An igct heat dissipation assembly based on an extra-high voltage power grid and a heat dissipation method thereof

Abstract

The application relates to an IGCT heat dissipation technology field for an extra-high voltage power grid, in particular to an IGCT heat dissipation assembly based on an extra-high voltage power grid and a heat dissipation method thereof, which comprises a heat transfer base body, a cooling regulation and control module, a driving regulation and control device and an electrostatic neutralization unit. The IGCT shell is designed in a three-layer composite material, efficient heat conduction and electrical insulation are realized through a heat-conducting metal layer, a corrugated metal framework and a ceramic insulation layer; the cooling regulation and control module utilizes a separation diaphragm and a liquid flow pump set to form turbulent heat exchange; the driving regulation and control device controls the flow of the cooling liquid through mechanical movement; and the electrostatic neutralization unit monitors and neutralizes the electric charge of the cooling liquid in real time. Through mechanical driving of the honeycomb liquid cooling array, turbulent flow strengthening heat dissipation and the electrostatic elimination mechanism of the charge neutralization module, the technical bottleneck of the existing IGCT heat dissipation assembly is comprehensively solved, and an efficient and reliable heat dissipation solution is provided for the IGCT in the extra-high voltage power grid.

Description

TECHNICAL FIELD

[0001] The application relates to an IGCT heat dissipation technology field for an extra-high voltage power grid, in particular to an IGCT heat dissipation assembly for an extra-high voltage power grid and a heat dissipation method thereof. BACKGROUND

[0002] In an extra-high voltage power grid, an IGCT (integrated gate-commutated thyristor) as a core power device generates a large amount of heat during operation, and the heat dissipation performance of the IGCT directly affects the stability and safety of the power grid. However, the existing IGCT heat dissipation assembly has many technical bottlenecks: first, the heat transfer efficiency is insufficient, the traditional substrate is mostly made of single metal or ceramic material, and either the contact thermal resistance is too large (> 0.1 ℃ / W) due to the mismatch of the thermal expansion coefficients, or the heat dissipation of the chip cannot be quickly conducted due to the poor thermal conductivity, and there is a lack of effective heat diffusion structure, which easily forms local hot spots and affects the service life of the IGCT; second, the heat dissipation mode is single and the synergy is poor, and the cooling liquid in the pure liquid cooling system is mostly in a laminar flow state, and the heat exchange coefficient is low; third, the charge control ability is weak, and the flow of the cooling liquid and the friction of the components in the extra-high voltage environment easily generate static charges, and the traditional assembly lacks real-time neutralization and discharge mechanism, the charge density often exceeds 50 muC / m3, and the charge decay time is as long as 120s or more, the risk of static electricity discharge is high, which may interfere with the operation of the equipment, or even cause serious faults such as insulation breakdown, thereby restricting the reliable application of the IGCT in the extra-high voltage power grid. SUMMARY

[0003] The application provides an IGCT heat dissipation assembly for an extra-high voltage power grid and a heat dissipation method thereof, which solves the technical bottlenecks of the traditional heat dissipation assembly in the extra-high voltage scene.

[0004] The application provides an IGCT heat dissipation assembly for an extra-high voltage power grid, which comprises the following structure:

[0005] The top of the substrate is provided with an IGCT, the inner wall of the IGCT is provided with a molybdenum-copper alloy layer, the middle layer is provided with a corrugated copper alloy framework, the outer layer of the corrugated copper alloy framework is covered with an aluminum nitride ceramic layer, the thermal conductivity of the molybdenum-copper alloy reaches 180 W / m·K, and the thermal expansion coefficient is close to that of the electrode of the IGCT (CTE: 6.5-7.5ppm / K) ), thereby reducing the contact thermal resistance and quickly absorbing the chip heat; the intermediate layer is a corrugated copper alloy skeleton, which increases the heat transfer area by 40% through the corrugated structure and uniformly transmits heat to the outer layer; the outer layer is covered with an aluminum nitride ceramic layer, which has high insulation (dielectric strength ≥ 15kV / mm) and high thermal conductivity (thermal conductivity ≥ 170W / m·K), and can guide heat to the liquid cooling system while blocking the interference of the extra-high voltage electric field.

