A fine-grained circuit repair method, system, and circuit board based on fluid flow self-assembly positioning.

Abstract

A method, system, and circuit board for fine circuit repair based on fluid flow self-assembly positioning; the fine circuit repair method includes the following steps: determining the location of the open circuit defect to be repaired in the metal circuit of the circuit board; cleaning and processing the area where the open circuit defect is located in the circuit board to form a groove structure; cutting several short metal wires from a metal wire, the size of the short metal wires matching the inner diameter of the groove structure; dispersing the short metal wires in a copper electroplating filling solution and stirring to form a vortex; placing the cleaned circuit board in the vortex and continuing to stir until the short metal wires fill the groove structure; reinforcing the original metal circuit and the short metal wires, filling the gap between them, and the circuit board is repaired. This solution simplifies the fine circuit repair process, ensures repair quality, has the advantage of accurate defect positioning, and solves the problems of high operation difficulty and high cost in fine circuit repair technology.

Description

Technical Field

[0001] This invention relates to the field of circuit boards, and more particularly to a fine circuit repair method, system, and circuit board based on fluid flow self-assembly positioning. Background Technology

[0002] Printed circuit boards (PCBs) serve as the support structure for electronic components and the carrier for electrical connections. Using PCBs in electronic devices ensures consistency among similar PCBs, reducing errors from manual wiring and enabling automated component insertion or mounting, soldering, and testing. This guarantees the quality of electronic equipment, improves labor productivity, reduces costs, and facilitates repair. With advancements in electronic circuit technology, various circuits are developing towards higher density, higher precision, and greater refinement. More intricate circuits mean more challenging repairs, which ordinary manual and machine repair methods can no longer meet.

[0003] Currently, existing fine circuit repair technologies face challenges in operation. On one hand, excess copper paste is difficult to remove, and unsintered copper paste has viscous properties, easily leaving tiny particles during removal, which can create potential short circuit points. On the other hand, copper paste positioning is difficult, mainly because the repair area of ​​high-density circuits is usually at the micron scale, and traditional mechanical positioning methods cannot achieve precise coating, easily resulting in copper paste misalignment or covering of adjacent circuits. In addition, existing fine circuit repair technologies also suffer from complex sintering processes and poor performance. Summary of the Invention

[0004] The purpose of this invention is to propose a fine circuit repair method based on fluid flow self-assembly positioning, which can simplify the repair process of fine circuits, ensure repair quality, and has the advantage of accurate defect location.

[0005] The present invention also proposes a fine circuit repair method based on fluid flow self-assembly positioning, which includes: a detection and positioning device, a circuit cleaning device, a cutting device, a vortex container, a stirring device, and a circuit reinforcement device.

[0006] The present invention also proposes a circuit board that is repaired by the above-mentioned fine circuit repair method based on fluid flow self-assembly positioning.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] A fine circuit repair method based on fluid flow self-assembly positioning includes the following steps:

[0009] (1) Determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board;

[0010] (2) Clean and process the area where the open circuit defect is located in the circuit board so that the open circuit defect location forms a groove structure;

[0011] (3) Cut several short metal wires from the metal wire, and the size of the short metal wires matches the inner diameter of the groove structure;

[0012] (4) Disperse the short metal wires in the copper electroplating filler solution and stir to form a vortex;

[0013] (5) Place the circuit board after cleaning and processing in step (2) into the eddy formed in step (4), and fix the circuit board in the relative position of the eddy, keep stirring until the metal short wires fill the groove structure.

[0014] (6) Reinforce the original metal lines and short metal wires, fill the gap between them, and the circuit board is repaired.

[0015] Alternatively, in step (2), some of the groove structures can be processed into grooves of a specific size.

[0016] In step (3), some of the metal short wires are cut into specific sizes, and each size of metal short wire corresponds to one or more sizes of groove structure.

[0017] Alternatively, in step (2), some of the groove structures can be processed into grooves of a specific groove type.

