High-current crimped and packaged alternating current contactor

Abstract

The invention relates to the technical field of high-current crimping-packaged alternating current contactors, and discloses a high-current crimping-packaged alternating current contactor, which comprises an elastic pressing plate, and is characterized in that a chip, a conductive cathode, a conductive anode, a conductive pressing block, a high-thermal-conductivity ceramic substrate and a bottom plate are pressed into a whole by the elastic pressing plate through hexagon socket screws for heat dissipation; the chip is connected with the conductive cathode and the conductive anode in an anti-parallel manner through a conductive pressing block; the AC contactor can be applied to large-scale crane control systems of steel mills, wharfs, freight stations and the like, and can completely replace an original AC contactor, a welded contactless switch and various AC switches with the through-current capability of 50A-3000A; comprising a radiator of the product, so that heat accumulation can be avoided during long-time work, a contactless alternating current contactor cannot be burnt, and the device can be compact, small in occupied space and simple in trigger circuit according to different occasions, and is convenient to install in a switch cabinet body.

Description

Technical Field

[0001] The invention relates to the technical field of high-current press-fit packaged AC contactors, in particular to a high-current press-fit packaged AC contactor. Background Art

[0002] In the advancement of modern industrial automation, contactless contactors have gained widespread application in power control due to their advantages, including no mechanical contact wear, fast response, and high control precision. However, current mainstream contactless contactors generally utilize soldered semiconductor chips, which presents significant technical bottlenecks. First, due to limitations in soldering processes and chip layout, their current capacity is generally limited to below 500A, making them unable to meet the high-power demands of high-load operating environments such as port loading and unloading terminals and storage and hoisting warehouses. Second, under full-load operation, the high contact resistance of soldered semiconductor chips easily generates significant heat. The solder material is prone to debonding under sustained high temperatures, which can lead to contactor burnout, severely impacting equipment stability and service life, increasing maintenance costs and downtime risks. Furthermore, in specialized environments where contactors are frequently used, such as port loading and unloading terminals and storage and hoisting warehouses, discrete devices are still commonly used as pilot switches. These discrete devices are not only bulky and have low integration density, but also suffer from poor contact and reliability issues, making them difficult to adapt to high-frequency and high-intensity operations and unable to meet the modern industrial demand for efficient and stable power control. Summary of the Invention

[0003] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a high-current crimped packaged AC contactor.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: an AC contactor with a high-current press-fit package, comprising a spring-loaded plate, which presses a chip, a conductive cathode, a conductive anode, a conductive voltage block, a high thermal conductivity ceramic substrate, and a bottom plate into one piece via hexagon socket bolts for heat dissipation, wherein the chip is connected to the conductive cathode and the conductive anode in anti-parallel via the conductive voltage block.

[0005] As a further description of the above technical solution:

[0006] A shell 1 is provided above the base plate, a high thermal conductivity ceramic substrate is provided in the shell 1, the high thermal conductivity ceramic substrate is provided above the base plate, a conductive anode is provided above the high thermal conductivity ceramic substrate, a chip is provided above the conductive anode, a conductive voltage block is provided above the chip, and a conductive cathode is provided above the conductive voltage block.

[0007] As a further description of the above technical solution:

[0008] A silicone integrated gate device body is arranged above the conductive cathode, an insulating gasket is arranged above the silicone integrated gate device body, a disc spring is arranged above the insulating gasket, a spring plate is arranged above the disc spring, a shell 2 is arranged above the spring plate and the shell 1, and a terminal is arranged above the shell 2.

[0009] As a further description of the above technical solution:

[0010] A chip positioning ring is provided between the insulating gasket and the disc spring, and the chip positioning ring limits the position of the chip.

[0011] As a further description of the above technical solution:

[0012] The novel high-power contactless AC switch is internally triggered by a control chip through a silicone integrated gate device body. The silicone integrated gate device body can control each of the six chips individually, or each group can be independently triggered and controlled.

[0013] As a further description of the above technical solution:

[0014] The internal control line of the novel high-power contactless AC switch is welded with a socket and controlled through a terminal to prevent the chip from falling off due to high temperature. The external control circuit of the novel high-power contactless AC switch can be directly connected to the intelligent trigger board.

[0015] As a further description of the above technical solution:

[0016] The four corners of the spring pressure plate and the top of the bottom plate are penetrated and threadedly connected with hexagon socket bolts.

[0017] The present invention has the following beneficial effects:

[0018] 1. The new high-power contactless AC switch is a reliable and high-quality chip press-connected together, press-mounted to a copper base plate or directly assembled to a heat sink for heat dissipation; the semiconductor chip control in the new high-power contactless AC switch can control each of the six chips individually, or each group can be independently triggered and controlled.

