Method and system for realizing rapid optical coupling test of silicon optical chip, and storage medium

Abstract

The invention discloses a rapid optical coupling test implementation method for a silicon optical chip, and relates to the technical field of silicon optical chip testing. According to the rapid optical coupling test implementation method for the silicon optical chip, after the incident waveguide device and the emergent waveguide device are respectively roughly matched with the target silicon optical chip, the wavelength of the incident laser in the incident waveguide device can be periodically adjusted; the emergent laser power change information in the emergent waveguide device when the wavelength of the incident laser periodically changes is obtained, and the emergent laser power change information can judge whether coupling succeeds or not and can also be used for analyzing to obtain a first position adjustment scheme, so that a correct adjustment direction can be found without continuous trial and error, and the accuracy of the adjustment direction is improved. And optical coupling between the incident waveguide device and the silicon optical chip is finally realized through continuous feedback fine tuning. According to the invention, the coupling speed is higher, and the time for the optical coupling test of the silicon optical chip is reduced.

Description

[0001] This application is a divisional application of the invention patent application with application number 202510346707.6 filed on March 24, 2025, and entitled “A method and device for implementing optical coupling testing of a silicon photonic chip, and a storage medium”. Technical Field

[0002] The present invention relates to the technical field of silicon photonic chip testing, and in particular to a method and system for implementing rapid optical coupling testing of a silicon photonic chip, and a storage medium. Background Art

[0003] Silicon photonic chips are a new type of chip that integrates optical elements and semiconductor devices on the same silicon wafer. Silicon photonic chips have the characteristics of high integration, low cost, and higher transmission bandwidth. Because silicon photonic chips use silicon as the substrate of the integrated chip, they can integrate more optical devices. In optical modules, the cost of optical chips is very high, but with the realization of large-scale production, the low cost of silicon photonic chips has become a huge advantage. Silicon waveguides have good transmission performance because the refractive index difference of silicon photonic materials is larger, which can achieve high-density waveguides and higher transmission bandwidth under the same area.

[0004] An essential step in the silicon photonics chip manufacturing process is optical coupling testing. The main purposes of optical coupling testing include: (1) Evaluating coupling efficiency: ensuring that the optical signal can be efficiently transmitted from the optical fiber to the chip waveguide to reduce coupling loss. (2) Detecting optical mode matching: verifying the degree of mode matching between the chip waveguide and the optical fiber to avoid signal attenuation caused by mode field mismatch. (3) Screening for good products: quickly screening qualified chips through wafer-level testing to reduce packaging costs. (4) Optimizing design and process: optimizing chip design and manufacturing processes through feedback from test results.

[0005] In the prior art, as described in Chinese patent publications CN 110187454 A and CN 113702004 A, the optical coupling test of existing silicon photonic chips mainly includes the following steps: (1) Chip fixation: The silicon photonic chip is glued and fixed on the substrate. (2) Fiber alignment: A high-precision fiber probe or fiber array is used to align the fiber with the waveguide end face or grating coupler of the chip. (3) Coupling test: The optical signal is coupled into the chip through the light source, and the intensity and quality of the output optical signal are detected. (4) Data acquisition and analysis: Parameters such as coupling loss and optical mode matching are recorded to evaluate chip performance. However, in each coupling process of the above operation, both the input fiber and the output fiber need to be re-coupled with the silicon photonic chip, which takes a long time. For example, the vertical coupling test of a single fiber takes 3-4 seconds each time, and the vertical coupling test of the entire fiber array takes 2-3 seconds. For a single silicon photonic chip that is tested thousands of times, the entire coupling test takes a long time. Summary of the Invention

[0006] The present invention provides a method and system for implementing rapid optical coupling testing of a silicon photonic chip, and a storage medium, for reducing the optical coupling testing time of a silicon photonic chip.

[0007] In order to solve the above technical problems, the first aspect of the present invention discloses a method for implementing rapid optical coupling testing of a silicon photonic chip, the method comprising: The first adjustment device roughly matches the incident waveguide device with the light entrance on the target silicon photonic chip; the second adjustment device roughly matches the output waveguide device with the light exit on the target silicon photonic chip; an adjustment and judgment step of periodically adjusting the wavelength of the incident laser in the incident waveguide device, obtaining output laser power change information in the output waveguide device when the incident laser wavelength periodically changes, and judging whether the output laser power change information indicates that the incident waveguide device is coupled to the light entrance; If it is determined that the output laser power change information indicates that the incident waveguide device is not coupled to the light inlet, determining a first position adjustment scheme for the first adjustment device based on the output laser power change information; the first adjustment device adjusts the position of the incident waveguide device according to the first position adjustment scheme, and re-triggering the adjustment determination step; If it is determined that the output laser power change information indicates that the incident waveguide device is coupled with the light entrance, the position of the incident waveguide device in the current state is determined to be the incident coupling position.

[0008] As an optional embodiment, in the first aspect of the present invention, if the optical path currently being tested on the target silicon photonic chip is a reversible optical path, then after determining the incoupling position of the incident waveguide device, the method further includes: Turn off the laser in the incident waveguide device and control the output waveguide device to emit a test laser; a reverse adjustment determination step of periodically adjusting the test laser wavelength in the output waveguide device, obtaining reverse output laser power change information in the input waveguide device when the test laser wavelength periodically changes, and determining whether the reverse output laser power change information indicates that the output waveguide device is coupled to the light exit; If it is determined that the reverse output laser power change information indicates that the output waveguide device is not coupled to the light outlet, determining a second position adjustment scheme for the second adjustment device based on the reverse output laser power change information; the second adjustment device adjusts the position of the output waveguide device according to the second position adjustment scheme, and re-triggering the reverse adjustment determination step; If it is determined that the reverse output laser power change information indicates that the output waveguide device is coupled with the light exit, the position of the output waveguide device in the current state is determined to be the output coupling position.

