Manufacturing method of PIN-inserted high-precision flexible board for intelligent visual module

Abstract

The invention discloses a manufacturing method of a PIN-inserted high-precision flexible board for an intelligent visual module, which comprises the following steps: taking a double-sided flexible copper-clad plate, manufacturing a circuit pattern, taking a single-sided flexible copper-clad plate, cutting, forming an auxiliary copper-clad plate, attaching the auxiliary copper-clad plate to the area of the circuit pattern, pressing, drilling a through hole, manufacturing a blind hole corresponding to the part of the circuit pattern in the auxiliary copper-clad plate, and manufacturing a PIN-inserted high-precision flexible board for the intelligent visual module. Electroplating the whole board, manufacturing a surface circuit pattern, taking a cover film, windowing, attaching the cover film to the surface of the surface circuit pattern to form a flexible board layer, taking a reinforcing plate, integrally attaching the reinforcing plate to the flexible board layer, and drilling reinforcing plate holes corresponding to the via holes to form the high-precision flexible board; part of the circuit pattern is moved to the surface of the auxiliary copper-clad plate to provide a receding space for the via hole, the high-reliability and high-precision via hole is manufactured and formed, the reinforcing plate hole is drilled after the reinforcing plate is integrally attached, the high-precision alignment effect of the reinforcing plate hole and the via hole is formed, and the problems of poor insertion or excessive insertion caused by insertion of precise PINs are effectively prevented.

Description

Technical Field

[0001] The present invention relates to the field of flexible circuit board processing, and in particular to a method for manufacturing a high-precision flexible circuit board with PIN pins for an intelligent vision module. Background Art

[0002] With the intelligent development of electronic modules, a type of visual products used for identification, calculation or monitoring have increasingly higher requirements for the efficiency of data transmission and analysis. With the technological updates and iterations of electronic products, the application and implementation of flexible board PIN pins have gradually been effectively applied.

[0003] Since flexible boards are relatively soft, general applications for inserting precision PIN pins require attaching reinforcement plates to the corresponding positions. Currently, the general practice is to first drill reinforcement plate holes at the positions of the conductive holes for inserting the PIN pins, and then attach the reinforcement plates to the corresponding positions of the flexible boards to achieve the processing of flexible boards with reinforcement plates.

[0004] However, since both the flexible board and the reinforcement board will expand and shrink during the processing, and the reinforcement board is attached after the flexible board is manufactured, the diameter of the reinforcement board hole needs to be larger than the conductive hole of the flexible board, and precise alignment is required to ensure that the conductive hole and the reinforcement board hole are accurately aligned and attached. However, in the actual processing process, it is difficult to ensure that the reinforcement board hole and the conductive hole can be accurately fitted, which can easily cause fitting deviation, resulting in problems such as difficulty in effectively plugging in the precision PIN needle, poor contact, and the flexible board being broken.

[0005] Furthermore, even if the two holes are precisely aligned, since the needle head of the precision PIN needle is relatively precise, the diameter difference between its smaller diameter section and larger diameter section is small. When the precision PIN needle is inserted, it is easy to squeeze the flexible board, causing the conductive hole to be squeezed in the direction of the reinforcement plate hole, thereby causing the precision PIN needle to be over-inserted or damage the conductive hole.

[0006] Moreover, for flexible boards with high wiring density, the PIN pin connection method is prone to problems such as the PIN pin being inserted into the via hole. Since the flexible board is relatively soft, the precision PIN pin will squeeze the circuit pattern near the via hole, causing circuit deformation or short circuit.

[0007] Based on the above background and problems, it is necessary to provide a method for manufacturing a high-precision flexible board that can improve the reliability of PIN insertion. Summary of the Invention

[0008] The present invention addresses the problems of the prior art high-precision flexible PCB with PIN pins, such as difficulty in effectively plugging the PIN pins, poor contact, and damage to the flexible PCB, as well as the problem of deformation or short circuit of the circuits adjacent to the vias caused by the insertion of the PIN pins. A method for manufacturing a high-precision flexible PCB with PIN pins for an intelligent vision module is provided.

