Golden finger connection structure and method with centroid compensation

Abstract

The invention relates to a golden finger connection structure with centroid compensation and a method. The golden finger connection structure comprises a bearing substrate of which the bottom surface is provided with a conductive connection part plugged with a mainboard PCB, a mass center regulation and control groove formed in the back surface of the substrate, an elastic constraint mechanism mounting part arranged on the side edge of the substrate, and a multidirectional elastic constraint mechanism for connecting the mounting part with the mainboard PCB; the mass center regulation and control groove is configured to change the mass center distribution of the connecting structure, so that the mass center shifts towards the direction of the elastic restraint mechanism mounting part; the multidirectional elastic restraining mechanism generates axial pre-tightening force in the inserting direction and compensation torque perpendicular to the inserting direction in the assembling process, and multidimensional dynamic restraining on the connecting structure is formed. Through the synergistic effect of the mass center regulation and control groove and the multidirectional elastic constraint mechanism, the mechanical defects of a traditional golden finger connection structure are fundamentally improved, self-balance of the connection structure in a three-dimensional space is achieved, and the mechanical stability and the electrical reliability of the connection structure are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic device connection, and specifically to a gold finger connection structure and method with center of mass compensation, which aims to address the mechanical performance deficiencies of traditional gold finger connection structures and improve the mechanical stability and electrical reliability of the connection structure under complex working conditions. Background Art

[0002] In electronic devices, gold finger connection structures are a common electrical connection method, widely used for signal transmission and power supply between various circuit boards. However, existing gold finger connection structures have some obvious mechanical defects.

[0003] On the one hand, under the influence of environmental factors such as temperature cycling and mechanical vibration, the contact pressure between the conductive connector of the traditional gold finger connection structure and the motherboard PCB slot is prone to change, resulting in fluctuations in contact resistance. This not only affects the stability of signal transmission, but also may cause localized overheating and even damage electronic components in severe cases.

[0004] On the other hand, when the device is subjected to shock or high-frequency vibration, the connection interface lacks effective resistance to lateral disturbances. Without sufficient restraint to offset the external torque, the contact surface is prone to slippage or fretting wear, further reducing the reliability of the connection and shortening the service life of the connector.

[0005] Furthermore, traditional gold finger connection structures have poor self-balancing capabilities when facing complex loads, making it difficult to maintain a stable connection in complex dynamic application scenarios. Therefore, an innovative connection structure is urgently needed to improve these problems and meet the requirements of modern electronic devices for high reliability and long life connections. Summary of the Invention

[0006] In view of this, the present invention provides a gold finger connection structure with center of mass compensation. Through the synergistic effect of the center of mass control groove and the multi-directional elastic constraint mechanism, the mechanical defects of the traditional gold finger connection structure are fundamentally improved, the self-balancing of the connection structure in three-dimensional space is achieved, and its mechanical stability and electrical reliability are improved.

[0007] The purpose of the present invention is achieved through the following technical solutions: A gold finger connection structure with center of mass compensation includes a carrier substrate with a conductive connection portion on the bottom surface for plugging into a mainboard PCB, a center of mass control groove provided on the back of the substrate, an elastic constraint mechanism mounting portion provided on the side of the substrate, and a multi-directional elastic constraint mechanism connecting the mounting portion and the mainboard PCB; the center of mass control groove is configured to change the center of mass distribution of the connection structure, causing the center of mass to shift toward the elastic constraint mechanism mounting portion; the multi-directional elastic constraint mechanism generates, during assembly, an axial preload along the plugging direction and a compensation torque perpendicular to the plugging direction, thereby forming a multi-dimensional dynamic constraint on the connection structure.

[0008] The synergistic effect of the center of mass control groove and the multi-directional elastic constraint mechanism fundamentally improves the mechanical deficiencies of traditional gold finger connection structures. In the axial preload dimension, the elastic constraint mechanism maintains constant contact pressure between the conductive connector and the motherboard PCB slot, effectively overcoming contact resistance fluctuations caused by temperature cycling and mechanical vibration. The introduction of a compensating torque makes the connection interface resistant to lateral disturbances. When the device is subjected to impact or high-frequency vibration, the elastic constraint mechanism generates a restoring torque through deformation, which offsets the external torque and prevents slippage or fretting wear on the contact surface. The center of mass offset design adjusts the structural mass distribution to form a mechanical fulcrum in the direction of the elastic constraint mechanism's mounting point, significantly improving the system's resistance to overturning moments. This multi-dimensional dynamic constraint mechanism enables the connection structure to achieve self-balancing in three dimensions, making it particularly suitable for dynamic applications with complex loads. Compared to traditional rigid connection solutions, this structure simultaneously improves mechanical stability and electrical reliability, significantly extending the connector's plug-in life and adaptability to operating conditions.

