A method for preparing a white Mini-LED light panel and a fixture

Abstract

This application provides a method for preparing a white Mini-LED light board and a fixture. The method for preparing the white Mini-LED light board includes: injecting a damming adhesive into a colloid groove on a support platform of the fixture, wherein the colloid groove is in the form of an interconnected grid, and the support platform is also provided with multiple LED bead receiving grooves, with one LED bead receiving groove in each grid of the colloid groove; pre-curing the damming adhesive; placing a white Mini-LED circuit board on the support platform of the fixture, and correspondingly placing multiple white Mini-LED beads fixed on the white Mini-LED circuit board into the multiple LED bead receiving grooves, wherein the thickness of the white Mini-LED beads is less than the depth of the colloid groove; bringing the white Mini-LED circuit board into contact with the damming adhesive; and curing the damming adhesive. The method for preparing the white Mini-LED light board provided by this application enables the prepared damming adhesive to have a large thickness while having a narrow width, thereby improving the strip shadow and light crosstalk problems of the white Mini-LED light board.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, specifically to a method for preparing a white Mini-LED lamp board and a fixture. Background Technology

[0002] A light-emitting diode (LED) is an electroluminescent semiconductor light-emitting device. Due to its advantages such as low power consumption, small size, long life, good stability, fast response, and stable emission wavelength, it is now widely used in lighting, display, medical, and optical communication fields.

[0003] Taking the display field as an example, LED backlight panels are typically used as backlight sources for display devices. White Mini-LED backlight panels utilize smaller LED chips, allowing for the integration of more LED chips and increasing their density. This, combined with driver dimming technology, enables display devices to achieve more vivid colors. Furthermore, because the LED chips in white Mini-LED backlight panels have their own color conversion layer, they can directly emit white light from the panel. Compared to the blue Mini-LED backlight panel + quantum dot film combination structure shown in Chinese invention patent application CN202111351994.8, this eliminates the need for the quantum dot film, simplifying the backlight module structure.

[0004] However, a higher LED chip density also makes it easier for optical crosstalk to occur between adjacent LED chips. In related technologies, to improve the optical crosstalk problem, a damming adhesive with light-isolating function is placed around the LED chip, and the height of the damming adhesive is greater than the height of the light-emitting surface of the LED chip.

[0005] The thickness of the damming adhesive directly affects its height. In other words, the height of the damming adhesive can be increased to exceed the height of the LED's light-emitting surface by adjusting its thickness. However, during the application of the damming adhesive, its thickness and width are directly proportional. That is, to increase the height of the damming adhesive on the circuit board containing the LED, its width must also be increased. Taking white and blue Mini-LED boards as examples, because the LEDs in the white Mini-LED board have their own color conversion layer, their thickness is greater than that of the LEDs in the blue Mini-LED board, which do not have a color conversion layer. Consequently, the damming adhesive used for the LEDs in the white Mini-LED board is thicker and wider. However, when the width of the dammed adhesive is too wide, it will degrade the light efficiency of the light panel, produce striped shadows, and increase material costs. Therefore, how to increase the thickness of the dammed adhesive without increasing its width in order to improve the striped shadows and light crosstalk problems of white Mini-LED light panels is a problem that needs to be solved by those skilled in the art. Summary of the Invention

[0006] This application provides a method for preparing a white Mini-LED light panel, which can effectively solve the problem in related technologies that it is difficult to increase the thickness of the dammed adhesive without increasing the width of the dammed adhesive.

[0007] In a first aspect, this application provides a method for preparing a white Mini-LED light panel, comprising:

[0008] The dam-enclosing adhesive is injected into the adhesive groove on the support platform of the fixture. The adhesive groove is in the form of an interconnected grid. The support platform is also provided with multiple LED bead receiving grooves, and each grid of the adhesive groove is provided with one LED bead receiving groove.

[0009] The dam sealant is pre-cured;

[0010] A white light Mini-LED circuit board is placed on the support platform of the fixture, and multiple white light Mini-LED beads fixed on the white light Mini-LED circuit board are correspondingly placed in multiple bead receiving slots, wherein the thickness of the white light Mini-LED beads is less than the depth of the colloid slots;

[0011] Make the white Mini-LED circuit board come into contact with the dammed adhesive;

[0012] The dam sealant is then cured.

[0013] Optionally, before the step of injecting the damming adhesive into the adhesive tank of the fixture, the method further includes: spraying a release agent into the adhesive tank of the fixture.

[0014] Optionally, the step of pre-curing the damming adhesive includes: heating the damming adhesive to pre-cur it, improving the flatness of the damming adhesive in the adhesive tank, and making the surface of the damming adhesive flush with the surface of the support platform of the fixture.

[0015] Optionally, the step of pre-curing the damming adhesive includes: heating the damming adhesive to pre-cur it, improving the flatness of the damming adhesive in the adhesive tank, and making the surface of the damming adhesive lower than the surface of the support platform of the fixture.

[0016] Optionally, in the step of injecting the damming adhesive into the adhesive groove on the support platform of the fixture, the fixture further includes a positioning frame, which is disposed on the surface of the support platform and forms a closed shape, the closed shape being adapted to the size of the white light Mini-LED circuit board.

[0017] Optionally, the step of heating the damming adhesive to pre-cure the damming adhesive includes: heating the damming adhesive in a first stage using the heating device in the fixture, with the heating temperature being a first temperature; and then heating the damming adhesive in a second stage using the heating device in the fixture, with the heating temperature being a second temperature, wherein the first temperature is lower than the second temperature, and the duration of the first stage is shorter than the duration of the second stage.

[0018] Optionally, in the step of injecting the damming adhesive into the colloid tank of the fixture, the support platform of the fixture has multiple vacuum adsorption holes, and the number of vacuum adsorption holes in each grid of the colloid tank is the same; the step of bringing the white light Mini-LED circuit board into contact with the damming adhesive includes: using the vacuum adsorption device in the fixture, through the vacuum adsorption holes, adsorbing the white light Mini-LED circuit board flat and tightly adhering it to the support platform, so that the white light Mini-LED circuit board comes into contact with the damming adhesive.

