Novel fusing structure
Through the cooperation of U-shaped conductive path and elastic deformation, the problem of unstable conductivity of traditional thermal fuses is solved, and the conductive stability and reliability are improved, which is a new fuse structure design suitable for high-current application scenarios.
Patent Information
- Application Number
- CN202510738835.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-04
- Publication Date
- 2025-09-02
AI Technical Summary
The conductivity stability of traditional thermal fuses is greatly affected by environmental factors, especially the conductivity of organic temperature-sensitive variants is unstable, resulting in poor conductivity, and the linear double-sided conductivity method is not applicable in some scenarios.
The U-shaped conductive path design is adopted, and the first conductive medium and the second conductive medium are located on the same side. Through the cooperation of the first and second conductive medium and the conductive communication sheet, the first and second elastic deformation variants and the temperature-sensitive deformation variant are combined to achieve a reliable fuse function, and the structure is compact and suitable for miniaturization design.
It improves the conductivity stability, reduces the impact of current heating factors on the temperature-sensitive deformation, is suitable for large current application scenarios, enhances the precise control of the temperature-sensitive deformation, and improves process stability and reliability.
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Figure CN120581402A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a thermal fuse, in particular to a novel fuse structure. Background Art
[0002] Thermal links, also known as temperature fuses, are disposable over-temperature protection devices typically installed on heating components in electrical and electronic devices. They sense overheating during abnormal product operation and shut down the circuit to prevent fires. They are widely used for thermal protection in similar components such as home appliances, automobiles, and smart bathroom fixtures. When the product's internal current is overloaded, the circuit is abnormal, or the ambient temperature rises to a certain level, the thermal link's inherent structure causes it to melt, automatically interrupting the current flow and preventing overheating that could cause damage or fire.
[0003] Traditional thermal fuses use a linear double-sided conductive structure. In this structure, the circuit must first pass through a spring, a copper sheet, a spring, a copper sheet, and an organic temperature sensor before it can be conducted from the first line (metal pin I) to the second line (metal pin II). For example, the thermal fuses disclosed in patents with publication numbers CN105489455B and CN118248504A are of this type.
[0004] The conductivity stability of organic temperature-sensing deformable bodies is affected by many factors, such as the properties of the material itself, the temperature, the environment, the application scenario, etc. The conductivity stability of organic temperature-sensing deformable bodies is usually poor and is easily affected by environmental factors such as temperature and humidity. Although they can perform well in the short term or in a controlled environment, they still lack long-term stability. Therefore, as one of the conductive objects, the organic temperature-sensing deformable body causes poor conductivity of the thermal fuse during normal operation.
[0005] In addition, in some usage scenarios, the straight-line double-sided conductive method is not applicable. At the same time, due to the need for technical improvement, we have developed a new technical solution. Summary of the Invention
[0006] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a new fuse structure, the technical solution of which includes:
[0007] A new type of fuse structure includes a conductive connecting piece, a first conductive medium, a second conductive medium, a temperature-sensitive deformable body and a first elastic deformable body, wherein the conductive connecting piece is defined with a forward direction and a reverse direction, the first conductive medium and the second conductive medium are located on the forward side of the conductive connecting piece, and the first elastic deformable body and the temperature-sensitive deformable body are located on the reverse side of the conductive connecting piece; the first elastic deformable body is located between the conductive connecting piece and the temperature-sensitive deformable body; the temperature-sensitive deformable body has a first state or a second state, when the temperature-sensitive deformable body is in the first state, the two ends of the first elastic deformable body respectively press against the temperature-sensitive deformable body and the conductive connecting piece, and the conductive connecting piece contacts the first conductive medium and the second conductive medium under the elastic force of the first elastic deformable body to conduct electricity, and when the temperature-sensitive deformable body is in the second state, the first elastic deformable body cannot drive the conductive connecting piece to contact the first conductive medium and the second conductive medium, and the conductive connecting piece is detached from any one of the first conductive medium and the second conductive medium, or is detached from both the first conductive medium and the second conductive medium.
