Preparation method of photovoltaic module and photovoltaic module

Abstract

The invention provides a preparation method of a photovoltaic module and the photovoltaic module. The method comprises the following steps: printing ultraviolet curing glue on a first surface of a target battery piece; carrying out primary curing treatment on the first surface printed with the ultraviolet curing glue; printing conductive adhesive on the positive electrode grid line and / or the negative electrode grid line in the first surface after the primary curing treatment; welding strips are pasted on the positive electrode grid lines printed with the conductive adhesive and / or the negative electrode grid lines printed with the conductive adhesive, so that at least one target battery piece is connected through the welding strips; carrying out secondary curing treatment on the conductive adhesive to obtain a target battery string; and preparing a target photovoltaic module based on the target battery string. According to the embodiment of the invention, while the energy consumption loss caused by the thermocuring process is reduced, the process time is shortened, and the process efficiency of preparing the photovoltaic module is improved.

Description

Technical Field

[0001] The present invention relates to the field of new energy technology, and in particular to a method for preparing a photovoltaic module and a photovoltaic module. Background Art

[0002] Back-contact solar cells are a special type of solar cell whose electrodes are located on the back of the cell instead of the traditional front. This design avoids the metal grid electrode blocking the front of the solar cell, can maximize the use of incident light, reduce optical losses, and improve photoelectric conversion efficiency.

[0003] In the current method of preparing photovoltaic modules based on back-contact solar cells, insulating glue is first printed on the back of the solar cell and heat-cured through a thermal curing process. The temperature of the thermal curing process is 100°C to 250°C, and the duration of the thermal curing process is 20s to 60s. Then, solder paste is printed on the back of the solar cell, and the printed solder paste is thermally cured at 200°C to 260°C for 20s to 60s to obtain a shaped solder paste. Then, based on the shaped solder paste, the solder ribbon is welded to the cell at 150°C to 350°C to obtain the cell string corresponding to the photovoltaic module. Finally, a photovoltaic module is prepared based on the cell string.

[0004] However, the methods for preparing photovoltaic modules in related technologies all need to be carried out at high temperatures, and the process is complicated, with problems of high energy consumption and long time consumption. Summary of the Invention

[0005] The present invention provides a method for preparing a photovoltaic module and a photovoltaic module, so as to solve the problems of high energy consumption and long time consumption in the process of preparing the photovoltaic module in the related art.

[0006] In order to solve the above problems, the technical solution of the present invention is implemented as follows:

[0007] An embodiment of the present invention provides a method for preparing a photovoltaic module, the method comprising:

[0008] Printing UV-curable glue on the first surface of a target cell; the target cell is an interdigitated back-contact cell, the first surface includes positive and negative grid lines, and the UV-curable glue is used to separate the positive and negative grid lines;

[0009] Performing a primary curing treatment on the first surface printed with the UV curing glue; the duration of the primary curing treatment is 2s to 5s;

[0010] Printing a conductive adhesive at the positive electrode grid lines and / or the negative electrode grid lines on the first surface after the primary curing treatment;

[0011] Pasting a soldering tape on the positive electrode grid line printed with conductive glue and / or the negative electrode grid line printed with conductive glue, so as to connect at least one of the target solar cells through the soldering tape;

[0012] Performing a secondary curing treatment on the conductive adhesive to obtain a target battery string; the target battery string includes at least one target battery cell; the temperature of the secondary curing treatment is 120° C. to 150° C., and the duration of the secondary curing treatment is 20 seconds to 30 seconds;

[0013] Based on the target cell string, a target photovoltaic module is prepared.

[0014] Optionally, the UV curable glue comprises: a first resin, a photoinitiator, a light stabilizer, an antioxidant, an inhibitor, and a first filler;

[0015] In the UV-curable glue, the first resin accounts for 55wt.% to 80wt.%; the photoinitiator accounts for 3wt.% to 5wt.%; the light stabilizer accounts for 2wt.% to 5wt.%; the antioxidant accounts for 0.5wt.% to 2wt.%; the inhibitor accounts for 0.5wt.% to 3wt.%; and the first filler accounts for 10wt.% to 30wt.%;

[0016] The total weight of the first resin, the photoinitiator, the light stabilizer, the antioxidant, the inhibitor and the first filler in the UV-curable glue is 100 wt.%.

