Power supply control device and control method of MCU (Microprogrammed Control Unit)

Abstract

The invention relates to the technical field of MCU power supply control, and discloses an MCU power supply control device and a control method, the MCU power supply control device comprises a power supply control box, a circuit board and a temperature control module, the power supply control box is provided with a wiring port and a ventilation port; the circuit board is arranged in the power supply control box; the temperature control module comprises a driving part, a guiding part, a moving part and an air cooling part, and the driving part is connected with the power supply control box; the guide piece is fixed in the power supply control box; the moving part is in sliding connection with the guide part, and the moving part is driven by the driving part to reciprocate along the guide part; and the air cooling piece is connected with the moving piece, and the air cooling piece and the moving piece synchronously reciprocate along the guide piece. When the interior of the power supply control box is cooled, the driving part drives the moving part to reciprocate along the guiding part, and the moving part drives the air cooling part to synchronously move, so that the purpose of uniformly cooling the interior of the power supply control box can be achieved, and the temperature of local equipment is effectively prevented from being too high.

Description

Technical Field

[0001] The present invention relates to the technical field of MCU power supply control, and in particular to a power supply control device and a control method for an MCU. Background Art

[0002] MCU is the abbreviation of microcontroller unit, also known as single-chip microcomputer or single-chip microcomputer. It is a computer system that integrates multiple functional modules such as central processing unit (CPU), memory, input and output interfaces on a single chip. MCU has the characteristics of small size, low power consumption and low cost, which makes it very suitable for application in various embedded systems. It can process various input signals according to pre-written programs and output corresponding control signals. The MCU can be powered by the MCU power control device, thereby ensuring that the MCU chip can accurately start each device.

[0003] Due to the ambient temperature, the MCU's own long-term operation, and the fact that fan modules can sometimes malfunction, if the chassis overheats, the MCU system performance may be degraded at best, or even burn out the board or even cause a fire. The current common practice is to set an alarm temperature threshold.

[0004] Chinese invention patent CN102523421B discloses a power control method and device for an MCU. When the MCU exits a meeting, the device shuts down the power of a designated processing module. When the MCU initiates a meeting, it powers the processing module selected based on the meeting requirements, eliminating the need to power other unselected processing modules. This solves the problem in related art where MCU power-off control can affect normal MCU operation, thereby controlling the MCU's temperature and extending its lifespan. The device also includes a fan to assist in heat dissipation.

[0005] However, the above device uses a single fan and a heat dissipation method to reduce energy consumption, and its heat dissipation effect is not ideal when the MCU power is high and the heat generated is large. Summary of the Invention

[0006] In view of this, the present invention provides a power control device and control method for an MCU to solve the problem that the existing MCU power control device uses a single fan and a heat dissipation method to reduce energy consumption, but its heat dissipation effect is not ideal when the MCU power is high and the heat generated is large.

[0007] In a first aspect, the present invention provides a power control device for an MCU, comprising:

[0008] A power control box, which is provided with wiring ports and ventilation ports;

[0009] A circuit board is arranged in the power control box;

[0010] Also includes a temperature control module; the temperature control module includes:

[0011] A driving member connected to the power control box;

[0012] A guide member, fixed in the power control box;

[0013] a moving member, slidably connected to the guide member, the moving member being driven by the driving member to reciprocate along the guide member;

[0014] The air-cooling part is connected to the moving part and reciprocates along the guide part synchronously with the moving part.

[0015] Beneficial effect: By providing a temperature control module, the temperature control module includes a driving part, a guide part, a moving part and an air-cooling part. The guide part is fixed in the power control box, and the moving part is slidably connected to the guide part. The guide part is provided to provide a guide for the movement of the moving part, that is, the moving part can only reciprocate along the guide part. The air-cooling part is connected to the moving part and reciprocates along the guide part synchronously with the moving part. When the inside of the power control box is cooled, the driving part drives the moving part to reciprocate along the guide part, and the moving part drives the air-cooling part to move synchronously, thereby achieving the purpose of uniformly dissipating heat inside the power control box and effectively preventing the local equipment from being overheated.