[0009] Preferably, a chip and a cooperative heat dissipation module are integrated on the front side of the carrier substrate, and the cooperative heat dissipation module includes an air-cooled radiator or a liquid-cooled heat dissipation device.

[0010] The air-cooled radiator or liquid-cooled heat sink becomes the thick plate area, and the rest of the position becomes the thin plate area, forming an L-shaped stepped gold finger as a whole.

[0011] Preferably, the multi-directional elastic restraint mechanism is composed of a disc spring group or a memory alloy spring.

[0012] The laminated composite structure of the disc spring group has nonlinear stiffness characteristics, which can automatically adjust the preload gradient according to the insertion depth, forming a progressive contact pressure in the axial direction. The phase change characteristics of the memory alloy spring give the mechanism temperature self-adaptation capabilities. When the ambient temperature changes, the additional stiffness generated by the shape memory effect of the spring can compensate for the preload attenuation caused by thermal expansion. The unique load-displacement curve characteristics of these two elastic elements enable the constraint mechanism to absorb high-frequency micro-amplitude vibration energy and respond to low-frequency large displacement deformation. Compared with traditional elastic elements, the space utilization rate of the disc spring group is significantly improved, which is particularly suitable for board-to-board connection scenarios with limited installation space. The memory alloy material shows excellent fatigue resistance in cyclic testing, ensuring the performance stability of the elastic constraint mechanism over a wide temperature range.

[0013] Preferably, the conductive connection portion forms a stepped structure, and its metal contact surface is configured to form an electromagnetic connection interface that matches the mainboard PCB slot.

[0014] Commonly known as gold finger, it is a commonly used connection structure on PCB.

[0015] Preferably, the center of mass regulating groove and the elastic constraint mechanism mounting portion are at the same height.

[0016] The highly coplanar structural design eliminates the spatial position difference between the center of mass adjustment unit and the constraint mechanism in traditional solutions, allowing the line of action of the compensation torque to pass directly through the center of the lever arm generated by the center of mass offset. This coplanar layout resets the eccentricity of the mechanical system to zero, avoids the generation of additional torque, and fully converts the deformation energy of the elastic constraint mechanism into an effective compensation torque. Compared with non-coplanar structures, this solution significantly improves energy conversion efficiency and reduces the deformation of the mechanism under the same disturbance conditions. The highly consistent design also simplifies the assembly process, and controls the cumulative errors of processing and installation through a unified positioning reference surface, ensuring that mass-produced products have highly consistent performance.

[0017] Preferably, the processing technology of the center of mass control groove includes depth-controlled milling or laser microstructure processing.

[0018] The controlled-depth milling process achieves high-precision groove formation with gradual depth variations through multi-axis machining, while detailed surface treatment ensures accurate center of mass calculation. Laser microstructuring utilizes ultrashort pulse technology to create a biomimetic surface texture on the inner wall of the groove. This non-contact process eliminates microscopic material defects and significantly improves fatigue strength. The combined application of these two processes leverages their respective strengths, simultaneously optimizing both macro-contour accuracy and microstructural performance. A specially designed tool path creates a process-specific chamfer, which not only avoids stress concentration but also creates favorable conditions for surface treatment, resulting in industry-leading coating adhesion.

[0019] Preferably, the anchoring portion of the elastic constraint mechanism is in the shape of a protrusion or a groove.

[0020] The raised anchoring section utilizes a hemispherical contact design to improve stress distribution and significantly increase tensile strength. The grooved structure utilizes a mechanical interlocking principle, exhibiting excellent resistance to loosening in vibrating environments. Two anchoring styles are available to meet different installation requirements: the raised type is suitable for surface mount applications, while the grooved type facilitates flush-mount installation. Micro-grooves on the anchoring section's surface increase friction and, when used with a dedicated conductive adhesive, significantly reduce interfacial contact resistance.

[0021] A method for dynamically stabilizing a gold finger connection structure comprises the following steps: S1. A center of mass control groove is provided on the back of the carrier substrate, and the spatial distribution of the groove is constructed so that the center of mass of the connecting structure is offset toward the mounting portion of the elastic constraint mechanism; S2. Connect a multi-directional elastic constraint mechanism between the side of the substrate and the mainboard PCB positioning structure to establish a mechanical connection; S3. The elastic restraint mechanism is generated by assembling a preload force: The axial constraint component along the gold finger insertion direction maintains the continuous contact pressure between the conductive connection part and the PCB slot; The moment compensation component perpendicular to the plug-in direction uses the force arm formed by the center of mass offset to balance the external disturbance load; S4. Under dynamic working conditions, adaptive adjustment of the stress distribution at the connection interface is achieved through the deformation energy absorption and release of the elastic constraint mechanism.