[0009] S10: Take a double-sided flexible copper-clad laminate composed of a first copper layer, a first PI layer, and a second copper layer, and take a single-sided flexible copper-clad laminate composed of a single-sided copper layer and a single-sided PI layer, and form a circuit pattern on the first copper layer; cut the single-sided copper-clad laminate to form an auxiliary copper-clad laminate; attach the auxiliary copper-clad laminate to the area of ​​the circuit pattern, press it together, and then drill through holes; then form blind holes in the auxiliary copper-clad laminate, the blind holes corresponding to the circuit pattern; and the entire board is formed into a through-blind hole board;

[0010] S20: Electroplating the entire through-hole and blind-via plate, wherein the through-holes become conductive vias and the blind holes become conductive blind vias; the first copper layer and the single-sided copper layer together form a surface copper layer; and the entire plate becomes a conductive via plate;

[0011] S30: forming a surface circuit pattern on the via plate to form a surface circuit pattern plate;

[0012] S40: taking the cover film, performing windowing to form a windowed cover film, and attaching the windowed cover film to the surface of the surface circuit pattern; and forming a flexible board layer on the entire board;

[0013] S50: Take a reinforcing plate and attach it as a whole to one side of the flexible board layer; then drill reinforcing plate holes at positions of the reinforcing plate corresponding to the conductive holes; after post-processing, the entire board forms the high-precision flexible board.

[0014] Furthermore, the auxiliary copper clad plate avoids the through hole.

[0015] Furthermore, the thickness of the single-sided copper layer is equal to the thickness of the first copper layer, and the thickness of the single-sided PI layer is less than the thickness of the first PI layer.

[0016] Furthermore, with the edge of the through hole as the starting position, the board body of the double-sided flexible copper clad laminate is extended to form a through hole coverage area, and the double-sided flexible copper clad laminate excluding the through hole and the through hole coverage area is a circuit distribution area; the circuit pattern includes a dense circuit pattern distributed adjacent to the through hole; making a circuit pattern on the first copper layer includes removing the dense circuit pattern in the through hole coverage area, and one end of the dense circuit pattern located in the circuit distribution area is a blind hole connection end; making a blind hole on the auxiliary copper clad laminate includes making the blind hole at a position of the auxiliary copper clad laminate corresponding to the blind hole connection end.

[0017] Furthermore, forming a surface circuit pattern on the via plate includes forming an auxiliary circuit pattern on the via, wherein the auxiliary circuit pattern extends from an edge of the via toward the body of the double-sided flexible copper clad laminate.

[0018] Furthermore, forming a circuit pattern corresponding to the first copper layer includes removing the first copper layer corresponding to the blind hole; and forming a blind hole on the auxiliary copper clad laminate includes laser drilling the first PI layer corresponding to the blind hole to expose the circuit pattern.

[0019] Furthermore, drilling the reinforcing plate hole at a position of the reinforcing plate corresponding to the conducting hole includes measuring the position of the conducting hole to generate a measurement result, and drilling the reinforcing plate hole according to the measurement result.

[0020] The diameter of the reinforcing plate hole is smaller than the diameter of the conducting hole on one side.

[0021] Furthermore, the size of one side of the window is larger than the diameter of the conducting hole.

[0022] Furthermore, after the flexible board layer is formed, the flexible board layer is subjected to surface treatment.

[0023] The technical solution of the present invention is to move the circuit pattern adjacent to the conductive hole to the single-sided copper layer of the auxiliary copper clad board to form a "line shifting" process. It not only prevents the circuit pattern in the area from being squeezed when the high-precision flexible board is plugged into the precision PIN needle, causing problems such as circuit deformation or short circuit, but also provides space for the through-hole coverage area, thereby providing space for the production of auxiliary circuit patterns, forming a flat area for plugging in precision PIN needles. At the same time, the auxiliary circuit pattern can effectively improve the bonding strength and reliability of the conductive hole, and prevent problems such as hole deformation during plugging.

