Thin chip bonding active tilt adjustment device and thin chip bonding equipment

Abstract

The present invention relates to the field of thin chip packaging technology, and in particular to an active tilt adjustment device for thin chip bonding and a thin chip bonding device, comprising a support frame unit, a micro-motion module and a parallelism adjustment unit. The support frame unit has a base, an elastic support member and a support plate. The micro-motion module has a micro-motion unit and an output platform. The parallelism adjustment unit has at least three telescopic motors. The base of the present invention is connected to the support plate by an elastic support member. The micro-motion telescopic adjustment of the telescopic motor adjusts the horizontal plane inclination deviation of the support plate. When the posture of the support plate changes, it will synchronously drive the micro-motion unit, so that the patch head can be adjusted to be parallel to the bonding table below to meet the micron-level parallelism; the support plate can perform posture adjustment in a frictionless manner, which is conducive to the precise control of the horizontal position of the support plate; it can also be compatible with the design that the telescopic motor and the micro-motion motor are both located between the base and the support plate, so as to achieve the purpose of shortening the height of the active tilt adjustment device.

Description

Technical Field

[0001] The present invention relates to the technical field of thin chip packaging, in particular to a thin chip bonding active tilt adjustment device and thin chip bonding equipment. Background Art

[0002] With the introduction of thin chips, the requirements for thermal compression bonding equipment are becoming increasingly stringent. During bonding, the thin chip, which is adsorbed on the bonding head, moves downward synchronously with the bonding head until the thin chip contacts the substrate placed on the bonding table. Then, pressure is applied to the thin chip to bond it. The bonding pressure can reach up to 400N. During this process, the displacement accuracy of the thin chip must meet the sub-micron level. In addition, the horizontal tilt deviation between the thin chip and the substrate must be extremely small. The bonding head and the bonding table below must meet micron-level parallelism to eliminate failures related to thin chip warping.

[0003] In view of this, the present invention aims to provide an active tilt adjustment device for thin chip bonding, which can accurately adjust the horizontal plane tilt deviation of the bonding head, and at the same time, has high vertical movement accuracy to achieve precise control of small up and down movements during bonding. Summary of the Invention

[0004] The technical problem to be solved by the present invention is: in order to solve the deficiencies in the prior art, a thin chip bonding active tilt adjustment device and a thin chip bonding equipment are provided.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a thin chip bonding active tilt adjustment device, comprising:

[0006] A support frame unit comprising a base, an elastic support member and a support plate, wherein the elastic support members are at least three and are arranged at intervals along the circumference of the support plate, the upper ends of the elastic support members are fixedly connected to the base, and the lower ends of the elastic support members are fixedly connected to the support plate;

[0007] The micro-movement module has a micro-movement unit and an output platform. The micro-movement unit is arranged between the base and the support plate. The micro-movement unit is fixedly connected to the support plate. The output end of the micro-movement unit is fixedly connected to the output platform to drive the output platform to move up and down. The output platform is used to connect to the chip placement head for adsorbing thin chips;

[0008] And a parallelism adjustment unit, which has at least three telescopic motors evenly spaced around the circumference of the micro-motion module, the upper end of the telescopic motor is connected to the lower surface of the base, and the driving end below the telescopic motor that reciprocates in a linear direction is used to press the upper surface of the support plate.

[0009] Furthermore, the elastic support member is an elastic support column of a columnar structure, and the elastic support column is provided with at least one transverse groove group;

[0010] The transverse groove group includes a first transverse groove and a second transverse groove, the first transverse groove is arranged on one side of the outer peripheral wall of the elastic support column, and the second transverse groove is arranged on the other side of the outer peripheral wall of the elastic support column. The part of the elastic support column located between the first transverse groove and the second transverse groove in the same transverse groove group constitutes a deformation part.

[0011] Furthermore, the elastic support column is provided with two transverse groove groups, and the axes of the elastic support members are distributed on the same circumference line;

[0012] The first transverse groove and the second transverse groove in one transverse groove group are respectively located on both sides of the radial direction of the elastic support column where the circumferential line is located, and the first transverse groove and the second transverse groove in another transverse groove group are respectively located on both sides of the tangential direction of the elastic support column where the circumferential line is located.

