An automated testing device for wafer chip manufacturing

Abstract

This invention discloses an automatic testing device for wafer chip production, relating to the field of photovoltaic panel support technology. The photovoltaic panel support device includes an outer sheath and an inner support column. An arc-shaped fixing column is fixedly connected to the top of the inner support column, and a fixing platform is fixedly connected to the top of the arc-shaped fixing column. An arc-shaped fixing block is fixedly connected to the side of the fixing platform. A spring is fixedly connected to the side of the inner support column, and a support foot is fixedly connected to one end of the spring. The support foot is rotatably connected to the inner support column. An arc-shaped push block is fixedly connected to the side of the support foot, and the arc-shaped push block is movably connected to a circular push block via a transmission component. The circular push block is movably connected to an automatic leveling component. In use, the photovoltaic panel support device, through the rotation of the first support foot, in conjunction with the second support foot, transmission component, circular push block, automatic leveling component, and flip-top component, makes the installation of the device more stable, improving the working and installation efficiency of the device.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, specifically to an automatic testing device for wafer chip production. Background Technology

[0002] A chip, also known as a microcircuit, microchip, or integrated circuit, refers to a silicon wafer containing integrated circuits. It is very small and is often part of a computer or other electronic device. Chips are a general term for semiconductor components and are the carriers of integrated circuits. They are made by dicing wafers. Currently, chips are widely used in the market due to their full functionality, convenience, and small size, which has accelerated social progress and made people's lives more convenient. However, because chips are small, they are very troublesome to manufacture, resulting in a large number of defective products after production. Before mounting the wafer chips on the PCB board, the chips need to be moved to a testing device for testing.

[0003] Chinese patent CN115775761B, authorized and published on September 22, 2023, discloses an automatic inspection device for wafer chip production. This device includes a inspection support, with a support rod connected above the support. An auxiliary inspection component is mounted above the support rod. The auxiliary inspection component includes an automatic feeding component, a placement component, a rotating component, an outer ring, and a discharging component. In the aforementioned application, after detecting a defective chip, the rotating component directly tilts all the chips on the turntable, discarding both good and defective products. This results in the waste of good products detected by the equipment and increases operating costs. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an automated inspection device for wafer chip manufacturing, solving the problems mentioned in the background section. To achieve the above objectives, this invention provides the following technical solution: an automated inspection device for wafer chip manufacturing, comprising:

[0005] The table has a chip turntable rotatably connected to its top, and a chip detector for detecting chips is movably connected above the chip turntable. A motor is rotatably connected below the chip turntable via a rotating shaft. The surface of the chip turntable has multiple chip slots, and a lifting plate is slidably connected inside each chip slot. A spring is fixedly connected between the bottom of each lifting plate and the chip slot, and a sliding rod is fixedly connected to the bottom of each lifting plate. Each sliding rod is slidably connected to the chip turntable via a sliding groove inside the chip turntable. An electric telescopic rod is fixedly connected to the bottom front side of the table, and a fixing ring is fixedly connected to the outside of the telescopic rod. A push block is movably connected above the fixing ring, and a hydraulic block is slidably connected above the push block. The hydraulic block is slidably connected to the exhaust vent via a transmission component and is fixedly connected to the table via a fixing frame. By setting up a lifting plate and an exhaust vent, defective chips detected by the chip detector can be lifted by the lifting plate and then directly sucked away by the exhaust vent. At the same time, the motor rotates the chip turntable, allowing multiple defective chips in the turntable to be individually removed, leaving only good chips. This ensures that the good products detected by the equipment are not wasted and improves the equipment's working efficiency.

[0006] Preferably, the transmission component includes a first hose, a second hydraulic block, and a second pusher block. One end of the first hose is fixedly connected to the side of the first hydraulic block, and the other end of the first hose is fixedly connected to the second hydraulic block. The second pusher block is slidably connected to the bottom of the second hydraulic block, and an exhaust port is fixedly connected to the bottom of the second pusher block.

[0007] Preferably, a feeding device is movably connected to the rear side of the platform, a discharging device is movably connected to the right side of the platform, a feeding pickup device is movably connected above the feeding device, and a discharging pickup device is movably connected above the discharging device.

[0008] Preferably, there are twelve chip slots, each chip slot is distributed circumferentially about the center of the chip turntable, there are twelve lifting plates, each lifting plate is distributed circumferentially about the center of the chip turntable, the size of the slot at the bottom of the exhaust port is the same as the size of the chip slot, and an exhaust fan switch assembly is fixedly connected to the front side of the exhaust port.

