Heat dissipation structure of electronic device

Abstract

The invention discloses a heat dissipation structure of an electronic device. The heat dissipation structure of the electronic device comprises an electronic element, a radiator and an elastic heat dissipation structure, the radiator is opposite to the electronic element along a first direction; the elastic heat dissipation structure is arranged between the electronic element and the heat dissipation device in the first direction and comprises a first elastic arm and a second elastic arm, the first elastic arm comprises a first fixed end and a first movable end, and the second elastic arm comprises a second fixed end and a second movable end. The first fixed end and the second fixed end are fixedly connected to one of the electronic component and the radiator, and the first movable end and the second movable end are in contact with the other one of the electronic component and the radiator; the first movable end and the second movable end are separated by a first distance before being pressed, the first movable end and the second movable end are separated by a second distance after being pressed, and the second distance is larger than the first distance. Through the configuration of the elastic heat dissipation structure, the tolerance can be absorbed through elasticity, and the good heat conduction performance of the elastic heat dissipation structure can be beneficial for improving the heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to a heat dissipation structure, and in particular to a heat dissipation structure for an electronic device. Background Art

[0002] With the development of technology, the number of electronic components included in the module has increased. When the electronic components are powered on, they will generate heat, so a heat sink is needed to dissipate the heat. Common heat sinks include heat pipes and heat sink fins. Heat pipes can be used to connect multiple electronic components (heat sources) and heat sink fins to achieve a heat dissipation effect. Heat pipes are set with multiple fixed points on the heat sink fins and pass through multiple electronic components. There are often tolerances between the fixed points, so thermal interface materials such as thermal pads or thermal grease can be used to solve this problem. However, in some cases, such as when the tolerance is too large, thermal grease cannot be used alone, and a thermal pad must be used, or a thermal pad must be used in combination with thermal grease.

[0003] Thermally conductive sheets can be placed between the heat sink and electronic components, and their compression can absorb tolerances. However, common thermally conductive sheets have a maximum thermal conductivity of 20W / mk and require a thickness of 1mm. This is less effective than thermal paste, which has a thermal conductivity of 5W / mk to 6W / mk and can be nearly 0mm thick.

[0004] Furthermore, since spring screws are used to secure electronic components, a spring force is generated between the components and the heat sink, thus absorbing tolerances. However, if the heat sink itself is constructed as a housing, conventional screws must be used for securing. This, when faced with large structural tolerances, requires the use of thicker thermal pads or additional metal blocks to absorb the tolerances, resulting in reduced heat transfer efficiency.

[0005] Although some companies have made improvements to the heat sink itself, such as machining bumps of different heights on the aluminum extruded heat sink fins to match the thermal pad to absorb tolerances, these bumps are generally machined using CNC, which significantly increases manufacturing costs.

[0006] In view of this, how to improve the heat dissipation structure of electronic devices including electronic components and heat sinks to enable convenient spatial configuration and higher thermal conductivity has become a goal of relevant industry players. Summary of the Invention

[0007] According to one embodiment of the present invention, a heat dissipation structure for an electronic device is provided, comprising an electronic component, a heat sink, and an elastic heat dissipation structure. The heat sink is opposite to the electronic component along a first direction. The elastic heat dissipation structure is disposed between the electronic component and the heat sink along the first direction, and comprises a first elastic arm and a second elastic arm. The first elastic arm comprises a first fixed end and a first movable end opposite to each other in the first direction, and the second elastic arm comprises a second fixed end and a second movable end opposite to each other in the first direction. The first fixed end and the second fixed end are fixedly connected to one of the electronic component and the heat sink, and the first movable end and the second movable end contact the other of the electronic component and the heat sink. When the elastic heat dissipation structure is subjected to a pressure in the first direction, the first movable end and the second movable end are allowed to move in a second direction. Before being subjected to pressure, the first movable end and the second movable end are separated by a first spacing, and after being subjected to pressure, the first movable end and the second movable end are separated by a second spacing, and the second spacing is greater than the first spacing.

[0008] According to another embodiment of the present invention, a heat dissipation structure for an electronic device is provided, comprising an electronic component, a heat sink, and an elastic heat dissipation structure. The heat sink is opposite to the electronic component along a first direction. The elastic heat dissipation structure is arranged between the electronic component and the heat sink along the first direction, and the elastic heat dissipation structure comprises a plurality of first elastic arms and a plurality of second elastic arms, each first elastic arm comprising a first fixed end and a first movable end opposite in the first direction, each second elastic arm comprising a second fixed end and a second movable end opposite in the first direction, each first fixed end and each second fixed end being fixed to one of the electronic component and the heat sink, and each first movable end and each second movable end contacting the other of the electronic component and the heat sink. When the elastic heat dissipation structure is subjected to a pressure in the first direction, the one of the plurality of first movable ends closest to the plurality of second movable ends and the one of the plurality of second movable ends closest to the plurality of first movable ends are allowed to move away from each other in a second direction.

[0009] Through the configuration of the elastic heat dissipation structure of the present invention, the elasticity can be used to absorb the tolerance, and the good thermal conductivity of the elastic heat dissipation structure can also help to improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 FIG2 is a schematic front view of a heat dissipation structure of an electronic device according to a first embodiment of the present invention;

[0011] Figure 2 Draw Figure 1 A three-dimensional schematic diagram of an elastic heat dissipation structure of the electronic device heat dissipation structure of the first embodiment;

[0012] Figure 3 Draw Figure 1 An animated diagram of the assembly of the heat dissipation structure of the electronic device according to the first embodiment;

[0013] Figure 4 FIG2 is a schematic front view of a heat dissipation structure of an electronic device according to a second embodiment of the present invention;

[0014] Figure 5 A schematic perspective view of a first elastic arm and a second elastic arm of a heat dissipation structure for an electronic device according to a third embodiment of the present invention is shown;

[0015] Figure 6 A schematic cross-sectional view illustrating the connection between a first elastic arm and a second elastic arm and a substrate of a heat dissipation structure for an electronic device according to a fourth embodiment of the present invention is shown;

[0016] Figure 7 A schematic front view of a heat sink and an elastic heat dissipation structure of a heat dissipation structure for an electronic device according to a fifth embodiment of the present invention is shown;

[0017] Figure 8 A schematic perspective view of an elastic heat dissipation structure of a heat dissipation structure for an electronic device according to a sixth embodiment of the present invention is shown;

[0018] Figure 9 A partial front view schematically illustrates a first elastic arm and a second elastic arm of a heat dissipation structure for an electronic device according to a seventh embodiment of the present invention;

[0019] Figure 10 A schematic front view of an elastic heat dissipation structure of an electronic device heat dissipation structure according to an eighth embodiment of the present invention is shown; and

[0020] Figure 11 FIG. 4 is a front view schematic diagram of an elastic heat dissipation structure of a heat dissipation structure for an electronic device according to a ninth embodiment of the present invention.