[0018] In step (3), some of the metal short wires are cut into specific shapes, and each shape of metal short wire corresponds to a groove structure of a slot type.

[0019] Optimally, in step (3), the amount of metal short wire added is 10-200 wires / mL.

[0020] Alternatively, in step (6), the circuit board is placed in an electrolyte, energized, and electroplated to fill the gap between the original metal lines and the short metal lines, thus completing the circuit board repair.

[0021] Alternatively, in step (6), the original metal wire and the short metal wire are reinforced and the gap between them are filled by at least one of laser sintering, nano-copper hot pressing and arc pulse welding.

[0022] Optimally, in step (3), the material of the metal short wire is at least one of copper, silver and gold, or an alloy of at least two of copper, silver and gold.

[0023] Optimally, in step (3), the size of the metal short wire is smaller than the size of the groove structure, and the size difference between the two is 1-10 μm; the size of the metal short wire is 5-1000 μm.

[0024] A circuit board is modified by the aforementioned fine circuit repair method based on fluid flow self-assembly positioning.

[0025] A precision circuit repair system based on fluid flow self-assembly positioning includes: a detection and positioning device, a circuit cleaning device, a cutting device, a vortex container, a stirring device, and a circuit reinforcement device.

[0026] The detection and positioning device is used to determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board.

[0027] The circuit cleaning device is used to clean and process the area where the open circuit defect is located on the circuit board, so that the open circuit defect location forms a groove structure.

[0028] The cutting device is used to cut several short metal wires from the metal wire, the size of which matches the inner diameter of the groove structure.

[0029] The eddy current container is used to hold copper electroplating filler solution and to receive short metal wires.

[0030] The stirring device is installed in the vortex container and is used to form a vortex in the vortex container, so that the cleaned circuit board moves in the vortex relative to the metal short wires until it is filled into the groove structure by the metal short wires.

[0031] The line reinforcement device is used to reinforce the original metal line and the metal short wire, and to fill the gap between them.

[0032] Compared with the prior art, one of the above technical solutions has the following beneficial effects:

[0033] This solution provides a fine circuit repair method based on fluid flow self-assembly positioning, which simplifies the repair process of fine circuits, ensures repair quality, and has the advantage of accurate defect location. It can solve the problems of high operation difficulty and high cost in fine circuit repair technology. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of one embodiment of a repair method that uses electroplating as a reinforcement treatment;

[0035] Figure 2 This is a schematic diagram of one embodiment of a repair method that uses laser sintering, nano-copper hot pressing, or arc pulse welding as reinforcement treatment.

[0036] in:

[0037] 1. Circuit board; 2. Metal circuit; 3. Metal short wire; 4. Copper electroplating filling solution; 5. Eddy current; 6. Reinforcement treatment; 7. Electrolyte; 21. Open circuit defect location; 22. Groove structure. Detailed Implementation

[0038] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0039] To facilitate understanding of the present invention, a more comprehensive description is provided below. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of the present invention. Where specific techniques or conditions are not specified in the embodiments, they are performed in accordance with techniques or conditions described in the literature in the art or according to product instructions. Reagents or instruments used, unless otherwise specified, are all conventional products that can be obtained commercially.

[0040] like Figure 1 A fine circuit repair method based on fluid flow self-assembly positioning includes the following steps:

[0041] (1) Determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board;

[0042] Among them, the metal circuit can be an embedded circuit, with a portion of it located inside the circuit board.

[0043] The location of an open circuit defect can be identified through known methods, such as visual inspection or resistance measurement with a multimeter; it can also be achieved through circuit diagram analysis and signal path tracing, or infrared thermal imaging detection; the goal is simply to determine the location of the open circuit defect. In a preferred embodiment, an AOI device is used to identify the defect location using machine vision algorithms. During automatic inspection, the AOI device automatically scans the metal circuit with a camera, acquires images, and compares the tested solder joints with qualified parameters in the database. After image processing, defects on the metal circuit are detected, and the defects are displayed and / or marked.