[0008] According to a new type of fuse structure in an embodiment of the present invention, a limiting body is defined on the positive side of the conductive connecting piece, and the limiting body is connected and fixed to the first conductive medium and the second conductive medium; a second elastic deformable body is provided between the limiting body and the conductive connecting piece, and the elastic force of the second elastic deformable body is smaller than the elastic force of the first elastic deformable body, and the two ends of the second elastic deformable body are respectively pressed against the limiting body and the conductive connecting piece.
[0009] A novel fuse structure according to an embodiment of the present invention includes a conductive medium fixing seat, wherein the first conductive medium and the second conductive medium are respectively arranged at two ends of the conductive medium fixing seat, and the conductive medium fixing seat serves as a limiter.
[0010] A novel fuse structure according to an embodiment of the present invention includes a connecting piece fixing seat, on which the conductive connecting piece is arranged.
[0011] According to a novel fuse structure of an embodiment of the present invention, a gasket is provided between the first elastic deformer and the temperature-sensitive deformer.
[0012] According to a novel fuse structure in an embodiment of the present invention, a mounting groove for mounting the first elastic deformer is provided on the gasket.
[0013] According to a novel fuse structure of an embodiment of the present invention, the temperature-sensitive deformation body is an organic temperature-sensitive body.
[0014] According to a novel fuse structure of an embodiment of the present invention, the temperature-sensitive deformation body is a shape memory alloy.
[0015] According to a novel fuse structure of an embodiment of the present invention, the temperature-sensitive deformation body is a bimetallic temperature sensor.
[0016] According to a novel fuse structure according to an embodiment of the present invention, the first elastic deformer and the second elastic deformer are both springs.
[0017] Compared with the prior art, the present invention has the following beneficial effects:
[0018] In the present invention application, the first conductive medium and the second conductive medium are located at the two ends of the same side of the conductive connecting piece. The current flows into the first conductive medium, passes through the conductive connecting piece, and then flows out of the second conductive medium, forming a U-shaped conductive path, realizing U-shaped conduction on the same side; through the cooperation of the first elastic deformer and the temperature-sensitive deformer, a reliable fusing function is achieved, with a simple structure and rapid response; its compact structure arranges the first conductive medium and the second conductive medium on the same side, saving space and being suitable for miniaturized design; the technical solution of the present invention improves the conductive stability and greatly reduces the influence of the heat factor on the temperature-sensitive deformer when the current passes through the conductor. It is suitable for large current application scenarios, further strengthens the precise control of the temperature-sensitive deformer, and compared with the traditional fusing structure, the technical solution of the present invention has process stability, high quality and reliability. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:
[0020] Figure 1 Schematic diagram of some embodiments of the present invention Figure 1 ;
[0021] Figure 2 Schematic diagram of some embodiments of the present invention Figure 2 .
[0022] Description of main component symbols:
[0023] 10. Conductive connecting piece; 20. First conductive medium; 30. Second conductive medium; 40. Temperature-sensing deformer; 50. First elastic deformer; 60. Second elastic deformer; 70. Conductive medium fixing seat; 71. Limiting groove; 80. Conductive wire; 90. Connecting piece fixing seat; 100. Gasket; 101. Mounting groove. DETAILED DESCRIPTION
[0024] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it should not be understood as a limitation on the scope of protection of the present invention.
[0025] In the description of this invention, "above," "below," and "within" are understood to be exclusive of the number indicated. The terms "first" and "second" are used solely to distinguish technical features and are not to be construed as indicating or implying relative importance, or as implicitly specifying the number or order of the technical features indicated.
[0026] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.
[0027] In the present invention, unless otherwise expressly defined, terms such as "disposed," "installed," and "connected" should be interpreted broadly. For example, they may refer to direct connection or indirect connection through an intermediate medium; fixed connection or detachable connection or integral molding; mechanical connection; and internal communication between two components or interaction between two components. Those skilled in the art can reasonably determine the specific meanings of these terms in the present invention based on the specific content of the technical solution.