[0021] Description of main component symbols:

[0022] 1000, 2000 electronic device heat dissipation structure 1100, 2100 electronic components

[0023] 1200, 2200 circuit boards

[0024] 1300, 2300, 5300 radiators

[0025] 1400, 2400, 5400, 6400, 8400, 9400 elastic heat dissipation structure

[0026] 1411 First movable end

[0027] 1412 First fixed end

[0028] 14141 First contact plane

[0029] 1415 The First Groove

[0030] 1421 Second movable end

[0031] 1422 Second fixed end

[0032] 14241 Second contact plane

[0033] 1425 The Second Trench

[0034] 1430, 2430, 4430 base plate

[0035] 1500, 2500 thermal paste

[0036] 2210 Conductive Via

[0037] 2416, 3416, 4416, 6416, 8416, 9416 First bottom plate

[0038] 2426, 3426, 4426, 6426, 8426, 9426 Second bottom plate

[0039] 3417 First Through Hole

[0040] 3427 Second Through Hole

[0041] 4418 First Bump

[0042] 4428 Second bump

[0043] 4431 First Groove

[0044] 4432 Second Groove

[0045] 5430a, 6430a first substrate

[0046] 5430b, 6430b second substrate

[0047] 7419 First Groove

[0048] 7429 Second groove

[0049] 8419, 9419 First support

[0050] 8429, 9429 Second support part

[0051] 9413a First Upper Body

[0052] 9413b First lower body

[0053] 9423a Second upper body

[0054] 9423b Second lower body

[0055] 9419a First upper half

[0056] 9419b First lower half

[0057] 9429a Second upper half

[0058] 9429b Second lower half

[0059] D1 first spacing

[0060] D2 second spacing

[0061] G1, G2 clearance

[0062] S1 solder paste

[0063] X, Y, and Z axes

[0064] θ1 first angle

[0065] θ2 Second angle

[0066] 1410, 2410, 3410, 4410, 5410a, 5410b, 5410c, 6410, 7410, 8410, 9410: First elastic arm

[0067] 1413, 2413, 3413, 4413, 5413a, 5413b, 5413c, 6413, 7413, 8413, 9413: The first body part

[0068] 1414, 2414, 3414, 4414, 5414a, 5414b, 5414c, 6414, 7414, 8414, 9414: First flat plate

[0069] 1420, 2420, 3420, 4420, 5420a, 5420b, 5420c, 6420, 7420, 8420, 9420: Second elastic arm

[0070] 1423, 2423, 3423, 4423, 5423a, 5423b, 5423c, 6423, 7423, 8423, 9423: Second body

[0071] 1424, 2424, 3424, 4424, 5424a, 5424b, 5424c, 6424, 7424, 8424, 9424: Second flat plate DETAILED DESCRIPTION

[0072] The following describes embodiments of the present invention with reference to the accompanying drawings. For clarity, many practical details will be included in the following description. However, the reader should understand that these practical details are not intended to limit the present invention. In other words, in some embodiments of the present invention, these practical details are not essential. Furthermore, to simplify the drawings, some well-known and commonly used structures and components are depicted in simplified schematic form; and repeated components may be represented using the same or similar numbers.

[0073] In addition, herein, when a certain element (or mechanism or module, etc.) is connected (or contacts, is set or coupled, etc.) to another element, it may refer to that the element is directly connected (or directly contacts, directly set or directly coupled, etc.) to another element, or it may refer to that a certain element is indirectly connected (or indirectly contacts, indirectly set or indirectly coupled, etc.) to another element, that is, there are other elements between the element and the other element. When it is explicitly stated that a certain element is directly connected (or directly contacts, directly set or directly coupled, etc.) to another element, it means that there are no other elements between the element and the other element. The terms first, second, third, etc. are only used to describe different elements or components, and there is no restriction on the elements / components themselves. Therefore, the first element / component may also be referred to as the second element / component. Moreover, the combination of elements / components / mechanisms / modules herein is not a generally known, conventional or well-known combination in this field, and whether the elements / components / mechanisms / modules themselves are well-known cannot be used to determine whether their combination relationship is easy to be easily completed by ordinary technicians in the technical field.

[0074] See also Figure 1 、 Figure 2 as well as Figure 3 ,in Figure 1 FIG. 1 is a front view schematic diagram of a heat dissipation structure 1000 for an electronic device according to a first embodiment of the present invention. Figure 2 Draw Figure 1 A three-dimensional schematic diagram of an elastic heat dissipation structure 1400 of the heat dissipation structure 1000 of the electronic device according to the first embodiment, Figure 3 Draw Figure 1 FIG1 is an assembly diagram of the heat dissipation structure 1000 of an electronic device according to the first embodiment. The heat dissipation structure 1000 of an electronic device includes an electronic component 1100, a heat sink 1300 and an elastic heat dissipation structure 1400.