[0024] The processing method of first attaching a complete reinforcement plate and then drilling the reinforcement plate holes effectively prevents the problem of misalignment between the reinforcement plate holes and the via holes, and creates the effect of reinforcement plate support around the via holes (without differential positions), effectively avoiding the problem of excessive insertion of precision PIN pins or damage to the via holes. Furthermore, it can also prevent the via holes from being bent or the edges from being pressed into the reinforcement plate holes when pressing the reinforcement plate together.

[0025] The overall processing process forms a correlation between the processing structure and processing flow based on the flatness around the conductive hole, forming the "line moving" processing, through-hole coverage area 1, auxiliary circuit graphics, cover film window opening and drilling reinforcement plate holes, providing an effective processing method for the processing of high-precision flexible boards with PIN pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0027] Figure 1 This is a schematic diagram of the cross-sectional structure of a high-precision flexible board with PIN pins in the prior art;

[0028] Figure 2 This is a schematic diagram of the cross-sectional structure of another prior art high-precision flexible board with PIN pins;

[0029] Figure 3 The main process flow chart of the embodiment of the present invention is included;

[0030] Figure 4 is a schematic diagram of the cross-sectional structure of the attachment plate of this embodiment;

[0031] Figure 5 Schematic diagram of the planar structure of the through-and-blind hole plate of this embodiment;

[0032] Figure 6 for Figure 5 AA cross-sectional structural diagram;

[0033] Figure 7 for Figure 5 BB cross-sectional structure diagram;

[0034] Figure 8 Schematic diagram of the cross-sectional structure of the via plate of this embodiment;

[0035] Figure 9 Based on Figure 7 And the schematic diagram of the cross-section structure after the whole board is electroplated;

[0036] Figure 10 Schematic diagram of the planar structure of the surface circuit graphic board of this embodiment;

[0037] Figure 11 for Figure 10 Schematic diagram of CC cross-section structure;

[0038] Figure 12 for Figure 10 DD cross-sectional structure diagram;

[0039] Figure 13 is a schematic diagram of the cross-sectional structure of the flexible board layer of this embodiment;

[0040] Figure 14 is a schematic diagram of the cross-sectional structure of the reinforced flexible plate of this embodiment;

[0041] Figure 15 Schematic diagram of the planar structure of the high-precision flexible board of this embodiment;

[0042] Figure 16 for Figure 15Schematic diagram of the cross-sectional structure of EE;

[0043] Figure 17 for Figure 15 Schematic diagram of the cross-sectional structure of FF.

[0044] Description of Figure Numbers:

[0045] 50X~Ordinary flexible board layer; 1112~Surface copper layer; 620X~Ordinary reinforced through-hole board; 1410~Conductive hole; 1310X~Ordinary dense circuit pattern; 1510~Conductive blind via; 1410X~Ordinary conductive hole; 40~Surface circuit pattern board; 300~Precision pin; 410~Surface circuit pattern; 400~Offset difference; 4110~First surface circuit pattern; 500~Difference position; 4120~Second surface circuit pattern; 10~Attached board; 4130~Auxiliary circuit pattern; 110~Double-sided flexible copper clad board; 1310~Dense circuit pattern; 111 0~first copper layer; 1320~blind hole connection end; 1120~first PI layer; 1411~annular ring; 1130~second copper layer; 1420~through hole coverage area; 120~auxiliary copper clad laminate; 1430~circuit distribution area; 1210~single-sided copper layer; 50~flexible board layer; 1220~single-sided PI layer; 510~window cover film; 130~circuit pattern; 60~reinforced flexible board; 20~through and blind hole board; 610~reinforced board; 140~through hole; 6110~reinforced board hole; 150~blind hole; 70~high-precision flexible board; 30~conductive hole board; 620~reinforced through hole board.

[0046] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0048] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside, etc.) are only used to explain the relative position relationship and movement status of the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0049] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being described. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0050] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0051] See also Figure 1 and Figure 2 ; Figure 1 This is a schematic diagram of the cross-sectional structure of a high-precision flexible board with PIN pins in the prior art; Figure 2 This is a schematic diagram of the cross-sectional structure of another prior art high-precision flexible board with PIN pins.