[0013] Furthermore, the micro-motion unit includes a micro-motion motor, a guide shaft and an air bearing;

[0014] The micro-motor is arranged between the base and the support plate, the housing of the micro-motor is fixedly connected to the support plate, and the mover of the micro-motor is fixedly connected to the output platform to drive the output platform to move up and down;

[0015] At least two guide shafts are fixed on the output platform; each guide shaft is arranged at intervals around the circumference of the micro motor, and the guide shaft is installed on the support plate through an air bearing so that the guide shaft can slide in the up and down directions, and the air bearings are fixedly connected to the support plate.

[0016] Furthermore, the micro-motor is a voice coil motor, and the micro-motion unit further includes a tension spring, a column and a top plate;

[0017] The top plate is fixedly connected to the upper end of the voice coil motor housing, one end of the column is fixedly connected to the top plate, and the other end is fixedly connected to the support plate. There are at least two guide shafts corresponding to tension springs, the upper end of the tension spring is fixedly connected to the top plate, and the lower end of the tension spring is fixedly connected to the corresponding guide shaft. The output platform is located below the support plate.

[0018] Furthermore, the motion accuracy of the voice coil motor is at the micron level, and the motion accuracy of the telescopic motor is at the micron level.

[0019] Furthermore, a pressure sensor is included;

[0020] The pressure sensor is fixed between the mover of the micro motor and the output platform.

[0021] Furthermore, it also includes a grating sensor;

[0022] The grating sensor is installed on the support plate and is used to detect the displacement of the output platform.

[0023] Furthermore, the number of the elastic support members is consistent with the number of the telescopic motors;

[0024] The elastic support members and the telescopic motors are arranged at equal intervals around the circumference of the micro-motor, and each telescopic motor is located between two adjacent elastic support members.

[0025] Furthermore, the lower end surface of the driving end of the telescopic motor is a part of a spherical surface.

[0026] Furthermore, it also includes an adjustment member;

[0027] The adjusting member is mounted on the support plate in an adjustable manner in terms of its upper and lower positions. The adjusting member corresponds to the telescopic motor in a one-to-one manner, and the driving end of the telescopic motor is used to press against the upper surface of the corresponding adjusting member.

[0028] The present invention also provides a thin chip bonding device, comprising the above-mentioned thin chip bonding active tilt adjustment device.

[0029] The beneficial effects of the present invention are as follows: the thin chip bonding active tilt adjustment device of the present invention has at least three telescopic motors disposed between its base and the support plate, the base is connected to the support plate by an elastic support member, and the horizontal plane tilt deviation of the support plate is adjusted by the micro-extension of the telescopic motor. When the posture of the support plate changes, the micro-motion unit is synchronously driven to cause the posture of the output platform and the placement head to change synchronously, thereby adjusting the placement head to be parallel to the bonding table below, meeting the micron-level parallelism, and the overall distance between the thin chip and the substrate can be basically consistent;

[0030] In the present invention, since the support plate and the micro-motion unit are carried by the elastic support member, and since the telescopic motor cooperates with the support plate in an abutting manner, the support plate can be adjusted in a frictionless manner, which is conducive to achieving precise control of the horizontal position of the support plate;

[0031] The mover of the micro-motor of the present invention directly drives the output platform to move slightly up and down, and the transmission path is short, which is conducive to controlling the movement accuracy of the output platform's up and down movement; it can also be compatible with the design where both the telescopic motor and the micro-motor are located between the base and the support plate, thereby achieving the purpose of shortening the height of the active tilt adjustment device, and can be used in narrow spaces.

[0032] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The present invention will be further described below with reference to the accompanying drawings and examples.

[0034] Figure 1It is a three-dimensional schematic diagram of one side of the thin chip bonding active tilt adjustment device equipped with a placement head;

[0035] Figure 2 It is a three-dimensional schematic diagram of the other side of the thin chip bonding active tilt adjustment device equipped with a placement head;

[0036] Figure 3 is a schematic diagram of a front view of an active tilt adjustment device for thin chip bonding;

[0037] Figure 4 is a schematic cross-sectional view of an active tilt adjustment device for thin chip bonding;

[0038] Figure 5 yes Figure 4 A partial enlarged schematic diagram;

[0039] Figure 6 yes Figure 4 BB-direction cross-sectional view;

[0040] Figure 7 This is a schematic diagram of the assembly of the support frame unit and the telescopic motor;

[0041] Figure 8 It is a three-dimensional schematic diagram of the micro-motion unit installed on the support plate;

[0042] Figure 9 This is a schematic diagram of the placement head on the output platform and the bonding stage.