[0017] Optionally, the first resin is at least one of epoxy resin, acrylic resin, and silicone resin;

[0018] The photoinitiator is at least one of phenylacetone, hydroxycyclohexyl benzophenone, and diphenylethane;

[0019] The light stabilizer is at least one of a polyurethane light stabilizer, an acrylate light stabilizer, and a hindered amine light stabilizer;

[0020] The antioxidant is at least one of a halogen salt antioxidant, a phenolic antioxidant, and a selenium compound antioxidant;

[0021] The inhibitor is a vulcanizing agent;

[0022] The first filler includes a first sub-filler and a second sub-filler; the first sub-filler is at least one of diatomaceous earth, talc, cellulose powder, and polyacrylate; the second sub-filler is at least one of calcium carbonate, aluminum hydroxide, zinc oxide, polyethylene powder, glass beads, and rubber powder.

[0023] Optionally, the conductive adhesive comprises: a second resin, metal particles, additives, oxide particles, a dispersant and a nucleating agent;

[0024] In the conductive adhesive, the second resin accounts for 5wt.% to 15wt.%; the metal particles account for 70wt.% to 90wt.%; the additive accounts for 0.5wt.% to 5wt.%; the oxide particles account for 1wt.% to 3wt.%; the dispersant accounts for 3wt.% to 5wt.%; and the nucleating agent accounts for 0.1wt.% to 3wt.%.

[0025] The total weight of the second resin, the metal particles, the additives, the oxide particles, the dispersant, and the nucleating agent in the conductive adhesive is 100 wt.%.

[0026] Optionally, the second resin is at least one of epoxy resin, acrylic resin, silicone, polyurethane, and rubber;

[0027] The metal particles are at least one of copper particles, silver particles, gold particles, nickel particles, and silver-coated copper particles;

[0028] The additive is at least one of carbon nanotubes, graphene, conductive carbon fibers and conductive carbon black;

[0029] The oxide particles are at least one of zinc oxide particles, indium oxide particles, copper oxide particles, and aluminum oxide particles;

[0030] The dispersant is at least one of polyvinyl alcohol, hydroxyethyl cellulose, and carboxymethyl cellulose;

[0031] The nucleating agent is at least one of stearic acid, calcium hydroxide, aluminum silicate, organic peroxide, calcium silicate, and cerium dioxide.

[0032] Optionally, when the second resin is an epoxy resin, the nucleating agent is at least one of stearic acid, calcium hydroxide, and aluminum silicate;

[0033] In the case where the second resin is an acrylic resin, the nucleating agent is an organic peroxide;

[0034] In the case where the second resin is a silicone conductive adhesive, the nucleating agent is at least one of aluminum silicate and calcium silicate;

[0035] When the second resin is polyurethane conductive adhesive, the nucleating agent is cerium dioxide.

[0036] Optionally, performing a curing process on the first surface printed with the ultraviolet curing glue comprises:

[0037] The first surface printed with UV curing glue is irradiated with an ultraviolet lamp; the irradiation power is 1000mw / m 2 Up to 3500mw / m 2 .

[0038] Optionally, the first surface after the primary curing treatment includes a first cured product; the volume resistance of the first cured product is 1×10 15 Ω·cm to 1×10 18 Ω·cm; the first cured product is formed after the ultraviolet curing glue is cured once.

[0039] Optionally, preparing a target photovoltaic module based on the target cell string includes:

[0040] stacking the front plate, the first adhesive film, the target battery string, the second adhesive film and the back plate in sequence to obtain a laminate;

[0041] Performing a lamination process on the stacked part to obtain a laminated part; the temperature of the lamination process is 120° C. to 150° C.; the duration of the lamination process is 5 minutes to 20 minutes; and the pressure of the lamination process is -80 kPa to -20 kPa;

[0042] A target photovoltaic module is prepared based on the laminate.

[0043] An embodiment of the present invention further provides a photovoltaic module, which is prepared by the method for preparing a photovoltaic module as described in any one of the above items.