[0019] 2. The press-fit structure can make this product have a greater current capacity and will not cause the problem of chip falling off due to high temperature like the soldering type; the external control circuit can be directly connected to the intelligent trigger board, and the trigger signal voltage range is VGT1.2v-6v, which can be triggered. At the same time, the high trigger current chip IGT100mA-500mA is selected to improve its anti-interference ability. If TVS and varistor protection are installed inside, it can resist lightning, or false triggering and breakdown accidents caused by equipment leakage when used in outdoor equipment, while eliminating inductive loads. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1This is a schematic diagram of the overall structure of an AC contactor with a high-current crimp package proposed by the present invention.

[0021] Legend:

[0022] 1. Base plate; 2. Housing 1; 3. High thermal conductivity ceramic substrate; 4. Conductive anode; 5. Chip; 6. Conductive voltage block; 7. Conductive cathode; 8. Silicone integrated gate device body; 9. Insulating gasket; 10. Chip positioning ring; 11. Disc spring; 12. Spring plate; 13. Hexagon socket bolt; 14. Housing 2; 15. Terminal. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] Example 1:

[0025] like Figure 1 As shown, this embodiment provides an AC contactor with a high-current press-fit package, including a spring pressure plate 12. The spring pressure plate 12 presses the chip 5, the conductive cathode 7, the conductive anode 4, the conductive voltage block 6, the high thermal conductivity ceramic substrate 3 and the bottom plate 1 together through the hexagon socket bolts 13 for heat dissipation. The chip 5 is connected to the conductive cathode 7 and the conductive anode 4 in an anti-parallel manner through the conductive voltage block 6.

[0026] In this embodiment, a spring-loaded plate 12 press-fits the base plate 1, high-thermal-conductivity ceramic substrate 3, conductive anode 4, chip 5, conductive voltage block 6, and conductive cathode 7 together using hexagon socket bolts 13, utilizing a vertical structure to dissipate heat. The chip 5 is connected in anti-parallel with the conductive anode 4 and cathode 7 via the conductive voltage block 6, enabling bidirectional current conduction. The press-fit structure reduces contact and thermal resistance, and the anti-parallel arrangement enables the module to handle AC current, making it suitable for high-current scenarios.

[0027] Specifically, a shell 2 is provided above the base plate 1, a high thermal conductivity ceramic substrate 3 is provided in the shell 2, the high thermal conductivity ceramic substrate 3 is provided above the base plate 1, a conductive anode 4 is provided above the high thermal conductivity ceramic substrate 3, a chip 5 is provided above the conductive anode 4, a conductive voltage block 6 is provided above the chip 5, and a conductive cathode 7 is provided above the conductive voltage block 6.

[0028] In this embodiment, the base plate 1 supports the high-thermal-conductivity ceramic substrate 3, which isolates electricity and conducts heat. The conductive anode 4 and the conductive cathode 7 achieve electrical energy conversion through the chip 5, and the conductive voltage block 6 ensures good contact between the chip 5 and the electrodes. The high-thermal-conductivity ceramic substrate 3 quickly conducts heat from the chip 5, reducing the junction temperature and extending the service life of the module.

[0029] Specifically, a silicone integrated gate device body 8 is arranged above the conductive cathode 7, an insulating gasket 9 is arranged above the silicone integrated gate device body 8, a disc spring 11 is arranged above the insulating gasket 9, a spring plate 12 is arranged above the disc spring 11, a shell 2 14 is arranged above the spring plate 12 and the shell 1 2, and a terminal 15 is arranged above the shell 2 14.

[0030] As a preferred embodiment, the silicone integrated gate device body 8 controls the triggering of the chip 5, the insulating gasket 9 isolates the electrical, the disc spring 11 compensates for thermal expansion pressure, the spring plate 12 evenly distributes pressure, the shell 1 2 and the shell 2 14 protect the internal components, the terminal 15 connects to the external circuit, the disc spring 11 maintains stable pressure, the silicone integrated gate device body 8 is resistant to aging, and the terminal 15 welding structure ensures reliable connection under high temperature.

[0031] Specifically, a chip positioning ring 10 is provided between the insulating gasket 9 and the disc spring 11 , and the chip positioning ring 10 limits the position of the chip 5 .

[0032] It should be noted that the chip positioning ring 10 ensures the accurate position of the chip 5 during press-fitting and thermal cycling through mechanical limiting, reduces position deviation of the chip 5, avoids local overheating, and improves module reliability.

[0033] Specifically, the new high-power contactless AC switch is internally triggered by the control chip 5 through the silicone integrated gate device body 8. The silicone integrated gate device body 8 can control each of the six chips individually, or each group can be independently triggered and controlled.