[0043] In the figure: 1. base;

[0044] 2. Elastic support member; 21. Transverse groove group; 211. First transverse groove; 212. Second transverse groove; 213. Deformation portion;

[0045] 3. Support plate; 31. Adjustment member; 3-1. Circumference line; 3-11. Tangent line;

[0046] 4. Micro motor; 41. Voice coil motor; 411. Mover;

[0047] 5. Output platform; 51. Guide shaft; 52. Air bearing; 53. Tension spring; 54. Column; 55. Top plate;

[0048] 6. Telescopic motor; 61. Driving end;

[0049] 7. Pressure sensor;

[0050] 8. Grating sensor;

[0051] 9. Stick the header;

[0052] 10. Bonding station. DETAILED DESCRIPTION

[0053] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating the basic structure of the present invention only in a schematic manner. They therefore only show components relevant to the present invention, and directions and references (e.g., up, down, left, right, etc.) may be used solely to facilitate the description of features in the drawings. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the claimed subject matter is defined solely by the appended claims and their equivalents.

[0054] like Figure 1-9 As shown, a thin chip bonding active tilt adjustment device includes a support unit, a micro-motion module and a parallelism adjustment unit:

[0055] like Figure 1 、 2 , 3 and 7, the support frame unit comprises a base 1, an elastic support member 2 and a support plate 3, the upper end of the elastic support member 2 is fixedly connected to the base 1, the lower end of the elastic support member 2 is fixedly connected to the support plate 3, the support plate 3 may be but is not limited to a circular plate, specifically, the elastic support member 2 may have multiple, for example, there are three elastic support members 2, which are equally spaced along the circumference of the support plate 3;

[0056] like Figure 1 、 2 As shown in Figure 8, the micro-motion module has a micro-motion unit and an output platform 5. The micro-motion unit is arranged between the base 1 and the support plate 3. The micro-motion unit is fixedly connected to the support plate 3. The output end of the micro-motion unit is fixedly connected to the output platform 5 to drive the output platform 5 to move up and down. The output platform 5 is used to connect the patch head 9 for adsorbing thin chips. The patch head 9 can vacuum adsorb the thin chip. Thin chips of different sizes can be replaced with matching patch heads 9. During bonding, the substrate is placed on the bonding table 10, and the patch head 9 adsorbs the thin chip and is located above the bonding table 10, as shown in Figure 8. Figure 9 As shown;

[0057] The parallelism adjustment unit has at least three telescopic motors 6 that are evenly spaced circumferentially around the micro-motion module. The movement accuracy of the telescopic motor 6 is in the micron level. The upper end of the telescopic motor 6 is fixedly connected to the lower surface of the base 1, and the driving end 61 below the telescopic motor 6 that reciprocates in a linear direction is used to press the upper surface of the support plate 3.

[0058] For example, the mutually perpendicular X-axis and Y-axis form a horizontal plane, and the parallelism adjustment unit can adjust the support plate 3 to rotate around the X-axis and around the Y-axis to adjust the horizontal plane inclination deviation of the support plate 3.

[0059] In this embodiment, at least three telescopic motors 6 are arranged between the base 1 and the support plate 3. The base 1 is connected to the support plate 3 by an elastic support member 2. The elastic support member 2 is characterized in that it can undergo elastic stretching but will not produce torsional bending. According to actual conditions, when the driving end 61 of the telescopic motor 6 is slightly extended, the side of the support plate 3 pushed by the telescopic motor 6 is slightly deflected downward, and the elastic support member 2 on the corresponding side is elastically stretched. When the driving end 61 of the telescopic motor 6 is slightly retracted, the elastic support member 2 on the corresponding side is elastically reset to pull the support plate 3 slightly upward, thereby adjusting the horizontal plane inclination deviation of the support plate 3. When the posture of the support plate 3 changes, it will synchronously drive the micro-motion unit, so that the postures of the output platform 5 and the patch head 9 change synchronously, so that the patch head 9 can be adjusted to be parallel to the bonding table 10 below, meeting the micron-level parallelism, and the overall distance between the thin chip and the substrate can be basically consistent;

[0060] In this embodiment, the thickness of the thin chip is usually less than 60 microns. During bonding, the chip head 9 and the bonding platform 10 below need to meet micron-level parallelism to eliminate failures related to warping of the thin chip.

