Heat dissipation structure

Abstract

A heat dissipation structure is provided. A heat dissipation structure according to one aspect of the present invention comprises: a printed circuit board on one surface of which a heat dissipation pad having a prescribed area is provided; the heating element is combined on the heat dissipation pad through a combination part and is provided with one surface adjacent to the heat dissipation pad and the other surface opposite to the one surface; the radiator is provided with a surface opposite to the other surface of the heating element; and a heat transfer material including a first region portion between the other surface of the heat generating element and one surface of the heat sink.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2024-0030725, filed on March 4, 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to a heat dissipation structure for a heating element and a housing structure for a brake system having the heat dissipation structure. More specifically, the present invention relates to a heat dissipation structure capable of improving the heat dissipation efficiency of a heating element and a housing structure for a brake system having the heat dissipation structure. Background Art

[0004] The brake system uses a three-phase motor as an actuator for pressure application. To drive it, an AC signal needs to be output through each of the three terminals, and the corresponding signal needs to be output through the inverter circuit.

[0005] In this case, the inverter circuit is composed of six switching elements, and since high-speed switching and large currents easily generate heat, heat dissipation measures are essential.

[0006] In conventional technology, a heating element is coated with thermal paste and mounted on a printed circuit board (PCB). Multiple through-holes are formed in the PCB to dissipate heat generated by the heating element to a heat sink structure located on the opposite side of the PCB.

[0007] However, since this method forms through holes on the PCB and dissipates heat through the substrate, there is a problem of reduced heat dissipation efficiency. Summary of the Invention

[0008] Problems to be solved by the invention

[0009] The present invention aims to solve the above problems. The purpose of the present invention is to provide a heat dissipation structure that can improve the heat dissipation efficiency of a heating element and a housing structure for a brake system using the structure.

[0010] Another object of the present invention is to provide a heat dissipation structure configured to dissipate heat directly from a heating element to a radiator structure, and a housing structure for a brake system using the structure.

[0011] Another object of the present invention is to provide a heat dissipation structure that can dissipate heat from a heating element without passing through a PCB substrate on which the heating element is mounted, and a housing structure for a braking system using the structure.

[0012] The problems of the present invention are not limited to the problems mentioned above, and those skilled in the art will clearly understand other problems not mentioned through the following description.

[0013] Means used to solve problems

[0014] According to one aspect of the present invention, a heat dissipation structure is provided, comprising: a PCB substrate having a first heat dissipation pad having a specified area provided on one surface; a heating element coupled to the first heat dissipation pad and having a surface in contact with the first heat dissipation pad and another surface opposite to the one surface; a heat sink having a surface opposite to the other surface of the heating element; and a heat transfer material including a first region portion located between the other surface of the heating element and a surface of the heat sink.

[0015] At this time, the area of ​​the first heat dissipation pad may correspond to the area of ​​the one surface of the heating element.

[0016] At this time, the area of ​​one surface of the heat sink may correspond to the area of ​​the other surface of the heating element.

[0017] At this time, the heat transfer material may include thermal paste.

[0018] At this time, the heat sink may form a part of a housing surrounding the PCB substrate and the heating element to protect the PCB substrate and the heating element of the heat dissipation structure.

[0019] At this time, the area of ​​the first heat dissipation pad may be larger than the area of ​​a surface of the heating element.

[0020] In this case, the first heat dissipation pad is a first electrode pad, and a surface of the heating element in contact with the first electrode pad may be a portion of a first electrode of the heating element in contact with the first electrode pad.

[0021] At this time, the area of ​​one surface of the radiator corresponds to the area of ​​the first heat dissipation pad, and the heat transfer material may include a second area portion, which is located on the side of the first area portion and between a portion of the first heat dissipation pad that is not connected to the heating element and a portion of the radiator facing the portion.

[0022] Here, the first heat dissipation pad may be formed to have a wider width on both sides of the heating element in the width direction, and the heat transfer material may have the second region formed on both sides of the first region in the width direction.

