram.

[0028] In one embodiment, after the step of performing damage monitoring on the high-intensity light element based on the light spot analysis map, the temperature spatial distribution map, and the temperature-power time distribution map, the method further includes:

[0029] When any parameter in the component temperature, the spot power, or the spot image exceeds a preset damage threshold, the laser output of the laser is cut off.

[0030] Furthermore, to achieve the above objectives, this application also proposes a high-intensity light element damage monitoring system, the high-intensity light element damage monitoring system comprising:

[0031] Lasers are used to irradiate the high-intensity light components to be monitored.

[0032] The data acquisition module is used to acquire the element temperature, spot power, and spot image of the high-intensity light element to be monitored during the irradiation process;

[0033] The data analysis module is used to generate a spot analysis map, a temperature spatial distribution map, and a temperature power time distribution map based on the component temperature, the spot power, and the spot image, and to perform damage monitoring on the high-intensity light component to be monitored based on the spot analysis map, the temperature spatial distribution map, and the temperature power time distribution map.

[0034] In addition, to achieve the above objectives, this application also proposes a storage medium, which is a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the steps of the high-intensity light element damage monitoring method described above.

[0035] In addition, to achieve the above objectives, this application also provides a computer program product, which includes a computer program that, when executed by a processor, implements the steps of the high-intensity light element damage monitoring method described above.

[0036] One or more technical solutions proposed in this application have at least the following technical effects:

[0037] A laser is activated to irradiate the high-intensity optical element under laser irradiation. During the irradiation process, the element temperature, laser power, and laser spot image are collected via a data acquisition module. Based on the element temperature, laser power, and laser spot image, a laser spot analysis map, a temperature spatial distribution map, and a temperature-power temporal distribution map are generated. Damage monitoring of the high-intensity optical element is then performed based on these maps. Element temperature reflects the thermal effect of the high-intensity optical element under laser irradiation, laser spot power reflects the distribution and transmission efficiency of laser energy on the element surface, and the laser spot image directly reflects surface damage or internal defects. By simultaneously acquiring multiple parameters, the state of the high-intensity optical element under laser irradiation is comprehensively reflected from different perspectives, avoiding misjudgments or omissions that may occur with single-parameter monitoring, thereby improving the comprehensiveness and accuracy of the monitoring. Combining the laser spot analysis map, temperature spatial distribution map, and temperature-power temporal distribution map for comprehensive damage monitoring of the high-intensity optical element not only improves the accuracy of damage monitoring but also enhances the reliability of the monitoring system. In summary, by acquiring multi-parameter data, analyzing multi-dimensional data, and conducting comprehensive damage monitoring, the limitations of single-parameter monitoring can be avoided, thereby improving the accuracy and comprehensiveness of damage status monitoring for high-intensity optical components. Attached Figure Description

[0038] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a flowchart illustrating the first embodiment of the high-intensity light element damage monitoring method of this application.

[0041] Figure 2 This is a flowchart illustrating the second embodiment of the high-intensity light element damage monitoring method of this application.

[0042] Figure 3This is a diagram showing the light spot under normal conditions.

[0043] Figure 4 This is an analysis diagram of the light spot under slightly damaged conditions;

[0044] Figure 5 This is an analysis diagram of the light spot under obvious damage conditions;

[0045] Figure 6 This is a schematic diagram of the high-intensity light element damage monitoring system of this application;

[0046] Figure 7 This is a schematic diagram of the overall process of the high-intensity light element damage monitoring method of this application;

[0047] Figure 8 This is a schematic diagram of the module structure of the high-intensity light element damage monitoring device according to an embodiment of this application;

[0048] Figure 9 This is a schematic diagram of the equipment structure of the hardware operating environment involved in the high-intensity light element damage monitoring method in the embodiments of this application.

[0049] The purpose, features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0050] It should be understood that the specific embodiments described herein are merely used to explain the technical solutions of the present application and are not intended to limit the present application.

[0051] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0052] The main solution of this application embodiment is: to start a laser to irradiate the high-intensity light element to be monitored, and to collect the element temperature, spot power and spot image of the high-intensity light element to be monitored during the irradiation process through a data acquisition module; to generate a spot analysis map, a temperature spatial distribution map and a temperature power time distribution map based on the element temperature, the spot power and the spot image; and to perform damage monitoring on the high-intensity light element to be monitored based on the spot analysis map, the temperature spatial distribution map and the temperature power time distribution map.

[0053] This application's embodiments take into account that: high-intensity laser elements are key components of high-energy laser systems. Due to their high manufacturing costs, long processing cycles, and difficulty in monitoring after system integration, the performance monitoring of high-intensity laser elements is of great significance. However, current damage monitoring of high-intensity laser elements is mostly limited to a single parameter, temperature detection, which cannot comprehensively reflect the damage characteristics of high-intensity laser elements such as beam deformation and power fluctuations, making it difficult to accurately determine the real-time status of high-intensity laser elements. Furthermore, relying solely on temperature as a single parameter is insufficient to reveal the synergistic effect of temperature field, beam deformation, and power changes, thus hindering in-depth analysis of the damage mechanism of high-intensity laser elements.

[0054] Therefore, this application provides a solution that involves irradiating a high-intensity optical element under laser irradiation with a laser, and acquiring the element temperature, spot power, and spot image of the element during irradiation using a data acquisition module. Based on the element temperature, spot power, and spot image, a spot analysis map, a temperature spatial distribution map, and a temperature-power temporal distribution map are generated. Damage monitoring of the high-intensity optical element is then performed based on these maps. The element temperature reflects the thermal effect of the high-intensity optical element under laser irradiation, the spot power reflects the distribution and transmission efficiency of laser energy on the element surface, and the spot image directly reflects surface damage or internal defects. By simultaneously acquiring multiple parameters, the state of the high-intensity optical element under laser irradiation is comprehensively reflected from different perspectives, avoiding misjudgments or omissions that may occur with single-parameter monitoring, thereby improving the comprehensiveness and accuracy of the monitoring. Combining the spot analysis map, temperature spatial distribution map, and temperature-power temporal distribution map for comprehensive damage monitoring of the high-intensity optical element not only improves the accuracy of damage monitoring but also enhances the reliability of the monitoring system. In summary, by acquiring multi-parameter data, analyzing multi-dimensional data, and conducting comprehensive damage monitoring, the limitations of single-parameter monitoring can be avoided, thereby improving the accuracy and comprehensiveness of damage status monitoring for high-intensity optical components.