[0061] In this embodiment, since the support plate 3 and the micro-motion unit are carried by the elastic support member 2, and since the telescopic motor 6 is not mechanically connected to the support plate 3 but cooperates with the support plate 3 in an abutting manner, the support plate 3 can be adjusted in a frictionless manner, which is conducive to achieving precise control of the horizontal position of the support plate 3;

[0062] In this embodiment, the output end of the micro-motion unit directly drives the output platform 5 to move slightly up and down. The transmission path is short, which is conducive to controlling the movement accuracy of the output platform 5 up and down. It can also be compatible with the design where the telescopic motor 6 and the micro-motion unit are both located between the base 1 and the support plate 3, so as to achieve the purpose of shortening the height of the active tilt adjustment device, and can be used in a small space.

[0063] In some examples, such as Figure 4 and 7 As shown, the elastic support member 2 is an elastic support column with a columnar structure. The material of the elastic support member 2 is spring steel or other elastic materials. The cross section of the elastic support member 2 can be, but is not limited to, a circle, a square, or a square with four rounded corners. In this embodiment, the cross section of the elastic support member 2 is a square with four rounded corners.

[0064] The elastic support column is provided with at least one transverse groove group 21;

[0065] The transverse groove group 21 includes a first transverse groove 211 and a second transverse groove 212. The first transverse groove 211 is provided on one side of the outer peripheral wall of the elastic support column, and the second transverse groove 212 is provided on the other side of the outer peripheral wall of the elastic support column. The portion of the elastic support column located between the first transverse groove 211 and the second transverse groove 212 in the same transverse groove group 21 constitutes a deformation portion 213. When the elastic support member 2 is elastically stretched, the deformation portion 213 deforms.

[0066] The elastic support member 2 with a special structural design achieves elastic stretching, but does not torsion or bend. That is, the elastic support member 2 with a columnar structure has a first transverse groove 211 and a second transverse groove 212 and is elastic at the deformation portion 213. Under this structure, the deformation portion 213 does not torsion or bend around the axis of the elastic support member 2, but can elastically move slightly up and down along the axis of the elastic support member 2, thereby stably supporting the support plate 3 and the micro-motion unit on the support plate 3, so that the support plate 3 can stably maintain the currently adjusted posture.

[0067] In some examples, such as Figure 1 and 5 As shown, the elastic support column is provided with two transverse groove groups 21, and the axes of the elastic support members 2 are distributed on the same circumferential line 3-1, as shown in FIG. Figure 6 As shown;

[0068] The first transverse groove 211 and the second transverse groove 212 in one transverse groove group 21 are respectively located on both sides of the elastic support column in the radial direction at the position of the circumferential line 3-1, and the first transverse groove 211 and the second transverse groove 212 in the other transverse groove group 21 are respectively located on both sides of the elastic support column in the direction of the tangent line 3-11 at the position of the circumferential line 3-1.

[0069] Specifically, the transverse groove group 21 above each elastic support member 2 is located at the same height, and the first transverse groove 211 and the second transverse groove 212 in the upper transverse groove group 21 are respectively located on both sides of the radial direction of the elastic support member 2 at the position of the circumferential line 3-1. The transverse groove group 21 below each elastic support member 2 is also located at the same height, and the first transverse groove 211 and the second transverse groove 212 in the lower transverse groove group 21 are respectively located on both sides of the radial direction of the elastic support member 2 at the position of the circumferential line 3-1. The elastic support member 2 can be positioned by two pins to ensure the consistency of the installation of each elastic support member 2.

[0070] Due to the design of the two sets of transverse groove groups 21, the elastic support member 2 allows the support plate 3 to more accurately follow the slight expansion and contraction of the telescopic motor 6 to form corresponding posture adjustment, thereby improving the adjustment effect of the parallelism between the patch head 9 and the bonding table 10.