[0028] Example
[0029] The present invention provides a new type of fuse structure, such as Figure 1As shown, it includes a conductive connecting piece 10, a first conductive medium 20, a second conductive medium 30, a temperature-sensitive deformable body 40 and a first elastic deformable body 50, wherein the temperature-sensitive deformable body 40 is an organic temperature sensor; the conductive connecting piece 10 is defined as a positive direction and a negative direction, the first conductive medium 20 and the second conductive medium 30 are located on the positive side of the conductive connecting piece 10, and are respectively located at the two ends of the conductive connecting piece 10, the first elastic deformable body 50 and the organic temperature sensor are located on the negative side of the conductive connecting piece 10; the first elastic deformable body 50 is located between the conductive connecting piece 10 and the organic temperature sensor; the organic temperature sensor has a first state or a second state, and the organic temperature sensor is in the first state In the first state, the two ends of the first elastic deformer 50 are respectively pressed against the organic temperature sensor and the conductive connecting piece 10, and the two ends of the conductive connecting piece 10 are respectively in contact with the first conductive medium 20 and the second conductive medium 30 under the elastic force of the first elastic deformer 50 for conductivity. When the organic temperature sensor is in the second state, the first elastic deformer 500 cannot drive the conductive connecting piece 10 to contact the first conductive medium 20 and the second conductive medium 30, and one end of the conductive connecting piece 10 is detached from any one of the first conductive medium 20 and the second conductive medium 30, or both ends of the conductive connecting piece 10 are detached from the first conductive medium 20 and the second conductive medium 30 (detached from both the first conductive medium 20 and the second conductive medium 30).
[0030] Under normal use, that is, when the organic temperature sensor is in the first state, the organic temperature sensor supports the first elastic deformer 50, the first elastic deformer 50 presses against the conductive connecting piece 10, and the conductive connecting piece 10 contacts the first conductive medium 20 and the second conductive medium 30 to conduct electricity, thereby realizing a normal circuit path; when the current in the circuit exceeds the specified value and the ambient temperature reaches or exceeds the melting point of the organic temperature sensor, the organic temperature sensor is in the second state, and the organic temperature sensor changes from solid to liquid. The compressed first elastic deformer 50 loses support and changes from the compressed state to the free length state, and cannot drive the conductive connecting piece 10 to adhere to and contact the first conductive medium 20 and the second conductive medium 30. At this time, one end of the conductive connecting piece 10 is separated from the first conductive medium 20 or the second conductive medium 30, or both ends of the conductive connecting piece 10 are separated from the first conductive medium 20 and the second conductive medium 30, thereby cutting off the current conduction circuit.
[0031] In some embodiments of the present application, the temperature-sensing deformable body 40 is a bimetallic temperature sensor or a shape memory alloy. In this embodiment, when the current in the circuit exceeds a specified value and the ambient temperature reaches or exceeds the deformation temperature of the temperature-sensing deformable body 40, the temperature-sensing deformable body 40 deforms and collapses, and the compressed first elastic deformable body 50 loses support and changes from a compressed state to a free length state, and is unable to drive the conductive connecting piece 10 to adhere to and contact the first conductive medium 20 and the second conductive medium 30. At this time, one end of the conductive connecting piece 10 is separated from the first conductive medium 20 or the second conductive medium 30, or both ends of the conductive connecting piece 10 are separated from the first conductive medium 20 and the second conductive medium 30, thereby cutting off the current conduction circuit; when the temperature of the temperature-sensing deformable body 40 is lower than its deformation temperature, the temperature-sensing deformable body 40 recovers its shape and again supports the first elastic deformable body 50 to drive the conductive connecting piece 10 to adhere to and contact the first conductive medium 20 and the second conductive medium 30. In this case, the circuit is reconnected.
