Glass-based antenna and preparation method thereof
By directly forming conductive lines on the glass substrate, the problems of large thickness and low transparency when the film-based antenna and glass are combined are solved, and thinner and more transparent glass-based antennas are realized, expanding application scenarios.
Patent Information
- Application Number
- CN202510563681.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-30
- Publication Date
- 2025-08-29
AI Technical Summary
When existing film-based antennas are combined with glass, they have a large thickness, which affects aesthetics and application scenarios, and have low transmittance and haze, making it difficult to meet the needs of invisibility and high performance.
The glass substrate is used to directly form conductive lines, and the conductive layer is prepared on the glass through magnetron sputtering and other technologies, and the conductive lines are formed through photolithography and electroplating to form a two-layer structure of glass-based antenna, reducing the additional adhesive layer and improving transparency and conductive properties.
It realizes a thinner antenna structure, improves transmittance and reduces haze, expands the scope of application, has good aesthetics and high transparency, and is suitable for architectural curtain walls, automotive windshields, smart wearable devices and touch screens.
Smart Images

Figure CN120566058A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present invention relate to the technical field of transparent antennas, and in particular to a glass-based antenna and a method for preparing the glass-based antenna. Background Art
[0002] With the continuous evolution of 5G communication technology, antenna applications are becoming increasingly diverse. As antenna performance requirements increase, their designs are becoming more complex and diverse. These antennas must not only possess excellent electromagnetic performance but also be virtually invisible to accommodate diverse application scenarios.
[0003] Currently, this type of antenna uses a film material (such as PET, Polyethylene terephthalate) as a substrate, with conductive circuits formed on the substrate. This type of substrate antenna has high transmittance and can blend harmoniously with the surrounding environment, which is particularly critical for urban landscape design and integrated equipment applications. However, when applying film-based antennas to glass, they require optically clear adhesive (OCA) to adhere to the glass or building surface to function. This creates a four-layer structure of glass, OCA adhesive, film material, and conductive circuits, which is thick and affects the antenna's application scenarios. Summary of the Invention
[0004] In view of the above problems, embodiments of the present invention provide a glass-based antenna and a method for preparing a glass-based antenna, which overcome the above problems or at least partially solve the above problems.
[0005] According to one aspect of an embodiment of the present invention, a glass-based antenna is provided, which is composed of a glass substrate and a conductive circuit, the glass substrate including a first surface and a second surface arranged opposite to each other; the conductive circuit is arranged on the first surface; and the line width of the conductive circuit is 1 μm to 10 μm.
[0006] In an optional manner, the yellowing index of the glass-based antenna is not greater than 0.52, the transmittance of the glass-based antenna is not less than 87.76%, and the haze of the glass-based antenna is not greater than 1.63%.
[0007] In an optional manner, the conductive circuit is made of copper.
[0008] In an optional embodiment, the glass substrate is soda-lime glass.
[0009] In an optional embodiment, the light transmittance of the glass substrate is 92.45%.
[0010] According to one aspect of an embodiment of the present invention, a method for preparing a glass-based antenna is provided, comprising forming a conductive layer on a glass substrate, wherein the thickness of the conductive layer is 100 nm to 200 nm; coating a photoresist on the conductive layer; exposing and developing the photoresist so that a first portion of the conductive layer is exposed and a second portion of the conductive layer is covered by the photoresist; electroplating the first portion to form a conductive circuit; removing the photoresist on the second portion of the conductive layer; and removing the second portion of the conductive layer.
[0011] In an optional manner, the conductive circuit is made of copper.
[0012] In an optional manner, the electroplating current density is 1A / dm 2 Up to 20A / dm 2 between.
[0013] In an optional manner, the electroplating system includes any one of a sulfate system, a pyrophosphate system and an organic phosphate system.
[0014] In an optional manner, the step of forming the conductive layer on the glass substrate includes forming the conductive layer on the glass substrate by using magnetron sputtering technology, evaporation, interface modification, etc.
[0015] The beneficial effects of embodiments of the present invention include providing a glass-based antenna comprising a glass substrate and a conductive circuit, wherein the glass substrate includes a first surface and a second surface disposed opposite each other; the conductive circuit is disposed on the first surface; and the conductive circuit has a line width of 1 μm to 10 μm. The glass-based antenna provided herein comprises only a two-layer structure of a glass substrate and a conductive circuit. Compared to the four-layer structure of a film-based antenna and glass in the prior art, the glass-based antenna provided herein is thinner, expanding its application range. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.
[0017] Figure 1 It is a schematic top view of a glass-based antenna provided in an embodiment of the present invention.
[0018] Figure 2 It is a cross-sectional view of a glass-based antenna provided in an embodiment of the present invention.
[0019] Figure 3It is a schematic diagram of a process of a glass-based antenna provided by an embodiment of the present invention.