[0016] In an optional embodiment, the temperature control module further includes:

[0017] A turntable connected to the driving end of the driving member;

[0018] A connecting rod, one end of which is hinged to the moving part, and the other end of which is hinged to the turntable;

[0019] The turntable is configured to be driven by the driving member to rotate and pull the connecting rod to reciprocate, and the connecting rod pulls the moving member to reciprocate along the guide member.

[0020] Beneficial effects: In the temperature control module of the power control device of the MCU, the turntable serves as the transmission hub between the driving part and the moving part, and is directly connected to the driving end of the driving part. When the driving part is started, the rotational power it outputs is quickly transmitted to the turntable, driving the turntable to start stable rotation based on the rotation speed of the driving part. The connecting rod is used for force transmission and motion form conversion in the entire transmission system. One end of it is connected to the moving part in a hinged manner. This connection gives the connecting rod and the moving part a relatively flexible space for movement, ensuring that the two can work together during the movement without motion interference due to a rigid connection. The other end is also hinged to the turntable to convert the circular motion of the turntable into its own reciprocating motion.

[0021] In an optional embodiment, the temperature control module further includes a fixing seat, and the fixing seat is fixed to the bottom of the power control box;

[0022] The guide member and the driving member are both fixed on the fixing seat.

[0023] Benefits: The guide and drive components are both fixed to the mounting base, ensuring precise positioning. Furthermore, the mounting base centrally secures the guide and drive components to the bottom of the power control box, making the overall temperature control module layout more compact and streamlined. This compact layout not only saves space within the power control box and prevents interference between components, but also facilitates subsequent maintenance and repair.

[0024] In an optional embodiment, the number of the temperature control modules is two, and the two temperature control modules are respectively arranged on opposite sides of the circuit board.

[0025] In an optional embodiment, the power control box is provided with ventilation holes on one side of the two temperature control modules.

[0026] Beneficial Effects: Each vent is precisely positioned to face its corresponding temperature control module, specifically the area along which the air-cooling unit moves. This layout allows the unit to most effectively expel hot air from the power control box through the vents during its reciprocating motion. From a protective perspective, the vents are also equipped with dust screens. These effectively filter dust, impurities, and other tiny particles from the outside air, preventing them from entering the power control box and damaging circuit boards and other electronic components, while also minimizing air flow.

[0027] In an optional embodiment, a through slot is provided in the middle of the fixing seat, and an air outlet corresponding to the position of the through slot is provided at the bottom of the power control box; the power control device also includes a ventilation plate, which is fixed in the through slot.

[0028] In an optional embodiment, the temperature control module further includes heat dissipation fins, which are fixed in the through slots and disposed on the lower side of the ventilation plate.

[0029] In an optional embodiment, the temperature control module further includes:

[0030] A plate heat exchanger is fixed to the rear side of the power control box;

[0031] The water inlet pipe and the water return pipe are both suitable for communicating with a water source, and the water inlet pipe and the water return pipe are communicated with the interior of the plate heat exchanger.

[0032] Beneficial Effects: The temperature control module incorporates a plate heat exchanger, water inlet pipe, and return pipe, significantly expanding the module's heat dissipation capabilities. The plate heat exchanger is securely mounted to the rear of the power control box, enabling fast and efficient heat exchange. The water inlet pipe introduces low-temperature water into the plate heat exchanger, where it exchanges heat with the hot air inside the power control box. Specifically, the hot air is directed toward the plate heat exchanger via the air cooling element, where its heat is transferred to the cooler water inside the heat exchanger, thereby lowering the air temperature. Simultaneously, the heat-absorbed water flows back to the source through the return pipe for further cooling and reuse. The plate heat exchanger and the existing air cooling components work together to form a more comprehensive heat dissipation system. When the temperature inside the power control box is low, the air cooling element can simply circulate air to meet heat dissipation requirements. During this time, the plate heat exchanger can operate at a low flow rate or temporarily close some of its flow channels based on actual temperature conditions to reduce energy consumption. When the temperature rises to a certain level and the air cooling system is insufficient to dissipate heat quickly, the plate heat exchanger fully activates, increasing the water flow and heat exchange intensity, working together with the air cooling system to quickly reduce the temperature inside the box. This dual cooling mechanism works together to enable the temperature control module to cope with various complex working scenarios and different heat generation conditions.