[0055] It should be noted that the executing entity in this embodiment can be a computing service device with data processing, network communication, and program execution functions, such as a tablet computer, personal computer, or mobile phone, or an electronic device capable of performing the above functions, such as a high-intensity light element damage monitoring system. The following description uses a high-intensity light element damage monitoring system as an example to illustrate this embodiment and the subsequent embodiments.

[0056] Based on this, this application provides a method for monitoring damage to high-intensity optical components, applied to a high-intensity optical component damage monitoring system. The high-intensity optical component damage monitoring system includes a laser, a data acquisition module, and a data analysis module. (Refer to...) Figure 1 , Figure 1 This is a flowchart illustrating the first embodiment of the high-intensity light element damage monitoring method of this application.

[0057] In this embodiment, the high-intensity light element damage monitoring method includes steps S10~S30:

[0058] Step S10: Start the laser to irradiate the high-intensity light element to be monitored, and collect the element temperature, spot power and spot image of the high-intensity light element to be monitored during the irradiation process through the data acquisition module;

[0059] It should be noted that the data acquisition module is a device used to collect the element temperature, spot power, and spot image of the high-intensity light element to be monitored during the irradiation process. The element temperature refers to the temperature change generated on the surface of the high-intensity light element during laser irradiation, reflecting the thermal effect of the element; the spot power refers to the power distribution of the laser spot on the surface of the element, reflecting the transmission efficiency of laser energy; the spot image refers to the image formed by the laser spot on the surface of the element, reflecting the shape, size, intensity distribution, and other characteristics of the spot.

[0060] A laser is activated to irradiate the high-intensity light source element under monitoring, simulating the operating conditions of an actual laser system. Laser energy is applied to the element. The element is irradiated by the laser, and various parameters are collected in real time during the irradiation process to comprehensively understand the changes in the element's state under laser influence. By acquiring data on element temperature, laser power, and laser imagery, rich data support can be provided for subsequent damage monitoring.

[0061] For example, in one possible implementation, the laser can be configured to emit light continuously or intermittently to simulate different laser operating conditions, thereby providing a more comprehensive evaluation of the component's performance. The laser can be a 300W high-stability continuous laser with an output center wavelength range of 1080±5nm and a beam quality of 1.1.

[0062] Step S20: Generate a spot analysis map, a temperature spatial distribution map, and a temperature power temporal distribution map based on the element temperature, the spot power, and the spot image;

[0063] Generating a spot analysis map, a temperature spatial distribution map, and a temperature-power time distribution map based on the component temperature, the spot power, and the spot image refers to using the collected data to generate charts that visually display the component status through data processing and analysis.

[0064] Specifically, a spot analysis chart refers to a graph that displays the characteristics of a spot, such as its shape, size, and intensity distribution, and is used to analyze the quality of the spot and the optical performance of the component; a temperature spatial distribution chart refers to a graph that displays the temperature distribution on the surface of the component and is used to identify local overheating areas; and a temperature-power time distribution chart refers to a graph that displays the trends of temperature and power over time and is used to assess the stability and damage of the component under long-term irradiation.

[0065] For example, in one specific implementation, the system generates a temperature spatial distribution map using component temperature data collected by an infrared thermometer, a temperature-power time distribution map using spot power data collected by a power meter, and a spot analysis map using spot images collected by a spot analyzer. These charts will provide detailed references for subsequent damage monitoring. For example, the spot analysis map can show whether the spot is uniform, the temperature spatial distribution map can identify local overheating areas, and the temperature-power time distribution map can analyze the stability of the component under long-term irradiation.

[0066] Step S30: Damage monitoring is performed on the high-intensity light element to be monitored based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature-power time distribution diagram.

[0067] Damage monitoring refers to determining whether components are damaged, the location and extent of the damage, and the type of damage by analyzing data in charts. Spot analysis charts are used to assess the quality of the spot and the optical performance of the component; temperature spatial distribution charts are used to identify localized overheating areas and assess the risk of thermal damage; and temperature-power time distribution charts are used to evaluate the stability and degree of damage to components under long-term irradiation.

[0068] For example, in one specific implementation, the system analyzes the laser spot analysis diagram to detect laser spot distortion, combines this with a temperature spatial distribution diagram to identify abnormally high local temperatures, and further refers to a temperature-power time distribution diagram to find abnormal trends in temperature and power changes over time. Based on this comprehensive analysis, the system determines that the component has suffered thermal damage. The system can automatically stop the laser's output, protecting the component from further damage. This comprehensive monitoring method effectively improves the accuracy and comprehensiveness of damage monitoring.

[0069] This embodiment provides a method for monitoring damage to high-intensity optical components. A laser is activated to irradiate the high-intensity optical component to be monitored. During irradiation, a data acquisition module collects the component temperature, laser power, and laser spot image. Based on the component temperature, laser power, and laser spot image, a laser spot analysis map, a temperature spatial distribution map, and a temperature-power temporal distribution map are generated. Damage monitoring of the high-intensity optical component is performed based on these maps. Component temperature reflects the thermal effect of the high-intensity optical component under laser irradiation; laser spot power reflects the distribution and transmission efficiency of laser energy on the component surface; and the laser spot image directly reflects surface damage or internal defects. By simultaneously acquiring multiple parameters, the state of the high-intensity optical component under laser irradiation is comprehensively reflected from different perspectives, avoiding misjudgments or omissions that may occur with single-parameter monitoring, thereby improving the comprehensiveness and accuracy of monitoring. Combining the laser spot analysis map, temperature spatial distribution map, and temperature-power temporal distribution map for comprehensive damage monitoring of the high-intensity optical component not only improves the accuracy of damage monitoring but also enhances the reliability of the monitoring system. In summary, by acquiring multi-parameter data, analyzing multi-dimensional data, and conducting comprehensive damage monitoring, the limitations of single-parameter monitoring can be avoided, thereby improving the accuracy and comprehensiveness of damage status monitoring for high-intensity optical components.