[0023] In this case, one surface of the heat sink may be formed into a flat surface, and the thickness of the heat transfer material in the second region may be thicker than the thickness of the heat transfer member in the first region.

[0024] Here, the first heat dissipation pad may be formed to have a wider width on one side in the width direction of the heating element, and the heat transfer material may have the second region formed on one side in the width direction of the first region.

[0025] At this time, one surface of the heat sink includes a first bottom surface adjacent to the first area portion and a second bottom surface protruding further toward the heat dissipation pad than the first bottom surface, and the thickness of the heat transfer material of the first area portion can be formed to be the same as the thickness of the heat transfer member of the second area portion.

[0026] At this time, a second electrode is provided on the heating element, and a second heat dissipation pad having a specified area and contacting the second electrode is provided on the PCB, and the area of ​​the second heat dissipation pad may be larger than that of the second electrode.

[0027] In this case, the heating element may be a switching element used in an inverter circuit, the first electrode may be a drain, and the second electrode may be a source.

[0028] According to another aspect of the present invention, a housing structure for a braking system is provided, comprising: a housing having a built-in PCB substrate for the braking system; a heat dissipation pad configured on the PCB substrate and having a specified area; a heating element coupled to the heat dissipation pad and provided with a surface adjacent to the heat dissipation pad and another surface opposite to the one surface; a heat sink having a surface opposite to the other surface of the heating element; and a heat transfer material including a first area portion located between the other surface of the heating element and a surface of the heat sink.

[0029] At this time, the area of ​​the heat dissipation pad may be formed to correspond to or be larger than the area of ​​the one surface of the heating element.

[0030] At this time, the area of ​​one surface of the heat sink may correspond to the area of ​​the other surface of the heating element.

[0031] In this case, the heat sink may form a part of the housing.

[0032] At this time, the area of ​​one surface of the radiator corresponds to the area of ​​the heat dissipation pad, and the heat transfer material may include a second area portion, which is located on the side of the first area portion and between a portion of the heat dissipation pad that is not connected to the heating element and a portion of the radiator facing the portion.

[0033] In this case, the second region of the heat transfer material may be formed on one side or both sides of the first region in the width direction.

[0034] In this case, one surface of the heat sink may be formed into a flat surface, and the thickness of the heat transfer material in the second region may be thicker than the thickness of the heat transfer member in the first region.

[0035] At this time, one surface of the heat sink includes a first bottom surface adjacent to the first area portion and a second bottom surface protruding further toward the heat dissipation pad than the first bottom surface, and the thickness of the heat transfer material of the first area portion can be formed to be the same as the thickness of the heat transfer member of the second area portion.

[0036] At this time, a plurality of heat dissipation pads may be provided on the PCB substrate, and a plurality of heating elements spaced apart from each other may be provided on the plurality of heat dissipation pads, and a plurality of heat sinks may be provided on the heating elements, and the plurality of heat sinks may be integrally connected to the housing.

[0037] In this case, the heating element may be a switching element used in an inverter circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Exemplary embodiments of the present disclosure are described in detail with reference to the accompanying drawings so that those skilled in the art to which the present disclosure pertains may more clearly understand the above contents and other objects, features and advantages of the present disclosure.

[0039] Figure 1 It is a three-dimensional diagram of the heat dissipation structure of the first embodiment of the present invention.

[0040] Figure 2 FIG. 1 is a plan view showing a region where a heat dissipation pad in contact with a heat generating component is formed on a PCB substrate of a heat dissipation structure according to a first embodiment of the present invention.

[0041] Figure 3 The heat dissipation structure of the first embodiment of the present invention is shown Figure 1 A cross-sectional view of the structure.

[0042] Figure 4 It is a perspective view of a heat dissipation structure according to a second embodiment of the present invention.

[0043] Figure 5 FIG. 1 is a plan view showing a region where a heat dissipation pad in contact with a heating element is formed on a PCB substrate of a heat dissipation structure according to a second embodiment of the present invention.

[0044] Figure 6 The heat dissipation structure of the second embodiment of the present invention is shown in FIG. Figure 4 A cross-sectional view of the structure.