[0044] The method for preparing a photovoltaic module provided by an embodiment of the present invention first prints ultraviolet curing glue on the first surface of the target battery, and separates the positive and negative grid lines on the first surface by the ultraviolet curing glue to avoid the problem of positive and negative short circuit in the target battery cell; then, after a primary curing treatment of 2s to 5s is performed on the first surface printed with the ultraviolet curing glue, a conductive glue is printed on the positive and / or negative grid lines on the first surface after the primary curing treatment, and a soldering tape is attached to the positive and / or negative grid lines printed with the conductive glue to connect at least one through the soldering tape. target cell; and then, by performing a secondary curing treatment on the conductive adhesive, a target cell string including at least one target cell is obtained, and the temperature of the secondary curing treatment is 120°C to 150°C, and the duration is 20s to 30s. Compared with the method for preparing photovoltaic modules in the related art, the temperature of the curing treatment in the embodiment of the present invention is greatly reduced, and the duration of the curing treatment is also significantly shortened, so that the time required for the entire process of preparing photovoltaic modules can be shortened to about 40s. While reducing the energy loss caused by the thermal curing process, the process time is also shortened, thereby improving the process efficiency of preparing photovoltaic modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0046] Figure 1 A flowchart showing the steps of a method for preparing a photovoltaic module according to an embodiment of the present invention is shown;

[0047] Figure 2 A logic diagram of a target cell according to an embodiment of the present invention is shown;

[0048] Figure 3 A schematic structural diagram of a laminate according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0049] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0050] Reference Figure 1 , shows a flowchart of a method for preparing a photovoltaic module according to an embodiment of the present invention, the method comprising steps S101 to S105:

[0051] Step S101: printing ultraviolet curing glue on the first surface of the target cell.

[0052] Wherein, the target cell is an interdigitated back contact cell, the first surface includes a positive electrode grid line and a negative electrode grid line, and the ultraviolet curing glue is used to separate the positive electrode grid line and the negative electrode grid line.

[0053] It is understood that the UV-curable glue is an insulating glue that can separate the positive and negative grid lines on the first surface of the target cell, preventing the positive and negative grid lines from conducting during the soldering process in step S104, which could cause a short circuit between the positive and negative electrodes of the target cell. Furthermore, the insulating glue in the embodiments of the present invention is UV-curable glue, which can be cured by ultraviolet irradiation. The curing temperature is low and the curing time is short, which reduces the energy consumption of curing the UV-curable glue while also improving the curing efficiency.

[0054] In an embodiment of the present invention, the UV-curable glue can be printed on the first surface between the positive and negative electrode gridlines, or around the positive and negative electrode gridlines. Specifically, an insulating glue printing screen suitable for interdigitated back-contact batteries can be used to print the UV-curable glue onto the first surface, thereby separating the positive and negative electrodes. The printing screen thickness is 20 μm to 200 μm.

[0055] The target cell may have a width of 180 mm to 300 mm, a length of 180 mm to 300 mm, and a thickness of 100 μm to 500 μm.

[0056] The target cell can be any one of a P-type cell, an N-type cell and an HTJ (heterojunction) cell; the target cell can be a whole cell, a two-piece cell, a three-piece cell, a four-piece cell, etc.

[0057] Step S102: performing a curing process on the first surface printed with the ultraviolet curing glue.

[0058] The duration of one curing process is 2s to 5s. For example, the duration of one curing process can be in the range of 2s, 3s, 4s, 5s or any two of them.

[0059] In an embodiment of the present invention, the first surface printed with ultraviolet curing glue can be placed under sunlight and the ultraviolet curing glue can be cured once using sunlight, thereby curing the ultraviolet curing glue without the need for additional energy consumption, and the duration of one curing process is only 2s to 5s.

[0060] Step S103 : printing a conductive adhesive on the positive electrode grid lines and / or the negative electrode grid lines on the first surface after the primary curing treatment.

[0061] The conductive adhesive is used to connect the electrode grid lines (positive grid lines and / or negative grid lines) of the target battery cell and the welding strips.

[0062] In an embodiment of the present invention, the conductive glue is printed at a pad point on an electrode grid line. An electrode grid line may include multiple pad points, and a pad point is a connection point between the electrode grid line and pins of other circuit elements in a target cell.

[0063] Reference Figure 2 , shows a logic diagram of a target cell according to an embodiment of the present invention. The first surface of the target cell 10 includes a first cured material 11 and a conductive adhesive 12. The first cured material 11 is formed by curing the UV-curable adhesive after the first surface printed with the UV-curable adhesive is subjected to a primary curing treatment in step S102. The first cured material 11 is located around the electrode grid lines in the target cell 10.