[0075] The heat sink 1300 is opposite to the electronic component 1100 along a first direction (parallel to the Z-axis). The elastic heat dissipation structure 1400 is disposed between the electronic component 1100 and the heat sink 1300 along the first direction. The elastic heat dissipation structure 1400 includes a first elastic arm 1410 and a second elastic arm 1420. The first elastic arm 1410 includes a first movable end 1411 and a first fixed end 1412 that are opposite in the first direction. The second elastic arm 1420 includes a second movable end 1421 and a second fixed end 1422 that are opposite in the first direction. The first fixed end 1412 and the second fixed end 1422 are fixedly connected to one of the electronic component 1100 and the heat sink 1300 (in the first embodiment, they are indirectly fixed to the electronic component 1100). The first movable end 1411 and the second movable end 1421 contact the other of the electronic component 1100 and the heat sink 1300 (in the first embodiment, they indirectly contact the heat sink 1300). When the elastic heat dissipation structure 1400 is subjected to pressure in a first direction, the first movable end 1411 and the second movable end 1421 are allowed to move in a second direction (parallel to the X-axis). Before the pressure is applied, the first movable end 1411 and the second movable end 1421 are separated by a first distance D1. After the pressure is applied, the first movable end 1411 and the second movable end 1421 are separated by a second distance D2, which is greater than the first distance D1. The first direction and the second direction are different. In this embodiment, the first direction corresponds to the vertical direction, and the second direction corresponds to the longitudinal direction.

[0076] Thus, the first elastic arm 1410 and the second elastic arm 1420 can be deformed when compressed, thereby absorbing the tolerance between the electronic component 1100 and the heat sink 1300. The details of the electronic device heat dissipation structure 1000 will be described in detail later.

[0077] The electronic component 1100 can be placed on a circuit board 1200. When the electronic component 1100 is powered on, it will generate heat. The heat can be transferred to the heat sink 1300 through the elastic heat dissipation structure 1400. The heat sink 1300 can include heat dissipation fins and heat pipes. Figure 1 The example is a heat sink fin, but the invention is not limited thereto.

[0078] In the elastic heat dissipation structure 1400, the first elastic arm 1410 and the second elastic arm 1420 can be made of a thin sheet made of a material with elasticity and high thermal conductivity. The first elastic arm 1410 and the second elastic arm 1420 can be curved or include angles, enabling them to have the resilience of a spring after repeated compression. The first elastic arm 1410 and the second elastic arm 1420 can be made of a metal material, and the thermal conductivity of the metal material can be above 250 W / mk, and furthermore, between 300 W / mk and 450 W / mk. In the first embodiment, the metal material is copper, with a thermal conductivity of 391 W / mk. Furthermore, the thickness of the first elastic arm 1410 and the second elastic arm 1420 can be at least 0.1 mm. In the first embodiment, the thickness of the first elastic arm 1410 and the second elastic arm 1420 can be 0.4 mm, achieving a thermal conductivity close to that of a 1 mm thick thermal conductive sheet with a thermal conductivity of 20 W / mk.

[0079] The elastic heat dissipation structure 1400 may further include a substrate 1430. The first fixing end 1412 and the second fixing end 1422 may be connected to the substrate 1430. Figure 1 In the first embodiment, the first fixing end 1412 and the second fixing end 1422 are integrally connected to the substrate 1430. Therefore, the substrate 1430 can be soldered to the circuit board 1200 to indirectly securely connect the first fixing end 1412 and the second fixing end 1422 to the electronic component 1100. In other embodiments, the substrate can also be secured to a heat sink, not limited to the above disclosure.

[0080] like Figure 1 and Figure 2 As shown, the first elastic arm 1410 may further include a first body 1413 and a first flat plate portion 1414, the first flat plate portion 1414 extends from a distal end of the first body 1413 toward the second direction and includes a first contact plane 14141, the first body 1413 is adjacent to the electronic component 1100, and the first contact plane 14141 contacts the heat sink 1300; the second elastic arm 1420 further includes a second body 1423 and a second flat plate portion 1424, the second flat plate portion 1424 extends from a distal end of the second body 1423 toward the second direction and includes a second contact plane 14241, the second body 1423 is adjacent to the electronic component 1100, the second contact plane 14241 contacts the heat sink 1300, and the second flat plate portion 1424 extends in the opposite direction to the first flat plate portion 1414 (extending in opposite directions along the X-axis). Furthermore, the first body portion 1413 has a first tilt direction, and the second body portion 1423 has a second tilt direction, and the first tilt direction is different from the second tilt direction.

[0081] Specifically, the first body portion 1413 extends integrally from the substrate 1430 in a first direction and has a curved shape. A proximal end of the first body portion 1413 can be defined as the first fixed end 1412, and the portion of the first flat plate portion 1414 that contacts the heat sink 1300 can be defined as the first movable end 1411. Similarly, the second body portion 1423 extends integrally from the substrate 1430 in the first direction and has a curved shape. A proximal end of the second body portion 1423 can be defined as the second fixed end 1422, and the portion of the second flat plate portion 1424 that contacts the heat sink 1300 can be defined as the second movable end 1421. It should be noted that in the first embodiment, because the first and second fixed ends 1412 and 1422 are fixedly connected to the electronic component 1100 and cannot move relative to the electronic component 1100 in the second direction, they are referred to as fixed ends, rather than the ends connected to the substrate 1430 being the fixed ends. In other embodiments, the first and second fixed ends may be directly soldered to one of the electronic component and the heat sink, while the first and second movable ends are respectively connected to two substrates, and the two substrates are not soldered to the other of the electronic component and the heat sink. This allows the two substrates to move away from each other after being compressed, and the second distance between the first and second movable ends after being compressed may be greater than the first distance before being compressed. Furthermore, when there are multiple first and second elastic arms, the second distance between only the middlemost adjacent first and second elastic arms may be greater than the first distance, without limitation.

[0082] In the first embodiment, the elastic heat dissipation structure 1400 includes a plurality of first elastic arms 1410 and a plurality of second elastic arms 1420. Assuming that the substrate 1430 includes a center line in the second direction, the plurality of first elastic arms 1410 are spaced apart and arranged on the left side of the center line (i.e., located at Figure 1 The second elastic arms 1420 are arranged at intervals on the right side of the midline (ie, located at Figure 1 The first elastic arm 1410 and the second elastic arm 1420 closest to the midline are approximately V-shaped on the X-axis and Z-axis planes.

[0083] The first elastic arm 1410 may further include a plurality of first grooves 1415 extending through the first body 1413 along the second direction and arranged along a third direction (parallel to the Y-axis) to separate the first elastic arm 1410 into a plurality of first elastic ribs. The second elastic arm 1420 may include a plurality of second grooves 1425 extending through the second body 1423 along the second direction and arranged along the third direction to separate the second elastic arm 1420 into a plurality of second elastic ribs. The third direction may be different from the first and second directions.