[0045] Figure 7 FIG. 4 is a perspective view of a heat dissipation structure according to a third embodiment of the present invention.

[0046] Figure 8 FIG. 1 is a plan view showing a region where a heat dissipation pad in contact with a heating element is formed on a PCB substrate of a heat dissipation structure according to a third embodiment of the present invention.

[0047] Figure 9 The heat dissipation structure of the third embodiment of the present invention is shown in FIG. Figure 7 A cross-sectional view of the structure.

[0048] Figure 10 It is a three-dimensional diagram of a housing structure for a brake system that adopts the heat dissipation structure of an embodiment of the present invention. DETAILED DESCRIPTION

[0049] The following is a detailed description of the embodiments of the present invention so that those skilled in the art can easily implement the invention. The present invention can be implemented in various forms and is not limited to the embodiments described in this specification. In order to clearly illustrate the present invention, parts not related to the description are omitted from the drawings, and the same reference numerals are given to the same or similar parts throughout the specification.

[0050] The words and terms used in the specification and claims are not limited to their ordinary meanings or dictionary meanings, and should be interpreted as meanings and concepts consistent with the technical ideas of the present invention on the principle that the terms can be defined by the inventor in order to best describe the present invention.

[0051] In this specification, it should be understood that terms such as "including" or "having" are intended to specify the existence of the features, numbers, steps, operations, components, parts or combinations thereof described in this specification, and do not exclude the possibility of the existence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0052] In the drawings of this specification, the thickness and size of components are exaggerated for clarity of explanation.

[0053] Figure 1 It is a three-dimensional diagram of the heat dissipation structure of the first embodiment of the present invention. Figure 2 FIG. 1 is a plan view showing a region where a heat dissipation pad in contact with a heat generating component is formed on a PCB substrate of a heat dissipation structure according to a first embodiment of the present invention. Figure 3 The heat dissipation structure of the first embodiment of the present invention is shown Figure 1 A cross-sectional view of the structure.

[0054] Reference Figures 1 to 3 The heat dissipation structure 10 according to an embodiment of the present invention may include a PCB substrate 30 , a heating element 20 and a heat sink 40 .

[0055] In the first embodiment of the present invention, a heat dissipation pad 31 and a heating element 20 are provided on a PCB substrate 30. In this case, multiple components for driving the braking system may be integrated on the PCB substrate 30, such as field effect transistors (FETs) and shunts.

[0056] In the first embodiment of the present invention, a heat dissipation pad 31 is provided on the PCB substrate 30. According to the first embodiment of the present invention, the heat dissipation pad 31 serves as an electrode pad formed on the PCB substrate to electrically connect to the electrodes of the FET, and may be a drain pad 32 electrically connected to the drain electrode of the FET electrodes. That is, in the first embodiment of the present invention, the drain pad 32 may function as the heat dissipation pad 31 to dissipate heat from the heating element 20.

[0057] In the first embodiment of the present invention, the FET serving as the heating element 20 has a gate 24, three source electrodes 26, and a drain electrode 22. Furthermore, a gate pad 34, a source pad 36, and a drain pad 32 are formed on a PCB substrate 30 and are connected to the gate 24, the source electrodes 26, and the drain electrode 22, respectively.

[0058] In one embodiment of the present invention, the heat dissipation pad 31 can be formed to have an area equal to or larger than the heating element 20 placed on the heat dissipation pad 31 (for example, a FET provided inside the housing of the brake system), so that heat can be dissipated from the heating element 20 (for example, the FET).

[0059] In the first embodiment of the present invention, the heat dissipation pad 31 , ie, the drain pad 32 , may be formed to have an area corresponding to the contact region of the drain 22 of the FET.

[0060] In the first embodiment of the present invention, the heating element 20 contacts and is coupled to the heat dissipation pad 31 .

[0061] In one embodiment of the present invention, as an example, the heating element 20 may be a field effect transistor (FET) that is a switching element of an inverter circuit for driving a pressurized brake in a braking system.

