An evaluation method for low-power consumption in laser control

Abstract

The application discloses a kind of evaluation methods for laser control low-power use energy, belong to laser cutting technical field.The application obtains the output power and moving speed that each cutting point on cutting path should adopt according to cutting thickness parameter, compare the output power, moving speed with the set output power and set moving speed generated directly in cutting control system according to plate thickness information, and further obtain the score of the reduction of power consumption effect that can be accurately reflected in set output power and moving speed, simultaneously, according to distance representation parameter, obtain the cutting distance that each cutting point on cutting path should adopt, compare the cutting distance with the set cutting distance generated directly in cutting control system according to plate thickness information, and further obtain the score of the reduction of power consumption effect that can be accurately reflected in set cutting distance, the comprehensive score is obtained by summing up two scores, accurate evaluation of the reduction of power consumption mode controlled by laser assembly is realized.

Description

Technical Field

[0001] This invention relates to the field of laser cutting technology, and more specifically to an evaluation method for low-power consumption in laser control. Background Technology

[0002] Laser cutting is primarily based on the high energy density of laser light, achieving cutting through a laser assembly. This assembly includes a laser generator and a laser head. The laser generator produces a high-energy laser beam, which, after being focused by the optical path system, forms an extremely small spot with a very high power density. When this high-power-density laser beam irradiates the material surface, the material rapidly absorbs the laser energy, and its surface temperature instantly rises to its melting point, boiling point, or ignition point, causing the material to melt, vaporize, or burn. Simultaneously, an auxiliary gas (such as oxygen or nitrogen) is ejected coaxially with the laser through the nozzle of the laser head, blowing away the molten material and thus achieving cutting. Depending on the method of material removal during the cutting process, laser cutting can be categorized into vaporization cutting, melting cutting, and reaction cutting. Laser cutting offers numerous advantages, such as high cutting precision, high cutting speed, small heat-affected zone, good cut surface quality, wide applicability, non-contact processing, and high automation.

[0003] Generally, for plates of different thicknesses, in order to reduce power consumption, after planning the cutting path of the plate, the thickness of the plate is input into the cutting control system according to the plate thickness information. The system automatically generates the corresponding set output power, set moving speed, and set cutting distance. After clicking execute, the laser head will drive the nozzle along the preset cutting path and cut the current plate using the set output power, set moving speed, and set cutting distance.

[0004] Accurate evaluation of the aforementioned power reduction methods is rarely addressed in existing technologies. Therefore, this invention proposes a method for evaluating low-power consumption in laser control. Summary of the Invention

[0005] The technical problem to be solved by this invention is: how to accurately evaluate the power consumption reduction methods in existing laser cutting operations, and provides an evaluation method for low power consumption of laser control, which is used to accurately evaluate the power consumption reduction methods in the prior art by controlling laser components (controlling output power, moving speed, cutting distance).

[0006] The present invention solves the above-mentioned technical problems through the following technical solution, and the present invention includes the following steps:

[0007] S1: Obtaining Cutting Thickness Parameters

[0008] Before the cutting work begins, the cutting thickness parameter detection module uses a distance sensor to detect the thickness of the material to be cut along the preset cutting path to obtain the cutting thickness parameter.

[0009] S2: Obtaining Distance Representation Parameters

[0010] During the cutting process along the preset cutting path by the laser head, the distance characterization parameter detection module uses multiple cameras set around the nozzle to detect the light spot formed by the laser beam on the surface of the material to be cut, and obtains the distance characterization parameters.

[0011] S3: First Rating Acquired

[0012] The output power P to be used at each cutting point on the cutting path is obtained based on the cutting thickness parameter. i With moving speed V i The output power P i Movement speed V i The output power P directly generated in the cutting control system based on the plate thickness information 设定 Movement speed V 设定 Compare the results and obtain the first score T1;

[0013] S4: Second score acquisition

[0014] The cutting distance D to be used at each cutting point on the cutting path is obtained based on the distance characterization parameter. i Cutting distance D i The cutting distance D is directly generated in the cutting control system based on the plate thickness information. 设 Compare the scores and obtain the second score T2.

