A smart loading device compatible with multiple size wafer boxes and a control method thereof

Abstract

The application discloses a kind of compatible multi-size wafer box's intelligent loading equipment and control method, belong to semiconductor detection loading technical field, the equipment includes: loading platform, for fixed and transport feed box;Adapter, detachably connected with loading platform;Detection system, integrated in loading platform, including in position sensor group;Trigger assembly, is located on the surface of adapter, with the physical characteristics that can be identified by external equipment, for activating in position sensor group to identify adapter installation state and feed box type;Door plate system, for controlling the opening and closing of feed box door plate.The application can automatically identify the type of feed box and the use condition of adapter, solve the safety risk caused by state misjudgment, positioning deviation and sealing failure of traditional equipment, improve the compatibility and operation reliability of equipment.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer inspection machines, and in particular relates to an intelligent loading device and a control method compatible with wafer boxes of multiple sizes. Background Art

[0002] As semiconductor manufacturing processes evolve toward multi-specification, high-mix capabilities, wafer fabs are increasingly demanding compatibility with automated equipment. As the core interface of the wafer transfer system, the Load Port performs critical functions, including precise positioning of wafer cassettes, status detection, and collaboration with robotic arms. Currently, mainstream wafer sizes range from 8 inches to 12 inches, and some specialized processes require the use of PFA or metal-structured cassettes. However, due to structural limitations, traditional Load Port equipment is typically only compatible with cassettes of a single size or type, requiring multiple devices on the production line, significantly increasing procurement and maintenance costs.

[0003] In existing technologies, some adapter structures lack integrated installation status detection modules. When the wafer boat is offset or not fully locked, the system cannot proactively identify the abnormal state, resulting in the risk of wafer damage when the robot directly performs the wafer removal action. Furthermore, existing technologies often rely on a single sensor or physical marking to identify the type of cassette, making it difficult to distinguish between adapters and cassettes with similar structures, and lack interlock detection for special cassettes. These deficiencies limit equipment compatibility and inadequate operational safety, making it difficult to meet the stringent requirements of high-precision wafer manufacturing.

[0004] The Japanese patent application number JP2023003748U discloses a wafer box storage device, including a wafer box loading platform, a storage device, a door opening device, a loading platform, a lifting device, and a control panel. A storage device is provided on one side of the wafer box mounting platform, one side of the storage device includes a first entrance, and the other side of the storage device is provided with a second entrance. The storage device is provided with multiple door opening devices that operate independently and open the wafer box door. A plurality of loading platforms capable of storing different types of wafer boxes are provided in the storage device, and a lifting device is connected to the loading platform. It can effectively prevent the intrusion of external dust, but when the invention is applied to dynamic detection, its adaptability to special types of material boxes and the fixing ability of the adapter need to be improved. Therefore, it is particularly necessary to design an intelligent loading device and control method compatible with multi-size wafer boxes to solve field-related problems. Summary of the Invention

[0005] The purpose of the present invention is to provide an intelligent loading device compatible with multi-size wafer boxes and a control method thereof, which has the advantages of improving wafer box loading safety, enhancing equipment compatibility and realizing intelligent status detection.

[0006] The technical solutions adopted by the present invention to achieve the above-mentioned purpose are:

[0007] An intelligent loading device compatible with multi-size wafer cassettes, comprising:

[0008] Loading platform, used to fix and transport the boxes;

[0009] an adapter, detachably connected to the loading platform;

[0010] Detection system, integrated into the loading platform, including an in-place sensor set;

[0011] A trigger component is provided on the surface of the adapter and has physical features that can be recognized by an external device, and is used to activate the in-position sensor group to identify the installation status of the adapter and the type of the cartridge;

[0012] The door panel system is used to control the opening and closing of the material box door panel.

[0013] Preferably, the in-situ sensor group is used to distinguish wafer specifications and detect whether the material box is placed in place. The detection system also includes an infopad sensor group, which cooperates with the in-situ sensor group to distinguish the type of material box.

[0014] Preferably, the in-place sensor group includes a plurality of mirror-distributed in-place sensors, the trigger component includes a plurality of sensor position seats corresponding to the in-place sensors, and at least one preset position is missing a sensor position seat, and the adapter and the material box are distinguished by identifying the missing preset position.