[0009] Preferably, the exhaust fan switch assembly includes a switch box, a circular switch, a rotating shaft, a gear, a rack, a hydraulic block, a hose, a waste pipe, and a negative pressure exhaust fan. The waste pipe is fixedly connected to the front side of the exhaust port, and the negative pressure exhaust fan is fixedly connected to the outer middle of the waste pipe. The switch box is fixedly connected to the top of the negative pressure exhaust fan. The inside of the switch box is rotatably connected to the circular switch via the rotating shaft. The gear is fixedly connected to the front side of the rotating shaft. The hydraulic block is fixedly connected to the top of the negative pressure exhaust fan. The rack is slidably connected to the right side of the hydraulic block, and the rack meshes with the gear. The top of the hydraulic block is fixedly connected to one end of the hose, and the other end of the hose is fixedly connected to the outer side of the hydraulic block. A waste agitator is movably connected to the bottom of the waste pipe. By setting the exhaust fan switch assembly, when the chip turntable rotates to the position where the exhaust port corresponds to the fertilizer, the negative pressure exhaust fan is activated, causing defective chips to be drawn away. This allows the equipment to individually remove detected defective products, thus preventing waste of good products and saving costs.

[0010] Preferably, the inner diameter of the waste pipe is larger than the size of the chip slot, and the rack is slidably connected to the negative pressure exhaust fan through a groove on the surface of the negative pressure exhaust fan.

[0011] Preferably, the interior of the second hose is in communication with the interior of the third hydraulic block.

[0012] Preferably, the waste agitation assembly includes a hose three, a hydraulic block four, a rack two, a gear two, a rotating shaft two, an agitation plate, a waste box, and a waste outlet. One end of the hose three is fixedly connected to the outer side of the hydraulic block one, and the other end of the hose three is fixedly connected to the left side of the hydraulic block four. The rack two is slidably connected to the right side of the hydraulic block four. The bottom of the waste tube is fixedly connected to the waste outlet, and a waste box is disposed below the waste outlet. The bottom of the waste box is rotatably connected to the rotating shaft two, and the top of the rotating shaft two is fixedly connected to the agitation plate. A gear two is fixedly connected between the agitation plate and the bottom of the rotating shaft two, and the gear two meshes with the rack two. The bottom of the hydraulic block four is fixedly connected to the waste box. By configuring the waste agitation assembly, defective chips will not accumulate when falling from the waste tube into the waste box, thereby maximizing the utilization of the space inside the waste box, allowing the waste box to receive more defective chips, thus extending the continuous working time of the equipment and improving its working efficiency.

[0013] Preferably, the length of the agitator is less than the width of the waste box, and the center of the bottom surface of the waste outlet is coaxial with the center of the second rotating shaft.

[0014] Preferably, the interior of the third hose is connected to the interior of the fourth hydraulic block, and the interior of the third hose is connected to the interior of the first hydraulic block.

[0015] This invention provides an automatic inspection device for wafer chip manufacturing. It has the following advantages:

[0016] This automatic inspection device for wafer chip production operates by detecting multiple chips on a turntable. When a defective chip is detected, the turntable rotates 90 degrees. In conjunction with a lifting plate, spring, slide bar, electric telescopic rod, fixing ring, push block one, hydraulic block one, hose one, hydraulic block two, and push block two, the exhaust port comes into contact with the lifting plate, causing the defective chip to be removed. This allows the equipment to individually reject defective chips.

[0017] This automatic testing device for wafer chip production uses an electric telescopic rod that extends during use, compressing hydraulic block two. This, along with hose two, switch box, circular switch, rotating shaft one, gear one, rack one, hydraulic block three, and waste pipe, activates a negative pressure exhaust fan. This causes defective chips to be drawn away along the waste pipe. The device also controls the start and stop of the negative pressure exhaust fan when removing defective chips, preventing excessive airflow from sucking away good chips.