[0019] Optionally, the step of curing the damming adhesive includes: heating the damming adhesive in a third stage using a heating device, wherein the heating temperature is a third temperature, the third temperature is greater than the second temperature, and the duration of the third stage is greater than the sum of the durations of the first stage and the second stage.

[0020] Optionally, after the step of curing the damming adhesive, the method further includes: turning off the heating function of the heating device, and after the damming adhesive cools to a preset temperature, turning off the vacuum adsorption device and removing the prepared white light Mini-LED lamp board from the fixture.

[0021] Secondly, this application provides a fixture, which includes a base, a heating device and a support platform stacked in sequence. The support platform includes interconnected grid-shaped colloid grooves and multiple LED bead receiving grooves, with one LED bead receiving groove corresponding to each grid of the grid-shaped colloid groove.

[0022] This application provides a method for preparing a white Mini-LED light board and a fixture. The method for preparing the white Mini-LED light board includes: injecting a damming adhesive into a colloid groove on a support platform of the fixture, wherein the colloid groove is in the form of an interconnected grid, and the support platform is further provided with a plurality of LED bead receiving grooves, and each grid of the colloid groove is provided with one LED bead receiving groove; pre-curing the damming adhesive; placing a white Mini-LED circuit board on the support platform of the fixture, and correspondingly placing a plurality of white Mini-LED LED beads fixed on the white Mini-LED circuit board into the plurality of LED bead receiving grooves, wherein the thickness of the white Mini-LED LED beads is less than the depth of the colloid groove; bringing the white Mini-LED circuit board into contact with the damming adhesive; and curing the damming adhesive. The method for preparing a white Mini-LED light panel provided in this application enables the prepared dammed adhesive to have a large thickness while having a narrow width, thereby improving the strip shadow and light crosstalk problems of the white Mini-LED light panel. Attached Figure Description

[0023] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0024] Figure 1 This is a flowchart illustrating the fabrication process of a white Mini-LED light panel provided in some embodiments of this application.

[0025] Figure 2 This is a perspective view of the fixture for a white Mini-LED light board provided in some embodiments of this application.

[0026] Figure 3 This is an enlarged view of a partial area of ​​the support platform of the fixture provided in some embodiments of this application.

[0027] Figure 4 This is a schematic diagram of the structure of the vacuum adsorption device for the fixture provided in some embodiments of this application.

[0028] Figure 5 This is a side view of a fixture for a white Mini-LED light panel provided in some embodiments of this application.

[0029] Figure 6This is a schematic diagram of the structure of a white Mini-LED module provided in some embodiments of this application.

[0030] Figure 7 This is a cross-sectional schematic diagram showing the combination of a white Mini-LED module and a dammed adhesive in a fixture, as provided in some embodiments of this application.

[0031] Figure 8 This is a schematic diagram of the structure of a white Mini-LED light panel provided in some embodiments of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] Base 10; heating device 20; vacuum adsorption device 30; vacuum chamber 31; vacuum interface 32; vacuum pump 33; bearing platform 40; colloid tank 401; LED bead receiving slot 402; vacuum adsorption hole 403; positioning frame 50; positioning post 60; damming adhesive 100; white light Mini-LED module 200; white light Mini-LED circuit board 201; positioning groove 2011; white light Mini-LED bead 202. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0035] The terms "first" and "second" used herein are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0036] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0037] The following disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0038] Reference Figure 1 As shown, in a first aspect, embodiments of this application provide a method for preparing a white light Mini-LED lamp board, the method for preparing the white light Mini-LED lamp board including steps S01, S02, S03, S04 and S05.

[0039] In some embodiments of this application, steps S01, S02, S03, S04 and S05 are performed sequentially. That is, step S02 is executed after step S01 is completed, step S03 is executed after step S02 is completed, step S04 is executed after step S03 is completed, and step S05 is executed after step S04 is completed.

[0040] In some embodiments of this application, other process steps may exist between steps S01 and S02, between steps S02 and S03, between steps S03 and S04, and between steps S04 and S05. Taking steps S01 and S02 as examples, after executing step S01, step S02 can be executed directly, or at least one of the other process steps can be executed before executing step S02.

[0041] Combination Figures 1 to 8As shown, in some embodiments of this application, step S01 includes: injecting the damming adhesive 100 into the adhesive groove 401 on the support platform 40 of the fixture, wherein the adhesive groove 401 is grid-shaped, and the support platform 40 is also provided with a plurality of LED bead receiving grooves 402, and each grid of the adhesive groove 401 is provided with one LED bead receiving groove 402; step S02 includes: pre-curing the damming adhesive 100; step S03 includes: setting the white light Mini-LED circuit board 201. The white light Mini-LED lamp beads 202, which are fixed on the white light Mini-LED circuit board 201, are placed on the support platform 40 of the fixture and are correspondingly arranged in the lamp bead receiving grooves 402, wherein the thickness of the white light Mini-LED lamp beads 202 is less than the depth of the colloid grooves 401; step S04 includes: bringing the white light Mini-LED circuit board 201 into contact with the damming adhesive 100; step S05 includes: curing the damming adhesive 100.

[0042] The method for preparing a white Mini-LED lamp board provided in this application embodiment utilizes a colloid tank 401 on the support platform 40 of a fixture to contain a fluid-state damming adhesive 100. Under the shaping action of the colloid tank 401, the fluid-state damming adhesive 100 is defined to a specific width and thickness. Through a curing step, the fluid-state damming adhesive 100 is transformed into a stable damming adhesive 100 with a specific width and thickness. This avoids the problem of deteriorated lamp board luminous efficiency caused by excessively wide damming adhesive 100 when directly preparing a thicker damming adhesive 100 adapted to the white Mini-LED lamp beads 202 on the LED circuit board, and also reduces waste of damming adhesive 100 material, lowering production costs.

