A wafer prober

Abstract

The application discloses a wafer inserting machine, and belongs to the technical field of semiconductor wafer processing. The wafer inserting machine comprises a main body module and a conveying and detecting module. The main body module comprises a fixing table, conveying devices are arranged on the two sides of the top of the fixing table, an electric control sliding rail is connected to the top of the fixing table and close to the rear end face, and two clamping claws are arranged on the electric control sliding rail. The setting of a rotating disc, a cold-hot alternating assembly, a driving assembly, a limiting assembly and a thermal imager enables the cold-hot alternating assembly to alternately blow cold air and hot air around the wafer, and the thermal imager captures the dynamic temperature difference, so that the signal-to-noise ratio of the originally invisible defects (such as microcracks, delamination and other defects) in the infrared image is increased by 3 to 5 times. Meanwhile, the cold-hot alternating assembly detects the overall shape of the wafer, so that the wafer can be more comprehensively and accurately detected, the wafer is prevented from being broken in the subsequent wafer inserting process, and the stability of the wafer inserting process is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor wafer processing, more particularly to a semiconductor wafer plug-in machine. BACKGROUND

[0002] The semiconductor wafer is a silicon wafer used for making silicon semiconductor circuits and is a basic material for manufacturing semiconductor chips, usually made of high-purity silicon, which widely exists in rocks and gravel in the form of silicate or silicon dioxide in nature. After multiple purification, single crystal silicon is further made for wafer production. In the wafer production process, an automatic plug-in machine is used to insert the finished wafer into a magazine for subsequent processing procedures.

[0003] According to the search, patent No. CN218513425U discloses an automatic plug-in machine for quartz wafer substrate production, which comprises a cabinet, a conveyor, a magazine and a wafer. The top side of the cabinet is provided with a feeding belt, and a plurality of wafers are placed on the feeding belt. The conveyor is arranged on the cabinet and located above the side of the feeding belt. The bottom side of the conveyor is provided with a magazine, and a plurality of groups of speed reduction components are fixedly installed on the inner walls of the two sides of the magazine. When the wafer rebounds, the baffles limit the rotation of the corresponding gears, thereby limiting the rotation of the plurality of rubber rollers, achieving the speed reduction effect of the wafer, preventing the wafer from rebounding to the feeding belt direction and colliding with the subsequent wafers, reducing the damage caused by the collision of the two wafers, and ensuring the normal operation of the wafer plug-in work. Secondly, rubber sheets are arranged in the magazine to play a buffering role when the wafer contacts the inner wall of the magazine, preventing the wafer from directly colliding with the inner wall of the magazine and causing damage to the wafer.

[0004] In view of the related technology in the above, although the plug-in machine in the prior art can realize the wafer plug-in operation, in actual use, the traditional plug-in machine lacks high-precision detection capability, leading to edge collapse or micro-crack wafers entering the processing program. Such defects not only cause direct fragmentation during the plug-in process, but also affect the subsequent plug-in due to the flying debris. After fragmentation, long-time machine maintenance is required before the work can be restarted, which seriously affects the plug-in process. The plug-in machine generally relies on manual detection, and the detection function is simple, which affects the detection effect of the plug-in machine. Therefore, a semiconductor wafer plug-in machine is proposed. SUMMARY

[0005] To solve the above problems, the present application provides a semiconductor wafer plug-in machine, which adopts the following technical scheme:

[0006] The utility model provides a kind of wafer insertion machine, including main module and transport detection module, the main module includes fixed platform, the top of fixed platform both sides are provided with conveying device, the top of fixed platform is connected with electric control slide rail near rear end surface, two clamping jaws are provided on electric control slide rail, the transport detection module includes support frame fixedly connected in the top of fixed platform, the top of fixed platform is provided with conveying assembly, and conveying assembly is located between two conveying devices, the top of support frame is rotatably connected with rotating disc, cold and hot alternation assembly is provided on rotating disc, drive assembly is provided between the top of rotating disc and the side of support frame, drive assembly is compatible with conveying assembly, the top of fixed platform is provided with limiting assembly, and limiting assembly is located below conveying assembly, lifting assembly is provided on the bottom of inner wall of fixed platform, and lifting assembly is provided with magazine on one of conveying device, the top of support frame is fixedly connected with steering rod, and the end of steering rod penetrates the middle part of rotating disc and is fixedly connected with thermal imager.