[0022] This dynamic stabilization method establishes a complete technical closed loop from center of mass design to adaptive adjustment. Structural topology optimization precisely matches the center of mass offset with the stiffness characteristics of the elastic constraint mechanism, forming a stable mechanical equilibrium point. The bidirectional constraint mechanism innovatively decouples axial pressure from lateral torque, achieving effective attenuation across a wide range of vibration frequencies. The adaptive adjustment function, based on the nonlinear deformation characteristics of elastic elements, compensates for displacement deviations in real time to maintain stable contact pressure. The entire method, validated through systematic simulation and testing, forms a standardized design process, demonstrating broad applicability in applications requiring stringent dynamic operating conditions.

[0023] The beneficial effects of the present invention compared to the prior art are: The present invention has a gold finger connection structure with center of mass compensation, and the synergistic effect of the center of mass control groove and the multi-directional elastic constraint mechanism fundamentally improves the mechanical defects of the traditional gold finger connection structure. In the dimension of axial preload, the elastic constraint mechanism can maintain a constant contact pressure between the conductive connection part and the mainboard PCB slot, effectively overcoming the problem of contact resistance fluctuation caused by temperature cycling and mechanical vibration. The introduction of compensation torque enables the connection interface to have the ability to resist lateral disturbances. When the equipment is subjected to impact or high-frequency vibration, the elastic constraint mechanism can offset the external torque through deformation and avoid slippage or micro-wear of the contact surface. The center of mass offset design forms a mechanical fulcrum in the direction of the elastic constraint mechanism installation part by adjusting the structural mass distribution, significantly improving the system's ability to resist overturning torque. This multi-dimensional dynamic constraint mechanism enables the connection structure to achieve self-balancing in three-dimensional space, and is particularly suitable for dynamic application scenarios with complex loads. Compared with the traditional rigid connection solution, this structure improves mechanical stability and electrical reliability simultaneously, significantly extending the connector's plug-in life and adaptability to working conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 FIG. 4 is a cross-sectional view of a gold finger connection structure with centroid compensation according to an embodiment of the present invention.

[0026] Figure 2 This is a rear view of a gold finger connection structure with center of mass compensation according to an embodiment of the present invention.

[0027] Explanation of reference numerals: carrier substrate (1), chip and coordinated heat dissipation module (2), center of mass control groove (3), elastic constraint mechanism mounting portion (4), multi-directional elastic constraint mechanism (5), mainboard PCB (6). DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0030] It should be noted that similar numbers and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further defined and explained in the subsequent figures. In the description of the embodiments of the present application, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc. is based on the orientation or position relationship shown in the drawings, or is the orientation or position relationship in which the product of the application is usually placed when in use, or is the orientation or position relationship commonly understood by those skilled in the art. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0031] It should be noted that, unless there is any conflict, the embodiments and features in the embodiments of this application can be combined with each other.

[0032] The technical solution in this application will be described below with reference to the accompanying drawings.

[0033] The present embodiment provides a gold finger connection structure with center of mass compensation, including a carrier substrate 1 with a conductive connection portion on the bottom surface for plugging into the main board PCB6, a center of mass control groove 3 provided on the back of the substrate, an elastic constraint mechanism mounting portion 4 provided on the side of the substrate, and a multi-directional elastic constraint mechanism 5 connecting the mounting portion and the main board PCB6; the center of mass control groove 3 is constructed to change the center of mass distribution of the connection structure so that the center of mass is offset toward the elastic constraint mechanism mounting portion 4; the multi-directional elastic constraint mechanism 5 generates: an axial preload along the plug-in direction, and a compensation torque perpendicular to the plug-in direction during assembly, forming a multi-dimensional dynamic constraint on the connection structure.