[0043] Based on this, the method for preparing a white Mini-LED lamp board provided in this application embodiment involves pre-curing the damming adhesive 100 before setting the white Mini-LED circuit board 201 onto the support platform 40 of the fixture. This pre-curing allows the fluid-state damming adhesive 100 to fully self-level within the interconnected grid-like colloid tank 401, improving the flatness of the damming adhesive 100 within the colloid tank 401 and enhancing the high uniformity of the damming adhesive 100 in each area. Consequently, in the subsequent step of bringing the white Mini-LED circuit board 201 into contact with the damming adhesive 100, under controlled process parameters, the damming adhesive 100 in each area can maintain close contact with the white Mini-LED circuit board 201, reducing luminous efficiency loss and light leakage, and improving the light output quality of the white Mini-LED lamp board.

[0044] In addition, in the method for preparing a white Mini-LED light panel provided in this application embodiment, in the step of setting a white Mini-LED circuit board 201 on the support platform 40 of the fixture and correspondingly setting multiple white Mini-LED beads 202 fixed on the white Mini-LED circuit board 201 in multiple bead receiving slots 402, the white Mini-LED module 200 composed of the white Mini-LED circuit board 201 and multiple white Mini-LED beads 202 is inverted on the support platform 40. Since multiple white Mini-LED beads 202 are correspondingly set in multiple bead receiving slots 402, the white Mini-LED beads 202 can be fully protected, avoiding the white Mini-LED beads 202 from being squeezed or contaminated, thereby ensuring the light output effect of the white Mini-LED light panel. Furthermore, since the thickness of the white Mini-LED lamp bead 202 is less than the depth of the colloid groove 401, the distance between the surface of the damming adhesive 100 at the bottom of the colloid groove 401 and the white Mini-LED circuit board 201 can be greater than the distance between the light-emitting surface of the white Mini-LED lamp bead 202 and the white Mini-LED circuit board 201. That is, the height of the damming adhesive 100 in the subsequently prepared white Mini-LED lamp board can be greater than the height of the white Mini-LED lamp bead 202, thereby improving the optical crosstalk problem.

[0045] Secondly, since the steps of placing the white light Mini-LED circuit board 201 on the support platform 40 of the fixture and bringing the white light Mini-LED circuit board 201 into contact with the damming adhesive 100 are performed before the step of curing the damming adhesive 100, the fluidity of the damming adhesive 100 before curing can be utilized to make the damming adhesive 100 more fully and tightly contact the white light Mini-LED circuit board 201, further reducing light efficiency loss and light leakage, and improving the light output quality of the white light Mini-LED lamp board.

[0046] In some embodiments of this application, before the step of injecting the damming adhesive 100 into the adhesive tank 401 of the fixture, the method further includes: spraying a release agent into the adhesive tank 401 of the fixture.

[0047] In the method for preparing a white Mini-LED light board provided in this application embodiment, after the curing step of the damming adhesive 100 is completed, the damming adhesive 100 will be tightly bonded to the white Mini-LED circuit board 201 of the white Mini-LED module 200, and the damming adhesive 100 and the white Mini-LED module 200 will combine to form a white Mini-LED light board. At this time, the white Mini-LED light board needs to be removed from the fixture to facilitate subsequent testing, packaging, and shipping of the white Mini-LED light board. However, since the damming adhesive 100 has a certain degree of stickiness, when the damming adhesive 100 adheres to the inside of the colloid tank 401, it may cause the white Mini-LED light board to be difficult to separate from the fixture. To improve this problem, this application performs a step of spraying a release agent into the colloid tank 401 of the fixture before the step of injecting the damming adhesive 100 into the colloid tank 401 of the fixture, so as to form a thin layer of release agent on the inner wall of the colloid tank 401, which facilitates the subsequent separation operation of the damming adhesive 100 from the colloid tank 401.

[0048] In some embodiments of this application, the thickness of the release agent is a first thickness, the thickness of the white Mini-LED lamp bead 202 is a second thickness, and the depth of the colloid groove 401 is greater than the sum of the first thickness and the second thickness.

[0049] In the method for preparing a white Mini-LED light panel provided in this application embodiment, the step of spraying a release agent into the colloid groove 401 of the fixture forms a thin layer of release agent on the inner wall of the colloid groove 401. Although the thickness of the release agent is small, it still compresses the accommodating space of the damming adhesive 100 in the colloid groove 401, thereby reducing the thickness of the damming adhesive 100 and affecting the light crosstalk effect of the light panel. In order to ensure that the height of the damming adhesive 100 in the subsequently prepared white Mini-LED light panel is greater than the height of the white Mini-LED lamp beads 202, this application makes the depth of the colloid groove 401 greater than the sum of the thickness of the release agent and the thickness of the white Mini-LED lamp beads 202.

[0050] In some embodiments of this application, the step of pre-curing the damming adhesive 100 includes: heating the damming adhesive 100 to pre-cur the damming adhesive 100, improving the flatness of the damming adhesive 100 in the colloid tank 401, and making the surface of the damming adhesive 100 flush with the surface of the support platform 40 of the fixture.