[0015] S5: Overall Score Calculation

[0016] The comprehensive score T is calculated based on the first score T1 and the second score T2. total T total The sum of the first score T1 and the second score T2 is used to evaluate the methods for reducing power consumption during laser cutting.

[0017] Furthermore, in step S1, the cutting thickness parameter detection module includes a thickness detection unit and a cutting thickness parameter calculation unit. The thickness detection unit includes an upper distance sensor, a lower distance sensor, and a moving frame. The upper and lower distance sensors are respectively installed on the upper and lower ends of the moving frame, located above and below the material to be cut. The upper and lower distance sensors are coaxially arranged, and when detecting the thickness of the material to be cut, they move synchronously under the drive of the moving frame. The cutting thickness parameter calculation unit is used to calculate the cutting thickness parameter based on the detection results of the upper and lower distance sensors.

[0018] Furthermore, both the upper and lower ranging sensors are ultrasonic ranging sensors.

[0019] Furthermore, the specific processing procedure in the cutting thickness parameter calculation unit is as follows:

[0020] S11: The preset cutting path on the upper surface of the plate to be cut is considered to be composed of n cutting points, where n is a positive integer;

[0021] S12: Obtain the distance detection results from the upper and lower distance sensors at each cutting point along the cutting path, denoted as d. 1i d 2i , where i represents the i-th cutting point;

[0022] S13: The distance between the ends of the upper and lower ranging sensors is a constant and known value, denoted as d0. The cutting thickness parameter is calculated using the following formula:

[0023] d ci =d0-d 1i -d 2i

[0024] Where, d ci This is the cutting thickness parameter at the i-th cutting point on the cutting path.

[0025] Furthermore, in step S2, the distance characterization parameter detection module includes an image acquisition unit, a spot recognition unit, and a distance characterization parameter acquisition unit. The image acquisition unit uses multiple cameras arranged around the nozzle to capture multiple spot images formed by the laser beam on the surface of the material to be cut at the current cutting point. The spot recognition unit is used to detect and recognize the spot in each spot image using a trained spot detection model, and obtain the position information of the spot detection box in the corresponding spot image. The distance characterization parameter acquisition unit is used to obtain the distance characterization parameter based on the position information of the spot detection box in the corresponding spot image.

[0026] Furthermore, multiple cameras are arranged at equal intervals, with their optical axes parallel to the axis of the nozzles and all set in the vertical direction.

[0027] Furthermore, the specific processing procedure in the distance representation parameter acquisition unit is as follows:

[0028] S21: Obtain the position information of the spot detection box in the corresponding spot image, wherein the position information of the spot detection box in the corresponding spot image refers to the coordinates of the upper left corner and lower right corner of the spot detection box in the corresponding spot image;

[0029] S22: Based on the coordinates of the upper left and lower right corners of the spot detection boxes in each spot image, calculate the pixel area of ​​each spot detection box, denoted as XS. i,j , where j represents the location of the j-th light spot image;

[0030] S23: Calculate the pixel area XS of each spot detection box. i,j The average value is used as the distance representation parameter at each cutting point, and the calculation formula is as follows:

[0031] XS i,svge =(XS i,1 +XS i,2 +……+XS i,j-1 +XS i,j ) / j

[0032] Among them, XS i,svge Let XS be the pixel area of ​​each spot detection box at the i-th cutting point. i,j The average value.

[0033] Furthermore, in step S3, the specific processing procedure is as follows:

[0034] S31: Based on the cutting thickness parameters, search and compare the preset power and speed adjustment database to obtain the output power P that should be used at each cutting point on the cutting path. i With moving speed V i The power and speed adjustment database stores the mapping relationship between different cutting thickness parameters and output power and moving speed.

[0035] S32: The output power P that should be used at each cutting point i With output power P 设定 By performing a difference comparison, the output power difference at each cut point is obtained and denoted as P. ci At the same time, the moving speed V that should be used at each cutting point i With moving speed V 设定 By performing a difference comparison, the difference in moving speed at each cutting point is obtained and denoted as V. ci ;

[0036] S33: Calculate the output power difference P at each cutting point. ci Standard deviation P c-sd Simultaneously calculate the difference in moving speed V at each cutting point. ci Standard deviation V c-sd ;

[0037] S34: Calculate the standard deviation P c-sd With standard deviation V c-sd The product of these two products yields the standard deviation product PV. sd According to the product of standard deviations PV sd A search and comparison is performed in the preset first rating database to obtain the first rating T1. The first rating database stores the mapping relationship between different standard deviation products and the second rating.