[0071] In some examples, such as Figure 8As shown, the micro-motion unit includes a micro-motion motor 4, a guide shaft 51 and an air bearing 52. Through the cooperation between the micro-motion motor 4 and the air bearing 52, the sensitivity of the small pressure control of the output platform 5 can be improved, and high-precision control can be achieved. The movement accuracy of the micro-motion motor 4 is in the micron level. The micro-motion motor 4 is preferably coaxially arranged with the circumferential line 3-1;

[0072] The micro-motor 4 is arranged between the base 1 and the support plate 3. The housing of the micro-motor 4 is fixedly connected to the support plate 3. The mover 411 of the micro-motor 4 is fixedly connected to the output platform 5 to drive the output platform 5 to move up and down. The mover 411 of the micro-motor 4 is the output end of the micro-motor unit.

[0073] In this embodiment, all the telescopic motors 6 in the parallelism adjustment unit may be, but are not limited to, evenly spaced around the micro-motor 4 . The telescopic motors 6 may be located outside the micro-motor 4 .

[0074] At least two guide shafts 51 are fixed to the output platform 5; the guide shafts 51 are arranged at intervals around the circumference of the micro-motor 4, and the guide shafts 51 are mounted on the support plate 3 via air bearings 52 so that the guide shafts 51 can slide in the up and down directions. The air bearings 52 are fixedly connected to the support plate 3;

[0075] When the support plate 3 is tilted and adjusted, the mover 411 of the micro-motor 4 is driven by the guide shaft 51, so that the mover 411 of the micro-motor 4 and the output platform 5 are tilted and fine-tuned synchronously with the tilt fine-tuning of the support plate 3. The guide shaft 51 is connected to the support plate 3 through the air bearing 52, which can have better up and down movement accuracy and realize precise control of downward micro-movement during thin chip bonding.

[0076] In some examples, such as Figure 4 As shown, the micro-motor 4 is a voice coil motor 41, which can achieve micron-level output motion. The micro-motor unit also includes a tension spring 53, a column 54 and a top plate 55;

[0077] The top plate 55 is fixedly connected to the upper end of the voice coil motor 41 housing. One end of the column 54 is fixedly connected to the top plate 55, and the other end is fixedly connected to the support plate 3. There are at least two guide shafts 51, each of which is provided with a tension spring 53. The upper end of the tension spring 53 is fixedly connected to the top plate 55, and the lower end of the tension spring 53 is fixedly connected to the corresponding guide shaft 51. The output platform 5 is located below the support plate 3. Under the tension of the tension spring 53, the output platform 5 presses upward against the air bearing 52.

[0078] By fixing the housing of the voice coil motor 41 on the support plate 3, when the support plate 3 is tilted, the housing of the voice coil motor 41 is driven by the pillar 54, so that the housing of the voice coil motor 41 is tilted and fine-tuned synchronously with the tilt fine-tuning of the support plate 3, thereby improving the accuracy of the posture adjustment of the output platform 5 and the patch head 9, and at the same time making the structure compact;

[0079] The mover 411 of the voice coil motor 41 is fixedly connected to the output platform 5, which is also fixedly connected to the guide shaft 51. One end of the tension spring 53 is fixedly connected to the guide shaft 51, and the other end is fixedly connected to the top plate 55. The top plate 55 is fixedly connected to the upper end of the voice coil motor 41 housing, thereby achieving the installation of the voice coil motor 41.

[0080] The tension spring 53 is designed to maintain internal balance. When the voice coil motor 41 is powered off, the mover 411 of the voice coil motor 41 is held stationary by the initial balancing force of the tension spring 53. For example, under the tension of the tension spring 53, the output platform 5 presses upward against the air bearing 52. The output platform 5 and the mover 411 are fixedly connected. Therefore, when the output platform 5 presses upward against the air bearing 52, the position of the output platform 5 is at the upper limit position, and the vertical position of the mover 411 fixedly connected to the output platform 5 is also at the upper limit position.

[0081] When the voice coil motor 41 is powered on, the mover 411 of the voice coil motor 41 moves downward precisely at the micron level, the tension spring 53 is stretched, and the output platform 5 moves synchronously and precisely at the micron level along with the mover 411 of the voice coil motor 41 .

[0082] In some examples, such as Figure 4 As shown, a pressure sensor 7 is also included;

[0083] The pressure sensor 7 is fixed between the mover 411 of the micro-motor 4 and the output platform 5. Specifically, the pressure sensor 7 passes through the central hole of the support plate 3. The output platform 5 is located below the support plate 3.