[0032] In the present application, the first conductive medium 20 and the second conductive medium 30 are located at the two ends of the same side of the conductive connecting piece 10. The current flows into the first conductive medium 20, passes through the conductive connecting piece 10, and then flows out of the second conductive medium 30, forming a U-shaped conductive path, realizing U-shaped conduction on the same side; through the cooperation of the first elastic deformer 50 and the temperature-sensitive deformer 40, a reliable fusing function is achieved, with a simple structure and rapid response; its compact structure arranges the first conductive medium 20 and the second conductive medium 30 on the same side, saving space and being suitable for miniaturized design; the technical solution of the present invention improves the conductive stability and greatly reduces the influence of the heat factor on the temperature-sensitive deformer 40 when the current passes through the conductor. It is suitable for high-current application scenarios and further strengthens the precise control of the temperature-sensitive deformer 40. Compared with the traditional fusing structure, the technical solution of the present invention has high-quality and reliable process stability, low processing technology requirements, and improved production efficiency.
[0033] Further, in some embodiments of the present invention, Figure 1 As shown, a limiting body is defined on the positive side of the conductive connecting piece 10, and the limiting body is connected and fixed to the first conductive medium 20 and the second conductive medium 30; a second elastic deformable body 60 is provided between the limiting body and the conductive connecting piece 10, and the elastic force of the second elastic deformable body 60 is less than the elastic force of the first elastic deformable body 50, and the two ends of the second elastic deformable body 60 are respectively pressed against the limiting body and the conductive connecting piece 10.
[0034] In a normal state, that is, when the organic temperature sensor 40 is in the first state, the two ends of the first elastic deformer 50 are respectively pressed against the organic temperature sensor 40 and the conductive connecting piece 10. Under the elastic force of the first elastic deformer 50, the two ends of the conductive connecting piece 10 are respectively in contact with the first conductive medium 20 and the second conductive medium 30, and the circuit is conductive. The elastic force of the second elastic deformer 60 is relatively small and does not affect the elastic pressing of the first elastic deformer 50 against the conductive connecting piece 10. When the current in the circuit exceeds the specified value and the ambient temperature reaches or exceeds the melting point of the organic temperature sensor 40, the organic temperature sensor 40 is in the second state. The organic temperature sensor 40 changes from solid to liquid, the first elastic deformer 50 loses its support, and its force on the conductive connecting piece 10 is less than the force of the second elastic deformer 60 on the conductive connecting piece 10. The second elastic deformer 60 pushes the conductive connecting piece 10 toward the first elastic deformer 50, so that one end or both ends of the conductive connecting piece 10 are separated from the first conductive medium 20 and the second conductive medium 30, and the circuit is disconnected. The limiting body is used to fix the position of the first conductive medium 20 and the second conductive medium 30, ensuring the contact stability between the conductive connecting piece 10 and the conductive medium. The introduction of the limiting body and the second elastic deformation body 60 improves the contact stability between the conductive connecting piece 10 and the conductive medium and reduces the risk of poor contact. Specifically, the limiting body is a conductive medium fixing seat 70. The first conductive medium 20 and the second conductive medium 30 are respectively provided at the two ends of the conductive medium fixing seat 70. The conductive medium fixing seat 70 is provided with a limiting groove 71 for fixing the first conductive medium 20 and the second conductive medium 30. When in use, as shown in FIG. Figure 2 As shown, one end of the conductive wire 80 is connected to the first conductive medium 20 / the second conductive medium 30 respectively, and the other end passes through the conductive medium fixing seat 70 and is led out to the outside.
[0035] Further, in some embodiments of the present invention, Figure 1 、 2 As shown, it includes a connecting piece fixing seat 90, and the conductive connecting piece 10 is set on the connecting piece fixing seat 90. The connecting piece fixing seat 90 is mainly used to assist in supporting the conductive connecting piece 10 to prevent it from being deformed by excessive force, and also facilitates the installation of the conductive connecting piece 10. In addition, with the isolation of the connecting piece fixing seat, the influence of current heat on the temperature-sensitive deformation body is greatly reduced.
