Efficient vapor chamber with built-in water cooler and manufacturing method of efficient vapor chamber

Abstract

The invention provides a built-in water-cooling efficient temperature equalizing plate and a manufacturing method thereof, and relates to the technical field of temperature equalizing plates, the temperature equalizing plate comprises a temperature equalizing plate lower cover and a temperature equalizing plate upper cover, the inner wall of the temperature equalizing plate lower cover is fixedly connected with a plurality of heat conduction fins, and an inner cavity of the temperature equalizing plate lower cover is provided with a cold plate upper cover; a capillary structure is arranged at the end, away from the vapor chamber lower cover, of the cold plate upper cover, two first connecting holes are formed in the cold plate upper cover, water cooling channels are arranged in inner cavities of the first connecting holes, the capillary structure comprises a copper net covering the cold plate upper cover, a plurality of first embedding holes are formed in the copper net, and a mounting groove is formed in the middle of the copper net. A second embedding hole is formed in an inner cavity of the mounting groove, the water cooling channel and a capillary structure and a working medium in the sealing cavity act synergistically, a dual heat dissipation mechanism of phase change heat transfer and forced convection is formed, the heat exchange area between the water cooling channel and the interior of the vapor chamber is increased through the heat conduction fins, the heat transfer efficiency is improved, and the surface temperature distribution of the vapor chamber is more uniform.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature averaging plates, and in particular to a high-efficiency temperature averaging plate with built-in water cooling and a manufacturing method thereof. Background Art

[0002] As a common heat dissipation component, the heat spreader is widely used in electronic equipment, new energy batteries and other fields. At present, the traditional heat spreader mainly relies on the phase change heat transfer of the internal working fluid to achieve rapid heat transfer and uniform distribution. During operation, heat is transferred from the heat source to the evaporation section of the heat spreader, the liquid working fluid evaporates due to heat, and the vapor diffuses inside the heat spreader to the condensation section. It re-liquefies after being cooled, and the liquefied working fluid flows back to the evaporation section through the capillary structure, thus completing the heat transfer cycle. The efficient heat dissipation performance enables the equipment to operate at a lower temperature, reduces the energy consumption of the equipment due to high temperature, and at the same time, extends the service life of the equipment. With the continuous improvement of the integration of electronic equipment and the continuous increase in power density, traditional heat spreaders have gradually exposed some problems in practical applications.

[0003] Deficiencies in existing technologies: The heat dissipation efficiency of traditional vapor chambers is difficult to meet the needs of high heat flux density scenarios. When the heat generated by the heat source is too high, the phase change heat transfer capacity of the working fluid inside the vapor chamber is limited, resulting in an increase in the surface temperature of the vapor chamber and inability to achieve efficient heat dissipation. At the same time, the temperature uniformity of the vapor chamber needs to be improved. In some complex heat dissipation scenarios, the heat distribution is uneven, and local hot spots are prone to occur, affecting the performance and life of the equipment. Traditional vapor chambers are difficult to dissipate heat quickly and effectively, causing the temperature of the equipment to be too high during operation, resulting in frequency reduction, and reducing the computing efficiency of the server. Summary of the Invention

[0004] The problem to be solved by the present invention is that the heat dissipation efficiency of traditional temperature vapor chambers is difficult to meet the needs of high heat flux density scenarios. At the same time, in some complex heat dissipation scenarios, the heat distribution is uneven and local hot spots are prone to occur. Traditional temperature vapor chambers are difficult to dissipate heat quickly and effectively, causing the temperature of the equipment to be too high during operation and frequency reduction.

[0005] In order to solve the above technical problems, the present invention provides a high-efficiency temperature homogenizing plate with built-in water cooling, comprising a temperature homogenizing plate lower cover and a temperature homogenizing plate upper cover fixedly connected to one end thereof, the inner cavity of the temperature homogenizing plate lower cover is provided with a cold plate upper cover, the end of the cold plate upper cover away from the temperature homogenizing plate lower cover is provided with a capillary structure, a water cooling channel is provided between the cold plate upper cover and the temperature homogenizing plate lower cover, and two first connection holes are provided on the cold plate upper cover;

[0006] The edges of the lower cover of the temperature homogenizing plate and the upper cover of the temperature homogenizing plate are connected by welding, the inner cavity between the lower cover of the temperature homogenizing plate and the upper cover of the temperature homogenizing plate forms a sealed cavity, and the capillary structure is located in the inner cavity of the sealed cavity.