[0084] When the bonding head 9 moves downward to load pressure on the thin chip for bonding, the pressure sensor 7 monitors the pressure feedback during the up and down displacement of the bonding head 9 in real time to obtain the pressure state of the thin chip in real time. Pressure closed-loop control can be achieved based on the feedback of the pressure sensor 7.

[0085] In some examples, a light barrier sensor 8 is also included;

[0086] The grating sensor 8 is mounted on the support plate 3 and is used to detect the displacement of the output platform 5 ; thereby the displacement of the output platform 5 driven by the micro-motor 4 can be accurately known.

[0087] In some examples, such as Figure 2 and 6As shown, there are multiple elastic support members 2, and the number is consistent with the number of telescopic motors 6;

[0088] The elastic support members 2 and telescopic motors 6 are arranged at equal intervals around the circumference of the micro-motor 4, and each telescopic motor 6 is located between two adjacent elastic support members 2. For example, there are three elastic support members 2 and three telescopic motors 6. In this case, the angle between the elastic support member 2 and the adjacent telescopic motor 6 is 60°.

[0089] In some examples, such as Figure 2-4 As shown, the lower end surface of the driving end 61 of the telescopic motor 6 is a part of a sphere. Preferably, the lower end surface of the driving end 61 of the telescopic motor 6 is a hemispherical surface, which is conducive to fine-tuning the tilt of the support plate 3.

[0090] In some examples, such as Figure 4 As shown, it also includes an adjustment member 31;

[0091] The adjusting member 31 is installed on the support plate 3 in an adjustable manner. The adjusting member 31 corresponds to the telescopic motor 6 one by one. The driving end 61 of the telescopic motor 6 is used to press the upper surface of the corresponding adjusting member 31. Since the adjusting member 31 is adjustable in the upper and lower positions, it is convenient for on-site debugging, and can also reduce the assembly requirements of the telescopic motor 6, and can adapt to telescopic motors 6 of different specifications. The adjusting member 31 can be specifically installed on the support plate 3 in an adjustable manner by being threadedly connected to the support plate 3.

[0092] A thin chip bonding device comprises the above-mentioned thin chip bonding active tilt adjustment device.

[0093] The working principle of the above-mentioned thin chip bonding active tilt adjustment device is as follows:

[0094] The substrate is placed on the bonding table 10 and the bonding head 9 picks up the thin chip;

[0095] like Figure 9 As shown, the tilt of the support plate 3 is adjusted by the telescopic micro-motion of the driving ends 61 of the three telescopic motors 6. When the posture of the support plate 3 changes, the micro-motion unit is synchronously driven, so that the postures of the output platform 5 and the placement head 9 change synchronously, thereby adjusting the placement head 9 to be parallel to the bonding table 10, meeting the micron-level parallelism, and the overall distance between the thin chip and the substrate can be basically consistent;

[0096] After the placement head 9 and the bonding platform 10 meet the micron-level parallelism, the voice coil motor 41 is energized, and the mover 411 of the voice coil motor 41 moves downward precisely at the micron level. The mover 411 drives the thin chip to move downward slightly through the output platform 5 and the placement head 9, thereby achieving precise control of displacement and pressure during the thin chip bonding process.

[0097] The above description of the preferred embodiments of the present invention is intended to serve as a guide. Based on the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A thin chip bonding active tilt adjustment device, characterized by: include: A support frame unit comprises a base (1), an elastic support member (2) and a support plate (3), wherein the elastic support members (2) are at least three and are arranged at intervals along the circumference of the support plate (3), the upper end of the elastic support member (2) is fixedly connected to the base (1), and the lower end of the elastic support member (2) is fixedly connected to the support plate (3); A micro-motion module having a micro-motion unit and an output platform (5), wherein the micro-motion unit is arranged between a base (1) and a support plate (3), the micro-motion unit is fixedly connected to the support plate (3), and the output end of the micro-motion unit is fixedly connected to the output platform (5) to drive the output platform (5) to move up and down, and the output platform (5) is used to connect a patch head (9) for adsorbing thin chips; and a parallelism adjustment unit having at least three telescopic motors (6) uniformly spaced around the circumference of the micro-motion module, wherein the upper ends of the telescopic motors (6) are connected to the lower surface of the base (1), and a driving end (61) below the telescopic motors (6) that reciprocates in a linear direction is used to press against the upper surface of the support plate (3).

