Radiator for high-power GPU (Graphics Processing Unit)

Abstract

The invention relates to a radiator for a high-power GPU (Graphics Processing Unit), which comprises a cover plate, a splitter plate, a radiating cold plate and a GPU mainboard, and is characterized in that a pair of working medium flowing ports are formed in one side of the cover plate and are respectively used as a working medium inflow port and a working medium outflow port of the radiator; the flow dividing plate is provided with a flow dividing concave cavity communicated with the working medium flow inlet, a flow collecting concave cavity communicated with the working medium flow outlet and a heat exchange concave cavity communicated with the flow dividing concave cavity and the flow collecting concave cavity, and a flow dividing channel with an opening facing the flow dividing concave cavity and a flow collecting channel with an opening facing the flow collecting concave cavity are arranged in the heat exchange concave cavity; micro-structure fins which correspond to the flow dividing concave cavity, the heat exchange concave cavity and the flow collecting concave cavity and are used for enhancing heat exchange are arranged on the heat dissipation cold plate, a GPU core corresponding to the micro-structure fins is arranged on the GPU main board, and the GPU main board and the heat dissipation cold plate are tightly attached by smearing a heat conduction material. According to the invention, the flow stability of the micro-channel radiator under a high-pressure-difference working condition can be improved, and the junction temperature fluctuation of a chip can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and in particular to a radiator for a high-power GPU. Background Art

[0002] Microchannel liquid cooling technology is currently an effective solution to the problem of high heat flux density heat dissipation. However, existing microchannel radiators have inherent defects such as uneven flow distribution and excessive pressure drop, which limit the heat dissipation performance. Especially under high-power conditions, the cooling fluid is prone to local boiling in the channel, causing flow instability and seriously affecting the reliability of the heat dissipation system. Although the traditional parallel straight channel structure is easy to process, it is prone to obvious uneven flow distribution problems, resulting in insufficient cooling in some areas and the formation of hot spots. In addition, the single-flow channel design limits the contact time between the working fluid and the heat source, making it difficult to further improve the heat exchange efficiency.

[0003] CN202420472681.0 discloses a CPU / GPU phase change liquid cooling radiator, comprising an upper cover plate, a liquid baffle plate, a lower cover plate and a bottom plate, wherein the liquid baffle plate is pressed between the upper cover plate and the lower cover plate; the upper cover plate is provided with a pair of working fluid flow ports, which serve as the working fluid flow inlet and working fluid flow outlet of the radiator respectively; a pair of connecting grooves are provided on the surface of the upper cover plate facing the liquid baffle plate, which are respectively connected to the working fluid flow ports; a pair of through holes are provided on the liquid baffle plate at positions corresponding to the connecting grooves; a through opening is provided in the middle of the lower cover plate, the liquid baffle plate is provided at one end of the through opening, and the bottom plate is connected to the other end of the through opening; a number of raised tiny structures are provided on the inner wall of the bottom plate, but the heat exchange efficiency is low and it cannot meet the heat dissipation requirements of higher performance chips.

[0004] Previous studies have attempted to introduce improvement solutions such as multi-stage diversion and staggered fins, but these structures often lead to a significant increase in pressure drop, which in turn reduces the overall energy efficiency of the system. Summary of the Invention

[0005] The purpose of the present invention is to overcome the defects of the prior art and provide a heat sink for a high-power GPU.

[0006] The purpose of the present invention can be achieved by the following technical solutions:

[0007] The technical solution of the present invention is to provide a radiator for high-power GPU, comprising: a cover plate, a diverter plate, a heat dissipation cold plate and a GPU motherboard.

[0008] The cover plate and the heat dissipation cold plate together form a heat dissipation space, and a diverter plate is provided in the heat dissipation space;

[0009] A pair of working fluid flow ports are provided on one side of the cover plate, serving as a working fluid flow inlet and a working fluid flow outlet of the radiator respectively;

[0010] The diverter plate is provided with a diverter cavity communicating with the working medium flow inlet, a collecting cavity communicating with the working medium flow outlet, and a heat exchange cavity communicating with the diverter cavity and the collecting cavity. The heat exchange cavity is provided with a diverter channel opening toward the diverter cavity and a collecting channel opening toward the collecting cavity. After the working medium flows into the diverter cavity through the working medium flow inlet, it flows from the diverter channel into the heat exchange cavity to exchange heat, then flows into the collecting cavity through the collecting channel, and finally flows out through the working medium flow outlet.