[0007] Preferably, a plurality of heat conducting ribs are fixedly connected to the inner wall of the lower cover of the temperature homogenizing plate. The heat conducting ribs are perpendicular to the upper cover of the temperature homogenizing plate. One end of the heat conducting rib away from the lower cover of the temperature homogenizing plate abuts against the upper cover of the cold plate.

[0008] Preferably, a contact protrusion is provided at one end of the lower cover of the temperature homogenizing plate, an inner cavity of the contact protrusion is provided as a stepped groove, and the water cooling channel is provided in a U-shaped configuration.

[0009] Preferably, the capillary structure includes a copper mesh covering the cold plate cover, a plurality of first embedded holes are provided on the copper mesh, a mounting groove is provided in the middle of the copper mesh, a second embedded hole is provided in the inner cavity of the mounting groove, a copper column is inserted in the inner cavity of the first embedded hole, and a powder ring is inserted in the inner cavity of the second embedded hole.

[0010] Preferably, a water inlet and a water outlet are respectively provided at both ends of the water cooling channel, the water cooling channel is connected to the output end of the external water cooling system through the water inlet, and the water cooling channel is connected to the input end of the external water cooling system through the water outlet.

[0011] Preferably, two mounting holes are provided on the upper cover of the temperature equalizing plate, and a water inlet nozzle and a water outlet nozzle are respectively inserted into the inner cavities of the two mounting holes.

[0012] Preferably, two second connection holes are provided on the copper mesh, and the positions of the second connection holes correspond to and are connected with the mounting holes.

[0013] Preferably, one end of the water inlet and the water outlet respectively passes through two second connecting holes and are respectively connected to the water outlet of the water inlet, and sealing rings are provided at the connections between the water inlet and the water outlet and the water inlet and the water outlet.

[0014] The present invention also provides a method for manufacturing a high-efficiency temperature homogenizing plate with built-in water cooling, comprising the following steps:

[0015] Step 1: Prepare the copper mesh. Select copper material of appropriate specifications and use precision cutting equipment to cut the copper material into the required shape of the copper mesh, ensuring that the dimensional accuracy of the copper mesh is within the range of ±0.05mm. Place the cut copper mesh in a profiling fixture and place it in a high-temperature sintering furnace for sintering. The sintering temperature is controlled at 850-950℃ and the holding time is 2.5-3.5 hours. The sintering process is used to form it into a specific shape. The sintering process forms a capillary structure with a specific pore structure and shape on the copper mesh.

[0016] Step 2: Assemble the cold plate upper cover and the copper mesh. Prepare the cold plate upper cover by cleaning and pre-treating its surface to remove impurities such as oil and oxide layers. The water cooling channel is formed through the cold plate upper cover and the vapor chamber lower cover. The thermal conductive fins are perpendicular to the surface of the vapor chamber lower cover and evenly distributed on the inner wall of the water cooling channel. Carefully cover the sintered copper mesh on the cold plate upper cover, ensuring that the copper mesh and the cold plate upper cover are completely in contact with each other without gaps or wrinkles.

[0017] Step 3: Select a plate to make the upper cover of the temperature equalizer plate, perform fine processing on its interior, then place the entire cold plate upper cover covered with copper mesh into the upper cover of the temperature equalizer plate, and simultaneously open a first embedding hole and a second embedding hole on the copper mesh. Place the copper pillars one by one into the first embedding hole cavity at the predetermined position in the upper cover of the temperature equalizer plate, with the height error of the copper pillars controlled within ±0.03mm. Subsequently, place the powder ring into the second embedding hole cavity. The material of the powder ring is selected to have good welding compatibility with the material of the temperature equalizer plate upper cover, and the thickness uniformity is controlled within ±0.02mm. The powder ring is made of sintered metal powder.

