A semiconductor quartz tube built-in pusher device

Abstract

The present invention discloses a semiconductor quartz tube built-in pusher device, which relates to the field of pusher technology and includes a pressure-resistant plate. A detection component for performing high-temperature treatment on the quartz tube is provided at the top of the pressure-resistant plate near one side edge. The detection component includes a quartz tube body and a pusher body. When the pusher device is needed to push a silicon wafer into the quartz tube for heating, the test silicon wafer is first inserted into the quartz tube body, and the constant temperature zone in the quartz tube body is detected by an infrared thermal imager. The position of the constant temperature zone is determined by the pusher body, and then the silicon wafer to be heated can be inserted into the constant temperature zone for heating. This allows the semiconductor quartz tube built-in pusher device to accurately detect the constant temperature zone in the quartz tube body when pushing the silicon wafer into the quartz tube body.

Description

Technical Field

[0001] The invention relates to the field of chip pushing technology, in particular to a semiconductor quartz tube built-in chip pushing device. Background Art

[0002] Semiconductor quartz tube is a key component widely used in the field of semiconductor manufacturing. It is mainly made of high-purity quartz material. With its excellent physical and chemical properties, it plays an important role in the high-temperature process of chip production. The built-in pusher device of the semiconductor quartz tube is a tool used in the annealing and loading process of semiconductor materials. Its structure is mainly a pusher. The pusher can be inserted into the quartz tube along the inner wall of the quartz tube. It is a core automation tool for accurately transmitting and positioning silicon wafers. Its working principle revolves around mechanical transmission and intelligent control to achieve batch and high-precision process processing of silicon wafers, and a slot is provided at the end of the pusher that extends into the quartz tube to clamp the material sheet.

[0003] Existing methods use a pusher to push a quartz tray carrying silicon wafers into a quartz tube for heat treatment. Due to the exponential relationship between the thickness of the silicon wafer oxide layer and temperature, the oxidation rate at 1000°C is approximately 0.1 nm / s. A temperature deviation of ±1°C results in a ±1% deviation in oxide layer thickness. When the axial temperature difference in the constant temperature zone is controlled within ±1°C, the oxidation process yield increases from 85% to 98%, and the percentage of thickness defects due to non-constant temperature zone treatment decreases from 12% to less than 1%. Therefore, during heat treatment, a pusher is required to precisely push the silicon wafers into the constant temperature zone of the quartz tube. Most existing equipment measures the constant temperature zone within the quartz tube by simply moving a thermocouple. However, this makes it difficult to locate the detector precisely in the actual position of the silicon wafers. The stacked spacing between the silicon wafers in the quartz boat is only 5-10 mm, making it difficult for the thermocouple to penetrate the gap between the wafers. Consequently, the temperature difference between the upper and lower wafers can reach as high as 2-3°C, which can be ignored and affect the uniformity of subsequent wafer heating.

[0004] Therefore, we propose a semiconductor quartz tube built-in pusher device to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a semiconductor quartz tube built-in wafer pushing device to solve the problem that most built-in wafer pushing devices proposed in the above background technology cannot accurately detect the constant temperature zone when pushing the silicon wafer into the semiconductor quartz tube, resulting in uneven heating of the silicon wafer.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a semiconductor quartz tube built-in pusher device, comprising a pressure-resistant plate, a detection assembly for performing high-temperature treatment on the quartz tube is provided at the top of the pressure-resistant plate near one side edge, the detection assembly includes a quartz tube body and a pusher body, a movable rotating assembly is provided at the top of the pressure-resistant plate near the other side edge, the movable rotating assembly includes a movable frame, a positioning assembly is provided at the top of the movable rotating assembly, the positioning assembly includes two quartz boats, the inner wall of one of the quartz boats is provided with an infrared thermal imager for detecting the specific position of the constant temperature zone in the quartz tube body, and the outer surface of the other quartz boat is provided with a pressure sensor for detecting whether the outer surface of the quartz boat is in contact with the pusher body, the outer surface of the movable rotating assembly is provided with a pushing assembly for pushing the two quartz boats into the quartz tube body, the pushing assembly includes a cross block for connecting to the two quartz boats respectively, the outer surface of the cross block is fixed with a threaded rod for pushing the two quartz tube bodies forward, and the outer surface of the threaded rod is threaded with an inner coil for driving the cross block to rotate.

[0007] Preferably, the two positioning assemblies also include two support frames, the inner walls of the four support frames are fixed with telescopic parts, the outer surfaces of the four telescopic parts are provided with a first spring, the outer surfaces of one side of the two quartz boats are provided with a card groove near the top, and the opposite outer surfaces of the two quartz boats are provided with a rectangular groove near the bottom.

[0008] Preferably, a trapezoidal block is fixedly installed at one end of the four telescopic parts, wherein an extension rod is fixedly installed on the outer surface of the two support frames, an electric push rod is set on the inner wall of the two extension rods, a movable plate is fixedly installed at one end of the two electric push rods, and movable connecting parts are coupled to the outer surfaces of the two movable connecting parts, and a rotating plate is rotatably sleeved on the outer surfaces of the two movable connecting parts.

[0009] Preferably, one end of the four first springs is fixedly connected to the inner walls of the four support frames, and the other ends of the four first springs are fixedly connected to the outer surfaces of the four trapezoidal blocks, respectively. One end of the two movable plates is movable through the outside of the two extension rods, and one end of the two rotating plates is fixedly connected to the outer surfaces of the other two support frames.