[0044] (2) Clean and process the area where the open circuit defect is located in the circuit board so that the open circuit defect location forms a groove structure;

[0045] After the location of the open circuit defect is discovered, the open circuit defect location or its surrounding area is cleaned and processed. Cleaning mainly removes residual impurities, such as some residual metal lines. Processing mainly involves creating a groove structure, which is a groove structure with a certain length and depth.

[0046] (3) Cut several short metal wires from the metal wire, and the size of the short metal wires matches the inner diameter of the groove structure;

[0047] Take a metal wire and cut out several short metal wires. The size of the short metal wires matches the size of the groove structure in step (2). That is, the outer diameter of the short metal wires can be contained in the groove structure, and the length of the short metal wires does not exceed the length of the groove structure. One or several short metal wires can be contained in the same groove structure. The short metal wires can be completely contained in the groove structure, or they can partially extend out of the groove structure. Since the length of the short metal wires does not exceed the length of the groove structure, a gap will be formed between the groove structure and the short metal wires.

[0048] (4) Disperse the short metal wires in the copper electroplating filler solution and stir to form a vortex;

[0049] After applying the copper plating filler solution to the short metal wire, the solution is stirred using a known method. This creates a vortex, which gives the short metal wire a certain degree of fluidity. The copper plating filler solution is a known solution used in electroplating. Its main salt can be selected as copper sulfate, cyanide copper plating, copper pyrophosphate, copper carbonate, or other main salts that can ionize to produce divalent copper ions. Leveling agents, accelerators, and inhibitors, accounting for no more than 1% of the total mass, can be added as needed. The formula can be adjusted as required.

[0050] (5) Place the circuit board after cleaning and processing in step (2) into the eddy formed in step (4), and fix the circuit board in the relative position of the eddy, keep stirring until the metal short wires fill the groove structure.

[0051] After the circuit board is fixed in the eddy current, the short metal wires are fluid; the dimensions of the short metal wires are slightly smaller than the groove structure, for example, the length of the short metal wires is 1-10 μm shorter than the length and / or width of the groove structure. Therefore, the short metal wires will flow relatively and embed themselves in the groove structure, making them less likely to be carried out by the liquid. During stirring, the short metal wires will also gather towards the center of the eddy current. Therefore, this solution uses random stirring to ensure that the circuit board is close to the short metal wires. The relative position of the circuit board in the eddy current can be determined as needed, for example, it can be vertically distributed at the center of the eddy current or horizontally distributed below the eddy current. Stirring can be maintained, and stirring parameters can be controlled during the process, such as by controlling the eddy current through stirring rate, angle, or position, making it easier for the eddy current to deliver the short metal wires into the groove structure.

[0052] (6) Reinforce the original metal lines and short metal wires, fill the gap between them, and the circuit board is repaired.

[0053] This step can be done using known methods to reinforce the original metal circuitry with the newly filled metal short wires in the groove structure, and to fill the gap between the two, ultimately obtaining a repaired circuit board.

[0054] This solution provides a fine circuit repair method based on fluid flow self-assembly positioning, which simplifies the repair process of fine circuits, ensures repair quality, and has the advantage of accurate defect location. It can solve the problems of high operation difficulty and high cost in fine circuit repair technology.

[0055] Alternatively, in step (2), some of the groove structures can be processed into grooves of a specific size.

[0056] In step (3), some of the metal short wires are cut into specific sizes, and each size of metal short wire corresponds to one or more sizes of groove structure.

