Radiating structure, radiator and radiating device

Abstract

The invention provides a heat dissipation structure, a radiator and a heat dissipation device, and relates to the technical field of heat dissipation. The extremely-small curved surface superstructure comprises a plurality of extremely-small curved surface unit cells which are arranged in a dot matrix manner; minimum curved surface unit cells in different areas in the minimum curved surface superstructure have corresponding preset structure parameters; wherein the preset structure parameters at least comprise porosity. The heat dissipation structure provided by the invention is good in heat dissipation performance and good in temperature uniformity.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure, a heat dissipation structure, a radiator and a heat dissipation device. Background Art

[0002] As the integration level of integrated products becomes higher and higher, the heat dissipation problem of integrated products has become a major issue that troubles product stability.

[0003] At present, the heat dissipation structure of the heat source in integrated products mostly adopts lattice structures such as simple cubic (SC) and body-centered cubic (BCC). However, these lattice structures have high flow resistance, which leads to poor heat dissipation performance and poor temperature uniformity of the heat dissipation structure. Summary of the Invention

[0004] The present application provides a heat dissipation structure, a radiator and a heat dissipation device, which are used to provide a technical solution with good heat dissipation performance and good temperature uniformity.

[0005] In a first aspect, the present application provides a heat dissipation structure having a minimal surface superstructure; the minimal surface superstructure comprises a plurality of minimal surface unit cells arranged in a lattice;

[0006] The minimal surface unit cells in different regions of the minimal surface superstructure have corresponding preset structural parameters; wherein the preset structural parameters at least include porosity.

[0007] In an optional embodiment, the minimal surface unit cell in the minimal surface superstructure includes a diamond crystal structure unit cell or a spiral minimal surface unit cell.

[0008] In an optional embodiment, when the minimal surface unit cell in the minimal surface superstructure is the diamond crystal structure unit cell, the pore connection direction of the minimal surface unit cells in each region of the minimal surface superstructure is along the pressure gradient direction of the heat dissipation structure.

[0009] In an optional embodiment, when the minimal surface unit cell of the minimal surface superstructure is the spiral minimal surface unit cell, the connection direction of the fluid domain of the minimal surface superstructure is along the horizontal direction.

[0010] In an optional embodiment, the solid volume fraction of the minimal surface unit cell of the minimal surface superstructure close to the heat source is smaller than the solid volume fraction of the minimal surface unit cell of the minimal surface superstructure far from the heat source; wherein the solid volume fraction of the minimal surface unit cell is inversely proportional to the porosity of the minimal surface unit cell.

[0011] In an optional embodiment, in each region of the minimal surface superstructure, the solid volume fraction of each minimal surface unit cell is determined by averaging the solid volume fractions of all minimal surface unit cells in the region set in which it is located; wherein the region set includes the minimal surface unit cell and the region in which multiple minimal surface unit cells that meet a first preset distance from it are located.

[0012] In an optional embodiment, in the minimal surface superstructure, the solid volume fraction of the minimal surface unit cell in the target area can be determined by the solid volume fraction of the minimal surface unit cell at a second preset distance therefrom; wherein, the target area includes the area where the minimal surface unit cell whose solid volume fraction has not yet been determined is located.

[0013] In an optional embodiment, in the minimal surface superstructure, the porosity of the minimal surface unit cell in each region is determined according to the implicit function of the minimal surface unit cell in the corresponding region.

[0014] In an optional embodiment, the preset structural parameters further include a thermal equivalent coefficient, which includes the permeability of the minimal surface unit cell, the equivalent thermal conductivity coefficient of the minimal surface unit cell, and the resistance coefficient of the minimal surface unit cell.

[0015] In an optional embodiment, in the minimal surface superstructure, the implicit function of the minimal surface unit cell in each region is determined according to the topological optimization design variables of the minimal surface unit cell in the corresponding region;

[0016] The topology optimization design variables of the minimal surface unit cell in each region have a corresponding mapping relationship with the equivalent coefficient and porosity of the minimal surface unit cell in the corresponding region.

[0017] In a second aspect, the present application further provides a radiator, comprising: a fluid channel and the heat dissipation structure according to any one of the first aspects, wherein the heat dissipation structure is disposed on one side of the fluid channel;

[0018] The fluid channel is used to circulate the coolant;

[0019] The heat dissipation structure is used to transfer the heat of the heat source to be dissipated to the fluid channel, so as to dissipate the heat of the heat source to be dissipated.

[0020] In an optional embodiment, when the minimal surface unit cell of the heat dissipation structure is a diamond crystal structure unit cell, along the diagonal direction of the fluid channel, the coolant inlet of the fluid channel and the coolant outlet of the fluid channel are respectively arranged at two diagonals of the fluid channel.

[0021] In an optional embodiment, the pore communication direction of the minimal surface unit cells in each region of the heat dissipation structure is along the pressure gradient direction of the heat dissipation structure.

[0022] In an optional embodiment, when the minimal surface unit cell of the heat dissipation structure is a spiral minimal surface unit cell, along the extension direction of the fluid channel, the coolant inlet of the fluid channel is arranged on at least one side of the fluid channel, and the coolant outlet of the fluid channel is arranged in the middle area of ​​the fluid channel.

[0023] In an optional embodiment, the coolant in the fluid channel flows in a horizontal direction.

[0024] In an optional embodiment, the coolant inlet is provided with a flow balancing portion.

[0025] In an optional embodiment, the solid volume fraction of the minimal surface unit cell of the heat dissipation structure close to the heat source of the radiator is smaller than the solid volume fraction of the minimal surface unit cell of the heat dissipation structure away from the heat source of the radiator; wherein the solid volume fraction of the minimal surface unit cell is inversely proportional to the porosity of the minimal surface unit cell.

[0026] In a third aspect, the present application further provides a heat dissipation device, comprising the heat sink and a heat source according to any one of the second aspects;

[0027] The heat source is arranged on a side of the heat dissipation structure of the radiator away from the fluid channel;

[0028] The fluid channel is used to circulate the coolant;

[0029] The heat dissipation structure is used to transfer the heat of the heat source to be dissipated to the fluid channel to dissipate the heat of the heat source.

[0030] In an optional embodiment, the heat source is a battery or a chip.

[0031] In an optional embodiment, when the heat source is a chip, the device further includes a first connection layer and an insulating layer, wherein the first connection layer is arranged between the heat source and the insulating layer, and the insulating layer is arranged between the heat source and the heat sink.

[0032] In an optional embodiment, the device further includes a second connection layer and a heat-conducting base plate, wherein the second connection layer is arranged between the insulating layer and the heat-conducting base plate, and the heat-conducting base plate is arranged between the insulating layer and the heat sink.

[0033] In an optional embodiment, the thermally conductive base plate and the heat dissipation structure are integrally formed using a thermally conductive material.

[0034] In an optional embodiment, the insulating layer includes an active metal brazed ceramic layer or an aluminum nitride layer.

[0035] In an optional embodiment, the heat dissipation device further includes a third connection layer provided on both sides of the active metal brazing ceramic layer.