[0006] Further, the honeycomb liquid cooling array is arranged on the top of the substrate to contact and dissipate heat from the aluminum nitride ceramic layer. The honeycomb liquid cooling array includes a liquid cooling base, a liquid cooling cavity, a servo motor, a double-headed rocker, an elastic membrane, a contact rod, a water pump group and the like. The liquid cooling cavity is divided into a liquid flow cavity and a replacement cavity, which are separated by the elastic membrane. When the cooling liquid flows in the liquid flow cavity, due to the periodic movement of the elastic membrane, the cooling liquid forms a turbulent flow, which increases the heat transfer coefficient by 50%. The contact rod moves with the elastic membrane and drives the fan blades to rotate, forming air cooling heat dissipation, and combining with liquid cooling heat dissipation, realizing multi-dimensional heat dissipation. The liquid cooling base is arranged between the substrate and the IGCT and is connected to the liquid flow cavity, and the top of the liquid cooling base is in direct contact with the IGCT, thereby increasing the liquid cooling heat dissipation area.

[0007] In particular, the driving assembly is arranged on the top of the substrate to drive the start of the honeycomb liquid cooling array. The servo motor drives the double-headed rocker to rotate, so that the extrusion part periodically extrudes the elastic membrane along the arc-shaped hole, thereby providing power for the liquid cooling circulation. When the extrusion part presses the elastic membrane, the volume of the liquid flow cavity is reduced to generate pressure, thereby pushing the cooling liquid to flow faster. When the extrusion part is separated, the spring pulls the elastic membrane to reset, thereby forming a mechanical reciprocating motion. The spring is connected to one side of the protrusion of the elastic membrane, thereby ensuring the stability and repeatability of the elastic membrane during the resetting process.

[0008] Further, the charge neutralization module is embedded in the honeycomb liquid cooling array and moves synchronously with the honeycomb liquid cooling array. The charge neutralization module includes an iridium titanium oxide electrode and an ion controller. The iridium titanium oxide electrode monitors the charge density of the liquid flow in real time, and when the charge density exceeds 5μC / m³, the ion controller injects reverse ions to quickly eliminate the excess charge in the liquid flow. The inner wall of the replacement cavity is covered with a fluorinated silicon dioxide nano coating with a thickness of 2-5μm, which can reduce frictional static electricity and shorten the charge decay time to 0.5s.

[0009] In particular, the outer wall of the substrate is fixedly connected with a stand, the outer wall of the stand is provided with a plurality of evenly distributed positioning rings, the inside of the positioning ring is rotatably connected with a hollow column, the outer wall of the hollow column is provided with a fan blade, and the inner wall of the hollow column is provided with a groove. The outer wall of the contact rod is fixedly connected with a sliding block, and the sliding block corresponds to the groove.

[0010] The application further provides a heat dissipation method of the IGCT heat dissipation assembly for the ultra-high voltage power grid.

[0011] S1, the IGCT is arranged on the top of the substrate, and the IGCT starts heat conduction through a three-layer composite structure: the molybdenum-copper alloy layer is closely attached to the electrode of the IGCT, and the high thermal conductivity of the molybdenum-copper alloy layer is used to quickly absorb the heat of the chip; the corrugated copper alloy framework increases the heat transfer area through the corrugated structure, and uniformly diffuses the heat; the aluminum nitride ceramic layer guides the heat to the liquid cooling system by virtue of the high insulation and high thermal conductivity, and simultaneously blocks the interference of the ultra-high voltage electric field;

[0012] S2, the servo motor is started to drive the double-end rocker to rotate, so that the extrusion part periodically extrudes the stretchable membrane along the arc-shaped hole; when the extrusion part presses the stretchable membrane, the volume of the liquid flow cavity is reduced to generate pressure, and the cooling liquid is pushed to form turbulent flow; when the extrusion part is separated, the spring pulls the stretchable membrane to reset, and the water pump set pumps the low-temperature cooling liquid to complete the circulation;