[0052] In the traditional manufacturing method, the ordinary reinforced through-hole plate 620X may be offset from the ordinary flexible plate layer 50X after being attached and pressed, resulting in the displacement between the ordinary reinforced plate holes of the ordinary reinforced through-hole plate 620X and the ordinary conductive holes 1410X of the ordinary flexible plate layer 50X (e.g. Figure 1 As shown in FIG, a large offset difference 400 is generated, and after the precision PIN needle 300 is inserted, it is easy to cause problems such as difficulty in effective plugging, poor contact, and the ordinary flexible board layer 50X being broken.

[0053] Even if the two holes are precisely aligned, since the needle head of the precision PIN needle 300 is relatively precise, the diameter difference between its smaller diameter section and larger diameter section is small (for example, the diameter of the smaller diameter section is 0.2 mm, and the diameter of the larger diameter section is 0.3 mm). When the PIN needle is inserted, it is easy to squeeze the ordinary flexible board layer 50X from the difference position 500, causing the ordinary conductive hole 1410X to be squeezed in the direction of the ordinary reinforcement plate hole, thereby causing the precision PIN needle 300 to be over-inserted (that is, the 0.3 mm diameter section passes through the flexible board) or damage the ordinary conductive hole 1410X.

[0054] Ordinary high-precision flexible boards have a high wiring density, which can easily cause the precision PIN needle 300 to squeeze the ordinary dense circuit pattern 1310X (i.e., the dense circuit adjacent to the precision PIN needle 300) after being inserted into the ordinary conductive hole 1410X, causing problems such as circuit deformation or short circuit.

[0055] See also Figure 3 ; Figure 3 The main process flow chart included in the embodiment of the present invention.

[0056] The method for manufacturing the high-precision flexible board 70 according to the embodiment of the present invention includes: Figure 1 The main production process is described in detail step by step below.

[0057] Step S10:

[0058] Take a double-sided flexible copper clad laminate 110 which is stacked in sequence by a first copper layer 1110, a first PI layer 1120, and a second copper layer 1130, and take a single-sided flexible copper clad laminate which is stacked in sequence by a single-sided copper layer 1210 and a single-sided PI layer 1220; make a circuit pattern 130 on the first copper layer 1110; and cut the single-sided copper clad laminate to form an auxiliary copper clad laminate 120; attach the auxiliary copper clad laminate 120 to the area of ​​the circuit pattern 130 to form an attached board 10, and press it together, and then drill through holes 140; then make blind holes 150 on the auxiliary copper clad laminate 120, and the blind holes 150 correspond to parts of the circuit pattern 130; the entire board forms a through-blind hole board 20.

[0059] The overall technical method of this embodiment adopts the method of appropriately enhancing the bonding force and strength between the conductive hole 1410 and the flexible board layer 50, and adopts the method of "shifting the line" to avoid the through-hole coverage area 1420, so that the conductive hole 1410 has stronger support force when inserting the precision PIN needle 300, and at the same time will not cause the adjacent circuit pattern 130 to deform. Further, after the reinforcement plate 610 is integrally attached, the reinforcement plate hole 6110 is drilled to improve the precision of the reinforcement plate hole 6110 and the conductive hole 1410 of the flexible board layer 50.

[0060] Based on the above overall technical implementation process, this embodiment adopts a method of first forming a small-pitch, high-density circuit pattern 130, and then moving adjacent circuits to a single-sided copper-clad laminate for production, thereby achieving avoidance and conduction of adjacent circuits.

[0061] The auxiliary copper clad plate 120 is attached to the area of ​​the circuit pattern 130 to form a lamination foundation for the subsequent "line shifting" process.

[0062] Cutting the single-sided flexible copper clad laminate to form an auxiliary copper clad laminate 120 and forming a partial attachment relative to the double-sided flexible copper clad laminate 110 can effectively realize the "line shifting" process and avoid the full attachment resulting in excessive lamination, conduction performance, and flexibility performance deviation of the flexible board layer 50 relative to the flexible board in the design data of the processing guidance; on the other hand, it can effectively utilize the board space with non-dense circuit distribution to realize the "line shifting" processing process through the auxiliary copper clad laminate 120.