[0033] In an optional embodiment, the temperature control module further includes a water tank, and the water inlet pipe and the water return pipe are connected to the water tank; a heat sink is provided on the water tank.

[0034] In a second aspect, the present invention further provides a power control method for an MCU, which is used for a power control device of the MCU, wherein the power control device of the MCU further includes a main control module, a temperature detection module, a power consumption estimation module, a power supply module, a voice control module, a video control module, a service processing module, a safety warning module, and a power display module. The method comprises the following steps:

[0035] Before the MCU chip starts, it inputs the duration and type of the meeting into the main control module, and then determines the voice control module, video control module or business processing module to be used according to the meeting type;

[0036] The power consumption is estimated by the power estimation module, and then the MCU chip is started. At this time, the specified module is started and accurately powered according to the started module. The other modules are in a power-off state.

[0037] At this time, the power supply control box is in operation, and the temperature sensor detects the temperature inside the power supply control box. When the temperature exceeds the threshold, the main control module drives the temperature control module to start;

[0038] When any device in the temperature control module is damaged, the safety warning module will sound an alarm while other modules operate normally, which will not affect the normal progress of the meeting. The equipment can be repaired after the meeting is completed.

[0039] Beneficial effects: Through the control of the voice control module, video control module, and business processing module by the main control module, the modules required for the meeting are selected for precise control, and the remaining modules are in a power-off state, thereby reducing energy consumption. The various structures of the temperature adjustment mechanism cooperate with each other to ensure the normal operation of the power control box, prevent equipment aging due to excessive temperature, and increase power consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0041] Figure 1 This is a front view of a power control device for an MCU according to an embodiment of the present invention;

[0042] Figure 2 This is a structural diagram of a plate heat exchanger in a power control device of an MCU according to an embodiment of the present invention;

[0043] Figure 3 This is a schematic diagram of the internal structure of a power control device of an MCU according to an embodiment of the present invention;

[0044] Figure 4 This is a structural diagram of a water tank in a power control device of an MCU according to an embodiment of the present invention;

[0045] Figure 5 Schematic diagram of another control method according to an embodiment of the present invention.

[0046] Description of reference numerals:

[0047] 1. Power control box; 2. Circuit board; 3. Wiring port; 4. Ventilation port; 501. Driving part; 502. Guide part; 503. Moving part; 504. Turntable; 505. Connecting rod; 506. Fixing seat; 507. Ventilation plate; 508. Heat sink fins; 509. Plate heat exchanger; 510. Water inlet pipe; 511. Water return pipe; 512. Water tank; 513. Heat sink; 514. Air cooling part; 6. Temperature sensor; 7. Dust screen. DETAILED DESCRIPTION

[0048] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0049] MCU is the abbreviation of microcontroller unit, also known as single-chip microcomputer or single-chip microcomputer. It is a computer system that integrates multiple functional modules such as central processing unit (CPU), memory, input and output interfaces on a single chip. MCU has the characteristics of small size, low power consumption and low cost, which makes it very suitable for application in various embedded systems. It can process various input signals according to pre-written programs and output corresponding control signals. The MCU can be powered by the MCU power control device, thereby ensuring that the MCU chip can accurately start each device.

[0050] Due to the ambient temperature, the MCU's own long-term operation, and the fact that fan modules can sometimes malfunction, if the chassis overheats, the MCU system performance may be degraded at best, or even burn out the board or even cause a fire. The current common practice is to set an alarm temperature threshold.