[0018] Step 4: Select a water inlet and outlet with good corrosion resistance and sealing performance, and install the water inlet and outlet in the two mounting holes of the upper cover of the temperature equalizer, so that the water inlet and outlet are connected to the water inlet and outlet respectively. The structure of the water cooling channel is composed of the lower cover of the temperature equalizer and the upper cover of the cold plate. The interior is interconnected through the water inlet and outlet to form a continuous channel. After the water inlet and outlet are installed, assemble the upper cover of the temperature equalizer and the lower cover of the temperature equalizer, and seal the edges of the upper cover of the temperature equalizer and the lower cover of the temperature equalizer through welding to form a complete and sealed cavity structure.

[0019] Technical effects and advantages of the present invention:

[0020] 1. The present invention forms a dual heat dissipation mechanism of "phase change heat transfer + forced convection" by providing a water-cooling channel and a capillary structure and working fluid in a sealed cavity, thereby greatly improving the heat transfer speed. The working fluid is filled in the sealed cavity and the capillary structure. The water-cooling channel structure is composed of a lower cover of a temperature vapor chamber and an upper cover of a cold plate, which are interconnected to form a continuous U-shaped channel. A water inlet and a water outlet are respectively provided at both ends of the channel. External cooling water continuously flows into the water-cooling channel from the water inlet through the water inlet nozzle. During the flow in the channel, it absorbs the heat transferred from the lower cover of the temperature vapor chamber and the copper mesh on the outer surface of the cold plate, and then flows out from the water outlet nozzle through the water outlet, taking away a large amount of heat, thereby accelerating the heat dissipation speed of the temperature vapor chamber.

[0021] 2. The present invention provides heat-conducting fins between the water-cooling channel and the sealed cavity. The fins are perpendicular to the lower cover of the temperature vapor chamber and the upper cover of the cold plate and are evenly distributed on the inner wall of the water-cooling channel. The heat-conducting fins increase the heat exchange area between the water-cooling channel and the inside of the temperature vapor chamber, so that the water-cooling channel can more effectively remove heat from various parts of the temperature vapor chamber, effectively reducing the generation of local hot spots, further improving the heat transfer efficiency, and making the temperature distribution on the surface of the temperature vapor chamber more uniform.

[0022] 3. The present invention fixes the position of the copper pillar by providing a first embedded hole. The copper pillar supports the upper cover and the lower cover of the temperature equalizing plate, ensures the spatial stability of the internal cavity of the temperature equalizing plate, and prevents the cover from deforming under pressure, which affects the phase change heat transfer of the internal working fluid and the heat dissipation effect of the water-cooling channel. At the same time, the porous structure of the powder ring generates a strong capillary effect, which accelerates the return of the working fluid from the condensation end to the heat source area. The evaporation rate at the heat source is high, and liquid needs to be replenished quickly to avoid dry burning. The powder ring maintains liquid circulation through capillary force. The microporous structure of the powder ring increases the evaporation surface area, so that the working liquid absorbs heat and evaporates more efficiently at the heat source, thereby enhancing the heat transfer performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0024] Figure 2 It is a schematic diagram of the overall explosion structure of the present invention.

[0025] Figure 3 It is a schematic diagram of the back structure of the present invention.

[0026] Figure 4 Schematic diagram of the capillary structure of the present invention.

[0027] Figure 5 The overall cross-sectional structure of the present invention is shown in FIG. Figure 1 .

[0028] Figure 6 The overall cross-sectional structure of the present invention is shown in FIG. Figure 2 .

[0029] Figure 7 For the present invention Figure 5 A magnified schematic diagram of the structure in the middle.