[0084] Specifically, Figure 2As shown, the first elastic arm 1410 and the second elastic arm 1420 are thin sheet-like structures, thus having a thickness in the second direction and a width in the third direction. The first groove 1415 penetrates the first body 1413. However, since the first flat plate portion 1414 is not penetrated or is partially not penetrated, and the proximal end of the first body 1413 is connected to the base plate 1430, they form a first elastic rib that is connected to each other without disconnection. Similarly, the second elastic arm 1420 forms a second elastic rib that is connected to each other without disconnection through the second groove 1425. The configuration of the first groove 1415 and the second groove 1425 can help improve the flexibility of the first elastic arm 1410 and the second elastic arm 1420.

[0085] like Figure 3 As shown, during assembly, the first fixed end 1412 and the second fixed end 1422 can be fixed to the electronic component 1100 through the substrate 1430, and thermal paste 1500 is applied to a surface of the heat sink 1300 facing the elastic heat dissipation structure 1400. When the heat sink 1300 is pressed against the first elastic arm 1410 and the second elastic arm 1420, the first fixed end 1412 and the second fixed end 1422 are fixed and cannot move. The first elastic arm 1410 and the second elastic arm 1420 are elastic and deformable. By configuring the first elastic arm 1410 and the second elastic arm 1420 in a V-shape on the X-axis and Z-axis planes, the first movable end 1411 can be moved toward Figure 3 and move the second movable end 1421 toward Figure 3 By moving to the right, the second distance D2 between the first movable end 1411 and the second movable end 1421 after compression becomes greater than the first distance D1 before compression. This allows the bending of the first movable end 1411 and the second movable end 1421 to adapt to varying tolerances, even if they exist. Furthermore, the high thermal conductivity of the elastic heat dissipation structure 1400 facilitates heat conduction, transferring heat from the electronic component 1100 to the heat sink 1300.

[0086] It should be noted that the first contact surface 14141 of the first flat portion 1414 helps increase the contact area between the first elastic arm 1410 and the heat sink 1300 when compressed, and the second contact surface 14241 of the second flat portion 1424 helps increase the contact area between the second elastic arm 1420 and the heat sink 1300 when compressed, thereby facilitating heat dissipation. The thermal paste 1500 can help reduce friction between the first and second movable ends 1411 and 1421 and the surface of the heat sink 1300, thereby facilitating heat dissipation. However, in other embodiments, thermal paste may not be provided. Furthermore, in other embodiments, a substrate may not be provided, and the first and second fixed ends may be directly fixed to the electronic component, or the first and second fixed ends may be directly or indirectly fixed to the heat sink, with the first and second movable ends directly or indirectly contacting the electronic component, without limitation.

[0087] See also Figure 4 ,in Figure 4 FIG2 is a schematic front view of a heat dissipation structure 2000 for an electronic device according to a second embodiment of the present invention. Figure 1 The electronic device heat dissipation structure 1000 of the first embodiment is similar and includes an electronic component 2100, a circuit board 2200, a heat sink 2300, an elastic heat dissipation structure 2400, and thermal paste 2500. However, the structure of the elastic heat dissipation structure 2400 is slightly different. Furthermore, the circuit board 2200 may include a conductive via (VIA) 2210. The electronic component 2100 is disposed at one end of the conductive via 2210, and the elastic heat dissipation structure 2400 is disposed at the other end of the conductive via 2210. This allows the elastic heat dissipation structure 2400 to be soldered to the conductive via 2210 using a soldering pot, thereby indirectly securing the elastic heat dissipation structure 2400 to the electronic component 2100.

[0088] The first elastic arm 2410 may include a first bottom plate portion 2416, the first flat plate portion 2414 is connected to a distal end of the first body portion 2413, the first bottom plate portion 2416 is connected to a proximal end of the first body portion 2413, and extends in the opposite direction of the first flat plate portion 2414; the second elastic arm 2420 includes a second bottom plate portion 2426, the second flat plate portion 2424 is connected to a distal end of the second body portion 2423, the second bottom plate portion 2426 is connected to a proximal end of the second body portion 2423, and extends in the opposite direction of the second flat plate portion 2424.

[0089] Specifically, the first bottom plate portion 2416 is connected to the substrate 2430, which may be, for example, a welding connection. The first bottom plate portion 2416, the first body portion 2413 and the first flat plate portion 2414 are integrally connected and form a "Z" shape with left and right opposites. The first flat plate portion 2414 can contact the thermal paste 2500 and the heat sink 2300. Similarly, the second bottom plate portion 2426 is connected to the substrate 2430, which may be, for example, a welding connection. The second bottom plate portion 2426, the second body portion 2423 and the second flat plate portion 2424 are integrally connected and form a "Z" shape. The second flat plate portion 2424 can contact the thermal paste 2500 and the heat sink 2300. In this way, when the heat sink 2300, the elastic heat dissipation structure 2400 and the electronic component 2100 are combined, the first body portion 2413 faces Figure 4 The left side of the second body 2423 is tilted Figure 4 The first movable end and the second movable end are tilted to the right, thereby increasing the first spacing between the first movable end and the second movable end to the second spacing. It should be noted that although only a single first elastic arm 2410 and a single second elastic arm 2420 are shown in the second embodiment, multiple first elastic arms 2410 and second elastic arms 2420 may be provided as in the first embodiment, and the present invention is not limited to the drawings.

[0090] See also Figure 5 ,in Figure 5 A schematic perspective view of a first elastic arm 3410 and a second elastic arm 3420 of a heat dissipation structure for an electronic device according to a third embodiment of the present invention is shown. The structures of the first elastic arm 3410 and the second elastic arm 3420 are respectively similar to Figure 4 The first elastic arm 2410 and the second elastic arm 2420 of the third embodiment are similar and have a thickness in the second direction and a width in the third direction.