[0051] This conventional power control method and device turns off the power of a designated processing module when the MCU exits a meeting. When the MCU initiates a meeting, it powers the processing module selected based on the meeting requirements, without powering other unselected processing modules. This solves the problem in related technologies where MCU power-off control affects normal MCU operation, thereby controlling the MCU's temperature and extending its lifespan. The device also includes a fan to assist in heat dissipation.

[0052] However, the above device uses a single fan and a heat dissipation method to reduce energy consumption, and its heat dissipation effect is not ideal when the MCU power is high and the heat generated is large.

[0053] The following combination Figures 1 to 5 , describing embodiments of the present invention.

[0054] According to an embodiment of the present invention, on the one hand, a power control device for an MCU is provided, comprising a power control box 1, a circuit board 2 and a temperature control module, wherein the power control box 1 is provided with a wiring port 3 and a vent 4; the circuit board 2 is arranged in the power control box 1; the temperature control module comprises a driving member 501, a guide member 502, a moving member 503 and an air-cooling member 514, wherein the driving member 501 is connected to the power control box 1; the guide member 502 is fixed in the power control box 1; the moving member 503 is slidably connected to the guide member 502, and the moving member 503 is driven by the driving member 501 to reciprocate along the guide member 502; the air-cooling member 514 is connected to the moving member 503 and reciprocates along the guide member 502 synchronously with the moving member 503.

[0055] In this embodiment, a temperature control module is provided, which includes a driving member 501, a guide member 502, a moving member 503, and an air-cooling member 514. The guide member 502 is fixed within the power control box 1, and the moving member 503 is slidably connected to the guide member 502. The guide member 502 is provided to provide a guide for the movement of the moving member 503, that is, the moving member 503 can only reciprocate along the guide member 502. The air-cooling member 514 is connected to the moving member 503 and reciprocates along the guide member 502 synchronously with the moving member 503. When dissipating heat from the interior of the power control box 1, the driving member 501 drives the moving member 503 to reciprocate along the guide member 502, and the moving member 503 drives the air-cooling member 514 to move synchronously, thereby achieving the purpose of uniformly dissipating heat from the interior of the power control box 1 and effectively preventing local equipment from overheating.

[0056] The core components of the MCU power control device in this embodiment include a power control box 1, a circuit board 2, and a temperature control module. The power control box 1 serves as the housing and base carrier of the entire device, providing important physical support and protection. It is equipped with a wiring port 3 and a vent 4. The wiring port 3 allows the power control device to easily connect electrically to an external power source and other devices, enabling power input and signal transmission. The vent 4 provides a channel for heat dissipation within the device, helping to maintain internal temperature balance. The circuit board 2 is located within the power control box 1 and carries various electronic components and circuits. It processes, converts, and distributes the input power, providing the MCU with a stable power supply that meets the requirements and ensures its normal operation. A guide member 502 is fixed within the power control box 1, providing precise guidance for the movement of the moving member 503, ensuring that the moving member 503 can reciprocate along a predetermined trajectory. When the temperature within the power control box 1 rises, the driver 501 activates, driving the moving member 503 to reciprocate along the guide member 502, while the air cooling member 514 also moves synchronously. During its movement, air cooling element 514 continuously promotes air flow, causing hot air to be exhausted from vents 4 while cool air from the outside enters power control box 1 through vents 4, creating a circulating air flow. This effectively reduces the temperature within power control box 1, ensuring that circuit board 2 and other electronic components can operate at a suitable temperature, and improving the stability and reliability of the MCU power control device. Air cooling element 514 is a fan.

[0057] In one embodiment, Figure 3 As shown, the temperature control module also includes a turntable 504 and a connecting rod 505, the turntable 504 is connected to the driving end of the driving member 501; one end of the connecting rod 505 is hinged to the moving member 503, and the other end of the connecting rod 505 is hinged to the turntable 504; wherein, the turntable 504 is configured to be driven by the driving member 501 to rotate, and pull the connecting rod 505 to reciprocate, and the connecting rod 505 pulls the moving member 503 to reciprocate along the guide member 502.