[0030] The figures are marked as follows: 1. lower cover of the temperature equalizing plate; 2. upper cover of the temperature equalizing plate; 3. upper cover of the cold plate; 4. capillary structure; 41. copper mesh; 42. first embedded hole; 43. mounting groove; 44. second embedded hole; 45. copper column; 46. powder ring; 47. second connecting hole; 5. water-cooling channel; 6. first connecting hole; 7. thermal conductive rib; 8. contact protrusion; 9. water inlet; 10. water outlet; 11. mounting hole; 12. water inlet nozzle; 13. water outlet nozzle; 14. sealing ring. DETAILED DESCRIPTION

[0031] The present invention provides a high-efficiency temperature averaging plate with built-in water cooling, such as Figure 1 - Figure 7 As shown, it includes a temperature equalizing plate lower cover 1 and a temperature equalizing plate upper cover 2 fixedly connected to one end thereof, the inner cavity of the temperature equalizing plate lower cover 1 is provided with a cold plate upper cover 3, and a capillary structure 4 is provided at one end of the cold plate upper cover 3 away from the temperature equalizing plate lower cover 1, a water cooling channel 5 is provided between the cold plate upper cover 3 and the temperature equalizing plate lower cover 1, and two first connecting holes 6 are provided on the cold plate upper cover 3.

[0032] Further, such as Figure 1 and Figure 2 As shown, the edges of the temperature equalizing plate lower cover 1 and the temperature equalizing plate upper cover 2 are connected by welding, the inner cavity between the temperature equalizing plate lower cover 1 and the temperature equalizing plate upper cover 2 forms a sealed cavity, the capillary structure 4 is located in the inner cavity of the sealed cavity, and the edges of the temperature equalizing plate lower cover 1 and the temperature equalizing plate upper cover 2 are sealed and connected by a welding process to ensure the sealing of the sealed cavity. The working fluid is filled in the sealed cavity, and heat dissipation is achieved by phase change heat transfer of the filled working fluid, and the working fluid is water or coolant.

[0033] Further, such as Figure 2 and Figure 5 As shown, a number of heat-conducting ribs 7 are fixedly connected to the inner wall of the lower cover 1 of the temperature equalizing plate. The heat-conducting ribs 7 are perpendicular to the lower cover 1 of the temperature equalizing plate. The end of the heat-conducting rib 7 away from the lower cover 1 of the temperature equalizing plate abuts against the upper cover 3 of the cold plate. The heat-conducting ribs 7 effectively enhance the heat transfer between the water-cooling channel 5 and the temperature equalizing plate body. The setting of the heat-conducting ribs 7 increases the heat exchange area, so that the water-cooling channel 5 can more effectively take away the heat from various parts of the temperature equalizing plate, effectively reducing the generation of local hot spots, and improving the surface temperature uniformity of the temperature equalizing plate by 25% to 35%, thereby ensuring the stable operation of the equipment.

[0034] Further, such as Figure 3 、 Figure 4 and Figure 6 As shown, a contact protrusion 8 is provided at one end of the lower cover 1 of the temperature equalizing plate, and the inner cavity of the contact protrusion 8 is provided as a stepped groove. The water cooling channel 5 is provided in a U-shape. The temperature equalizing plate contacts the components that need heat dissipation through the contact protrusion 8, and the stepped groove formed inside effectively improves the heat dissipation effect.

[0035] Further, such as Figure 4 、 Figure 5 and Figure 6As shown, the capillary structure 4 includes a copper mesh 41 covering the cold plate cover 3, a plurality of first embedded holes 42 are opened on the copper mesh 41, a mounting groove 43 is opened in the middle of the copper mesh 41, a second embedded hole 44 is opened in the inner cavity of the mounting groove 43, a copper column 45 is inserted into the inner cavity of the first embedded hole 42, and a powder ring 46 is inserted into the inner cavity of the second embedded hole 44. The positions of the copper column 45 and the powder ring 46 are fixed by the first embedded hole 42 and the second embedded hole 44 respectively, ensuring the accuracy and stability of the installation position of the copper column 45 and the powder ring 46. 45 ensures stable support for the lower cover 1 and the upper cover 2 of the temperature equalizer, ensures the spatial stability of the internal cavity of the temperature equalizer, and prevents the lower cover 1 and the upper cover 2 of the temperature equalizer from being deformed under pressure, which affects the phase change heat transfer of the internal working fluid and the heat dissipation effect of the water-cooling channel 5. The powder ring 46 is composed of sintered metal powder such as copper powder. Its porous structure can produce a strong capillary effect, accelerating the return of the working fluid from the condensation end to the heat source area. The microporous structure of the powder ring 46 increases the evaporation surface area, allowing the working liquid to absorb heat and evaporate more efficiently at the heat source, thereby enhancing the heat transfer performance.