[0015] Preferably, the loading platform is provided with a positioning pin and a snap-fit ​​mechanism, and the adapter comprises a positioning interface plug-fitted with the positioning pin, and a locking interface linked to the snap-fit ​​mechanism.

[0016] Preferably, the adapter has a flip cover, the adapter is provided with a torque hinge, a door closing magnet and a door closing sensor, the flip cover is connected to the adapter through the torque hinge, and when the flip cover is closed, it is attracted by the door closing magnet and the door closing sensor verifies that it is in place.

[0017] Preferably, the door panel system includes a door panel detection sensor, and the door panel detection sensor is a push-to-pop-up structure.

[0018] Preferably, the snap-fit ​​mechanism includes a retractable snap, a cylinder for driving the snap to retract, and a position sensor for detecting the position of the snap.

[0019] Preferably, the detection system further comprises a metal lever detection sensor. When the material box is a metal material box, the metal lever detection sensor detects whether the metal lever is opened and in position, and prohibits wafer picking and placing when the in-position signal is not triggered.

[0020] Preferably, the loading platform is provided with a network port, and the signals of the sensors inside the adapter are aggregated to the network port via a network cable.

[0021] Preferably, a method for controlling an intelligent loading device compatible with multi-size wafer cassettes, operating the above-mentioned device, comprises the following steps:

[0022] Step 1: Activate the in-place sensor group by the physical features of the trigger component, and generate a cartridge type identification mark in combination with the signal of the infopad sensor group. When the identification mark contains the preset default features, it is determined to be the adapter installation mode;

[0023] Step 2: Match the adapter type based on the spatial distribution of the default features, activate the communication link between the adapter and the loading platform, and simultaneously verify the adapter's in-place status and the door-closed status signal;

[0024] Step 3: Control the door panel system to execute the door panel opening operation, and start the wafer placement process after verifying the door panel's existence and opening status through multi-level sensors;

[0025] Step 4: When the type of magazine that requires metal lever interlocking is detected, verify the metal lever open position signal. If the verification fails, interrupt the equipment operation.

[0026] Step 5: Control the locking mechanism to perform the material box fixing operation, and ensure that the locking is in place through the closed-loop detection feedback mechanism.

[0027] Compared with the existing technology, the present invention has the following beneficial effects: through the coordination of the adapter trigger component and the mirror sensor group, a coding mechanism is formed by utilizing the missing of preset features to accurately identify the adapter type and installation status, avoiding the risk of traditional clamping misalignment; multi-level sensor combination detection realizes automatic differentiation of material box types, and combined with the infopad sensor group, it enhances compatibility and effectively solves the problem of misjudgment of similar structures; the push-to-pop door panel detection sensor synchronizes the door panel movement status with the equipment control logic in real time through mechanical contact and elastic reset dual feedback, blocking abnormal operation instructions; the clamping mechanism integrates a position sensor closed-loop detection to verify the buckle extension and retraction status in real time, eliminating the hidden danger of material box fixation failure; the internal sensor of the adapter interacts with the loading platform in real time through a communication link, improving the accuracy of system coordinated control; the magnetic attraction of the flip cover closure and the torque hinge damping are coordinated with the door closing sensor verification to ensure sealing and avoid mechanical interference; the metal lever detection forcibly verifies the in-place status to ensure the safety of wafer placement; the positioning pin and the clamping mechanism cooperate to realize coarse and fine dual positioning, significantly improving the installation stability of the wafer box; it solves the safety risks caused by state misjudgment, positioning deviation and sealing failure of traditional equipment, and improves the compatibility and operational reliability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of an intelligent loading device compatible with wafer cassettes of multiple sizes;

[0029] Figure 2 Schematic diagram of the internal structure of the door panel system;

[0030] Figure 3 This is a schematic diagram of the door panel detection sensor structure;

[0031] Figure 4 This is a top view of the loading platform;

[0032] Figure 5 Schematic diagram of the clamping mechanism;

[0033] Figure 6 This is a schematic diagram of the adapter with its cover closed;

[0034] Figure 7 This is a schematic diagram of the connection between the limit block, door closing magnet, and presence sensor and the adapter;

[0035] Figure 8 Schematic diagram of the bottom structure of the adapter;

[0036] Figure 9 is a schematic cross-sectional view of a magnetic connection assembly;

[0037] Figure 10 This is a schematic diagram of the bottom structure of the adapter of the magnetic link assembly in the second embodiment of the present invention;

[0038] Figure 11 Schematic diagram of the direction of gas release from the pores in embodiment 3 of the invention.