[0007] Further, the cold and hot alternation assembly includes two connection pipes fixedly connected in the inside of rotating disc, a fixed hopper is fixedly connected between one end of two connection pipes, a fan and a mounting plate are mounted in the inside of fixed hopper, a semiconductor refrigeration sheet is mounted in the inside of mounting plate, and a plurality of heat-conducting sheets are fixedly connected on the two sides of semiconductor refrigeration sheet.

[0008] Further, the cold and hot alternation assembly further includes two vertical rods fixedly connected at the bottom of rotating disc, an infrared range finder is fixedly connected to the bottom end of two vertical rods, and two infrared range finders are in square distribution with two connection pipes.

[0009] Further, the drive assembly includes a fixed seat fixedly connected to the top of support frame, a long rod is rotatably connected in the inside of fixed seat, a pinion is fixedly connected to one end of long rod, a bevel gear is fixedly connected to the other end of long rod, a bevel gear ring is fixedly connected to the top of rotating disc, and the outer surface of bevel gear ring is engaged with the outer surface of bevel gear.

[0010] Further, the drive assembly further includes a drive motor fixedly connected to one side of support frame, an incomplete gear is fixedly connected to the output shaft of drive motor, and the outer surface of incomplete gear is compatible with the outer surface of pinion.

[0011] Further, the limiting assembly includes two alignment rods fixedly connected to the top of fixed platform, a first air cylinder is fixedly connected to the top of fixed platform, a blocking block is fixedly connected to the output shaft of first air cylinder, and an inclined slot is formed in the outer surface of blocking block.

[0012] Further, the limiting assembly further comprises a second air cylinder fixedly connected to the top of the fixed table, and an elevating disc is fixedly connected to the output shaft of the second air cylinder.

[0013] Further, the conveying assembly comprises four mounting seats fixedly connected to the top of the fixed table, and a rolling rod is rotatably connected between the interiors of every two mounting seats.

[0014] Further, the conveying assembly further comprises a second transmission roller fixedly connected to one end of the rolling rod, a third transmission roller is rotatably connected to one side of the support frame, a linkage belt is transmissionally connected between the outer surfaces of the second transmission roller and the third transmission roller, a linkage gear is fixedly connected to the outer surface of the third transmission roller, and the outer surface of the linkage gear is matched with the incomplete gear.

[0015] Further, the lifting assembly comprises two third air cylinders fixedly connected to the bottom of the inner wall of the fixed table, and a lifting plate is fixedly connected between the output shafts of the two third air cylinders.

[0016] In summary, the present application has the following beneficial technical effects:

[0017] (1) The present application sets the rotating disc, the cold-hot alternating assembly, the driving assembly, the limiting assembly and the thermal imager, so that the cold-hot alternating assembly blows cold and hot alternately around the wafer, and the thermal imager captures the dynamic temperature difference, so that the originally invisible defects (such as micro-cracks, delamination and other defects) are improved by 3 to 5 times in the signal-to-noise ratio in the infrared image, and the cold-hot alternating assembly detects the overall shape of the wafer, so that the detection is more comprehensive and accurate, and the subsequent insertion process is avoided to avoid fragmentation and ensure the stability of the insertion process.

[0018] (2) The present application sets the conveying assembly, so that the conveying assembly can cooperate with the detection step through the driving of the driving assembly, so as to realize the coherent detection effect.

[0019] (3) The present application sets the righting rod and the blocking block, so that the position of the wafer can be righted and limited, so as to ensure the wafer detection and improve the detection accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0021] Figure 2 It is a schematic diagram of the lifting assembly of the present application;

[0022] Figure 3Structure schematic view of the conveying assembly of the present application;

[0023] Figure 4 Structure schematic view of the conveying assembly of the present application Figure 3 Structure schematic view of the conveying assembly of the present application

[0024] Figure 5 Position schematic view of the limiting assembly of the present application

[0025] Figure 6 Structure schematic view of the driving assembly of the present application

[0026] Figure 7 Structure schematic view of the conveying assembly of the present application Figure 6 Structure schematic view of the conveying assembly of the present application

[0027] Explanation of the figure labels:

[0028] 100, main body module; 110, fixed table; 120, conveying device; 130, electric control sliding rail; 140, clamping claw; 150, material box;

[0029] 200, conveying detection module; 210, support frame; 220, rotating disc; 230, cold and hot alternating assembly; 231, connecting pipe; 232, fixed hopper; 233, fan; 234, mounting plate; 235, semiconductor refrigeration piece; 236, heat conduction piece; 237, vertical rod; 238, infrared range finder; 240, conveying assembly; 241, mounting seat; 242, rolling rod; 243, first transmission roller; 244, transmission belt; 245, second transmission roller; 246, third transmission roller; 247, linkage belt; 248, linkage gear; 250, driving assembly; 251, driving motor; 252, incomplete gear; 253, fixed seat; 254, long rod; 255, bevel gear; 256, pinion; 257, bevel gear ring; 260, limiting assembly; 261, alignment rod; 262, first air cylinder; 263, blocking block; 264, second air cylinder; 265, lifting disc; 270, lifting assembly; 271, third air cylinder; 272, lifting plate; 280, thermal imager. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application; obviously, the described embodiments are only part of the embodiments of the present application, but not all the embodiments; based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0031] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom end" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0032] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "sleeved / connected", "connected" and the like should be broadly understood, for example, "connected" can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, can be electrically connected; can be directly connected, can be indirectly connected through an intermediate medium, and can be internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0033] The following will be described in detail in combination with the accompanying drawings Figures 1-7 The present application will be further described in detail.

[0034] Please refer to Figures 1-7 A semiconductor wafer plug machine, comprising a main body module 100 and a conveying detection module 200, the main body module 100 comprises a fixed table 110, both sides of the top of the fixed table 110 are provided with conveying devices 120, the top of the fixed table 110 is connected with an electric control sliding rail 130 near the rear end face, two clamping jaws 140 are arranged on the electric control sliding rail 130, the conveying detection module 200 comprises a support frame 210 fixedly connected to the top of the fixed table 110, a conveying assembly 240 is arranged on the top of the fixed table 110, the conveying assembly 240 is located between the two conveying devices 120, a rotating disc 220 is rotatably connected to the top of the support frame 210, a cold and hot alternating assembly 230 is arranged on the rotating disc 220, a driving assembly 250 is arranged between one side of the support frame 210 and the top of the rotating disc 220, the driving assembly 250 is matched with the conveying assembly 240, a limiting assembly 260 is arranged on the top of the fixed table 110, the limiting assembly 260 is located below the conveying assembly 240, a lifting assembly 270 is arranged on the bottom of the inner wall of the fixed table 110, the lifting assembly 270 and one of the conveying devices 120 are provided with a material box 150, a steering rod is fixedly connected to the top of the support frame 210, one end of the steering rod penetrates through the middle part of the rotating disc 220 and is fixedly connected with a thermal imager 280.

[0035] In use, the wafer that needs to be inserted is transported on the conveying assembly 240, the driving assembly 250 is opened, the driving assembly 250 will drive the conveying assembly 240 to transport the wafer to the designated position, and the wafer is limited by the limiting assembly 260, the limiting assembly 260 will lift the wafer to the designated height, then the driving assembly 250 drives the rotating disc 220 to rotate, while the cold and hot alternating assembly 230 blows alternately around the wafer, and the thermal imager 280 captures the dynamic temperature difference, so that the originally invisible defects such as microcracks and delamination are improved by 3 to 5 times in the signal-to-noise ratio of the infrared image, and the cold and hot alternating assembly 230 detects the overall shape of the wafer, so that the detection is more comprehensive and accurate, avoiding the fragmentation in the subsequent insertion process, ensuring the stability of the insertion process, after the detection is completed, the limiting assembly 260 drives the wafer to descend to the conveying assembly 240, and the driving assembly 250 drives the conveying assembly 240 again, so that the wafer after detection is inserted into the magazine 150, and another wafer moves to the detection position, the lifting assembly 270 will drive the magazine 150 to rise to a certain height to wait for the next insertion, after the insertion of the magazine 150 is completed, the clamping jaw 140 cooperates with the electric control sliding rail 130 to move the magazine 150 after the insertion to one of the conveying devices 120, and another magazine 150 on the other conveying device 120 is placed on the lifting assembly 270.