[0070] In one feasible implementation, the data acquisition module includes an infrared thermometer, a spot analyzer with an attenuator, and an interface-type laser power meter. Step S10 may include steps S11 to S13:

[0071] Step S11: Control the infrared thermometer to measure the temperature of the high-intensity light element to be monitored on the central axis of the high-intensity light element to obtain the element temperature;

[0072] It should be noted that this implementation uses a FOTRIC 600C infrared thermometer, model 626CH, with the following parameters: infrared resolution 384*288, temperature range -20℃ to 2000℃, and temperature accuracy ±2℃ or ±2%. An LT-500-VIS-NIR spot analyzer is used, with the following parameters: wavelength range 300-1100nm, photosensitive area 8.45mm x 7mm, resolution 2448*2048, and camera operating mode CMOS global shutter. A Lynk interface laser power meter is used, with the following parameters: wavelength range 190-1100nm, accuracy ±1.0%, maximum measurement power 600W, and response time 1.5s.

[0073] Point the infrared thermometer directly at the surface of the high-intensity light source. Adjust the thermometer using a mechanical support so that its central axis coincides with the center of the laser irradiation area of ​​the light source. Use a coaxial red indicator light from the laser to assist in optical path alignment, ensuring the temperature measurement area covers the irradiation range of the light spot. The focal length and measurement range of the thermometer can also be adjusted according to the size and shape of the light source, or the collected temperature data can be corrected based on the ambient temperature to optimize the measurement results.

[0074] For example, when the continuous temperature measurement mode of the infrared thermometer is activated, the system synchronously records temperature field data and generates a two-dimensional temperature matrix for subsequent spatial distribution map rendering.

[0075] Step S12: Acquire the light spot image of the high-intensity light element to be monitored using the light spot analyzer;

[0076] A laser spot analyzer is used to image and analyze the laser spot after it passes through the high-intensity light element to be monitored, obtaining information such as the shape, size, and intensity distribution of the spot to form a spot image. It should be noted that, to protect the detector of the spot analyzer from damage by high-power laser light, an attenuator can be installed in front of the spot analyzer to reduce the light intensity entering the detector.

[0077] For example, a standard circular spot calibration analyzer is used, and the adjustable focusing lens is fine-tuned to ensure that the spot diameter error is less than ±2%. After the spot analyzer is debugged and calibrated, the beam is split by a beam splitter to ensure that the spot analyzer receives the reflected light signal, and the CMOS global shutter mode is activated to capture the spot image at a frequency of 1Hz. The system automatically performs centroid positioning of the spot image.

[0078] Step S13: Collect the spot power of the high-intensity light element to be monitored through the interface laser power meter.

[0079] An interface-type laser power meter is used to measure the power of the laser spot after passing through the high-intensity light element to be monitored, thereby obtaining the spot power data. For example, a Lynk-type interface laser power meter is installed in the optical path behind the beam splitter to receive the transmitted light signal. The power meter measures the spot power with a response time of 1.5 seconds and an accuracy of ±1.0%. The collected spot power is transmitted to the working computer in real time via a USB interface.

[0080] In one feasible implementation, step S20 may include steps S21 to S24:

[0081] Step S21: The size of the spot image is calibrated according to the photosensitive area and resolution of the spot analyzer. The size parameters of the size-calibrated spot image are identified using an image processing algorithm, and the spot intensity distribution data is extracted.

[0082] Size calibration of the spot image based on the photosensitive area and resolution of the spot analyzer refers to converting the pixel coordinates in the spot image into actual physical size coordinates by establishing a mapping relationship between pixels and actual physical dimensions. The purpose of size calibration is to ensure that the size measurement results in the spot image are consistent with the actual size, thereby improving the accuracy and reliability of the measurement.

[0083] Image processing algorithms are used to identify the size parameters of the calibrated light spot image and extract the light spot intensity distribution data. Size parameters include the light spot's diameter in the X / Y directions and ellipticity (the ratio of its major axis to its minor axis), reflecting changes in the light spot's shape and size. The light spot intensity distribution data is stored in the form of a grayscale matrix for subsequent light spot energy uniformity analysis. In one possible implementation, an edge detection algorithm (such as the Canny operator) can be used to identify the edges of the light spot and calculate its diameter and ellipticity; simultaneously, a grayscale distribution analysis algorithm is used to extract the light spot intensity distribution data. If local hot spots are present in the light spot, an anomaly marker is triggered, indicating a possible abnormal light spot distribution.

[0084] Step S22: The size parameters and the light spot intensity distribution data are comprehensively displayed on the light spot image after size calibration to form a light spot analysis map;

[0085] The spot size parameters and intensity distribution data obtained after size calibration are visualized and integrated to generate an intuitive spot analysis map. The spot analysis map overlays intensity contour lines in pseudo-color, annotates the diameter values ​​in the X / Y directions and the percentage of ellipticity deviation (e.g., "ellipticity +12%)", and displays the intensity distribution curve in the image sidebar (the horizontal axis is the radial distance of the spot, and the vertical axis is the normalized intensity value). This visualization method can intuitively show the shape, size, and intensity distribution characteristics of the spot, facilitating subsequent damage analysis and judgment.

[0086] Furthermore, it should be noted that the generation of the spot analysis map is not only for visually displaying the characteristics of the spot, but also provides important information for subsequent damage monitoring. For example, when the ellipticity exceeds ±10%, the software automatically marks the abnormal area with a red outline on the map, indicating that the spot deformation may be caused by component damage. In one possible implementation, the spot analysis map can be generated using dedicated image processing software. The software interface provides various visualization options, and users can adjust display parameters as needed, such as color mapping and contour density. The generated spot analysis map can be directly used for deformation determination, providing an intuitive reference for subsequent damage monitoring.

[0087] Step S23: Map the temperature of the element to the two-dimensional plane where the high-intensity light element to be monitored is located to generate a temperature spatial distribution map;

[0088] Each temperature data point is associated with the physical coordinates of the component to generate a temperature spatial distribution map. The temperature spatial distribution map is presented in the form of a pseudo-color heatmap, with the color gradually changing from blue (low temperature) to red (high temperature), and the outline of the light spot in the light spot analysis map is superimposed to intuitively show the matching degree between the high temperature area and the position of the light spot.