[0039] Reference numerals: main frame 1; status indicator light 2; door panel system 3; loading platform 4; metal lever detection sensor 5; first wafer detection sensor 6; second size wafer detection sensor 7; door panel detection sensor 8; sensing rod 81, sensor base 82; detection sensor 83; positioning pin 9; cone 91; first infopad sensor 10; second infopad sensor 11; third infopad sensor 12; fourth infopad sensor 13; first in-position sensor 14; second in-position sensor 15 ; Third in-position sensor 16; Fourth in-position sensor 17, RFID detection module 18; Manual button 19; Snap mechanism 20; Buckle 201; Work position sensor 202, induction plate 203; Cylinder 204; In-situ sensor 205; Torque hinge 24; Door opening magnet 25; Presence sensor 26; Limit block 27; Door closing magnet 28; Positioning interface 29; Support 30; Buckle seat 31; Sensor position seat 32; Adapter sensor 33; Door closing sensor 34; Groove 35; Permanent magnet 36; Annular airbag 37; Air hole 38. DETAILED DESCRIPTION

[0040] The technical solution of the present invention is further described in detail below with reference to the specific embodiments and the accompanying drawings:

[0041] Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0042] Example 1: See Figure 1-Figure 4 , an intelligent loading device compatible with multi-size wafer cassettes includes:

[0043] The main frame 1 is provided with a status indicator light 2, which displays the current working status of the device;

[0044] Loading platform 4, used for fixing and conveying material boxes;

[0045] an adapter, detachably connected to the loading platform 4;

[0046] A detection system, integrated into the loading platform 4, including an in-place sensor group;

[0047] A trigger component is provided on the surface of the adapter and has physical features that can be recognized by an external device, and is used to activate the in-position sensor group to identify the installation status of the adapter and the type of the cartridge;

[0048] The door panel system 3 is used to control the opening and closing of the material box door panel. The door panel system 3 is connected to the wafer detection sensor. The loading platform 4 transports the material box to the loading position, opens the door panel to open the material box panel, and then the wafer detection sensor performs mapping detection on the wafers in the material box.

[0049] The wafer detection sensor includes a first-size wafer detection sensor 6 and a second-size wafer detection sensor 7. As an embodiment of the present invention, the first-size wafer detection sensor 6 is an eight-inch wafer detection sensor, and the second-size wafer detection sensor 7 is a twelve-inch wafer detection sensor.

[0050] It should be noted that the loading platform 4 is the base structure that supports and transports the cartridges. Specifically, it can be implemented as a metal frame with guide rails and a drive motor. Its surface is equipped with positioning pins 9 and a latching mechanism 20 for mechanical connection with the adapter. The adapter is a connecting component that matches cartridges of different sizes. Specifically, it can be plugged into the loading platform 4 via a positioning interface. The adapter can also integrate signal transmission circuits, such as using a network cable to transmit sensor signals to the network port of the loading platform 4.

[0051] When the adapter is mounted on the loading platform 4, the locating pin 9 inserts into the adapter's locating interface, and the latching mechanism 20 automatically locks the adapter. The sensor position seat 32 on the adapter's surface triggers the corresponding in-place sensor group on the loading platform 4. The in-place sensor group detects the spatial distribution of triggering features and generates an adapter type identifier. If the sensor detects a missing triggering feature at a preset position, it determines that the current installation object is an adapter, not a cartridge. Upon receiving the adapter in-place signal, the door panel system 3 initiates the door panel opening operation.

[0052] This solution uses a trigger component in the adapter to enable the sensor group to automatically identify the adapter type and verify the installation status, avoiding equipment failures caused by adapter misalignment. Traditional snap-in mechanisms lack closed-loop detection.

[0053] Through the above technical solution, the present invention realizes the automatic identification of wafer boxes of different sizes and the detection of adapter installation status, effectively preventing mechanical collisions caused by the offset of the material box placement; verifies the opening and closing of the door panel and the status of the metal lever through multi-level sensors to avoid misoperation during the wafer placement process; after the communication link between the adapter and the loading platform 4 is established, it can transmit internal sensor signals in real time to improve the system collaborative control accuracy.