[0010] Preferably, the pushing assembly also includes a pressure-resistant frame, a telescopic plate is fixedly installed on the outer surface of the pressure-resistant frame near the bottom, a servo motor is fixedly installed on the outer surface of the movable frame by screws, the output end of the servo motor is fixedly connected to a driving rod, an eccentric wheel is fixedly sleeved on the outer surface of the driving rod near the center, a limiting rod is fixed on the inner wall of the pressure-resistant frame, and a second spring is provided on the outer surface of the limiting rod.

[0011] Preferably, a load-bearing frame is fixed to the top of the mobile frame by screws, a hydraulic rod is provided on the inner top surface of the load-bearing frame, a round-head positioning tube is fixedly installed on the bottom end of the hydraulic rod, a hollow rod is fixedly connected to the inner wall of the pressure-resistant frame near the top, a positioning groove for positioning the round-head positioning tube is provided on the outer surface of the hollow rod, a multi-stage electric telescopic rod is provided near one side edge of the inner wall of the pressure-resistant frame, and a multi-stage telescopic rod is fixedly installed near the other side edge of the inner wall of the pressure-resistant frame.

[0012] Preferably, the outer surface of the telescopic plate is fixedly connected to the outer surface of the movable frame, the two ends of the driving rod are respectively movable and penetrated to the opposite outsides of the movable frame, one end of the limit rod is fixedly connected to the outer surface of the movable frame, one end of the second spring is fixedly connected to the inner wall of the pressure-resistant frame, the other end of the second spring is fixedly connected to the outer surface of the movable frame, one end of the threaded rod is movable and penetrated to the outside of the hollow rod, one end of the multi-stage electric telescopic rod is fixedly connected to the outer surface of the inner spiral tube, and one end of the multi-stage telescopic rod is fixedly connected to the outer surface of the inner spiral tube.

[0013] Preferably, the detection component also includes a high-temperature furnace, the quartz tube body is arranged inside the high-temperature furnace, the outer surface of the push piece body slides with the inner wall of the quartz tube body, the outer diameter of the push piece body matches the inner diameter of the quartz tube body, and a controller is set on the outer surface of the high-temperature furnace.

[0014] Preferably, the movable rotating assembly also includes a mounting plate, the bottom of the mounting plate is fixedly connected to the top of the pressure-resistant plate, the outer surface of the mounting plate is fixedly mounted with a forward and reverse motor by screws, the output end of the forward and reverse motor is fixed with a screw rod, the two ends of the screw rod are respectively movable through to the opposite outsides of the mounting plate, the outer surface of the screw rod is threadedly connected to the inner wall of the movable frame, the outer surface of the movable frame is slidably connected to the inner wall of the mounting plate, and a mounting frame is fixed near the center of the top of the mounting plate.

[0015] Preferably, the internal movable sleeve of the mounting frame is provided with a rotating shaft, and a connecting rod is fixed to the top of the rotating shaft, wherein the outer surfaces of the two support frames are fixedly connected to the inner wall of the connecting rod, and the bottoms of the two extension rods are fixedly connected to the top of the connecting rod, and the outer surface of the rotating shaft is fixedly sleeved with a driven gear ring, and the outer surface of the driven gear ring is meshed with the active gear ring, and the inner wall of the mounting frame is fixed with a driving motor by screws, and the output end of the driving motor is fixed with a driving shaft, and the top end of the driving shaft is movable through the interior of the mounting frame, and the outer surface of the driving shaft is fixedly connected to the inner wall of the active gear ring.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. When it is necessary to use a wafer pushing device to push a silicon wafer into the quartz tube for heating, first insert the test silicon wafer into the interior of the quartz tube body, and use an infrared thermal imager to detect the constant temperature zone in the quartz tube body, and determine the position of the constant temperature zone through the wafer pushing body. Then, the silicon wafer to be heated can be inserted into the constant temperature zone for heating. This allows the built-in wafer pushing device of the semiconductor quartz tube to accurately detect the constant temperature zone in the quartz tube body when pushing the silicon wafer into the interior of the quartz tube, solving the problem in the prior art that most built-in wafer pushing devices cannot accurately detect the constant temperature zone when pushing the silicon wafer into the interior of the semiconductor quartz tube, resulting in uneven heating of the silicon wafer.

[0018] 2. When the silicon wafer needs to be pushed into the interior of the quartz tube for heating treatment, first start the high-temperature furnace to heat the quartz tube body, and then place the quartz boats loaded with the test silicon wafer and the silicon wafer to be heated between the two sets of clamps as shown in the figure, so that each two opposing trapezoidal blocks are respectively inserted into the interior of the corresponding rectangular groove to achieve the positioning of the two sets of quartz boats and ensure the stability of the quartz boats.