[0089] Furthermore, it should be noted that the generation of the temperature spatial distribution map aims to reveal the thermal distribution characteristics of the component under laser irradiation, helping to identify localized overheating areas and assess the risk of thermal damage. In one possible implementation, a mapping relationship between temperature data points and physical coordinates is established by calibrating the field of view of the infrared thermometer and the actual size of the component. The generated temperature spatial distribution map not only displays the temperature distribution but also visually reflects temperature variations through color coding. If a high-temperature area is detected deviating from the center of the laser spot by more than 15% of the spot diameter, it is determined to be an abnormal thermal diffusion, indicating a potential risk of thermal damage. This temperature visualization method can provide important thermal information for subsequent damage monitoring.

[0090] Step S24: Correlate the element temperature and the spot power with the time axis to generate a temperature-power time distribution map.

[0091] By unifying the time axis, the temperature data recorded by the infrared thermometer and the spot power data collected by the laser power meter are synchronized and aligned. The system automatically interpolates and fills in missing timestamp data points, generating a dual-axis curve. The upper axis represents temperature (unit: °C), plotting a temperature-time curve; the lower axis represents power (unit: W), plotting a power-time curve. The two curves share the same horizontal time axis, and their time coordinates correspond one-to-one. A preset threshold line (e.g., a temperature threshold of 100 °C) is marked on the graph. This time distribution graph clearly shows the trends of temperature and power changes over time, providing a basis for analyzing the dynamic performance of components under laser irradiation.

[0092] Furthermore, it should be noted that the generation of the temperature-power time distribution map is not only for displaying the temporal changes in temperature and power, but also provides a dynamic analysis tool for damage monitoring. In one possible implementation, when any curve exceeds a preset threshold, the system inserts a red vertical line marker at the corresponding time point and associates it with the spot analysis map and temperature spatial distribution map at that moment, forming a complete time-series-spatial damage evolution record. This comprehensive analysis method can help users fully understand the damage evolution process of components during laser irradiation and promptly identify potential damage risks.

[0093] Based on the first embodiment of this application, a second embodiment of this application is proposed. In the second embodiment of this application, content that is the same as or similar to that in the first embodiment described above can be referred to the above description and will not be repeated hereafter.

[0094] Based on this, please refer to Figure 2 , Figure 2 A flowchart is provided for the second embodiment of this application. Before step S10, the high-intensity light element damage monitoring method further includes steps S01~S02:

[0095] Step S01: Activate the laser according to the preset laser parameters to irradiate the debugging high-intensity light element, and observe the light spot status on the debugging high-intensity light element through a light spot analyzer;

[0096] Irradiating the high-intensity optical element to be tested using a laser according to preset laser parameters refers to irradiating the high-intensity optical element to be tested with laser according to pre-set laser parameters (e.g., 300W continuous output, wavelength 1080±5nm). Preset laser parameters refer to parameters such as output power and wavelength set before laser startup to simulate actual working conditions. The high-intensity optical element being tested refers to the high-intensity optical element used to test the optical path and parameters before the system is officially used, with the purpose of ensuring the correctness of the optical path and the accuracy of the parameters. Observing the light spot state on the high-intensity optical element using a light spot analyzer refers to using a light spot analyzer to capture light spot images in real time and analyze parameters such as the size, ellipticity, and intensity distribution uniformity of the light spot. The light spot state refers to the shape, size, intensity distribution, and other characteristics of the light spot on the surface of the high-intensity optical element being tested, reflecting the collimation of the optical path and the performance of the element.

[0097] By activating the laser and observing the spot state using a spot analyzer, the correctness of the optical path and the accuracy of the parameters are ensured. In one possible implementation, the optical path is first pre-adjusted using a red indicator light (200μW) coaxial with the laser to ensure that the center of the spot coincides with the target point on the surface of the high-power element. The red indicator light is a low-power visible light used to initially adjust the optical path before activating the high-power laser, ensuring the accuracy of the spot position. Subsequently, the spot image is captured in real time by the spot analyzer, and the system automatically analyzes the spot size (X / Y diameter error ±0.1mm), ellipticity (major axis / minor axis ratio), and intensity distribution uniformity (grayscale value standard deviation ≤10%). If the spot shows blurred edges or a shift in the energy concentration area, irradiation must be paused and the optical path collimation checked to ensure that the spot quality meets the requirements.

[0098] Step S02: Adjust the focusing lens located in front of the laser until the light spot state meets the preset light spot quality conditions.

[0099] By adjusting the adjustable focusing lens in front of the laser output, the focusing state of the beam is changed, allowing parameters such as the size, ellipticity, and intensity distribution uniformity of the beam to meet preset quality conditions. A focusing lens is an optical element used to adjust the focusing state of a laser beam; by adjusting its position and angle, the size and shape of the beam spot can be changed. Preset beam quality conditions refer to the standard values ​​for parameters such as beam size, ellipticity, and intensity distribution uniformity set during the debugging process, used to determine whether the beam spot meets the requirements.

[0100] By adjusting the focusing lens, the beam spot condition is brought to a preset quality level, ensuring the optimal state of the optical path. In one possible implementation, the beam focusing state is changed by fine-tuning a knob, and the beam spot analyzer continuously provides feedback on the beam spot parameters. The system displays the dynamic curve of the beam spot size and ellipticity in real time. When the uniformity of the beam spot intensity distribution reaches a preset condition (e.g., grayscale standard deviation ≤ 8%), the focusing lens position is locked, completing the adjustment. After adjustment, the beam spot stability needs to be verified through five consecutive beam outputs to ensure that the beam spot center offset is less than 3% of the beam spot diameter, thereby guaranteeing the stability and reliability of the optical path.

[0101] In this embodiment, the laser is started by preset laser parameters, and the spot state is observed using a spot analyzer, ensuring the accuracy of the optical path. Adjusting the focusing lens located before the laser until the spot state meets the preset spot quality conditions optimizes parameters such as spot size, ellipticity, and intensity distribution uniformity. Fine-tuning the beam focusing state with a fine-tuning knob optimizes the spot quality, providing reliable optical path conditions for subsequent high-intensity optical element damage monitoring.

[0102] Based on the first and / or second embodiments of this application, a third embodiment of this application is proposed. In this third embodiment, content that is the same as or similar to the above embodiments can be referred to the above description, and will not be repeated hereafter.