[0054] The in-place sensor group is used to distinguish wafer specifications and detect whether the cassette is in place. The detection system also includes an infopad sensor group, which works with the in-place sensor group to distinguish cassette types. The in-place sensor group can be used to distinguish wafer specifications and detect whether the cassette is in place. The in-place sensor group also works with the infopad sensor group to distinguish different cassette types, improving cassette compatibility.

[0055] Compared to existing technologies that lack sensors to detect the placement of a cartridge, the present invention combines a presence sensor group with an infopad sensor group, enabling not only cartridge position detection but also accurate identification of different cartridge types. For example, when the adapter is installed, the infopad sensor group recognizes the adapter's pre-set coding signature, preventing misidentification of ordinary cartridges. When a metal cartridge is detected, the system enforces the metal lever's position verification, eliminating the risk of tipping caused by the securing hook not fully extending in the existing technology.

[0056] Through the above technical solution, the present application can verify the placement status and type information of the material box in real time, prevent mechanical collision accidents caused by skewed or unfixed material boxes, and at the same time ensure the operational safety of different types of material boxes through dual sensor collaborative detection.

[0057] The detection system also includes an RFID detection module 18, which is located on the loading platform 4 and is used to read the information contained in the label on the material box. The detection system includes a manual button 19 that can terminate the selection.

[0058] The in-place sensor group includes multiple mirror-distributed in-place sensors, and the trigger component includes multiple sensor position seats 32 corresponding to the in-place sensors. At least one preset position is missing a sensor position seat 32, and the adapter and the material box are distinguished by identifying the missing preset position.

[0059] The in-place sensor group includes four in-place sensors: a first in-place sensor 14, a second in-place sensor 15, a third in-place sensor 16, and a fourth in-place sensor 17. The four in-place sensors 14, 15, 16, and 17 are arranged in mirrored configuration on the loading platform 4. The trigger assembly includes four mounting holes, each corresponding to the positions of the four in-place sensors 14, 15, 16, and 17. A sensor position seat 32 is installed in each mounting hole, with one mounting hole lacking a sensor position seat 32. The sensor position seat 32 is used to trigger the in-place sensors 14, 15, 16, and 17 to detect whether the adapter is in place. The fourth mounting hole, lacking a sensor position seat 32, cannot trigger the corresponding in-place sensor 17, thereby distinguishing whether the adapter or another type of cartridge is connected to the loading platform 4.

[0060] The infopad sensor group includes four infopad sensors: a first infopad sensor 10, a second infopad sensor 11, a third infopad sensor 12, and a fourth infopad sensor 13. These four infopad sensors are mirror-imaged on the loading platform 4, cooperating with the four in-position sensors to distinguish between the adapter and the cartridge.

[0061] Compared with the existing technology, the traditional solution uses a single contact sensor or physical mark recognition method, which has the risk of misjudgment and cannot distinguish between adapters and cassettes with similar structures. The present invention uses a binary coding mechanism formed by preset missing positions. It can accurately identify more than 16 different installation modes through logical judgment without increasing hardware costs. It effectively solves the problem of equipment operation errors caused by misidentification of adapters and cassettes, and avoids robot arm collision accidents caused by crooked placement of wafer cassettes. When the adapter is not installed correctly, the system can immediately detect the abnormality of the sensor trigger mode and stop subsequent operations. At the same time, it is compatible with the automatic identification requirements of cassettes of different sizes.

[0062] The loading platform 4 is provided with a positioning pin 9 and a clamping mechanism 20 . The adapter comprises a positioning interface 29 that is plugged into and matched with the positioning pin 9 , and a locking interface that is linked to the clamping mechanism 20 .

[0063] The cassette rests on the positioning pins 9, and the latching mechanism 20 secures it in place. This eliminates the problem of wafer cassette misalignment caused by adapter installation deviation and prevents the risk of cassette tipping due to incomplete latching. The insertion of the positioning pins 9 into the positioning interface 29 provides coarse positioning, while the latching mechanism 20 and the locking interface work together to achieve precise positioning. The synergistic effect ensures minimal flatness error in the adapter installation.

[0064] See also Figure 6 - Figure 8 The adapter has a flip cover, and the adapter is provided with a torque hinge 24, a door opening magnet 25, a door closing magnet 28 and a door closing sensor 34. The flip cover is connected to the adapter through the torque hinge 24. When the flip cover is opened, it is released by the door opening magnet 25. When the flip cover is closed, it is adsorbed by the door closing magnet 28 and the door closing sensor 34 verifies that it is in place.