[0034] As a preferred embodiment, the silicone integrated gate device body 8 integrates an independent trigger circuit, which can control the chip 5 individually or in groups, realize synchronous triggering of multiple chips 5, support high-frequency switching, and is suitable for AC power transmission systems.

[0035] Example 2:

[0036] Specifically, the internal control line of the new high-power contactless AC switch is welded with a socket and controlled through terminal 15 to prevent the chip 5 from falling off due to high temperature. The external control circuit of the new high-power contactless AC switch can be directly connected to the intelligent trigger board.

[0037] It should be noted that the internal control line is welded to terminal 15 through a socket. All internal control lines are welded with a socket. Finally, terminal 15 receives the signal control in the overall control program to perform each disconnection and operation, thereby achieving a highly efficient, safe, practical, fatigue-resistant and anti-attenuation operating device. Terminal 15 can be directly connected to the intelligent trigger board to transmit signals. The solder joint is reliable at high temperatures, the intelligent trigger board has an integrated protection circuit, and responds quickly.

[0038] Specifically, hexagon socket bolts 13 are passed through the four corners of the spring plate 12 and the top of the bottom plate 1 and are threadedly connected.

[0039] In this embodiment, the hexagon socket bolts are tightened diagonally to generate uniform surface pressure on the spring pressure plate, ensuring uniform pressure distribution, ensuring consistent contact resistance in various areas of the chip, and ensuring good current sharing performance of the module.

[0040] When in use, the AC contactor with high-current crimping package presses the chip 5, conductive cathode 7, conductive anode 4 and other components into one through the spring pressure plate 12 and the hexagon socket bolt 13, and uses the vertical structure to dissipate heat. The chip 5 is connected in anti-parallel to achieve bidirectional current conduction; the internal silicone integrated gate device body 8 controls the chip 5 to be triggered, which can be controlled individually or in groups. The internal control line is connected to the intelligent trigger board through the terminal 15 through the socket welding to transmit the signal, the disc spring 11 maintains stable pressure, and the chip positioning ring 10 ensures the accurate position of the chip 5, thereby achieving efficient and stable power control.

[0041] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high current crimp packaged AC contactor, characterized by: The invention comprises a spring-pressing plate (12), wherein the spring-pressing plate (12) presses a chip (5), a conductive cathode (7), a conductive anode (4), a conductive voltage block (6), a high thermal conductivity ceramic substrate (3) and a bottom plate (1) together through a hexagon socket bolt (13) for heat dissipation, and the chip (5) is connected to the conductive cathode (7) and the conductive anode (4) in an anti-parallel manner through the conductive voltage block (6).

2. The AC contactor with a high current crimp package according to claim 1, characterized in that: A shell (2) is provided above the base plate (1), a high thermal conductivity ceramic substrate (3) is provided in the shell (2), the high thermal conductivity ceramic substrate (3) is provided above the base plate (1), a conductive anode (4) is provided above the high thermal conductivity ceramic substrate (3), a chip (5) is provided above the conductive anode (4), a conductive voltage block (6) is provided above the chip (5), and a conductive cathode (7) is provided above the conductive voltage block (6).

3. The AC contactor with a high current crimp package according to claim 2, characterized in that: A silicone integrated gate device body (8) is provided above the conductive cathode (7), an insulating gasket (9) is provided above the silicone integrated gate device body (8), a disc spring (11) is provided above the insulating gasket (9), a spring plate (12) is provided above the disc spring (11), a shell 2 (14) is provided above the spring plate (12) and the shell 1 (2), and a terminal (15) is provided above the shell 2 (14).

4. The AC contactor with a high current crimp package according to claim 3, characterized in that: A chip positioning ring (10) is provided between the insulating gasket (9) and the disc spring (11), and the chip positioning ring (10) limits the position of the chip (5).

5. The AC contactor with a high current crimp package according to claim 3, characterized in that: The novel high-power contactless AC switch is internally triggered by a control chip (5) through a silicone integrated gate device body (8). The silicone integrated gate device body (8) can control six chips individually, or each group can be independently triggered and controlled.

6. The AC contactor with a high current crimp package according to claim 3, characterized in that: The internal control line of the novel high-power contactless AC switch is welded with a socket and controlled through a terminal (15) to prevent the chip (5) from falling off due to high temperature. The external control line of the novel high-power contactless AC switch can be directly connected to the intelligent trigger board.

7. The AC contactor with a high current crimp package according to claim 1, characterized in that: Hexagon socket bolts (13) are threadedly connected through the four corners of the spring-pressing plate (12) and the top of the bottom plate (1).

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