[0020] The reference numerals in the accompanying drawings are as follows:
[0021] Glass-based antenna 100;
[0022] Glass substrate 10, conductive circuit 20;
[0023] First surface 101 and second surface 102 . DETAILED DESCRIPTION
[0024] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0025] The embodiment of the present invention provides a glass-based antenna 100, see Figure 1 and Figure 2 The glass-based antenna 100 comprises a glass substrate 10 and a conductive circuit 20. The glass substrate 10 includes a first surface 101 and a second surface 102 facing each other. The conductive circuit 20 is disposed on the first surface 101. The conductive circuit 20 has a line width w of 1 μm to 10 μm. The glass-based antenna 100 provided in this embodiment comprises only two layers, the glass substrate 10 and the conductive circuit 20. Compared to conventional film-based antennas that combine four layers of glass, the glass-based antenna 100 provided in this embodiment is thinner, expanding its application range.
[0026] Furthermore, in the prior art, when the conductive trace 20 and the film substrate are bonded to the glass using OCA adhesive, protrusions are formed on the glass surface, which not only affects the aesthetics but also limits the application range of the antenna. In the embodiments of the present application, since the conductive trace 20 is formed directly on the glass substrate 10, it has better aesthetics and expands the application scenarios of the antenna.
[0027] It is worth noting that in some embodiments, the glass-based antenna 100 has a yellowing index of no greater than 0.52, a transmittance of no less than 87.76%, and a haze of no greater than 1.63%. However, conventional film-based antennas have a yellowing index of 2.34, a transmittance of 84.51%, and a haze of 2.13%. Compared to conventional film-based antennas, the glass-based antenna 100 provided in the present application has superior optical performance, higher transmittance, lower yellowing index and haze, and is closer to transparency.
[0028] Among them, the yellowing index is used to measure the yellowness of the material.
[0029] Here, transmittance represents the percentage of light that passes through the material.
[0030] Haze is used to describe the degree to which light is scattered when passing through a material.
[0031] It is worth noting that, in some embodiments, the conductive circuit 20 is made of copper.
[0032] It is worth noting that, in some embodiments, the glass substrate 10 is soda-lime glass.
[0033] It is worth noting that, in some embodiments, the light transmittance of the glass substrate 10 is 92.45%.
[0034] According to one aspect of an embodiment of the present invention, a method for preparing a glass-based antenna 100 is provided. Figure 3 The preparation method of the glass-based antenna 100 includes the following steps:
[0035] In step S10 , a conductive layer is formed on the glass substrate 10 , wherein the thickness of the conductive layer is 100 nm to 200 nm.
[0036] It is worth noting that, in some embodiments, the step of forming the conductive layer on the glass substrate 10 includes forming the conductive layer on the glass substrate 10 by using magnetron sputtering technology, evaporation, interface modification, etc.
[0037] It is worth noting that, in some embodiments, the conductive layer is a copper layer.
[0038] Step S20: coating photoresist on the conductive layer.
[0039] Step S30 , exposing and developing the photoresist so that the first portion of the conductive layer is exposed and the second portion of the conductive layer is covered by the photoresist.
[0040] Exposure involves projecting a designed pattern through a mask onto a conductive layer formed with photoresist. The photoresist undergoes chemical changes during the exposure process, causing the exposed and unexposed areas to exhibit different solubility in the subsequent development step. Exposure energy must be controlled between 10-1000 mJ / cm 2 Within the range, it needs to be left to stand for 0-1 hour after exposure to allow the photoresist to fully react.
[0041] Development involves chemically treating the exposed photoresist, dissolving the unexposed areas and leaving the exposed pattern behind. Alternatively, the unexposed areas remain and the exposed pattern dissolves. The developer is typically an organic or alkaline solution, controlled at a temperature of 23-80°C, for a development time of 0.1-20 minutes.
[0042] The first portion of the conductive layer is the exposed portion after the photoresist is exposed and developed, and the second portion of the conductive layer is the portion still covered by the photoresist after the photoresist is exposed and developed.
[0043] Step S40 , electroplating the first portion to form a conductive circuit 20 .
[0044] It is worth noting that, in some embodiments, the conductive circuit is made of copper.
[0045] It is understood that the thickness of the conductive circuit 20 formed by electroplating can be controlled by adjusting the current density and the electroplating time.
[0046] It is worth noting that, in some embodiments, the electroplating current density is 1A / dm 2 Up to 20A / dm 2 between.
[0047] It is worth noting that, in some embodiments, the electroplating system includes any one of a sulfate system, a pyrophosphate system, and a citrate system.
[0048] Electroplating is a surface treatment technique that utilizes the principles of electrolysis to deposit a layer of another metal or alloy onto a metal surface (corresponding to the conductive layer in the present embodiment). During this process, the developed conductive layer acts as a cathode. Under the action of an electric current, metal ions in the electroplating solution are reduced and deposited as metal atoms on the cathode surface, gradually forming a metal coating, i.e., forming the conductive circuit 20.
[0049] The current density during electroplating is set at 1-20A / dm 2 The current density affects the plating rate and coating quality. Depending on the quality, cost, and emissions requirements of the electroplating, a suitable electroplating system, such as a sulfate system, pyrophosphate system, or organophosphate system, must be selected. These systems provide the metal ions required for electroplating and a suitable electrolytic environment.