[0051] In the preparation method of the white Mini-LED light board provided in this application embodiment, the pre-curing process involves heating the damming adhesive 100 to achieve pre-curing. Although the fluidity of the damming adhesive 100 will decrease at the end of the pre-curing, in the early and middle stages of pre-curing, before the temperature of the damming adhesive 100 reaches the set pre-curing temperature, the fluidity of the damming adhesive 100 will increase due to heating, so that the damming adhesive 100 can fully self-level in the colloid tank 401, thereby improving the flatness of the damming adhesive 100 in the colloid tank 401 and making the surface height of the damming adhesive 100 in the colloid tank 401 tend to be uniform. Based on this, this application can control the injection amount of the damming adhesive 100. For example, based on the volume of the colloid tank 401 and the amount of release agent used, the maximum amount of damming adhesive 100 to be injected can be calculated, and the damming adhesive 100 can be injected into the colloid tank 401 on the support platform 40 of the fixture according to the actual injection amount equal to the maximum amount. After the damming adhesive 100 is fully leveled, the surface of the damming adhesive 100 is flush with the surface of the support platform 40 of the fixture. Since the surface of the damming adhesive 100 is flush with the surface of the support platform 40 of the fixture, the bonding tightness between the damming adhesive 100 and the white light Mini-LED circuit board 201 can be improved in the subsequent step of contacting the white light Mini-LED circuit board 201 with the damming adhesive 100, thereby improving the assembly yield, reducing luminous efficiency loss and light leakage, and improving the light output quality of the white light Mini-LED lamp board.

[0052] In some embodiments of this application, the step of pre-curing the damming adhesive 100 includes: heating the damming adhesive 100 to pre-cur the damming adhesive 100, improving the flatness of the damming adhesive 100 in the colloid tank 401, and making the surface of the damming adhesive 100 lower than the surface of the support platform 40 of the fixture.

[0053] In the preparation method of the white Mini-LED light board provided in this application embodiment, the pre-curing process involves heating the damming adhesive 100 to achieve pre-curing. Although the fluidity of the damming adhesive 100 will decrease at the end of the pre-curing, in the early and middle stages of pre-curing, before the temperature of the damming adhesive 100 reaches the set pre-curing temperature, the fluidity of the damming adhesive 100 will increase due to heating, so that the damming adhesive 100 can fully self-level in the colloid tank 401, thereby improving the flatness of the damming adhesive 100 in the colloid tank 401 and making the surface height of the damming adhesive 100 in the colloid tank 401 tend to be uniform. Based on this, this application can control the injection amount of the damming adhesive 100. For example, based on the volume of the colloid tank 401 and the amount of release agent used, the maximum amount of damming adhesive 100 to be injected can be calculated, and the damming adhesive 100 can be injected into the colloid tank 401 on the support platform 40 of the fixture according to an actual injection amount less than the maximum amount. This allows the damming adhesive 100 to be fully leveled, with its surface lower than the surface of the support platform 40 of the fixture. Since the surface of the damming adhesive 100 is lower than the surface of the support platform 40 of the fixture, the problem of damming adhesive 100 overflowing onto the support platform 40 due to uncontrollable process factors (such as vibration) and thus contaminating the support platform 40 and the white Mini-LED lamp beads 202 can be reduced in the subsequent step of setting the white Mini-LED circuit board 201 onto the support platform 40 of the fixture.

[0054] In addition, in the method for preparing the white Mini-LED light panel provided in this application embodiment, since the actual amount of glue injected is less than the maximum amount, in the step of injecting the damming glue 100 into the glue tank 401 on the support platform 40 of the fixture, even if the damming glue 100 has slightly poor fluidity and there are uneven areas of the damming glue 100 in the glue tank 401, the situation of excessive accumulation of damming glue 100 in local areas and overflow of damming glue 100 contaminating the support platform 40 due to reaching the planned amount of damming glue 100 can be avoided.

[0055] For example, when the planned amount of adhesive is equal to the maximum amount of damming adhesive 100 to be injected, in the step of injecting the damming adhesive 100 into the adhesive tank 401 on the support platform 40 of the fixture, since the damming adhesive 100 has not been pre-cured, the damming adhesive 100 in the adhesive tank 401 cannot achieve complete self-leveling and has low flatness. This will inevitably lead to incomplete filling of the damming adhesive 100 in the adhesive tank 401 in some areas, which will cause the damming adhesive 100 in the adhesive tank 401 in some areas to accumulate above the surface of the support platform 40, resulting in the damming adhesive 100 overflowing and contaminating the support platform 40. Therefore, based on the result that the surface of the damming adhesive 100 is lower than the surface of the support platform 40 of the fixture after pre-curing the damming adhesive 100, this application can determine that the planned amount of adhesive is less than the maximum amount of damming adhesive 100. Thus, in the step of injecting the damming adhesive 100 into the colloid tank 401 on the support platform 40 of the fixture, the maximum height of the damming adhesive 100 in the colloid tank 401 can be controlled to be flush with the surface of the support platform 40.

[0056] In some embodiments of this application, in the step of injecting the damming adhesive 100 into the adhesive groove 401 on the support platform 40 of the fixture, the fixture further includes a positioning frame 50, which is disposed on the surface of the support platform 40 and encloses to form a closed shape, the closed shape being adapted to the size of the white light Mini-LED circuit board 201.

[0057] In the method for preparing a white Mini-LED lamp board provided in this application embodiment, the positioning frame 50 serves two purposes. First, it ensures more precise alignment between the white Mini-LED module 200 and the damming adhesive 100 during the step of placing the white Mini-LED circuit board 201 onto the support platform 40 of the fixture. Second, the closed positioning frame 50 creates a negative pressure between the white Mini-LED circuit board 201 and the support platform 40 during the step of placing the white Mini-LED circuit board 201 onto the support platform 40 of the fixture. This allows the partially cured and still fluid damming adhesive 100 to extend a small distance closer to the white Mini-LED circuit board 201, thus facilitating closer contact between the damming adhesive 100 and the white Mini-LED circuit board 201 in each area. This reduces light loss and light leakage, thereby improving the light output quality of the white Mini-LED lamp board.

[0058] That is, whether the surface of the damming adhesive 100 is flush with the surface of the support platform 40 of the fixture, but the white light Mini-LED circuit board 201 is uneven, or the surface of the damming adhesive 100 is lower than the surface of the support platform 40 of the fixture, the positioning frame 50 can be used to create a negative pressure between the white light Mini-LED circuit board 201 and the support platform 40 during the step of setting the white light Mini-LED circuit board 201 onto the support platform 40 of the fixture. This allows the damming adhesive 100, which still has a certain degree of fluidity, to extend a small distance toward the white light Mini-LED circuit board 201, thereby achieving a tight bond between the damming adhesive 100 and the white light Mini-LED circuit board 201.