[0062] At this time, the FET may include a gate, a drain, and a source (or electrode terminals).

[0063] exist Figure 2 In the figure, the upper part of the heat dissipation pad 31, namely the drain pad 32, is the drain contact area of ​​the FET, the reference numeral 36 is the source pad, which is the source contact area, and the reference numeral 34 is the gate pad, which is the gate contact area.

[0064] In this embodiment, the FETs used in the brake system may be composed of six FETs. The structure of the FETs and the gate, drain, and source are well known, so their detailed description will be omitted.

[0065] On the other hand, in one embodiment of the present invention, the structure in which a heating element 20 is connected to the PCB substrate 30 and the heat sink 40 will be described in detail.

[0066] In one embodiment of the present invention, the heating element 20 (eg, FET) may include: Figure 1 The body 21 is a hexahedron as shown. However, the shape of the body 21 of the heating element 20 is not limited thereto. The heating element 20 may have a Figure 1 When viewed in the x-axis, the source and gate electrodes are formed by protruding toward the positive direction of the x-axis. Figure 1 It can be seen that the source and gate can be provided in a shape that is bent toward the substrate.

[0067] In the body 21 of the heating element 20 ( Figure 1 When viewed in FIG, a drain electrode 22 may be formed on the lower surface of the body 21 facing the substrate 30. The drain electrode 22 may be coupled to the substrate by a coupling member (not shown), for example, a bolt or the like.

[0068] On the other hand, according to the first embodiment of the present invention, a heat transfer material 50 (e.g., thermal grease) may be applied to the upper portion of the heating element 20 on the heat dissipation pad 31 coupled to the substrate 30 , and the heat sink 40 is located on the heat transfer material 50 .

[0069] In the first embodiment of the present invention, the shape of the bottom surface 42 of the heat sink 40 opposite to the upper surface 28 of the heating element 20 can correspond to the shape of the upper surface 28 of the heating element 20. A heat transfer material 50 can be applied between the bottom surface 42 of the heat sink 40 and the upper surface 28 of the heating element 20 to promote heat transfer. In this case, the heat transfer material 50 can be thermal paste, but is not limited thereto.

[0070] In one embodiment of the present invention, the heat sink 40 may form a housing ( Figure 10 301) to protect the PCB substrate 30 and the heating element 20.

[0071] The heat sink 40 can be made of a metal material or non-metal material with high thermal conductivity such as aluminum. Thus, the heat generated from the heating element 20 can be transferred to the housing ( Figure 10 301 in), then, to the shell ( Figure 10 301) is discharged externally.

[0072] In one embodiment of the present invention, the housing ( Figure 10 A plurality of FETs may be provided inside 301), and the heat sink 40 may be in contact with a surface of each of the plurality of FETs, so that heat may be transferred through the thermal paste.

[0073] The plurality of heat sinks 40 connected to the plurality of FETs may be connected to the housing ( Figure 10 301) is formed as a whole, so that the heat generated during the operation of the multiple FETs can be dissipated to the housing ( Figure 10 External emission of 301).

[0074] According to one embodiment of the present invention, the heat generated by the heating element 20 is not dissipated to the heat sink 40 side through the substrate 30, but is directly dissipated to the housing ( Figure 10 The heat dissipation is carried out on the side 301) in the heat dissipation module, thereby improving the heat dissipation efficiency and simplifying the heat dissipation structure.

[0075] Figure 4 It is a perspective view of a heat dissipation structure according to a second embodiment of the present invention. Figure 5 FIG. 1 is a plan view showing a region where a heat dissipation pad in contact with a heating element is formed on a PCB substrate of a heat dissipation structure according to a second embodiment of the present invention. Figure 6 The heat dissipation structure of the second embodiment of the present invention is shown in FIG. Figure 4 A cross-sectional view of the structure.

[0076] Similar to the first embodiment, the heat dissipation structure 100 of the second embodiment of the present invention may include a PCB substrate 130, a heating element 120 and a heat sink 140. Hereinafter, when describing the heat dissipation structure 100 of the second embodiment, the configuration different from the first embodiment will be described in detail.