[0103] In this embodiment, before step S30, the high-intensity light element damage monitoring method further includes steps A01~A02:

[0104] Step A01: Unify the data timestamps of the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature power time distribution diagram through the time axis linkage control;

[0105] The high-intensity optical element damage monitoring system uses a built-in time-axis linkage control to timestamp and synchronize data from the spot analyzer, infrared thermometer, and laser power meter, aiming to ensure the consistency and correlation of multi-source data across time. The time-axis linkage control is a software module used to coordinate and synchronize time information from different data sources, enabling the integration and analysis of data collected from different devices within a unified time frame. The spot analyzer, infrared thermometer, and laser power meter are responsible for acquiring spot images, temperature fields, and spot power data, respectively. These data may have different sampling rates; for example, the sampling rate for spot images and temperature data is 1Hz, while the sampling rate for power data is 0.67Hz.

[0106] Specifically, using the laser start-up time as the base time (T0), data is interpolated and aligned according to the sampling rate of each device. For example, data points collected by the power meter every 1.5 seconds are extended into a 1Hz sequence through linear interpolation, ensuring strict matching of the three devices on the same time axis. This interpolation alignment method effectively solves the problem of data point mismatch caused by different sampling rates, making the data consistent in the time dimension. Timestamp errors are controlled within ±10ms, and the clock offset of each device (e.g., a 50ms delay for the thermometer) is recorded by software logs and automatically compensated during the data analysis phase. Such error control and compensation mechanisms further improve the accuracy of data synchronization and ensure the reliability of subsequent analysis.

[0107] Step A02: Integrate the spot analysis diagram, temperature spatial distribution diagram, and temperature-power time distribution diagram after unifying the data timestamps into the same visualization interface.

[0108] Integrating synchronized multi-parameter data into a single visualization interface aims to provide users with an intuitive and comprehensive data analysis platform, facilitating the observation and analysis of the correlations and changes between spot, temperature, and power data. The visualization interface serves as the window for user interaction with the data; through a reasonable layout and design, it presents complex data in an intuitive and easy-to-understand manner. The interface employs a split-screen design: the upper half displays a spot analysis diagram with superimposed elliptical fitted contours and dimension annotations; the lower left half displays a pseudo-color heatmap superimposed with the temperature spatial distribution of the spot's position coordinates; and the lower right half displays a temperature-power time distribution diagram with dual vertical axis curves. Additionally, the visualization interface also includes laser parameter setting modules, specifically: laser power settings, laser emission time settings, laser emission interval time settings, and test count settings.

[0109] Exemplarily, three - figure linkage is achieved through a time - axis scroll bar. When dragging the time axis, the spot image, temperature field, and curve are synchronously updated to the corresponding moment. A "superimposed layer" button can also be provided, which can semi - transparently superimpose the temperature heat map and the spot contour, intuitively showing the correlation between the high - temperature area and the spot deformation. This superimposed display method helps to discover the potential connection between temperature changes and spot deformation, providing richer information for damage analysis. All charts support click - based interaction. For example, clicking on a high - temperature point in the temperature spatial distribution map can pop up an enlarged view of the corresponding area in the spot analysis map. This interaction function enhances the user's ability to explore data, enabling the user to deeply understand the detailed information of specific data points.

[0110] In this embodiment, through the built - in time - axis linkage control of the system, the data timestamps of the spot analyzer, infrared thermometer, and laser power meter are synchronized, eliminating the problem of inconsistent timestamps and improving the accuracy and reliability of data integration. The synchronized multi - parameter data is integrated into the same visualization interface, providing an intuitive and comprehensive data analysis platform for users. It enables users to simultaneously view the spot analysis map, temperature spatial distribution map, and temperature - power - time distribution map on the same interface, facilitating the observation and analysis of the correlations and changes between different parameters.

[0111] Based on the above embodiments of the present application, the fourth embodiment of the present application is proposed. In the fourth embodiment of the present application, for the same or similar content as the above embodiments, reference can be made to the above introduction and will not be elaborated hereinafter.

[0112] In this embodiment, the step S30 of monitoring the damage of the to - be - monitored high - intensity light element based on the spot analysis map, the temperature spatial distribution map, and the temperature - power - time distribution map may include steps S31 - S32:

[0113] Step S31, calculating the spot deformation degree in the spot analysis map based on the ellipse fitting algorithm, and analyzing the matching degree between the high - temperature area in the temperature spatial distribution map and the spot position in the spot analysis map;

[0114] Quantitative analysis of the spot deformation degree in the spot analysis map based on the ellipse fitting algorithm. First, extract the edge pixel points of the spot image, fit the optimal ellipse equation by the least - squares method, and calculate the ratio of the long axis to the short axis of the ellipse (ellipticity) and the center coordinates. The spot deformation degree refers to the shape change of the spot during laser irradiation, usually caused by element damage or thermal effects. The ellipse fitting algorithm quantifies the shape characteristics of the spot by fitting the edge pixel points of the spot image to an ellipse model. The ellipticity is defined as the ratio of the long axis to the short axis of the ellipse, which is used to describe the degree of deviation of the spot shape from a perfect circle. The center coordinates represent the geometric center position of the fitted ellipse.

[0115] Exemplarily, reference Figure 3 , Figure 3 The image shows a light spot analysis pattern under normal conditions. An ellipse fitting algorithm was used to calculate the ellipticity and center coordinates, resulting in a pattern similar to a normal circle / ellipse. For example... Figure 4 The light spot analysis diagram shown is illustrated under the condition of slight damage. Figure 5 The analysis diagram of the light spot under obvious damage shows that the ellipticity and center coordinates deviate from the normal circle / ellipse after calculation. The criterion for distinguishing between minor damage and obvious damage is the degree to which the ellipticity and center coordinates deviate from the normal circle / ellipse.

[0116] By spatially matching the high-temperature regions in the temperature spatial distribution map with the coordinates of the spot center in the spot analysis map, the offset distance between the centroid of the high-temperature region and the spot center is calculated. The high-temperature region refers to an area in the temperature spatial distribution map whose temperature is significantly higher than the ambient temperature, usually related to the thermal effects caused by laser irradiation. Spatial matching involves comparing the centroid position of the high-temperature region with the coordinates of the spot center and calculating the offset distance between them. If the offset exceeds a preset threshold (which can be set as a percentage of the spot diameter), it is determined to be an abnormal heat diffusion, and the offset direction and value are marked with a yellow arrow on the temperature distribution map. The matching degree result is displayed as a percentage, and an alarm is triggered when it falls below the preset matching degree threshold. This spatial matching and offset calculation method can effectively identify abnormal heat diffusion, providing important evidence for damage monitoring.