[0057] In step (2), this solution can process at least one groove structure of a specific length, with different dimensions. Each size of metal short wire corresponds to at least one groove structure with an inner diameter, so a metal short wire of one size can be directionally filled into one or more specific groove structures; a large-sized groove structure can also accommodate small-sized metal short wires; thus, the filling type of metal short wires in this solution is not singular, and the shape and size of both the metal short wire and the groove structure can be designed according to needs. It can also accommodate smaller-sized metal short wires through a single groove structure, and can perform targeted directional filling design for specific defect locations on the circuit board, so as to fill multiple specific defects at once, simplifying the repair process of fine circuits, ensuring repair quality, and having the advantage of precise defect positioning. For example, all defects on the same substrate can be cleaned to form open-circuit defects into specific groove structures of three sizes, and three different sizes of metal short wires can be added. The three metal short wires are respectively matched with the size of one of the groove structures; due to size limitations, a specific size of metal short wire can only enter one of the groove structures. For example, all defects on the same substrate can be cleaned to form open-circuit defects into specific groove structures of three sizes. Three different sizes of short metal wires can be added, and the large-sized groove structure can be filled by the other two small-sized short metal wires.

[0058] Alternatively, in step (2), some of the groove structures can be processed into grooves of a specific groove type.

[0059] In step (3), some of the metal short wires are cut into specific shapes, and each shape of metal short wire corresponds to a groove structure of a slot type.

[0060] This solution can process at least one specific groove shape in step (2), such as a long circular groove, a rectangular groove, a trapezoidal groove, or other regular or irregular shapes. Each shape of metal short wire corresponds to a specific groove shape, so only one shape of metal short wire can be directionally filled into a specific groove shape. Thus, the filling type of the metal short wire in this solution is not limited. The shape and size of both the metal short wire and the groove structure can be designed according to needs, and targeted processing can be carried out for the location of specific defects on the circuit board. This allows multiple specific defects to be filled at once, simplifying the repair process of fine circuits, ensuring repair quality, and providing the advantage of accurate defect positioning.

[0061] Optimally, in step (3), the amount of metal short wire added is 10-200 wires / mL.

[0062] The amount of metal short wires added can be determined as needed. This solution is preferably for groove structures with a length range of 5-1000μm, with an addition amount of 10-200 wires / mL. At this addition amount, the number of metal short wires gathered at the center of the vortex is appropriate, and the metal short wires have the best filling effect in the groove structure, resulting in the highest filling effect.

[0063] In step (2), the cleaning method for the area where the open circuit defect is located on the circuit board is at least one of laser cleaning, chemical etching and fine cutting.

[0064] Laser cleaning offers advantages such as being non-abrasive, non-contact, heat-free, and suitable for various materials. Chemical etching removes materials using chemical reactions or physical impacts; precision cutting can be achieved through laser cutting, waterjet cutting, and plasma cutting. This solution is compatible with a variety of different cleaning methods.

[0065] Alternatively, in step (6), the circuit board is placed in an electrolyte, energized, and electroplated to fill the gap between the original metal lines and the short metal lines, thus completing the circuit board repair.

[0066] like Figure 1The circuit board is placed in electrolyte 7, and a direct current is applied to it. The positive terminal is connected to a metal plate, and the negative terminal is connected to the circuit board, allowing for electroplating. In the copper electroplating filling solution, electroplating preferentially occurs at the holes and grooves, filling the gaps between the original metal lines and the newly filled metal short lines in the groove structure, ultimately resulting in a repaired circuit board. According to common knowledge in electroplating, mechanisms such as uneven current density distribution, edge effects, and differences in electrolyte flowability form a barrier film in high current density areas (hole openings), inhibiting metal deposition while promoting ion migration and reduction in low current density areas (within the holes). This allows electroplating to preferentially occur at the holes and grooves, thus filling the gaps between the original lines and the metal short lines.

[0067] Alternatively, in step (6), the original metal wire and the short metal wire are reinforced and the gap between them are filled by at least one of laser sintering, nano-copper hot pressing and arc pulse welding.

[0068] As an alternative to electroplating, this solution can use laser sintering, nano-copper hot pressing, and arc pulse welding for reinforcement and filling; in some embodiments, such as Figure 2 For reinforcement treatment 6, laser sintering, nano-copper hot pressing, and arc pulse welding can be selected as needed for reinforcement and filling.

