Semiconductor air conditioning system with microgroove soaking liquid cooling device and control method

Abstract

The semiconductor air conditioning system comprises a semiconductor refrigeration module located in a box body, a temperature difference power generation module is arranged above the hot end of the semiconductor refrigeration module, the hot end of the semiconductor refrigeration module is provided with the microgroove soaking liquid cooling device, and the microgroove soaking liquid cooling device is connected with the temperature difference power generation module. The micro-groove soaking liquid cooling device comprises a soaking plate, the soaking plate is connected with the hot end of a semiconductor chip of the semiconductor refrigeration module, the soaking plate is provided with a micro-channel, one end of the micro-channel is connected with an agent storage box, the other end of the micro-channel is connected with a refrigerant box, and the agent storage box communicates with the refrigerant box. A liquid refrigerant in the agent storage box absorbs heat of the hot end of the semiconductor chip after flowing through the vapor chamber through the micro-channel, becomes a gaseous refrigerant and then enters the refrigerant box, and the gaseous refrigerant in the refrigerant box becomes a liquid refrigerant after being cooled and then flows back to the agent storage box. The control method comprises the following steps: S1, monitoring and judging a phase change state; s2, a power adjustment strategy; and S3, an adaptive parameter adjustment mechanism. According to the semiconductor air conditioner system with the microgroove soaking liquid cooling device and the control method, the heat dissipation efficiency of a semiconductor air conditioner can be improved, the energy consumption of the system is reduced, and the temperature control precision is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioning, and in particular to a semiconductor air conditioning system with a micro-groove heat-equalizing liquid cooling device and a control method thereof. Background Art

[0002] In modern environmental conditioning equipment, energy efficiency, temperature control accuracy, and air quality have become key performance indicators for air conditioning systems. Traditional air conditioning systems generally suffer from low heat dissipation efficiency, high energy consumption, and insufficient air purification, making them unable to meet the growing demand for energy conservation and intelligent operation.

[0003] With the rapid development of semiconductor refrigeration technology, its application in miniaturized, high-efficiency environmental control is becoming increasingly widespread. However, existing semiconductor air conditioning systems still have limitations in terms of heat dissipation design, temperature control accuracy, and air purification. For example, a single or inefficient heat dissipation method leads to high system energy consumption; control algorithms struggle to fully adapt to complex environmental changes, resulting in large temperature fluctuations; and the layout and filtration effectiveness of the air purification system make it difficult to ensure high air quality standards.

[0004] In particular, traditional air conditioning cooling systems rely on single passive or surface-based cooling structures, which limit cooling efficiency and make it difficult to quickly respond to temperature changes. This leads to insufficient control precision and further increases energy consumption. Although some systems have attempted to introduce multi-level cooling or intelligent control strategies, the lack of efficient thermal management solutions and real-time monitoring technologies makes it difficult to achieve both energy-saving and high-precision temperature control. Summary of the Invention

[0005] The technical problem to be solved by the present invention is: in order to solve the technical problem of poor heat dissipation at the hot end of semiconductor air conditioners in the prior art, the present invention provides a semiconductor air conditioning system with a micro-groove heat-equalizing liquid cooling device and a control method, which can improve the heat dissipation efficiency of the semiconductor air conditioner, reduce system energy consumption, and improve temperature control accuracy.

[0006] The technical solution adopted by the present invention to solve its technical problems is: a semiconductor air-conditioning system with a micro-groove soaking liquid cooling device, including a semiconductor refrigeration module located in a box body, a temperature difference power generation module is provided above the hot end of the semiconductor refrigeration module, and a micro-groove soaking liquid cooling device is provided at the hot end of the semiconductor refrigeration module. The micro-groove soaking liquid cooling device includes a soaking plate, which is connected to the hot end of the semiconductor chip of the semiconductor refrigeration module, and has a microchannel on the soaking plate. One end of the microchannel is connected to a storage tank, and the other end is connected to a cold agent tank. The storage tank and the cold agent tank are connected. The liquid refrigerant in the storage tank flows through the soaking plate through the microchannel, absorbs the heat of the hot end of the semiconductor chip, and enters the cold agent tank after becoming a gaseous refrigerant. The gaseous refrigerant in the cold agent tank becomes a liquid refrigerant after cooling and flows back to the storage tank.