[0117] Step S32: Analyze the overall performance status of the high-intensity light element to be monitored by combining the degree of light spot deformation, the matching degree, and the slope change of the temperature-power-time distribution graph.

[0118] A multi-parameter collaborative analysis was performed, considering the degree of laser spot deformation, temperature matching degree, and the slope changes of the temperature-power time distribution plot. This multi-parameter collaborative analysis involves combining multiple parameters (such as the degree of laser spot deformation, temperature matching degree, temperature rise rate, and power fluctuation) to comprehensively assess the damage status of high-intensity optical components. The degree of laser spot deformation reflects the shape change of the component under laser irradiation; the temperature matching degree reflects the consistency between the high-temperature region and the laser spot position; and the slope changes of the temperature-power time distribution plot reflect the trends of temperature and power changes over time. By integrating these parameters, the degree of component damage can be determined more accurately.

[0119] By setting thresholds and logical conditions, multiple parameters are analyzed collaboratively. For example, when the spot ellipticity deviation reaches +15%, the high-temperature region matching degree is less than 80%, and the slope of the temperature-time curve increases sharply (e.g., 20℃ / s), the high-intensity laser element is determined to be in a significantly damaged state, the laser output is immediately cut off, and a damage report is generated. The damage report includes deformable parameters (e.g., ellipticity deviation value, high-temperature offset distance), dynamic trends (e.g., peak heating rate, power fluctuation amplitude), and damage mechanism speculation (e.g., coating peeling caused by thermal stress). If only a single parameter is abnormal (e.g., spot ellipticity deviation +8% but temperature matching degree 92%), it is marked as a "potential risk," and it is recommended to shorten the monitoring cycle or conduct a manual re-inspection. This multi-parameter collaborative analysis method can effectively improve the accuracy and reliability of damage monitoring, providing strong support for the safe use and maintenance of components.

[0120] In this embodiment, an ellipse fitting algorithm is used to quantify the degree of light spot deformation, enabling precise calculation of the ellipticity and center coordinates of the light spot. This method transforms light spot deformation into specific numerical indicators, facilitating subsequent damage assessment. By comprehensively analyzing multiple parameters—including the degree of light spot deformation, temperature matching degree, and the slope changes of the temperature-power time distribution plot—a more comprehensive evaluation of the overall performance status of the high-intensity light element can be achieved. This method avoids misjudgments that may result from judging a single parameter, thus improving the accuracy of damage assessment.

[0121] Based on the above embodiments of this application, a fifth embodiment of this application is proposed. In this fifth embodiment, content that is the same as or similar to that in the above embodiments can be referred to the above description, and will not be repeated hereafter.

[0122] In this embodiment, after step S30 of performing damage monitoring on the high-intensity light element to be monitored based on the light spot analysis map, the temperature spatial distribution map, and the temperature-power time distribution map, step S40 is further included:

[0123] Step S40: When any parameter in the component temperature, the spot power, or the spot image exceeds a preset damage threshold, the laser output of the laser is cut off.

[0124] By monitoring multiple key parameters in real time, rapid action can be taken to protect the high-intensity optical element from further damage in the event of parameter anomalies. Element temperature refers to the surface temperature of the high-intensity optical element under laser irradiation, and its preset damage threshold (e.g., 200℃) is set based on the element's heat resistance. Spot power refers to the power of the laser spot, and its preset damage threshold (e.g., power fluctuation ±5% or power value exceeding 600W) is determined based on the laser system's design parameters and the element's tolerance. Spot image parameters include spot ellipticity and edge discontinuity, and their preset damage thresholds (e.g., ellipticity deviation ±10% or edge discontinuity >30%) are set based on spot quality and element performance requirements.

[0125] During implementation, once the component temperature exceeds the preset damage threshold, the system immediately sends a shutdown command to the laser, cutting off continuous laser output. Simultaneously, the system locks the current temperature field data and saves it to a local log file for later analysis.

[0126] For example, regarding the spot power parameter, if the Lynk laser power meter detects an instantaneous power fluctuation exceeding a preset damage threshold, an emergency shutdown is triggered, and the abnormal time point is marked on the temperature-power-time distribution graph. For the spot image parameter, the spot ellipticity is calculated in real-time using an ellipse fitting algorithm. If the deviation exceeds a preset damage threshold or the spot fragments, or the edge discontinuity is greater than the preset damage threshold, it is determined to be deformation exceeding the limit, irradiation is automatically stopped, and the current spot analysis graph is saved. All shutdown operations have a response delay of less than 0.5 seconds, and after shutdown, the optical path must be recalibrated using a red indicator light before the experiment can be restarted, ensuring the safety of subsequent operations.

[0127] In this embodiment, by monitoring the component temperature, spot power, and spot image parameters in real time, the system can quickly respond and cut off the laser output when any parameter exceeds a preset damage threshold. This rapid response mechanism effectively prevents the high-intensity light component from continuing to operate under abnormal conditions, thereby preventing further damage to the component and significantly reducing the risk of damage to the component under abnormal conditions.

[0128] For example, to help understand the implementation flow of the high-intensity light element damage monitoring method in the above embodiments of this application, please refer to... Figure 6 and Figure 7 , Figure 6 This is a schematic diagram of the high-intensity light element damage monitoring system of this application. Figure 7 This is a schematic diagram of the overall process of the high-intensity light element damage monitoring method of this application.

[0129] like Figure 6As shown, the high-intensity optical component damage monitoring system mainly includes: laser 1, infrared thermometer 2, spot analyzer 3, interface-type laser power meter 4, 2 / 3 / 4 together form a data acquisition module, and 5 is a working computer, i.e., a data analysis module. In addition, the high-intensity optical component damage monitoring system also includes an adjustable focusing lens 6, a beam splitter 8, and attenuators 9 and 7, representing the high-intensity optical component under test.