[0013] S3, when the extrusion part extrudes the stretchable membrane, the cooling liquid in the liquid flow cavity forms turbulent flow, and the heat exchange coefficient is increased by 50%; the contact rod moves with the stretchable membrane, and drives the hollow column and the fan blade to rotate to cause air disturbance to generate air cooling heat dissipation;

[0014] S4, the charge neutralization module is started, and the iridium titanium oxide electrode monitors the charge density of the liquid flow in real time; when the charge density exceeds 5 mu C / m3, the ion controller injects reverse ions to quickly eliminate the excess charge in the liquid flow, and eliminates the risk of static electricity.

[0015] Further, the specific working process of the honeycomb liquid cooling array is as follows: after the servo motor on the positioning plate is started, the double-end rocker is driven to rotate, one end of the double-end rocker extends into the displacement cavity through the arc-shaped hole, and the extrusion part at the other end of the double-end rocker periodically extrudes the stretchable membrane when rotating. When the extrusion part approaches the stretchable membrane, the stretchable membrane is pushed to one side of the liquid flow cavity, the volume of the liquid flow cavity is reduced, and the internal cooling liquid flows under the action of pressure; when the extrusion part is away from the stretchable membrane, the stretchable membrane is reset under the action of the spring force, the volume of the liquid flow cavity is restored, and the water pump set pumps the low-temperature cooling liquid in the liquid storage cavity into the liquid flow cavity to form a circulation. The protruding end of the stretchable membrane is provided with a hemispherical structure, which can reduce the friction resistance with the extrusion part, and the contact rod moves with the stretchable membrane. When the extrusion part extrudes the stretchable membrane, the contact rod drives the hollow column and the fan blade to rotate through the sliding block and the groove, and air cooling heat dissipation is formed.

[0016] In particular, the working principle of the charge neutralization module is as follows: the iridium titanium oxide electrode in the liquid flow cavity monitors the charge density of the cooling liquid in real time, and when the ion controller detects that the charge density exceeds 5 mu C / m3, reverse ions are immediately injected into the electrode to neutralize the excess charge in the cooling liquid, and the continuous discharge of the charge is realized. The fluorinated silicon dioxide nano coating covering the inner wall of the displacement cavity has a surface resistivity of 10 0The characteristics of Ω can shorten the charge decay time to 0.5s, and completely eliminate the risk of static electricity.

[0017] The technical scheme of the application achieves the following beneficial effects:

[0018] Firstly, the matching thermal expansion coefficient of the molybdenum-copper alloy layer and the IGCT electrode reduces the contact thermal resistance, the corrugated copper alloy skeleton realizes uniform heat diffusion through the increase of the heat transfer area, and the aluminum nitride ceramic layer ensures high-efficiency heat conduction on the basis of high insulation, and the three layers cooperate to improve the thermal response speed by more than 30%, which provides a core guarantee for the stable operation of the IGCT in an extra-high voltage environment.

[0019] Secondly, liquid cooling and air cooling are cooperated to strengthen the heat dissipation effect. The periodic action of the telescopic film driven by the driving assembly forms turbulent flow of the cooling liquid in the liquid flow cavity, and the heat exchange coefficient is improved by 50%; the contact rod drives the fan blades to rotate to produce air cooling heat dissipation, and the heat dissipation capacity is significantly improved compared with the single liquid cooling scheme.