[0069] Laser sintering is a layered processing technology. First, the three-dimensional model is sliced ​​into multiple two-dimensional cross-sections. The laser beam scans the powder material (such as metal or polymer powder) layer by layer according to the slice data, melting and solidifying it to form a solid layer. After each layer is sintered, the powder bed is lowered and new powder is spread. This process is repeated until the entire three-dimensional object is manufactured. Specifically, the laser is used to irradiate the metal short wires and the original circuit at the position of the notch in the groove structure. The circuit near the notch is remelted and connected into one piece.

[0070] The hot-pressing method for nano-copper bonds nanomaterials to a matrix through heating and pressurization. Due to their small size, large specific surface area, and high activity, nano-copper particles are more prone to plastic deformation during hot pressing. Applying pressure at high temperatures breaks down the oxide layer on the material surface, promoting diffusion bonding between atoms and forming a dense connection. Specifically, after the short metal wires are plastically deformed from the original circuitry, the circuitry near the notch becomes integrated.

[0071] Arc pulse welding, based on the fundamentals of arc welding, uses pulsed current to periodically adjust the arc energy. During the high-energy phase of the pulse, the arc instantly melts the welding material and the base material. Specifically, by applying a pulsed current to the circuit, the circuit near the gap remelts and fuses together.

[0072] Optimally, in step (3), the material of the metal short wire is at least one of copper, silver and gold, or an alloy of at least two of copper, silver and gold.

[0073] The main considerations for choosing copper, silver, and gold as the sole metals for short-term trading are:

[0074] Copper is the cheapest of the three materials, making it suitable for low-cost repair scenarios. When the surface is not oxidized, its welding performance is stable, making it suitable for ordinary circuit connections.

[0075] Silver has the lowest resistivity, making it suitable for repairing high-frequency or high-precision circuits. It also has better heat dissipation performance than copper and gold, making it suitable for repairing components that are prone to overheating.

[0076] Gold is virtually non-oxidizing and maintains its conductivity even after long-term use, making it suitable for high-reliability repairs. Furthermore, gold has strong resistance to chemical corrosion, making it suitable for harsh environments or scenarios requiring high durability.

[0077] For alloys of copper, silver, and gold, their properties can be adjusted by changing the composition ratio to meet different needs.

[0078] Optimally, in step (3), the size of the metal short wire is smaller than the size of the groove structure, and the size difference between the two is 5-1000μm.

[0079] The size of the short metal wire is slightly smaller than that of the groove structure, preferably with a size difference of 1-10 μm. This size difference ensures that once the short metal wire enters the groove structure, it is not easily detached due to the spatial steric hindrance within the groove structure. Here, the size difference refers to the dimension in the same direction between the short metal wire and the groove structure, such as the difference in size along the length, width, and thickness of the short metal wire. The short metal wire can be a regular shape such as a strip or rod, or it can be an irregular shape.

[0080] A circuit board is modified by a fine circuit repair method based on fluid flow self-assembly positioning according to any of the above embodiments.

[0081] A precision circuit repair system based on fluid flow self-assembly positioning includes: a detection and positioning device, a circuit cleaning device, a cutting device, a vortex container, a stirring device, and a circuit reinforcement device.

[0082] The detection and positioning device is used to determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board.

[0083] The circuit cleaning device is used to clean and process the area where the open circuit defect is located on the circuit board, so that the open circuit defect location forms a groove structure.

[0084] The cutting device is used to cut several short metal wires from the metal wire, the size of which matches the inner diameter of the groove structure.

[0085] The eddy current container is used to hold copper electroplating filler solution and to receive short metal wires.

[0086] The stirring device is installed in the vortex container and is used to form a vortex in the vortex container, so that the cleaned circuit board moves in the vortex relative to the metal short wires until it is filled into the groove structure by the metal short wires.

[0087] The line reinforcement device is used to reinforce the original metal line and the metal short wire, and to fill the gap between them.