[0036] The technical solution provided by this application features a heat dissipation structure comprising a minimal surface superstructure, which comprises a plurality of minimal surface cells arranged in a lattice. The minimal surface cells in different regions of the minimal surface superstructure have corresponding preset structural parameters, wherein these preset structural parameters include at least porosity. Therefore, this application can adjust the porosity of the minimal surface cells in different regions based on actual heat dissipation requirements to avoid local hot spots in the heat dissipation structure, thereby achieving uniform temperature distribution across all regions of the heat dissipation structure. Consequently, the heat dissipation structure determined by the determination method provided by this application exhibits good temperature uniformity.

[0037] Furthermore, the heat dissipation structure of this application utilizes a minimally curved superstructure, which has a large specific surface area and a significant flow disturbance structure. At the same solid volume fraction, the flow resistance is much lower than that of lattice structures such as simple cubic and body-centered cubic structures. Therefore, the heat dissipation structure provided by this application has better heat dissipation performance than lattice structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0039] Figure 1 A structural diagram of a heat dissipation structure established using diamond crystal structure cells provided in an embodiment of the present application;

[0040] Figure 2 A structural diagram of a heat dissipation structure established using spiral minimal surface unit cells provided in an embodiment of the present application;

[0041] FIG3( a ) is a heat dissipation structure with a pin-pillar geometry in the prior art provided by an embodiment of the present application;

[0042] FIG3( b ) is a schematic diagram of the fluid pressure distribution in the fluid channel of the radiator based on the heat dissipation structure of FIG3( a );

[0043] FIG3( c ) is a temperature cloud diagram when the heat sink formed by the heat dissipation structure of FIG3( a ) is used to dissipate heat from the chip;

[0044] FIG3( d ) is a schematic diagram of the fluid velocity distribution in the fluid channel structure in FIG3( b );

[0045] FIG4( a ) is a schematic diagram of a heat dissipation structure in which a minimal curved surface unit cell is a diamond crystal structure unit cell, provided in an embodiment of the present application;

[0046] FIG4( b ) is a schematic diagram of the fluid pressure distribution in the fluid channel of the radiator based on the heat dissipation structure in FIG4( a );

[0047] FIG4( c ) is a temperature cloud diagram when the heat sink formed by the heat dissipation structure of FIG4( a ) is used to dissipate heat from the chip;

[0048] FIG4( d ) is a schematic diagram of the fluid velocity distribution in the fluid channel structure in FIG4( b );

[0049] FIG5( a ) is a schematic diagram of a heat dissipation structure in which a minimal surface unit cell is a spiral minimal surface unit cell, provided in an embodiment of the present application;

[0050] FIG5( b ) is a schematic diagram of the fluid pressure distribution in the fluid channel of the radiator constructed based on the heat dissipation structure in FIG5( a );

[0051] FIG5(c) is a temperature cloud diagram when the heat sink formed by the heat dissipation structure of FIG5(a) is used to dissipate heat from the chip;

[0052] FIG5( d ) is a schematic diagram of the fluid velocity distribution in the fluid channel structure in FIG5( b );

[0053] Figure 6 A structural diagram of a heat dissipation device provided in an embodiment of the present application;

[0054] Figure 7 A method provided in the embodiment of the present application Figure 6 The cross-section obtained from the mid-section AA;

[0055] Figure 8 A method provided in the embodiment of the present application Figure 6 The cross-section obtained from the middle section BB;

[0056] Figure 9 A method provided in the embodiment of the present application Figure 7 The cross-section obtained by the mid-section CC;

[0057] Figure 10 An exploded diagram of a heat dissipation device provided in an embodiment of the present application;

[0058] Figure 11 An exploded view of another heat dissipation device provided in an embodiment of the present application.

[0059] Reference numerals:

[0060] 1-chip, 2-first connection layer, 3-insulation layer, 4-second connection layer, 5-thermal conductive base plate, 6-heat dissipation structure, 7-fluid channel, 8-water tank.

[0061] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0062] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0063] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. It will be understood that the terms "first", "second", etc. used in this application may be used herein to describe various information or data, but these elements are not limited by these terms. These terms are only used to distinguish the first information from another information. For example, without departing from the scope of this application, the first action information may be referred to as the second action information, and similarly, the second action information may be referred to as the first action information. Both the first action information and the second action information are action information, but they are not the same action information.

[0064] As the integration level of integrated products becomes higher and higher, the heat dissipation problem of integrated products has become a major issue that troubles product stability.

[0065] At present, the heat dissipation structure of the heat source in integrated products mostly adopts lattice structures such as simple cubic (SC) and body-centered cubic (BCC). However, these lattice structures have high flow resistance, which leads to poor heat dissipation performance and poor temperature uniformity of the heat dissipation structure.

[0066] In response to the above problems, this application proposes the following technical concept: a heat dissipation structure is constructed using a superstructure with a minimal curved surface, and the structural parameters of the minimal curved surface unit cells in each area of ​​the heat dissipation structure are constructed according to specific heat dissipation requirements, thereby providing a heat dissipation structure with excellent heat dissipation performance and good temperature uniformity.

[0067] The following specific embodiments describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0068] In a first aspect, an embodiment of the present application provides a heat dissipation structure that adopts a minimal curved surface superstructure.

[0069] Minimal surface superstructures are structures designed and manufactured using the geometric properties of minimal surfaces to achieve specific functions. They offer advantages such as large surface area, distinct flow disturbances, and low flow resistance. Therefore, these structures hold great potential for application in heat sinks.

[0070] In the embodiment of the present application, the minimal surface superstructure includes a plurality of minimal surface unit cells arranged in a lattice, wherein the minimal surface unit cell refers to a geometric shape that serves as a basic repeating unit in the minimal surface structure.

[0071] The minimal surface unit cells in different regions of the minimal surface superstructure have corresponding preset structural parameters, wherein the preset structural parameters include at least porosity.

[0072] The porosity of a minimal surface unit cell refers to the ratio of the pore volume to the total volume in the minimal surface unit cell. The porosity of a minimal surface unit cell has a complementary relationship with the solid volume fraction of the minimal surface unit cell. Specifically, the sum of the solid volume fraction and the porosity is equal to 100%.

[0073] It should be understood that the heat dissipation structure is composed of multiple regions, and the minimal surface unit cell of each region may have different porosities. The embodiment of the present application can determine the correspondence between the porosity of the minimal surface unit cell of each region of the heat dissipation structure and the thermal equivalent coefficient of the corresponding region through simulation analysis and according to actual heat dissipation requirements, thereby optimizing the heat dissipation performance of the heat dissipation structure.

[0074] Based on the above description, the heat dissipation structure provided in the embodiments of the present application comprises a minimal surface superstructure comprising a plurality of minimal surface unit cells arranged in a lattice. The minimal surface unit cells in different regions of the minimal surface superstructure have corresponding preset structural parameters, wherein the preset structural parameters include at least porosity. Therefore, the present application can adjust the porosity of the minimal surface unit cells in different regions according to actual heat dissipation requirements to avoid the problem of local hot spots in the heat dissipation structure, thereby achieving uniform temperature distribution across all regions of the heat dissipation structure. Consequently, the heat dissipation structure obtained by the determination method provided in the present application exhibits good temperature uniformity.