[0050] The thickness of the electroplated layer can be controlled by adjusting the current density and plating time. A higher current density results in a faster plating rate, but excessively high current density can lead to reduced coating quality. A longer plating time results in a thicker coating, but excessively long plating times can also have adverse effects, such as increased stress and porosity in the coating. Therefore, in practice, these parameters must be optimized based on specific needs and plating conditions.
[0051] Step S50 , removing the photoresist on the second portion of the conductive layer.
[0052] The photoresist on the second portion of the conductive layer can be removed by using a stripping solution, i.e., a solution such as an organic amine, an inorganic base, or an organic base that can dissolve the photoresist. The temperature for removing the photoresist can be 23-80° C., and the time can be 0.1-20 minutes.
[0053] Step S60: removing the second portion of the conductive layer.
[0054] In some embodiments, the portion of the conductive layer that is not electroplated (the second portion) is removed by a flash etching process, leaving only the conductive circuit 20 formed by electroplating. The prepared glass-based antenna 100 only includes a glass substrate 10 and a conductive circuit 20. Compared with the combination of a film-based antenna and a four-layer structure of glass in the prior art, the glass-based antenna 100 provided in the embodiment of the present application has a small thickness, which expands the scope of application.
[0055] To illustrate the beneficial effects of the glass-based antenna 100 provided in the embodiments of the present application, the applicant compared a film-based antenna in the prior art with the glass-based antenna 100 claimed in the embodiments of the present application, or a glass-based antenna 100 prepared using the method for preparing the glass-based antenna 100 provided in the present application. The thickness of the film-based antenna attached to glass in the prior art and the glass-based antenna 100 provided in the present application were measured. When using the same 3μm thick conductive circuit 20, the thickness of the glass-based antenna 100 provided in the embodiment of the present application is (3μm + thickness of glass substrate 10), while the thickness of the film-based antenna attached to glass in the prior art is (3μm + thickness of film substrate + thickness of OCA adhesive + thickness of glass). Compared to the prior art, the glass-based antenna 100 provided in the embodiment of the present application has less thickness of film substrate and OCA adhesive, and the glass-based antenna 100 provided in the embodiment of the present application is significantly reduced.
[0056] In addition, the applicant tested the optical properties of the film-based antenna in the prior art and the glass-based antenna 100 requested in the embodiments of the present application or the glass-based antenna 100 prepared using the preparation method of the glass-based antenna 100 provided in the present application. The test results are shown in Table 1 below.
[0057] Table 1
[0058]
[0059] As shown in Table 1, compared with the prior art, the glass-based antenna 100 provided in the present application has a reduced yellowing index, improved transmittance, and reduced haze. The glass-based antenna 100 provided in the present application has better optical performance, higher transmittance, lower yellowing index and haze, and is closer to transparent.
[0060] In summary, the glass-based antenna 100 provided in the embodiment of the present application not only has conductive properties, but also has good optical transparency, that is, it has both high transparency and conductive properties, so it can be widely used in building curtain walls, car windshields, smart wearable devices, touch screens, solar panels and other fields.
[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Under the concept of the present invention, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes in different aspects of the present invention as described above. For the sake of simplicity, they are not provided in detail. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A glass-based antenna, characterized in that: The glass-based antenna is composed of a glass substrate and a conductive circuit. The glass substrate includes a first surface and a second surface arranged opposite to each other. The conductive circuit is arranged on the first surface. The line width of the conductive circuit is 1 μm to 10 μm.
2. The glass-based antenna according to claim 1, wherein: The yellowing index of the glass-based antenna is not greater than 0.52, the transmittance of the glass-based antenna is not less than 87.76%, and the haze of the glass-based antenna is not greater than 1.63%.
3. The glass-based antenna according to claim 1, wherein: The conductive circuit is made of copper.
4. The glass-based antenna according to claim 1, wherein: The glass substrate is soda-lime glass.
5. The glass-based antenna according to claim 1, wherein: The light transmittance of the glass substrate is 92.45%.
6. A method for preparing a glass-based antenna, characterized in that: include: forming a conductive layer on a glass substrate, wherein the conductive layer has a thickness of 100 nm to 200 nm; coating a photoresist on the conductive layer; exposing and developing the photoresist so that the first portion of the conductive layer is exposed and the second portion of the conductive layer is covered by the photoresist; electroplating the first portion to form a conductive circuit; removing the photoresist on the second portion of the conductive layer; The second portion of the conductive layer is removed.
7. The method for preparing a glass-based antenna according to claim 6, wherein: The conductive circuit is made of copper.
8. The method for preparing a glass-based antenna according to claim 6, wherein: The electroplating current density is 1A / dm 2 Up to 20A / dm 2 between.
9. The method for preparing a glass-based antenna according to claim 6, wherein: The electroplating system includes any one of a sulfate system, a pyrophosphate system and an organic phosphate system.
10. The method for preparing a glass-based antenna according to claim 6, wherein: The step of forming a conductive layer on the glass substrate includes forming the conductive layer on the glass substrate by using magnetron sputtering technology, evaporation, interface modification and the like.