[0009] As an optional embodiment, in the first aspect of the present invention, if the optical path currently being tested on the target silicon photonic chip is an irreversible optical path, then after determining the incoupling position of the incident waveguide device, the method further includes: The wavelength of the incident laser in the incident waveguide device is fixed, and the second adjustment device adjusts the position of the output waveguide device multiple times according to a preset position adjustment scheme, and obtains the output laser power in the output waveguide device when the output waveguide device is at different positions; A target outgoing laser power with the largest power is screened out from the plurality of outgoing laser powers, and a position of the outgoing waveguide device corresponding to the target outgoing laser power is determined as an outgoing coupling position.

[0010] As an optional embodiment, in the first aspect of the present invention, the method further comprises: The first adjustment device adjusts the incident waveguide device to the incident coupling position, and the second adjustment device adjusts the output waveguide device to the output coupling position, so that the incident waveguide device, the target silicon photonic chip and the output waveguide device form a test optical path, and the target silicon photonic chip is optically coupled based on the test optical path.

[0011] As an optional implementation manner, in the first aspect of the present invention, the adjustment determination step specifically includes: In each adjustment cycle, adjusting the wavelength of the incident laser in the input waveguide device from a first wavelength to a second wavelength, and obtaining information on a change in the output laser power in the output waveguide device during the process of the incident laser wavelength changing from the first wavelength to the second wavelength; For each adjustment period, fitting a wavelength-power curve based on the output laser power change information in the output waveguide device during the adjustment period, wherein the wavelength-power curve is used to represent the corresponding relationship between the incident laser wavelength and the output laser power; Determining whether wavelength-power curves corresponding to a continuous preset number of adjustment cycles are consistent; if it is determined that the wavelength-power curves corresponding to the continuous preset number of adjustment cycles are consistent, determining the wavelength-power curve corresponding to each adjustment cycle when the wavelength-power curves are consistent as the target wavelength-power curve; It is determined whether the target wavelength-power curve indicates that the incident waveguide device is coupled to the light entrance.

[0012] As an optional embodiment, in the first aspect of the present invention, adjusting the wavelength of the incident laser in the incident waveguide device from the first wavelength to the second wavelength in each adjustment period includes: In each adjustment cycle, at each preset time interval, the wavelength of the incident laser in the incident waveguide device is increased by a preset wavelength increment, so that the wavelength of the incident laser changes from a first wavelength to a second wavelength; Furthermore, determining whether the target wavelength-power curve indicates that the incident waveguide device is coupled with the light entrance includes: It is determined whether the target wavelength-power curve is a straight line parallel to the horizontal axis. If the target wavelength-power curve is a straight line parallel to the horizontal axis, it is determined that the incident waveguide device is coupled to the light entrance.

[0013] As an optional embodiment, in the first aspect of the present invention, determining the first position adjustment scheme of the first adjustment device according to the output laser power change information includes: The target incident laser wavelength corresponding to the maximum incident laser power is determined according to the emitted laser power change information, and the rotation direction and rotation angle corresponding to the first adjustment device are determined according to the wavelength value of the target incident laser wavelength.

[0014] A second aspect of the present invention discloses a device for implementing optical coupling testing of a silicon photonic chip, the device comprising: A first adjustment device is used to roughly match the incident waveguide device with the light entrance on the target silicon photonic chip; A second adjustment device is used to roughly match the output waveguide device with the light outlet on the target silicon photonic chip; an adjustment and judgment module, configured to execute an adjustment and judgment step, the adjustment and judgment step comprising: periodically adjusting the wavelength of an incident laser in an incident waveguide device, obtaining output laser power change information in an output waveguide device when the incident laser wavelength periodically changes, and determining whether the output laser power change information indicates that the incident waveguide device is coupled to the light inlet; a first adjustment planning module, configured to determine a first position adjustment scheme for the first adjustment device according to the output laser power variation information when it is determined that the output laser power variation information indicates that the incident waveguide device is not coupled to the light inlet; The first adjusting device is further configured to adjust the position of the incident waveguide device according to the first position adjustment scheme, and re-trigger the adjustment judgment module to perform the adjustment judgment step; The first adjustment planning module is further configured to determine that the position of the incident waveguide device in the current state is the incident coupling position when it is determined that the output laser power change information indicates that the incident waveguide device is coupled with the light entrance.

[0015] As an optional embodiment, in the second aspect of the present invention, the device further includes: an optical path adjustment module, configured to, when the optical path currently being tested on the target silicon photonic chip is a reversible optical path and after determining the incoupling position of the input waveguide device, turn off the laser in the input waveguide device and control the output waveguide device to emit a test laser; a reverse adjustment judgment module, configured to execute a reverse adjustment judgment step, the reverse adjustment judgment step comprising: periodically adjusting the test laser wavelength in the output waveguide device, obtaining reverse output laser power change information in the input waveguide device when the test laser wavelength periodically changes, and determining whether the reverse output laser power change information indicates that the output waveguide device is coupled to the light exit; a second adjustment planning module, configured to determine a second position adjustment scheme for the second adjustment device according to the reverse output laser power variation information when it is determined that the reverse output laser power variation information indicates that the output waveguide device is not coupled to the light outlet; The second adjustment device is further configured to adjust the position of the output waveguide device according to the second position adjustment scheme, and re-trigger the reverse adjustment judgment module to perform the reverse adjustment judgment step; The second adjustment planning module is further configured to determine the position of the output waveguide device in the current state as the output coupling position when it is determined that the reverse output laser power change information indicates that the output waveguide device is coupled with the light outlet.