[0038] Furthermore, in step S4, the specific processing procedure is as follows:

[0039] S41: Based on the distance characterization parameters, search and compare in the preset cutting distance adjustment database to obtain the cutting distance D that should be used at each cutting point on the cutting path. i Among them, the cutting distance adjustment database stores the mapping relationship between different distance characterization parameters and cutting distance;

[0040] S42: The cutting distance D to be used at each cutting point i With cutting distance D 设定 By performing a difference comparison, the difference in cutting distance at each cutting point is obtained and denoted as D. ci ;

[0041] S43: Calculate the difference in cutting distance D at each cutting point. ci Standard deviation D c-sd ;

[0042] S44: Based on standard deviation D c-sd A search and comparison is performed in the preset second rating database to obtain the second rating T2. The second rating database stores the mapping relationship between the standard deviation of different cutting distance differences and the second rating.

[0043] Compared with the prior art, the present invention has the following advantages: This method for evaluating low-power consumption of laser control obtains the output power and moving speed that should be used at each cutting point on the cutting path based on the cutting thickness parameter. It compares the output power and moving speed with the set output power and set moving speed directly generated in the cutting control system based on the plate thickness information, thereby obtaining a score that accurately reflects the power reduction effect under the set output power and moving speed. At the same time, it obtains the cutting distance that should be used at each cutting point on the cutting path based on the distance characterization parameter, compares the cutting distance with the set cutting distance directly generated in the cutting control system based on the plate thickness information, thereby obtaining a score that accurately reflects the power reduction effect under the set cutting distance. The two scores are summed to obtain a comprehensive score, thus realizing an accurate evaluation of the power reduction method controlled by the laser component. Attached Figure Description

[0044] Figure 1 This is a schematic block diagram of the structure of the laser control low-power energy consumption evaluation system in this embodiment of the invention;

[0045] Figure 2 This is a schematic diagram of the thickness detection unit in an embodiment of the present invention;

[0046] Figure 3 This is a flowchart illustrating the evaluation method for low-power laser control in an embodiment of the present invention. Detailed Implementation

[0047] The embodiments of the present invention are described in detail below. These embodiments are implemented based on the technical solution of the present invention, and provide detailed implementation methods and specific operation processes. However, the scope of protection of the present invention is not limited to the following embodiments.

[0048] like Figure 1 As shown, this embodiment provides a technical solution: an evaluation system for low-power laser control, the evaluation system including the following modules: a cutting thickness parameter detection module, a distance characterization parameter detection module, a first evaluation module, a second evaluation module, and a comprehensive evaluation module.

[0049] In this embodiment, the cutting thickness parameter detection module is used to detect the thickness of the plate to be cut along a preset cutting path using a distance sensor before the cutting operation, and to obtain the cutting thickness parameter.

[0050] In more specific terms, such as Figure 2As shown, the cutting thickness parameter detection module includes a thickness detection unit and a cutting thickness parameter calculation unit. The thickness detection unit includes an upper distance sensor 11, a lower distance sensor 12, and a moving frame 13. The upper distance sensor 11 and the lower distance sensor 12 are respectively installed on the upper and lower ends of the moving frame 13, located above and below the material to be cut (placed horizontally). The upper distance sensor 11 and the lower distance sensor 12 are coaxially arranged. When detecting the thickness of the material to be cut, the upper distance sensor 11 and the lower distance sensor 12 move synchronously under the drive of the moving frame 13. The cutting thickness parameter calculation unit is used to calculate the cutting thickness parameter based on the detection results of the upper distance sensor 11 and the lower distance sensor 12.

[0051] More specifically, both the upper ranging sensor 11 and the lower ranging sensor 12 are ultrasonic ranging sensors.

[0052] More specifically, the moving frame 13 is controlled by a multi-axis robotic arm to move along a preset cutting path.