[0059] In some embodiments of this application, in the step of heating the damming adhesive 100 to pre-cure the damming adhesive 100, improving the flatness of the damming adhesive 100 in the colloid tank 401, and making the surface of the damming adhesive 100 lower than the surface of the support platform 40 of the fixture, the height by which the surface of the damming adhesive 100 is lower than the surface of the support platform 40 of the fixture is a, where 0 < a ≤ 50 micrometers.

[0060] In the method for fabricating a white Mini-LED lamp board provided in this application embodiment, the applicant discovered in actual research that although a negative pressure can be formed between the white Mini-LED circuit board 201 and the support platform 40 to allow the still somewhat fluid dammed adhesive 100 to extend a small distance towards the white Mini-LED circuit board 201, when the surface of the dammed adhesive 100 is significantly lower than the surface of the support platform 40 of the fixture, the liquid level adjustment effect of the negative pressure on the dammed adhesive 100 will fail, resulting in a problem where the dammed adhesive 100 and the white Mini-LED circuit board 201 are difficult to bond tightly. Therefore, the applicant controls the height of the dammed adhesive 100 surface below the surface of the support platform 40 of the fixture to within 50 micrometers to ensure that the liquid level adjustment effect of the negative pressure on the dammed adhesive 100 is maintained during the step of bringing the white Mini-LED circuit board 201 into contact with the dammed adhesive 100, thereby improving the reliability and fabrication yield of the white Mini-LED lamp board.

[0061] In some embodiments of this application, in the step of injecting the damming adhesive 100 into the adhesive groove 401 on the support platform 40 of the fixture, the support platform 40 of the fixture is further provided with at least one positioning post 60. The positioning post 60 is disposed on the surface of the support platform 40 to facilitate positioning of the white Mini-LED circuit board 201 on the support platform 40. Optionally, the positioning post 60 is located at the corner of the support platform 40. For example, if the support platform 40 of the fixture is rectangular, four positioning posts 60 may be provided on the support platform 40, with the four positioning posts 60 respectively disposed at the four corners of the rectangle.

[0062] In some embodiments of this application, at least one positioning groove 2011 is provided at the corner of the white light Mini-LED circuit board 201. The positioning groove 2011 corresponds to the positioning post 60 and is adapted in size to facilitate the alignment and assembly of the white light Mini-LED module 200 and the damming adhesive 100.

[0063] In some embodiments of this application, the step of heating the damming adhesive 100 to pre-cure the damming adhesive 100 includes: heating the damming adhesive 100 in a first stage using the heating device 20 in the fixture, with the heating temperature being a first temperature; and then heating the damming adhesive 100 in a second stage using the heating device 20 in the fixture, with the heating temperature being a second temperature, wherein the first temperature is lower than the second temperature, and the duration of the first stage is shorter than the duration of the second stage.

[0064] In the method for preparing the white Mini-LED light board provided in this application embodiment, the damming adhesive 100 is heated by using the heating device 20 in the fixture to heat the damming adhesive 100 in stages, so as to first improve the flatness of the damming adhesive 100 in the colloid tank 401, and then achieve the pre-curing of the damming adhesive 100 in the colloid tank 401.

[0065] Specifically, the heating device 20 is located below the support platform 40 and can heat the damming adhesive 100 in the colloid tank 401 in the support platform 40 through heat conduction to achieve pre-curing of the damming adhesive 100. During the pre-curing process of the damming adhesive 100, by setting a first stage with a shorter duration and lower temperature and a second stage with a longer duration and higher temperature, the fluidity of the damming adhesive 100 in the colloid tank 401 can be further increased in the first stage, thereby helping to improve the flatness of the damming adhesive 100 in the colloid tank 401; and the fluidity of the damming adhesive 100 in the colloid tank 401 can be reduced in the second stage, thereby helping to improve the morphological stability of the damming adhesive 100 in the colloid tank 401. After this step, the damming adhesive 100 is fully pre-cured, converted into a semi-solid state, and has a flatter surface morphology, which facilitates the subsequent assembly of the white Mini-LED circuit board 201 with the damming adhesive 100.

[0066] In some embodiments of this application, the duration of the first stage is 40 to 80 seconds, and the first temperature is 55°C to 65°C; the duration of the second stage is 100 to 140 seconds, and the second temperature is 75°C to 85°C.

[0067] In some embodiments of this application, in the step of injecting the damming adhesive 100 into the colloid tank 401 of the fixture, the support platform 40 of the fixture is provided with a plurality of vacuum adsorption holes 403, and the number of vacuum adsorption holes 403 in each grid of the colloid tank 401 is the same; the step of bringing the white light Mini-LED circuit board 201 into contact with the damming adhesive 100 includes: using the vacuum adsorption device 30 in the fixture, through the vacuum adsorption holes 403, adsorbing the white light Mini-LED circuit board 201 flat and tightly adhering it to the support platform 40, so that the white light Mini-LED circuit board 201 comes into contact with the damming adhesive 100.

[0068] In the method for preparing a white Mini-LED light board provided in this application embodiment, since the supporting platform 40 of the fixture has multiple vacuum adsorption holes 403 in the step of injecting the damming adhesive 100 into the colloid tank 401 of the fixture, and the number of vacuum adsorption holes 403 in each grid of the colloid tank 401 is the same, when the vacuum adsorption device 30 in the fixture is used to adsorb the white Mini-LED circuit board 201 set on the supporting platform 40 through the vacuum adsorption holes 403, it can ensure that the adsorption force of the white Mini-LED circuit board 201 is uniform throughout, thereby improving the flatness of the white Mini-LED circuit board 201 and improving the problem of loose bonding with the damming adhesive 100 caused by unevenness in some areas of the white Mini-LED circuit board 201.