[0007] The semiconductor air conditioning system of the present invention has a micro-groove heat-averaging liquid cooling device, which uses the micro-groove heat-averaging liquid cooling device to dissipate heat from the hot end of the semiconductor chip of the semiconductor refrigeration module, accurately controls the temperature of the hot end, ensures the heat dissipation effect of the hot end, reduces system energy consumption, and improves temperature control accuracy.

[0008] Furthermore, in order to monitor the microchannel in real time, platinum thermal resistance sensors are arranged at intervals on the left and right side walls of the microchannel, and adjacent platinum thermal resistance sensors form a monitoring grid.

[0009] Furthermore, in order to improve the heat dissipation effect of the microchannel, the microchannel is arranged along the surface of the heat spreader and forms a baffle-type microchannel, and the width of the microchannel is 0.5 mm.

[0010] Furthermore, in order to realize the transportation of refrigerant, a two-phase flow micro electromagnetic pump is connected between the microchannel and the storage tank.

[0011] Furthermore, in order to condense the gaseous refrigerant into liquid refrigerant, the refrigerant tank is connected to a cooling fan and a pressure pump.

[0012] Furthermore, in order to improve the temperature control accuracy, the box body includes an upper cavity and a lower cavity, the semiconductor refrigeration module is located in the upper cavity, and the cold end of the semiconductor refrigeration module forms a cold cavity with the upper cavity, a part of the hot air entering the upper cavity is cooled by the cold cavity to form cold air and then enters the lower cavity, a part of the hot air entering the upper cavity directly enters the lower cavity through a pipe, and is mixed with the cold air in the lower cavity and then discharged from the lower cavity.

[0013] Furthermore, in order to achieve air filtration, there are air intake cavities on the left and right sides of the upper cavity, a guide fan is provided on the air intake cavity, the air intake cavity is connected to the lower cavity by a pipe, and an air purification module is connected to the outside of the air intake cavity.

[0014] Furthermore, in order to control the gas flow from the cold chamber to the mixing chamber, a temperature and pressure sensor and an electric regulating valve are provided in the cold chamber.

[0015] Furthermore, in order to improve the heat exchange effect with hot air, the cold end of the semiconductor chip of the semiconductor refrigeration module is connected to a heat conducting fin, and guide fans are provided at both ends of the semiconductor refrigeration module.

[0016] The technical solution adopted by the present invention to solve the technical problem is: a control method for the semiconductor air conditioning system with the micro-grooved heat-dissipating liquid cooling device, comprising the following steps:

[0017] S1. Phase change state monitoring and judgment: Collect temperature data, flow data, and pressure data, use a sliding average filter algorithm to process temperature data to eliminate random errors, perform Kalman filtering on the data flow meter, integrate historical data to predict the current value, and improve dynamic response performance;

[0018] S2. Power regulation strategy:

[0019] Subcooled boiling adjustment stage, ΔT sub <10℃: Accelerate the vaporization of refrigerant and quickly enter the nucleate boiling zone. Adjustment formula: P=0.6P max +(10-ΔT sub )×0.05P max , where P max Indicates the rated maximum power; where ΔT sub Expressed as refrigerant superheat, power adjustment step: 0.5W / time, adjustment cycle 100ms.

[0020] Nucleate boiling maintenance stage, 10℃≤ΔT sub ≤20℃: Take 15℃ as the target superheat, minimize temperature fluctuations, and use fuzzy proportional integral differential control algorithm: Input variable: superheat deviation e=15℃-ΔT sub , and its rate of change Output variable: pump power adjustment ΔP;

[0021] Film boiling warning stage, ΔT sub >20℃: Immediately increase the power of the two-phase flow micro electromagnetic pump to 100%; start the pressure pump to increase the system pressure by 0.2MPa;

[0022] S3. Adaptive parameter adjustment mechanism: The proportional, integral, and differential coefficients are adjusted in real time according to the system operating status. When the thermal load fluctuation is greater than 20%, it automatically switches to the preset robust control parameter group, records the critical parameters of each phase change state transition, establishes an operating condition-parameter mapping table, and directly calls the optimized parameters when encountering similar operating conditions.