[0064] Specifically, a silk screen or steel mesh may be used as a printing screen, and the conductive glue may be scraped and squeezed on the printing plate by a scraper so that the conductive glue is printed on the pad points on the positive electrode grid lines and / or the negative electrode grid lines.

[0065] Optionally, in one embodiment, a dispensing process may be used to fill the conductive glue into the glue tube, and air pressure is applied to the glue tube to cause the conductive glue to drip onto the pad points on the positive and / or negative grid lines.

[0066] Step S104 : pasting a soldering tape on the positive electrode grid lines printed with the conductive adhesive and / or the negative electrode grid lines printed with the conductive adhesive, so as to connect at least one of the target solar cells through the soldering tape.

[0067] Specifically, in step S103, after printing the conductive adhesive at the positive electrode grid lines and / or the negative electrode grid lines on the first surface after the primary curing treatment, a soldering tape can be attached to the positive electrode grid lines printed with the conductive adhesive, and a soldering tape can be attached to the negative electrode grid lines printed with the conductive adhesive. The soldering tape is connected to the electrode grid lines on the first surface using the conductive adhesive, and the same soldering tape can be connected to at least one target cell at the same time. It is understandable that when multiple target cells are connected by soldering tape, the polarity of the electrode grid lines connected by the same soldering tape is the same. For example, the first soldering tape is connected to the first target cell, the second target cell, and the third target cell at the same time. In addition, when the first soldering tape is connected to the positive electrode grid lines of the first target cell, the first soldering tape will also be attached to the positive electrode grid lines printed with the conductive adhesive in the second target cell and the third target cell.

[0068] like Figure 2 As shown, the first surface of the target cell 10 further includes a soldering ribbon 13. Each electrode grid line in the target cell 10 corresponds to a soldering ribbon 13. Based on the bonding effect of the conductive adhesive, the soldering ribbon 13 can connect the target cell 10 to other target cells. After the conductive adhesive is secondary cured in step S105, a target cell string is obtained.

[0069] In the embodiment of the present invention, the welding ribbon can be a cylindrical welding ribbon or a rectangular welding ribbon. In the case of a cylindrical welding ribbon, the diameter of the welding ribbon is 0.15mm to 0.4mm; in the case of a rectangular welding ribbon, the width of the welding ribbon is 0.2mm to 0.8mm, and the thickness of the welding ribbon is 0.15mm to 0.35mm. It is understood that the length of the welding ribbon can be determined according to the size and number of target solar cells to be connected by the welding ribbon, and this embodiment of the present invention does not limit this.

[0070] Step S105 : performing a secondary curing process on the conductive adhesive to obtain a target battery string.

[0071] In which, the target battery string includes at least one target battery cell; the temperature of the secondary curing treatment is 120°C to 150°C, for example, it can be one or any two of 120°C, 125°C, 130°C, 135°C, 140°C, 145°C, and 150°C; the duration of the secondary curing treatment is 20s to 30s, for example, it can be one or any two of 22s, 24s, 26s, 28s, and 30s.

[0072] In an embodiment of the present invention, the target battery string is composed of at least one target battery cell connected by a welding ribbon based on the bonding effect of a conductive adhesive.

[0073] The temperature of the secondary curing treatment of the conductive adhesive is 120°C to 150°C, and the duration is 20s to 30s. Compared with the related art of thermally curing the solder paste at 200°C to 260°C for 20s to 60s, the curing temperature and duration are both reduced.

[0074] Step S106: preparing a target photovoltaic module based on the target battery string.

[0075] Specifically, when the target cell string is obtained in step S105, the target photovoltaic module can be prepared based on the target cell string using an existing photovoltaic module preparation process, which is not specifically limited in the embodiment of the present invention.

[0076] For example, in step S106, a front plate, an adhesive film, and a back plate can be selected, and the front plate, adhesive film, target cell string, adhesive film, and back plate can be stacked and pressed in sequence to obtain a laminate; the laminate is then bonded to the back plate to obtain a bonded member, and the bonded member is rolled and statically pressed using a roller static pressing technique to obtain a target photovoltaic module. The front plate can be at least one of an ethylene-tetra-fluoro-ethylene (ETFE) plate, a polyvinylidene fluoride (PVDF) plate, a polyvinyl fluoride (PVF) plate, a polyethylene terephthalate (PET) plate, a propylene oxide (PO) plate, and a glass fiber prepreg plate.