[0018] This automatic testing device for wafer chip production uses an electric telescopic rod that extends during use, compressing hydraulic block one. Excess pressure in hydraulic block one is then transmitted to hydraulic block four through hose three. This, in conjunction with rack two, gear two, and rotating shaft two, causes the agitator plate to rotate, alleviating the accumulation of defective chips in the waste box, improving the space utilization of the waste box, and extending the continuous working time of the equipment. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the overall appearance of the present invention;

[0020] Figure 2 This is a schematic diagram of the overall cross-sectional three-dimensional structure of the present invention;

[0021] Figure 3 For the present invention Figure 2 Enlarged structural diagram at point A in the middle;

[0022] Figure 4 For the present invention Figure 2 Enlarged structural diagram at point B;

[0023] Figure 5 This is a three-dimensional structural schematic diagram of the exhaust fan switch assembly of the present invention;

[0024] Figure 6 For the present invention Figure 5 Enlarged structural diagram at point C;

[0025] Figure 7This is a three-dimensional structural diagram of the waste agitation component of the present invention;

[0026] Figure 8 For the present invention Figure 7 Enlarged structural diagram at point D.

[0027] In the picture:

[0028] 100. Tabletop; 200. Feeding equipment; 300. Discharging equipment; 400. Feeding and picking equipment; 500. Discharging and picking equipment; 600. Chip detector; 700. Chip turntable; 800. Motor;

[0029] 901. Slide rod; 902. Spring; 903. Lifting plate; 904. Chip slot; 905. Electric telescopic rod; 906. Fixing ring; 907. Push block one; 908. Hydraulic block one; 909. Hoses one; 910. Hydraulic block two; 911. Push block two; 912. Exhaust vent; 913. Fixing frame;

[0030] 1000. Exhaust fan switch assembly; 1001. Switch box; 1002. Circular switch; 1003. Rotating shaft one; 1004. Gear one; 1005. Rack one; 1006. Hydraulic block three; 1007. Hose two; 1008. Waste pipe; 1009. Negative pressure exhaust fan

[0031] 1100. Waste agitator assembly; 1101. Hoses III; 1102. Hydraulic block IV; 1103. Rack II; 1104. Gear II; 1105. Shaft II; 1106. Agitator plate; 1107. Waste box; 1108. Waste outlet. Detailed Implementation

[0032] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0033] Example 1, please refer to Figures 1-4 An automatic testing device for wafer chip manufacturing, comprising:

[0034] A table 100 has a chip turntable 700 rotatably connected above it. The chip turntable 700 allows the feeding and picking device 400 to feed multiple chips into it, preparing for subsequent chip inspection. A chip detector 600 is movably connected above the chip turntable 700, enabling the identification of both good and defective chips on the turntable 700. An electrical circuit is rotatably connected below the chip turntable 700 via a rotating shaft. The machine 800 and the table 100 are movably connected to the rear side of the feeding device 200. The feeding device 200 is set up so that the finished chips are sent to the top of the chip turntable 700. The table 100 is movably connected to the right side of the discharging device 300 so that the good chips are transferred out from the discharging device 300. The feeding device 200 is movably connected to the top of the feeding device 200 and the discharging device 300 is movably connected to the top of the discharging device 500.The chip turntable 700 has multiple chip slots 904 on its surface. These slots allow the chip pick-up device 400 to place the chip into the slot 904 and fix it within, facilitating subsequent chip inspection. There are twelve chip slots 904, distributed circumferentially around the center of the chip turntable 700. There are also twelve lifting plates 903, also distributed circumferentially around the center of the chip turntable 700. The size of the slot at the bottom of the exhaust vent 912 is related to the chip size. All slots 904 are the same size. An exhaust fan switch assembly 1000 is fixedly connected to the front of the exhaust vent 912. A lifting plate 903 is slidably connected inside each chip slot 904. A spring 902 is fixedly connected between the bottom of each lifting plate 903 and the chip slot 904. A sliding rod 901 is fixedly connected to the bottom of each lifting plate 903. Each sliding rod 901 is slidably connected to the chip turntable 700 via a groove inside the turntable 700. An electric telescopic rod 905 is fixedly connected to the bottom front of the tabletop 100. A fixing ring 906 is fixedly connected to the outer side of the telescopic rod. A push block 907 is movably connected above the fixing ring 906. A hydraulic block 908 is slidably connected above the push block 907. The hydraulic block 908 is slidably connected to the exhaust port 912 via a transmission component. The transmission component includes a hose 909, a hydraulic block 910, and a push block 911. One end of the hose 909 is fixedly connected to the side of the hydraulic block 908, and the other end of the hose 909 is fixedly connected to the hydraulic block 910. A push block 911 is slidably connected to the bottom of the hydraulic block 910. 1. The bottom of push block 2 911 is fixedly connected to an exhaust vent 912. Hydraulic block 1 908 is fixedly connected to the table 100 via a fixing bracket 913. A lifting plate 903 and an exhaust vent 912 are provided so that defective chips detected by the chip detector 600 can be lifted by the lifting plate 903 and then directly sucked away by the exhaust vent 912. At the same time, the motor 800 rotates the chip turntable 700, allowing multiple defective chips in the chip turntable 700 to be individually rejected, leaving only good chips. This ensures that good products detected by the equipment are not wasted and improves the equipment's working efficiency.