[0023] Furthermore, in step S1, the phase change state judgment criterion is: calculating the average wall temperature: Where T wall It is the average wall temperature; n is the number of temperature sensors; T i Represents the temperature value collected by the i-th sensor; the saturation temperature T is obtained by interpolation from the refrigerant physical property table sat : Calculate superheat: ΔT sub =T wall -T sat , where ΔT sub Expressed as superheat; T wall Expressed as the average temperature of the microchannel wall; Tsat Expressed as the refrigerant saturation temperature at the corresponding system pressure; the critical heat flux is calculated according to the Zuber model:

[0024]

[0025] Where: q CHF Critical heat flux, ρ v The density of the refrigerant in gaseous state, ρ l The density of refrigerant in liquid state, h fg is the latent heat of vaporization of the refrigerant, σ is the surface tension, and g is the acceleration due to gravity.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. The semiconductor air conditioning system and control method of the present invention have a micro-groove heat-equalizing liquid cooling device, which dissipates heat from the hot end of the semiconductor refrigeration module through the micro-groove heat-equalizing liquid cooling device, ensuring the stability of the hot end temperature, can quickly respond to temperature changes, reduce energy consumption, and improve temperature control accuracy.

[0028] 2. The semiconductor air conditioning system and control method of the present invention with micro-groove heat-equalizing liquid cooling device breaks through the passive mode of "temperature feedback-flow regulation" of traditional liquid cooling system, directly controls the phase change state of refrigerant, and adjusts the superheat ΔT sub and critical heat flux q CHF Dual parameter discrimination enables precise maintenance of nucleate boiling. By comprehensively considering the interactions among temperature, flow, and pressure fields, a three-dimensional phase change state matrix is ​​established. Control parameters are adaptively adjusted for different heat load characteristics, broadening the system's applicability.

[0029] 3. The semiconductor air conditioning system and control method of the present invention with a micro-groove heat-equalizing liquid cooling device forms a cold cavity in the box, isolates the cold cavity and the mixing cavity, avoids cross-talk between hot and cold, and improves temperature control accuracy and system stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention will be further described below with reference to the accompanying drawings and examples.

[0031] Figure 1 A schematic diagram of the structural principle of a semiconductor air conditioning system with a micro-groove heat-dissipating liquid cooling device according to the present invention;

[0032] Figure 2 This is a schematic diagram of the cold end principle of the semiconductor refrigeration module;

[0033] Figure 3 This is a schematic diagram of the principle of the hot end and micro-groove heat-equalizing liquid cooling device of the semiconductor refrigeration module;

[0034] Figure 4 is a partial schematic diagram of the microchannel;

[0035] Figure 5 This is the cycle control flow chart of the semiconductor air conditioning system.

[0036] In the picture:

[0037] 1. Box body, 11. Upper chamber, 12. Lower chamber, 13. Air intake chamber, 14. Pipeline, 15. Air purification module, 16. Refrigeration control system, 17. Power supply unit, 18. Thermoelectric power generation module;

[0038] 2. semiconductor refrigeration module, 21. thermal conductive fins, 22. semiconductor chip;

[0039] 3. Micro-groove soaking liquid cooling device, 31. Vaporizing plate, 32. Microchannel, 33. Reservoir, 34. Refrigerant tank, 35. Two-phase flow micro electromagnetic pump, 36. Cooling fan, 37. Pressure pump, 38. Platinum thermal resistor sensor. DETAILED DESCRIPTION

[0040] The present invention will now be described in further detail with reference to the accompanying drawings, which are simplified schematic diagrams that illustrate the basic structure of the present invention in a schematic manner.

[0041] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, features defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0042] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0043] like Figure 1As shown, a semiconductor air conditioning system with a micro-grooved heat-equalizing liquid cooling device includes a semiconductor refrigeration module 2 located within a housing 1. The housing 1 includes an upper chamber 11 and a lower chamber 12. The semiconductor refrigeration module 2 is located within the upper chamber 11, and the cold end of the semiconductor refrigeration module 2 forms a cold chamber with the upper chamber 11. A portion of the hot air entering the upper chamber 11 is cooled by the cold chamber to form cold air, and then enters the lower chamber 12. A portion of the hot air entering the upper chamber 11 directly enters the lower chamber 12 through a pipe 14, where it mixes with the cold air and is discharged from the lower chamber 12.