[0016] As an optional embodiment, in the second aspect of the present invention, the device further includes: a third adjustment planning module, configured to, when the optical path currently being tested on the target silicon photonic chip is an irreversible optical path and after determining the incoupling position of the input waveguide device, fix the wavelength of the incident laser in the input waveguide device, control the second adjustment device to adjust the position of the output waveguide device multiple times according to a preset position adjustment scheme, and obtain the output laser power of the output waveguide device when the output waveguide device is at different positions; The third adjustment planning module is further configured to select a target output laser power with the largest power from the plurality of output laser powers, and determine the output waveguide device position corresponding to the target output laser power as the output coupling position.

[0017] As an optional embodiment, in the second aspect of the present invention, the first adjustment device is further used to adjust the input waveguide device to the input coupling position; the second adjustment device is further used to adjust the output waveguide device to the output coupling position, so that the input waveguide device, the target silicon photonic chip, and the output waveguide device form a test light path; And, the device further comprises: A coupling test module is used to perform an optical coupling test on the target silicon photonic chip based on the test optical path.

[0018] As an optional implementation manner, in the second aspect of the present invention, the specific manner in which the adjustment determination module performs the adjustment determination step includes: In each adjustment cycle, adjusting the wavelength of the incident laser in the input waveguide device from a first wavelength to a second wavelength, and obtaining information on a change in the output laser power in the output waveguide device during the process of the incident laser wavelength changing from the first wavelength to the second wavelength; For each adjustment period, fitting a wavelength-power curve based on the output laser power change information in the output waveguide device during the adjustment period, wherein the wavelength-power curve is used to represent the corresponding relationship between the incident laser wavelength and the output laser power; Determining whether wavelength-power curves corresponding to a continuous preset number of adjustment cycles are consistent; if it is determined that the wavelength-power curves corresponding to the continuous preset number of adjustment cycles are consistent, determining the wavelength-power curve corresponding to each adjustment cycle when the wavelength-power curves are consistent as the target wavelength-power curve; It is determined whether the target wavelength-power curve indicates that the incident waveguide device is coupled to the light entrance.

[0019] As an optional embodiment, in the second aspect of the present invention, the specific manner in which the adjustment judgment module adjusts the wavelength of the incident laser in the incident waveguide device from the first wavelength to the second wavelength in each adjustment period includes: In each adjustment cycle, at each preset time interval, the wavelength of the incident laser in the incident waveguide device is increased by a preset wavelength increment, so that the wavelength of the incident laser changes from a first wavelength to a second wavelength; Furthermore, the adjustment judgment module judges whether the target wavelength-power curve represents a specific manner in which the incident waveguide device is coupled to the light inlet, including: It is determined whether the target wavelength-power curve is a straight line parallel to the horizontal axis. If the target wavelength-power curve is a straight line parallel to the horizontal axis, it is determined that the incident waveguide device is coupled to the light entrance.

[0020] As an optional embodiment, in the second aspect of the present invention, the first adjustment planning module determines a specific manner of adjusting the first position of the first adjustment device according to the output laser power change information, including: The target incident laser wavelength corresponding to the maximum incident laser power is determined according to the emitted laser power change information, and the rotation direction and rotation angle corresponding to the first adjustment device are determined according to the wavelength value of the target incident laser wavelength.

[0021] A third aspect of the present invention discloses a system for implementing rapid optical coupling testing of silicon photonic chips, the system comprising: a memory storing executable program code; a processor coupled to the memory; The processor calls the executable program code stored in the memory to execute the method for implementing rapid optical coupling testing of silicon photonic chips disclosed in the first aspect of the present invention.

[0022] The fourth aspect of the present invention discloses a computer storage medium, which stores computer instructions. When the computer instructions are called, they are used to execute the method for implementing rapid optical coupling testing of silicon photonic chips disclosed in the first aspect of the present invention.

[0023] Compared with the prior art, the method for implementing rapid optical coupling testing of silicon photonic chips of the present invention can periodically adjust the wavelength of the incident laser in the incident waveguide device after the incident waveguide device and the output waveguide device are respectively roughly matched with the target silicon photonic chip, and obtain the output laser power change information in the output waveguide device when the incident laser wavelength changes periodically. The output laser power change information can be used to determine whether the coupling is successful, and can also be used to analyze and obtain a first position adjustment plan, so that the correct adjustment direction can be found without continuous trial and error. Therefore, it has a faster coupling speed and reduces the time required for optical coupling testing of silicon photonic chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 This is a flow chart of a method for implementing rapid optical coupling testing of a silicon photonic chip disclosed in an embodiment of the present invention; Figure 2 This is a schematic structural diagram of a device for implementing optical coupling testing of a silicon photonic chip disclosed in an embodiment of the present invention; Figure 3 Schematic diagram of another device for implementing optical coupling testing of a silicon photonic chip disclosed in an embodiment of the present invention; Figure 4 This is a schematic structural diagram of another device for implementing optical coupling testing of a silicon photonic chip disclosed in an embodiment of the present invention; Figure 5 This is a structural diagram of a silicon photonic chip fast optical coupling test implementation system disclosed in an embodiment of the present invention. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0027] The terms "first," "second," and so on, in the description and claims of the present invention and the accompanying drawings are used to distinguish between different items, not to describe a specific order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, apparatus, product, or end comprising a series of steps or elements is not limited to the listed steps or elements but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or end.

[0028] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute a separate or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0029] The present invention discloses a method and system for implementing a rapid optical coupling test of a silicon photonic chip, and a storage medium, which are used to reduce the optical coupling test time of the silicon photonic chip.

[0030] Example 1 See also Figure 1 , Figure 1 This is a flow chart of a method for implementing a rapid optical coupling test of a silicon photonic chip disclosed in an embodiment of the present invention. Figure 1The method for implementing the fast optical coupling test of silicon photonic chips described above can be used in a device for implementing the optical coupling test of silicon photonic chips, and the device for implementing the optical coupling test of silicon photonic chips can be integrated in a cloud server or a local server. Figure 1 As shown, the method for implementing the rapid optical coupling test of a silicon photonic chip may include the following operations: Step 101: A first adjustment device roughly matches an incident waveguide device with a light inlet on a target silicon photonic chip; a second adjustment device roughly matches an output waveguide device with a light outlet on the target silicon photonic chip.