[0035] In use, when the chip detector 600 detects a defective chip among multiple chips on the chip turntable 700, the chip turntable 700 rotates 90 degrees counterclockwise. Simultaneously, the motor 800 starts, aligning the chip slot 904 corresponding to the defective chip on the chip turntable 700 with the electric telescopic rod 905. At this point, the electric telescopic rod 905 is activated, extending upwards and causing the sliding rod 901 to move upwards. This causes the lifting plate 903 to move the defective chip upwards. Simultaneously, the fixing ring 906 is activated by the electric telescopic rod. Driven by the retraction rod 905, the push block 907 moves upward, compressing the hydraulic block 908. The internal pressure of the hydraulic block 908 is transmitted to the hydraulic block 910 through the hose 909, compressing the hydraulic block 910. This causes the push block 911 to move downward, moving the exhaust port 912 downward until it is in contact with the lifting plate 903. This allows defective chips to be removed from the chip turntable 700 through the exhaust port 912, thus preserving good chips and saving costs.

[0036] Example 2, please refer to Figures 1-6Based on Embodiment 1, the exhaust fan switch assembly 1000 includes a switch box 1001, a circular switch 1002, a rotating shaft 1003, a gear 1004, a rack 1005, a hydraulic block 1006, a flexible hose 1007, a waste pipe 1008, and a negative pressure exhaust fan 1009. The waste pipe 1008 is fixedly connected to the front side of the exhaust port 912, and the negative pressure exhaust fan 1009 is fixedly connected to the outer middle of the waste pipe 1008. The negative pressure exhaust fan 1009 is configured to remove defective chips from the chip slot 904. The top of the negative pressure exhaust fan 1009 is fixedly connected to a switch box 1001. Inside the switch box 1001, a circular switch 1002 is rotatably connected to a rotating shaft 1003. The circular switch 1002 allows the start and stop of the negative pressure exhaust fan 1009 to be controlled, saving energy. A gear 1004 is fixedly connected to the front side of the rotating shaft 1003. A hydraulic block 1006 is fixedly connected to the top of the negative pressure exhaust fan 1009. A rack 1005 is slidably connected to the right side of the hydraulic block 1006. The rack 1005... Gear 1004 meshes; the top of hydraulic block 3 1006 is fixedly connected to one end of hose 2 1007; the other end of hose 2 1007 is fixedly connected to the outside of hydraulic block 2 910; the interior of hose 2 1007 communicates with the interior of hydraulic block 3 1006; the interior of hose 2 1007 communicates with the interior of hydraulic block 2 910; a waste agitator 1100 is movably connected to the bottom of waste pipe 1008; the waste pipe 1008 is configured to allow defective chips to be drawn out along the direction of waste pipe 1008 to the subsequent waste agitator. Within 1100, the inner diameter of the waste pipe 1008 is larger than the size of the chip slot 904. The rack 1005 is slidably connected to the negative pressure exhaust fan 1009 through a groove on the surface of the negative pressure exhaust fan 1009. An exhaust fan switch assembly 1000 is set up so that when the chip turntable 700 rotates to the position corresponding to the exhaust port 912 and the defective chip, the negative pressure exhaust fan 1009 is activated, so that the defective chip is extracted. This allows the equipment to remove the detected defective products separately, so that the good products produced are not wasted and costs are saved.

[0037] In use, based on Example 1, hydraulic block 908 is compressed. At this time, the electric telescopic rod 905 is activated to extend upward, so that the excess pressure inside hydraulic block 908 is transmitted to the inside of hydraulic block 910 through hose 909. The excess pressure inside hydraulic block 910 is transmitted to the inside of hydraulic block 1006 through hose 1007, so that hydraulic block 1006 is compressed. This causes rack 1005 to be pushed to the right, causing gear 1004 to rotate, causing shaft 1003 to rotate, and opening the circular switch 1002 in switch box 1001. This activates the negative pressure exhaust fan 1009, so that defective chips are removed along the direction of exhaust port 912 and waste pipe 1008. This allows the equipment to remove defective chips that have been detected separately, so that good products are not wasted and costs are saved.