[0019] 3. In order to facilitate the stable movement of the quartz boat into the interior of the quartz tube body, first insert the cross block into the corresponding slot to achieve the connection between the cross block and the slot, then start the forward and reverse motors to drive the moving frame forward, thereby stably pushing the quartz boat into the interior of the quartz tube body for heating, ensuring the stability of the quartz boat movement. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a front perspective view of a semiconductor quartz tube built-in pusher device of the present invention;

[0021] Figure 2 This is a partial three-dimensional diagram of a high-temperature furnace of a semiconductor quartz tube built-in pusher device according to the present invention;

[0022] Figure 3 This is a partial perspective view of a moving frame of a semiconductor quartz tube built-in pusher device according to the present invention;

[0023] Figure 4 This is a partial perspective view of the moving and rotating component of a semiconductor quartz tube built-in pusher device of the present invention;

[0024] Figure 5 This is a partially cutaway perspective view of a mounting frame of a semiconductor quartz tube built-in pusher device according to the present invention;

[0025] Figure 6 This is a partial perspective view of the positioning component of a semiconductor quartz tube built-in pusher device of the present invention;

[0026] Figure 7A partial perspective view of a quartz boat of a semiconductor quartz tube built-in pusher device according to the present invention;

[0027] Figure 8 This is a partially cutaway perspective view of a support frame of a semiconductor quartz tube built-in pusher device according to the present invention;

[0028] Figure 9 This is a three-dimensional diagram of the rotating shaft portion of a semiconductor quartz tube built-in pusher device of the present invention;

[0029] Figure 10 This is a three-dimensional diagram of the threaded rod portion of a semiconductor quartz tube built-in pusher device of the present invention;

[0030] Figure 11 This is a perspective view of the structure of a supporting frame of a semiconductor quartz tube built-in pusher device according to the present invention;

[0031] Figure 12 This is a three-dimensional diagram of the expanded structure of the multi-stage electric telescopic rod of the semiconductor quartz tube built-in pusher device of the present invention.

[0032] In the picture:

[0033] 1. Anti-pressure plate; 2. Detection assembly; 201. High-temperature furnace; 202. Controller; 203. Quartz tube body; 204. Push piece body; 3. Moving and rotating assembly; 301. Mounting plate; 302. Forward and reverse motor; 303. Screw rod; 304. Moving frame; 305. Mounting frame; 306. Rotating shaft; 307. Connecting rod; 308. Driven gear ring; 309. Driving motor; 310. Driving shaft; 311. Active gear ring; 4. Positioning assembly; 401. Quartz boat; 402. Slot; 403. Rectangular slot; 404. Support frame; 405. Telescopic member; 406. First spring; 407. Trapezoidal block; 408. 8. Infrared thermal imager; 409. Extension rod; 410. Electric push rod; 411. Moving plate; 412. Active connector; 413. Rotating plate; 414. Pressure sensor; 5. Pushing assembly; 501. Compression frame; 502. Telescopic plate; 503. Servo motor; 504. Driving rod; 505. Eccentric wheel; 506. Limit rod; 507. Second spring; 508. Carrying frame; 509. Hydraulic rod; 510. Round-head positioning tube; 511. Hollow rod; 512. Positioning groove; 513. Threaded rod; 514. Inner screw tube; 515. Multi-stage electric telescopic rod; 516. Multi-stage telescopic rod; 517. Cross block. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0035] See also Figure 1 and Figure 7-12The present invention provides a technical solution: a semiconductor quartz tube built-in pusher device, including a pressure-resistant plate 1, a detection component 2 for high-temperature treatment of the quartz tube is set near the edge of one side of the top of the pressure-resistant plate 1, the detection component 2 includes a quartz tube body 203 and a pusher body 204, a moving rotation component 3 is set near the edge of the other side of the top of the pressure-resistant plate 1, the moving rotation component 3 includes a moving frame 304, a positioning component 4 is set on the top of the moving rotation component 3, and the positioning component 4 includes two quartz boats 401, the inner wall of one of the quartz boats 401 is set for detecting the infrared thermal image of the specific position of the constant temperature zone in the quartz tube body 203 The outer surface of the other quartz boat 401 is provided with a pressure sensor 414 for detecting whether the outer surface of the quartz boat 401 is in contact with the pusher body 204. The outer surface of the moving rotating assembly 3 is provided with a pushing assembly 5 for pushing the two quartz boats 401 into the quartz tube body 203. The pushing assembly 5 includes a cross block 517 for connecting with the two quartz boats 401 respectively. The outer surface of the cross block 517 is fixed with a threaded rod 513 for pushing the two quartz tube bodies 203 forward. The outer surface of the threaded rod 513 is threadedly sleeved with an inner screw 514 for driving the cross block 517 to rotate. The two positioning assemblies 4 Each of the four quartz boats 401 includes two support frames 404, the inner walls of the four support frames 404 are fixed with telescopic parts 405, the outer surfaces of the four telescopic parts 405 are provided with first springs 406, the outer surfaces of one side of the two quartz boats 401 are provided with a card slot 402 near the top, the opposite outer surfaces of the two quartz boats 401 are provided with a rectangular slot 403 near the bottom, and one end of the four telescopic parts 405 is fixedly installed with a trapezoidal block 407, wherein the outer surfaces of the two support frames 404 are fixedly installed with extension rods 409, the inner walls of the two extension rods 409 are provided with electric push rods 410, and one end of the two electric push rods 410 is fixedly installed with a moving plate 411, the outer surfaces of the two moving plates 411 are coupled with movable connecting parts 412, the outer surfaces of the two movable connecting parts 412 are rotatably sleeved with a rotating plate 413, and one end of the four first springs 406 is respectively connected to the four support frames 404. 04 is fixedly connected, the other ends of the four first springs 406 are respectively fixedly connected to the outer surfaces of the four trapezoidal blocks 407, one end of the two movable plates 411 are respectively movable to the outside of the two extension rods 409, and one end of the two rotating plates 413 are respectively fixedly connected to the outer surfaces of the other two support frames 404, and the pushing component 5 also includes a pressure-resistant frame 501, and a telescopic plate 502 is fixedly installed on the outer surface of the pressure-resistant frame 501 near the bottom. The servo motor 503 is fixedly installed on the outer surface of the mobile frame 304 by screws, and the output end of the servo motor 503 is fixedly connected to the driving rod 504. The outer surface of the driving rod 504 is fixedly sleeved with an eccentric wheel 505 near the center. The inner wall of the pressure-resistant frame 501 is fixed with a limiting rod 506, and the outer surface of the limiting rod 506 is provided with a second spring 507. The top of the mobile frame 304 is fixed with a supporting frame 508 by screws.A hydraulic rod 509 is provided on the inner top surface of the carrier 508, and a round-head positioning tube 510 is fixedly installed at the bottom end of the hydraulic rod 509. A hollow rod 511 is fixedly connected to the inner wall of the pressure-resistant frame 501 near the top, and a positioning groove 512 is provided on the outer surface of the hollow rod 511 for positioning the round-head positioning tube 510. A multi-stage electric telescopic rod 515 is provided near one edge of the inner wall of the pressure-resistant frame 501, and a multi-stage telescopic rod 516 is fixedly installed near the other edge of the inner wall of the pressure-resistant frame 501. The outer surface of the telescopic plate 502 is fixedly connected to the outer surface of the movable frame 304. Then, the two ends of the driving rod 504 are movable and extend through opposite exterior portions of the movable frame 304. One end of the limiting rod 506 is fixedly connected to the exterior surface of the movable frame 304. One end of the second spring 507 is fixedly connected to the inner wall of the pressure-resistant frame 501. The other end of the second spring 507 is fixedly connected to the exterior surface of the movable frame 304. One end of the threaded rod 513 is movable and extends through the exterior of the hollow rod 511. One end of the multi-stage electric telescopic rod 515 is fixedly connected to the exterior surface of the inner coil 514. One end of the multi-stage telescopic rod 516 is fixedly connected to the exterior surface of the inner coil 514.