[0063] The blind vias 150 are formed to provide the conductive conditions from the single-sided copper layer 1210 to the circuit pattern 130 for “wire transfer”.

[0064] The “line shifting” process is not only based on the avoidance factor of the small-pitch, high-density circuit pattern 130 adjacent to the via 1410, but also based on the subsequent production of the auxiliary circuit pattern 4130, providing sufficient board space for the production of the auxiliary circuit pattern 4130 (see the following description for details).

[0065] In this embodiment, the auxiliary copper clad laminate 120 avoids the through hole 140 ; ​​preferably, the avoiding dimension is 100 μm to 0.5 mm extending from the edge of the through hole 140 toward the board surface.

[0066] Since the high-precision flexible board 70 needs to be plugged into the precision PIN needle 300, and the plugging position needs to be flat, in this embodiment, after the auxiliary copper clad board 120 is attached and pressed, a certain step structure is formed on the surface of the double-sided flexible copper clad board 110. In order to prevent the step structure from affecting the plugging effect of the precision PIN needle 300, the auxiliary copper clad board 120 needs to avoid the through hole 140 so that the board surface within the range of the through hole 140 is a flat board surface.

[0067] In this embodiment, the thickness of the single-sided copper layer 1210 is equal to the thickness of the first copper layer 1110 , and the thickness of the single-sided PI layer 1220 is less than the thickness of the first PI layer 1120 .

[0068] Preferably, the line body after "moving the line" needs to match the line body of the original line. Therefore, the thickness of the single-sided copper layer 1210 of the line after "moving the line" needs to be the same as the thickness of the line that has not been "moved", that is, the same as the thickness of the first copper layer 1110. At the same time, in order to reduce the overall thickness of the auxiliary copper clad laminate 120, the thickness of the single-sided PI layer 1220 can be reduced; for example: the thickness of the single-sided PI layer 1220 is 20μm, and the thickness of the first PI layer 1120 is 50μm.

[0069] It is worth noting that the lines processed by "line shifting" in this embodiment are not signal lines, nor are they lines that carry large currents, but are ordinary conductive lines. Therefore, the "line shifting" processing method will not affect the signal or the current carrying capacity.

[0070] Step S20:

[0071] The through-hole and blind-via plate 20 is electroplated throughout the entire plate. The through-hole 140 forms a conductive via 1410 (with an annular ring 1411 ), and the blind hole 150 forms a conductive blind via 1510 . The first copper layer 1110 and the single-sided copper layer 1210 together form a surface copper layer 1112 . The entire plate forms a conductive via plate 30 .

[0072] Since the through-hole and blind-hole plate 20 is an integral plate body, the whole plate can be processed by electroplating. After the electroplating, the through-hole 140 and the blind-hole 150 are all electroplated with copper to form a conductive effect. At the same time, the surface of the plate is also electroplated. There is no need to adopt the processing method of electroplating the through-hole 140, the blind-hole 150, and the surface copper layer 1112 in batches, which effectively shortens the processing process, improves the processing efficiency, and reduces the processing cost.

[0073] In this embodiment, with the edge of the through hole 140 as the starting position, the board body of the double-sided flexible copper clad laminate 110 is extended to form a through hole coverage area 1420, and the double-sided flexible copper clad laminate 110 other than the through hole 140 and the through hole coverage area 1420 is a circuit distribution area 1430; the circuit pattern 130 includes a dense circuit pattern 1310 distributed adjacent to the through hole 140 (generally, the circuit pattern 1310 is less than or equal to 100 μm away from the through hole 1410). shape 130 is an adjacent circuit pattern 130); producing the circuit pattern 130 on the first copper layer 1110 includes removing the dense circuit pattern 1310 in the through-hole coverage area 1420, and one end of the dense circuit pattern 1310 located in the circuit distribution area 1430 is a blind hole connection end 1320; producing the blind hole 150 on the auxiliary copper clad laminate 120 includes producing the blind hole 150 at a position of the auxiliary copper clad laminate 120 corresponding to the blind hole connection end 1320.