[0075] Furthermore, the heat dissipation structure in the embodiments of this application utilizes a minimally curved superstructure. This minimally curved superstructure has a large specific surface area and a pronounced flow disturbance. At the same solid volume fraction, its flow resistance is significantly lower than that of lattice structures such as simple cubic and body-centered cubic structures. Therefore, the heat dissipation structure provided by this application exhibits superior heat dissipation performance compared to lattice structures.

[0076] In an optional embodiment, in the above minimal surface superstructure, the porosity of the minimal surface unit cell in each region is determined according to the implicit function of the minimal surface unit cell in the corresponding region.

[0077] It should be understood that a minimal surface is a surface with zero curvature that can be described by an implicit function. Implicit functions are often used to represent complex geometries and surfaces. In topology optimization and material design, the right-hand side of the implicit function may involve geometric parameters, design variables, or the optimization objective.

[0078] Based on this, after determining the implicit function of the minimal surface unit cell in each area of ​​the heat dissipation structure, the porosity of the minimal surface unit cell in the corresponding area can be determined, thereby determining the structure of the minimal surface unit cell in each area of ​​the heat dissipation structure.

[0079] Optionally, the thermal equivalent coefficient may be a thermal equivalent coefficient in a local thermal equilibrium model, which includes the permeability, equivalent thermal conductivity, and resistance coefficient of a minimal surface unit cell.

[0080] Among them, the unit cell permeability of the minimal surface is a parameter of the fluid flow capacity in the heat dissipation structure, reflecting the flow resistance of the fluid inside the heat dissipation.

[0081] The equivalent thermal conductivity is a parameter that describes the thermal conductivity of porous or composite materials at a macroscale. It comprehensively considers factors such as the material's microstructure, porosity, composition, and interfacial effects. The equivalent thermal conductivity is often used to describe the thermal conductivity of porous or composite materials under specific conditions. Therefore, the equivalent thermal conductivity of a minimal surface unit cell can be used to describe the thermal conductivity of a minimal surface unit cell.

[0082] The drag coefficient is a parameter that describes the resistance encountered by a fluid when flowing through a porous material or structure, reflecting the flow resistance of the fluid within the material. Therefore, the drag coefficient of a minimal surface unit cell can be used to describe the flow resistance of a fluid within a minimal surface unit cell.

[0083] In the embodiment of the present application, in the minimal surface superstructure, the implicit function of the minimal surface unit cell in each region can be determined according to the topological optimization design variables of the minimal surface unit cell in the corresponding region;

[0084] The topology optimization design variables of the minimal surface unit cell in each region have a corresponding mapping relationship with the equivalent coefficient and porosity of the minimal surface unit cell in the corresponding region.

[0085] Topology optimization is a method used to optimize structural design by adjusting the distribution of materials in the design space to achieve optimal performance targets. The design variables of topology optimization refer to the parameters that can be adjusted during the topology optimization process. These variables directly affect the shape, material distribution, and performance of the structure.

[0086] Based on this, the application embodiment can adjust the structure of the minimal surface unit cells in each area of ​​the heat dissipation structure in the global distribution of the heat dissipation structure according to the mapping relationship between the topological optimization design variables of the minimal surface unit cells in each area of ​​the minimal surface superstructure and the equivalent coefficients and porosity of the minimal surface unit cells in the corresponding areas, thereby optimizing the heat dissipation performance of the heat dissipation structure.

[0087] Among them, there is a first corresponding relationship between the porosity of the minimal surface unit cell in each area of ​​the heat dissipation structure and the equivalent coefficient of the corresponding area, and there is a second corresponding relationship between the porosity and thermal equivalent coefficient of the minimal surface unit cell in each area of ​​the heat dissipation structure and the topology optimization design variables of the corresponding area. Based on the first corresponding relationship and the second corresponding relationship, the distribution of the topology optimization design variables of all areas of the heat dissipation structure can be determined.

[0088] In this step, the distribution of topology optimization design variables in all regions of the heat dissipation structure can be determined based on the first corresponding relationship and the second corresponding relationship and the partition filling topology optimization method.

[0089] The partition filling topology optimization method can be explained as: a method for optimizing complex structural design, which divides the design space into multiple regions and performs independent topology optimization in each region to achieve the global optimization goal.

[0090] In this embodiment, the optimization goal of the partition filling topology optimization method can be to maximize the heat conduction efficiency, and of course it can be other optimization goals, which are not specifically limited in this embodiment of the present application. In this embodiment, the topology optimization method can be used to optimize and solve to determine the topology optimization design variables of the minimal surface unit cell in different areas of the heat dissipation structure.

[0091] It should be understood that the minimal surface unit cells in various regions of the heat dissipation structure in the embodiment of the present application may have different porosities, equivalent coefficients and topology optimization design variables, so the partition filling topology optimization method can be used to independently perform topology optimization on the structures of the minimal surface unit cells in each region so that the heat dissipation structure has better heat dissipation performance.

[0092] Optionally, this embodiment can use multiple iterations to determine the topology optimization design variables of the minimal surface unit cell in each area of ​​the heat dissipation structure. In each iteration, the topology optimization design variables of each area can be adjusted according to the numerical simulation results and the optimization algorithm. Based on this, the topology optimization design variables of the minimal surface unit cell in each area of ​​the heat dissipation structure can be optimized to improve the heat dissipation performance of the heat dissipation structure.

[0093] Afterwards, the implicit function of the minimal surface unit cell in the corresponding area can be determined based on the topological optimization design variables of the minimal surface unit cell.

[0094] Specifically, the implicit function of the minimal surface unit cell in each area of ​​the heat dissipation structure can be determined according to the distribution of topological optimization variables in each area of ​​the minimal surface superstructure, and the heat dissipation structure can be constructed according to the implicit function of the minimal surface unit cell in each area.

[0095] When adopting the above-mentioned technical solution, the embodiment of the present application determines the distribution of the topological optimization design variables of the minimal surface cells in all areas of the heat dissipation structure based on the first correspondence between the porosity of the minimal surface cell in each area of ​​the heat dissipation structure and the equivalent coefficient of the corresponding area, and the second correspondence between the porosity and equivalent coefficient of the minimal surface cell in each area of ​​the heat dissipation structure and the topological optimization design variables of the corresponding area. The heat dissipation structure uses the minimal surface cell of the minimal surface superstructure as the design primitive, and the structure of the minimal surface cell in each area of ​​the heat dissipation structure is accurately controlled by implicit functions. Therefore, the present application can adjust the porosity and size of the minimal surface cells in different areas, avoid the problem of local hot spots in the heat dissipation structure, so that the temperature distribution in each area of ​​the heat dissipation structure is uniform. Therefore, the heat dissipation structure provided by the present application has good temperature uniformity.