[0065] The adapter is also provided with a presence sensor 26, a limit block 27 and a support 30. The presence sensor 26 is used to detect whether the material box exists and whether the material box is installed in place. The limit block 27 is used to fix the position of the material box. The support 30 prevents the adapter from contacting the placement surface to prevent scratches.

[0066] The flap of the adapter is connected to the main body via a torque hinge 24. During the closing process of the flap, the damping characteristics of the torque hinge 24 cause the flap to fall slowly, avoiding the impact caused by rapid closing. When the flap contacts the main body of the adapter, the permanent magnet of the door closing magnet 28 generates an adsorption force with the ferromagnetic material on the main body, fixing the flap in the closed position. At this time, the door closing sensor 34 is triggered by the closing action of the flap and generates an in-position status signal. If the sensor does not detect the trigger signal, it is determined that the flap is not completely closed, and the device will prohibit subsequent operation procedures. By integrating the door closing magnet 28 and the door closing sensor 34 in the adapter, not only is the stable closing and locking of the flap achieved, but the closing state can also be verified in real time, avoiding sealing failure or mechanical interference problems caused by the flap not being completely closed.

[0067] The above technical solution effectively solves the technical problem of being unable to confirm the closed state of the adapter flap, ensuring that the wafer box is transferred in a closed state, preventing external contaminants from entering the interior of the box, and at the same time improving the safety and reliability of equipment operation through the dual locking mechanism of mechanics and sensors.

[0068] The door panel system 3 includes a door panel detection sensor 8 , which is a push-to-pop-up structure.

[0069] Door panel detection sensor 8 comprises a sensing rod 81, a sensor base 82, and two detection sensors 83. One end of sensing rod 81 is elastically retracted from sensor base 82. The free end of sensing rod 81 is pressed against the magazine, and two detection sensors 83 are mounted on sensor base 82. Pressure on sensing rod 81 triggers the first detection sensor 83, detecting the presence of a door panel. Continued pressure on sensing rod 81 triggers the second detection sensor 83, determining that the door panel is fully open.

[0070] During the door opening process, when the door panel is fully open, its moving parts disengage from the door panel detection sensor 8. At this point, spring force drives the probe contact back up, generating a position signal based on the contact separation. During the door closing process, the door panel's motion compresses the probe contact, causing it to displace. When the contact displacement reaches a preset threshold, a closing signal is triggered. This structure, through the dual mechanisms of mechanical contact and elastic reset, monitors the door panel's opening angle and closing pressure in real time, ensuring that the door panel's opening and closing movements precisely match the device's operating sequence.

[0071] The existing technology uses hooks to secure the magazine but lacks a position detection feature. This creates a risk of the magazine securing not being able to be secured due to the hook not being fully extended. This solution, however, uses a physical contact trigger mechanism that uses a pop-up sensor to provide real-time feedback on the door panel's opening and closing status. It blocks the robot's operating instructions when the door panel has not reached the predetermined position, effectively avoiding wafer collision accidents caused by abnormal door panels. This solution addresses equipment operation safety hazards caused by improperly opened or closed door panels. A dual detection mechanism ensures real-time synchronization between the door panel's movement status and the equipment control system, preventing wafer damage or mechanical interference with the equipment due to door panel position deviation.

[0072] See attached Figure 5 The snap-fit ​​mechanism 20 includes a retractable snap 201 , a cylinder 204 for driving the snap 201 to retract, and a position sensor for detecting the position of the snap 201 .

[0073] The position sensor includes: a working position sensor 202, a sensing piece 203 and an in-situ sensor 205. The sensing piece 203 is connected to the buckle 201. The working position sensor 202 and the in-situ sensor 205 detect whether the buckle 201 extends and retracts by detecting the sensing piece 203.

[0074] The integrated position sensor enables closed-loop detection of the buckle 201's status, enabling real-time verification of the results of the buckle 201's actions. This resolves the issue of cartridge retention failure caused by buckle 201 malfunction. If the buckle 201 fails to extend correctly, an alarm is immediately triggered and the equipment stops, preventing tipping accidents caused by an unsecured cartridge. Position feedback signals also ensure strict synchronization between the buckle 201's actions and the cartridge's locking status, enhancing operational safety.