[0020] Finally, the charge neutralization module completely eliminates the static electricity hazard. The real-time reverse ion injection of the iridium-titanium oxide electrode and the ion controller can quickly neutralize the liquid flow charge, shorten the charge decay time to 0.5s, and avoid the interference or damage of static electricity accumulation on the extra-high voltage power grid equipment. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a perspective view of the IGCT heat dissipation assembly based on an extra-high voltage power grid in the application;

[0022] Figure 2 is a display diagram of the IGCT heat dissipation assembly based on an extra-high voltage power grid in the application;

[0023] Figure 3 is a schematic diagram of the IGCT heat dissipation assembly based on an extra-high voltage power grid in the application;

[0024] Figure 4 is a sectional view of the IGCT heat dissipation assembly based on an extra-high voltage power grid in the application;

[0025] Figure 5 is an enlarged view of A in the application;

[0026] Figure 6 is an enlarged view of B in the application;

[0027] Figure 7 is an exploded view of the IGCT heat dissipation assembly based on an extra-high voltage power grid in the application.

[0028] Wherein, 1, substrate; 2, molybdenum copper alloy layer; 3, aluminum nitride ceramic layer; 4, honeycomb liquid cooling array; 401, liquid cooling base; 402, liquid cooling cavity; 403, positioning plate; 404, servo motor; 405, liquid flow cavity; 406, displacement cavity; 407, contact rod; 408, annular film; 409, water pump group; 410, extrusion part; 411, fluorinated silicon dioxide nano coating; 412, telescopic film; 413, double-end rocker; 414, arc hole; 415, spring; 416, limiting tube; 417, sealing ring; 418, liquid storage cavity; 5, driving assembly; 6, charge neutralization module; 601, iridium titanium oxide electrode; 602, ion controller; 7, corrugated copper alloy skeleton; 8, stand; 9, positioning ring; 10, hollow column; 11, fan blade; 12, groove; 13, sliding block. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0030] The present application provides an IGCT heat dissipation assembly and heat dissipation method based on an ultra-high voltage power grid, combined with the attached Figure 1 to the attached Figure 7 The specific embodiments are described in detail. The heat dissipation assembly of the present application includes a substrate 1, a honeycomb liquid cooling array 4, a driving assembly 5 and a charge neutralization module 6, which work together to achieve efficient heat dissipation and static elimination functions.

[0031] The substrate 1 is the core carrier of the entire heat dissipation assembly, and the top of the substrate 1 is provided with an IGCT. The IGCT structure is designed as a three-layer composite material. The innermost cavity wall of the IGCT is a molybdenum copper alloy layer 2. The molybdenum copper alloy layer 2 is made of molybdenum copper alloy, and has a thermal conductivity of 180 W / m·K and a thermal expansion coefficient of 6.5ppm / K. The intermediate layer is a corrugated copper alloy skeleton 7, which increases the heat transfer area by 40% through the corrugated structure design, and uniformly transmits heat to the outer layer. The outer layer covers an aluminum nitride ceramic layer 3, which is made of high-purity aluminum nitride ceramic material, has high insulation and dielectric strength ≥ 15 kV / mm and high thermal conductivity ≥ 170 W / m·K, can guide heat to the honeycomb liquid cooling array 4, and effectively block the interference of the extra-high voltage electric field. The synergistic effect of the three-layer structure makes the thermal response speed increase by more than 30%, providing a core guarantee for the stable operation of IGCT in an extra-high voltage environment. The liquid cooling base 401 is arranged below the IGCT assembly and communicates with the liquid flow cavity 405, and increases the liquid cooling area of the IGCT by directly contacting the IGCT.