[0069] In addition, it should be noted that before the step of using the vacuum adsorption device 30 in the fixture to adsorb and flatten the white light Mini-LED circuit board 201 through the vacuum adsorption hole 403, the damming adhesive 100 has been pre-cured, thus minimizing the possibility of the damming adhesive 100 being sucked into the vacuum adsorption hole 403.

[0070] In some embodiments of this application, the white Mini-LED circuit board 201 can be a rigid printed circuit board (PCB), or a relatively flexible flexible circuit board (FPC), fiberglass board, etc.

[0071] In the method for preparing a white Mini-LED light board provided in this application embodiment, when the white Mini-LED circuit board 201 is a flexible circuit board or a fiberglass board, wrinkles often exist on the white Mini-LED circuit board 201 during the steps of placing the white Mini-LED circuit board 201 on the support platform 40 of the fixture and bringing the white Mini-LED circuit board 201 into contact with the retaining adhesive 100. These wrinkles are difficult to eliminate by pressing and may even further damage the white Mini-LED light board. If the ED circuit board 201 is damaged, this application uses vacuum adsorption to bring the white light Mini-LED circuit board 201 into contact with the damming adhesive 100. This not only reduces the probability of damage to the white light Mini-LED circuit board 201, but also makes the white light Mini-LED circuit board 201 flatter during the vacuum adsorption process. This improves the bonding tightness between the white light Mini-LED circuit board 201 and the damming adhesive 100, enhances the light reflection and anti-crosstalk effect of the damming adhesive 100, and improves the manufacturing yield of the white light Mini-LED lamp board.

[0072] In some embodiments of this application, the dam adhesive 100 is a white wall adhesive with light-reflecting properties.

[0073] In some embodiments of this application, the vacuum adsorption device 30 in the fixture includes a vacuum chamber 31 and a vacuum pump 33. The vacuum chamber 31 is disposed below the support platform 40 and is connected to the vacuum adsorption hole 403, that is, the vacuum adsorption hole 403 penetrates the support platform 40. A vacuum interface 32 is provided on the side of the vacuum chamber 31, and the vacuum pump 33 is connected to the vacuum chamber 31 through the vacuum interface 32.

[0074] In some embodiments of this application, the heating device 20 is disposed on the side of the vacuum chamber 31 away from the support platform 40.

[0075] In some embodiments of this application, the step of curing the damming adhesive 100 includes: heating the damming adhesive 100 in a third stage using a heating device 20, wherein the heating temperature is a third temperature, the third temperature is greater than the second temperature, and the duration of the third stage is greater than the sum of the durations of the first stage and the second stage.

[0076] In the method for preparing a white Mini-LED lamp board provided in this application embodiment, by using a heating device 20 to heat the damming adhesive 100 for a longer time and at a higher temperature, the damming adhesive 100 in contact with the white Mini-LED circuit board 201 can be converted from a semi-solid state to a fully solid state, thereby forming a stable solid damming adhesive 100 frame structure on the white Mini-LED circuit board 201, so that the damming adhesive 100 has a stable anti-crosstalk effect.

[0077] In some embodiments of this application, the duration of the third stage is 8 to 12 minutes, and the third temperature is 130°C to 170°C.

[0078] In some embodiments of this application, in the step of setting the white light Mini-LED circuit board 201 onto the support platform 40 of the fixture, and correspondingly setting the multiple white light Mini-LED lamp beads 202 fixed on the white light Mini-LED circuit board 201 into the multiple lamp bead receiving slots 402, the heating device 20 can continue to maintain the heating state, and its heating temperature can be equal to the second temperature.

[0079] In some embodiments of this application, during the step of bringing the white Mini-LED circuit board 201 into contact with the dammed adhesive 100, the heating device 20 may continue to maintain a heating state, and its heating temperature may be equal to the second temperature.

[0080] In some embodiments of this application, after the step of curing the damming adhesive 100, the method further includes: turning off the heating function of the heating device 20, and after the damming adhesive 100 cools to a preset temperature, turning off the vacuum adsorption device 30, and removing the prepared white light Mini-LED lamp board from the fixture.

[0081] In the method for preparing a white Mini-LED light board provided in this application embodiment, after the curing step of the damming adhesive 100, the white Mini-LED light board needs to be removed from the fixture to facilitate subsequent testing, packaging, and shipping of the white Mini-LED light board. However, the applicant discovered in its research that, in the step of curing the damming adhesive 100, in order to facilitate the curing of the damming adhesive 100, the damming adhesive 100 will be heated to a high temperature under the heating action of the heating device 20. If the white Mini-LED light board is directly removed from the fixture without cooling the damming adhesive 100, the white Mini-LED circuit board 201 may warp under the thermal stress of the damming adhesive 100, resulting in problems such as reduced luminous efficacy, reduced reliability, and reduced yield of the white Mini-LED light board. Therefore, after the step of curing the damming adhesive 100, this application continues to keep the vacuum adsorption device 30 working to maintain the surface flatness of the white Mini-LED circuit board 201. On this basis, the heating function of the heating device 20 is turned off. After the damming adhesive 100 cools to the preset temperature and the risk of thermal stress damage to the white Mini-LED circuit board 201 caused by the damming adhesive 100 is eliminated, the vacuum adsorption device 30 is turned off, and the prepared white Mini-LED lamp board is taken out from the fixture. This ensures the surface stability of the white Mini-LED circuit board 201, improves the warping problem caused by thermal stress, and enhances the luminous efficacy, reliability, and yield of the white Mini-LED circuit board 201.

[0082] In some embodiments of this application, the preset temperature is below 40°C. Optionally, the preset temperature can be room temperature.

[0083] In some embodiments of this application, the white Mini-LED bead 202 includes a stacked blue LED chip and a color conversion film. The color conversion film has a multi-layer structure and includes a color conversion layer, which can be a phosphor layer or a quantum dot layer. Optionally, the thickness of the color conversion film is greater than the thickness of the blue LED chip. The color conversion film includes a first transparent protective layer, a second transparent protective layer, and the color conversion layer disposed between the first transparent protective layer and the second transparent protective layer.