[0075] The detection system also includes a metal lever detection sensor 5. When the material box is a metal material box, the metal lever detection sensor 5 detects whether the metal lever is opened and in place, and prohibits the wafer taking and placing action when the in-place signal is not triggered.

[0076] The loading platform 4 is provided with a network port, and the signals of the sensors inside the adapter are aggregated to the network port through a network cable.

[0077] A method for controlling an intelligent loading device compatible with multi-size wafer cassettes comprises the following steps:

[0078] Step 1: Activate the in-place sensor group by the physical features of the trigger component, and generate a cartridge type identification mark in combination with the signal of the infopad sensor group. When the identification mark contains the preset default features, it is determined to be the adapter installation mode;

[0079] Step 2: Match the adapter type based on the spatial distribution of the default features, activate the communication link between the adapter and the loading platform 4, and simultaneously verify the adapter in-position status and the door closing status signal;

[0080] Step 3: Control the door panel system 3 to perform the door panel opening operation, and start the wafer placement process after verifying the existence and opening status of the door panel through multi-level sensors;

[0081] Step 4: When the type of magazine that requires metal lever interlocking is detected, verify the metal lever open position signal. If the verification fails, interrupt the equipment operation.

[0082] Step 5: Control the latching mechanism 20 to perform the magazine fixing operation, and ensure that the buckle 201 is in place through a closed-loop detection feedback mechanism.

[0083] When the adapter is installed on the loading platform 4, the physical features on the trigger component activate the in-place sensor group, and the material box type identification is generated in combination with the signal output by the infopad sensor group. If the preset default feature exists in the identification mark, the system determines that the current mode is the adapter installation mode, and determines the adapter type based on the spatial distribution of the default feature. Subsequently, the communication link is activated, and the adapter in-place status and the flip door closed status signal are synchronously obtained. When the door panel system 3 is turned on, the multi-level sensor verifies in turn whether the door panel exists and the open position status, ensuring that the wafer placement process is only started when the door panel is fully opened. For material boxes interlocked with a metal lever, the system immediately interrupts the operation when it detects that the metal lever has not been opened to avoid collision with the robot. The clamping mechanism 20 monitors the position of the buckle 201 in real time through a closed-loop feedback mechanism. If the buckle 201 does not reach the predetermined position, the system automatically re-executes the fixing action.

[0084] The above solution ensures accurate detection of adapter installation, door panel opening, and clip 201 fixation through multi-level sensor verification and closed-loop feedback mechanisms, avoiding operational risks caused by components not being in place. Through the above technical solution, the present application can accurately identify the adapter and magazine types, verify the locked and opened states in real time, and avoid collisions or tipping problems caused by components not being in place during wafer placement. At the same time, the reliability of the clip 201 fixation is improved through closed-loop feedback, thereby improving the safety of equipment operation.

[0085] The present invention is compatible with various types of magazines. Magazine types such as FOUP, FOSB, and metal magazines can be used directly through the positioning pins 9 on the loading platform 4, while PFA cassettes require an adapter to be used. In order to distinguish the types of magazines, the infopad sensor group and the in-place sensor group can be combined to formulate identification rules as described in Table 1. The above-mentioned magazine mentioned in the present invention is only one type, and the corresponding identification rules are formulated, aiming to provide a magazine differentiation method without special limitation.

[0086] Table 1 Identification rules of the detection system for different boxes

[0087]

[0088] Example 2: See Figure 9 - Figure 10 Based on the first embodiment of the present invention, an intelligent loading device compatible with multi-size wafer cassettes further includes multiple magnetic connection components arranged in an array, including: a conical groove 35 provided at the bottom of the cassette and adapter, with a permanent magnet 36 disposed on its conical surface; a magnetic positioning pin 9, with a cone 91 at its top that engages with the permanent magnet 36; and an annular airbag 37, sleeved around the periphery of the positioning pin 9, with its top initially higher than the top of the positioning pin 9. When the cassette and adapter are installed, the annular airbag 37 sequentially triggers initial deformation cushioning and secondary compression cushioning after magnetic attraction.

[0089] The magnetic connection component also includes a controllable magnetization unit, which realizes the adsorption, fixation and separation and release of the permanent magnet 36 by changing the magnetization state of the positioning pin 9. During separation, the recovery deformation of the annular airbag 37 generates a lifting force to assist in the separation of the positioning pin 9 and the permanent magnet 36.