[0011] The heat dissipation cold plate is provided with microstructured fins corresponding to the flow diversion cavity, the heat exchange cavity and the flow collection cavity and used to enhance heat exchange;

[0012] The GPU mainboard is provided with a GPU core corresponding to the microstructure ribs, and the GPU mainboard and the heat dissipation cold plate are tightly fitted by applying thermal conductive material.

[0013] In some specific embodiments, the diversion channel is composed of a plurality of baffles arranged in parallel and spaced apart and connected to the collecting cavity, and the space opening formed by two adjacent baffles is oriented toward the diversion channel;

[0014] The collecting channel is composed of a plurality of baffles arranged in parallel and spaced apart and connected to the diversion cavity, and the opening direction of the space formed by two adjacent baffles is toward the collecting channel.

[0015] In some specific embodiments, the structure of the baffle includes a multi-segment structure, a tangent structure, a cotangent structure, a sine structure, and a cosine structure;

[0016] When the baffle is a multi-segment structure, the baffle includes three fold segments, and the lengths of each fold segment are L1, L3 and L2, respectively, and at least one of L1, L2 and L3 is not zero. 1 / 2 of the width of the flow channel opening is defined as W1, and 1 / 2 of the width of the closed end of the flow channel is defined as W2. The angles between two adjacent fold segments are θ1 and θ2, respectively.

[0017] When W1 and W2 are equal, L3 is 0, and the flow channel is a uniform rectangular structure;

[0018] When W1 and W2 are not equal and non-zero, L1 and L2 are both 0, and the flow channel is a trapezoidal structure;

[0019] When W2 is 0, the flow channel is a pointed mouth structure;

[0020] When W2 is 0, and L1 and L2 are both 0, the flow channel is a triangular structure;

[0021] When all parameters are non-zero and the angles θ1 and θ2 are right angles, the flow channel is a quasi-convex structure;

[0022] When the strip structure is a tangent structure or a cotangent structure, the distance from the center line of the strip to the center line of the flow channel is defined as E, the total length of the flow channel is L4, and the amplitude of the tangent or cotangent is A.

[0023] When the strip structure is a sine structure or a cosine structure, the distance from the strip centerline to the flow channel centerline is defined as F, the total length of the flow channel is L5, the amplitude of the sine / cosine is B, and the wavelength of the sine or cosine is λ.

[0024] In some specific embodiments, a second gasket for sealing is further provided between the diverter plate and the cover plate.

[0025] In some specific embodiments, a first gasket for adjusting the assembly gap is further provided between the heat exchange cavity of the diverter plate and the heat dissipation cold plate.

[0026] In some specific embodiments, the thickness ratio of the fin capillary structure in the microstructured fin is ≥0;

[0027] When the thickness of the fin capillary structure in the microstructure fin accounts for 0%, the microstructure fin is a completely solid fin;

[0028] When the thickness of the fin capillary structure in the microstructured fin accounts for 100%, the microstructured fin is composed of a complete porous capillary structure.

[0029] In some specific embodiments, the heat dissipation cold plate is provided with a multi-layer fin bottom surface capillary structure on a side surface provided with microstructured fins, and the number of layers of the fin bottom surface capillary structure is ≥0;

[0030] When the number of layers of the capillary structure on the bottom surface of the fin is 0, the surface of the heat dissipation cold plate on the side where the microstructured fins are provided is a smooth surface.

[0031] In some specific embodiments, the heat dissipation cold plate, the diverter plate, and the cover plate are connected by threaded connection, snap connection, riveting, or welding.

[0032] In some specific embodiments, the radiator further includes a pair of radiator joints, each connected to the pair of working medium flow ports.

[0033] In some specific implementations, a base plate is further provided at the bottom of the GPU mainboard.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] (1) The heat dissipation cold plate of the present application adopts a planar raised fin structure, and the heat exchange cavity is opened inside the cover plate. This design reduces the complexity of processing the heat dissipation cold plate.

[0036] (2) The diverter plate of this application can guide the fluid to achieve laminar transition, effectively reducing the risk of flow separation. By optimizing the channel structure design, the fluid kinetic energy is smoothly converted; this design helps to improve the flow stability of the microchannel heat sink under high pressure difference conditions and reduce chip junction temperature fluctuations.