[0036] In this embodiment, when the silicon wafer needs to be pushed into the interior of the quartz tube for heating treatment, in order to ensure that the silicon wafer entering the quartz tube is heated in a constant temperature zone, the high temperature furnace 201 is first started to heat the quartz tube body 203, and then the quartz boats 401 loaded with the test silicon wafer and the silicon wafer to be heated are placed in the following positions: Figure 1 As shown in the figure, the two sets of clamping members are arranged such that the two trapezoidal blocks 407 are inserted into the corresponding rectangular grooves 403 to realize the positioning of the two sets of quartz boats 401. The quartz tube body 203 is heated to a predetermined temperature by the controller 202. Figure 1 The two test silicon wafers shown are inserted into the interior of the corresponding quartz boat 401, and then the servo motor 503 is started to drive the driving rod 504 to rotate, thereby driving the eccentric wheel 505 to rotate, so that the outer surface of the eccentric wheel 505 rotates to a position separated from the outer surface of the pressure frame 501, thereby shortening the second spring 507, driving the pressure frame 501 to move toward the direction of the corresponding quartz boat 401, thereby driving the cross block 517 to move forward and insert it into the interior of the corresponding slot 402, wherein, in combination with Figure 1 and Figure 7 As shown, the cross section of the cross block 517 is consistent with the cross section of the slot 402, which is to facilitate the connection between the cross block 517 and the slot 402. At this time, the positioning groove 512 is just moved to the position corresponding to the round head positioning tube 510, and as shown in FIG. Figure 11As shown, the outer edge of the positioning groove 512 is an arc surface. When the round-head positioning tube 510 corresponds to the positioning groove 512, the round-head positioning tube 510 falls into the interior of the positioning groove 512 under the action of its own gravity, thereby limiting the position of the hollow rod 511. Then, the multi-stage electric telescopic rod 515 can be started to extend, driving the inner screw tube 514 to move forward, thereby driving the threaded rod 513 to rotate until the cross block 517 rotates to a position perpendicular to the slot 402, thus achieving the connection between the cross block 517 and the slot 402. Then, the staff can start the electric push rod 410 corresponding to the quartz boat 401 to extend it, drive the movable plate 411 to move forward, thereby drive the rotating plate 413 to move forward, and then drive the corresponding trapezoidal block 407 to move forward and move out of the rectangular groove 403. When the movable connecting piece 412 moves to a position where it does not contact the outer surface of the connecting rod 307, it will rotate downward under the action of its own gravity, thereby driving the support frame 404 connected to the movable connecting piece 412 to rotate downward, and then driving the movable connecting piece 412 to rotate downward. Figure 8 The trapezoidal block 407 shown rotates clockwise downward, thereby separating the trapezoidal block 407 from the quartz boat 401 , making it easier to push the quartz boat 401 into the interior of the quartz tube body 203 later.