[0090] The compression deformation of the annular airbag 37 is dynamically matched with the magnetic attraction force. When the downward movement distance of the material box or adapter reaches the preset value of the total stroke, the deformation rate of the airbag decreases, which is specifically achieved through the gradient design of the airbag wall thickness.

[0091] The wafer box loading and positioning device of this embodiment realizes positioning guidance and high positioning accuracy through the cooperation of the conical magnetic groove 35 and the magnetic positioning pin 9. The technical principle is as follows: when the box or adapter is installed, the annular airbag 37 contacts the bottom of the box or adapter first, and is compressed and deformed under the action of the gravity of the box or adapter to absorb the impact force at the moment of bearing; the magnetization state of the positioning pin 9 is changed by the controllable magnetization unit, so that the positioning pin 9 produces magnetic attraction to the permanent magnet 36 in the conical groove 35, and the box or adapter carries the permanent magnet 36 downward and contacts the positioning pin 9 to achieve magnetic attraction, and at the same time, The cone 91 and the conical surface of the permanent magnet 36 cooperate to achieve guidance and positioning; when the permanent magnet 36 moves downward and is magnetically attracted to the positioning pin 9, the material box or adapter further presses down the annular airbag 37, and the impact force of the magnetic attraction at the moment is buffered by the compression of the gas inside the annular airbag 37, thereby reducing the vibration amplitude of the wafer in the material box; after the adsorption is completed, the annular airbag 37 relies on its closed cavity to dynamically buffer the vibration energy generated during the operation of the equipment through the gas compression-expansion cycle in the cavity; during the separation operation, the positioning pin 9 is powered off and demagnetized, and the lifting force generated by the recovery of the deformation of the annular airbag 37 assists the material box to detach.

[0092] The above scheme has the following beneficial effects: the cone 91 at the top of the positioning pin 9 cooperates with the conical groove 35 at the bottom of the material box or adapter to achieve guidance, and the material box or adapter is positioned in the longitudinal and transverse directions on the loading platform by means of magnetic attraction of the cone 91, which can avoid the possibility of lateral slippage and longitudinal jumping of the material box or adapter caused by vibration during the operation of the equipment, and avoid the possibility of wafer damage in the material box; the buffer mechanism of airbag compression significantly reduces the contact wear of the positioning pin 9 during the positioning process, reduces the risk of positioning jamming or inaccurate positioning caused by wear debris, and improves The positioning accuracy of the material box or adapter is improved, and the economic and time costs of replacing the positioning pin 9 are reduced, so that the long-term efficient and stable loading positioning of the equipment is achieved, which is beneficial to improving the efficiency of semiconductor detection; during the separation operation, the magnetic release mechanism enables the material box or adapter to be lifted, so that the positioning pin 9 automatically disengages from the groove 35 in the longitudinal direction, that is, the longitudinal space constraint is automatically eliminated. Compared with the traditional fixed positioning pin 9, there is no need for a robotic arm or manual operation to lift the material box or adapter and then take it out, which optimizes the operating steps of separating, removing and replacing the material box or adapter, and improves work efficiency.

[0093] Example 3: See attached Figure 11 On the basis of the second embodiment of the present invention, the magnetic connection component includes an airtight adjustment module, which includes an air hole 38 provided on the inner side of the annular airbag 37. When the material box or the adapter is magnetically adsorbed with the positioning pin 9, the air hole 38 is closed by the compression force to form a closed cavity. When the equipment is in operation, the vibration energy is absorbed by the compression of the gas in the cavity.

[0094] At the moment when the permanent magnet 36 moves downward and is magnetically attracted to the positioning pin 9, the material box or adapter further presses down the annular airbag 37, so that the air hole 38 inside it approaches and is pressed against the side wall of the positioning pin 9, and the air hole 38 is blocked. At the moment before the blockage, the annular airbag 37 is pressurized to release airflow from the air hole 38, thereby cooling the upper surface of the loading platform, which is beneficial to reduce the heat generated by the long-term operation of the internal equipment of the loading platform and the transfer to the wafer, thereby reducing the temperature fluctuation of the wafer caused by heat conduction and avoiding lattice defects caused by thermal stress.