[0037] (3) The baffle structure of the manifold can be selected in various forms such as folded segment, tangent, cotangent, sine or cosine according to actual needs to meet the heat dissipation requirements under different working conditions. It can be optimized for specific flow and pressure drop requirements.

[0038] (4) The porous capillary structure of the present application increases the area and path of liquid flow on the cold plate surface as well as the liquid supply, making the phase change heat dissipation technology more efficient and improving the overall performance of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is an exploded view of the overall structure of the radiator thread method of an embodiment of the present application.

[0040] Figure 2 This is a heat sink packaging diagram of an embodiment of the present application.

[0041] Figure 3 Schematic diagram of the structure of the top surface of the heat dissipation cold plate according to an embodiment of the present application.

[0042] Figure 4 Schematic diagram of the structure of the bottom surface of the heat dissipation cold plate according to an embodiment of the present application.

[0043] Figure 5 This is a structural schematic diagram of the top surface of the diverter plate according to an embodiment of the present application.

[0044] Figure 6 This is a structural schematic diagram of the bottom surface of the diverter plate in an embodiment of the present application.

[0045] Figure 7 Schematic diagram of the bottom structure of the cover plate according to an embodiment of the present application.

[0046] Figure 8 This is a schematic diagram of the top surface structure of the cover plate according to an embodiment of the present application.

[0047] Figure 9 This is a schematic diagram of the top surface structure of the GPU motherboard according to an embodiment of the present application.

[0048] Figure 10 This is a schematic diagram of the bottom surface structure of the GPU motherboard according to an embodiment of the present application.

[0049] Figure 11 This is a schematic diagram of the top surface structure of the base plate of an embodiment of the present application.

[0050] Figure 12 This is a schematic diagram of the bottom surface structure of the base plate of an embodiment of the present application.

[0051] Figure 13 This is a schematic structural diagram of the top surface of the first gasket in an embodiment of the present application.

[0052] Figure 14 This is a schematic structural diagram of the bottom surface of the first gasket in an embodiment of the present application.

[0053] Figure 15 This is a schematic structural diagram of the top surface of the second gasket in an embodiment of the present application.

[0054] Figure 16 This is a schematic structural diagram of the bottom surface of the second gasket in an embodiment of the present application.

[0055] Figure 17 This is a structural diagram of a radiator joint according to an embodiment of the present application.

[0056] Figure 18 Schematic diagram of the flow diversion / collection structure of an embodiment of the present application.

[0057] Figure 19 Schematic diagram of the capillary structure of the heat dissipation cold plate of this application.

[0058] Figure 20 This is a cross-sectional view of the overall structure of the radiator according to an embodiment of the present application.

[0059] Figure 21 This is a structural diagram of the radiator joint welding method according to an embodiment of the present application.

[0060] The following are marked in the figure:

[0061] 1-heat dissipation cold plate; 101-top surface of heat dissipation cold plate; 102-bottom surface of heat dissipation cold plate; 103-microstructure fin; 15-first countersunk through hole of cold plate; 16-second countersunk through hole of cold plate; 111-fin capillary structure; 112-fin bottom surface capillary structure.

[0062] 2-diverter plate; 21-diverter cavity; 22-collector cavity; 23-diverter channel; 24-collector channel; 25-transition zone; 26-diverter plate countersunk through hole; 27-diverter plate threaded hole; 28-diverter plate sealing groove; 29-heat exchange cavity; 201-diverter plate top surface; 202-diverter plate bottom surface.

[0063] 3-cover plate; 32-cover plate cavity; 33-cover plate first screw hole; 34-cover plate second screw hole; 35-cover plate sealing groove; 36-cover plate third threaded hole; 37-cover plate groove; 38-rib plate; 39-ventilation slot; 301-cover plate top surface; 302-cover plate bottom surface; 303-cover plate side surface; 312-working medium flow port.

[0064] 4- Radiator joint; 41- Joint structure; 42- Bottom structure.

[0065] 5- First washer.

[0066] 6-Second washer.

[0067] 7-first gasket; 71-gasket fluid channel; 701-first gasket top surface; 702-first gasket bottom surface.

[0068] 8-second gasket; 81-second gasket through hole; 82-second gasket threaded through hole; 801-second gasket top surface; 802-second gasket bottom surface.

[0069] 9-First screw.

[0070] 10-Second screw.

[0071] 11-Third screw.