[0034] The synergistic effect of the center of mass control groove 3 and the multi-directional elastic constraint mechanism 5 fundamentally improves the mechanical defects of the traditional gold finger connection structure. In the dimension of axial preload, the elastic constraint mechanism 5 can maintain a constant contact pressure between the conductive connection part and the mainboard PCB6 slot, effectively overcoming the problem of contact resistance fluctuations caused by temperature cycles and mechanical vibrations. The introduction of compensation torque enables the connection interface to have the ability to resist lateral disturbances. When the equipment is subjected to impact or high-frequency vibration, the elastic constraint mechanism 5 generates a restoring torque through deformation to offset the external torque and avoid slippage or micro-wear on the contact surface. The center of mass offset design forms a mechanical fulcrum in the direction of the elastic constraint mechanism mounting part 4 by adjusting the structural mass distribution, significantly improving the system's ability to resist overturning torque. This multi-dimensional dynamic constraint mechanism enables the connection structure to achieve self-balancing in three-dimensional space, and is particularly suitable for dynamic application scenarios with complex loads. Compared with traditional rigid connection solutions, this structure improves mechanical stability and electrical reliability simultaneously, significantly extending the connector's plug-in life and adaptability to working conditions.

[0035] In this embodiment, a chip and a cooperative heat dissipation module 2 are integrated on the front side of the carrier substrate 1 . The cooperative heat dissipation module includes an air-cooled radiator or a liquid-cooled radiator.

[0036] The air-cooled radiator or liquid-cooled heat sink becomes the thick plate area, and the rest of the position becomes the thin plate area, forming an L-shaped stepped gold finger as a whole.

[0037] In this embodiment, the multi-directional elastic restraint mechanism 5 is composed of a disc spring group or a memory alloy spring.

[0038] The laminated composite structure of the disc spring group has nonlinear stiffness characteristics, which can automatically adjust the preload gradient according to the insertion depth, forming a progressive contact pressure in the axial direction. The phase change characteristics of the memory alloy spring give the mechanism temperature self-adaptation capabilities. When the ambient temperature changes, the additional stiffness generated by the shape memory effect of the spring can compensate for the preload attenuation caused by thermal expansion. The unique load-displacement curve characteristics of these two elastic elements enable the constraint mechanism 5 to absorb high-frequency micro-amplitude vibration energy and respond to low-frequency large displacement deformation. Compared with traditional elastic elements, the space utilization rate of the disc spring group is significantly improved, which is particularly suitable for plate-to-plate connection scenarios with limited installation space. The memory alloy material shows excellent fatigue resistance in cyclic tests, ensuring the performance stability of the elastic constraint mechanism 5 within a wide temperature range.

[0039] In this embodiment, the conductive connection portion forms a stepped structure, and its metal contact surface is configured to form an electromagnetic connection interface that matches the mainboard PCB6 slot.

[0040] Commonly known as gold finger, it is a commonly used connection structure on PCB.

[0041] In this embodiment, the center of mass regulating groove 3 and the elastic constraint mechanism mounting portion 4 are at the same height.

[0042] The highly coplanar structural design eliminates the spatial position difference between the center of mass adjustment unit and the constraint mechanism in traditional solutions, allowing the line of action of the compensation torque to pass directly through the center of the lever arm generated by the center of mass offset. This coplanar layout resets the eccentricity of the mechanical system to zero, avoiding the generation of additional torque and allowing the deformation energy of the elastic constraint mechanism 5 to be fully converted into an effective compensation torque. Compared with non-coplanar structures, this solution significantly improves energy conversion efficiency and reduces the deformation of the mechanism under the same disturbance conditions. The highly consistent design also simplifies the assembly process, controlling the cumulative errors of processing and installation through a unified positioning reference surface, ensuring that mass-produced products have highly consistent performance.

[0043] In this embodiment, the processing technology of the centroid control groove 3 includes controlled depth milling or laser microstructure processing.

[0044] The controlled-depth milling process achieves high-precision groove formation with gradual depth variation through multi-axis machining, while detailed surface treatment ensures accurate center of mass calculation. Laser microstructuring utilizes ultrashort pulse technology to create a biomimetic surface texture on the inner wall of groove 3. This non-contact process eliminates microscopic material defects and significantly improves fatigue strength. The combined application of the two processes leverages their respective strengths, simultaneously optimizing macro-profile accuracy and microstructural performance. A specially designed tool path creates a process-specific chamfer, which not only avoids stress concentration but also creates favorable conditions for surface treatment, resulting in industry-leading coating adhesion.

[0045] In this embodiment, the anchoring portion of the elastic constraint mechanism 5 is in the shape of a protrusion or a groove.

[0046] The raised anchoring section utilizes a hemispherical contact design to improve stress distribution and significantly increase tensile strength. The grooved structure utilizes a mechanical interlocking principle, exhibiting excellent resistance to loosening in vibrating environments. Two anchoring styles are available to meet different installation requirements: the raised type is suitable for surface mount applications, while the grooved type facilitates flush-mount installation. Micro-grooves on the anchoring section's surface increase friction and, when used with a dedicated conductive adhesive, significantly reduce interfacial contact resistance.