2. The thin chip bonding active tilt adjustment device according to claim 1, characterized in that: The elastic support member (2) is an elastic support column with a columnar structure, and the elastic support column is provided with at least one transverse groove group (21); The transverse groove group (21) comprises a first transverse groove (211) and a second transverse groove (212), wherein the first transverse groove (211) is arranged on one side of the outer peripheral wall of the elastic support column, and the second transverse groove (212) is arranged on the other side of the outer peripheral wall of the elastic support column, and the portion of the elastic support column located between the first transverse groove (211) and the second transverse groove (212) in the same transverse groove group (21) constitutes a deformation portion (213).

3. The thin chip bonding active tilt adjustment device according to claim 2, characterized in that: The elastic support column is provided with two transverse groove groups (21), and the axes of the elastic support members (2) are distributed on the same circumferential line (3-1); The first transverse groove (211) and the second transverse groove (212) in one transverse groove group (21) are respectively located on both sides of the elastic support column at the position of the circumferential line (3-1) in the radial direction, and the first transverse groove (211) and the second transverse groove (212) in the other transverse groove group (21) are respectively located on both sides of the elastic support column at the position of the circumferential line (3-11) in the direction of the tangent line (3-11).

4. The thin chip bonding active tilt adjustment device according to claim 1, characterized in that: The micro-motion unit includes a micro-motion motor (4), a guide shaft (51) and an air bearing (52); The micro-motor (4) is arranged between the base (1) and the support plate (3), the housing of the micro-motor (4) is fixedly connected to the support plate (3), and the mover (411) of the micro-motor (4) is fixedly connected to the output platform (5) to drive the output platform (5) to move up and down; At least two guide shafts (51) are fixed on the output platform (5); the guide shafts (51) are arranged at intervals around the circumference of the micro-motor (4); the guide shafts (51) are mounted on the support plate (3) via air bearings (52) so that the guide shafts (51) can slide in the up and down directions; the air bearings (52) are fixedly connected to the support plate (3).

5. The thin chip bonding active tilt adjustment device according to claim 4, characterized in that: The micro-motor (4) is a voice coil motor (41), and the micro-motor unit further comprises a tension spring (53), a column (54) and a top plate (55); The top plate (55) is fixedly connected to the upper end of the voice coil motor (41) housing, one end of the column (54) is fixedly connected to the top plate (55), and the other end is fixedly connected to the support plate (3), at least two guide shafts (51) are provided with corresponding tension springs (53), the upper end of the tension spring (53) is fixedly connected to the top plate (55), and the lower end of the tension spring (53) is fixedly connected to the corresponding guide shaft (51), and the output platform (5) is located below the support plate (3).

6. The thin chip bonding active tilt adjustment device according to claim 5, characterized in that: The motion accuracy of the voice coil motor (41) is at the micron level, and the motion accuracy of the telescopic motor (6) is also at the micron level.

7. The thin chip bonding active tilt adjustment device according to claim 4, characterized in that: Also included is a pressure sensor (7); The pressure sensor (7) is fixed between the mover (411) of the micro-motor (4) and the output platform (5).

8. The thin chip bonding active tilt adjustment device according to claim 1, characterized in that: Also included is a grating sensor (8); The grating sensor (8) is mounted on the support plate (3) and is used to detect the displacement of the output platform (5).

9. The thin chip bonding active tilt adjustment device according to claim 4, characterized in that: The number of the elastic support members (2) is the same as the number of the telescopic motors (6); The elastic support members (2) and the telescopic motors (6) are arranged at equal intervals around the circumference of the micro-motor (4), and each telescopic motor (6) is located between two adjacent elastic support members (2).

10. The thin chip bonding active tilt adjustment device according to claim 1, characterized in that: The lower end surface of the driving end (61) of the telescopic motor (6) is a part of a spherical surface.

11. The thin chip bonding active tilt adjustment device according to claim 1, characterized in that: Also included is an adjustment member (31); The adjusting member (31) is mounted on the support plate (3) in an adjustable manner in terms of its upper and lower positions. The adjusting member (31) corresponds to the telescopic motor (6) in a one-to-one manner. The driving end (61) of the telescopic motor (6) is used to press against the upper surface of the corresponding adjusting member (31).

12. A thin chip bonding device, characterized in that: The device comprises the thin chip bonding active tilt adjustment device as described in any one of claims 1-11.

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