[0091] The first elastic arm 3410 further includes a plurality of first through holes 3417, a portion of the plurality of first through holes 3417 are arranged along the third direction and penetrate the connection between the first bottom plate portion 3416 and the first body portion 3413 along the second direction, and another portion of the plurality of first through holes 3417 are arranged along the third direction and penetrate the connection between the first flat plate portion 3414 and the first body portion 3413 along the second direction; the second elastic arm 3420 may further include a plurality of second through holes 3427, a portion of the plurality of second through holes 3427 are arranged along the third direction and penetrate the connection between the second bottom plate portion 3426 and the second body portion 3423 along the second direction, and another portion of the plurality of second through holes 3427 are arranged along the third direction and penetrate the connection between the second flat plate portion 3424 and the second body portion 3423 along the second direction.

[0092] like Figure 5As shown, there are four first through holes 3417, two of which are located at the connection between the first bottom plate portion 3416 and the first body portion 3413, and each of the two first through holes 3417 may, for example, be half located at the first bottom plate portion 3416 and the other half located at the first body portion 3413, but the present invention is not limited thereto; the other two first through holes 3417 are located at the connection between the first flat plate portion 3414 and the first body portion 3413, and each of the two first through holes 3417 may, for example, be half located at the first flat plate portion 3414 and the other half located at the first body portion 3413, but the present invention is not limited thereto. Similarly, there are four second through holes 3427, two of which are located at the connection between the second bottom plate portion 3426 and the second body portion 3423, and each of the two second through holes 3427 can, for example, be half located at the second bottom plate portion 3426 and the other half located at the second body portion 3423, but the present invention is not limited thereto; the other two second through holes 3427 are located at the connection between the second flat plate portion 3424 and the second body portion 3423, and each of the two second through holes 3427 can, for example, be half located at the second flat plate portion 3424 and the other half located at the second body portion 3423, but the present invention is not limited thereto. In this way, it can help increase the flexibility of the first elastic arm 3410 and the second elastic arm 3420. Please pay special attention to the following: Figure 5 For the sake of simplicity, the thickness of the first elastic arm 3410 and the second elastic arm 3420 are not shown, but this does not limit the present invention.

[0093] See also Figure 6 ,in Figure 6 A cross-sectional diagram illustrates a first elastic arm 4410 and a second elastic arm 4420 connected to a substrate 4430 in accordance with a fourth embodiment of the present invention. The first elastic arm 4410 further includes a first protrusion 4418 at a first fixed end, and the second elastic arm 4420 further includes a second protrusion 4428 at a second fixed end. The substrate 4430 includes a first groove 4431 and a second groove 4432 spaced apart in a second direction. The first protrusion 4418 is soldered to the first groove 4431, and the second protrusion 4428 is soldered to the second groove 4432.

[0094] Specifically, the first elastic arm 4410 and Figure 4 The first elastic arm 2410 of the second embodiment is similar to the first elastic arm 2410 and includes a first bottom plate portion 4416, a first body portion 4413 and a first flat plate portion 4414 connected in an integral manner. The proximal end of the first bottom plate portion 4416 can be defined as a first fixed end and is integrally connected to a first protrusion 4418 extending in the first direction. Figure 4The second elastic arm 2420 of the second embodiment is similar and includes an integrally connected second bottom plate portion 4426, a second body portion 4423, and a second flat plate portion 4424. The proximal end of the second bottom plate portion 4426 can be defined as a first fixed end and is integrally connected to a second bump 4428 extending in the first direction. During the manufacturing process, solder paste S1 is first applied to the substrate 4430. The first elastic arm 4410 is then positioned with its first bump 4418 in the first groove 4431, and the second elastic arm 4420 is then positioned with its second bump 4428 in the second groove 4432. The components are then placed in a reflow oven, pre-fixing the positions of the first and second elastic arms 4410 and 4420 to facilitate soldering.

[0095] See also Figure 7 ,in Figure 7 A schematic front view of a heat sink 5300 and an elastic heat dissipation structure 5400 of an electronic device heat dissipation structure according to a fifth embodiment of the present invention is shown. The elastic heat dissipation structure 5400 may include a first substrate 5430a, a second substrate 5430b, a plurality of first elastic arms 5410a, 5410b, and 5410c, and a plurality of second elastic arms 5420a, 5420b, and 5420c. The first fixed ends of the first elastic arms 5410a, 5410b, and 5410c may be connected to the first substrate 5430a, and the second fixed ends of the second elastic arms 5420a, 5420b, and 5420c may be connected to the second substrate 5430b.

[0096] Each first elastic arm 5410a, 5410b, 5410c includes a first body portion 5413a, 5413b, 5413c and a first flat plate portion 5414a, 5414b, 5414c, and each first body portion 5413a, 5413b, 5413c includes a first body length. The first body lengths of the multiple first bodies 5413a, 5413b, 5413c are different, and the first body length of the one of the multiple first bodies 5413a, 5413b, 5413c closest to the second elastic arm 5420a, 5420b, 5420c (i.e., the first body portion 5413a) is smaller than the first length of the one of the multiple first bodies 5413a, 5413b, 5413c farthest from the second elastic arm 5420a, 5420b, 5420c (i.e., the first body portion 5413c).

[0097] Each second elastic arm 5420a, 5420b, 5420c includes a second flat plate portion 5424a, 5424b, 5424c and a second body portion 5423a, 5423b, 5423c, and each second body portion 5423a, 5423b, 5423c includes a second body length. The second body lengths of the multiple second bodies 5423a, 5423b, 5423c are different, and the second body length of the one of the multiple second bodies 5423a, 5423b, 5423c closest to the first elastic arm 5410a, 5410b, 5410c (i.e., the second body portion 5423a) is smaller than the second length of the one of the multiple second bodies 5423a, 5423b, 5423c farthest from the first elastic arm 5410a, 5410b, 5410c (i.e., the second body portion 5423c).

[0098] In other embodiments, each first flat plate portion includes a first plate length, the first plate lengths of the plurality of first flat plate portions are different, and the one of the plurality of first flat plate portions closest to the second elastic arm (which may be similar to Figure 7 The first plate length of the first flat plate portion 5414a) is less than the one of the plurality of first flat plate portions that is farthest from the second elastic arm (which may be similar to Figure 7 Each second flat plate portion includes a second plate length, and the second plate lengths of the plurality of second flat plate portions are different, and the one of the plurality of second flat plate portions closest to the first elastic arm (which may be similar to Figure 7 The second plate length of the second flat plate portion 5424a) is smaller than the one of the plurality of second flat plates that is farthest from the first elastic arm (which may be similar to Figure 7 The second plate length of the second flat plate portion 5424c).