[0044] Specifically, the left and right sides of the upper chamber 11 are provided with an air inlet chamber 13, and a guide fan is provided on the air inlet chamber 13. The air inlet chamber 13 is connected to the lower chamber 12 through a pipe 14. Preferably, an air purification module 15 is connected to the outside of the air inlet chamber 13. In this embodiment, the cooling mode is used for explanation. The external air is sucked into the box body 1 through the guide fan, and the hot air is filtered by the air purification module 15 and enters the cold chamber. When the hot air enters the cold chamber, it exchanges heat with the semiconductor refrigeration module 2, and the temperature of the hot air is reduced to form cold air. Then the cold air will enter the lower chamber 12. In order to ensure that the air in the lower chamber 12 is at a suitable temperature, a small amount of hot air in the air inlet chamber 13 is introduced into the lower chamber 12 through the pipe 14. A small amount of hot air and cold air are mixed in the lower chamber 12 to control the air temperature in the lower chamber 12, ensuring that the cold air blown out from the lower chamber 12 is at a suitable temperature.

[0045] Specifically, the air purification module 15 is equipped with a multi-stage high-efficiency filter H13 HEPA filter (size 400×200×50mm, dust holding capacity ≥300g) and an activated carbon filter layer (iodine value ≥1000mg / g, thickness 30mm). The filtration efficiency reaches 99.97%, which can remove suspended particles, bacteria and odors, ensuring the output air quality. The working principle and configuration of the filter can be described by the following model: When air flows through the multi-stage filter layer, the pollutant concentration drops to:

[0046] C out =C in ×e -λ×n

[0047] Among them, C in is the inlet pollutant concentration, C out is the output concentration, λ is the filtration efficiency parameter, and n is the number of filter layers.

[0048] Specifically, a temperature sensor is further provided in the lower chamber 12 for detecting the temperature of the mixed gas in the lower chamber 12. A guide fan can also be provided in the lower chamber 12 to ensure that the air and the hot air are evenly mixed.

[0049] Specifically, the cavity also has independent equipment chambers, which are located on the left and right sides of the lower cavity 12. The equipment chambers are equipped with a refrigeration control system 16 and a power supply unit 17. When the power supply unit 17 is turned on, the semiconductor refrigeration module 2 and other components can start working.

[0050] The refrigeration control system includes an intelligent composite temperature control module: it integrates the feedforward fuzzy PID algorithm and model predictive control (MPC), predicts the temperature for the next 30 seconds based on the thermal network state space model (error ≤ 0.2°C), and dynamically adjusts the refrigeration plate current and two-phase flow rate, improving the control accuracy to ±0.3°C.

[0051] Specifically, a temperature and pressure sensor and an electric regulating valve are provided in the cold chamber. The temperature and pressure sensor detects the temperature and pressure in the cold chamber to prevent overcooling in the cold chamber. The electric regulating valve controls the flow of cold air into the lower chamber 12.

[0052] Specifically, the pipeline 14 is also provided with an electric regulating valve, which is also used to control the flow rate of hot air entering the lower chamber 12.

[0053] like Figure 2 As shown ( Figure 2 (Only the positional relationship of the cold ends of the two semiconductor chips 22 is shown in the figure). Preferably, the cold ends of the semiconductor chips 22 of the semiconductor refrigeration module 2 are connected to thermal fins 21, and diversion fans are provided at both ends of the semiconductor refrigeration module 2. The thermal fins 21 are connected to the cold ends of the semiconductor chips 22 via thermal grease, allowing hot air to fully exchange heat with the thermal fins 21, thereby improving the heat dissipation effect on the hot air.

[0054] Specifically, the heat conducting fins 21 are copper heat dissipating fins, which enhance heat conduction through thermal grease to maintain the cold end temperature stable at 5-10°C.