[0037] like Figures 1-12As shown, a semiconductor quartz tube built-in pusher device includes a pressure-resistant plate 1, a detection component 2 for high-temperature treatment of the quartz tube is set near the edge of one side of the top of the pressure-resistant plate 1, the detection component 2 includes a quartz tube body 203 and a pusher body 204, a moving and rotating component 3 is set near the edge of the other side of the top of the pressure-resistant plate 1, the moving and rotating component 3 includes a moving frame 304, and a positioning component 4 is set on the top of the moving and rotating component 3. The positioning component 4 includes two quartz boats 401, the inner wall of one of the quartz boats 401 is provided with an infrared thermal imager 408 for detecting the specific position of the constant temperature zone in the quartz tube body 203, and the outer surface of the other quartz boat 401 is provided with an infrared thermal imager 408 for detecting the specific position of the constant temperature zone in the quartz tube body 203. The outer surface of the push piece body 204 is in contact with the pressure sensor 414, and the outer surface of the movable rotating component 3 is provided with a pushing component 5 for pushing the two quartz boats 401 to move into the quartz tube body 203. The pushing component 5 includes a cross block 517 for connecting with the two quartz boats 401 respectively. The outer surface of the cross block 517 is fixed with a threaded rod 513 for pushing the two quartz tube bodies 203 forward. The outer surface of the threaded rod 513 is threadedly sleeved with an inner screw 514 for driving the cross block 517 to rotate. The detection component 2 also includes a high-temperature furnace 201. The quartz tube body 203 is arranged inside the high-temperature furnace 201. The outer surface of the push piece body 204 is in contact with the inner wall of the quartz tube body 203. Sliding, the outer diameter of the push piece body 204 matches the inner diameter of the quartz tube body 203, the outer surface of the high temperature furnace 201 is provided with a controller 202, the mobile rotating assembly 3 also includes a mounting plate 301, the bottom of the mounting plate 301 is fixedly connected to the top of the pressure plate 1, the outer surface of the mounting plate 301 is fixed with a forward and reverse motor 302 by screws, the output end of the forward and reverse motor 302 is fixed with a screw rod 303, the two ends of the screw rod 303 are respectively movable through the opposite outside of the mounting plate 301, the outer surface of the screw rod 303 is threadedly connected to the inner wall of the moving frame 304, the outer surface of the moving frame 304 is slidably connected to the inner wall of the mounting plate 301, and the top of the mounting plate 301 is fixed with a mounting bracket 305 near the center. The internal movable sleeve of the mounting frame 305 is provided with a rotating shaft 306, and a connecting rod 307 is fixed to the top of the rotating shaft 306, wherein the outer surfaces of the two support frames 404 are fixedly connected to the inner wall of the connecting rod 307, and the bottoms of the two extension rods 409 are fixedly connected to the top of the connecting rod 307, and the outer surface of the rotating shaft 306 is fixedly sleeved with a driven gear ring 308, and the outer surface of the driven gear ring 308 is meshed with the active gear ring 311. The inner wall of the mounting frame 305 is fixedly installed with a driving motor 309 by screws, and the output end of the driving motor 309 is fixed with a driving shaft 310, and the top end of the driving shaft 310 is movable through the interior of the mounting frame 305, and the outer surface of the driving shaft 310 is fixedly connected to the inner wall of the active gear ring 311.

[0038] In this embodiment, the forward and reverse motor 302 can be started to drive the screw rod 303 to rotate, thereby pushing the movable frame 304 to move forward, thereby pushing the threaded rod 513 to move forward slowly, and then pushing the cross block 517 to move forward, thereby pushing the quartz boat 401 to move forward, enter the interior of the quartz tube body 203, and push the pusher body 204 set in the quartz tube body 203 to move forward, and at the same time start the infrared thermal imager 408 to shoot the temperature distribution of the test silicon wafer surface in the quartz tube body 203, and extract the temperature difference data between the center and edge of the silicon wafer. When the rotation of the forward and reverse motors 302 is continued for more than 5 minutes, the forward and reverse motors 302 can be started in the reverse direction to move the test silicon wafer in the quartz boat 401 out of the high-temperature furnace 201 and reset to the surface of the corresponding support frame 404 until the trapezoidal block 407 is inserted into the corresponding rectangular slot 403 again. Then the multi-stage electric telescopic rod 515 is started to shorten it, driving the threaded rod 513 to rotate in the reverse direction and reset to a position completely corresponding to the slot 402. Then the servo motor 503 can be started in the reverse direction to drive the eccentric wheel 505 to reset and squeeze the anti-pressure frame 501, so that the second spring 507 is pulled and extended, thereby driving the hollow rod 511 to move away from the movable frame 304. Figure 11As shown, the outer surface of the positioning groove 512 is an arc surface, the purpose of which is to facilitate the removal of the round-head positioning tube 510 from the interior of the positioning groove 512, thereby driving the threaded rod 513 to move backward, so that the cross block 517 moves out of the interior of the card slot 402, and then the forward and reverse motor 302 is continued to be started to drive the cross block 517 to a position away from the card slot 402. At the same time, the electric push rod 410 corresponding to the test silicon wafer is started again to shorten it, driving the movable plate 411 connected thereto to move toward the interior of the extension rod 409, thereby causing the corresponding rotating plate 413 to rotate upward and reset until the trapezoidal block 407 corresponding to the rotating plate 413 moves to the interior of the corresponding rectangular groove 403, that is, the quartz boat 401 in the measured silicon wafer is repositioned. Then the drive motor 309 can be started to drive the drive shaft 310 to rotate, thereby driving the active gear ring 311 to rotate, thereby driving the driven gear ring 308 to rotate, causing the rotating shaft 306 to rotate, and then driving the connecting rod 307 to rotate until the silicon wafer to be heated is loaded. When the quartz boat 401 rotates to a position corresponding to the quartz tube body 203, the above steps can be repeated again to push the quartz boat 401 into the interior of the quartz tube body 203 and start the pressure sensor 414 at the same time. When the pressure sensor 414 detects the position where the outer surface of the quartz boat 401 contacts the outer surface of the pusher body 204, it means that the quartz boat 401 has moved to the constant temperature zone of the quartz tube. The cross block 517 can be separated from the quartz boat 401 and moved out of the interior of the quartz tube body 203 to heat the silicon wafer. Through the combination of the pushing component 5 and the positioning component 4, the semiconductor quartz tube built-in pusher device can accurately detect the constant temperature zone in the quartz tube body 203 when pushing the silicon wafer into the interior of the quartz tube, thereby further improving the quality of subsequent silicon wafer heating and solving the problem that most existing built-in pushers in the prior art cannot accurately detect the constant temperature zone in the quartz tube when pushing the silicon wafer into the semiconductor quartz tube, resulting in uneven heating of the silicon wafer.