[0096] In some specific examples, the partition filling topology optimization method provided in the embodiments of the present application can adopt the local thermal equilibrium method (LTE), which is an assumption method commonly used in thermal conduction analysis of porous media and composite materials. This method assumes that the temperature difference between the solid and the fluid can be ignored at the microscopic scale, that is, the solid and the fluid can also reach a thermal equilibrium state within each tiny control volume. Since the local thermal equilibrium method assumes that the temperature of the solid and the fluid is the same, only one temperature field is required to describe the heat conduction process of the entire structure. This greatly simplifies the mathematical model and reduces the number of equations that need to be solved. Moreover, since only one temperature field needs to be solved, the local thermal equilibrium method significantly reduces the computational complexity. Compared with the local thermal non-equilibrium method that needs to solve the solid and fluid temperature fields separately, the local thermal equilibrium method has a smaller computational load and a faster computation speed. Therefore, the embodiment of the present application adopts the local thermal equilibrium method to reduce the computational complexity of the heat dissipation structure determination process and improve the computational speed. It should be understood that other partition filling topology optimization methods can also be used, and the embodiment of the present application does not specifically limit this.

[0097] Optionally, the type of the minimal surface unit cell of the heat dissipation structure of this embodiment can be determined according to the heat dissipation requirements of the heat dissipation structure.

[0098] The heat dissipation requirements of the heat dissipation structure may include at least one of thermal conductivity, mechanical properties, fluid dynamics properties, and manufacturing process.

[0099] Thermal conductivity refers to the thermal conductivity performance indicators that the heat dissipation structure must meet, such as thermal conductivity coefficient and temperature gradient. Mechanical properties refer to the mechanical properties that the heat dissipation structure must possess, such as strength, stiffness, and fatigue resistance. Fluid dynamics refers to the flow characteristics of the cooling medium, such as flow velocity, flow rate, and flow resistance. Manufacturing processes may include 3D printing and injection molding.

[0100] In the embodiment of the present application, the type of minimal surface unit cell may include a diamond crystal structure (Diamond) unit cell or a gyroid minimal surface unit cell. Different types of minimal surface unit cells have different geometric characteristics and performance advantages. In this embodiment, the type of minimal surface unit cell is determined based on the heat dissipation requirements of the heat dissipation structure, which can optimize the thermal conductivity and mechanical strength of the heat dissipation structure.

[0101] In an embodiment of the present application, the correspondence between the porosity of the minimal surface unit cell in each area of ​​the heat dissipation structure and the unit cell permeability, equivalent thermal conductivity coefficient and resistance coefficient of the corresponding area can be determined according to the type of minimal surface unit cell and based on heat-flow simulation analysis.

[0102] Among them, thermal-fluid simulation analysis is a multi-physics field simulation technology used to study the interaction between heat conduction and fluid flow. Therefore, this embodiment can use thermal-fluid simulation analysis to determine the correspondence between the porosity of the minimal surface unit cell in different areas of the heat dissipation structure and the unit cell permeability, equivalent thermal conductivity coefficient, and resistance coefficient.

[0103] In this embodiment, through heat-fluid simulation analysis, the unit cell permeability, equivalent thermal conductivity, and resistance coefficient at different porosities can be calculated. The data obtained from the simulation analysis are then fitted to establish a first correspondence between porosity and unit cell permeability, equivalent thermal conductivity, and resistance coefficient. The fitting method can use polynomial fitting, exponential fitting, and other methods. This embodiment can also optimize the design of minimal surface unit cells in different regions of the heat dissipation structure based on the established first correspondence, thereby improving the heat dissipation performance of the heat sink.

[0104] It should be understood that different types of minimal surface unit cells correspond to different implicit functions. Therefore, the embodiment of the present application can also determine the implicit function of the minimal surface unit cells in each area of ​​the heat dissipation structure according to the type of the minimal surface unit cells.

[0105] Based on this, the implicit functions of the minimal surface unit cells in different regions can be applied to different regions of the heat dissipation structure to generate the required minimal surface unit cells.

[0106] On this basis, this embodiment can also determine the implicit function of the minimal surface unit cell in each area of ​​the heat dissipation structure according to the distribution of the topology optimization design variables of the minimal surface unit cell, and the correspondence between the topology optimization design variables of each area and the right-hand side term of the implicit function of the corresponding minimal surface unit cell.

[0107] In the embodiment of the present application, it is assumed that the implicit function of the minimal surface unit cell is as follows:

[0108] F(x,y,z)=C

[0109] The right-hand term C is related to the porosity ε of the minimal surface unit cell. The larger the right-hand term C, the greater the minimal surface solid volume fraction and the smaller the porosity ε. For a given type of minimal surface unit cell, adjusting the value of the right-hand term C can obtain different minimal surface unit cell skeletons, calculate the porosity ε, and establish a functional relationship between the right-hand term C and the porosity ε: ε = ε(C). During the partition filling topology optimization process, the porosity of the minimal surface unit cell is set to vary from ε0 to ε1. The functional relationship between the topology optimization design variable d and the porosity ε can be:

[0110] ε=ε0+d(ε1-ε0)

[0111] When the topology optimization design variable increases from 0 to 1, the porosity of the minimal surface increases from the minimum porosity ε0 to the maximum porosity ε1. According to the third correspondence between the topology optimization design variable d of the minimal surface unit cell in different regions and the implicit function right-hand side term C of the minimal surface unit cell in the corresponding region The topology optimization design variable d can be mapped to the right-hand side term C of the minimal surface unit cell.

[0112] In one example, according to the third correspondence The design variable d is mapped to the right-hand side term C of the implicit function of the minimal surface. Combining Matlab with implicit modeling techniques, a field-driven theory-based minimal surface heat dissipation structure with arbitrary variable density is established. The structure features a different solid volume fraction for the minimal surface unit cell in each region, and the transition between regions is completely smooth.

[0113] From the above description, we can see that the right-hand term C is related to the porosity ε of the minimal surface unit cell. A larger right-hand term C indicates a greater minimal surface solid volume fraction and a smaller porosity ε. For a given type of minimal surface unit cell, adjusting the value of the right-hand term C yields different minimal surface unit cell skeletons, allowing the porosity ε to be calculated. This establishes a functional relationship between the right-hand term C and the porosity ε: ε = ε(C).

[0114] As can be seen from the above description, the porosity of a minimal surface cell refers to the ratio of the pore volume to the total volume of the minimal surface cell. The porosity of a minimal surface cell is complementary to the solid volume fraction of the minimal surface cell. Specifically, the sum of the solid volume fraction and the porosity equals 100%. Therefore, once the porosity of the minimal surface cell in each region is determined, the solid volume fraction of the minimal surface cell in that region can be determined.

[0115] In some embodiments, in each region of a minimal surface superstructure, the solid volume fraction of each minimal surface unit cell is determined by averaging the solid volume fractions of all minimal surface unit cells in the region set in which it is located; wherein the region set includes the minimal surface unit cell and the region where multiple minimal surface unit cells that meet a first preset distance from it are located. The first preset distance can be set according to specific design requirements and is not specifically limited in the embodiments of the present application. For example, the region set is the region within a range of two minimal surface unit cell sizes from the minimal surface unit cell.

[0116] The above average calculation may include a volume average operation and an interpolation operation.