[0055] In order to ensure the heat dissipation effect of the hot end of the semiconductor refrigeration module 2, as shown in FIG. Figure 3As shown (only the hot end of the semiconductor chip 22 and the position of the microgroove heat-absorbing liquid cooling device 3 are shown), the hot end of the semiconductor refrigeration module 2 is provided with a microgroove heat-absorbing liquid cooling device 3. The microgroove heat-absorbing liquid cooling device 3 is located between the thermoelectric power generation module 18 and the hot end. The microgroove heat-absorbing liquid cooling device 3 includes a heat-absorbing plate 31. The heat-absorbing plate 31 is connected to the hot end of the semiconductor chip 22 of the semiconductor refrigeration module 2. The heat-absorbing plate 31 has microchannels 32 arranged along the surface of the heat-absorbing plate 31 and forming a baffled microchannel 32. The width of the microchannel 32 is 0.5 mm. One end of the microchannel 32 is connected to the reservoir tank 33, and the other end is connected to the coolant tank 34. The reservoir tank 33 and the coolant tank 34 are connected. The liquid refrigerant in the reservoir tank 33 flows through the microchannel 32 through the heat-absorbing plate 31, absorbs the heat from the hot end of the semiconductor chip 22, and then becomes a gaseous refrigerant and enters the coolant tank 34. The gaseous refrigerant in the refrigerant tank 34 is cooled to become liquid refrigerant and then flows back to the storage tank 33 .

[0056] Specifically, platinum RTD sensors are spaced apart on the left and right sidewalls of the microchannel. These sensors utilize miniature PT100 platinum RTD sensors (OmegaFTF series, 0.1mm thickness), arranged in rows every 5mm along the length of microchannel 32, with two sensors evenly spaced along the centerline of the width. The sensors are tightly bonded to the outer wall of the microchannel using thermally conductive silicone, ensuring a temperature response time of less than 50ms. Adjacent platinum RTD sensors form a 5mm x 5mm monitoring grid, covering over 80% of the effective heat dissipation area of ​​the vapor chamber.

[0057] Specifically, a two-phase flow micro electromagnetic pump 35 is connected between the microchannel 32 and the agent storage box 33 .

[0058] Specifically, the refrigerant tank 34 is connected to a cooling fan 36 and a pressure pump 37. The cooling fan 36 and pressure pump 37 convert the gaseous refrigerant into liquid refrigerant, which then flows back into the refrigerant storage tank 33. A MEMS piezoresistive pressure sensor (Honeywell 24PC) with a range of 0-1 MPa and a response time of less than 1 ms is installed within the refrigerant tank 34.

[0059] Preferably, a micro Coriolis mass flowmeter (Emerson MicroMotion G) is installed at the inlet end, with a measuring range of 0-5 L / h and an accuracy of ±0.1%.

[0060] It uses an STM32F407VGT6 microcontroller with a main frequency of 168MHz, a built-in 12-bit ADC (sampling rate 1MSPS), and supports multi-channel synchronous sampling.

[0061] Equipped with 256KB SRAM and 1MB Flash to meet the needs of temperature matrix data storage and algorithm operation.

[0062] Signal processing circuit: The temperature signal is processed by the MAX31865 analog-to-digital converter to achieve ±0.5°C measurement accuracy. The flow / pressure signal is converted into a digital signal by the INA219 current sensing chip with a resolution of 0.1μA. All signal channels integrate second-order low-pass filters (cutoff frequency 20Hz) to suppress high-frequency noise.

[0063] Electromagnetic pump drive circuit: Uses IR2110 half-bridge driver chip + IRF540NMOSFET to build an H-bridge circuit, supporting bidirectional current control; PWM modulation frequency is adjustable from 1 to 10kHz, drive current range is 0 to 10A, and power regulation accuracy is ±0.2W; integrated overcurrent protection (threshold 12A) and overtemperature protection (threshold 85°C) ensure system safety.

[0064] When the device is running, the micro-grooved heat-equalizing liquid cooling device 3 starts working. The two-phase flow micro electromagnetic pump 35 provides power, and the liquid refrigerant flows from the reservoir 33 to the copper heat-equalizing plate 31. When the liquid refrigerant flows through the microchannel 32, it exchanges heat with the hot end of the semiconductor chip 22. After the liquid refrigerant is heated, it becomes a gaseous refrigerant and flows to the refrigerant tank 34. The cooling fan 36 and the pressure pump 37 of the refrigerant tank 34 convert the gaseous refrigerant into a liquid refrigerant and then flow back to the reservoir 33, thus completing a heat dissipation cycle. The heat-equalizing plate is connected to the micro-grooved liquid cooling system, and the contact gap is filled with thermal conductive silicone grease. The thermal resistance is ≤0.05℃·cm 2 / W.