[0072] 12-GPU motherboard; 121-motherboard threaded through hole; 122-connection card; 123-peripheral module; 124-GPU core; 1200-motherboard top surface; 1201-motherboard bottom surface.

[0073] 13-base plate; 131-cylindrical countersunk through hole; 1300-top surface of base plate; 1301-bottom surface of base plate.

[0074] 14-Fourth screw.

[0075] 100-Heat exchange chamber.

[0076] 230-shunt cavity.

[0077] 240-Manifold. DETAILED DESCRIPTION

[0078] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0079] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition or explanation in subsequent drawings.

[0080] The following describes some embodiments of the present invention in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0081] In the following embodiments, unless otherwise specified, functional components or structures are conventional components or structures used in the art to achieve corresponding functions.

[0082] Example 1

[0083] like Figures 1-2 20 shows a radiator for a high-power GPU, comprising: a cover plate 3, a diverter plate 2, a heat dissipation cold plate 1, a GPU mainboard 12, a base plate 13 and a radiator connector 4.

[0084] The cover plate 3 and the cold plate 1 together form a heat dissipation space, within which a manifold 2 is located. The GPU core 124 on the top surface 1200 of the GPU motherboard 12 is tightly bonded to the cold plate bottom surface 102 by applying some thermally conductive material. A base plate 13 is located at the bottom of the GPU motherboard 12.

[0085] A pair of working medium flow ports are provided on one side of the cover plate 3 and connected to the radiator joint 4 , serving as the working medium flow inlet and the working medium flow outlet of the radiator respectively.

[0086] like Figures 5-6 As shown, the top surface 201 of the manifold plate is provided with a diverter cavity 21 communicating with the working medium inlet, a collecting cavity 22 communicating with the working medium outlet, and a heat exchange cavity 29 connecting the diverter cavity 21 and the collecting cavity 22. The diverter cavity 21 is screwed to the bottom surface 302 of the cover plate to form a diverter cavity 230, the collecting cavity 22 is screwed to the bottom surface 302 of the cover plate to form a collecting cavity 240, and the heat exchange cavity 29 is screwed to the top surface 101 of the heat dissipation cold plate to form a heat exchange cavity 100.

[0087] A diversion channel 23 with an opening facing the diversion cavity 21 and a collecting channel 24 with an opening facing the collecting cavity 22 are provided in the heat exchange cavity 29. After the cooling medium flows into the diversion cavity 21 through the working medium inlet, it flows into the heat exchange cavity 29 from the diversion channel 23 to exchange heat, then flows into the collecting cavity 22 through the collecting channel 24, and finally flows out through the working medium outlet.

[0088] The cooling medium is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oils, transformer oils or fluorinated liquids.

[0089] like Figures 3-4 As shown, microstructured fins 103 corresponding to the flow-dividing cavity 21 , the heat-exchanging cavity 29 and the flow-collecting cavity 22 and used for enhancing heat exchange are arranged on the heat dissipation cold plate 1 .

[0090] like Figure 1 、 5As shown in Figures 15 to 17, in one embodiment of the present invention, the cover bottom surface 302 is provided with a cover mounting groove 37 for placing the heat dissipation cold plate 1 so that the cover bottom surface 302 and the heat dissipation cold plate bottom surface 102 are in the same plane, and a cover cavity 32 is provided inside the cover mounting groove 37 for supporting the diverter plate 2 and the heat dissipation cold plate 1.

[0091] The cover plate 3 is connected to the manifold plate 2 by screws. The manifold plate 2 is provided with a manifold countersunk through hole 26, which corresponds to the second threaded hole 35 provided on the cover plate 3, and is fixedly connected by a third screw 11. A second gasket 8 is also provided between the manifold plate 2 and the cover plate 3 for sealing.

[0092] The cover plate 3 is connected to the heat dissipation cold plate 1 by means of screws. The bottom surface 302 of the cover plate 3 is provided with a cover plate sealing groove 35 for installing and fixing the first gasket 5. The cover plate 3 and the heat dissipation cold plate 1 are sealed by the first gasket 5; the bottom surface 302 of the cover plate is provided with a cover plate first threaded hole 33, which corresponds to the first countersunk through hole 15 of the heat dissipation cold plate 1. The cover plate 3 and the heat dissipation cold plate 1 are tightly fixed together by the first screw 9.