[0117] The volume averaging operation is a mathematical operation used to calculate the average solid volume fraction of all unit cells within a region. The interpolation operation, based on the average solid volume fraction, interpolates the regions between known solid volume fractions, filling in regions with unknown solid volume fractions to obtain the optimized solid volume fractions for each region.

[0118] Based on this, the solid volume fraction of the minimal surface unit cell in each region is obtained by performing volume averaging and interpolation operations on the solid volume fraction of the minimal surface unit cell. Therefore, although the solid volume fractions of the minimal surface unit cells in each region of the heat dissipation structure are different, the minimal surface unit cells in each region of the heat dissipation structure can transition completely smoothly, and the convective heat transfer performance is high.

[0119] In some embodiments, in a minimal surface superstructure, the solid volume fraction of the minimal surface unit cell in the target area can be determined by the solid volume fraction of the minimal surface unit cell at a second preset distance from it; wherein, the target area includes the area where the minimal surface unit cell whose solid volume fraction has not yet been determined is located.

[0120] Among them, the second preset distance can be set according to specific design requirements, and the embodiments of the present application do not impose any special limitations on this.

[0121] In some examples, the second preset distance may be the size of the minimal surface unit cell.

[0122] Based on this, the solid volume fraction of the minimal surface unit cell can be determined according to the solid volume fraction of the minimal surface unit cell in the area surrounding the minimal surface unit cell. On the one hand, the volume fraction of all minimal surface unit cells in the minimal surface superstructure can be obtained. On the other hand, the minimal surface unit cells in each area can be smoothly transitioned, thereby improving the overall performance and stability of the heat dissipation structure.

[0123] Optionally, the minimal surface unit cell of the heat dissipation structure of the embodiment of the present application includes a diamond crystal structure unit cell or a spiral minimal surface unit cell.

[0124] Among them, diamond crystal structure (Diamond) unit cells have good structural stability, high specific surface area and thermal conductivity. Therefore, the minimal surface unit cell of the heat dissipation structure in the embodiment of the present application adopts diamond crystal structure unit cells to improve the stability and heat dissipation efficiency of the heat dissipation structure.

[0125] Gyroid cells have a high specific surface area, providing more surface area for contact with fluids (such as air or liquid), thereby enhancing the heat dissipation efficiency of the heat sink. Furthermore, the high specific surface area helps increase the heat exchange rate, allowing heat to be transferred from the heat source to the cooling medium more quickly.

[0126] Reference Figure 1 , shows a structural diagram of a heat dissipation structure established using diamond crystal structure unit cells, wherein the structure in the a1 area of ​​the heat dissipation structure is enlarged as shown in the structure in a2, and it can be seen that the minimal surface unit cell of the heat dissipation structure has a diamond crystal structure.

[0127] The pore communication direction of the heat dissipation structure is the X direction. In some embodiments, the pore communication direction of the heat dissipation structure may be the pressure gradient direction.

[0128] It should be understood that the pressure gradient is the spatial derivative of the scalar field pressure and can be used to describe the direction of the driving force of fluid flow, which is the direction of pressure drop. Therefore, setting the pore connection direction of the heat dissipation structure to the direction of the pressure gradient can reduce flow resistance.

[0129] Reference Figure 2 , shows a structural diagram of a heat dissipation structure built using a spiral minimal surface unit cell. The structure in region b1 of the heat dissipation structure is magnified as shown in region b2, showing that the minimal surface unit cell of the heat dissipation structure has a spiral structure.

[0130] When the minimal surface unit cell of the minimal surface superstructure is the spiral minimal surface unit cell, the connection direction of the fluid domain of the minimal surface superstructure is along the horizontal direction to reduce the flow resistance of the heat dissipation structure.

[0131] In a second aspect, embodiments of the present application further provide a heat sink comprising a fluid channel and the heat dissipation structure of the first aspect. The heat dissipation structure is disposed on one side of the fluid channel; the fluid channel is used to circulate a coolant; and the heat dissipation structure is used to dissipate heat from a heat source to be dissipated based on the fluid channel. In other words, the heat dissipation structure is used to transfer heat from the heat source to be dissipated to the fluid channel to dissipate heat from the heat source to be dissipated.

[0132] In the embodiment of the present application, the heat generated by the heat source is transferred to the fluid channel by using the heat dissipation structure, and the heat is balanced by using the coolant in the fluid channel to cool the heat source.

[0133] It should be understood that since the heat dissipation structure in the radiator is the heat dissipation structure in the first aspect, the heat dissipation structure of the radiator uses the minimal surface unit cell of the minimal surface superstructure as the design primitive, and the structure of the minimal surface unit cell in each area is precisely controlled by implicit functions. Therefore, the heat dissipation temperature uniformity of the radiator is good.

[0134] Furthermore, the heat dissipation structure of the heat sink in the embodiment of the present application utilizes a minimal surface superstructure. This minimal surface superstructure has a large specific surface area and a significant flow disturbance structure. At the same solid volume fraction, the flow resistance is much lower than that of lattice structures such as simple cubic and body-centered cubic. Therefore, the heat sink provided by the embodiment of the present application has better heat dissipation performance than heat sinks with lattice heat dissipation structures.

[0135] Based on the above description, the radiator in the embodiment of the present application can utilize the better temperature uniformity and better heat dissipation performance of the heat dissipation structure to uniformly cool down various areas of the heat source to avoid local over-temperature of the heat source.

[0136] It should be understood that the locations of the coolant inlet and outlet can be designed to allow the coolant to flow in different directions, thereby improving the heat dissipation performance of the radiator. Furthermore, the locations of the coolant inlet and outlet will also vary for heat dissipation structures formed by different types of minimal surface unit cells.

[0137] In one example, the minimal surface unit cell of the heat dissipation structure is a diamond crystal structure unit cell, and along the diagonal direction of the fluid channel, the coolant inlet and the coolant outlet of the fluid channel are respectively arranged at two diagonals of the fluid channel.

[0138] It should be understood that the coolant inlet and outlet are arranged along the diagonal line of the fluid channel to ensure that the coolant is evenly distributed in the fluid channel and maximize the heat exchange efficiency.

[0139] The diagonally arranged coolant inlet and outlet can also ensure that the coolant flows evenly throughout the fluid channel, avoiding local overheating and improving heat dissipation efficiency.

[0140] The diagonally arranged coolant flow path can also reduce flow resistance, lower pressure drop, increase coolant flow rate, and enhance the contact area between the coolant and the heat dissipation structure, thereby improving heat exchange efficiency.

[0141] In one specific embodiment, the coolant inlet is located at the lower right corner of the fluid channel, while the coolant outlet is located at the upper left corner of the fluid channel. The heat source is the IGBT module located above the heat dissipation structure. Based on this, the heat dissipation in this embodiment has the following effects:

[0142] 1) The gradient fluid channels at the inlet and outlet ensure that the flow rate through the IGBT module cluster area is basically consistent, increasing temperature uniformity; 2) The macroscopic flow direction of the fluid is basically consistent with the pore connectivity direction of the minimal surface unit cells in each area of ​​the heat dissipation structure; 3) The lateral inlet and outlet pipeline layout allows the coolant to flow in parallel through the IGBT module heat source cluster area. Compared with the common left-in and right-out pipeline layout of the current IGBT module, this solution reduces the radiator pressure drop by about 3-4 times and improves temperature uniformity.