[0077] Compared with the first embodiment, in the heat dissipation structure 100 of the second embodiment of the present invention, the area of ​​the heat dissipation pad 131, for example, the drain 132 of the FET can be formed to be larger than a surface of the heating element 120, that is, larger than the area of ​​the surface of the heating element 120 in contact with the heat dissipation pad 131 on the substrate.

[0078] In the second embodiment of the present invention, the FET serving as the heating element 120 has a gate 124, three sources 126, and a drain 122. Furthermore, a gate pad 134, a source pad 136, and a drain pad 132 are formed on a PCB substrate 130 and are connected to the gate 124, the source 126, and the drain 122, respectively.

[0079] At this time, Figure 5In the figure, the first region 131a on the heat dissipation pad 131 is the region where the drain 122 of the FET contacts, reference numeral 136 is the source pad region where the source pad 126 contacts, and reference numeral 134 is the gate pad region where the gate 124 contacts.

[0080] At this time, the upper surface of the heat dissipation pad 131 can be divided into a first area portion 131a which is an area in contact with the heating element 120 and a second area portion 131b which is not in contact with the heating element 120. According to the second embodiment of the present invention, the heat dissipation pad 131 is formed in a quadrilateral shape, and the first area portion 131a is located in the center, and the second area portion 131b is located on both sides of the heating element 120 in the width direction with the first area portion 131a as the center.

[0081] According to the second embodiment of the present invention, the area of ​​the bottom surface 142 of the heat sink 140 may correspond to the area of ​​the heat dissipation pad 131. Figure 4 and Figure 6 It can be seen that the area of ​​the bottom surface 142 of the heat sink 140 can be formed to be larger than the area of ​​the upper surface 128 of the heating element 120 .

[0082] According to the second embodiment of the present invention, a heat transfer material 150 (ie, thermal paste) is applied to the first region portion 131 a and the second region portion 131 b .

[0083] Therefore, by Figure 6 It can be seen that the thickness H2 of the second region portion 131 b can be formed to be thicker than the thickness H1 of the heat transfer material 150 in the first region portion 131 a .

[0084] According to the second embodiment of the present invention, in the case of the first region portion 131 a , heat generated from the heating element 120 is transferred to the heat sink 140 side through the upper surface 124 of the heating element 120 .

[0085] In addition, a portion of the heat generated from the heating element 120 is transferred to the heat sink 140 through the heat dissipation pad 131 and the heat transfer material 150 (ie, thermal paste) on the upper portion of the second region 131 b .

[0086] Furthermore, in the second embodiment of the present invention, the source pad 136 includes a third region 136a in contact with the source electrode 126 and a fourth region 136b not in contact with the source electrode 126. In this case, the third region 136a and the fourth region 136b are formed to be conductive. Furthermore, the fourth region 136b can be formed to be larger than the third region 136a. As a result, heat generated by the source electrode 126 can be transferred from the third region 136a to the fourth region 136b and dissipated from the fourth region 136b into the air.

[0087] Therefore, the amount of heat transfer in the second embodiment may be increased compared to the first embodiment in which the heat generated from the heat generating component 20 is transferred to the heat sink 40 side only through the upper surface of the heat generating component 20 .

[0088] Figure 7 is a perspective view of a heat dissipation structure according to a third embodiment of the present invention. Figure 8 FIG. 1 is a plan view showing a region where a heat dissipation pad in contact with a heating element is formed on a PCB substrate of a heat dissipation structure according to a third embodiment of the present invention. Figure 9 The heat dissipation structure of the third embodiment of the present invention is shown in FIG. Figure 7 A cross-sectional view of the structure.

[0089] Compared with the second embodiment, in a structure in which the area of ​​the heat dissipation pad 231 is formed to be larger than the area of ​​the heating element 220, the heat dissipation structure 200 of the third embodiment of the present invention is the same as that of the second embodiment, but the position of the heating element 220 is configured to be different from the heat dissipation structure of the second embodiment.