[0032] The honeycomb liquid cooling array 4 is arranged on the top of the substrate 1, and the specific structure of the honeycomb liquid cooling array 4 includes a liquid cooling base 401, a liquid cooling cavity 402, a servo motor 404, a double-head rocker 413, an extension film 412, a contact rod 407 and a water pump group 409 and the like. The IGCT is installed at the top axis of the liquid cooling base 401, and the liquid cooling base 401 is symmetrically arranged on the surface of the substrate 1. The top of the liquid cooling base 401 is also provided with a liquid cooling cavity 402, and the liquid cooling base 401 communicates with the liquid cooling cavity 402. The IGCT is arranged on the top of the liquid cooling base 401 and directly contacts the liquid cooling base 401, thereby increasing the liquid cooling area. The top of the two liquid cooling cavities 402 is fixedly connected with a same positioning plate 403, and the positioning plate 403 is fixedly installed with the servo motor 404. The output end of the servo motor 404 is fixedly connected with a double-head rocker 413, like Figure 3As shown, the double-ended rocker 413 has an inverted "U" shape. The end of the double-ended rocker 413 extends through the arc-shaped hole 414 and into the displacement chamber 406. Its end is rotatably connected to the extrusion portion 410. The interior of the liquid cooling chamber 402 is divided into a liquid flow chamber 405 and a displacement chamber 406 by a telescopic membrane 412. The telescopic membrane 412 consists of a hard isolation membrane and a soft isolation membrane. The hard isolation membrane has a through hole for the contact rod 407 to pass through, while the soft isolation membrane is located on the other side of the through hole. The side closest to the aluminum nitride ceramic layer 3 is the liquid flow chamber 405, and the other side is the displacement chamber 406. One end of the contact rod 407 extends out of the liquid cooling chamber 402 and is inserted into the hollow column 10. The other end of the contact rod 407 extends into the soft isolation membrane. A spring 415 is installed between the end of the contact rod 407 and the hard isolation membrane. The liquid cooling chamber 402 is provided with an annular membrane 408 at the connection with the contact rod 407 to ensure dynamic sealing when the contact rod 407 slides. At the same time, the limiting tube 416 provides a limiting effect on the contact rod 407, ensuring that the contact rod 407 can only move forward and backward along the extension direction of the limiting tube 416. At the same time, the sealing ring 417 further prevents the overflow of the coolant. The outer wall of the liquid cooling chamber 402 is provided with a water pump group 409. One end of the water pump group 409 is connected to the liquid flow chamber 405, which is in turn connected to the liquid cooling base. The other end is connected to the liquid storage chamber 418 through a hose. The inner wall of the displacement chamber 406 is covered with a fluorinated silica nano-coating 411. The coating thickness is 2-5μm and has a surface resistivity of 10¹ 0 The characteristics of Ω can shorten the charge decay time to 0.5s.

[0033] The honeycomb liquid cooling array 4 operates as follows: Servomotor 404 activates, driving a double-ended rocker 413 to rotate. The other end of the double-ended rocker 413 extends through an arc-shaped hole 414 into the displacement chamber 406. During rotation, the extrusion portion 410 at its end periodically compresses the telescopic membrane 412. The raised portion of the telescopic membrane 412 is a soft compression membrane, while the flat surface of the membrane 412 is a hard isolation membrane. As the extrusion portion 410 approaches the membrane 412, the volume of the soft compression membrane decreases under the pressure, reducing the volume of the liquid flow chamber 405 and generating pressure. This accelerates the flow of coolant and creates turbulence within the liquid flow chamber 405. This turbulent effect increases the heat transfer coefficient by 50%, significantly enhancing heat dissipation.

[0034] like Figure 3As shown, the contact surface between the extrusion portion 410 and the telescopic membrane 412 presents a parabolic structure having two valleys and one peak. As the extrusion portion 410 moves, the contact position between the telescopic membrane 412 and the extrusion portion 410 continuously changes. When the contact point between the telescopic membrane 412 and the extrusion portion 410 moves from the valley to the peak, the telescopic membrane 412 exerts a squeezing effect on the contact rod 407, and the volume of the liquid flow chamber 405 gradually decreases. When the contact point between the telescopic membrane 412 and the extrusion portion 410 moves from the peak to the valley, the extrusion portion 410 gradually releases its squeezing of the telescopic membrane 412. Simultaneously, under the action of the spring 415, the contact rod 407 causes the telescopic membrane 412 to return to its original state, and the volume of the liquid flow chamber 405 gradually increases. At this time, the water pump assembly 409 pumps the low-temperature coolant in the liquid storage chamber 418 into the liquid flow chamber 405, forming a circulation. When the contact rod 407 moves, the slider 13 provided on the outer wall thereof will slide along the groove 12 inside the hollow column 10. Figure 7 As shown, groove 12 is arranged in a spiral shape. Therefore, under the combined action of contact rod 407 and slider 13, hollow column 10 begins to rotate, synchronously driving fan blades 11 to rotate, disturbing the air and creating a wind cooling effect. The combined action of sealing ring 417 and annular membrane 408 ensures dynamic sealing when contact rod 407 slides, preventing coolant leakage.