[0039] The method of use and working principle of this device: In order to ensure that the silicon wafer entering the quartz tube is heated in a constant temperature zone, first start the high temperature furnace 201 to heat the quartz tube body 203, and then place the quartz boat 401 loaded with the test silicon wafer and the silicon wafer to be heated in the following order: Figure 1 Between the two sets of clamping members shown, each of the two opposing trapezoidal blocks 407 is inserted into the corresponding rectangular groove 403 to achieve the positioning of the two sets of quartz boats 401. The quartz tube body 203 is heated to a predetermined temperature by the controller 202. The high-temperature furnace 201 utilizes the Joule heat generated by the resistance wire when it is energized. , as a heat source, transfers heat to the quartz tube body 203 through radiation and conduction, first Figure 1The two test silicon wafers shown are inserted into the interior of the corresponding quartz boat 401, and then the servo motor 503 is started to drive the driving rod 504 to rotate, thereby driving the eccentric wheel 505 to rotate, so that the outer surface of the eccentric wheel 505 rotates to a position separated from the outer surface of the pressure frame 501, thereby shortening the second spring 507, driving the pressure frame 501 to move toward the direction of the corresponding quartz boat 401, thereby driving the cross block 517 to move forward and insert it into the interior of the corresponding slot 402, wherein, in combination with Figure 1 and Figure 7 As shown, the cross section of the cross block 517 is consistent with the cross section of the slot 402. At this time, the positioning slot 512 is just moved to the position corresponding to the round head positioning tube 510, and as shown in FIG. Figure 11 As shown, the outer edge of the positioning groove 512 is an arc surface. When the round-head positioning tube 510 corresponds to the positioning groove 512, the round-head positioning tube 510 falls into the interior of the positioning groove 512 under the action of its own gravity, and then the multi-stage electric telescopic rod 515 can be started to extend, driving the inner screw tube 514 to move forward, thereby driving the threaded rod 513 to rotate until the cross block 517 rotates to a position perpendicular to the card slot 402, completing the connection between the cross block 517 and the card slot 402. Then the staff can start the electric push rod 410 corresponding to the quartz boat 401 to extend it, driving the movable plate 411 to move forward, thereby driving the rotating plate 413 to move forward, and then driving the corresponding trapezoidal block 407 to move forward and move out of the interior of the rectangular groove 403. When the movable connecting member 412 moves to a position where it does not contact the outer surface of the connecting rod 307, it will rotate downward under the action of its own gravity, thereby driving the support frame 404 connected to the movable connecting member 412 to rotate downward, thereby driving Figure 8 The trapezoidal block 407 shown rotates clockwise downward to separate the trapezoidal block 407 from the quartz boat 401. Then the forward and reverse motors 302 can be started to drive the screw rod 303 to rotate, thereby pushing the movable frame 304 to move forward, thereby pushing the threaded rod 513 to move slowly forward, and then pushing the cross block 517 to move forward, thereby pushing the quartz boat 401 to move forward, enter the interior of the quartz tube body 203, and push the pusher body 204 set in the quartz tube body 203 to move forward. At the same time, the infrared thermal imager 408 is started to capture the temperature distribution on the surface of the test silicon wafer in the quartz tube body 203. The infrared thermal imager 408 is used to monitor the surface temperature distribution and temperature difference of the silicon wafer. In essence, it captures the infrared radiation energy emitted by the silicon wafer, converts it into temperature data and visualizes it. According to Planck's law: any object with a temperature above absolute zero will emit infrared radiation, and the radiation energy is proportional to the fourth power of the temperature. ,in is the emissivity, the silicon wafer The radiation intensity of different temperature areas on the surface of the silicon wafer is different. The radiation energy in the high temperature area is high, and the radiation energy in the low temperature area is low. The infrared thermal imager 408 quantifies the temperature distribution by detecting this energy difference and extracts the temperature difference data between the center and edge of the silicon wafer. When the rotation of the forward and reverse motors 302 is continued for more than 5 minutes, the forward and reverse motors 302 can be started in the reverse direction to move the test silicon wafer in the quartz boat 401 out of the high-temperature furnace 201 and reset to the surface of the corresponding support frame 404 until the trapezoidal block 407 is inserted into the corresponding rectangular slot 403 again. Then the multi-stage electric telescopic rod 515 is started to shorten it, driving the threaded rod 513 to rotate in the reverse direction and reset to a position completely corresponding to the slot 402. Then the servo motor 503 can be started in the reverse direction to drive the eccentric wheel 505 to reset and squeeze the anti-pressure frame 501, so that the second spring 507 is pulled and extended, thereby driving the hollow rod 511 to move away from the movable frame 304. Figure 11 As shown, the outer surface of the positioning groove 512 is an arc surface, which drives the threaded rod 513 to move backward, so that the cross block 517 moves out of the interior of the card slot 402, and then continues to start the forward and reverse motor 302 to drive the cross block 517 to move to a position away from the card slot 402. At the same time, the electric push rod 410 corresponding to the test silicon wafer is started again to shorten it, driving the movable plate 411 connected thereto to move toward the interior of the extension rod 409, thereby causing the corresponding rotating plate 413 to rotate upward and reset until the trapezoidal block 407 corresponding to the rotating plate 413 moves to the interior of the corresponding rectangular groove 403. Then, the driving motor 309 can be started to drive the driving shaft 310 to rotate, thereby driving the active gear ring 311 to rotate, thereby driving the driven gear ring 308 Rotation causes the rotating shaft 306 to rotate, which in turn drives the connecting rod 307 to rotate until the quartz boat 401 carrying the silicon wafer to be heated rotates to a position corresponding to the quartz tube body 203. The above steps can be repeated again to push the quartz boat 401 into the interior of the quartz tube body 203 and activate the pressure sensor 414 at the same time. When the pressure sensor 414 detects the position where the outer surface of the quartz boat 401 contacts the outer surface of the pusher body 204, it indicates that the quartz boat 401 has moved to the constant temperature zone of the quartz tube. The working principle of the pressure sensor 414 is that when two objects come into contact, pressure acts on the sensor's elastic element: the metal diaphragm, causing it to deform slightly. The strain gauge attached to the surface of the metal diaphragm changes its resistance value with the deformation: , is proportional to the strain and follows Hooke's law. The strain gauge is connected to the Wheatstone bridge circuit, and the resistance change is converted into a voltage difference output. After amplification and filtering, it is compared with the preset threshold to determine whether there is contact. When the two are in contact, the cross block 517 can be separated from the quartz boat 401 and moved out of the interior of the quartz tube body 203 to heat the silicon wafer. Among them, the controller 202 is electrically connected to the high-temperature furnace 201, the forward and reverse motor 302, the drive motor 309, the infrared thermal imager 408, the electric push rod 410, the pressure sensor 414, the servo motor 503, the hydraulic rod 509 and the multi-stage electric telescopic rod 515.