[0031] In an embodiment of the present invention, a waveguide device is a structure or device that can guide the propagation of electromagnetic waves. It confines electromagnetic waves within a certain path through specific material and shape design to achieve efficient transmission. In this embodiment, the waveguide device may include a hollow metal waveguide tube, a surface waveguide, a dielectric waveguide, an optical fiber, etc.

[0032] The method for implementing rapid optical coupling testing of silicon photonic chips in this embodiment relies on an optical coupling test platform. The optical coupling test platform includes at least a first adjustment device capable of adjusting the position of an incident waveguide device and a second adjustment device capable of adjusting the position of an output waveguide device. The incident waveguide device is used to couple with the light inlet on the target silicon photonic chip, and the output waveguide device is used to couple with the light outlet on the target silicon photonic chip, so that the incident waveguide device, the target silicon photonic chip, and the output waveguide device form a test optical path, thereby performing an optical coupling test on a tested optical path in the target silicon photonic chip. Because the optical coupling process requires very high precision, a rough matching is generally required first. For example, the coupling position coordinates are recorded based on the coupling process of similar products, and then a rough matching is achieved based on the coupling position coordinates. Alternatively, the incident waveguide device and the light inlet can be identified using a visual sensor such as a camera, and then a rough matching solution is determined based on the visual sensor identification results. Alternatively, a theoretical rough matching solution can be calculated based on the design drawings of the silicon photonic chip. After completing the rough matching, the coupling of the incident waveguide device with the light entrance on the target silicon photonic chip, and the coupling of the output waveguide device with the light exit on the target silicon photonic chip cannot be achieved. Further more precise matching is required to find the accurate incident coupling position of the incident waveguide device.

[0033] Step 102, adjustment judgment step: periodically adjust the incident laser wavelength in the incident waveguide device, obtain the output laser power change information in the output waveguide device when the incident laser wavelength changes periodically, and judge whether the output laser power change information indicates that the incident waveguide device is coupled with the light entrance.

[0034] In this embodiment, the adjustment and determination step is a continuously fine-tuning feedback control step. Specifically, by periodically changing the wavelength of the incident laser light, the power change of the outgoing laser light can be measured. The present invention has discovered that during fine-tuning of the coupling position, approximate coupling is generally achieved, requiring only slight angle adjustments. However, the refractive index of light of different wavelengths in the medium is different. This results in different directions of the incident laser light when using laser light of different wavelengths, and thus different powers of the final outgoing laser light. When the incident waveguide device is fully coupled to the light inlet, laser light of different wavelengths can be coupled, and the power of the outgoing laser light does not vary with wavelength. However, when the incident waveguide device is not fully coupled to the light inlet, most laser light wavelengths cannot be coupled, and only a small number of laser light wavelengths can be coupled to a certain extent, resulting in higher power of the outgoing laser light in certain wavelength segments. Therefore, the present invention measures the position deviation of the incident waveguide device by periodically adjusting the wavelength of the incident laser light in the incident waveguide device.

[0035] Step 103: If it is determined that the output laser power change information indicates that the incident waveguide device is not coupled to the light inlet, a first position adjustment scheme of the first adjustment device is determined based on the output laser power change information; the first adjustment device adjusts the position of the incident waveguide device according to the first position adjustment scheme, and re-triggers the execution of the adjustment judgment step.

[0036] In this embodiment, Figure 1 As shown, step 103 and step 102 constitute a loop feedback adjustment step. In an optional embodiment, determining whether the output laser power change information indicates that the incident waveguide device is coupled with the light entrance may include: The output laser power variation information is input into a pre-trained wavelength-position analysis model. This wavelength-position analysis model is trained using a series of training data, wherein the training data includes standard output laser power variation information and the position deviation corresponding to each standard output laser power variation information. Because embodiments of the present invention can measure the position deviation of the input waveguide device by periodically adjusting the wavelength of the incident laser in the input waveguide device, the wavelength-position analysis model can be used to obtain position deviation information based on the input output laser power variation information, then determine whether coupling is successful based on the position deviation information, and obtain a first position adjustment solution based on the position deviation information.

[0037] The optical coupling fine-tuning process in the prior art often uses trial and error or a ramp-up algorithm to find the optimal coupling position, but it is unable to find the correct adjustment direction during the adjustment process, resulting in a long coupling time. The embodiments of the present invention can analyze the change information of the output laser power to obtain a subsequent adjustment solution, thereby eliminating the need for trial and error to find the correct adjustment direction, thereby achieving a faster coupling speed.

[0038] Step 104: If it is determined that the output laser power variation information indicates that the incident waveguide device is coupled with the light entrance, the position of the incident waveguide device in the current state is determined to be the incident coupling position.

[0039] In this embodiment, during the optical coupling test of the silicon photonic chip, it is necessary to ensure that the input waveguide device is coupled to the light inlet in order to perform the subsequent optical coupling test steps. However, the coupling requirements for the output waveguide device and the light outlet are lower. For optical coupling tests with low precision requirements, the output waveguide device and the light outlet do not need to be fully coupled. Therefore, it is only necessary to determine the input coupling position between the input and output waveguide devices and the light inlet to perform the optical coupling test of the silicon photonic chip. In addition, in some optional embodiments, the input waveguide device can be a more precise input light, and the output waveguide device can be set as another waveguide device capable of receiving the output laser from the light outlet. The waveguide device only needs to receive most of the output laser.