[0036] Further, such as Figure 5 and Figure 7 As shown, a water inlet 9 and a water outlet 10 are respectively provided at both ends of the water-cooling channel 5. The water-cooling channel 5 is connected to the output end of the external water cooling system through the water inlet 9, and the water-cooling channel 5 is connected to the input end of the external water cooling system through the water outlet 10. The structure of the water-cooling channel 5 is composed of a lower cover 1 of the temperature homogenizing plate and an upper cover 3 of the cold plate. The interior is interconnected through the water inlet 9 and the water outlet 10 to form a continuous U-shaped channel, ensuring that the working medium circulates inside the temperature homogenizing plate.

[0037] Further, such as Figure 1 and Figure 2 As shown, two mounting holes 11 are provided on the upper cover 2 of the temperature equalizing plate, and the inner cavities of the two mounting holes 11 are respectively inserted with a water inlet nozzle 12 and a water outlet nozzle 13. The positions of the water inlet nozzle 12 and the water outlet nozzle 13 are installed and fixed through the mounting holes 11, and the water-cooling channel 5 is connected to the external water-cooling circulation system through the water inlet nozzle 12. The cooling water in the inner cavity of the water-cooling channel 5 is circulated and discharged through the water outlet nozzle 13 to form a circulating flow system.

[0038] Further, such as Figure 4 and Figure 7 As shown, two second connection holes 47 are provided on the copper mesh 41 . The second connection holes 47 correspond to and are connected to the mounting holes 11 . The second connection holes 47 ensure the stability and firmness of the connection between the water inlet 12 and the water outlet 13 .

[0039] Further, such as Figure 4 and Figure 7As shown, one end of the water inlet nozzle 12 and the water outlet nozzle 13 respectively pass through the two second connecting holes 47, and are respectively connected to the water outlet 10 of the water inlet 9. A sealing ring 14 is provided at the connection between the water inlet nozzle 12 and the water outlet nozzle 13 and the water inlet 9 and the water outlet 10. The sealing ring 14 ensures the tightness of the connection between the water inlet nozzle 12 and the water outlet nozzle 13 and ensures the sealing of the inner cavity of the temperature equalizing plate.

[0040] The present invention also provides a method for manufacturing a high-efficiency temperature homogenizing plate with built-in water cooling, comprising the following steps:

[0041] Step 1: First, prepare the copper mesh 41. Select copper material of appropriate specifications and use precision cutting equipment to cut the copper material into the required shape of the copper mesh 41. Ensure that the dimensional accuracy of the copper mesh 41 is within the range of ±0.05mm. Place the cut copper mesh 41 in a profiling fixture and put it into a high-temperature sintering furnace for sintering. The sintering temperature is controlled at 850-950℃ and the holding time is 2.5-3.5 hours. The copper mesh 41 is formed into a specific shape through the sintering process. The copper mesh 41 is formed into a capillary structure 4 with a specific pore structure and shape through sintering. The copper mesh 41 will subsequently serve as a key part of the capillary structure 4 and assume the important function of liquid working medium reflux. Its porosity reaches 45%-55%, so that it can effectively promote the reflux of liquid working medium in the subsequent temperature uniformity plate.

[0042] Step 2: Next, assemble the cold plate upper cover 3 and the copper mesh 41, prepare the cold plate upper cover 3, clean and pre-treat its surface, remove impurities such as oil and oxide layer, improve its surface flatness and fit with the copper mesh 41, the cold plate upper cover 3 is an important component for the temperature homogenizer to contact the external water cooling system, and corresponds to the water cooling channel 5. The water cooling channel 5 is composed of the cold plate upper cover 3 and the temperature homogenizer lower cover 1. The heat conducting fins 7 are perpendicular to the surface of the temperature homogenizer lower cover 1 and are evenly distributed on the inner wall of the water cooling channel 5. They are evenly distributed on the inner wall of the water cooling channel 5 to increase the heat exchange area. The temperature homogenizer upper cover 2 is the top shell of the entire temperature homogenizer, which plays a role in protecting the internal structure and defining the space of the water cooling channel 5. The sintered copper mesh 41 is carefully covered on the cold plate upper cover 3 to ensure that the copper mesh 41 is completely fitted with the cold plate upper cover 3 without gaps and wrinkles, creating good conditions for subsequent heat transfer and working medium reflux;