[0074] Optionally, the dense circuit pattern 1310 is a circuit pattern 130 with a line width / line gap ≤ 4 mil / 4 mil.

[0075] The above is the processing process of "moving the line". By setting the through-hole coverage area 1420, a space area is provided for the insertion of the precision PIN needle 300, and the adjacent dense circuit graphics 1310 in the through-hole coverage area 1420 are moved to the single-sided copper layer 1210 of the auxiliary copper clad board 120 for production, and interconnected and conducted through the conductive blind vias 1510, forming the need for the insertion of the precision PIN needle 300, forming the through-hole coverage area 1420, forming the single-sided copper layer 1210 to make the "moving the line" line, and forming the process and correlation of the conductive blind vias 1510.

[0076] It is worth noting that the through-hole coverage area 1420 matches the size setting of the large diameter section of the precision PIN needle 300, so that the board surface of the double-sided flexible copper clad laminate 110 corresponding to the position where the precision PIN needle 300 is inserted is a flat area, rather than a stepped board surface after the auxiliary copper clad laminate 120 is attached and pressed.

[0077] The auxiliary circuit pattern 4130 matches the setting of the through-hole coverage area 1420, thereby meeting the flat board surface effect of matching the insertion of the precision PIN needle 300, and at the same time improving the bonding force between the conductive hole 1410 and the board surface, enhancing the strength and reliability of the conductive hole 1410.

[0078] In this embodiment, producing the circuit pattern 130 corresponding to the first copper layer 1110 includes removing the first copper layer 1110 corresponding to the blind hole 150; producing the blind hole 150 on the auxiliary copper clad board 120 includes laser drilling the first PI layer 1120 corresponding to the blind hole 150 to expose the circuit pattern 130.

[0079] Step S30:

[0080] A surface circuit pattern 410 is fabricated on the via plate 30 to form a surface circuit pattern plate 40 . This includes fabricating a first surface circuit pattern 4110 on the surface copper layer 1112 and a second surface circuit pattern 4120 on the second copper layer 1130 .

[0081] In this embodiment, forming the surface circuit pattern 410 on the via plate 30 includes forming an auxiliary circuit pattern 4130 on the via 1410 , wherein the auxiliary circuit pattern 4130 extends from the edge of the via 1410 toward the body of the double-sided flexible copper clad laminate 110 .

[0082] The circuit pattern 130 is manufactured in accordance with the process of dry film application, exposure, development, etching, and film stripping. Due to the above process, the auxiliary copper clad laminate 120 provides space for the through-hole coverage area 1420, forming a surface space for manufacturing the auxiliary circuit pattern 4130. The auxiliary circuit pattern 4130 is an extension of a portion of the hole ring 1411 in the non-circuit distribution area (i.e., avoiding the circuit distribution area) on the surface copper layer 1112 when manufacturing the surface circuit pattern 410, forming an auxiliary graphic structure that effectively increases the conductive hole 1410.

[0083] Generally, the circuit patterns 130 on the board are densely distributed, and the width of the hole ring 1411 of the through hole 1410 itself is generally 20μm to 50μm, so the minimum space provided for the auxiliary circuit pattern 4130 can be 70μm, so the "line moving" process can move 2 to 4 lines.

[0084] Step S40:

[0085] A covering film is taken and opened with windows to form a window covering film 510 , and the window covering film 510 is attached to the surface of the surface circuit pattern 410 ; the entire board forms a flexible board layer 50 .

[0086] In this embodiment, the size of one side of the window is larger than the diameter of the conducting hole 1410 .

[0087] The window of the covering film further matches the setting of the conductive hole 1410. Preferably, the size of the window on one side is larger than the diameter of the conductive hole 1410 and smaller than the diameter of the through-hole covering area 1420, forming an effect that the covering film covers the auxiliary circuit pattern 4130 and exposes the hole ring 1411, providing a contact and conduction basis for plugging in the precision PIN needle 300 during application.