[0099] In other words, the multiple first elastic arms 5410a, 5410b, and 5410c have similar shapes, but the dimensions of the first body portions 5413a, 5413b, and 5413c may differ. The first elastic arm 5410a has the smallest overall dimensions, while the first body portion 5413c of the first elastic arm 5410c is the longest and has the steepest slope. Similarly, the multiple second elastic arms 5420a, 5420b, and 5420c have similar shapes, but the dimensions of the second body portions 5423a, 5423b, and 5423c may differ. The second elastic arm 5420a has the smallest overall dimensions, while the second body portion 5423c of the second elastic arm 5420c is the longest and has the steepest slope. Furthermore, in other embodiments, the lengths of the first and second flat plate portions may differ. This increases the area in contact with the heat sink, thereby enhancing heat dissipation capacity without being limited by the size of the electronic component.

[0100] See also Figure 8 ,in Figure 8A schematic perspective view of an elastic heat dissipation structure 6400 of an electronic device heat dissipation structure according to a sixth embodiment of the present invention is shown. The elastic heat dissipation structure 6400 may include a first substrate 6430a, a second substrate 6430b, a plurality of first elastic arms 6410, and a plurality of second elastic arms 6420.

[0101] Each first elastic arm 6410 may include a first flat portion 6414, a first body portion 6413 and a first bottom portion 6416 integrally connected to form a first curve, and each second elastic arm 6420 may include a second flat portion 6424, a second body portion 6423 and a second bottom portion 6426 integrally connected to form a second curve, and the second curve and the first curve are mirror images of each other.

[0102] Specifically, the first bottom plate portion 6416 of each first elastic arm 6410 is connected to the first substrate 6430a, and the first curve is an S-shape. The second bottom plate portion 6426 of each second elastic arm 6420 is connected to the second substrate 6430b, and the second curve is a left-right opposite S-shape, a mirror image of the first curve. The first and second substrates 6430a, 6430b are soldered to electronic components or heat sinks. In other embodiments, the first flat plate portion may be connected to the first substrate, and the first curve is an S-shape; the second flat plate portion may be connected to the second substrate, and the second curve is a left-right opposite S-shape. The first and second bottom plates may be directly soldered to the electronic component or heat sink, and the first and second substrates may be moved away from each other under pressure. Alternatively, the first bottom plate portion is connected to the first substrate and the second bottom plate portion is connected to the second substrate, the first flat plate portion is connected to a third substrate, the second flat plate portion is connected to a fourth substrate, the first bottom plate portion and the second bottom plate portion are directly soldered to electronic components or heat sinks, and the third substrate and the fourth substrate can be moved away from each other after being pressurized, including but not limited to the above.

[0103] See also Figure 9 ,in Figure 9 A partial front view of a first elastic arm 7410 and a second elastic arm 7420 of a heat dissipation structure for an electronic device according to the seventh embodiment of the present invention is shown. The shapes of the first elastic arm 7410 and the second elastic arm 7420 can be Figure 8 The first elastic arm 6410 and the second elastic arm 6420 of the sixth embodiment are similar in shape. The difference is that the first elastic arm 7410 may further include a plurality of first grooves 7419 disposed in the first body portion 7413 adjacent to the first flat plate portion 7414; and the second elastic arm 7420 may further include a plurality of second grooves 7429 disposed in the second body portion 7423 adjacent to the second flat plate portion 7424. This increases the flexibility of the first elastic arm 7410 and the second elastic arm 7420.

[0104] See also Figure 10 ,in Figure 10 A schematic front view of an elastic heat dissipation structure 8400, a heat dissipation structure for an electronic device according to an eighth embodiment of the present invention, is shown. The elastic heat dissipation structure 8400 includes a first elastic arm 8410 and a second elastic arm 8420. The first elastic arm 8410 includes a first support portion 8419 extending from an end of the first flat portion 8414 away from the first body portion 8413 toward the first base portion 8416. When the elastic heat dissipation structure 8400 is uncompressed, a gap G1 is defined between the first support portion 8419 and the first base portion 8416. When the elastic heat dissipation structure 8400 is compressed, the first support portion 8419 contacts the first base portion 8416. The second elastic arm 8420 includes a second support portion 8429, which extends from one end of the second flat portion 8424 away from the second body portion 8423 toward the second bottom plate portion 8426. When the elastic heat dissipation structure 8400 is not under pressure, there is another gap G2 between the second support portion 8429 and the second bottom plate portion 8426. After the elastic heat dissipation structure 8400 is under pressure, the second support portion 8429 contacts the second bottom plate portion 8426.

[0105] Specifically, the first bottom plate portion 8416, the first body portion 8413, the first flat plate portion 8414, and the first support portion 8419 are integrally connected to form a quadrilateral. The first body portion 8413 and the first support portion 8419 are all inclined, but the length of the first support portion 8419 in the first direction is relatively short and does not contact the first bottom plate portion 8416. Similarly, the second bottom plate portion 8426, the second body portion 8423, the second flat plate portion 8424, and the second support portion 8429 are integrally connected to form a quadrilateral. The second body portion 8423 and the second support portion 8429 are all inclined, but the length of the second support portion 8429 in the first direction is relatively short and does not contact the second bottom plate portion 8426. Since the first elastic arm 8410 and the second elastic arm 8420 are elastic, when the elastic heat dissipation structure 8400 is compressed in the first direction, the first body 8413, the first support portion 8419, the second body 8423 and the second support portion 8429 will be more inclined, so that the gaps G1 and G2 will disappear. The first support portion 8419 and the second support portion 8429 contact the first bottom plate portion 8416 and the second bottom plate portion 8426 respectively. In addition to helping to support the first elastic arm 8410 and the second elastic arm 8420, it can also help to allow heat to pass through the first support portion 8419 and the second support portion 8429 and then be conducted to the first flat plate portion 8414 and the second flat plate portion 8424, thereby improving the heat dissipation effect.