[0036] The cold and hot alternating assembly 230 includes two connecting pipes 231 fixedly connected inside the rotating disc 220, a fixed hopper 232 fixedly connected between one end of the two connecting pipes 231, a fan 233 and a mounting plate 234 mounted inside the fixed hopper 232, a semiconductor refrigerating fin 235 mounted inside the mounting plate 234, a plurality of heat-conducting fins 236 fixedly connected to the two sides of the semiconductor refrigerating fin 235, and two vertical rods 237 fixedly connected to the bottom of the rotating disc 220, the bottom end of each vertical rod 237 is fixedly connected with an infrared range finder 238, and the two infrared range finders 238 are in square distribution with the two connecting pipes 231. The driving assembly 250 includes a fixed seat 253 fixedly connected to the top of the support frame 210, a long rod 254 rotatably connected inside the fixed seat 253, a small gear 256 fixedly connected to one end of the long rod 254, a bevel gear 255 fixedly connected to the other end of the long rod 254, a bevel gear ring 257 fixedly connected to the top of the rotating disc 220, and the outer surface of the bevel gear ring 257 is engaged with the outer surface of the bevel gear 255. The driving assembly 250 further includes a driving motor 251 fixedly connected to one side of the support frame 210, and an incomplete gear 252 fixedly connected to the output shaft of the driving motor 251, and the outer surface of the incomplete gear 252 is matched with the outer surface of the small gear 256.

[0037] The subsequent second air cylinder 264 opens the wafer to rise to between the two connecting pipes 231 and the two infrared range finders 238 by the lifting disc 265, the subsequent incomplete gear 252 drives the pinion 256, the pinion 256 will drive the bevel gear 255 through the long rod 254, the bevel gear 255 drives the bevel gear ring 257 to drive the rotating disc 220 to rotate, so that the two connecting pipes 231 and the infrared range finder 238 rotate around the wafer, while the fan 233 and the semiconductor refrigeration piece 235 are opened, the fan 233 blows air, and the two sides of the semiconductor refrigeration piece 235 respectively refrigerate and heat a plurality of heat conduction pieces 236, so that two air streams are respectively refrigerated and heated, and cold air and hot air enter the two connecting pipes 231 and blow to the wafer, and the wafer is alternately blown by cold and hot air, the thermal imager 280 captures the dynamic temperature difference, so that the originally invisible defects such as microcracks and delamination are improved by 3 to 5 times in the signal-to-noise ratio of the infrared image, and the infrared range finder 238 irradiates the outer surface of the wafer to detect the overall circular shape of the wafer, and judges whether the wafer has irregular phenomenon, so as to more comprehensively and accurately detect.

[0038] The limiting assembly 260 comprises two alignment rods 261 fixedly connected to the top of the fixed table 110, the top of the fixed table 110 is fixedly connected with a first air cylinder 262, the output shaft of the first air cylinder 262 is fixedly connected with a blocking block 263, the outer surface of the blocking block 263 is provided with an inclined groove, and the limiting assembly 260 further comprises a second air cylinder 264 fixedly connected to the top of the fixed table 110, and the output shaft of the second air cylinder 264 is fixedly connected with a lifting disc 265.

[0039] The wafer is aligned by the two alignment rods 261, and the position of the wafer is limited by the blocking block 263, so that the wafer is located between the two connecting pipes 231 and the infrared range finder 238, and the wafer can be lifted to the specified position by the lifting disc 265 by opening the second air cylinder 264.

[0040] The conveying assembly 240 comprises four mounting seats 241 fixedly connected to the top of the fixed table 110, the inner portion of every two mounting seats 241 is rotatably connected with a rolling rod 242, the outer surface of the two rolling rods 242 is fixedly connected with two first transmission rollers 243, the outer surface of every two first transmission rollers 243 is drivingly connected with a transmission belt 244, the conveying assembly 240 further comprises a second transmission roller 245 fixedly connected to one end of one of the rolling rods 242, one side of the supporting frame 210 is rotatably connected with a third transmission roller 246, the outer surface of the second transmission roller 245 and the third transmission roller 246 is drivingly connected with a linkage belt 247, the outer surface of the third transmission roller 246 is fixedly connected with a linkage gear 248, the outer surface of the linkage gear 248 is matched with the incomplete gear 252, the lifting assembly 270 comprises two third air cylinders 271 fixedly connected to the bottom of the inner wall of the fixed table 110, the output shafts of the two third air cylinders 271 is fixedly connected with a lifting plate 272, one of the material boxes 150 is arranged on the top of the lifting plate 272.