[0088] In this embodiment, after the flexible board layer 50 is formed, the flexible board layer 50 is subjected to surface treatment.

[0089] After the surface treatment, a surface protection layer and a wear-resistant layer are formed on the via hole 1410 .

[0090] Step S50:

[0091] Take the reinforcing plate 610 and attach it as a whole to one side of the flexible board layer 50, that is, to one side of the second surface circuit pattern 4120, to form a reinforced flexible board 60; then, drill reinforcing plate holes 6110 at the positions of the reinforcing plate 610 corresponding to the conductive holes 1410, and the reinforcing plate 610 forms a reinforced through-hole plate 620; after post-processing, the entire board forms the high-precision flexible board 70.

[0092] This embodiment is based on the high-precision and high-reliability processing of the conductive hole 1410 and the flexible board layer 50. For the reinforcement plate 610, a method of first attaching the reinforcement plate 610 as a whole and then drilling the reinforcement plate hole 6110 is adopted. Compared with the prior art method of drilling first and then attaching, this effectively improves the alignment accuracy of the reinforcement plate hole 6110 and the conductive hole 1410, and creates an effect that the conductive hole 1410 is also supported by the reinforcement plate 610 around the conductive hole 1410 (without the difference position 500). In addition, the method of attaching first and then drilling in this embodiment can solve the problem in the prior art that the conductive hole 1410 is bent or the edge of the conductive hole 1410 is pressed into the reinforcement plate hole 6110 when the hole diameter of the conductive hole 1410 is smaller than the hole diameter of the reinforcement plate hole 6110, thereby effectively improving the balance and reliability of the conductive hole 1410.

[0093] In this embodiment, drilling the reinforcing plate hole 6110 at the position of the reinforcing plate 610 corresponding to the conductive hole 1410 includes measuring the position of the conductive hole 1410 to generate a measurement result, and drilling the reinforcing plate hole 6110 in the reinforcing plate 610 according to the measurement result.

[0094] Since the flexible board layer 50 may be affected by expansion and contraction after being processed in the intermediate process, the conductive hole 1410 may be offset from the design data of the processing guidance. If the reinforcement plate hole 6110 is directly drilled, the drilling may be offset or the conductive hole 1410 may be damaged. Therefore, before drilling the reinforcement plate hole 6110, a two-dimensional measurement device, an AOI optical scanning device, a CCD lens alignment device or other optical scanning equipment can be used to measure the position of the conductive hole 1410. After comparing and adjusting the data with the design data, a drilling coefficient for drilling the reinforcement plate hole 6110 is formed, and then the drilling process is performed, which can effectively improve the drilling accuracy.

[0095] In this embodiment, the diameter of the reinforcing plate hole 6110 is smaller than the diameter of the conducting hole 1410 on one side.

[0096] When there is a sufficient space for insertion of the precision PIN needle 300, since the reinforcement plate hole 6110 of this embodiment is processed after the conductive hole 1410 is processed and has higher processing accuracy, the processing process of the reinforcement plate hole 6110 can be used to further match the diameter of the precision PIN needle 300, so that the precision PIN needle 300 has better insertion firmness when used.

[0097] It is worth noting that due to the actual design and processing of circuit boards, which are relatively precise, the actual structural diagrams and the thickness of each layer, line width and other dimensions are all at the micron level. For example, the thickness of each layer is generally between 5μm and 50μm. If the drawings in the specification are made according to the actual proportions, there will be a problem of unclear drawings. Therefore, in order to more clearly show the implementation process of the manufacturing method, the drawings of this embodiment are all schematic diagrams that enlarge the technical features, and do not represent the size of the actual structural diagram, nor do they represent enlarged drawings of the actual structural diagram in proportion.