[0143] Optionally, the fluid channel includes an aluminum water trough and a copper base plate. The aluminum water trough and the copper base plate are tightly connected by bolts. The aluminum water trough provides a flow channel for the coolant on one hand, and on the other hand, it conducts heat on the base plate to other areas, thereby increasing the heat exchange area and reducing the lateral thermal resistance.

[0144] Optionally, the minimal surface unit cell of the heat dissipation structure is a diamond crystal structure unit cell, and the pore connection direction of the minimal surface unit cell in each area of ​​the heat dissipation structure can be along the pressure gradient direction of the heat dissipation structure.

[0145] It should be understood that the pressure gradient is the spatial derivative of the scalar field pressure, indicating the direction of the fastest pressure drop and describing the driving force of fluid flow. Therefore, aligning the pore connectivity of the heat dissipation structure with the pressure gradient can reduce the coolant flow resistance in the radiator.

[0146] In summary, the heat dissipation structure in this embodiment is a locally variable-density heat dissipation structure designed based on topology optimization methods. It is a minimal surface superstructure whose primitive type uses diamond crystal structure units with a large specific surface area. When this heat sink is applied to cool FRD (Fast Recovery Diode) and IGBT (Insulated Gate Bipolar Transistor) chips, the solid volume fraction of the minimal surface unit cell is low near the FRD and IGBT chip regions, while the solid volume fraction of the unit cell in other regions is high. This allows fluid to be drawn into the vicinity of the chip, reducing the local temperature of heat sources near the chip. Furthermore, this heat dissipation structure, designed based on implicit modeling technology and topology optimization methods, has a relatively smooth surface and excellent overall connectivity. The geometric features and pore structures of each region smoothly connect and transition, reducing flow resistance several times compared to lattice heat dissipation structures with the same volume fraction (such as simple cubic SC and body-centered cubic BCC). This smoothly transitioned variable-density minimal surface superstructure has high heat dissipation efficiency, facilitates the design of zoned gradient structures to eliminate local hot spots, and provides a wide range of design freedom. Rational design of the unit cell structure and orientation ensures that the pore connectivity of the overall heat dissipation structure aligns with the macroscopic pressure gradient, further reducing coolant flow resistance. Adjusting the type, porosity, and size of the minimal surface primitives in different regions of the heat dissipation structure can reduce the temperature of localized high-power-density heat sources while simultaneously optimizing two key performance indicators: heat dissipation efficiency and flow resistance.

[0147] In another example, the minimal surface unit cell of the heat dissipation structure is a spiral minimal surface unit cell, and the coolant inlet of the fluid channel is arranged on at least one side of the fluid channel, for example, the coolant inlet of the fluid channel is arranged on both sides of the fluid channel.

[0148] The coolant outlet of the fluid channel is arranged in a middle area of ​​the fluid channel.

[0149] Optionally, the coolant flow direction of the fluid channel is horizontal.

[0150] It should be understood that reference Figure 2 The structural characteristics of the spiral minimal surface unit cell are different from those of the diamond crystal structure unit cell mentioned above. The direction of its wavy skeleton (the direction of fluid domain connection) is along the horizontal direction. In order to reduce the flow resistance of the heat dissipation structure formed by the spiral minimal surface unit cell, the embodiment of the present application sets the structure of the fluid channel to have inlets on both sides and an outlet in the middle, and the coolant flow direction of the fluid channel (the direction of the overall pressure gradient) is along the horizontal direction. Compared with the heat dissipation structure formed by the diamond crystal structure unit cell with the same volume fraction and pore density distribution, the flow resistance of this heat dissipation structure is about 2000Pa lower.

[0151] Optionally, a flow equalizing portion is provided at the coolant inlet to achieve the effect of equalizing the flow of the coolant.

[0152] For example, the flow balancing portion may include small protrusions, which are provided at the inlets on both sides of the fluid channel to achieve a better flow balancing effect. It should be understood that the flow balancing portion may also have other structures, and the present embodiment does not impose any special limitation on this.

[0153] In an optional embodiment, the solid volume fraction of the minimal surface unit cell of the heat dissipation structure close to the heat source of the heat sink is smaller than the solid volume fraction of the minimal surface unit cell of the heat dissipation structure far from the heat source of the heat sink; wherein, the solid volume fraction of the minimal surface unit cell is inversely proportional to the porosity of the minimal surface unit cell.

[0154] The solid volume fraction of the minimal surface unit cell near the heat source of the radiator is low, while the solid volume fraction of the unit cell in other areas is high. Based on this, the cold source in the fluid channel can be introduced near the heat source to reduce the local temperature of the heat source near the heat source.

[0155] In summary, the geometric structural characteristics of the spiral minimal surface unit cell are different from those of the diamond crystal structure unit cell, and the direction of its wavy skeleton (the direction of fluid domain connectivity) is along the horizontal direction. In order to reduce the flow resistance of the variable density heat dissipation structure formed by the spiral minimal surface unit cell, the structure of the fluid channel can be set to have inlets on both sides and an outlet in the middle, and the flow direction (the direction of the overall pressure gradient) is along the horizontal direction. Compared with the heat dissipation structure of the diamond crystal structure unit cell with the same volume fraction and pore density distribution, the flow resistance of this heat dissipation structure is about 2000Pa lower. There are small protrusions at the inlets on both sides to achieve the effect of uniform flow. The solid volume fraction of the spiral minimal surface unit cell is different in the entire area, but the grid between the unit cells has a completely smooth transition, which helps to reduce the fluid loss along the way.

[0156] When the heat sink is used to cool an IGBT chip, the solid volume fraction of the minimal surface unit cell of the heat dissipation structure is low near the IGBT chip, which can guide the fluid into the local hot spot area and quickly reduce the chip temperature.

[0157] It should be understood that most minimal surface superstructures generally have high convective heat transfer performance. By selecting different types of unit cell structures and rotating and adjusting the unit cell direction and the full-field porosity distribution according to the unit cell characteristics and pore distribution, a porous heat dissipation structure with low flow resistance and high heat transfer coefficient can be designed.

[0158] Referring to Figures 3(a), 3(b), 3(c), 3(d), 4(a), 4(b), 4(c), 4(d), and 5(a), 5(b), 5(c), 5(d), a comparison is given of the heat dissipation of the IGBT by the current heat dissipation structure and the minimal surface heat dissipation structure formed by the diamond crystal structure unit cell and the spiral minimal surface unit cell of the embodiment of the present application. The current heat dissipation solution adopts a flow channel design mode with an inlet on the left and an outlet on the right, and the needle-column-shaped spoiler structure is evenly distributed throughout the flow field. This uniformly distributed serial flow channel solution makes it difficult to ensure temperature uniformity across the entire chip. That is, the coolant temperature will rise along the flow direction, and the heat dissipation effect will be reduced. As can be seen from the temperature cloud map in Figure 3(c), along the streamline direction, the temperature on the right side of the chip is significantly higher than that on the left, with the highest temperature reaching 128.18°C. As can be seen from Figure 3(b) and Figure 3(d) of the staggered cylindrical disturbance structure, the flow disturbance is small and there is an obvious backflow dead zone behind the cylinder. However, the inlet and outlet pressure drop is relatively low, at 2173.7 Pa.