[0041] The driving motor 251 is started, the driving motor 251 drives the incomplete gear 252 to rotate, the incomplete gear 252 drives the linkage gear 248 to rotate the third transmission roller 246, the third transmission roller 246 rotates the second transmission roller 245 through the linkage belt 247 when rotating, the second transmission roller 245 rotates the rolling rod 242, the rolling rod 242 drives the first transmission roller 243 to drive the transmission belt 244 to convey the wafer to the designated position, the third air cylinder 271 drives the lifting plate 272 and the material box 150 to rise a certain height after single insertion to wait for the next insertion.

[0042] The implementation principle of the embodiment of the present application is as follows: in use, the wafer needing to be inserted is on the two transmission belts 244, the driving motor 251 is turned on, the driving motor 251 drives the incomplete gear 252 to rotate, the incomplete gear 252 drives the third transmission roller 246 to rotate through the linkage gear 248, the third transmission roller 246 drives the second transmission roller 245 to rotate through the linkage belt 247 when rotating, the second transmission roller 245 drives the rolling rod 242 to rotate, the rolling rod 242 drives the first transmission roller 243 to drive the transmission belt 244 to convey the wafer to a designated position, and the wafer is aligned by the two alignment rods 261, the position of the wafer is limited by the blocking block 263, the second cylinder 264 is subsequently turned on to push the wafer up to between the two connecting pipes 231 and the two infrared distance meters 238 through the lifting disc 265, the incomplete gear 252 subsequently drives the pinion 256, the pinion 256 drives the bevel gear 255 through the long rod 254, the bevel gear 255 drives the bevel gear ring 257 to drive the rotating disc 220 to rotate, so that the two connecting pipes 231 and the infrared distance meter 238 rotate around the wafer, at the same time, the fan 233 and the semiconductor refrigeration sheet 235 are turned on, the fan 233 blows air, and the two sides of the semiconductor refrigeration sheet 235 respectively refrigerate and heat the plurality of heat-conducting sheets 236, so that two air streams are respectively refrigerated and heated, the cold air and the hot air respectively enter the two connecting pipes 231 to blow toward the wafer, and the cold air and the hot air alternately blow around the wafer, the thermal imager 280 captures this dynamic temperature difference, the originally invisible defects such as microcracks and delamination are improved by 3 to 5 times in the signal-to-noise ratio in the infrared image, at the same time, the infrared distance meter 238 irradiates the outer surface of the wafer to detect the overall circular shape of the wafer, and whether the wafer has irregularities is judged, so that the detection is more comprehensive and accurate, and the wafer is prevented from being broken in the subsequent insertion process, the stability of the insertion process is ensured, after the detection is completed, the second cylinder 264 drives the wafer to descend to the transmission belt 244, the first cylinder 262 drives the blocking block 263 to descend, the incomplete gear 252 drives the linkage gear 248 again, so that the wafer after the detection is conveyed to the insertion box 150 through the transmission belt 244, the blocking block 263 is subsequently lifted to move another wafer to the detection position, at this time, the third cylinder 271 drives the lifting plate 272 and the insertion box 150 to ascend to a certain height to wait for the next insertion, after the insertion of the insertion box 150 is completed, the clamping jaw 140 cooperates with the electric control sliding rail 130 to move the insertion box 150 after the insertion is completed to one of the conveying devices 120, and another insertion box 150 on the other conveying device 120 is placed on the lifting assembly 270 to receive the wafer again.