[0088] The detection and positioning device, circuit cleaning device, cutting device, eddy current container, stirring device, and circuit reinforcement device are replacements for devices involved in known circuit repair processes, and they only need to achieve the corresponding functions. For example, for the detection and positioning device, it is sufficient to identify the location of the open circuit defect to be repaired; for the circuit cleaning device, it is sufficient to form a groove structure; for the cutting device, it is sufficient to cut out short metal wires; for the eddy current container, it is sufficient to be able to hold copper electroplating filling solution; for the stirring device, it is sufficient to perform stirring to form an eddy current; and the circuit reinforcement device is one of the following: electroplating processing line, laser sintering processing line, nano-copper hot pressing processing line, and arc pulse welding processing line.

[0089] Example 1:

[0090] (1) Use AOI equipment to determine the location of open circuit defects to be repaired in the metal lines of the circuit board;

[0091] (2) Use laser cleaning to clean the area where the open circuit defect is located on the circuit board, so that the open circuit defect location forms a groove structure; the groove structure is a rectangular groove.

[0092] (3) Cut several short metal wires from the metal wire. The size of the short metal wires matches the inner diameter of the groove structure. The size of the short metal wires is controlled to be 3-4 μm smaller than the inner diameter of the groove structure. The amount of short metal wires added is 50 wires / mL. The material of the short metal wires is copper. The copper is in the shape of a strip with an outer diameter of 20 μm and a length of 100 μm.

[0093] (4) Disperse the metal short wires in the copper electroplating filling solution, and use a stirring device to stir the copper electroplating filling solution to form a vortex; the main salt of the copper electroplating filling solution is copper sulfate, and the copper ion concentration is 30g / L.

[0094] (5) Place the circuit board after cleaning and processing in step (2) into the eddy formed in step (4), and fix the circuit board in the relative position of the eddy, keep stirring until the metal short wires fill the groove structure.

[0095] (6) Place the circuit board in the electrolyte, energize the circuit board, and perform electroplating to fill the gap between the original metal lines and the short metal lines, thus completing the circuit board repair.

[0096] Example 2:

[0097] (1) Use AOI equipment to determine the location of open circuit defects to be repaired in the metal lines of the circuit board;

[0098] (2) Use chemical etching to clean and process the area where the open circuit defect is located in the circuit board, so that the open circuit defect location forms a groove structure; the groove structure is a rectangular groove.

[0099] (3) Cut several short metal wires from the metal wire. The size of the short metal wires matches the inner diameter of the groove structure. The size of the short metal wires is controlled to be 2-5 μm smaller than the inner diameter of the groove structure. The amount of short metal wires added is 10 wires / mL. The material of the short metal wires is gold. The gold is in the shape of a strip with an outer diameter of 20 μm and a length of 50 μm.

[0100] (4) Disperse the metal short wires in the copper electroplating filling solution, and use a stirring device to stir the copper electroplating filling solution to form a vortex; the main salt of the copper electroplating filling solution is copper pyrophosphate, and the copper ion concentration is 70g / L.

[0101] (5) Place the circuit board after cleaning and processing in step (2) into the eddy formed in step (4), and fix the circuit board in the relative position of the eddy, keep stirring until the metal short wires fill the groove structure.

[0102] (6) The original metal circuit and short metal wire are reinforced by laser sintering and the gap between them is filled, and the circuit board is repaired.

[0103] Example 3:

[0104] (1) Use AOI equipment to determine the location of open circuit defects to be repaired in the metal lines of the circuit board;

[0105] (2) Use a fine cutting method to clean and process the area where the open circuit defect is located in the circuit board, so that the open circuit defect location forms a groove structure; the groove structure is a rectangular groove.