[0053] More specifically, the specific processing procedure in the cutting thickness parameter calculation unit is as follows:

[0054] Step 1: Consider the preset cutting path on the upper surface of the material to be cut as consisting of n cutting points, where n is a positive integer;

[0055] Step 2: Obtain the distance detection results from the upper distance sensor 11 and the lower distance sensor 12 at each cutting point along the cutting path, and denote them as d. 1i d 2i , where i represents the i-th cutting point;

[0056] Step 3: The distance between the end of the upper distance sensor 11 and the end of the lower distance sensor 12 is a constant and known value, denoted as d0. The cutting thickness parameter is calculated using the following formula:

[0057] d ci =d0-d 1i -d 2i

[0058] Where, d ci This is the cutting thickness parameter at the i-th cutting point on the cutting path.

[0059] It should be noted that in the prior art, for the same sheet material, the output power of the laser emitter, the moving speed of the laser head, and the distance between the nozzle tip and the upper surface of the sheet material at each cutting path are all fixed and the same. However, in reality, there will be certain errors in the processing of the sheet material, and its surface is not completely flat, which leads to slight differences in the thickness of the sheet material at different locations. Therefore, the present invention detects the thickness of the sheet material to be cut along the preset cutting path, obtains the actual thickness information at each cutting position on the sheet material, and then conducts subsequent evaluation of power consumption reduction methods.

[0060] In this embodiment, the distance characterization parameter detection module is used to detect the light spot formed by the laser beam on the upper surface of the material to be cut by multiple cameras arranged around the nozzle during the cutting process of the laser head along the preset cutting path, and obtain the distance characterization parameters.

[0061] More specifically, the distance characterization parameter detection module includes an image acquisition unit, a spot recognition unit, and a distance characterization parameter acquisition unit. The image acquisition unit uses multiple cameras arranged around the nozzle to capture multiple spot images formed by the laser beam on the surface of the material to be cut at the current cutting point. The spot recognition unit is used to detect and recognize the spot in each spot image using a trained spot detection model, and obtain the position information of the spot detection box in the corresponding spot image. The distance characterization parameter acquisition unit is used to obtain the distance characterization parameter based on the position information of the spot detection box in the corresponding spot image.

[0062] More specifically, in this embodiment, four cameras are arranged around the nozzle, with the four cameras spaced at equal intervals, and the optical axes of the four cameras are parallel to the axis of the nozzle and are all arranged in the vertical direction.

[0063] More specifically, in the spot recognition unit, the spot detection model is trained based on the SSD target detection network.

[0064] More specifically, the processing procedure in the distance representation parameter acquisition unit is as follows:

[0065] Step 1: Obtain the position information of the spot detection box in the corresponding spot image. The position information of the spot detection box in the corresponding spot image refers to the coordinates of the upper left corner and lower right corner of the spot detection box in the corresponding spot image.

[0066] Step 2: Based on the coordinates of the top-left and bottom-right corners of the spot detection boxes in each spot image, calculate the pixel area of ​​each spot detection box, denoted as XS. i,j , where j represents the location in the j-th light spot image, and in this embodiment j takes the values ​​1, 2, 3, or 4;

[0067] Step 3: Calculate the pixel area XS of each spot detection box. i,j The average value is used as the distance representation parameter at each cutting point, and the calculation formula is as follows:

[0068] XS i,svge =(XS i,1 +XS i,2 +……+XS i,j-1 +XS i,j ) / j

[0069] Among them, XS i,svge Let XS be the pixel area of ​​each spot detection box at the i-th cutting point. i,j The average value.

[0070] In this invention, the pixel area XS of each spot detection frame is cleverly used. i,j The average value is used as a distance representation parameter at each cutting point, which can provide more accurate data support for subsequent evaluation.

[0071] In this embodiment, the first evaluation module is used to obtain the output power P that should be used at each cutting point on the cutting path based on the cutting thickness parameter. i With moving speed V i The output power P i Movement speed V i The output power P directly generated in the cutting control system based on the plate thickness information 设定 Movement speed V 设定 By comparing and obtaining the first score T1, the power consumption reduction effect can be reflected under the set output power and movement speed.