[0106] See also Figure 11 ,in Figure 11A schematic front view of an elastic heat dissipation structure 9400, a heat dissipation structure for an electronic device according to a ninth embodiment of the present invention, is shown. The elastic heat dissipation structure 9400 includes a first elastic arm 9410 and a second elastic arm 9420. The first elastic arm 9410 includes a first base portion 9416, a first body portion 9413, a first flat portion 9414, and a first support portion 9419, which are connected in sequence. The second elastic arm 9420 includes a second base portion 9426, a second body portion 9423, a second flat portion 9424, and a second support portion 9429, which are connected in sequence.

[0107] like Figure 11 As shown, the end of the first bottom plate 9416 away from the first body 9413 is connected to the end of the second bottom plate 9426 away from the second body 9423, and the first support portion 9419 and the second support portion 9429 are located between the first body 9413 and the second body 9423 along the second direction. That is, the first bottom plate 9416 is connected to the second bottom plate 9426, and Figure 11 From left to right in the middle are the first body portion 9413 , the first support portion 9419 , the second support portion 9429 and the second body portion 9423 .

[0108] The first support portion 9419 may include a first upper section 9419a and a first lower section 9419b, which are connected to each other and form a first angle θ1. The second support portion 9429 may include a second upper section 9429a and a second lower section 9429b, which are connected to each other and form a second angle θ2, with the second angle θ2 facing the first angle θ1.

[0109] Specifically, the first body portion 9413 may also include a first upper body portion 9413a and a first lower body portion 9413b, which are connected to each other and form a first angle. The second body portion 9423 may also include a second upper body portion 9423a and a second lower body portion 9423b, which are connected to each other and form a second angle. Thus, the first upper body portion 9413a and the first lower body portion 9413b may be curved to match the curved shape of the first upper section 9419a and the first lower section 9419b, and the second upper body portion 9423a and the second lower section 9423b may be curved to match the curved shape of the second upper section 9429a and the second lower section 9429b. The first elastic arm 9410 and the second elastic arm 9420 are mirror images of each other, so the first angle θ1 can face the second angle θ2.

[0110] Since the first elastic arm 9410 and the second elastic arm 9420 are elastic, after being compressed, the first upper body 9413a and the first lower body 9413b are further bent, the first upper half 9419a and the first lower half 9419b are further bent, the second upper body 9423a and the second lower body 9423b are further bent, and the second upper half 9429a and the second lower half 9429b are further bent, so that the first included angle, the second included angle, the first angle θ1 and the second angle θ2 are further bent. The degree θ2 becomes smaller, and the first lower half 9419b of the first support portion 9419 and the second lower half 9429b of the second support portion 9429 contact the first bottom plate portion 9416 and the second bottom plate portion 9426 respectively. In addition to helping to support the first elastic arm 9410 and the second elastic arm 9420, it can also help to allow heat to pass through the first support portion 9419 and the second support portion 9429 and then be conducted to the first flat plate portion 9414 and the second flat plate portion 9424, thereby improving the heat dissipation effect.

[0111] It can be seen from the above embodiments that, through the configuration of the elastic heat dissipation structure, the elasticity can be utilized to absorb the tolerance, and the good thermal conductivity of the elastic heat dissipation structure can also help to improve the heat dissipation effect.

[0112] Although the present invention has been disclosed above with reference to the embodiments, they are not intended to limit the present invention. Any person skilled in the art should be able to make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the appended claims.

Claims

1. A heat dissipation structure for an electronic device, comprising: an electronic component; a heat sink, the heat sink being opposite to the electronic component along a first direction; as well as an elastic heat dissipation structure disposed between the electronic component and the heat sink along the first direction, the elastic heat dissipation structure comprising a first elastic arm and a second elastic arm, the first elastic arm comprising a first fixed end and a first movable end opposite to each other in the first direction, the second elastic arm comprising a second fixed end and a second movable end opposite to each other in the first direction, the first fixed end and the second fixed end being fixedly connected to one of the electronic component and the heat sink, and the first movable end and the second movable end contacting the other of the electronic component and the heat sink; When the elastic heat dissipation structure is subjected to a pressure in the first direction, the first movable end and the second movable end are allowed to move in a second direction, wherein the first movable end and the second movable end are separated by a first distance before being pressurized, and the first movable end and the second movable end are separated by a second distance after being pressurized, and the second distance is greater than the first distance.

2. The heat dissipation structure of an electronic device according to claim 1, wherein: The elastic heat dissipation structure further includes a substrate, and the first fixing end and the second fixing end are connected to the substrate.

3. The heat dissipation structure of an electronic device according to claim 2, wherein: The first fixing end and the second fixing end are integrally connected to the base plate.

4. The heat dissipation structure of an electronic device according to claim 2, wherein: The first elastic arm also includes a first protrusion located at the first fixed end, the second elastic arm also includes a second protrusion located at the second fixed end, the substrate includes a first groove and a second groove spaced apart from each other in the second direction, the first protrusion is welded to the first groove, and the second protrusion is welded to the second groove.

5. The electronic device heat dissipation structure according to any one of claims 2 to 4, wherein: The substrate is soldered to one of the electronic component and the heat sink.

6. The heat dissipation structure of an electronic device according to claim 1, wherein: The first elastic arm also includes a first body and a first flat plate portion, the first flat plate portion extends from a distal end of the first body toward the second direction and includes a first contact plane, the first body portion is adjacent to the one of the electronic component and the radiator, and the first contact plane contacts the other of the electronic component and the radiator; the second elastic arm also includes a second body and a second flat plate portion, the second flat plate portion extends from a distal end of the second body toward the second direction and includes a second contact plane, the second body portion is adjacent to the one of the electronic component and the radiator, the second contact plane contacts the other of the electronic component and the radiator, and the second flat plate portion extends in the opposite direction to the first flat plate portion.

7. The heat dissipation structure of an electronic device according to claim 6, wherein: The first body portion has a first tilt direction, and the second body portion has a second tilt direction. The first tilt direction is different from the second tilt direction.