[0043] The above are preferred embodiments of the present application, which do not limit the protection scope of the present application, therefore: any equivalent changes made on the structure, shape and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A semiconductor wafer insertion machine, comprising a main module (100) and a transport and detection module (200), characterized in that: The main module (100) includes a fixed platform (110), and conveying devices (120) are provided on both sides of the top of the fixed platform (110). An electrically controlled slide rail (130) is connected to the top of the fixed platform (110) near the rear end face, and two clamping claws (140) are provided on the electrically controlled slide rail (130). The conveying detection module (200) includes a support frame (210) fixedly connected to the top of the fixed platform (110). A conveying assembly (240) is provided on the top of the fixed platform (110). The conveying assembly (240) is located between two conveying devices (120). A rotating disk (220) is rotatably connected to the top of the support frame (210). A hot and cold alternation assembly (230) is provided on the rotating disk (220). A driving assembly (250) is provided between one side of the support frame (210) and the top of the rotating disk (220). 50) Adapted to the conveying assembly (240), the top of the fixed platform (110) is provided with a limiting assembly (260), the limiting assembly (260) is located below the conveying assembly (240), the bottom of the inner wall of the fixed platform (110) is provided with a lifting assembly (270), the lifting assembly (270) and one of the conveying devices (120) are both provided with a material box (150), the top of the support frame (210) is fixedly connected with a steering rod, one end of the steering rod passes through the middle of the rotating disk (220) and is fixedly connected with a thermal imager (280). The alternating hot and cold component (230) includes two connecting pipes (231) that are fixedly connected inside the rotating disk (220). A fixed bucket (232) is fixedly connected between one end of the two connecting pipes (231). A fan (233) and a mounting plate (234) are installed inside the fixed bucket (232). A semiconductor cooling chip (235) is installed inside the mounting plate (234). Multiple heat-conducting plates (236) are fixedly connected to both sides of the semiconductor cooling chip (235). The alternating hot and cold assembly (230) also includes two vertical rods (237) that are fixedly connected to the bottom of the rotating disk (220). The bottom ends of the two vertical rods (237) are fixedly connected to infrared rangefinders (238). The two infrared rangefinders (238) and the two connecting tubes (231) are arranged in a square. The drive assembly (250) includes a fixed seat (253) fixedly connected to the top of the support frame (210), a long rod (254) rotatably connected inside the fixed seat (253), a pinion (256) fixedly connected to one end of the long rod (254), a bevel gear (255) fixedly connected to the other end of the long rod (254), and a bevel gear (257) fixedly connected to the top of the rotating disk (220), the outer surface of the bevel gear (257) meshing with the outer surface of the bevel gear (255); The drive assembly (250) also includes a drive motor (251) fixedly connected to one side of the support frame (210). The output shaft of the drive motor (251) is fixedly connected to an incomplete gear (252). The outer surface of the incomplete gear (252) is adapted to the outer surface of the pinion (256). The limiting component (260) includes two aligning rods (261) that are fixedly connected to the top of the fixed platform (110). A first cylinder (262) is fixedly connected to the top of the fixed platform (110). A blocking block (263) is fixedly connected to the output shaft of the first cylinder (262). An inclined groove is provided on the outer surface of the blocking block (263).

2. The semiconductor wafer insertion machine according to claim 1, characterized in that: The limiting assembly (260) also includes a second cylinder (264) fixedly connected to the top of the fixed platform (110), and the output shaft of the second cylinder (264) is fixedly connected to a lifting plate (265).

3. A semiconductor wafer insertion machine according to claim 2, characterized in that: The conveying assembly (240) includes four mounting bases (241) that are fixedly connected to the top of the fixed platform (110). A rolling rod (242) is rotatably connected between the interior of each pair of mounting bases (241). Two first drive rollers (243) are fixedly connected to the outer surfaces of each pair of rolling rods (242). A drive belt (244) is drively connected between the outer surfaces of each pair of first drive rollers (243).

4. A semiconductor wafer insertion machine according to claim 3, characterized in that: The conveying assembly (240) further includes a second drive roller (245) fixedly connected to one end of one of the rolling rods (242), a third drive roller (246) rotatably connected to one side of the support frame (210), a linkage belt (247) drivingly connecting the outer surfaces of the second drive roller (245) and the third drive roller (246), a linkage gear (248) fixedly connected to the outer surface of the third drive roller (246), and the outer surface of the linkage gear (248) being adapted to the incomplete gear (252).

5. A semiconductor wafer insertion machine according to claim 4, characterized in that: The lifting assembly (270) includes two third cylinders (271) fixedly connected to the bottom of the inner wall of the fixed platform (110), and a lifting plate (272) is fixedly connected between the output shafts of the two third cylinders (271), and one of the material boxes (150) is located on the top of the lifting plate (272).

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