[0084] In the method for preparing a white Mini-LED light board provided in this application embodiment, the white Mini-LED beads 202 used in the white Mini-LED light board have a structure of stacked blue LED chips and color conversion films, resulting in a relatively thick white Mini-LED beads 202. Conventional Mini-LED light boards are blue Mini-LED light boards, and the beads used are blue Mini-LED beads without color conversion films. That is, when adhesive is directly applied to the white Mini-LED circuit board 201, without changing the material of the damming adhesive 100, based on the thixotropic properties of the adhesive, it is impossible to ensure that the width of the damming adhesive 100 is the same as the width of the damming adhesive 100 in the blue Mini-LED light board, while making the thickness of the damming adhesive 100 protrude beyond the white Mini-LED beads 202. In other words, the method for preparing white Mini-LED light boards provided in this application can specifically improve the problem that the conventional 100-dot encapsulation process cannot meet the actual process requirements due to the relatively thick Mini-LED beads.

[0085] Secondly, embodiments of this application provide a fixture that can be applied in the fabrication process of white Mini-LED lamp panels.

[0086] Combination Figures 2 to 8 As shown, in some embodiments of this application, the fixture includes a base 10, a heating device 20 and a support platform 40 stacked in sequence. The support platform 40 includes interconnected grid-shaped colloid grooves 401 and a plurality of LED bead receiving grooves 402. Each grid of the grid-shaped colloid groove 401 is provided with a corresponding LED bead receiving groove 402.

[0087] In the fixture provided in this application embodiment, the interconnected mesh-like colloid tanks 401 are used to accommodate the damming adhesive 100 and achieve self-leveling of the damming adhesive 100, thereby enabling the damming adhesive 100 to have better height consistency. This can improve the problem of excessive adhesive thickness at intersections caused by directly applying adhesive to the circuit board, and also improve the problem of uneven dotted areas around intersections caused by skipping dots when applying adhesive directly to the circuit board. The heating device 20 can heat the damming adhesive 100 in the colloid tank 401 in the support platform 40 to achieve pre-curing or curing of the damming adhesive 100, so that the damming adhesive 100 in the colloid tank 401 can contact and be fixedly connected to the white light Mini-LED circuit board 201 in the white light Mini-LED module 200.

[0088] In the fixture provided in this application embodiment, the support platform 40 can be used to support the white light Mini-LED circuit board 201 in the white light Mini-LED module 200, and the lamp bead receiving groove 402 can be used to support the white light Mini-LED lamp beads 202 in the white light Mini-LED module 200. Since each grid of the grid-like colloid groove 401 is provided with a corresponding lamp bead receiving groove 402, the damming adhesive 100 subsequently formed on the white light Mini-LED circuit board 201 can form an independent light-emitting space for each white light Mini-LED lamp bead 202, thereby improving the optical crosstalk problem.

[0089] In some embodiments of this application, the support platform 40 of the fixture is provided with a plurality of vacuum adsorption holes 403, and the number of vacuum adsorption holes 403 in each grid of the colloid tank 401 is the same. The fixture also includes a vacuum adsorption device 30 comprising a vacuum chamber 31 and a vacuum pump 33. The vacuum chamber 31 is disposed between the support platform 40 and the heating device 20 and is connected to the vacuum adsorption holes 403, that is, the vacuum adsorption holes 403 penetrate the support platform 40. A vacuum interface 32 is provided on the side of the vacuum chamber 31, and the vacuum pump 33 is connected to the vacuum chamber 31 through the vacuum interface 32.

[0090] In the fixture provided in this application embodiment, the vacuum adsorption device 30 in the fixture can be used to adsorb the white light Mini-LED circuit board 201 set on the support platform 40 through the vacuum adsorption hole 403. This can ensure that the adsorption force is uniform throughout the white light Mini-LED circuit board 201, thereby improving the flatness of the white light Mini-LED circuit board 201 and improving the problem of poor bonding with the dam adhesive 100 caused by unevenness in some areas of the white light Mini-LED circuit board 201.

[0091] In some embodiments of this application, the depth of the lamp bead receiving groove 402 is greater than or equal to the thickness of the white light Mini-LED lamp beads 202 in the white light Mini-LED lamp board.

[0092] In the fixture provided in this application embodiment, the depth of the lamp bead receiving groove 402 is greater than or equal to the thickness of the white light Mini-LED lamp bead 202, so as to avoid the problem of the white light Mini-LED lamp bead 202 being squeezed and damaged when the white light Mini-LED circuit board 201 is placed on the support platform 40 of the fixture.

[0093] In some embodiments of this application, the depth of the lamp bead receiving groove 402 is less than the depth of the colloid groove 401.

[0094] In the fixture provided in this application embodiment, in the actual manufacturing process, the depth of the lamp bead receiving groove 402 is generally approximately the thickness of the white light Mini-LED lamp bead 202. In order to ensure the anti-crosstalk effect of the damming adhesive 100, the distance between the damming adhesive 100 and the white light Mini-LED circuit board 201 needs to be greater than the distance between the white light Mini-LED lamp bead 202 and the white light Mini-LED circuit board 201. Therefore, the depth of the lamp bead receiving groove 402 is set to be less than the depth of the adhesive groove 401.

[0095] In some embodiments of this application, the cross-sectional shape of the colloid tank 401 is arc-shaped, so as to minimize the risk of adhesion between the colloid tank 401 and the damming adhesive 100, save the material of the damming adhesive 100, and at the same time ensure the anti-crosstalk effect of the damming adhesive 100.