[0093] The cover plate 3 is connected to the GPU mainboard 12 and the base plate 13 by means of screws. The third threaded hole 36 on the bottom surface 302 of the cover plate corresponds one-to-one with the mainboard threaded through hole 121 and the cylindrical countersunk through hole 132 of the base plate, and is fixed by the fourth screw 14. The third threaded hole 36 of the cover plate and the cylindrical countersunk through hole 132 of the base plate are adapted according to the position of the mainboard threaded through hole 121 corresponding to the graphics card mainboard model.

[0094] A working medium flow port 312 is provided on the side surface 303 of the cover plate for connecting to the radiator connector 4 .

[0095] like Figure 1 、 13 As shown in Figures 14 to 15, in one embodiment of the present invention, the assembly between the manifold 2 and the heat dissipation cold plate 1 is characterized by a first gasket 7 provided between the heat exchange cavity 29 and the heat dissipation cold plate 1 to adjust the assembly gap and ensure structural stability. A manifold sealing groove 28 is provided on the bottom surface 202 of the manifold for mounting and securing a second gasket 6, which is used to achieve sealing. The heat dissipation cold plate 1 is provided with a second countersunk through-hole 16 corresponding to the manifold threaded hole 27 provided on the manifold 2. A second screw 10 is used to secure the manifold 2 to the heat dissipation cold plate 1.

[0096] like Figure 17 As shown, in one embodiment of the present invention, the radiator joint 4 is provided with a joint structure 41 and a bottom structure 42 for realizing pipe connection and joint installation respectively. The radiator joint 4 is installed in the working medium flow port 312 on the side surface 303 of the cover plate 3 and is connected to the cover plate 3 by a threaded manner. The radiator joint 4 is used for the input / output of the cooling medium.

[0097] like Figures 9-10 As shown, in one embodiment of the present invention, the GPU motherboard 12 is provided with a motherboard threaded through-hole 121 and is fixed between the cover plate 3 and the base plate 13 by a fourth screw 14. The motherboard 12 is provided with a connection card 122 for inserting into the graphics card slot of the host to obtain specific signals. The GPU core 124 on the top surface 1200 of the motherboard is tightly bonded to the bottom surface 102 of the heat dissipation cold plate by applying some thermal conductive material. The peripheral module 123 on the top surface 1200 of the motherboard is also tightly bonded to the bottom surface 302 of the cover plate by applying some thermal conductive material. The GPU core 124 and peripheral module 123 are modified according to the model of the graphics card motherboard.

[0098] like Figures 11-12 As shown, in one embodiment of the present invention, a cylindrical countersunk through hole 131 is provided on the top surface 1300 of the base plate, which corresponds one-to-one to the motherboard threaded through hole 121 on the bottom surface 1201 of the motherboard, and is installed and fixed to the GPU motherboard 12 and the cover plate 3 by a fourth screw 14.

[0099] like Figure 18 As shown, in one embodiment of the present invention, the diversion channel 23 is composed of a number of baffles arranged in parallel and spaced apart and connected to the collecting cavity 22, and the space opening formed by two adjacent baffles is directed toward the diversion channel 23; the collecting channel 24 is composed of a number of baffles arranged in parallel and spaced apart and connected to the diversion cavity 21, and the space opening formed by two adjacent baffles is directed toward the collecting channel 24.

[0100] The structure of the baffle includes a multi-segment structure, a tangent structure, a cotangent structure, a sine structure, and a cosine structure.

[0101] Taking the multi-fold structure as an example, the length of the baffle is divided into L1, L2 and L3, where L3 is the side length of the transition zone 25, W1 is 1 / 2 of the width of the opening of the space formed by the two baffles toward the flow channel, W2 is 1 / 2 of the closed width formed by the connection of the two baffles, θ1 and θ2 are the bending angles between the three folds of the baffle, D1 is the width of the baffle, and at least one of L1, L2 and L3 is not zero. If W1 and W2 are equal, the side length L3 of the transition zone 25 is 0, and the flow channel is a uniform rectangular structure; if W1 and W2 are not equal and not zero, L1 and L2 are both 0, and the flow channel is a trapezoidal structure; if W2 is 0, the flow channel is a pointed mouth structure; if W2 is 0, and L1 and L2 are both 0, the flow channel is a triangular structure; if all parameters are not zero, and the angles θ1 and θ2 are right angles, the flow channel is a convex-like structure;

[0102] When the baffle structure is designed as a tangent / cotangent structure, E is the distance from the center line of the baffle (the coordinate axis y in the figure) to the center line of the flow channel, L4 is the total length of the flow channel, A is the amplitude of the tangent / cotangent, and D2 is the width of the baffle.