[0130] like Figure 7 As shown, the overall test is divided into two parts: the debugging of the monitoring system and the monitoring of the high-intensity light element. The debugging process is as follows: first, a high-intensity light element is placed for debugging, the position of the focusing lens is adjusted, the laser parameters are set and the laser is started, and the quality of the light spot on the high-intensity light element is analyzed by the light spot analysis system to see if it meets the requirements. If it does not meet the requirements, the light spot is adjusted by fine-tuning the focusing lens. After the requirements are met, the position of the focusing lens is fixed.

[0131] The main process for monitoring high-intensity light sources is as follows: First, the high-intensity light source to be monitored is fixed, the damage threshold of the high-intensity light source is set, and the laser parameters are set and the laser is started. At this time, the infrared thermometer, power meter, and spot analyzer begin recording and send the recorded data to the working computer, where the temperature and power change curves can be displayed. When any parameter exceeds the set damage threshold, the working computer sends a stop command to the laser, the laser stops working, and data recording also stops.

[0132] It should be noted that the above examples are only for understanding this application and do not constitute a limitation on the high-intensity light element damage monitoring method of this application. Any simple modifications based on this technical concept are within the protection scope of this application.

[0133] This application also provides a high-intensity light element damage monitoring device, please refer to... Figure 8 The high-intensity light element damage monitoring device includes:

[0134] Laser module 10 is used to irradiate the high-intensity light element to be monitored;

[0135] Data acquisition module 20 is used to acquire the element temperature, spot power and spot image of the high-intensity light element to be monitored during irradiation;

[0136] The data analysis module 30 is used to generate a spot analysis map, a temperature spatial distribution map, and a temperature power time distribution map based on the element temperature, the spot power, and the spot image, and to perform damage monitoring on the high-intensity light element to be monitored based on the spot analysis map, the temperature spatial distribution map, and the temperature power time distribution map.

[0137] The high-intensity light element damage monitoring device provided in this application, employing the high-intensity light element damage monitoring method in the above embodiments, can solve the technical problem of high-intensity light element damage monitoring. Compared with the prior art, the beneficial effects of the high-intensity light element damage monitoring device provided in this application are the same as those of the high-intensity light element damage monitoring method provided in the above embodiments, and other technical features in the high-intensity light element damage monitoring device are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0138] This application provides a high-intensity light element damage monitoring device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the high-intensity light element damage monitoring method in the first embodiment described above.

[0139] The following is for reference. Figure 9 The diagram illustrates a structural schematic suitable for implementing a high-intensity light element damage monitoring device according to embodiments of this application. The high-intensity light element damage monitoring device in embodiments of this application may include, but is not limited to, mobile terminals such as mobile phones, laptops, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Description), PMPs (Portable Media Players), in-vehicle terminals (e.g., in-vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 9 The illustrated high-intensity light element damage monitoring device is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of this application.

[0140] like Figure 9As shown, the high-intensity light element damage monitoring device may include a processing unit 1001 (e.g., a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory 1002 or a program loaded from a storage device 1003 into a random access memory 1004. The random access memory 1004 also stores various programs and data required for the operation of the high-intensity light element damage monitoring device. The processing unit 1001, the read-only memory 1002, and the random access memory 1004 are interconnected via a bus 1005. An input / output interface 1006 is also connected to the bus. Typically, the following systems can be connected to the input / output interface 1006: input devices 1007 including, for example, a touch screen, touchpad, keyboard, mouse, image sensor, microphone, accelerometer, gyroscope, etc.; output devices 1008 including, for example, a liquid crystal display (LCD), speaker, vibrator, etc.; storage devices 1003 including, for example, magnetic tape, hard disk, etc.; and communication devices 1009. Communication device 1009 allows the high-intensity light element damage monitoring device to communicate wirelessly or wiredly with other devices to exchange data. Although the figure shows high-intensity light element damage monitoring devices with various systems, it should be understood that implementation or possession of all the systems shown is not required. More or fewer systems may be implemented alternatively.

[0141] Specifically, according to the embodiments disclosed in this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments disclosed in this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from storage device 1003, or installed from read-only memory 1002. When the computer program is executed by processing device 1001, it performs the functions defined in the methods of the embodiments disclosed in this application.

[0142] The high-intensity light element damage monitoring device provided in this application, employing the high-intensity light element damage monitoring method described in the above embodiments, can solve the technical problem of high-intensity light element damage monitoring. Compared with the prior art, the beneficial effects of the high-intensity light element damage monitoring device provided in this application are the same as those of the high-intensity light element damage monitoring method provided in the above embodiments, and other technical features of this high-intensity light element damage monitoring device are the same as those disclosed in the method of the previous embodiment, and will not be repeated here.

[0143] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0144] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

[0145] This application provides a computer-readable storage medium having computer-readable program instructions (i.e., a computer program) stored thereon, which are used to execute the high-intensity light element damage monitoring method in the above embodiments.

[0146] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems or devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0147] The aforementioned computer-readable storage medium may be included in the high-intensity light element damage monitoring device; or it may exist independently and not assembled into the high-intensity light element damage monitoring device.

[0148] The aforementioned computer-readable storage medium carries one or more programs. When the aforementioned one or more programs are executed by the high-intensity light element damage monitoring device, the high-intensity light element damage monitoring device causes the following: activating the laser to irradiate the high-intensity light element to be monitored, and acquiring the element temperature, spot power, and spot image of the high-intensity light element to be monitored during the irradiation process through the data acquisition module; generating a spot analysis map, a temperature spatial distribution map, and a temperature power time distribution map based on the element temperature, the spot power, and the spot image; and performing damage monitoring on the high-intensity light element to be monitored based on the spot analysis map, the temperature spatial distribution map, and the temperature power time distribution map.

[0149] Computer program code for performing the operations of the present application may be written in one or more programming languages, or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0150] The flow charts and block diagrams in the accompanying drawings illustrate the possible architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, program segment or a part of code, and the module, program segment or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order than that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0151] The modules described in the embodiments of the present application may be implemented in software or hardware, wherein the name of a module does not necessarily limit the unit itself.

[0152] The readable storage medium provided in this application is a computer-readable storage medium that stores computer-readable program instructions (i.e., a computer program) for executing the above-described high-intensity light element damage monitoring method, thereby solving the technical problem of high-intensity light element damage monitoring. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the high-intensity light element damage monitoring method provided in the above embodiments, and will not be repeated here.