[0072] More specifically, the processing procedure in the first evaluation module is as follows:

[0073] Step 1: Based on the cutting thickness parameters, search and compare the preset power and speed adjustment database to obtain the output power P that should be used at each cutting point on the cutting path. i With moving speed V i The power and speed adjustment database stores the mapping relationship between different cutting thickness parameters and output power and moving speed.

[0074] Step 2: Determine the output power P required for each cutting point. i With output power P 设定 By performing a difference comparison, the output power difference at each cut point is obtained and denoted as P. ci At the same time, the moving speed V that should be used at each cutting point i With moving speed V 设定By performing a difference comparison, the difference in moving speed at each cutting point is obtained and denoted as V. ci ;

[0075] Step 3: Calculate the output power difference P at each cutting point. ci Standard deviation P c-sd Simultaneously calculate the difference in moving speed V at each cutting point. ci Standard deviation V c-sd ;

[0076] Step 4: Calculate the standard deviation P c-sd With standard deviation V c-sd The product of these two products yields the standard deviation product PV. sd According to the product of standard deviations PV sd A search and comparison is performed in a preset first rating database to obtain a first rating T1. The first rating database stores the mapping relationship between different standard deviation products and the first rating. The larger the first rating T1, the better the power consumption reduction effect after cutting on the current material to be cut with the set output power and moving speed.

[0077] It should be noted that the power and speed adjustment database was obtained through multiple experimental calibrations, while the first scoring database was established by experts. Output power refers to the output power of the laser generator, and movement speed refers to the movement speed of the laser head.

[0078] In this embodiment, the second evaluation module is used to obtain the cutting distance D that should be used at each cutting point on the cutting path based on the distance characterization parameter. i Cutting distance D i The cutting distance D is directly generated in the cutting control system based on the plate thickness information. 设定 By comparing the results, the second score T2 is obtained, which reflects the power reduction effect under the set cutting distance;

[0079] More specifically, the processing procedure in the second evaluation module is as follows:

[0080] Step 1: Based on the distance characterization parameters, search and compare them in the preset cutting distance adjustment database to obtain the cutting distance D that should be used at each cutting point on the cutting path. i Among them, the cutting distance adjustment database stores the mapping relationship between different distance characterization parameters and cutting distance;

[0081] Step 2: Determine the cutting distance D for each cutting point. i With cutting distance D 设定 By performing a difference comparison, the difference in cutting distance at each cutting point is obtained and denoted as D. ci ;

[0082] Step 3: Calculate the difference D of the cutting distance at each cutting point. ci Standard deviation D c-sd ;

[0083] Step 4: Based on the standard deviation D c-sd A search and comparison is performed in a preset second rating database to obtain a second rating T2. This database stores the mapping relationship between the standard deviation of different cutting distance differences and the second rating. A larger second rating T2 indicates a better power reduction effect when cutting the current material at the set cutting distance.

[0084] It should be noted that the cutting distance adjustment database was obtained through multiple experimental calibrations, while the second scoring database was established by experts. The cutting distance refers to the distance between the tip of the laser head nozzle and the upper surface of the material.

[0085] In this embodiment, the comprehensive evaluation module is used to calculate and obtain a comprehensive score T based on the first score T1 and the second score T2. total T total The sum of the first score T1 and the second score T2 is reflected in the power reduction effect under the set output power, set movement speed and set cutting distance.

[0086] In this embodiment, after obtaining the first score T1 and the second score T2, new adjustment methods for output power, moving speed and cutting distance can be formulated as needed, such as real-time dynamic adjustment, which is beneficial for subsequent optimization design of power consumption reduction methods.

[0087] like Figure 3 As shown, this embodiment also provides an evaluation method for low-power laser control, implemented using the aforementioned evaluation system, including the following steps:

[0088] Step 1: Obtaining Cutting Thickness Parameters

[0089] Before the cutting work begins, the cutting thickness parameter detection module uses a distance sensor to detect the thickness of the material to be cut along the preset cutting path to obtain the cutting thickness parameter.

[0090] Step 2: Obtaining Distance Characterization Parameters

[0091] During the cutting process along the preset cutting path by the laser head, the distance characterization parameter detection module uses multiple cameras set around the nozzle to detect the light spot formed by the laser beam on the surface of the material to be cut, and obtains the distance characterization parameters.