[0043] Step 3: Select a plate to make the upper cover 2 of the temperature equalizing plate, perform fine processing on the inside to ensure the dimensional accuracy of the internal space, then put the cold plate upper cover 3 covered with the copper mesh 41 into the upper cover 2 of the temperature equalizing plate as a whole to make it accurately positioned, and at the same time, open a first embedded hole 42 and a second embedded hole 44 on the copper mesh 41, and put the copper pillars 45 one by one into the inner cavity of the first embedded hole 42 at the predetermined position, and control the height error of the copper pillars 45 within ±0.03mm to ensure stable support for the lower cover 1 and the upper cover 2 of the temperature equalizing plate, ensure the spatial stability of the internal cavity of the temperature equalizing plate, avoid deformation of the cover under pressure, and affect the phase change heat transfer of the internal working medium and the heat dissipation effect of the water-cooling channel 5. Subsequently, place the powder ring 46 in the inner cavity of the second embedded hole 44. The material of the powder ring 46 is A powder material with good welding compatibility with the material of the upper cover 2 of the heat spreader is selected, and its thickness uniformity is controlled within ±0.02mm. The powder ring 46 plays an important role in the operation of the heat spreader. The powder ring 46 is composed of sintered metal powder (such as copper powder). Its porous structure can produce a strong capillary effect, accelerating the return of the working fluid from the condensation end to the heat source area. The evaporation rate at the heat source is high, and the liquid needs to be replenished quickly to avoid dry burning. The powder ring 46 maintains liquid circulation through capillary force. The microporous structure of the powder ring 46 increases the evaporation surface area, allowing the working liquid to absorb heat and evaporate more efficiently at the heat source, thereby enhancing the heat transfer performance. The positional relationship between the copper mesh 41, copper column 45 and powder ring 46 in the sealed cavity and the mutual cooperation of each component jointly realize the efficient heat dissipation function of the heat spreader;

[0044] Step 4: Finally, select the water inlet nozzle 12 and the water outlet nozzle 13 with good corrosion resistance and sealing, and install the water inlet nozzle 12 and the water outlet nozzle 13 at the corresponding positions of the two mounting holes 11 on the upper cover 2 of the temperature equalizer plate, and install the water inlet nozzle 12 and the water outlet nozzle 13 in place through the water inlet 9 and the water outlet 10. The water inlet nozzle 12 and the water outlet nozzle 13 are key components for connecting the water cooling channel 5 of the temperature equalizer plate with the external water cooling circulation system. After the installation of the water inlet nozzle 12 and the water outlet nozzle 13 is completed, assemble the lower cover 1 of the temperature equalizer plate and the upper cover 2 of the temperature equalizer plate, and seal the edges of the lower cover 1 of the temperature equalizer plate and the upper cover 2 of the temperature equalizer plate by welding. The heat conducting ribs 7 are connected to form a complete and sealed cavity structure to prevent leakage of the internal working fluid, ensuring that the phase change heat transfer process of the working fluid inside the temperature homogenizer and the heat dissipation process of the water-cooling channel 5 can be carried out stably and efficiently. Inside the temperature homogenizer, heat conducting ribs 7 are arranged between the water-cooling channel 5 and the sealed cavity. These heat conducting ribs 7 are perpendicular to the surface of the cover plate and are evenly distributed on the inner wall of the water-cooling channel 5. They greatly increase the heat exchange area between the water-cooling channel 5 and the inside of the temperature homogenizer, so that the cooling water in the water-cooling channel 5 can more efficiently absorb the heat transferred from the temperature homogenizer, further improving the heat dissipation efficiency and temperature uniformity of the temperature homogenizer.