[0159] Figures 4(a), 4(b), 4(c), and 4(d) show the heat dissipation performance of a heat dissipation structure whose minimal surface unit cell is a diamond crystal structure unit cell. As shown in Figure 4(d), after the coolant enters the fluid channel from the inlet, it is evenly divided into three parallel flow paths, with the flow rate in each flow path being essentially the same, which can minimize the maximum temperature of the chip. The chip temperature on this heat dissipation structure is only 97.85°C, which is 30.33°C lower than the current pin-column heat dissipation structure. The pressure drop of this heat dissipation structure is 6828.53Pa, which is only about 4654.83Pa higher than the pin-column structure, far lower than the maximum flow resistance of 30KPa-40KPa that the IGBT heat dissipation structure can withstand.

[0160] Figures 5(a), 5(b), 5(c), and 5(d) show the heat dissipation performance of a heat dissipation structure in which the minimal surface unit cell is a spiral minimal surface unit cell. Figures 5(b) and 5(c) show that the chip temperature above the heat dissipation structure in which the minimal surface unit cell is a spiral minimal surface unit cell is 101.85°C, and the voltage drop is only 4721Pa. This chip temperature is approximately 27°C lower than that of current IGBT heat dissipation structures, and the voltage drop increases by only 2548Pa, demonstrating excellent heat dissipation performance and low flow resistance.

[0161] Thirdly, refer to Figures 6-11 The present application also provides a heat dissipation device comprising any heat sink described in the second aspect and a heat source. The heat source is disposed on a side of the heat dissipation structure 6 of the heat sink facing away from the fluid channel 7; the fluid channel 7 is configured to circulate a coolant; and the heat dissipation structure 6 is configured to dissipate heat from the heat source via the fluid channel 7. In other words, the heat dissipation structure 6 is configured to transfer heat from the heat source to the fluid channel 7, thereby dissipating heat from the heat source.

[0162] It should be understood that since the heat sink in the second aspect can achieve better temperature uniformity and better heat dissipation performance, the heat dissipation device can evenly cool down various areas of the heat source, thereby avoiding the situation where the heat source has a local temperature that is too high.

[0163] Based on the second aspect, the minimal surface unit cell in the heat dissipation structure of the heat sink can be a diamond crystal structure unit cell, or a spiral minimal surface unit cell, wherein, Figures 6-10 The minimal surface unit cell in the heat dissipation structure of the heat sink is a diamond crystal structure unit cell, in which, Figure 6 This is the structural diagram of the heat dissipation device. Figure 7 For the Figure 6 The cross-section obtained from the mid-section AA; Figure 8 For the Figure 6 The cross-section obtained from the middle section BB; Figure 9 For the Figure 7 The cross-section obtained by the mid-section CC; Figure 10 The exploded diagram of the heat dissipation device in which the minimal surface unit cell in the heat dissipation structure is a spiral minimal surface unit cell. Figure 11 An exploded diagram of a heat dissipation device in which the minimal surface unit cell in the heat dissipation structure is a spiral minimal surface unit cell.

[0164] In some examples, reference Figures 6-11 When the coolant in the above-mentioned fluid channel is water, the heat dissipation device may further include a water tank 8, in which water is stored. The water circulates from the inlet to the outlet of the fluid channel as a coolant to cool the heat source. It should be understood that a large amount of water can be stored in the water tank, and the circulated water can flow back into the water tank for cooling. Other water that has not been circulated or cooled flows back into the fluid channel from the inlet to achieve cooling of the heat source end, thereby ensuring the reliability of the radiator.

[0165] Optionally, the water tank may be an aluminum alloy water tank, which can achieve a better heat exchange effect with the outside world to ensure that the cooling water therein is at a lower temperature.

[0166] In some examples, the heat source may be a battery or a chip. It should be understood that the embodiments of the present application may also dissipate heat from other types of heat sources, without any particular limitation.

[0167] In an optional embodiment, when the heat source is a chip 1 , the device further includes a first connection layer 2 and an insulating layer 3 , the first connection layer 2 is arranged between the heat source and the insulating layer 3 , and the insulating layer 3 is arranged between the heat source and the heat dissipation structure 6 .

[0168] Among them, the above-mentioned chip 1 can be an FRD chip and an IGBT chip. It should be understood that the chip can also be other types of chips, and the embodiments of the present application do not make special limitations on this.

[0169] The insulating layer 3 is used to electrically insulate the first connection layer 2 from the heat dissipation structure 6 to ensure the functionality of the heat dissipation device. The first connection layer 2 is used to connect the chip 1 and the insulating layer 3.

[0170] Optionally, the thermal conductivity of the first connection layer 2 is in the range of 90 W / (m*K)-238 W / (m*K). Within this range, the first connection layer 2 can also effectively reduce the thermal resistance from the chip 1 to the insulating layer 3.

[0171] The first connection layer 2 can be made of a material with high thermal conductivity, such as double-sided nanosilver, which has a thermal conductivity of 238 W / (m*K). The first connection layer 2 can be prepared by a sintering process or a welding process.

[0172] The heat dissipation device in this embodiment further includes a second connection layer 4 and a heat-conducting base plate 5. The second connection layer 4 is arranged between the insulating layer 3 and the heat-conducting base plate 5. The heat-conducting base plate 5 is arranged between the insulating layer 3 and the radiator.

[0173] The second connection layer 4 is used to connect the insulating layer 3 and the heat-conducting base plate 5. The heat-conducting base plate 5 is used to achieve uniform heat conduction.

[0174] The thermal conductivity of the second connection layer 4 is in the range of 90 W / (m*K) to 238 W / (m*K). Based on this, the second connection layer can also effectively reduce the thermal resistance from the chip to the insulation layer 3.

[0175] The second connection layer 4 can be made of a material with high thermal conductivity, such as double-sided nanosilver, which has a thermal conductivity of 238 W / (m*K). The second connection layer 4 can be prepared by sintering or welding.

[0176] In the embodiment of the present application, the insulating layer 3 may be an active metal brazed ceramic layer or an aluminum nitride layer.

[0177] It should be understood that the insulating layer 3 in the heat dissipation device not only needs to provide electrical insulation, but also needs to have good thermal conductivity.

[0178] Active metal brazing is a method of joining ceramic materials to metal materials by adding active metals (such as titanium, zirconium, etc.) during the brazing process to enhance the bonding strength between ceramic and metal. Ceramic materials generally have high hardness, high wear resistance and excellent electrical insulation.

[0179] Therefore, the active metal brazed ceramic layer can not only achieve a high-strength bond between ceramic and metal, ensuring the mechanical stability of the insulating layer 3, but also effectively prevent electrical short circuits and failures, and is suitable for heat dissipation applications in high-temperature environments.