[0092] Step 3: Obtaining the first score

[0093] The output power P to be used at each cutting point on the cutting path is obtained based on the cutting thickness parameter. i With moving speed V i The output power P i Movement speed V i The output power P directly generated in the cutting control system based on the plate thickness information 设定 Movement speed V 设定 Compare the results and obtain the first score T1;

[0094] Step 4: Obtaining the Second Score

[0095] The cutting distance D to be used at each cutting point on the cutting path is obtained based on the distance characterization parameter. i Cutting distance D i The cutting distance D is directly generated in the cutting control system based on the plate thickness information. 设 Compare the scores and obtain the second score T2.

[0096] Step 5: Calculate the overall score

[0097] The comprehensive score T is calculated based on the first score T1 and the second score T2. total T total The sum of the first score T1 and the second score T2 is used to evaluate the methods for reducing power consumption during laser cutting.

[0098] It should be noted that the specific process of the above steps is described in the evaluation system and will not be repeated here.

[0099] In summary, the laser control low-power evaluation system and method described in the above embodiments obtain the output power and moving speed that should be used at each cutting point on the cutting path based on the cutting thickness parameter. This output power and moving speed are compared with the set output power and set moving speed directly generated in the cutting control system based on the plate thickness information. This yields a score that accurately reflects the power reduction effect under the set output power and moving speed. Simultaneously, the cutting distance that should be used at each cutting point on the cutting path is obtained based on the distance characterization parameter. This cutting distance is compared with the set cutting distance directly generated in the cutting control system based on the plate thickness information. This yields a score that accurately reflects the power reduction effect under the set cutting distance. The two scores are summed to obtain a comprehensive score, thus achieving an accurate evaluation of the power reduction method controlled by the laser component.

[0100] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0101] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0102] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method of evaluating laser control low-power energy consumption, characterized by, The method comprises the following steps: S1: cutting thickness parameter acquisition Before the cutting work is performed, the cutting thickness parameter detection module detects the thickness of the to-be-cut plate along the preset cutting path by using the distance sensor, and acquires the cutting thickness parameter; S2: distance representation parameter acquisition In the process of cutting work performed by the laser head along the preset cutting path, the distance representation parameter detection module detects the light spot formed by the laser beam on the upper surface of the to-be-cut plate by using the multiple cameras arranged around the nozzle, and acquires the distance representation parameter; S3: first score acquisition According to the cutting thickness parameter, the output power P to be adopted by each cutting point on the cutting path is obtained i The moving speed V i The output power P i The moving speed V i The output power P 设定 The moving speed V 设定 A first score T1 is obtained by comparing the output power P and the moving speed V S4: second score acquisition According to the distance representation parameter, the cutting distance D to be taken by each cutting point on the cutting path is obtained i The cutting distance D i is compared with the cutting distance D 设定 generated in the cutting control system according to the plate thickness information, and a second score T2 is obtained S5: comprehensive score calculation The comprehensive score T is calculated according to the first score T1 and the second score T2 total , T total is the sum of the first score T1 and the second score T2, and the evaluation of the power reduction mode in the laser cutting process is realized. In the step S3, the specific processing process is as follows: S31: According to the cutting thickness parameter, a comparison is made in a preset power and speed adjustment database to obtain an output power P to be adopted at each cutting point on the cutting path i and the moving speed V i wherein the power and speed adjustment database stores a mapping relationship between different cutting thickness parameters and output powers and moving speeds. S32: Perform difference comparison between the output power P i and the output power P 设定 , to obtain the output power difference value of each cutting point, denoted as P ci . S33: Perform difference comparison between the moving speed V i and the moving speed V 设定 , to obtain the moving speed difference value of each cutting point, denoted as V ci . S33: calculate the output power difference value P of each cutting point ci the standard deviation P of the output power difference value P c-sd , and calculate the moving speed difference value V of each cutting point ci the standard deviation V of the moving speed difference value V c-sd ; S34: Calculate the standard deviation P c-sd The product of the standard deviation V c-sd The standard deviation product PV sd According to the standard deviation product PV sd In the preset first score database, find the first score T1, wherein the first score database stores the mapping relationship between different standard deviation products and the first score.