[0058] In the temperature control module of the MCU's power control device, the turntable 504 serves as the transmission hub between the driver 501 and the moving member 503, directly connected to the drive end of the driver 501. When the driver 501 is activated, the rotational power it outputs is rapidly transmitted to the turntable 504, driving the turntable 504 to begin stable rotation based on the speed of the driver 501. The connecting rod 505 is used within the entire transmission system to transmit force and convert motion forms. One end of the turntable is connected to the moving member 503 in an articulated manner. This connection provides relatively flexible movement between the connecting rod 505 and the moving member 503, ensuring that the two can operate in coordination during movement without the motion interference caused by a rigid connection. The other end is also articulated to the turntable 504, converting the circular motion of the turntable 504 into its own reciprocating motion. During operation, as the driver 501 drives the turntable 504 to continuously rotate, the point on the turntable 504 where the connecting rod 505 is articulated moves in a circular trajectory around the center of the turntable 504. Due to the hinged nature of the two ends of the connecting rod 505, during the rotation of the turntable 504, the circular motion of the hinge point is transmitted through the connecting rod 505, forcing the connecting rod 505 to swing back and forth in space. At the same time, the end of the connecting rod 505 connected to the moving part 503, by virtue of the force of its reciprocating swing, pulls the moving part 503 to perform reciprocating linear motion along the guide member 502. During this process, the guide member 502 not only provides a precise track for the movement of the moving part 503, ensuring that the moving part 503 strictly reciprocates linearly in the predetermined direction and avoids motion deviation, but also can withstand the lateral force generated by the moving part 503 during the reciprocating process, ensuring the operational stability of the entire temperature control module. This transmission design based on the turntable 504 and the connecting rod 505 achieves a smooth conversion from the rotational motion of the driving part 501 to the linear reciprocating motion of the moving part 503 through a simple and reliable mechanical structure. Compared with complex electronic control or other transmission methods, it greatly reduces the probability of system failure and improves the reliability and stability of the temperature control module.

[0059] In one embodiment, the temperature control module further includes a fixing base 506, which is fixed to the bottom of the power control box 1; the guide member 502 and the driver 501 are both fixed to the fixing base 506. The guide member 502 and the driver 501 are both fixed to the fixing base 506, so that their installation positions can be accurately determined. In addition, the fixing base 506 centrally fixes the guide member 502 and the driver 501 to the bottom of the power control box 1, making the layout of the entire temperature control module more compact and reasonable. This compact layout not only saves space inside the power control box 1 and avoids mutual interference between the various components, but also facilitates subsequent maintenance and repair work.

[0060] In one embodiment, there are two temperature control modules, and the two temperature control modules are respectively arranged on opposite sides of the circuit board 2. The two temperature control modules each perform their own functions and work together. Since different areas of the circuit board 2 will generate different degrees of heat when it is working, it is often difficult to fully and efficiently dissipate the heat of the entire circuit board 2 by relying solely on a single temperature control module. When the two temperature control modules are respectively arranged on opposite sides of the circuit board 2, they can simultaneously perform targeted temperature adjustments on different areas of the circuit board 2. Compared with a single temperature control module, the overall temperature of the circuit board 2 can be reduced more quickly and comprehensively, effectively avoiding the occurrence of local overheating, and ensuring that all types of electronic components on the circuit board 2 can work stably in a suitable temperature environment, thereby significantly improving the operating stability and reliability of the MCU.