[0040] It can be seen that the method for implementing the rapid optical coupling test of silicon photonic chips in an embodiment of the present invention can periodically adjust the wavelength of the incident laser in the incident waveguide device after the incident waveguide device and the output waveguide device are respectively roughly matched with the target silicon photonic chip, and obtain the output laser power change information in the output waveguide device when the incident laser wavelength changes periodically. The output laser power change information can determine whether the coupling is successful, and can also be used to analyze and obtain the first position adjustment plan, so that the correct adjustment direction can be found through continuous trial and error, thereby having a faster coupling speed and reducing the time required for the optical coupling test of the silicon photonic chip.

[0041] In an optional embodiment, for some optical coupling tests requiring high precision, the output waveguide device and the light outlet must also be strictly coupled. In this case, a coupling operation between the output waveguide device and the light outlet is also required. In this optional embodiment, if the optical path currently being tested on the target silicon photonic chip is a reversible optical path, indicating that the laser can be transmitted in the reverse direction within the optical path, the input waveguide device can be changed to the laser receiver and the output waveguide device to the laser transmitter, thereby reversing the laser light flow. The output waveguide device and the light outlet are then coupled using the same principle as the coupling process between the input waveguide device and the light inlet.

[0042] Specifically, in this optional embodiment, after determining the incoupling position of the input and output waveguide device, the method may further include: Turn off the laser in the incident waveguide device and control the output waveguide device to emit a test laser; a reverse adjustment determination step of periodically adjusting the test laser wavelength in the output waveguide device, obtaining reverse output laser power change information in the input waveguide device when the test laser wavelength periodically changes, and determining whether the reverse output laser power change information indicates that the output waveguide device is coupled to the light output; If it is determined that the reverse output laser power change information indicates that the output waveguide device is not coupled to the light outlet, a second position adjustment scheme of the second adjustment device is determined based on the reverse output laser power change information; the second adjustment device adjusts the position of the output waveguide device according to the second position adjustment scheme, and re-triggers the reverse adjustment determination step; If it is determined that the reverse output laser power change information indicates that the output waveguide device is coupled with the light output, the position of the output waveguide device in the current state is determined to be the output coupling position.

[0043] In this optional embodiment, after achieving coupling between the incident waveguide device and the light inlet, for a reversible light path, it is only necessary to reverse the laser direction, periodically adjust the test laser wavelength in the output waveguide device, obtain the reverse output laser power change information in the incident waveguide device when the test laser wavelength changes periodically, and couple the output waveguide device according to the coupling principle of the incident waveguide device, thereby achieving coupling between the output waveguide device and the light outlet, thereby providing support for high-precision optical coupling testing.

[0044] In yet another optional embodiment, if the optical path currently being tested on the target silicon photonic chip is an irreversible optical path, then the solution for adjusting the laser direction in the above optional embodiment is difficult to apply. Therefore, in this optional embodiment, if the optical path currently being tested on the target silicon photonic chip is an irreversible optical path, then after determining the incoupling position of the input and output waveguide device, the method may further include: The wavelength of the incident laser in the incident waveguide device is fixed, and the second adjustment device adjusts the position of the output waveguide device multiple times according to a preset position adjustment scheme, and obtains the output laser power in the output waveguide device when the output waveguide device is at different positions; A target output laser power with the largest power is screened out from a plurality of output laser powers, and a position of an output waveguide device corresponding to the target output laser power is determined as an output coupling position.

[0045] In this optional embodiment, the preset position adjustment scheme can involve the second adjustment device scanning within a preset cone angle around the current position, or it can involve traversing a number of positions around the current position that are randomly generated based on the current position of the second adjustment device. Furthermore, a hill climbing algorithm can be employed with an additional feedback step to locate the position of maximum power. This optional embodiment enables coupling between the output waveguide device and the light outlet, thereby supporting high-precision optical coupling testing.

[0046] In yet another optional embodiment, the method may further include: The first adjustment device adjusts the incident waveguide device to the incident coupling position, and the second adjustment device adjusts the output waveguide device to the output coupling position, so that the incident waveguide device, the target silicon photonic chip and the output waveguide device form a test optical path, and the target silicon photonic chip is optically coupled based on the test optical path.

[0047] Further optionally, after the test of the current test optical path is completed, the next optical path to be tested in the silicon photonic chip is selected, and the above operations in the embodiment of the present invention are repeated, and finally the test of all optical paths on the entire silicon photonic chip is quickly realized.

[0048] In another optional embodiment, the adjustment determination step specifically includes: During each adjustment cycle, the wavelength of the incident laser light in the input waveguide device is adjusted from a first wavelength to a second wavelength. Optionally, the wavelength of the incident laser light in the input waveguide device may be increased by a preset wavelength increment at each preset time interval within each adjustment cycle, thereby changing the wavelength of the incident laser light from the first wavelength to the second wavelength. For example, the wavelength of the incident laser light in the input waveguide device may be gradually adjusted from infrared light to ultraviolet light, and the wavelength of the incident laser light may be increased at a fixed interval within each cycle. After the current adjustment cycle ends, the wavelength change operation is repeated in the next adjustment cycle. During each adjustment cycle, information on the change in output laser power in the output waveguide device is obtained during the change in the wavelength of the incident laser light from the first wavelength to the second wavelength. Thus, each wavelength within each adjustment cycle corresponds to an output laser power.

[0049] For each adjustment period, a wavelength-power curve is fitted based on the output laser power change information in the output waveguide device during the adjustment period, wherein the wavelength-power curve is used to represent the corresponding relationship between the incident laser wavelength and the output laser power.