[0035] It is particularly important to note that multiple groups of contact rods 407 and telescopic membranes 412 are provided in the honeycomb liquid cooling array 4. When the squeezing portion 410 completely releases the squeezing of the current telescopic membrane 412, it begins to squeeze the next telescopic membrane 412. As the squeezing portion 410 moves, the interior of the liquid flow cavity 405 is continuously compressed and restored, thereby continuously forming turbulence inside the liquid cooling base 401, thereby improving the heat dissipation effect.

[0036] The charge neutralization module 6 is embedded in the honeycomb liquid cooling array 4 and moves synchronously with the honeycomb liquid cooling array 4. The charge neutralization module 6 includes an iridium titanium oxide electrode 601 and an ion controller 602. The iridium titanium oxide electrode 601 is embedded in the inner wall of the liquid flow chamber 405 with a spacing of 5-10mm, and monitors the charge density in the coolant in real time. When the ion controller 602 detects that the charge density exceeds 5μC / m³, it immediately injects reverse ions into the iridium titanium oxide electrode 601 to neutralize the excess charge in the coolant and achieve continuous charge discharge. The fluorinated silicon dioxide nano-coating 411 covering the inner wall of the displacement chamber 406 has a surface resistivity of 10¹ 0 The characteristics of Ω can shorten the charge decay time to 0.5s, completely eliminating the risk of ultra-high voltage static electricity.

[0037] The top of the base plate 1 is fixedly connected with a column 8, and a uniformly distributed positioning ring 9 is provided on one side of the outer wall of the column 8. A hollow column 10 is rotatably connected to the inner side of the positioning ring 9. A fan blade 11 is installed on the outer wall of the hollow column 10. A groove 12 is provided on one side of the inner wall of the hollow column 10. A slider 13 is fixedly connected to one side of the outer wall of the contact rod 407. The slider 13 corresponds to the groove 12. The contact rod 407 moves toward the inside of the hollow column 10 under the extrusion action of the extrusion part 410. The slider 13 is embedded in the groove 12 at the same time as the contact rod 407 enters the hollow column 10. Since the groove 12 is a screw The rotary setting, during the forward movement of the contact rod 407, this part of the forward force is converted into the rotational force of the hollow column 10, and the hollow column 10 drives the fan blades 11 to rotate, thereby accelerating the air flow outside the aluminum nitride ceramic layer 3, and realizing the simultaneous liquid cooling and air cooling. In addition, the special shape of the extrusion portion 410 increases the displacement distance of the contact rod 407, increases the number of rotations of the hollow column 10, and improves the air cooling effect accordingly. Of course, in order to further increase the number of rotations of the hollow column 10, the pitch of the groove 12 can be appropriately reduced to increase the number of rotations of the groove.

[0038] The present invention also provides a heat dissipation method based on an IGCT heat dissipation assembly for an ultra-high voltage power grid, the specific steps of which are as follows:

[0039] An IGCT is installed on top of S1 and substrate 1. The IGCT initiates heat conduction through a three-layer composite structure: the molybdenum-copper alloy layer 2 closely adheres to the IGCT electrode and uses its high thermal conductivity to quickly absorb chip heat; the corrugated copper alloy skeleton 7 increases the heat transfer area through its corrugated structure, evenly dissipating the heat; and the aluminum nitride ceramic layer 3, with its high insulation and high thermal conductivity, conducts heat to the liquid cooling system while blocking interference from the ultra-high voltage electric field.