[0061] In one embodiment, a vent 4 is provided on one side of each of the two temperature control modules on the power control box 1. The position of each vent 4 is precisely planned to face the corresponding temperature control module, especially the movement trajectory area of ​​the air-cooling component 514. This layout enables the air-cooling component 514 to most effectively discharge the hot air in the power control box 1 to the outside through the vent 4 during the reciprocating motion. From a protection perspective, the vent 4 is also equipped with a dustproof net 7. The dustproof net 7 can effectively filter out tiny particles such as dust and impurities in the outside air, preventing them from entering the interior of the power control box 1 and causing damage to the circuit board 2 and other electronic components, without causing excessive resistance to air circulation.

[0062] In one embodiment, a through slot is provided in the middle of the fixing seat 506, and an air outlet corresponding to the position of the through slot is provided at the bottom of the power control box 1; the power control device further includes a ventilation plate 507, which is fixed in the through slot.

[0063] In one embodiment, the temperature control module further includes heat dissipation fins 508 , which are fixed in the through slots and disposed on the lower side of the ventilation plate 507 .

[0064] In one embodiment, the temperature control module also includes a plate heat exchanger 509, a water inlet pipe 510, and a water return pipe 511. The plate heat exchanger 509 is fixed to the rear of the power control box 1. The water inlet pipe 510 and the water return pipe 511 are adapted to connect to a water source and are in communication with the interior of the plate heat exchanger 509. The addition of the plate heat exchanger 509, the water inlet pipe 510, and the water return pipe 511 to the temperature control module significantly expands the module's heat dissipation capabilities. The plate heat exchanger 509 is securely fixed to the rear of the power control box 1, enabling fast and efficient heat exchange. The water inlet pipe 510 introduces low-temperature water into the plate heat exchanger 509, where the water exchanges heat with the hot air inside the power control box 1. Specifically, the hot air is directed to the vicinity of the plate heat exchanger 509 by the air-cooling element 514. The heat from the hot air is then transferred to the low-temperature water flow within the heat exchanger, thereby lowering the air temperature. Simultaneously, the water that has absorbed the heat flows back to the water source through the return pipe 511 for subsequent cooling and reuse. From the perspective of the coordinated operation of the overall temperature control module, the plate heat exchanger 509 and the existing air-cooling components work together to form a more comprehensive heat dissipation system. When the temperature inside the power control box 1 is low, the air-cooling element 514 can meet the heat dissipation requirements through simple air flow. At this time, the plate heat exchanger 509 can operate in a low-flow mode or temporarily close some flow channels based on the actual temperature to reduce energy consumption. When the temperature rises to a certain level and the air-cooling element 514 is insufficient to dissipate heat quickly, the plate heat exchanger 509 fully activates, increasing the water flow rate and heat exchange intensity, working together with the air-cooling element 514 to rapidly lower the temperature inside the box. The collaborative work of this dual heat dissipation mechanism enables the temperature control module to cope with various complex working scenarios and different heat generation situations.

[0065] In one embodiment, Figure 4As shown, the temperature control module also includes a water tank 512, which is connected to a water inlet pipe 510 and a water return pipe 511. A heat sink 513 is provided on the water tank 512. When the water inlet pipe 510 introduces the water flow, which has absorbed heat from the hot air in the power control box 1, into the water tank 512, the temperature of the water in the water tank 512 rises accordingly. At this point, the heat sink 513 on the water tank 512 begins to function. In this embodiment, the heat sink 513 is a cooling fan. When the fan is activated, it forces air flow, accelerating air renewal on the surface of the water tank 512 and significantly improving heat dissipation efficiency. The continuous operation of the heat sink 513 rapidly reduces the temperature of the water in the water tank 512, allowing it to be transported again through the return pipe 511 to the plate heat exchanger 509 for a new round of heat exchange. Alternatively, the heat sink 513 can be a heat sink designed with a maximized surface area to ensure sufficient contact with the outside air, accelerating heat conduction and dissipation. When the hot water in the water tank 512 flows near the heat sink 513, the heat is quickly transferred to the heat sink through heat conduction, and then the heat sink dissipates the heat into the surrounding air.