[0090] In the third embodiment of the present invention, the FET serving as the heating element 220 has a gate 224, three sources 226, and a drain 222. Furthermore, a gate pad 234, a source pad 236, and a drain pad 232 are formed on a PCB substrate 230 and are connected to the gate 224, the source 226, and the drain 222, respectively.

[0091] At this time, Figure 8 In the figure, the first region portion 231a on the heat dissipation pad is the region where the drain 222 of the FET contacts, reference numeral 236 is the source pad region where the source 226 contacts, and reference numeral 234 is the gate pad region where the gate 224 contacts.

[0092] In the third embodiment of the present invention, the heating element 220 is formed to be biased toward one side of the width direction of the heat dissipation pad 231 (for example, at Figure 7 to the right when viewing from the center).

[0093] Therefore, in Figure 8 In the embodiment, the first region 231a is located on the right side of the heat dissipation pad 231, and the second region 231b is located on the left side of the first region 231a. Figure 7 and Figure 9 As shown, the second region portion 231 b is disposed on the left side of the heating element 220 .

[0094] On the other hand, according to the third embodiment of the present invention, the end surface 244 of the heat sink 240 located above the second region 231b of the heat dissipation pad 231 faces the heat dissipation pad 231 (i.e., Figure 9 When viewed from the center, it protrudes in the downward direction) to form a protrusion 242.

[0095] At this time, the height of the heat sink 240 protruding toward the heat dissipation pad 231 may be formed to correspond to the height of the heating element 220 .

[0096] As described above, the second region 231b of the bottom surface of the heat sink 240 that is not facing the heating element 220 is formed to protrude toward the heat dissipation pad 231, thereby narrowing the distance between the protruding portion 242 of the heat sink 240 and the heat dissipation pad 231. Therefore, the amount of heat transfer material 250 (i.e., thermal paste) applied between the protruding portion 242 of the heat sink 240 and the heat dissipation pad 231 can be reduced.

[0097] As in the second embodiment, when the thickness of the second regional portion 131b between the heat sink 140 and the heating element 120 is thicker than the thickness of the first regional portion 131a between the heat sink 140 and the heating element 120, the distance between the heat sink 140 and the heat dissipation pad 131 increases. Therefore, depending on the viscosity of the heat transfer material (i.e., thermal paste), there may be a situation where the space in the second regional portion between the heat sink 140 and the heat dissipation pad 131 is not filled with the heat transfer material (i.e., thermal paste).

[0098] As described above, in order to prevent the space between the heat sink 140 and the heat dissipation pad 131 from being unable to be filled with the thermal paste, the distance between the heat sink 140 and the heat dissipation pad 131 may need to be as short as possible.

[0099] In the third embodiment of the present invention, in order to keep the distance between the heat sink 240 and the heat dissipation pad 231 short, a protrusion 242 is formed on the heat sink 240 disposed at the second region portion 231 b to protrude toward the heat dissipation pad 231 .

[0100] Thus, the thickness of the heat transfer material (ie, thermal paste) applied to the first region portion 231 a and the second region portion 231 b may be formed to have substantially the same thickness.

[0101] At this time, the side surface 246 of the protrusion 242 is opposite to the side surface of the heating element 220 and is separated by a predetermined distance. At this time, the distance between the side surface of the protrusion 242 and the side surface of the heating element 220 can also be formed to be the same as or similar to the thickness of the heat transfer material (i.e., thermal paste) applied to the first region.

[0102] In the third embodiment of the present invention, the thickness of the thermal conductive paste applied to the first region 231 a and the thickness of the thermal conductive paste applied to the second region 231 b can be different or the same according to design.

[0103] At this time, if the thickness of the heat transfer material (ie, thermal paste) is formed to be uniform across the entire area, mass productivity is improved, and the possibility of poor contact between the heat dissipation pad 231 and the heat sink 240 is reduced.

[0104] Also, in the third embodiment, since the distance that heat moves through the heat transfer material (ie, thermal paste) is shortened, it is possible to prevent the heat through the thermal paste from being transferred to the heat generating element 220 side.