[0103] When the baffle structure is a sine / cosine structure design, F is defined as the distance from the center line of the baffle (the coordinate axis x-axis in the figure) to the center line of the flow channel, L5 is the total length of the flow channel, B is the amplitude of the sine / cosine, λ is the wavelength of the sine / cosine, and D3 is the baffle width.

[0104] like Figure 19 As shown, in one embodiment of the present invention, the thickness ratio of the fin capillary structure 111 in the microstructure fin 103 is ≥0; when the thickness ratio of the fin capillary structure 111 in the microstructure fin 103 is 0%, the microstructure fin 103 is a completely solid fin; when the thickness ratio of the fin capillary structure 111 in the microstructure fin 103 is 100%, the microstructure fin 103 is composed of a complete porous capillary structure.

[0105] The heat dissipation cold plate 1 is provided with a multi-layer fin bottom surface capillary structure 112 on the side surface where the microstructure fins 103 are provided, and the number of layers of the fin bottom surface capillary structure 112 is ≥0; when the number of layers of the fin bottom surface capillary structure 112 is 0, the heat dissipation cold plate 1 on the side where the microstructure fins 103 are provided is a smooth surface.

[0106] The fin capillary structure 111 and the fin bottom capillary structure 112 are both porous capillary structures, and the porous capillary structure is formed by a method selected from metal powder sintering, metal wire sintering, or a mixed sintering method of metal powder and metal wire.

[0107] The materials of the heat dissipation cold plate 1, the manifold plate 2, the cover plate 3, the radiator joint 4 and the base plate 13 are selected from one or more of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, resin, plastic, ceramic or glass; the first gasket 5 and the second gasket 6 are selected from one or more of rubber, silicone, fluororubber, resin or plastic; the first gasket 7 and the second gasket 8 are selected from one or more of rubber, silicone, fluororubber, resin, plastic, copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, resin, plastic, ceramic or glass.

[0108] The basic application principle of the radiator provided in this embodiment is as follows: the low-temperature cooling medium enters the diverter cavity 21 through the radiator connector 4 on one side, enters the heat exchange cavity 100 along the diverter channel 23, takes away the heat conducted from the high-temperature chip to the heat dissipation cold plate 1, and enters the manifold cavity 22 along the manifold channel 24, and finally is discharged to the external circulation pipeline through the radiator connector 4 on the other side.

[0109] Example 2:

[0110] like Figure 21As shown, this embodiment differs from Example 1 in that the radiator connector 4 is connected to the cover plate 3 by welding, the working fluid flow ports 312 are all through holes, and the radiator connector 4 is selected from one of a standard threaded quick-connect connector, a pagoda connector, a quick water-stop connector, and a ferrule connector. This is done so that welding can achieve a permanent seal, eliminating the risk of leakage, and forming an integrated structure that can withstand higher mechanical stresses, thereby improving the overall strength and long-term reliability of the cooling system.

[0111] The above description of the embodiments is intended to facilitate understanding and use of the invention by those skilled in the art. It will be apparent that those skilled in the art can readily make various modifications to these embodiments and apply the general principles described herein to other embodiments without requiring inventive effort. Therefore, the present invention is not limited to the above-described embodiments. Improvements and modifications made by those skilled in the art based on the disclosure of the present invention, without departing from the scope of the present invention, should be within the scope of protection of the present invention.

Claims

1. A heat sink for a high-power GPU, characterized in that: include: Cover plate (3), diverter plate (2), heat dissipation cold plate (1) and GPU main board (12), The cover plate (3) and the heat dissipation cold plate (1) together form a heat dissipation space, and a diverter plate (2) is provided in the heat dissipation space; A pair of working medium flow ports (312) are provided on one side of the cover plate (3), serving as a working medium flow inlet and a working medium flow outlet of the radiator respectively; The diverter plate (2) is provided with a diverter cavity (21) communicating with the working medium flow inlet, a collecting cavity (22) communicating with the working medium flow outlet, and a heat exchange cavity (29) communicating with the diverter cavity (21) and the collecting cavity (22). The heat exchange cavity (29) is provided with a diverter channel (23) with an opening facing the diverter cavity (21) and a collecting channel (24) with an opening facing the collecting cavity (22). After the working medium flows into the diverter cavity (21) through the working medium flow inlet, it flows from the diverter channel (23) into the heat exchange cavity (29) to exchange heat, then flows into the collecting cavity (22) through the collecting channel (24), and finally flows out through the working medium flow outlet. The heat dissipation cold plate (1) is provided with microstructured fins (103) corresponding to the diversion cavity (21), the heat exchange cavity (29) and the collecting cavity (22) and used to enhance heat exchange. The GPU mainboard (12) is provided with a GPU core (124) corresponding to the microstructure ribs (103), and the GPU mainboard (12) and the heat dissipation cold plate (1) are tightly fitted by applying a heat conductive material.