[0066] According to an embodiment of the present invention, on the other hand, a power control method of an MCU is provided, which is used for the power control device of the above-mentioned MCU. The power control device of the MCU also includes a main control module, a temperature detection module, a power estimation module, a power supply module, a voice control module, a video control module, a business processing module, a safety warning module, and a power display module: Figure 5 As shown, the method includes the following steps:

[0067] Before the MCU chip starts, it inputs the duration and type of the meeting into the main control module, and then determines the voice control module, video control module or business processing module to be used according to the meeting type;

[0068] The power consumption is estimated by the power estimation module, and then the MCU chip is started. At this time, the specified module is started and accurately powered according to the started module. The other modules are in a power-off state.

[0069] At this time, the power supply control box 1 for power supply is in operation, and the temperature sensor 6 will detect the temperature inside the power supply control box 1. When the temperature exceeds the threshold, the main control module drives the temperature control module to start;

[0070] When any device in the temperature control module is damaged, the safety warning module will sound an alarm while other modules operate normally, which will not affect the normal progress of the meeting. The equipment can be repaired after the meeting is completed.

[0071] Before the MCU chip boots up, the user first inputs the meeting duration and type into the main control module, which receives and analyzes this information. The meeting type input is particularly important, as different types of meetings require distinct functional modules. For example, a purely voice-based meeting may rely primarily on the voice control module; a meeting involving multiple parties via video calls would require the video control module to play a key role. For a meeting primarily focused on business data processing and analysis, the business processing module would be the core. Based on pre-set algorithms and rules, the main control module quickly determines which modules are required for the meeting, facilitating precise power supply and system resource allocation. Next, the power consumption estimation module comes into play. Based on the meeting duration, the expected module types, and the power consumption characteristics of each module, it uses an algorithm to estimate the required power consumption for the meeting. This accurate power consumption estimation enables the system to plan and allocate power resources in advance. After completing the power consumption estimation, the MCU chip officially boots up. At this point, the main control module accurately activates the designated modules based on the previously determined results. These activated modules quickly enter operation and begin providing the appropriate services for the meeting. At the same time, in order to avoid wasting energy, the remaining modules that are not needed temporarily are in a power-off state. This precise power supply method not only improves energy utilization efficiency, but also reduces the overall power consumption of the system, reduces heat generation, and creates good conditions for the stable operation of the system. As the power supply control box 1 for power supply starts working, the temperature sensor 6 immediately enters the working state and performs real-time and continuous detection of the temperature inside the power supply control box 1. Once it detects that the temperature exceeds the preset threshold, it will quickly feed this information back to the main control module. After receiving the temperature abnormality signal, the main control module immediately drives the temperature control module to start. The temperature control module responds quickly, and the various components inside it work together. The driver 501 rotates the turntable 504, which in turn reciprocates along the guide 502 via the connecting rod 505. The air cooling element 514 operates synchronously to accelerate air flow. The heat sink 508 quickly dissipates heat from the bottom of the circuit board 2, accelerating cooling within the power control box 1. Simultaneously, if the plate heat exchanger 509 is activated, the water circulation system within the water tank 512 also begins operating, lowering the water temperature via the heat sink 513. This allows for rapid temperature regulation within the power control box 1, ensuring that the entire power control device operates within an optimal temperature environment and preventing performance degradation or failure due to overheating. If any device within the temperature control module malfunctions during operation, the safety warning module will promptly issue an alarm. Using existing fault detection algorithms, the safety warning module can sensitively detect abnormal conditions within the temperature control module. Upon detecting a fault, it issues an alarm through various means, including sound and light, alerting maintenance personnel to promptly perform repairs. Meanwhile, other modules remain unaffected and continue to operate normally, ensuring that the meeting proceeds smoothly and uninterrupted.This design fully considers the stability and reliability of the system, ensuring the continued operation of critical services even in the event of equipment failure. After the meeting is completed, maintenance personnel can use the fault information provided by the security warning module to carry out targeted repairs on damaged equipment, greatly improving maintenance efficiency and reducing equipment downtime.