[0095] The released airflow can suppress the deposition of particles on the platform surface, reduce the amount of small particles attached to the loading platform, material box or adapter, provide a clean environment for wafer inspection, improve the cleanliness of the dust-free environment, and improve the accuracy of wafer inspection.

[0096] The airflow released from the air hole 38 can act on the side wall of the positioning pin 9 to form upward and downward airflow, wherein the downward airflow can remove wear debris or particles attached to the cone 91, thereby further improving the guide positioning accuracy of the magnetic connection and reducing the possibility of tilting of the material box or adapter after installation.

[0097] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. An intelligent loading device compatible with multi-size wafer cassettes, comprising: A loading platform (4) for fixing and conveying the material box; an adapter detachably connected to the loading platform (4); A detection system, integrated into the loading platform (4), comprising an in-place sensor group; a trigger component, disposed on the surface of the adapter, having physical features that can be recognized by an external device, and used to activate the in-place sensor group to identify the installation status of the adapter and the type of the cartridge; The door panel system (3) is used to control the opening and closing of the material box door panel. The in-place sensor group includes a plurality of mirror-distributed in-place sensors, the trigger assembly includes a plurality of sensor position seats (32) corresponding to the in-place sensors, the adapter surface has a plurality of preset positions corresponding to the in-place sensors, at least one preset position lacks the sensor position seat (32), and the adapter is distinguished from the material box by identifying the missing preset position. The in-situ sensor group is used to distinguish wafer specifications and detect whether the material box is placed in place. The detection system also includes an infopad sensor group. The infopad sensor group cooperates with the in-situ sensor group to distinguish the type of material box.

2. The intelligent loading device compatible with multi-size wafer cassettes according to claim 1, characterized in that: The loading platform (4) is provided with a positioning pin (9) and a clamping mechanism (20), and the adapter comprises a positioning interface (29) plug-fitted with the positioning pin (9), and a locking interface linked to the clamping mechanism (20).

3. The intelligent loading device compatible with multi-size wafer cassettes according to claim 1, characterized in that: The adapter has a flip cover, and the adapter is provided with a torque hinge (24), a door closing magnet (28) and a door closing sensor (34). The flip cover is connected to the adapter via the torque hinge (24). When the flip cover is closed, it is adsorbed by the door closing magnet (28) and the door closing sensor (34) verifies that the flip cover is in position.

4. The intelligent loading device compatible with multi-size wafer cassettes according to claim 1, characterized in that: The door panel system comprises a door panel detection sensor (8), and the door panel detection sensor (8) is a push-to-pop-up structure.

5. The intelligent loading device compatible with multi-size wafer cassettes according to claim 2, characterized in that: The clamping mechanism (20) comprises a retractable clamp (201), a cylinder (204) for driving the clamp (201) to retract, and a position sensor for detecting the position of the clamp (201).

6. The intelligent loading device compatible with multi-size wafer cassettes according to claim 1, characterized in that: The detection system further comprises a metal lever detection sensor (5). When the material box is a metal material box, the metal lever detection sensor (5) detects the metal lever being in the opened position, and prohibits the wafer taking and placing action when the in-position signal is not triggered.

7. The intelligent loading device compatible with multi-size wafer cassettes according to claim 1, characterized in that: The loading platform (4) is provided with a network port, and the signals of the sensors inside the adapter are aggregated to the network port via a network cable.

8. A method for controlling an intelligent loading device compatible with multi-size wafer cassettes, characterized by: Using the device according to any one of claims 1 to 7, the method comprises the following steps: Step 1: Activate the in-place sensor group through the physical features of the trigger component, generate a cartridge type identification mark in combination with the signal of the infopad sensor group, and determine the adapter installation mode when the identification mark contains a preset default feature; Step 2: Match the adapter type based on the spatial distribution of the default feature, activate the communication link between the adapter and the loading platform, and simultaneously verify the adapter in-place status and the closed door status signal; Step 3: Control the door panel system (3) to perform the door panel opening operation, and start the wafer placement process after verifying the existence of the door panel and the open state through the multi-level sensor; Step 4: When the type of magazine that requires metal lever interlocking is detected, verify the metal lever open position signal. If the verification fails, interrupt the equipment operation. Step 5: Control the snap-fit ​​mechanism (20) to perform the material box fixing operation, and ensure that the snap-fit ​​is in place through a closed-loop detection feedback mechanism.

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