[0038] Example 3, please refer to Figures 1-8 Based on Embodiments 1 and 2, the waste agitation assembly 1100 includes a hose 3 1101, a hydraulic block 4 1102, a rack 2 1103, a gear 2 1104, a rotating shaft 2 1105, an agitation plate 1106, a waste box 1107, and a waste outlet 1108. One end of the hose 3 1101 is fixedly connected to the outside of the hydraulic block 1 908, and the other end of the hose 3 1101 is fixedly connected to the left side of the hydraulic block 4 1102. The interior of the hose 3 1101 communicates with the interior of the hydraulic block 4 1102 and the interior of the hydraulic block 1 908. The rack 2 1103 is slidably connected to the right side of the hydraulic block 4 1102. The waste outlet 1108 is fixedly connected to the bottom of the waste pipe 1008. The waste box 1107 is located below the waste outlet 1108, and the rotating shaft 2 1105 is rotatably connected to the bottom of the waste box 1107. A stirring plate 1106 is fixedly connected to the top of the rotating shaft 1105. The stirring plate 1106 is set to make the defective chips more evenly distributed in the waste box 1107. The length of the stirring plate 1106 is less than the width of the waste box 1107. The center of the bottom surface of the waste outlet 1108 is coaxial with the center of the rotating shaft 1105. A gear 1104 is fixedly connected between the stirring plate 1106 and the bottom of the rotating shaft 1105. The gear 1104 meshes with the rack 1103. The bottom of the hydraulic block 1102 is fixedly connected to the waste box 1107. A waste stirring assembly 1100 is set to prevent defective chips from piling up when they fall from the waste pipe 1008 into the waste box 1107. This maximizes the use of space in the waste box 1107, allowing the waste box 1107 to receive more defective chips, thereby extending the continuous working time of the equipment and improving the working efficiency of the equipment.

[0039] In use, based on Embodiment 1 and Embodiment 2, hydraulic block 908 is compressed. At this time, the electric telescopic rod 905 is activated to extend upward, so that the excess pressure inside hydraulic block 908 is transmitted to hydraulic block 1102 through hose 1101, compressing hydraulic block 1102, causing rack 1103 to slide to the right, rotating gear 1104, rotating shaft 1105, and rotating agitator 1106. This agitates the defective chips accumulated in waste box 1107, reducing the accumulation of defective waste as it falls from waste outlet 1108 into waste box 1107. This ensures that defective chips are evenly filled at the bottom of waste box 1107, improving the space utilization rate of waste box 1107, allowing waste box 1107 to receive more defective chips, extending the continuous working time of the equipment, and improving the working efficiency of the equipment.

[0040] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An automatic testing device for wafer chip manufacturing, characterized in that, Include: The upper rotationally connected with the chip carousel (700) of the table (100), the upper movable connection with the chip detector (600) of the chip detection function of the chip carousel (700), the lower rotationally connected with the motor (800) of the rotation shaft of the chip carousel (700); The surface of the chip carousel (700) is provided with a plurality of chip grooves (904), the inside of each chip groove (904) is slidably connected with a lifting plate (903), the bottom of each lifting plate (903) is fixedly connected with a spring (902) between the chip groove (904), the bottom of each lifting plate (903) is fixedly connected with a slide rod (901), each slide rod (901) is slidably connected with the chip carousel (700) through the slide groove formed in the chip carousel (700), the front bottom of the table (100) is fixedly connected with an electric telescopic rod (905), the telescopic rod outside of the electric telescopic rod (905) is fixedly connected with a fixed ring (906), the upper movable connection of the fixed ring (906) is provided with a push block one (907), the upper slide of the push block one (907) is provided with a hydraulic block one (908), the hydraulic block one (908) is slidably connected with the air outlet (912) through the transmission member, the hydraulic block one (908) is fixedly connected with the table (100) through the fixed frame (913).

2. The automatic detection device for wafer chip production according to claim 1, characterized in that: The transmission member includes a hose one (909), a hydraulic block two (910), a push block two (911), one end of the hose one (909) is fixedly connected with the side surface of the hydraulic block one (908), the other end of the hose one (909) is fixedly connected with the hydraulic block two (910), the bottom of the hydraulic block two (910) is slidably connected with the push block two (911), the bottom of the push block two (911) is fixedly connected with the air outlet (912).