[0072] Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention. Such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A power control device for an MCU, comprising: A power control box (1) is provided with a wiring port (3) and a vent (4); A circuit board (2) is arranged in the power control box (1); It is characterized in that it also includes a temperature control module; the temperature control module includes: A driving member (501) connected to the power control box (1); A guide member (502) is fixed in the power control box (1); a moving member (503) slidably connected to the guide member (502), wherein the moving member (503) is driven by the driving member (501) to reciprocate along the guide member (502); An air-cooling member (514) is connected to the moving member (503) and reciprocates along the guide member (502) in synchronization with the moving member (503).

2. The power control device for MCU according to claim 1, wherein: The temperature control module further includes: A rotating disk (504) is connected to the driving end of the driving member (501); A connecting rod (505), one end of which is hinged to the moving member (503), and the other end of which is hinged to the rotating disk (504); The turntable (504) is configured to be driven by the driving member (501) to rotate and pull the connecting rod (505) to reciprocate, and the connecting rod (505) pulls the moving member (503) to reciprocate along the guide member (502).

3. The power control device for MCU according to claim 2, characterized in that: The temperature control module further comprises a fixing seat (506), wherein the fixing seat (506) is fixed to the bottom of the power control box (1); The guide member (502) and the driving member (501) are both fixed on the fixing seat (506).

4. The power control device of MCU according to any one of claims 1 to 3, characterized in that: The driving member (501), the guiding member (502), the moving member (503), the rotating disk (504) and the connecting rod (505) are two in number and are respectively arranged on opposite sides of the circuit board (2).

5. The power control device for MCU according to claim 4, characterized in that: The power control box (1) is provided with ventilation holes (4) on one side of the two temperature control modules.

6. The power control device for MCU according to claim 3, characterized in that: A through slot is provided in the middle of the fixing seat (506), and an air outlet corresponding to the position of the through slot is provided at the bottom of the power control box (1); the power control device further comprises a ventilation plate (507), and the ventilation plate (507) is fixed in the through slot.

7. The power control device for MCU according to claim 6, characterized in that: The temperature control module further comprises a heat dissipation fin (508), which is fixed in the through slot and arranged on the lower side of the ventilation plate (507).

8. The power control device of MCU according to any one of claims 1 to 3, characterized in that: The temperature control module also includes: A plate heat exchanger (509) is fixed to the rear side of the power control box (1); The water inlet pipe (510) and the water return pipe (511) are both suitable for communicating with a water source, and the water inlet pipe (510) and the water return pipe (511) are in communication with the interior of the plate heat exchanger (509).

9. The power control device for MCU according to claim 8, characterized in that: The temperature control module further comprises a water tank (512), the water inlet pipe (510) and the water return pipe (511) are in communication with the water tank (512); and a heat dissipation element (513) is provided on the water tank (512).

10. A method for controlling a power supply of an MCU, used for a power supply control device of an MCU according to any one of claims 1 to 9, wherein the power supply control device of the MCU further comprises a main control module, a temperature detection module, a power consumption estimation module, a power supply module, a voice control module, a video control module, a service processing module, a safety warning module, and a power display module: characterized in that: The method comprises the following steps: Before the MCU chip starts, it inputs the duration and type of the meeting into the main control module, and then determines the voice control module, video control module or business processing module to be used according to the meeting type; The power consumption is estimated by the power estimation module, and then the MCU chip is started. At this time, the specified module is started and accurately powered according to the started module. The other modules are in a power-off state. At this time, the power supply control box (1) for power supply is in operation, and the temperature sensor (6) detects the temperature inside the power supply control box (1). When the temperature exceeds a threshold, the main control module drives the temperature control module to start; When any device in the temperature control module is damaged, the safety warning module will sound an alarm while other modules operate normally, which will not affect the normal progress of the meeting. The equipment can be repaired after the meeting is completed.

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