[0047] A method for dynamically stabilizing a gold finger connection structure comprises the following steps: S1. The center of mass regulating groove 3 is provided on the back of the carrier substrate 1, and the spatial distribution of the groove is constructed so that the center of mass of the connecting structure is offset toward the direction of the elastic constraint mechanism mounting portion 4; S2. A multi-directional elastic constraint mechanism 5 is connected across the side of the substrate and the mainboard PCB6 positioning structure to establish a mechanical connection; S3. The elastic restraint mechanism 5 is generated by assembling a preload force: The axial constraint component along the gold finger insertion direction maintains the continuous contact pressure between the conductive connection part and the PCB slot; The moment compensation component perpendicular to the plug-in direction uses the force arm formed by the center of mass offset to balance the external disturbance load; S4. Under dynamic working conditions, the deformation energy of the elastic constraint mechanism 5 is absorbed and released to achieve adaptive adjustment of the stress distribution at the connection interface.

[0048] This dynamic stabilization method establishes a complete technical closed loop from center of mass design to adaptive adjustment. Structural topology optimization precisely matches the center of mass offset with the stiffness characteristics of the elastic constraint mechanism 5, forming a stable mechanical equilibrium point. The bidirectional constraint mechanism innovatively decouples axial pressure from lateral torque, achieving effective attenuation across a wide range of vibration frequencies. The adaptive adjustment function, based on the nonlinear deformation characteristics of the elastic element, compensates for displacement deviations in real time to maintain stable contact pressure. The entire method, validated through systematic simulation and testing, forms a standardized design process, making it widely applicable in fields with stringent dynamic operating conditions.

[0049] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A gold finger connection structure with center of mass compensation, characterized in that: include: A carrier substrate (1), the bottom surface of which is provided with a conductive connection portion for plugging into a mainboard PCB (6); A center of mass control groove (3) provided on the back side of the substrate; An elastic restraint mechanism mounting portion (4) provided on a side of the base plate; A multi-directional elastic restraint mechanism (5) connecting the mounting portion and the mainboard PCB (6); The center of mass regulating groove (3) is configured to change the center of mass distribution of the connection structure so that the center of mass is offset toward the elastic constraint mechanism mounting portion (4); The multi-directional elastic constraint mechanism (5) generates, during assembly, an axial preload along the plugging direction and a compensating torque perpendicular to the plugging direction, thereby forming a multi-dimensional dynamic constraint on the connection structure.

2. The gold finger connection structure with center of mass compensation according to claim 1, characterized in that: The front side of the carrier substrate (1) is integrated with a chip and a cooperative heat dissipation module (2), and the cooperative heat dissipation module comprises an air-cooled radiator or a liquid-cooled heat dissipation device.

3. The gold finger connection structure with center of mass compensation according to claim 1, characterized in that: The multi-directional elastic restraint mechanism (5) is composed of a disc spring group or a memory alloy spring.

4. The gold finger connection structure with center of mass compensation according to claim 1, characterized in that: The conductive connection portion forms a stepped structure, and its metal contact surface is structured to form an electromagnetic connection interface that matches the mainboard PCB (6) slot.

5. The gold finger connection structure with center of mass compensation according to claim 1, characterized in that: The center of mass regulating groove (3) and the elastic constraint mechanism mounting portion (4) are at the same height.

6. The gold finger connection structure with center of mass compensation according to claim 1, characterized in that: The processing technology of the center of mass regulating groove (3) includes controlled depth milling or laser microstructure processing.

7. The gold finger connection structure with center of mass compensation according to claim 1, characterized in that: The anchoring portion of the elastic constraint mechanism (5) is in the shape of a protrusion or a groove.

8. A method for dynamically stabilizing a gold finger connection structure, characterized in that: The following steps are involved: S1. A center-of-mass control groove (3) is provided on the back of the carrier substrate (1), and the spatial distribution of the groove is constructed so that the center of mass of the connection structure is offset toward the elastic constraint mechanism mounting portion (4); S2. A multi-directional elastic constraint mechanism (5) is connected across the side of the substrate and the main board PCB (6) positioning structure to establish a mechanical connection; S3. The elastic restraint mechanism (5) is generated by assembling a preload force: The axial constraint component along the gold finger insertion direction maintains the continuous contact pressure between the conductive connection part and the PCB slot; The moment compensation component perpendicular to the plug-in direction uses the force arm formed by the center of mass offset to balance the external disturbance load; S4. Under dynamic working conditions, adaptive adjustment of the stress distribution at the connection interface is achieved through the deformation energy absorption and release of the elastic constraint mechanism (5).

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