[0105] As in the second embodiment, if the distance that heat is transferred through the thermal paste in the second area portion 131b is longer than the distance that heat is transferred through the thermal paste in the first area portion 131a, then during the heat transfer in the second area portion 131b, a portion of the heat may be transferred to the side of the heating element 120 on the side of the second area portion 131b, resulting in a possible decrease in heat transfer efficiency.

[0106] On the other hand, according to the third embodiment of the present invention, similar to the first and second embodiments, the heat sink 240 may form a housing ( Figure 10 Part of 301).

[0107] At this time, the protrusion 242 formed on the bottom surface of the heat sink 240 can be designed in the housing ( Figure 10 301) is manufactured based on the consideration of the size and shape of the heating element 220.

[0108] On the other hand, in the third embodiment of the present invention, similar to the second embodiment, the source pad 236 includes a third region 236a in contact with the source electrode 226 and a fourth region 236b not in contact with the source electrode 226. In this case, the third region 236a and the fourth region 236b are formed to be conductive. Furthermore, the fourth region 236b can be formed to be larger than the third region 236a. As a result, heat generated by the source electrode 226 can be transferred from the third region 236a to the fourth region 236b and dissipated from the fourth region 236b into the air.

[0109] On the other hand, in this embodiment, a structure in which the protrusion 242 protrudes from one side of the bottom surface of the heat sink 240 is shown as an example, however, as another example, as in the second embodiment, when two second area portions are formed on both side portions of the heat dissipation pad, a plurality of protrusions 242 may be formed corresponding to the number of the second area portions.

[0110] In addition, in the third embodiment, although the cross-section of the protrusion 242 is shown as an example to be formed in a quadrilateral shape corresponding to the quadrilateral second region portion of the heat dissipation pad, the cross-sectional shape of the protrusion 242 may also be formed in a rectangular shape, a square shape, or various shapes not shown, such as having an "L" shaped cross-section or a "匚" shaped cross-section, according to the shape of the second region portion of the heat dissipation pad 231.

[0111] Figure 10 FIG. 4 is an external perspective view of a housing structure 300 for a braking system to which the heat dissipation structures of the first to third embodiments of the present invention are applied.

[0112] Refer to Figure 10 and, refer to Figures 1 to 9 The heat dissipation structures 10, 100, 200 of the embodiments of the present invention described can be provided in a housing structure 300 for a braking system. The structures of the heat dissipation structures 10, 100, 200 of the embodiments of the present invention have been described in detail in the above embodiments, and thus their descriptions will be omitted.

[0113] In an embodiment of the present invention, a plurality of FETs can be provided inside a housing structure 300 for a braking system as a plurality of heating elements.

[0114] At this time, as described in the first to third embodiments above, a radiator in contact with the plurality of FETs is provided to dissipate the heat of the plurality of FETs, and the radiator can be formed as a part of the housing in Figure 10 .

[0115] At this time, in Figure 10 , the radiators 40, 140, 240 described in the first to third embodiments can be disposed in a portion formed as a groove 302 on the surface of the housing 301.

[0116] At this time, the thickness of the radiators 40, 140, 240 can be formed to a specified thickness so as to dissipate the heat generated from the heating elements, and the design of the housing can be carried out based on considering the position and thickness of the radiators.

[0117] As in the exemplary housing structure 300 for a braking system of the present invention, when the overall design of the housing 301 is carried out based on considering the thickness of the radiators 40, 140, 240, if the thickness of the radiator at the position where the FET is provided does not need to be thick, the housing 301 can be configured such that when viewed from the outside, the radiator is disposed at the position where the groove 302 is formed. The size and thickness of the groove 302 can be designed based on considering the position and heat generation degree of the radiator.

[0118] In addition, the position and shape of the heat sink formed on the housing 301 can be designed differently according to the position, size, shape and heat generation degree of the heating element that the heat sink contacts.

[0119] As described above, the heat dissipation structure of each embodiment of the present invention can be used as a heating element, and in particular, can be used as a heat dissipation structure of a FET element mounted on a circuit substrate provided for a braking system. It has a simple structure and mass production performance while effectively improving heat dissipation efficiency.