[0036] Further, in some embodiments of the present invention, Figure 1 、 2As shown, a gasket 100 is disposed between the first elastic deformer 50 and the temperature-sensing deformer 40. The gasket 100 not only serves as an isolation barrier, further protecting the temperature-sensing deformer 40 from external influences, but also serves to mount the first elastic deformer 50. A mounting groove 101 for mounting the first elastic deformer 50 is provided on the gasket 100. Because the mounting groove 101 serves as the gasket 100, in some embodiments, the gasket 100 is omitted and the mounting groove 101 is provided directly to provide isolation. Both the gasket 100 and the mounting groove 101 function to prevent the first elastic deformer 50 from directly acting on the organic temperature sensor, potentially damaging or crushing it, when the temperature-sensing deformer 40 is an organic material.
[0037] Furthermore, in some embodiments of the present invention, both the first elastic deformer and the second elastic deformer are springs.
[0038] Of course, the present invention is not limited to the above-mentioned embodiments. Those skilled in the art may make equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications and substitutions are all included in the scope defined by the claims of this application.
Claims
1. A new type of fuse structure, characterized in that: The invention comprises a conductive connecting piece (10), a first conductive medium (20), a second conductive medium (30), a temperature-sensitive deformable body (40) and a first elastic deformable body (50); the conductive connecting piece (10) is defined as having a positive direction and a negative direction, the first conductive medium (20) and the second conductive medium (30) are located on the positive side of the conductive connecting piece (10), the first elastic deformable body (50) and the temperature-sensitive deformable body (40) are located on the negative side of the conductive connecting piece (10); the first elastic deformable body (50) is located between the conductive connecting piece (10) and the temperature-sensitive deformable body (40); the temperature-sensitive deformable body (40) has a first state or a second state, and the temperature-sensitive deformable body (40) When in the first state, the two ends of the first elastic deformer (50) respectively press against the temperature-sensing deformer (40) and the conductive connecting piece (10), and the conductive connecting piece (10) contacts the first conductive medium (20) and the second conductive medium (30) under the elastic force of the first elastic deformer (50) to conduct electricity. When the temperature-sensing deformer (40) is in the second state, the first elastic deformer (50) cannot drive the conductive connecting piece (10) to contact the first conductive medium (20) and the second conductive medium (30), and the conductive connecting piece (10) is separated from any one of the first conductive medium (20) and the second conductive medium (30), or is separated from both the first conductive medium (20) and the second conductive medium (30).
2. A novel fuse structure according to claim 1, characterized in that: A limiting body is defined on the positive side of the conductive connecting piece (10), and the limiting body is connected and fixed to the first conductive medium (20) and the second conductive medium (30); a second elastic deformable body (60) is provided between the limiting body and the conductive connecting piece (10), the elastic force of the second elastic deformable body (60) is smaller than the elastic force of the first elastic deformable body (50), and the two ends of the second elastic deformable body (60) respectively press against the limiting body and the conductive connecting piece (10).
3. A novel fuse structure according to claim 2, characterized in that: The conductive medium fixing seat (70) is included. The first conductive medium (20) and the second conductive medium (30) are respectively arranged at two ends of the conductive medium fixing seat (70). The conductive medium fixing seat (70) is a limiting body.
4. A novel fuse structure according to claim 2, characterized in that: It comprises a connecting piece fixing seat (90), and the conductive connecting piece (10) is arranged on the connecting piece fixing seat (90).
5. A novel fuse structure according to claim 1, characterized in that: A gasket (100) is provided between the first elastic deformation body (50) and the temperature-sensitive deformation body (40).
6. A novel fuse structure according to claim 5, characterized in that: The gasket (100) is provided with a mounting groove (101) for mounting the first elastic deformer (50).
7. A novel fuse structure according to claim 1, characterized in that: The temperature-sensing deformation body (40) is an organic temperature-sensing body.
8. A novel fuse structure according to claim 1, characterized in that: The temperature-sensitive deformation body (40) is a shape memory alloy.
9. A novel fuse structure according to claim 1, characterized in that: The temperature-sensing deformation body (40) is a bimetallic temperature-sensing body.
10. A novel fuse structure according to claim 1, characterized in that: The first elastic deformer and the second elastic deformer are both springs.
Citation Information
Patent Citations
A thermal fuse with double insulators
CN105489455B
Insulation wire rod type thermal fuse-link
CN118248504A