[0050] A determination is made as to whether the wavelength-power curves corresponding to a predetermined number of consecutive adjustment cycles are consistent. If the wavelength-power curves corresponding to the predetermined number of consecutive adjustment cycles are determined to be consistent, the wavelength-power curve corresponding to each adjustment cycle when the wavelength-power curves remain consistent is determined to be the target wavelength-power curve. In this optional embodiment, because the position of the input waveguide device continuously changes during feedback adjustment, the measured output laser power is only meaningful when the position of the input waveguide device stably reaches the next position. In this optional embodiment, if the wavelength-power curves corresponding to the predetermined number of consecutive adjustment cycles are determined to be consistent, it indicates that the input waveguide device has stably reached the next position, and the wavelength-power curve at this time is a stable wavelength-power curve, which is meaningful for guidance.

[0051] Determine whether the target wavelength-power curve indicates that the incident waveguide device is coupled to the light inlet. In this optional embodiment, when the incident waveguide device is fully coupled to the light inlet, incident laser light of any wavelength can pass through the optical path, so the target wavelength-power curve is a straight line parallel to the horizontal axis. However, in some special cases, the optical path has a large loss for some wavelengths of light, while other wavelengths of light can pass through with lower loss. In this case, the target wavelength-power curve has a fixed shape, which can be measured and saved in advance. Once the target wavelength-power curve conforms to this curve trend, it is determined that the incident waveguide device is coupled to the light inlet.

[0052] It can be seen that in this optional embodiment, the principle that lasers of different wavelengths (colors) have different refractive indices in the medium is utilized, and the continuous probing of the position of the incident laser waveguide device is replaced by adjusting the wavelength of the incident laser, thereby greatly improving the efficiency of the optical coupling test and saving the coupling test time.

[0053] Furthermore, the aforementioned wavelength-position analysis model is already capable of determining the first position adjustment solution. In an optional embodiment, a target wavelength-power curve can also be input into the wavelength-position analysis model. In this case, the wavelength-position analysis model is trained using a series of training data, wherein the training data includes standard wavelength-power curves and the position deviations corresponding to each standard wavelength-power curve. Therefore, the wavelength-position analysis model can be used to obtain position deviation information based on the input wavelength-power curve, and then determine whether coupling is successful based on the position deviation information, and then obtain the first position adjustment solution based on the position deviation information.

[0054] In a preferred embodiment, determining the first position adjustment scheme of the first adjustment device according to the output laser power change information may include: The target incident laser wavelength corresponding to the maximum output laser power is determined according to the output laser power change information, and the rotation direction and rotation angle corresponding to the first adjustment device are determined according to the wavelength value of the target incident laser wavelength.

[0055] In this preferred embodiment, when the outgoing laser power is at its maximum, it indicates that the incident angle of the corresponding target incident laser wavelength is closest to the angle at which coupling is successful. The distribution of the target incident laser wavelength between the first and second wavelengths can then reflect the adjustment scheme corresponding to the first adjustment device. Therefore, alternative adjustment schemes corresponding to each wavelength can be pre-recorded. When any wavelength becomes the target laser wavelength, its corresponding adjustment scheme is selected as the first position adjustment scheme. This preferred embodiment can more efficiently and quickly determine the first position adjustment scheme, thereby further improving the efficiency of optical coupling testing.

[0056] Example 2 See also Figure 2 , Figure 2 This is a schematic diagram of the structure of a device for implementing optical coupling testing of a silicon photonic chip disclosed in an embodiment of the present invention. Figure 2 As shown, the silicon photonic chip optical coupling test implementation device may include: A first adjustment device 201 is used to roughly match the incident waveguide device with the light entrance on the target silicon photonic chip; A second adjustment device 202 is used to roughly match the output waveguide device with the light outlet on the target silicon photonic chip; An adjustment determination module 203 is configured to execute an adjustment determination step, which may include: periodically adjusting the wavelength of the incident laser in the incident waveguide device, obtaining output laser power change information in the output waveguide device when the incident laser wavelength periodically changes, and determining whether the output laser power change information indicates that the incident waveguide device is coupled to the light inlet; A first adjustment planning module 204 is configured to determine a first position adjustment scheme for the first adjustment device based on the output laser power variation information when it is determined that the output laser power variation information indicates that the incident waveguide device is not coupled to the light inlet; The first adjustment device 201 is further configured to adjust the position of the incident waveguide device according to the first position adjustment scheme, and re-trigger the adjustment judgment module to perform the adjustment judgment step; The first adjustment planning module 204 is further configured to determine the position of the incident waveguide device in the current state as the incident coupling position when it is determined that the output laser power change information indicates that the incident waveguide device is coupled with the light entrance.

[0057] In an optional embodiment, if Figure 3 As shown, the device may also include: The optical path adjustment module 205 is configured to, when the optical path currently being tested on the target silicon photonic chip is a reversible optical path and after determining the incoupling position of the input and output waveguide devices, turn off the laser in the input waveguide device and control the output waveguide device to emit a test laser; a reverse adjustment determination module 206 configured to execute a reverse adjustment determination step, which may include: periodically adjusting the wavelength of the test laser in the output waveguide device, obtaining reverse output laser power change information in the input waveguide device when the test laser wavelength periodically changes, and determining whether the reverse output laser power change information indicates that the output waveguide device is coupled to the light output; The second adjustment planning module 207 is configured to determine a second position adjustment scheme for the second adjustment device based on the reverse output laser power variation information when it is determined that the reverse output laser power variation information indicates that the output waveguide device is not coupled to the light outlet; The second adjustment device 202 is further configured to adjust the position of the output waveguide device according to the second position adjustment scheme, and re-trigger the reverse adjustment judgment module to perform the reverse adjustment judgment step; The second adjustment planning module 207 is further configured to determine the position of the output waveguide device in the current state as the output coupling position when it is determined that the reverse output laser power change information indicates that the output waveguide device is coupled with the light outlet.