[0098] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's description and drawings, or direct / indirect applications in other related technical fields, within the scope of the present invention are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a high-precision flexible board with PIN pins for an intelligent vision module, characterized by: S10: taking a double-sided flexible copper-clad laminate having a first copper layer, a first PI layer, and a second copper layer stacked in sequence, and taking a single-sided flexible copper-clad laminate having a single-sided copper layer and a single-sided PI layer stacked in sequence; making a circuit pattern on the first copper layer; and cutting the single-sided copper-clad laminate to form an auxiliary copper-clad laminate; The auxiliary copper clad laminate is attached to the area of ​​the circuit pattern and pressed together, and then through holes are drilled; blind holes are then made in the auxiliary copper clad laminate, and the blind holes correspond to parts of the circuit pattern; the entire board is formed into a through-blind hole board; S20: Electroplating the entire through-hole and blind-via plate, wherein the through-holes become conductive vias, and the blind holes become conductive blind vias; the first copper layer and the single-sided copper layer together form a surface copper layer; and the entire plate becomes a conductive via plate; S30: forming a surface circuit pattern on the via plate to form a surface circuit pattern plate; S40: taking the cover film, performing windowing to form a windowed cover film, and attaching the windowed cover film to the surface of the surface circuit pattern; and forming a flexible board layer on the entire board; S50: Take a reinforcing plate and attach it as a whole to one side of the flexible board layer; then drill reinforcing plate holes at positions of the reinforcing plate corresponding to the conductive holes; after post-processing, the entire board forms the high-precision flexible board.

2. The method for manufacturing a high-precision flexible board with PIN pins for an intelligent vision module according to claim 1, characterized in that: The auxiliary copper clad plate avoids the through hole.

3. The method for manufacturing a high-precision flexible board with PIN pins for an intelligent vision module according to claim 1, characterized in that: The thickness of the single-sided copper layer is equal to the thickness of the first copper layer, and the thickness of the single-sided PI layer is less than the thickness of the first PI layer.

4. The method for manufacturing a high-precision flexible board with PIN pins for an intelligent vision module according to claim 1, characterized in that: Starting from the edge of the through hole, the board body of the double-sided flexible copper clad laminate is extended to form a through hole coverage area, and the double-sided flexible copper clad laminate other than the through hole and the through hole coverage area is a circuit distribution area; the circuit pattern includes a dense circuit pattern distributed adjacent to the through hole; The step of forming a circuit pattern on the first copper layer includes removing the dense circuit pattern in the through-hole coverage area, and providing a blind hole connection end at one end of the dense circuit pattern in the circuit distribution area; The step of forming the blind hole on the auxiliary copper clad laminate includes forming the blind hole at a position of the auxiliary copper clad laminate corresponding to the blind hole connection end.

5. The method for manufacturing a high-precision flexible board with PIN pins for an intelligent vision module according to claim 1 or 4, characterized in that: Producing a surface circuit pattern on the via plate includes producing an auxiliary circuit pattern on the via, wherein the auxiliary circuit pattern extends from the edge of the via to the body of the double-sided flexible copper clad laminate.

6. The method for manufacturing a high-precision flexible board with PIN pins for an intelligent vision module according to claim 1, characterized in that: Making a circuit pattern corresponding to the first copper layer includes removing the first copper layer corresponding to the blind hole; making a blind hole on the auxiliary copper clad board includes laser drilling the first PI layer corresponding to the blind hole to expose the circuit pattern.

7. The method for manufacturing a high-precision flexible board with PIN pins for an intelligent vision module according to claim 1, characterized in that: Drilling the reinforcing plate hole at a position of the reinforcing plate corresponding to the conductive hole includes measuring the position of the conductive hole to generate a measurement result, and drilling the reinforcing plate hole according to the measurement result.

8. The method for manufacturing a high-precision flexible board with PIN pins for an intelligent vision module according to claim 1 or 7, characterized in that: The diameter of the reinforcing plate hole is smaller than the diameter of the conducting hole on one side.

9. The method for manufacturing a high-precision flexible board with PIN pins for an intelligent vision module according to claim 1, characterized in that: The size of one side of the window is larger than the diameter of the conducting hole.

10. The method for manufacturing a high-precision flexible board with PIN pins for an intelligent vision module according to claim 1, characterized in that: After the flexible board layer is formed, the flexible board layer is surface treated.

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