2. The method of claim 1, wherein the method further comprises: In the step S1, the cutting thickness parameter detection module comprises a thickness detection unit and a cutting thickness parameter calculation unit; wherein the thickness detection unit comprises an upper distance sensor, a lower distance sensor and a moving frame, the upper distance sensor and the lower distance sensor are respectively installed at the upper end and the lower end of the moving frame, and are respectively located above and below the to-be-cut plate, and the upper distance sensor and the lower distance sensor are coaxially arranged, and the upper distance sensor and the lower distance sensor are synchronously moved under the driving of the moving frame when detecting the thickness of the to-be-cut plate; the cutting thickness parameter calculation unit is used for calculating the cutting thickness parameter according to the detection results of the upper distance sensor and the lower distance sensor.

3. The method of claim 2, wherein the method further comprises: The upper distance sensor and the lower distance sensor are both ultrasonic distance sensors.

4. The method of claim 2, wherein the method further comprises: In the cutting thickness parameter calculation unit, the specific processing process is as follows: S11: the preset cutting path on the upper surface of the to-be-cut plate is regarded as being composed of n cutting points, wherein n is a positive integer; S12: Obtain the distance detection results of the upper distance sensor and the lower distance sensor at each cutting point on the cutting path, denoted as d 1i , d 2i , where i represents the i-th cutting point; S13: the distance between the end of the upper distance sensor and the end of the lower distance sensor is a constant value and is known, denoted as d0, and the cutting thickness parameter is calculated by the following formula: d ci = d0- d 1i - d 2i where d ci is the cutting thickness parameter at the i-th cutting point on the cutting path.

5. The method of claim 4, wherein, In the step S2, the distance representation parameter detection module comprises an image acquisition unit, a light spot identification unit and a distance representation parameter acquisition unit; the image acquisition unit captures the light spot formed by the laser beam on the upper surface of the to-be-cut plate at the current cutting point by using the multiple cameras arranged around the nozzle, and acquires multiple light spot images; the light spot identification unit is used for detecting and identifying the light spot in each light spot image by using the trained light spot detection model, and acquiring the position information of the light spot detection frame in the corresponding light spot image; The distance representation parameter acquisition unit is used for acquiring the distance representation parameter according to the position information of the light spot detection frame in the corresponding light spot image.

6. The method of claim 5, wherein the method further comprises: The multiple cameras are arranged at equal intervals, and the optical axes thereof are parallel to the axis of the nozzle, and are all arranged in the vertical direction.

7. The method of claim 5, wherein the method further comprises: In the distance representation parameter acquisition unit, the specific processing process is as follows: S21: the position information of the light spot detection frame in the corresponding light spot image is acquired, and the position information of the light spot detection frame in the corresponding light spot image refers to the coordinates of the upper left corner point and the lower right corner point of the light spot detection frame in the corresponding light spot image; S22: Calculate the pixel area of each light spot detection frame according to the coordinates of the top-left corner point and the bottom-right corner point of the light spot detection frame in each light spot image, denoted as XS i,j wherein j represents the jth light spot image; S23: Calculate the pixel area XS of each light spot detection frame i,j The average value of the distance between the two points is calculated as the distance representation parameter at each cutting point, and the formula is as follows: XS i,svge = (XS i,1 + XS i,2 +... + XS i,j-1 + XS i,j ) / j where XS i,svge is the average of the pixel area XS i,j of the individual light spot detection boxes at the i-th cut point.

8. The method of claim 1, wherein the method further comprises: In the step S4, the specific processing process is as follows: S41: According to the distance representation parameter, searching and comparing in the preset cutting distance adjustment database to obtain the cutting distance D to be adopted by each cutting point on the cutting path i Wherein, the cutting distance adjustment database stores different mapping relationships between distance representation parameters and cutting distances. S42: the cutting distance D to be adopted for each cutting point is determined i The cutting distance D 设定 The cutting distance difference D ci is obtained by making a difference comparison, and is recorded as S43: Calculate the cutting distance difference D of each cutting point ci of the standard deviation D c-sd ; S44: According to the standard deviation D c-sd A lookup comparison is performed in a preset second score database to obtain a second score T2, wherein the second score database stores a mapping relationship between standard deviations of different cutting distance difference values and second scores.

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