[0040] The wiring diagram of the high-temperature furnace 201, controller 202, forward and reverse motor 302, drive motor 309, infrared thermal imager 408, electric push rod 410, pressure sensor 414, servo motor 503, hydraulic rod 509, and multi-stage electric telescopic rod 515 in the present invention is common knowledge in the field, and its working principle is a well-known technology. The model is selected according to actual use. Therefore, the control method and wiring layout of the high-temperature furnace 201, controller 202, forward and reverse motor 302, drive motor 309, infrared thermal imager 408, electric push rod 410, pressure sensor 414, servo motor 503, hydraulic rod 509, and multi-stage electric telescopic rod 515 will not be explained in detail.

[0041] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor quartz tube built-in pusher device, comprising a pressure-resistant plate (1), a detection assembly (2) for performing high-temperature treatment on the quartz tube is arranged near one side edge of the top of the pressure-resistant plate (1), the detection assembly (2) comprises a quartz tube body (203) and a pusher body (204), a moving rotation assembly (3) is arranged near the other side edge of the top of the pressure-resistant plate (1), the moving rotation assembly (3) comprises a moving frame (304), and is characterized in that: A positioning assembly (4) is provided on the top of the movable rotating assembly (3), and the positioning assembly (4) includes two quartz boats (401), wherein an infrared thermal imager (408) is provided on the inner wall of one of the quartz boats (401) for detecting the specific position of the constant temperature zone in the quartz tube body (203), and a pressure sensor (414) is provided on the outer surface of the other quartz boat (401) for detecting whether the outer surface of the quartz boat (401) is in contact with the pusher body (204); The outer surface of the moving rotation component (3) is provided with a pushing component (5) for pushing the two quartz boats (401) to move into the quartz tube body (203), and the pushing component (5) includes a cross block (517) for connecting to the two quartz boats (401) respectively, and a threaded rod (513) for pushing the two quartz tube bodies (203) forward is fixed to the outer surface of the cross block (517), and an inner screw tube (514) for driving the cross block (517) to rotate is threadedly sleeved on the outer surface of the threaded rod (513).

2. The semiconductor quartz tube built-in pusher device according to claim 1, characterized in that: The two positioning assemblies (4) each further include two support frames (404), the inner walls of the four support frames (404) are each fixed with a telescopic member (405), the outer surfaces of the four telescopic members (405) are each provided with a first spring (406), a slot (402) is provided on one side of the outer surface of the two quartz boats (401) near the top, and a rectangular slot (403) is provided on the opposite outer surfaces of the two quartz boats (401) near the bottom.