[0045] The working principle of the present invention is as follows: when the temperature equalizing plate is working, heat is transferred from the heat source to the evaporation section of the temperature equalizing plate, the liquid working medium in the sealed cavity is evaporated by the heat, and the steam diffuses in the cavity to the condensation section (the copper mesh 41 on the outer surface of the upper cover 3 of the cold plate) and is liquefied when cooled, completing the phase change heat transfer process. At the same time, external cooling water continuously flows into the water cooling channel 5 from the water inlet 9 through the water inlet nozzle 12, enters the inner cavity of the sealed cavity through the water cooling channel 5 and circulates. During the flow in the channel, it absorbs the heat transferred from the lower cover 1 of the temperature equalizing plate and the copper mesh 41 on the outer surface of the upper cover 3 of the cold plate, and then flows out through the water outlet 10 through the water outlet nozzle 13, taking away a large amount of heat, thereby accelerating the heat dissipation speed of the temperature equalizing plate. The heat conducting ribs 7 increase the heat exchange area between the water cooling channel 5 and the inside of the temperature equalizing plate, further improving the heat transfer efficiency, and making the surface temperature distribution of the temperature equalizing plate more uniform.

[0046] It will be understood that the present invention is described by way of some embodiments, and it will be appreciated by those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are intended to be protected by the present invention.

Claims

1. A high-efficiency temperature averaging plate with built-in water cooling, comprising a temperature averaging plate lower cover (1) and a temperature averaging plate upper cover (2) fixedly connected to one end thereof, characterized in that: The inner cavity of the temperature equalizing plate lower cover (1) is provided with a cold plate upper cover (3), an end of the cold plate upper cover (3) away from the temperature equalizing plate lower cover (1) is provided with a capillary structure (4), a water cooling channel (5) is provided between the cold plate upper cover (3) and the temperature equalizing plate lower cover (1), and two first connection holes (6) are provided on the cold plate upper cover (3); The edges of the lower cover (1) and the upper cover (2) of the temperature equalizing plate are connected by welding, and the inner cavity between the lower cover (1) and the upper cover (2) of the temperature equalizing plate forms a sealed cavity, and the capillary structure (4) is located in the inner cavity of the sealed cavity.

2. The high-efficiency vapor chamber with built-in water cooling according to claim 1, characterized in that: A plurality of heat-conducting ribs (7) are fixedly connected to the inner wall of the lower cover (1) of the temperature-equalizing plate. The heat-conducting ribs (7) are perpendicular to the lower cover (1) of the temperature-equalizing plate. One end of the heat-conducting rib (7) away from the lower cover (1) of the temperature-equalizing plate abuts against the upper cover (3) of the cold plate.

3. The high-efficiency temperature vapor chamber with built-in water cooling according to claim 1, characterized in that: A contact protrusion (8) is provided at one end of the lower cover (1) of the temperature homogenizing plate, and the inner cavity of the contact protrusion (8) is provided as a stepped groove, and the water cooling channel (5) is provided in a U-shaped configuration.

4. The high-efficiency vapor chamber with built-in water cooling according to claim 1, characterized in that: The capillary structure (4) comprises a copper mesh (41) covering the upper cover (3) of the cold plate, a plurality of first embedding holes (42) being provided on the copper mesh (41), a mounting groove (43) being provided in the middle of the copper mesh (41), a second embedding hole (44) being provided in the inner cavity of the mounting groove (43), a copper column (45) being inserted into the inner cavity of the first embedding hole (42), and a powder ring (46) being inserted into the inner cavity of the second embedding hole (44).

5. The high-efficiency temperature vapor chamber with built-in water cooling according to claim 4, characterized in that: A water inlet (9) and a water outlet (10) are respectively provided at both ends of the water cooling channel (5); the water cooling channel (5) is connected to the output end of the external water cooling system through the water inlet (9); and the water cooling channel (5) is connected to the input end of the external water cooling system through the water outlet (10).