[0153] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the high-intensity light element damage monitoring method described above.

[0154] The computer program product provided in this application can solve the technical problem of high-intensity light element damage monitoring. Compared with the prior art, the beneficial effects of the computer program product provided in this application are the same as those of the high-intensity light element damage monitoring method provided in the above embodiments, and will not be repeated here.

[0155] The above description is only part of the embodiments of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made by using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A method for monitoring damage to high-intensity light components, applied to a high-intensity light component damage monitoring system, characterized in that, The high-intensity optical component damage monitoring system includes a laser, a data acquisition module, and a data analysis module; the high-intensity optical component damage monitoring method includes: The laser is activated to irradiate the high-intensity light element to be monitored, and the element temperature, spot power, and spot image of the high-intensity light element to be monitored are collected through the data acquisition module during the irradiation process. Generate a spot analysis map, a temperature spatial distribution map, and a temperature power temporal distribution map based on the component temperature, the spot power, and the spot image; Damage monitoring of the high-intensity light element to be monitored is performed based on the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature-power time distribution diagram. This step includes: The degree of light spot deformation in the light spot analysis diagram is calculated based on the ellipse fitting algorithm, and the matching degree between the high temperature region in the temperature spatial distribution diagram and the light spot position in the light spot analysis diagram is analyzed. By combining the degree of light spot deformation, the degree of matching, and the slope change of the temperature-power-time distribution diagram, a multi-parameter collaborative analysis is performed to analyze the overall performance status of the high-intensity light element to be monitored. The ellipse fitting algorithm quantifies the shape features of the spot image by fitting the edge pixels of the spot image in the spot analysis map to an ellipse model. The step of analyzing the matching degree between the high-temperature region in the temperature spatial distribution map and the spot position in the spot analysis map includes: spatially matching the high-temperature region in the temperature spatial distribution map with the center coordinates of the spot in the spot analysis map, and calculating the offset distance between the centroid of the high-temperature region and the center of the spot.

2. The high-intensity light element damage monitoring method as described in claim 1, characterized in that, Before the step of irradiating the high-intensity light element to be monitored with the laser and collecting the element temperature, spot power, and spot image of the high-intensity light element during the irradiation process through the data acquisition module, the following steps are included: The laser is activated according to the preset laser parameters to irradiate the debugging high-intensity light element, and the light spot status on the debugging high-intensity light element is observed by the light spot analyzer. Adjust the focusing lens located in front of the laser until the light spot condition meets the preset light spot quality conditions.

3. The high-intensity light element damage monitoring method as described in claim 1, characterized in that, The data acquisition module includes an infrared thermometer, a spot analyzer with an attenuator, and an interface-type laser power meter. The steps of acquiring the element temperature, spot power, and spot image of the high-intensity light element to be monitored during irradiation through the data acquisition module include: The infrared thermometer is controlled to measure the temperature of the high-intensity light element on the central axis of the high-intensity light element to be monitored, thereby obtaining the temperature of the element; The spot image of the high-intensity light element to be monitored is acquired by the spot analyzer. The spot power of the high-intensity light element to be monitored is collected by the interface-type laser power meter.

4. The high-intensity light element damage monitoring method as described in claim 1, characterized in that, The step of generating a spot analysis map, a temperature spatial distribution map, and a temperature power temporal distribution map based on the element temperature, the spot power, and the spot image includes: The size of the spot image is calibrated according to the photosensitive area and resolution of the spot analyzer. Image processing algorithms are used to identify the size parameters of the size-calibrated spot image and extract the spot intensity distribution data. The size parameters and the intensity distribution data of the spot are comprehensively displayed on the spot image after size calibration to form a spot analysis map; The temperature of the component is mapped onto the two-dimensional plane where the high-intensity light component to be monitored is located, generating a temperature spatial distribution map; The element temperature and the spot power are correlated with the time axis to generate a temperature-power time distribution map.

5. The high-intensity light element damage monitoring method as described in claim 1, characterized in that, Before the step of performing damage monitoring on the high-intensity light element based on the light spot analysis map, the temperature spatial distribution map, and the temperature-power time distribution map, the method further includes: The time axis linkage control unifies the data timestamps of the light spot analysis diagram, the temperature spatial distribution diagram, and the temperature power time distribution diagram; The spot analysis diagram, temperature spatial distribution diagram, and temperature-power time distribution diagram after unifying the data timestamps are integrated into the same visualization interface.

6. The high-intensity light element damage monitoring method as described in claim 1, characterized in that, Following the step of performing damage monitoring on the high-intensity light element based on the light spot analysis map, the temperature spatial distribution map, and the temperature-power time distribution map, the method further includes: When any parameter in the component temperature, the spot power, or the spot image exceeds a preset damage threshold, the laser output of the laser is cut off.

7. A high-intensity light element damage monitoring system, characterized in that, The high-intensity light element damage monitoring system includes: Lasers are used to irradiate the high-intensity light components to be monitored. The data acquisition module is used to acquire the element temperature, spot power, and spot image of the high-intensity light element to be monitored during the irradiation process; The data analysis module is used to generate a spot analysis map, a temperature spatial distribution map, and a temperature-power time distribution map based on the component temperature, the spot power, and the spot image. Damage monitoring is performed on the high-intensity light component to be monitored based on these maps. The data analysis module is also used to calculate the degree of spot deformation in the spot analysis map using an ellipse fitting algorithm, and to analyze the matching degree between the high-temperature region in the temperature spatial distribution map and the spot position in the spot analysis map. The ellipse fitting algorithm quantifies the shape features of the spot image by fitting the edge pixels of the spot image in the spot analysis map to an ellipse model. Multi-parameter collaborative analysis is performed by combining the degree of spot deformation, the matching degree, and the slope change of the temperature-power time distribution map to analyze the overall performance status of the high-intensity light component to be monitored. The data analysis module is also used to spatially match the high-temperature region in the temperature spatial distribution map with the center coordinates of the spot in the spot analysis map, and to calculate the offset distance between the centroid of the high-temperature region and the center of the spot.

8. A storage medium, characterized in that, The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, it implements the steps of the high-intensity light element damage monitoring method as described in any one of claims 1 to 6.

9. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements the steps of the high-intensity light element damage monitoring method as described in any one of claims 1 to 6.

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