[0065] Preferably, the refrigerant charge should be precisely controlled, and it is recommended to be 60%-70% of the system's internal volume. The refrigerant used is trans-1-chloro-3,3,3-trifluoropropene, with an ODP of 0.00034 and a GWP of 1. Its boiling point is 18.7°C at normal pressure, and its boiling point increases after pressurization, as shown in the following table:

[0066] Temperature (℃) Saturation pressure (bar, abs) Saturation pressure (KPa, abs) Status Description 18.7 1.013 101.3 Boiling point / dew point (phase transition point at normal pressure) 20.0 1.110 111.0 Liquid-gas equilibrium 25.0 1.412 141.2 Liquid-gas equilibrium 30.0 1.792 179.2 Liquid-gas equilibrium 35.0 2.265 226.5 Liquid-gas equilibrium .

[0067] Preferably, the semiconductor refrigeration module 2 includes two opposing semiconductor chips 22, with the cold ends of the two semiconductor chips 22 facing inward and the hot ends of the two semiconductor chips 22 facing outward. Hot air flows through the opposing cold ends for cooling, while the hot ends of the semiconductor chips 22 dissipate heat through the micro-grooved heat-equalizing liquid cooling device 3.

[0068] Specifically, a thermoelectric power generation module 18 is installed above the hot end of the semiconductor refrigeration module 2. This module is integrated onto the outside of the hot end's vapor chamber 31. It includes a bismuth telluride-based thermoelectric generator (TEC), a DC-DC energy conversion circuit, and an energy storage unit. It utilizes the temperature difference between the hot end (40-50°C) and the cold end (5-10°C) to generate electricity (1-3W), powering the sensor and control module.

[0069] Based on the Seebeck effect, when there is a temperature difference on both sides of the TEG module, the carriers in the bismuth telluride-based semiconductor material (Bi2Te3 alloy) move in a directional manner to generate an electromotive force. The core formula is:

[0070] V=α·ΔT

[0071] Where V is the output voltage, α is the Seebeck coefficient, and ΔT is the temperature difference between the hot and cold ends. This system utilizes the temperature difference between the cold end (5-10°C) and the hot end (40-50°C) of the refrigeration system to generate electricity, providing self-power for the sensor and Bluetooth module, enabling low-power operation.

[0072] A control method for the semiconductor air conditioning system having the micro-grooved heat-dissipating liquid cooling device comprises the following steps:

[0073] S1. Phase change state monitoring and identification:

[0074] Data collection and preprocessing:

[0075] Synchronously collect 15 channels of temperature data, 1 channel of flow data, and 1 channel of pressure data at a frequency of 100Hz;

[0076] Use sliding average filtering algorithm to process temperature data to eliminate random errors;

[0077] Perform Kalman filtering on traffic data, integrate historical data to predict current values, and improve dynamic response performance.

[0078] Phase change state judgment criteria:

[0079] Calculate the average wall temperature:

[0080]

[0081] Where T wall It is the average wall temperature; n is the number of temperature sensors; T i Indicates the temperature value collected by the i-th sensor

[0082] Obtain the saturation temperature T through interpolation from the refrigerant physical property table sat , calculate superheat: ΔT sub =T wall -T sat

[0083] Where ΔT sub Expressed as superheat; T wall Expressed as the average temperature of the microchannel wall; T sat Expressed as the refrigerant saturation temperature at the corresponding system pressure

[0084] Calculate the critical heat flux density according to the Zuber model:

[0085]

[0086] Where: q CHF Critical heat flux, ρ v The density of the refrigerant in gaseous state, ρ l The density of refrigerant in liquid state, h fg is the latent heat of vaporization of the refrigerant, σ is the surface tension, and g is the acceleration due to gravity.

[0087] S2. Three-stage power regulation strategy:

[0088] Subcooled boiling adjustment stage (ΔT sub <10℃)

[0089] Control objective: Accelerate the vaporization of refrigerant and quickly enter the nucleate boiling zone;

[0090] Adjustment formula: P = 0.6P max +(10-ΔT sub )×0.05P max , where P max Indicates the rated maximum power; where ΔT sub Expressed as refrigerant superheat.