[0120] While the above description uses an FET mounted on a circuit substrate for a brake system as an example of a heat-generating element, any structure configured such that a heat sink directly contacts a heat-generating element via a heat transfer material (i.e., thermal paste) can be applied to the heat dissipation structures exemplified in the various embodiments of the present invention. According to this configuration, the heat dissipation structure of one embodiment of the present invention achieves heat dissipation by directly contacting the heat sink with the heat sink, thereby improving heat dissipation efficiency.

[0121] In addition, since heat is not transferred to the heat sink side through the PCB, heat dissipation efficiency can be improved.

[0122] The heat dissipation structure of the embodiment of the present invention can improve heat dissipation efficiency by configuring the area of ​​the heat dissipation pad of the PCB substrate to be larger than the area in contact with the heating element, and can dissipate heat from the heat dissipation pad to the radiator side.

[0123] Furthermore, in the heat dissipation structure of the embodiment of the present invention, the radiator constitutes a part of the housing for the brake system, so that the housing functions as a radiator, thereby improving heat dissipation efficiency.

[0124] It should be understood that the effects of the present invention are not limited to the above-described effects, and include all effects that can be inferred from the configuration of the present invention described in the detailed description of the present invention or the claims.

[0125] Although the embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments set forth in the specification. Those skilled in the art should understand the spirit of the present invention and will be able to easily propose other embodiments within the same spirit by adding, changing, deleting or adding components, but this will also be included in the spirit of the present invention.

Claims

1. A heat dissipation structure, characterized in that: include: The printed circuit board has a first heat dissipation pad with a predetermined area provided on one surface thereof. A heating element is combined on the first heat dissipation pad, and has a surface in contact with the first heat dissipation pad and another surface opposite to the surface of the heating element. a heat sink having a surface opposite to the other surface of the heating element, and The heat transfer material includes a first region portion located between the other surface of the heating element and the one surface of the heat sink.

2. The heat dissipation structure according to claim 1, characterized in that: The area of ​​the first heat dissipation pad corresponds to the area of ​​the surface of the heating element.

3. The heat dissipation structure according to claim 1, characterized in that: An area of ​​one surface of the heat sink corresponds to an area of ​​another surface of the heating element.

4. The heat dissipation structure according to claim 1, characterized in that: The heat sink forms a part of a housing surrounding the printed circuit board and the heating element to protect the printed circuit board and the heating element of the heat dissipation structure.

5. The heat dissipation structure according to claim 1, characterized in that: The area of ​​the first heat dissipation pad is larger than the area of ​​a surface of the heating element.

6. The heat dissipation structure according to claim 5, characterized in that: The first heat dissipation pad is a first electrode pad, A surface of the heating element in contact with the first electrode pad is a portion of the first electrode of the heating element in contact with the first electrode pad.

7. The heat dissipation structure according to claim 6, characterized in that: The area of ​​a surface of the radiator corresponds to the area of ​​the first heat dissipation pad. The heat transfer material includes a second area portion, which is located on a side of the first area portion and between a portion of the first heat dissipation pad that is not in contact with the heating element and a portion of the heat sink that faces a portion of the first heat dissipation pad that is not in contact with the heating element.

8. The heat dissipation structure according to claim 7, characterized in that: The first heat dissipation pad is formed to have a wider width on both sides of the heating element in the width direction. The second region portion of the heat transfer material is formed on both sides of the first region portion in the width direction.

9. The heat dissipation structure according to claim 7, characterized in that: The first heat dissipation pad is formed to have a wider width on one side in the width direction of the heating element. The second region of the heat transfer material is formed on one side in the width direction of the first region.

10. The heat dissipation structure according to claim 6, characterized in that: The heating element has a second electrode, A second heat dissipation pad having a predetermined area and in contact with the second electrode is provided on the printed circuit board. The area of ​​the second heat dissipation pad is larger than the area of ​​the second electrode.

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