[0040] S2: Servo motor 404 starts, driving double-ended rocker 413 to rotate, causing extrusion unit 410 to periodically squeeze expansion membrane 412 along arc-shaped hole 414. When extrusion unit 410 compresses expansion membrane 412, the volume of liquid flow chamber 405 decreases, generating pressure, pushing the coolant into turbulent flow. When extrusion unit 410 disengages, spring 415 pushes expansion membrane 412 back into place via contact rod 407, and water pump assembly 409 pumps in low-temperature coolant to complete the circulation. S3: When extrusion unit 410 squeezes expansion membrane 412, the coolant in liquid flow chamber 405 forms turbulent flow, increasing the heat transfer coefficient by 50%. Contact rod 407 moves with expansion membrane 412, driving the fan blades to rotate, generating air cooling and heat dissipation.

[0041] S4. The charge neutralization module 6 is started, and the iridium titanium oxide electrode 601 monitors the charge density of the liquid flow in real time. When the charge density exceeds 5μC / m³, the ion controller 602 injects reverse ions to quickly eliminate excess charge in the liquid flow and eliminate the risk of ultra-high voltage static electricity.

[0042] In practical applications, the heat dissipation assembly of the present application is suitable for IGCT devices in an extra-high voltage power grid. For example, in an extra-high voltage substation, IGCT as the core power device needs to be operated stably for a long time, and a large amount of heat will be generated during operation. Due to the insufficient heat transfer efficiency and single heat dissipation mode of the traditional heat dissipation assembly, it often cannot meet the demand of high heat flux density, while the present application solves the bottleneck of the prior art through the mechanical driving and turbulent flow strengthening heat dissipation of the substrate, the honeycomb liquid cooling array and the electrostatic elimination mechanism of the charge neutralization module. The IGCT three-layer composite structure on the top of the substrate 1 ensures efficient heat transfer, the honeycomb liquid cooling array 4 strengthens the heat dissipation effect through mechanical driving and liquid flow circulation, and the charge neutralization module 6 solves the electrostatic problem in the extra-high voltage environment, and the three work together to realize the safe and stable heat dissipation of IGCT.

[0043] In summary, through the innovative design and technical scheme, the present application realizes efficient heat dissipation and electrostatic elimination function. The honeycomb liquid cooling array realizes multi-dimensional heat dissipation through mechanical driving and turbulent flow strengthening heat dissipation, and the charge neutralization module completely eliminates the electrostatic hidden danger, providing reliable technical support for IGCT in the extra-high voltage power grid.

[0044] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. An IGCT heat dissipation component for ultra-high voltage power grid, characterized in that: The invention comprises a substrate (1), a honeycomb liquid cooling array (4), a driving component (5) and a charge neutralization module (6), wherein an IGCT is provided on the top of the substrate (1), an inner wall of the IGCT is provided on one side with a molybdenum-copper alloy layer (2), an intermediate layer is provided with a corrugated copper alloy skeleton (7), an outer layer of the corrugated copper alloy skeleton (7) is covered with an aluminum nitride ceramic layer (3), the honeycomb liquid cooling array (4) is provided on the top of the substrate (1) and contacts the aluminum nitride ceramic layer (3), the driving component (5) is used to drive the start of the honeycomb liquid cooling array (4), the charge neutralization module (6) is embedded in the honeycomb liquid cooling array (4), a column (8) is fixedly connected to the top of the substrate (1), an outer wall of the column (8) is provided with a uniformly distributed positioning ring (9), a hollow column (10) is rotatably connected to the inside of the positioning ring (9), a fan blade (11) is installed on the outer wall of the hollow column (10), and a groove (12) is provided on the inner wall of the hollow column (10).

2. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 1, characterized in that: The honeycomb liquid cooling array (4) comprises a liquid cooling base (401), a liquid cooling chamber (402), a servo motor (404), a double-headed rocker (413), a telescopic membrane (412), a contact rod (407) and a water pump group (409); the liquid cooling chamber (402) is divided into a liquid flow chamber (405) and a displacement chamber (406); the telescopic membrane (412) separates the liquid flow chamber (405) and the displacement chamber (406); the liquid cooling base (401) is arranged between the substrate (1) and the IGCT, is connected to the liquid flow chamber (405), and its top is in direct contact with the IGCT; the outer wall of the contact rod (407) is fixedly connected to a slider (13), and the slider (13) corresponds to the groove (12).

3. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 2, characterized in that: The servo motor (404) drives the double-headed rocker (413) to rotate. The double-headed rocker (413) extends into the displacement cavity (406) through the arc-shaped hole (414) and is connected to the extrusion part (410). The extrusion part (410) periodically squeezes the telescopic membrane (412).

4. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 3, characterized in that: A raised side of the telescopic membrane (412) is fixedly connected to a spring (415), and the other end of the spring (415) is fixedly connected to the outer wall of the liquid cooling cavity (402). The raised end of the telescopic membrane (412) is a soft compression membrane, and the flat surface of the telescopic membrane (412) is a hard isolation membrane. One side of the inner wall of the liquid cooling cavity (402) is fixedly connected to a limiting tube (416), and a sealing ring (417) is provided on the inner wall of the limiting tube (416).

5. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 1, characterized in that: The charge neutralization module (6) comprises an iridium titanium oxide electrode (601) and an ion controller (602), wherein the iridium titanium oxide electrode (601) is embedded in the inner wall of the liquid flow chamber (405).

6. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 2, characterized in that: The inner wall of the replacement cavity (406) is covered with a fluorinated silicon dioxide nano-coating (411), and the thickness of the fluorinated silicon dioxide nano-coating (411) is 2 to 5 microns.

7. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 1, characterized in that: The corrugated copper alloy skeleton (7) increases the heat transfer area through the corrugated structure design.

8. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 2, characterized in that: One end of the contact rod (407) contacts the aluminum nitride ceramic layer (3), and the other end is fixedly connected to one side of the inner wall of the telescopic membrane (412).

9. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 2, characterized in that: One end of the water pump assembly (409) is connected to the liquid flow chamber (405), and the other end is connected to the liquid storage chamber (418) via a hose. The thermal conductivity of the molybdenum-copper alloy layer (2) is 180W / m·K, and the thermal expansion coefficient is .

10. A heat dissipation method for IGCT based on ultra-high voltage power grid, characterized in that: An IGCT is provided on the top of the S1 substrate (1). The IGCT initiates heat conduction through a three-layer composite structure: the molybdenum-copper alloy layer (2) is tightly attached to the IGCT electrode and uses its high thermal conductivity to quickly absorb the heat of the chip; the corrugated copper alloy skeleton (7) increases the heat transfer area through the corrugated structure and evenly diffuses the heat; the aluminum nitride ceramic layer (3) conducts the heat to the liquid cooling system with its high insulation and high thermal conductivity, while blocking the interference of the ultra-high voltage electric field; S2, the servo motor (404) is started, driving the double-headed rocker (413) to rotate, so that the extrusion part (410) periodically squeezes the telescopic membrane (412) along the arc-shaped hole (414). When the extrusion part (410) presses the telescopic membrane (412), the volume of the liquid flow chamber (405) is reduced to generate pressure, pushing the coolant to form turbulent flow; when the extrusion part (410) is disengaged, the spring (415) pushes the telescopic membrane (412) to return to its original position through the contact rod (407), and the water pump group (409) pumps the low-temperature coolant to complete the cycle; S3, when the extrusion portion (410) squeezes the telescopic membrane (412), the cooling liquid in the liquid flow chamber (405) forms turbulence, and the heat transfer coefficient is increased by 50%; the contact rod (407) moves with the telescopic membrane (412), driving the fan blades to rotate to form air cooling and heat dissipation; S4. The charge neutralization module (6) is started, and the iridium titanium oxide electrode (601) monitors the charge density of the liquid flow in real time; when the charge density exceeds 5 μC / m³, the ion controller (602) injects reverse ions to quickly eliminate excess charge in the liquid flow and eliminate the risk of ultra-high voltage static electricity.

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