[0091] Power adjustment step: 0.5W / time, adjustment cycle 100ms.

[0092] Nucleate boiling maintenance stage (10℃≤ΔT sub ≤20℃), control target: 15℃ as the target superheat to minimize temperature fluctuations;

[0093] Using fuzzy proportional integral differential control algorithm: Input variable: superheat deviation e = 15℃-ΔT sub , and its rate of change Output variable: pump power adjustment ΔP;

[0094] Fuzzy rule base: contains the following rules:

[0095]

[0096] Defuzzification method: centroid method.

[0097] Film boiling warning stage (ΔT sub >20℃):

[0098] Emergency response: immediately increase the electromagnetic pump power to 100%; start the refrigerant tank pressure pump (37) to increase the system pressure by 0.2 MPa; trigger the sound and light alarm, and store the abnormal data in the non-volatile memory at the same time.

[0099] S3. Adaptive parameter adjustment mechanism:

[0100] Dynamically adjust PID parameters: adjust the proportional, integral and differential coefficients in real time according to the system operating status; when the thermal load fluctuation is greater than 20%, it automatically switches to the preset robust control parameter group.

[0101] Learning and optimization: Record the critical parameters of each phase change state transition; establish a working condition-parameter mapping table, and directly call the optimized parameters when encountering similar working conditions next time.

[0102] Micro-grooved heat-dissipating liquid cooling device, micro-channel size 50mm×10mm×1mm; electric heating film simulates semiconductor heat source, which can achieve 10-200W / cm 2 Heat flux loading; data acquisition system (NIcDAQ-9178), sampling frequency 100 Hz.

[0103] The performance test results are as follows:

[0104]

[0105] In summary, the semiconductor air conditioning system with the micro-groove heat-equalizing liquid cooling device of the present invention can improve the heat dissipation efficiency of the semiconductor air conditioning, reduce system energy consumption, and improve temperature control accuracy.

[0106] The above description is intended to serve as a guide for the preferred embodiments of the present invention. Based on the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A semiconductor air conditioning system with a micro-groove heat-equalizing liquid cooling device, comprising a semiconductor refrigeration module (2) located in a box (1), a thermoelectric power generation module (18) being provided above the hot end of the semiconductor refrigeration module (2), characterized in that: The hot end of the semiconductor refrigeration module (2) is provided with a micro-groove heat-equalizing liquid cooling device (3), the micro-groove heat-equalizing liquid cooling device (3) comprising a heat-equalizing plate (31), the heat-equalizing plate (31) being connected to the hot end of the semiconductor chip (22) of the semiconductor refrigeration module (2), the heat-equalizing plate (31) having a micro-channel (32), one end of the micro-channel (32) being connected to a storage tank (33), and the other end being connected to a cold agent tank (34), the storage tank (33) and the cold agent tank (34) being connected, the liquid refrigerant in the storage tank (33) flowing through the heat-equalizing plate (31) through the micro-channel (32) absorbs the heat of the hot end of the semiconductor chip (22), and then becomes a gaseous refrigerant and enters the cold agent tank (34), and the gaseous refrigerant in the cold agent tank (34) becomes a liquid refrigerant after being cooled and then flows back to the storage tank (33).

2. The semiconductor air conditioning system with a micro-groove heat-dissipating liquid cooling device according to claim 1, characterized in that: Platinum thermal resistance sensors (38) are arranged at intervals on the left and right side walls of the microchannel (32), and adjacent platinum thermal resistance sensors (38) form a monitoring grid.

3. The semiconductor air conditioning system with a micro-groove heat-dissipating liquid cooling device according to claim 2, characterized in that: The microchannels (32) are arranged along the surface of the heat spreader (31) to form baffled microchannels (32), and the width of the microchannels (32) is 0.5 mm.

4. The semiconductor air conditioning system with a micro-groove heat-dissipating liquid cooling device according to claim 1, characterized in that: A two-phase flow micro electromagnetic pump (35) is connected between the microchannel (32) and the agent storage box (33).

5. The semiconductor air conditioning system with a micro-groove heat-dissipating liquid cooling device according to claim 1, characterized in that: The refrigerant tank (34) is connected to a cooling fan (36) and a pressure pump (37).