3. The automatic detection device for wafer chip production according to claim 1, characterized in that: The rear of the table (100) is movably connected with the feeding equipment (200), the right side of the table (100) is movably connected with the discharging equipment (300), the upper of the feeding equipment (200) is movably connected with the feeding pickup equipment (400), the upper of the discharging equipment (300) is movably connected with the discharging pickup equipment (500).

4. The automatic detection device for wafer chip production according to claim 2, characterized in that: The number of chip grooves (904) is twelve, each chip groove (904) is circumferentially distributed about the center of the chip carousel (700), the number of lifting plates (903) is twelve, each lifting plate (903) is circumferentially distributed about the center of the chip carousel (700), the size of the slot at the bottom of the air outlet (912) is consistent with the size of the chip groove (904), the front side of the air outlet (912) is fixedly connected with an air extractor switch assembly (1000).

5. The automatic inspection apparatus for wafer chip production according to claim 4, wherein: The exhaust fan switch assembly (1000) includes a switch box (1001), a circular switch (1002), a shaft one (1003), a gear one (1004), a rack one (1005), a hydraulic block three (1006), a hose two (1007), a waste pipe (1008), a negative pressure exhaust fan (1009), the front side of the exhaust port (912) is fixedly connected with the waste pipe (1008), the middle outside of the waste pipe (1008) is fixedly connected with the negative pressure exhaust fan (1009), the top of the negative pressure exhaust fan (1009) is fixedly connected with the switch box (1001), the inside of the switch box (1001) is rotatably connected with the circular switch (1002) through the shaft one (1003), the front side of the shaft one (1003) is fixedly connected with the gear one (1004), the top of the negative pressure exhaust fan (1009) is fixedly connected with the hydraulic block three (1006), the right side of the hydraulic block three (1006) is slidably connected with the rack one (1005), the rack one (1005) is engaged with the gear one (1004), the top of the hydraulic block three (1006) is fixedly connected with one end of the hose two (1007), the other end of the hose two (1007) is fixedly connected with the outside of the hydraulic block two (910), and the bottom of the waste pipe (1008) is movably connected with a waste stirring assembly (1100).

6. The automatic inspection apparatus for wafer chip production according to claim 5, wherein: The inner diameter of the waste pipe (1008) is larger than the size of the chip groove (904), and the rack one (1005) is slidably connected with the negative pressure exhaust fan (1009) through the sliding groove formed in the surface of the negative pressure exhaust fan (1009).

7. The automatic inspection apparatus for wafer chip production according to claim 5, wherein: The inside of the hose two (1007) is communicated with the inside of the hydraulic block three (1006), and the inside of the hose two (1007) is communicated with the inside of the hydraulic block two (910).

8. The automatic inspection apparatus for manufacturing a wafer chip according to claim 5, wherein: The waste stirring assembly (1100) comprises a third hose (1101), a fourth hydraulic block (1102), a second rack (1103), a second gear (1104), a second rotating shaft (1105), a stirring plate (1106), a waste box (1107), and a waste outlet (1108), one end of the third hose (1101) is fixedly connected with the outside of the first hydraulic block (908), the other end of the third hose (1101) is fixedly connected with the left side of the fourth hydraulic block (1102), the right side of the fourth hydraulic block (1102) is slidably connected with the second rack (1103), the bottom of the waste pipe (1008) is fixedly connected with the waste outlet (1108), the waste outlet (1108) is provided below the waste box (1107), the bottom of the waste box (1107) is rotatably connected with the second rotating shaft (1105), the top of the second rotating shaft (1105) is fixedly connected with the stirring plate (1106), the stirring plate (1106) and the bottom of the second rotating shaft (1105) are fixedly connected with the second gear (1104), the second gear (1104) is engaged with the second rack (1103), and the bottom of the fourth hydraulic block (1102) is fixedly connected with the waste box (1107).

9. The automatic inspection apparatus for wafer chip production according to claim 8, wherein: The length of the stirring plate (1106) is less than the width of the waste box (1107), and the bottom center of the waste outlet (1108) is coaxial with the center of the second rotating shaft (1105).

10. The automatic inspection apparatus for manufacturing a wafer chip according to claim 8, wherein: The inside of the third hose (1101) is communicated with the inside of the fourth hydraulic block (1102), and the inside of the third hose (1101) is communicated with the inside of the first hydraulic block (908).

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