2. The heat sink for high-power GPU according to claim 1, characterized in that: The diversion channel (23) is composed of a plurality of baffles arranged in parallel and spaced apart and connected to the collecting cavity (22), and the space opening formed by two adjacent baffles is oriented toward the diversion channel (23); The collecting channel (24) is composed of a plurality of baffles arranged in parallel and spaced apart and connected to the diversion cavity (21), and the opening direction of the space formed by two adjacent baffles is toward the collecting channel (24).

3. The heat sink for high-power GPU according to claim 2, characterized in that: The structure of the baffle includes a multi-segment structure, a tangent structure, a cotangent structure, a sine structure, and a cosine structure; When the baffle is a multi-segment structure, the baffle includes three fold segments, and the lengths of each fold segment are L1, L3 and L2, respectively, and at least one of L1, L2 and L3 is not zero. 1 / 2 of the width of the flow channel opening is defined as W1, and 1 / 2 of the width of the closed end of the flow channel is defined as W2. The angles between two adjacent fold segments are θ1 and θ2, respectively. When W1 and W2 are equal, L3 is 0, and the flow channel is a uniform rectangular structure; When W1 and W2 are not equal and non-zero, L1 and L2 are both 0, and the flow channel is a trapezoidal structure; When W2 is 0, the flow channel is a pointed mouth structure; When W2 is 0, and L1 and L2 are both 0, the flow channel is a triangular structure; When all parameters are non-zero and the angles θ1 and θ2 are right angles, the flow channel is a quasi-convex structure; When the strip structure is a tangent structure or a cotangent structure, the distance from the center line of the strip to the center line of the flow channel is defined as E, the total length of the flow channel is L4, and the amplitude of the tangent or cotangent is A; When the strip structure is a sine structure or a cosine structure, the distance from the strip centerline to the flow channel centerline is defined as F, the total length of the flow channel is L5, the amplitude of the sine / cosine is B, and the wavelength of the sine or cosine is λ.

4. The heat sink for high-power GPU according to claim 1, characterized in that: A second gasket (8) for sealing is also provided between the diverter plate (2) and the cover plate (3).

5. The heat sink for high-power GPU according to claim 1, characterized in that: A first gasket (7) for adjusting the assembly gap is also provided between the heat exchange cavity (29) of the diverter plate (2) and the heat dissipation cold plate (1).

6. The heat sink for a high-power GPU according to claim 1, wherein: The thickness ratio of the fin capillary structure (111) in the microstructured fin (103) is ≥0; When the thickness of the fin capillary structure (111) in the microstructured fin (103) accounts for 0%, the microstructured fin (103) is a completely solid fin; When the thickness of the fin capillary structure (111) in the microstructured fin (103) accounts for 100%, the microstructured fin (103) is composed of a complete porous capillary structure.

7. The heat sink for a high-power GPU according to claim 1, wherein: The heat dissipation cold plate (1) is provided with a multi-layer fin bottom surface capillary structure (112) on a side surface provided with the microstructured fins (103), and the number of layers of the fin bottom surface capillary structure (112) is ≥0; When the number of layers of the capillary structure (112) on the bottom surface of the fin is 0, the surface of the heat dissipation cold plate (1) on the side provided with the microstructure fins (103) is a smooth surface.

8. The heat sink for a high-power GPU according to claim 1, wherein: The heat dissipation cold plate (1) and the cover plate (3) are connected by threaded connection, snap connection, riveting or welding.

9. The heat sink for a high-power GPU according to claim 1, wherein: The radiator further comprises a pair of radiator joints (4), which are respectively connected to a pair of working medium flow ports (312).

10. The heat sink for a high-power GPU according to claim 1, wherein: A base plate (13) is also provided at the bottom of the GPU mainboard (12).

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