[0106] (3) Cut several short metal wires from the metal wire. The size of the short metal wires matches the inner diameter of the groove structure. The size of the short metal wires is controlled to be 7-10 μm smaller than the inner diameter of the groove structure. The amount of short metal wires added is 200 wires / mL. The material of the short metal wires is silver. The silver is in the shape of a strip with an outer diameter of 25 μm and a length of 100 μm.

[0107] (4) Disperse the metal short wires in the copper electroplating filling solution, and use a stirring device to stir the copper electroplating filling solution to form a vortex; the main salt of the copper electroplating filling solution is copper carbonate, and the copper ion concentration is 70g / L.

[0108] (5) Place the circuit board after cleaning and processing in step (2) into the eddy formed in step (4), and fix the circuit board in the relative position of the eddy, keep stirring until the metal short wires fill the groove structure.

[0109] (6) The original metal circuit and short metal wire are reinforced by using the arc pulse welding method, and the gap between them is filled, thus completing the circuit board repair.

[0110] Example 4:

[0111] (1) Use AOI equipment to determine the location of open circuit defects to be repaired in the metal lines of the circuit board;

[0112] (2) Use laser cleaning to clean the area where the open circuit defect is located on the circuit board, so that the open circuit defect location forms a groove structure;

[0113] (3) Cut several short metal wires from the metal wire, and the size of the short metal wires matches the inner diameter of the groove structure;

[0114] One type of short metal wire is 3-4 μm smaller than the inner diameter of the groove structure. The amount of this short metal wire added is 50 wires / mL. The material is copper. The copper wire is long and thin, with an outer diameter of 20 μm and a length of 100 μm. The corresponding groove structure is a rectangular groove.

[0115] One type of short metal wire is sized to be 1-2 μm smaller than the inner diameter of the groove structure. The amount of this short metal wire added is 50 wires / mL, and the material is silver. The silver wire is long and thin, with an outer diameter of 25 μm and a length of 60 μm. The corresponding groove structure is a rectangular groove.

[0116] One type of short metal wire is sized to be 2-3 μm smaller than the inner diameter of the groove structure. The amount of this short metal wire added is 100 wires / mL, and the material is silver. The silver wire is long and thin, with an outer diameter of 10 μm and a length of 20 μm. The corresponding groove structure is a rectangular groove.

[0117] (4) Disperse the metal short wires in the copper electroplating filling solution, and use a stirring device to stir the copper electroplating filling solution to form a vortex; the main salt of the copper electroplating filling solution is copper sulfate, and the copper ion concentration is 30g / L.

[0118] (5) Place the circuit board after cleaning and processing in step (2) into the eddy formed in step (4), and fix the circuit board in the relative position of the eddy, keep stirring until the metal short wires fill the groove structure.

[0119] (6) Place the circuit board in the electrolyte, energize the circuit board, and perform electroplating to fill the gap between the original metal lines and the short metal lines, thus completing the circuit board repair.

[0120] Example 5:

[0121] (1) Use AOI equipment to determine the location of open circuit defects to be repaired in the metal lines of the circuit board;

[0122] (2) Use laser cleaning to clean the area where the open circuit defect is located on the circuit board, so that the open circuit defect location forms a groove structure;

[0123] (3) Cut several short metal wires from the metal wire, and the size of the short metal wires matches the inner diameter of the groove structure;

[0124] One type of short metal wire has a size controlled to be 3-4 μm smaller than the inner diameter of the groove structure. The amount of this short metal wire added is 50 wires / mL, and the material is copper. Copper is a regular hexahedron with a length, width, and height of 30 μm. The corresponding groove structure is a square groove.

[0125] One type of short metal wire is 5-10 μm smaller than the inner diameter of the groove structure. The amount of this short metal wire added is 10 wires / mL. The material is copper. The copper wire is long and thin, with an outer diameter of 100 μm and a length of 500 μm. The corresponding groove structure is a rectangular groove.

[0126] (4) Disperse the metal short wires in the copper electroplating filling solution, and use a stirring device to stir the copper electroplating filling solution to form a vortex; the main salt of the copper electroplating filling solution is copper sulfate, and the copper ion concentration is 30g / L.