3. The semiconductor quartz tube built-in pusher device according to claim 2, characterized in that: One end of each of the four telescopic members (405) is fixedly mounted with a trapezoidal block (407), wherein the outer surfaces of the two support frames (404) are fixedly mounted with an extension rod (409), the inner walls of the two extension rods (409) are provided with an electric push rod (410), one end of each of the two electric push rods (410) is fixedly mounted with a movable plate (411), the outer surfaces of the two movable plates (411) are coupled with movable connecting members (412), and the outer surfaces of the two movable connecting members (412) are rotatably sleeved with a rotating plate (413).

4. The semiconductor quartz tube built-in pusher device according to claim 3, characterized in that: One end of the four first springs (406) is fixedly connected to the inner wall of the four support frames (404), and the other end of the four first springs (406) is fixedly connected to the outer surface of the four trapezoidal blocks (407). One end of the two movable plates (411) is movable through the outside of the two extension rods (409), and one end of the two rotating plates (413) is fixedly connected to the outer surface of the other two support frames (404).

5. The semiconductor quartz tube built-in pusher device according to claim 4, characterized in that: The pushing assembly (5) further comprises a pressure-resistant frame (501), a telescopic plate (502) being fixedly mounted on the outer surface of the pressure-resistant frame (501) near the bottom, a servo motor (503) being fixedly mounted on the outer surface of the movable frame (304) via screws, a driving rod (504) being fixedly connected to the output end of the servo motor (503), an eccentric wheel (505) being fixedly sleeved on the outer surface of the driving rod (504) near the center, a limiting rod (506) being fixedly mounted on the inner wall of the pressure-resistant frame (501), and a second spring (507) being arranged on the outer surface of the limiting rod (506).

6. The semiconductor quartz tube built-in pusher device according to claim 5, characterized in that: The top of the movable frame (304) is fixed with a supporting frame (508) by screws, the inner top surface of the supporting frame (508) is provided with a hydraulic rod (509), the bottom end of the hydraulic rod (509) is fixedly installed with a round head positioning tube (510), the inner wall of the pressure-resistant frame (501) is fixedly connected with a hollow rod (511) near the top, the outer surface of the hollow rod (511) is provided with a positioning groove (512) for positioning the round head positioning tube (510), the inner wall of the pressure-resistant frame (501) is provided with a multi-stage electric telescopic rod (515) near one side edge, and the inner wall of the pressure-resistant frame (501) is fixedly installed with a multi-stage telescopic rod (516) near the other side edge.

7. The semiconductor quartz tube built-in pusher device according to claim 6, characterized in that: The outer surface of the telescopic plate (502) is fixedly connected to the outer surface of the movable frame (304), the two ends of the driving rod (504) are respectively movable and penetrated to the opposite outer sides of the movable frame (304), one end of the limiting rod (506) is fixedly connected to the outer surface of the movable frame (304), one end of the second spring (507) is fixedly connected to the inner wall of the pressure-resistant frame (501), the other end of the second spring (507) is fixedly connected to the outer surface of the movable frame (304), one end of the threaded rod (513) is movable and penetrated to the outside of the hollow rod (511), one end of the multi-stage electric telescopic rod (515) is fixedly connected to the outer surface of the inner spiral tube (514), and one end of the multi-stage telescopic rod (516) is fixedly connected to the outer surface of the inner spiral tube (514).

8. The semiconductor quartz tube built-in chip pushing device according to claim 7, characterized in that: The detection assembly (2) further includes a high-temperature furnace (201), the quartz tube body (203) is arranged inside the high-temperature furnace (201), the outer surface of the push piece body (204) slides with the inner wall of the quartz tube body (203), the outer diameter of the push piece body (204) matches the inner diameter of the quartz tube body (203), and a controller (202) is arranged on the outer surface of the high-temperature furnace (201).

9. The semiconductor quartz tube built-in pusher device according to claim 8, characterized in that: The movable rotating assembly (3) further comprises a mounting plate (301), the bottom of the mounting plate (301) being fixedly connected to the top of the pressure-resistant plate (1), the outer surface of the mounting plate (301) being fixedly mounted with a forward and reverse motor (302) by screws, the output end of the forward and reverse motor (302) being fixed with a screw rod (303), the two ends of the screw rod (303) being movable and penetrating to opposite exteriors of the mounting plate (301), the outer surface of the screw rod (303) being threadedly connected to the inner wall of the movable frame (304), the outer surface of the movable frame (304) being slidably connected to the inner wall of the mounting plate (301), and a mounting frame (305) being fixed near the center of the top of the mounting plate (301).

10. The semiconductor quartz tube built-in chip pushing device according to claim 9, characterized in that: The internal movable sleeve of the mounting frame (305) is provided with a rotating shaft (306), and a connecting rod (307) is fixed to the top of the rotating shaft (306), wherein the outer surfaces of the two support frames (404) are fixedly connected to the inner wall of the connecting rod (307), and the bottoms of the two extension rods (409) are fixedly connected to the top of the connecting rod (307), and the outer surface of the rotating shaft (306) is fixedly provided with a driven gear ring (308), and the outer surface of the driven gear ring (308) is meshedly connected with the active gear ring (311), and the inner wall of the mounting frame (305) is fixedly installed with a driving motor (309) by screws, and the output end of the driving motor (309) is fixed with a driving shaft (310), and the top end of the driving shaft (310) is movable and penetrates into the interior of the mounting frame (305), and the outer surface of the driving shaft (310) is fixedly connected to the inner wall of the active gear ring (311).

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