[0058] In another optional embodiment, Figure 4 As shown, the device may also include: The third adjustment planning module 208 is configured to, when the optical path currently being tested on the target silicon photonic chip is an irreversible optical path and after determining the incoupling position of the input and output waveguide devices, fix the wavelength of the incident laser in the input waveguide device, control the second adjustment device to adjust the position of the output waveguide device multiple times according to a preset position adjustment scheme, and obtain the output laser power in the output waveguide device when the output waveguide device is at different positions; The third adjustment planning module 208 is further configured to select a target output laser power with the largest power from the multiple output laser powers, and determine the output waveguide device position corresponding to the target output laser power as the output coupling position.

[0059] In another optional embodiment, the first adjustment device 201 is further used to adjust the input waveguide device to the input coupling position; the second adjustment device 202 is further used to adjust the output waveguide device to the output coupling position, so that the input waveguide device, the target silicon photonic chip, and the output waveguide device form a test light path; And, the device may further include: The coupling test module (not shown) is used to perform an optical coupling test on the target silicon photonic chip based on the test optical path.

[0060] In another optional embodiment, the specific manner in which the adjustment determination module 203 performs the adjustment determination step may include: In each adjustment cycle, adjusting the wavelength of the incident laser in the incident waveguide device from the first wavelength to the second wavelength, and obtaining information on a change in the power of the output laser in the output waveguide device during the process of the wavelength of the incident laser changing from the first wavelength to the second wavelength; For each adjustment period, a wavelength-power curve is obtained by fitting according to the output laser power change information in the output waveguide device during the adjustment period, wherein the wavelength-power curve is used to represent the corresponding relationship between the incident laser wavelength and the output laser power; Determining whether wavelength-power curves corresponding to a continuous preset number of adjustment cycles are consistent; if it is determined that the wavelength-power curves corresponding to the continuous preset number of adjustment cycles are consistent, determining the wavelength-power curve corresponding to each adjustment cycle when the wavelength-power curves are consistent as the target wavelength-power curve; It is determined whether the target wavelength-power curve indicates that the incident waveguide device is coupled to the light entrance.

[0061] In another optional embodiment, the specific manner in which the adjustment judgment module 203 adjusts the wavelength of the incident laser in the incident waveguide device from the first wavelength to the second wavelength in each adjustment period may include: In each adjustment cycle, at each preset time interval, the wavelength of the incident laser in the incident waveguide device is increased by a preset wavelength increment, so that the wavelength of the incident laser changes from a first wavelength to a second wavelength; Furthermore, the adjustment determination module 203 determines whether the target wavelength-power curve represents a specific manner in which the incident waveguide device is coupled with the light inlet, which may include: It is determined whether the target wavelength-power curve is a straight line parallel to the horizontal axis. If the target wavelength-power curve is a straight line parallel to the horizontal axis, it is determined that the incident waveguide device is coupled to the light entrance.

[0062] In another optional embodiment, the first adjustment planning module 204 determines a specific manner of adjusting the first position of the first adjustment device according to the output laser power variation information, which may include: The target incident laser wavelength corresponding to the maximum output laser power is determined according to the output laser power change information, and the rotation direction and rotation angle corresponding to the first adjustment device are determined according to the wavelength value of the target incident laser wavelength.

[0063] Example 3 See also Figure 5 , Figure 5 This is a schematic diagram of the structure of a silicon photonic chip fast optical coupling test implementation system disclosed in an embodiment of the present invention. Figure 5As shown, the silicon photonic chip fast optical coupling test implementation system may include: A memory 301 storing executable program code; a processor 302 coupled to the memory 301; The processor 302 calls the executable program code stored in the memory 301 to execute the steps of the method for implementing the rapid optical coupling test of a silicon photonic chip described in the first embodiment of the present invention.

[0064] Example 4 An embodiment of the present invention discloses a computer storage medium storing computer instructions. When the computer instructions are called, they are used to execute the steps of the method for implementing rapid optical coupling testing of silicon photonic chips described in the first embodiment of the present invention.

[0065] Example 5 An embodiment of the present invention discloses a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to enable a computer to execute the steps in the method for implementing rapid optical coupling testing of silicon photonic chips described in Example 1.

[0066] The device embodiments described above are merely illustrative, wherein the modules described as separate components may or may not be physically separate, and the components shown as modules may or may not be physical modules, i.e., they may be located in one place or distributed across multiple network modules. Some or all of the modules may be selected based on actual needs to achieve the objectives of the present embodiment. Those skilled in the art can understand and implement the present invention without inventive effort.

[0067] Through the detailed description of the above embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by means of software plus the necessary general hardware platform, or of course, by means of hardware. Based on this understanding, the essence of the above technical solution, or the portion that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as a read-only memory (ROM), a random access memory (RAM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), a one-time programmable read-only memory (OTPROM), an electronically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM), or other optical disk storage, magnetic disk storage, or magnetic tape storage, or any other computer-readable medium capable of carrying or storing data.

[0068] Finally, it should be noted that the method and system for implementing fast optical coupling testing of silicon photonic chips and the storage medium disclosed in the embodiments of the present invention are only preferred embodiments of the present invention, and are only used to illustrate the technical solutions of the present invention, rather than to limit them. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features therein can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A method for implementing rapid optical coupling testing of silicon photonic chips, characterized in that: The method comprises: The first adjustment device roughly matches the incident waveguide device with the light entrance on the target silicon photonic chip; the second adjustment device roughly matches the output waveguide device with the light exit on the target silicon photonic chip; an adjustment and judgment step of periodically adjusting the wavelength of the incident laser in the incident waveguide device, obtaining output laser power change information in the output waveguide device when the incident laser wavelength periodically changes, and judging whether the output laser power change information indicates that the incident waveguide device is coupled to the light entrance; If it is determined that the output laser power change information indicates that the incident waveguide device is not coupled to the light inlet, determining a first position adjustment scheme for the first adjustment device based on the output laser power change information; the first adjustment device adjusts the position of the incident waveguide device according to the first position adjustment scheme, and re-triggering the adjustment determination step; If it is determined that the output laser power change information indicates that the incident waveguide device is coupled with the light entrance, determining the position of the incident waveguide device in the current state as the incident coupling position; Furthermore, determining a first position adjustment scheme of the first adjustment device according to the output laser power change information includes: The target incident laser wavelength corresponding to the maximum incident laser power is determined according to the emitted laser power change information, and the rotation direction and rotation angle corresponding to the first adjustment device are determined according to the wavelength value of the target incident laser wavelength.