[0180] Aluminum nitride is a ceramic material with high thermal conductivity and excellent electrical insulation properties, used for heat dissipation and electrical insulation in electronic devices.

[0181] Furthermore, the heat sink further includes a third connection layer provided on both sides of the active metal brazed ceramic layer, thereby further enhancing the overall stability of the heat sink.

[0182] In some examples, to reduce the contact thermal resistance between the heat-conducting base plate 5 and the heat sink, the embodiments of the present application can use a thermally conductive material to integrally form the heat-conducting base plate 5 and the heat dissipation structure 6. The thermally conductive material can be copper or other suitable thermally conductive materials, which are not specifically limited in the embodiments of the present application.

[0183] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation structure, characterized in that: The heat dissipation structure has a minimal surface superstructure; the minimal surface superstructure includes a plurality of minimal surface unit cells arranged in a lattice; The minimal surface unit cells in different regions of the minimal surface superstructure have corresponding preset structural parameters; wherein the preset structural parameters at least include porosity.

2. The heat dissipation structure according to claim 1, characterized in that: The minimal surface unit cell in the minimal surface superstructure includes a diamond crystal structure unit cell or a spiral minimal surface unit cell.

3. The heat dissipation structure according to claim 2, characterized in that: When the minimal surface unit cell in the minimal surface superstructure is the diamond crystal structure unit cell, the pore connection direction of the minimal surface unit cell in each region of the minimal surface superstructure is along the pressure gradient direction of the heat dissipation structure.

4. The heat dissipation structure according to claim 2, characterized in that: When the minimal surface unit cell of the minimal surface superstructure is the spiral minimal surface unit cell, the connection direction of the fluid domain of the minimal surface superstructure is along the horizontal direction.

5. The heat dissipation structure according to any one of claims 1 to 4, characterized in that: The solid volume fraction of the minimal surface unit cell of the minimal surface superstructure close to the heat source is smaller than the solid volume fraction of the minimal surface unit cell of the minimal surface superstructure far from the heat source; wherein the solid volume fraction of the minimal surface unit cell is inversely proportional to the porosity of the minimal surface unit cell.

6. The heat dissipation structure according to claim 5, characterized in that: In each region of the minimal surface superstructure, the solid volume fraction of each minimal surface unit cell is determined by averaging the solid volume fractions of all minimal surface unit cells in the region set in which it is located; wherein the region set includes the minimal surface unit cell and the region in which multiple minimal surface unit cells that meet a first preset distance from it are located.

7. The heat dissipation structure according to claim 6, characterized in that: In the minimal surface superstructure, the solid volume fraction of the minimal surface unit cell in the target area can be determined by the solid volume fraction of the minimal surface unit cell at a second preset distance from it; wherein, the target area includes the area where the minimal surface unit cell whose solid volume fraction has not yet been determined is located.

8. The heat dissipation structure according to any one of claims 1 to 4, characterized in that: In the minimal surface superstructure, the porosity of the minimal surface unit cell in each region is determined according to the implicit function of the minimal surface unit cell in the corresponding region.

9. The heat dissipation structure according to claim 8, characterized in that: The preset structural parameters also include a thermal equivalent coefficient, which includes the permeability of the minimal surface unit cell, the equivalent thermal conductivity coefficient of the minimal surface unit cell, and the resistance coefficient of the minimal surface unit cell.

10. The heat dissipation structure according to claim 8, characterized in that: In the minimal surface superstructure, the implicit function of the minimal surface unit cell in each region is determined according to the topological optimization design variables of the minimal surface unit cell in the corresponding region; The topology optimization design variables of the minimal surface unit cell in each region have a corresponding mapping relationship with the thermal equivalent coefficient and porosity of the minimal surface unit cell in the corresponding region.

11. A radiator, characterized in that: include: A fluid channel and a heat dissipation structure according to any one of claims 1 to 10, wherein the heat dissipation structure is provided on one side of the fluid channel; The fluid channel is used to circulate the coolant; The heat dissipation structure is used to transfer the heat of the heat source to be dissipated to the fluid channel, so as to dissipate the heat of the heat source to be dissipated.

12. The radiator according to claim 11, characterized in that When the minimal surface unit cell of the heat dissipation structure is a diamond crystal structure unit cell, along the diagonal direction of the fluid channel, the coolant inlet and the coolant outlet of the fluid channel are respectively arranged at two diagonals of the fluid channel.

13. The radiator according to claim 12, wherein: The pore communication direction of the minimal surface unit cells in each area of ​​the heat dissipation structure is along the pressure gradient direction of the heat dissipation structure.

14. The heat sink according to claim 11, wherein When the minimal surface unit cell of the heat dissipation structure is a spiral minimal surface unit cell, along the extension direction of the fluid channel, the coolant inlet of the fluid channel is arranged on at least one side of the fluid channel, and the coolant outlet of the fluid channel is arranged in the middle area of ​​the fluid channel.

15. The radiator according to claim 14, characterized in that The coolant in the fluid channel flows in a horizontal direction.

16. The heat sink according to claim 14, wherein: The coolant inlet is provided with a flow balancing portion.

17. The radiator according to any one of claims 11 to 16, characterized in that: The solid volume fraction of the minimal surface unit cell of the heat dissipation structure close to the heat source of the radiator is smaller than the solid volume fraction of the minimal surface unit cell of the heat dissipation structure far from the heat source of the radiator; wherein the solid volume fraction of the minimal surface unit cell is inversely proportional to the porosity of the minimal surface unit cell.

18. A heat dissipation device, characterized in that: A heat sink and a heat source comprising any one of claims 11 to 17; The heat source is arranged on a side of the heat dissipation structure (6) of the radiator away from the fluid channel (7); The fluid channel (7) is used for circulating the coolant; The heat dissipation structure (6) is used to transfer the heat of the heat source to be dissipated to the fluid channel (7) to dissipate the heat of the heat source.

19. The heat dissipation device according to claim 18, characterized in that: The heat source is a battery or a chip (1).

20. The heat dissipation device according to claim 19, characterized in that: When the heat source is a chip (1), the device further comprises a first connection layer (2) and an insulating layer (3), wherein the first connection layer (2) is arranged between the heat source and the insulating layer (3), and the insulating layer (3) is arranged between the heat source and the heat sink.

21. The heat dissipation device according to claim 20, characterized in that: The device further comprises a second connecting layer (4) and a heat-conducting base plate (5), wherein the second connecting layer (4) is arranged between the insulating layer (3) and the heat-conducting base plate (5), and the heat-conducting base plate (5) is arranged between the insulating layer (3) and the heat sink.

22. The heat dissipation device according to claim 21, characterized in that: The heat-conducting base plate (5) and the heat dissipation structure (6) are integrally formed using heat-conducting material.

23. The heat dissipation device according to claim 20, characterized in that: The insulating layer (3) comprises an active metal brazing ceramic layer or an aluminum nitride layer.

24. The heat dissipation device according to claim 23, characterized in that: The heat dissipation device further includes a third connection layer arranged on both sides of the active metal brazing ceramic layer.

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