[0096] In some embodiments of this application, the fixture further includes at least one positioning post 60, which is disposed on the surface of the support platform 40 to facilitate positioning of the white Mini-LED circuit board 201 on the support platform 40. Correspondingly, the white Mini-LED circuit board 201 is provided with a positioning groove 2011 adapted to the positioning post 60. Optionally, the positioning post 60 is located at the corner of the support platform 40. For example, the support platform 40 of the fixture is rectangular, and four positioning posts 60 may be provided on the support platform 40, with the four positioning posts 60 respectively disposed at the four corners of the rectangle.

[0097] In some embodiments of this application, the fixture further includes a positioning frame 50, which is disposed on the surface of the support platform 40 and encloses a closed shape that is adapted to the size of the white Mini-LED circuit board 201.

[0098] In the method for preparing a white Mini-LED lamp board provided in this application embodiment, the positioning frame 50 serves two purposes. First, it ensures more precise alignment between the white Mini-LED module 200 and the damming adhesive 100 during the step of placing the white Mini-LED circuit board 201 onto the support platform 40 of the fixture. Second, the closed positioning frame 50 creates a negative pressure between the white Mini-LED circuit board 201 and the support platform 40 during the step of placing the white Mini-LED circuit board 201 onto the support platform 40 of the fixture. This allows the partially cured and still fluid damming adhesive 100 to extend a small distance closer to the white Mini-LED circuit board 201, thus facilitating closer contact between the damming adhesive 100 and the white Mini-LED circuit board 201 in each area. This reduces light loss and light leakage, thereby improving the light output quality of the white Mini-LED lamp board.

[0099] In summary, this application provides a method for preparing a white Mini-LED light board and a fixture. The method for preparing the white Mini-LED light board includes: injecting a damming adhesive into a colloid groove on a support platform of the fixture, wherein the colloid groove is in the form of an interconnected grid, and the support platform is further provided with a plurality of LED bead receiving grooves, and each grid of the colloid groove is provided with one LED bead receiving groove; pre-curing the damming adhesive; placing a white Mini-LED circuit board on the support platform of the fixture, and correspondingly placing a plurality of white Mini-LED LED beads fixed on the white Mini-LED circuit board into the plurality of LED bead receiving grooves, wherein the thickness of the white Mini-LED LED beads is less than the depth of the colloid groove; bringing the white Mini-LED circuit board into contact with the damming adhesive; and curing the damming adhesive. The method for preparing a white Mini-LED light panel provided in this application enables the prepared dammed adhesive to have a large thickness while having a narrow width, thereby improving the strip shadow and light crosstalk problems of the white Mini-LED light panel.

[0100] The preparation method and fixture for a white Mini-LED light board provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for preparing a white Mini-LED light panel, characterized in that, include: The dam-enclosing adhesive is injected into the adhesive groove on the support platform of the fixture. The adhesive groove is in the form of an interconnected grid. The support platform is also provided with multiple LED bead receiving grooves, and each grid of the adhesive groove is provided with one LED bead receiving groove. The dam sealant is pre-cured; A white light Mini-LED circuit board is placed on the support platform of the fixture, and multiple white light Mini-LED beads fixed on the white light Mini-LED circuit board are correspondingly placed in multiple bead receiving slots, wherein the thickness of the white light Mini-LED beads is less than the depth of the colloid slots; Make the white Mini-LED circuit board come into contact with the dammed adhesive; The dam sealant is then cured. In the step of injecting the damming adhesive into the adhesive groove on the support platform of the fixture, the fixture also includes a positioning frame, which is disposed on the surface of the support platform and forms a closed shape, the closed shape being adapted to the size of the white light Mini-LED circuit board.

2. The method for preparing a white Mini-LED lamp board according to claim 1, characterized in that, Before the step of injecting the damming adhesive into the adhesive tank of the fixture, the method further includes: spraying a release agent into the adhesive tank of the fixture.

3. The method for preparing a white Mini-LED lamp board according to claim 1, characterized in that, The step of pre-curing the damming adhesive includes: heating the damming adhesive to pre-cur it, improving the flatness of the damming adhesive in the adhesive tank, and making the surface of the damming adhesive flush with the surface of the support platform of the fixture.

4. The method for preparing a white Mini-LED lamp board according to claim 1, characterized in that, The step of pre-curing the damming adhesive includes: heating the damming adhesive to pre-cur it, improving the flatness of the damming adhesive in the adhesive tank, and making the surface of the damming adhesive lower than the surface of the support platform of the fixture.

5. The method for preparing a white Mini-LED lamp panel according to claim 3 or 4, characterized in that, The step of heating the damming adhesive to pre-cure it includes: heating the damming adhesive in a first stage using the heating device in the fixture, with the heating temperature being a first temperature; and then heating the damming adhesive in a second stage using the heating device in the fixture, with the heating temperature being a second temperature, wherein the first temperature is lower than the second temperature, and the duration of the first stage is shorter than the duration of the second stage.

6. The method for preparing a white Mini-LED lamp board according to claim 5, characterized in that, In the step of injecting the damming adhesive into the colloid tank of the fixture, the support platform of the fixture is provided with multiple vacuum adsorption holes, and the number of vacuum adsorption holes in each grid of the colloid tank is the same; the step of bringing the white light Mini-LED circuit board into contact with the damming adhesive includes: using the vacuum adsorption device in the fixture, through the vacuum adsorption holes, adsorbing the white light Mini-LED circuit board flat and tightly adhering it to the support platform, so that the white light Mini-LED circuit board comes into contact with the damming adhesive.

7. The method for preparing a white Mini-LED lamp board according to claim 6, characterized in that, The step of curing the damming adhesive includes: heating the damming adhesive in a third stage using a heating device, wherein the heating temperature is a third temperature, the third temperature is greater than the second temperature, and the duration of the third stage is greater than the sum of the durations of the first stage and the second stage.

8. The method for preparing a white Mini-LED lamp board according to claim 6, characterized in that, After the step of curing the damming adhesive, the method further includes: turning off the heating function of the heating device, and after the damming adhesive cools to a preset temperature, turning off the vacuum adsorption device, and removing the prepared white light Mini-LED lamp board from the fixture.

Images