6. The high-efficiency temperature vapor chamber with built-in water cooling according to claim 5, characterized in that: Two mounting holes (11) are provided on the upper cover (2) of the temperature equalizing plate, and a water inlet nozzle (12) and a water outlet nozzle (13) are respectively inserted into the inner cavities of the two mounting holes (11).

7. The high-efficiency temperature vapor chamber with built-in water cooling according to claim 6, characterized in that: Two second connection holes (47) are provided on the copper mesh (41), and the second connection holes (47) correspond to and are in communication with the mounting holes (11).

8. The high-efficiency temperature vapor chamber with built-in water cooling according to claim 7, characterized in that: One end of the water inlet (12) and the water outlet (13) respectively passes through the two second connecting holes (47) and are respectively connected to the water inlet (9) and the water outlet (10). A sealing ring (14) is provided at the connection between the water inlet (12) and the water outlet (13) and the water inlet (9) and the water outlet (10).

9. A method for manufacturing a high-efficiency temperature equalizing plate with built-in water cooling, characterized in that: The following steps are involved: Step 1: preparing a copper mesh (41), selecting a copper material of suitable specifications, and using a precision cutting device to cut the copper material into the shape required by the copper mesh (41), ensuring that the dimensional accuracy of the copper mesh (41) is within the range of ±0.05mm, placing the cut copper mesh (41) in a profiling fixture, and placing it in a high-temperature sintering furnace for sintering, the sintering temperature is controlled at 850-950°C, the holding time is 2.5-3.5 hours, and forming it into a specific shape through the sintering process, and forming the copper mesh (41) into a capillary structure (4) with a specific pore structure and shape through sintering; Step 2: Assemble the upper cover (3) of the cold plate with the copper mesh (41), prepare the upper cover (3) of the cold plate, clean and pre-treat its surface, remove impurities such as oil and oxide layer, the water cooling channel (5) is formed by the upper cover (3) of the cold plate and the lower cover (1) of the temperature equalizing plate, the heat conducting fins (7) are perpendicular to the surface of the lower cover (1) of the temperature equalizing plate and are evenly distributed on the inner wall of the water cooling channel (5), and the sintered copper mesh (41) is carefully covered on the upper cover (3) of the cold plate to ensure that the copper mesh (41) and the upper cover (3) of the cold plate are completely fitted without gaps and wrinkles; Step 3: Select a plate to make the upper cover of the temperature equalizing plate (2), perform fine processing on the inside thereof, then place the cold plate upper cover (3) covered with the copper mesh (41) into the upper cover of the temperature equalizing plate (2), and at the same time, open a first embedding hole (42) and a second embedding hole (44) on the copper mesh (41), and place the copper pillars (45) one by one into the inner cavity of the first embedding hole (42) at a predetermined position in the upper cover of the temperature equalizing plate (2), and the height error of the copper pillars (45) is controlled within ±0.03mm. Subsequently, place the powder ring (46) into the inner cavity of the second embedding hole (44), and the material of the powder ring (46) is selected to be a powder material with good welding compatibility with the material of the upper cover of the temperature equalizing plate (2), and the thickness uniformity thereof is controlled within ±0.02mm. The powder ring (46) is composed of sintered metal powder (such as copper powder); Step 4: Select a water inlet (12) and a water outlet (13) with good corrosion resistance and sealing properties, and install the water inlet (12) and the water outlet (13) in the inner cavity of the two mounting holes (11) of the upper cover (2) of the temperature equalizing plate, so that the water inlet (12) and the water outlet (13) are connected to the water inlet (9) and the water outlet (10) respectively. The structure of the water cooling channel (5) is composed of the lower cover (1) of the temperature equalizing plate and the upper cover (3) of the cold plate, and the interior is connected to each other through the water inlet (9) and the water outlet (10) to form a continuous channel. After the water inlet (12) and the water outlet (13) are installed, the upper cover (2) of the temperature equalizing plate and the lower cover (1) of the temperature equalizing plate are assembled, and the edges of the upper cover (2) of the temperature equalizing plate and the lower cover (1) of the temperature equalizing plate are sealed and connected by welding to form a complete and sealed cavity structure.

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