6. The semiconductor air conditioning system with a micro-groove heat-dissipating liquid cooling device according to any one of claims 1 to 5, characterized in that: The semiconductor refrigeration module (2) comprises two semiconductor chips (22) arranged opposite to each other, the cold ends of the two semiconductor chips (22) being arranged opposite to each other inwards, and the hot ends of the semiconductor chips (22) being arranged opposite to each other outwards, the cold ends of the semiconductor chips (22) of the semiconductor refrigeration module (2) being connected to heat-conducting fins (21), and guide fans being provided at both ends of the semiconductor refrigeration module (2).

7. The semiconductor air conditioning system with a micro-groove heat-dissipating liquid cooling device according to claim 6, characterized in that: The box body (1) comprises an upper chamber (11) and a lower chamber (12); the semiconductor refrigeration module (2) is located in the upper chamber (11), and the cold end of the semiconductor refrigeration module (2) and the upper chamber (11) form a cold chamber; a portion of the hot air entering the upper chamber (11) is cooled by the cold chamber to form cold air and then enters the lower chamber (12); a portion of the hot air entering the upper chamber (11) directly enters the lower chamber (12) through a pipe (14), and is mixed with the cold air in the lower chamber (12) and then discharged from the lower chamber (12).

8. The semiconductor air conditioning system with a micro-groove heat-dissipating liquid cooling device according to claim 7, characterized in that: The upper chamber (11) has air inlet chambers (13) on the left and right sides, and a guide fan is provided on the air inlet chamber (13). The air inlet chamber (13) is connected to the lower chamber (12) through a pipe (14), and the outside of the air inlet chamber (13) is connected to an air purification module (15).

9. A control method for a semiconductor air conditioning system comprising the micro-grooved heat-saturated liquid cooling device according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1. Phase change state monitoring and judgment: Collect temperature data, flow data, and pressure data, use a sliding average filter algorithm to process temperature data to eliminate random errors, perform Kalman filtering on the data flow meter, integrate historical data to predict the current value, and improve dynamic response performance; S2. Power regulation strategy: Subcooled boiling adjustment stage, ΔT sub <10℃: Accelerate the vaporization of refrigerant and quickly enter the nucleate boiling zone. Adjustment formula: P=0.6P max +(10-ΔT sub )×0.05P max , where P max Indicates the rated maximum power; where ΔT sub Expressed as refrigerant superheat, power adjustment step: 0.5W / time, adjustment cycle 100ms. Nucleate boiling maintenance stage, 10℃≤ΔT sub ≤20℃: Take 15℃ as the target superheat, minimize temperature fluctuations, and use fuzzy proportional integral differential control algorithm: Input variable: superheat deviation e=15℃-ΔT sub , and its rate of change Output variable: pump power adjustment ΔP; Film boiling warning stage, ΔT sub >20°C: immediately increase the power of the two-phase flow micro electromagnetic pump (35) to 100%; start the pressure pump (37) to increase the system pressure by 0.2 MPa; S3. Adaptive parameter adjustment mechanism: The proportional, integral, and differential coefficients are adjusted in real time according to the system operating status. When the thermal load fluctuation is greater than 20%, it automatically switches to the preset robust control parameter group, records the critical parameters of each phase change state transition, establishes an operating condition-parameter mapping table, and directly calls the optimized parameters when encountering similar operating conditions.

10. The semiconductor air conditioning system with a micro-groove heat-dissipating liquid cooling device according to claim 9, characterized in that: In step S1, the phase change state judgment criterion is: Calculate the average wall temperature: Where T wall It is the average wall temperature; n is the number of temperature sensors; T i represents the temperature value collected by the i-th sensor; Obtain the saturation temperature T through interpolation from the refrigerant physical property table sat : Calculate superheat: ΔT sub =T wall -T sat , where ΔT sub Expressed as superheat; T wall Expressed as the average temperature of the microchannel wall; T sat Expressed as the refrigerant saturation temperature at the corresponding system pressure; Where: q CHF Critical heat flux, ρ v The density of the refrigerant in gaseous state, ρ l The density of refrigerant in liquid state, h fg is the latent heat of vaporization of the refrigerant, σ is the surface tension, and g is the acceleration due to gravity.

Images