8. The heat dissipation structure of an electronic device according to claim 7, wherein: The first elastic arm includes a plurality of first grooves, which penetrate the first body along the second direction and are arranged along a third direction to separate the first elastic arm into a plurality of first elastic ribs; the second elastic arm includes a plurality of second grooves, which penetrate the second body along the second direction and are arranged along the third direction to separate the second elastic arm into a plurality of second elastic ribs.

9. The heat dissipation structure of an electronic device according to claim 6, wherein: The first elastic arm also includes a first bottom plate portion, which is connected to a proximal end of the first body portion and extends in the opposite direction of the first flat plate portion; the second elastic arm also includes a second bottom plate portion, which is connected to a proximal end of the second body portion and extends in the opposite direction of the second flat plate portion.

10. The heat dissipation structure of an electronic device according to claim 9, wherein: The first elastic arm also includes a plurality of first through holes, a portion of the first through holes being arranged along a third direction and penetrating the connection between the first bottom plate portion and the first body portion along the second direction, and another portion of the first through holes being arranged along the third direction and penetrating the connection between the first flat plate portion and the first body portion along the second direction; the second elastic arm also includes a plurality of second through holes, a portion of the second through holes being arranged along the third direction and penetrating the connection between the second bottom plate portion and the second body portion along the second direction, and another portion of the second through holes being arranged along the third direction and penetrating the connection between the second flat plate portion and the second body portion along the second direction.

11. The heat dissipation structure of an electronic device according to claim 9, wherein: The first flat plate portion, the first body portion and the first bottom plate portion are integrally connected to form a first curved shape, and the second flat plate portion, the second body portion and the second bottom plate portion are integrally connected to form a second curved shape. The second curved shape is a mirror image of the first curved shape.

12. The heat dissipation structure of an electronic device according to claim 9, wherein: The first elastic arm also includes a first supporting portion, which extends from an end of the first flat plate portion away from the first body portion toward the first bottom plate portion. When the elastic heat dissipation structure is not under pressure, there is a gap between the first supporting portion and the first bottom plate portion. After the elastic heat dissipation structure is under pressure, the first supporting portion contacts the first bottom plate portion; the second elastic arm also includes a second supporting portion, which extends from an end of the second flat plate portion away from the second body portion toward the second bottom plate portion. When the elastic heat dissipation structure is not under pressure, there is another gap between the second supporting portion and the second bottom plate portion. After the elastic heat dissipation structure is under pressure, the second supporting portion contacts the second bottom plate portion.

13. The heat dissipation structure of an electronic device according to claim 12, wherein: One end of the first bottom plate away from the first body part is connected to one end of the second bottom plate away from the second body part. The first support part and the second support part are located between the first body part and the second body part along the second direction.

14. The heat dissipation structure of an electronic device according to claim 13, wherein: The first supporting portion includes a first upper section and a first lower section, the first upper section and the first lower section are connected to each other and form a first angle; the second supporting portion includes a second upper section and a second lower section, the second upper section and the second lower section are connected to each other and form a second angle, and the second angle faces the first angle.

15. The heat dissipation structure of an electronic device according to claim 6, wherein: The first elastic arm further includes a plurality of first grooves, which are arranged at a location of the first body adjacent to the first flat plate portion; the second elastic arm further includes a plurality of second grooves, which are arranged at a location of the second body adjacent to the second flat plate portion.

16. The heat dissipation structure of an electronic device according to claim 1, wherein: The elastic heat dissipation structure further includes a first substrate and a second substrate. The first fixed end is connected to the first substrate, and the second fixed end is connected to the second substrate.

17. A heat dissipation structure for an electronic device, comprising: an electronic component; a heat sink, the heat sink being opposite to the electronic component along a first direction; as well as an elastic heat dissipation structure disposed between the electronic component and the heat sink along the first direction, the elastic heat dissipation structure comprising a plurality of first elastic arms and a plurality of second elastic arms, each of the first elastic arms comprising a first fixed end and a first movable end opposite to each other in the first direction, each of the second elastic arms comprising a second fixed end and a second movable end opposite to each other in the first direction, each of the first fixed end and each of the second fixed ends being fixed to one of the electronic component and the heat sink, and each of the first movable end and each of the second movable ends being in contact with the other of the electronic component and the heat sink; When the elastic heat dissipation structure is subjected to a pressure in the first direction, the one of the first movable ends closest to the second movable ends and the one of the second movable ends closest to the first movable ends are allowed to move away from each other in a second direction.

18. The heat dissipation structure of an electronic device according to claim 17, wherein: Each of the first elastic arms further includes a first body portion and a first flat plate portion, each of the first flat plate portions extends from a distal end of each of the first bodies toward the second direction and includes a first contact plane, each of the first bodies is adjacent to one of the electronic component and the radiator, each of the first contact planes contacts the other of the electronic component and the radiator; each of the second elastic arms further includes a second body portion and a second flat plate portion, each of the second flat plate portions extends from a distal end of each of the second bodies toward the second direction and includes a second contact plane, each of the second bodies is adjacent to one of the electronic component and the radiator, each of the second contact planes contacts the other of the electronic component and the radiator, and each of the second flat plate portions extends in the opposite direction to each of the first flat plate portions.

19. The heat dissipation structure of an electronic device according to claim 18, wherein: Each of the first body parts includes a first body length, the first body lengths are different, and the first body length of the one of the first body parts closest to the second elastic arms is smaller than the first body length of the one of the first body parts farthest from the second elastic arms; each of the second body parts includes a second body length, the second body lengths are different, and the second body length of the one of the second body parts closest to the first elastic arms is smaller than the second body length of the one of the second body parts farthest from the first elastic arms.

20. The heat dissipation structure of an electronic device according to claim 19, wherein: Each of the first flat plate portions includes a first plate length, the first plate lengths are different, and the first plate length of one of the first flat plate portions closest to the second elastic arms is smaller than the first plate length of one of the first flat plate portions farthest from the second elastic arms; each of the second flat plate portions includes a second plate length, the second plate lengths are different, and the second plate length of one of the second flat plate portions closest to the first elastic arms is smaller than the second plate length of one of the second flat plate portions farthest from the first elastic arms.

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