[0127] (5) Place the circuit board after cleaning and processing in step (2) into the eddy formed in step (4), and fix the circuit board in the relative position of the eddy, keep stirring until the metal short wires fill the groove structure.

[0128] (6) Place the circuit board in the electrolyte, energize the circuit board, and perform electroplating to fill the gap between the original metal lines and the short metal lines, thus completing the circuit board repair.

[0129] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A fine circuit repair method based on fluid flow self-assembly positioning, characterized in that, Includes the following steps: (1) Determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board; (2) Clean and process the area where the open circuit defect is located in the circuit board so that the open circuit defect location forms a groove structure; (3) Cut several short metal wires from the metal wire, and the size of the short metal wires matches the inner diameter of the groove structure; (4) Disperse the short metal wires in the copper electroplating filler solution and stir to form a vortex; (5) Place the circuit board after cleaning and processing in step (2) into the eddy formed in step (4), and fix the circuit board in the relative position of the eddy, keep stirring until the metal short wires fill the groove structure. (6) Reinforce the original metal lines and short metal wires, fill the gap between them, and the circuit board is repaired.

2. The fine circuit repair method based on fluid flow self-assembly positioning according to claim 1, characterized in that, In step (2), some of the groove structures are respectively processed into grooves of a specific size; In step (3), some of the metal short wires are cut into specific sizes, and each size of metal short wire corresponds to one or more sizes of groove structure.

3. The fine circuit repair method based on fluid flow self-assembly positioning according to claim 1, characterized in that, In step (2), some of the groove structures are processed into grooves of a specific groove type; In step (3), some of the metal short wires are cut into specific shapes, and each shape of metal short wire corresponds to a groove structure of a slot type.

4. The fine circuit repair method based on fluid flow self-assembly positioning according to claim 1, characterized in that, In step (3), the amount of metal short wire added is 10-200 wires / mL.

5. The fine circuit repair method based on fluid flow self-assembly positioning according to claim 1, characterized in that, In step (6), the circuit board is placed in an electrolyte, energized, and electroplated to fill the gap between the original metal lines and the short metal lines, thus completing the circuit board repair.

6. The fine circuit repair method based on fluid flow self-assembly positioning according to claim 1, characterized in that, In step (6), the original metal wire and the short metal wire are reinforced and the gap between them are filled by at least one of laser sintering, nano-copper hot pressing and arc pulse welding.

7. The fine circuit repair method based on fluid flow self-assembly positioning according to claim 1, characterized in that, In step (3), the metal short wire is made of at least one of copper, silver and gold, or an alloy of at least two of copper, silver and gold.

8. A fine circuit repair method based on fluid flow self-assembly positioning according to any one of claims 1-7, characterized in that, In step (3), the size of the metal short wire is smaller than the size of the groove structure, and the size difference between the two is 1-10 μm; the size of the metal short wire is 5-1000 μm.

9. A circuit board, characterized in that, The fine circuit repair method based on fluid flow self-assembly positioning described in any one of claims 1-8 is modified.

10. A fine circuit repair system based on fluid flow self-assembly positioning, characterized in that, include: Detection and positioning devices, line cleaning devices, cutting devices, eddy current containers, stirring devices, and line reinforcement devices; The detection and positioning device is used to determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board. The circuit cleaning device is used to clean and process the area where the open circuit defect is located on the circuit board, so that the open circuit defect location forms a groove structure. The cutting device is used to cut several short metal wires from the metal wire, the size of which matches the inner diameter of the groove structure. The eddy current container is used to hold copper electroplating filler solution and to receive short metal wires. The stirring device is installed in the vortex container and is used to form a vortex in the vortex container, so that the cleaned circuit board moves in the vortex relative to the metal short wires until it is filled into the groove structure by the metal short wires. The line reinforcement device is used to reinforce the original metal line and the metal short wire, and to fill the gap between them.

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