2. The method for implementing rapid optical coupling testing of silicon photonic chips according to claim 1, characterized in that: The method further comprises: Pre-record the preparation adjustment plan corresponding to each wavelength; Furthermore, determining the rotation direction and rotation angle corresponding to the first adjustment device according to the wavelength value of the target incident laser wavelength includes: The preliminary adjustment scheme corresponding to the target laser wavelength is selected as the first position adjustment scheme, thereby determining the rotation direction and rotation angle corresponding to the first adjustment device.

3. The method for implementing rapid optical coupling testing of silicon photonic chips according to claim 1, characterized in that: If the optical path currently being tested on the target silicon photonic chip is a reversible optical path, after determining the incoupling position of the incident waveguide device, the method further includes: Turn off the laser in the incident waveguide device and control the output waveguide device to emit a test laser; a reverse adjustment determination step of periodically adjusting the test laser wavelength in the output waveguide device, obtaining reverse output laser power change information in the input waveguide device when the test laser wavelength periodically changes, and determining whether the reverse output laser power change information indicates that the output waveguide device is coupled to the light exit; If it is determined that the reverse output laser power change information indicates that the output waveguide device is not coupled to the light outlet, determining a second position adjustment scheme for the second adjustment device based on the reverse output laser power change information; the second adjustment device adjusts the position of the output waveguide device according to the second position adjustment scheme, and re-triggering the reverse adjustment determination step; If it is determined that the reverse output laser power change information indicates that the output waveguide device is coupled with the light exit, the position of the output waveguide device in the current state is determined to be the output coupling position.

4. The method for implementing rapid optical coupling testing of silicon photonic chips according to claim 1, wherein: If the optical path currently being tested on the target silicon photonic chip is an irreversible optical path, after determining the incoupling position of the incident waveguide device, the method further includes: The wavelength of the incident laser in the incident waveguide device is fixed, and the second adjustment device adjusts the position of the output waveguide device multiple times according to a preset position adjustment scheme, and obtains the output laser power in the output waveguide device when the output waveguide device is at different positions; A target outgoing laser power with the largest power is screened out from the plurality of outgoing laser powers, and a position of the outgoing waveguide device corresponding to the target outgoing laser power is determined as an outgoing coupling position.

5. The method for implementing rapid optical coupling testing of silicon photonic chips according to any one of claims 3 or 4, characterized in that: The method further comprises: The first adjustment device adjusts the incident waveguide device to the incident coupling position, and the second adjustment device adjusts the output waveguide device to the output coupling position, so that the incident waveguide device, the target silicon photonic chip and the output waveguide device form a test optical path, and the target silicon photonic chip is optically coupled based on the test optical path.

6. The method for implementing rapid optical coupling testing of silicon photonic chips according to claim 1, characterized in that: The adjustment and judgment step specifically includes: In each adjustment cycle, adjusting the wavelength of the incident laser in the input waveguide device from a first wavelength to a second wavelength, and obtaining information on a change in the output laser power in the output waveguide device during the process of the incident laser wavelength changing from the first wavelength to the second wavelength; For each adjustment period, fitting a wavelength-power curve based on the output laser power change information in the output waveguide device during the adjustment period, wherein the wavelength-power curve is used to represent the corresponding relationship between the incident laser wavelength and the output laser power; Determining whether wavelength-power curves corresponding to a continuous preset number of adjustment cycles are consistent; if it is determined that the wavelength-power curves corresponding to the continuous preset number of adjustment cycles are consistent, determining the wavelength-power curve corresponding to each adjustment cycle when the wavelength-power curves are consistent as the target wavelength-power curve; It is determined whether the target wavelength-power curve indicates that the incident waveguide device is coupled to the light entrance.

7. The method for implementing rapid optical coupling testing of silicon photonic chips according to claim 6, characterized in that: The determining whether the target wavelength-power curve indicates that the incident waveguide device is coupled with the light entrance includes: determining whether a target wavelength-power curve conforms to a fixed-shape curve trend, and if it is determined that the target wavelength-power curve conforms to the fixed-shape curve trend, determining that the incident waveguide device is coupled to the light entrance; The fixed shape is a shape measured and saved in advance.

8. The method for implementing rapid optical coupling testing of silicon photonic chips according to claim 6, characterized in that: The step of adjusting the wavelength of the incident laser in the incident waveguide device from the first wavelength to the second wavelength in each adjustment period includes: In each adjustment cycle, at each preset time interval, the wavelength of the incident laser in the incident waveguide device is increased by a preset wavelength increment, so that the wavelength of the incident laser changes from a first wavelength to a second wavelength; Furthermore, determining whether the target wavelength-power curve indicates that the incident waveguide device is coupled with the light entrance includes: It is determined whether the target wavelength-power curve is a straight line parallel to the horizontal axis. If the target wavelength-power curve is a straight line parallel to the horizontal axis, it is determined that the incident waveguide device is coupled to the light entrance.

9. A silicon photonic chip fast optical coupling test implementation system, characterized in that: The system includes: a memory storing executable program code; a processor coupled to the memory; the processor calls the executable program code stored in the memory to execute the method for implementing rapid optical coupling testing of silicon photonic chips as described in any one of claims 1 to 8.

10. A computer storage medium, characterized in that The computer storage medium stores computer instructions, which, when called, are used to execute the method for implementing rapid optical coupling testing of silicon photonic chips as described in any one of claims 1 to 8.

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