[0077] The adhesive film can be any one of silicone, polyolefin elastomer (POE), ethylene vinyl acetate copolymer (EVA), polyvinyl butyral (PVB), expandable polyethylene (EPE), and epoxy resin (EP). The weight range of the adhesive film is 200g / m 2 Up to 600g / m 2 The color of the film can be transparent, white, black or other customized colors.

[0078] The back panel can be a double-sided cement-based polyurethane composite (Cement-based Polymer Composite, CPC) board, polycarbonate (PC) board, polyethylene terephthalate (PET) board, KPF board (fluorine film technology, structure is PVDF / PET / fluorine film), thermoplastic composite material (Thermo plastic Composites, TPC) board, PO board, glass fiber prepreg board, etc.; the thickness of the back panel is 100μm to 700μm; the color of the back panel can be white, black, transparent or other customized colors.

[0079] The backboard can be made of a metal material or a non-metal material with a certain strength and plasticity, and the surface of the backboard can be corrugated or flat.

[0080] The target photovoltaic module can be a lightweight photovoltaic module, with a length of 1m to 5m and a width of 0.2m to 3m. Furthermore, the target photovoltaic module can be a framed or frameless module. In the case of a framed module, the frame of the target photovoltaic module can be a metal frame or a polymer composite frame.

[0081] Related technology In the method of preparing photovoltaic modules based on back-contact solar cells, insulating glue is first printed on the back of the solar cell, and the insulating glue is heated and cured through a thermal curing process. The temperature of the thermal curing process is 100°C to 250°C, and the duration of the thermal curing process is 20s to 60s; then, solder paste is printed on the back of the solar cell, and the printed solder paste is thermally cured at 200°C to 260°C for 20s to 60s to obtain a shaped solder paste; then, based on the shaped solder paste, the soldering ribbon is welded to the cell at 150°C to 350°C to obtain the cell string corresponding to the photovoltaic module; finally, a photovoltaic module is prepared based on the cell string. In this process, the curing of the insulating glue, the curing of the solder paste, and the welding of the soldering ribbon to the cell all need to be carried out at high temperature and are time-consuming. The preparation method of the photovoltaic module provided by the embodiment of the present invention is as follows: first, ultraviolet curing glue is printed on the first surface of the target battery, and the positive and negative grid lines in the first surface are separated by the ultraviolet curing glue to avoid the problem of short circuit between the positive and negative electrodes in the target battery cell; then, the first surface printed with the ultraviolet curing glue is subjected to a primary curing treatment for 2s to 5s, and the primary curing treatment can be carried out at room temperature without the need for heating and curing; thereafter, conductive glue is printed at the positive and / or negative grid lines in the first surface after the primary curing treatment, and soldering strips are pasted at the positive and / or negative grid lines printed with the conductive glue to connect at least one target battery cell through the soldering strips; then, the conductive glue is subjected to a secondary curing treatment to obtain a target battery string including at least one target battery cell, and the temperature of the secondary curing treatment is 120°C to 150°C and the duration is 20s to 30s; after the secondary curing treatment, the soldering strips and the target battery cell can be welded without the need to perform welding operations at high temperatures after the conductive glue is cured. Compared with the method for preparing photovoltaic modules in the related art, the temperature of the curing treatment in the embodiment of the present invention is greatly reduced, so that the energy consumption of preparing photovoltaic modules is reduced by about 50% compared with the related art, and the duration of the curing treatment is also significantly shortened, so that the time required for the entire process of preparing photovoltaic modules can be shortened to about 40s. Compared with the related art, the process time is shortened by about 70%. While reducing the energy consumption loss caused by the thermal curing process, it also shortens the process time and improves the process efficiency of preparing photovoltaic modules.

[0082] Optionally, in one embodiment, the UV curable glue comprises: a first resin, a photoinitiator, a light stabilizer, an antioxidant, an inhibitor, and a first filler;

[0083] In the UV-curable glue, the first resin accounts for 55 wt.% to 80 wt.%; the photoinitiator accounts for 3 wt.% to 5 wt.%; the light stabilizer accounts for 2 wt.% to 5 wt.%; the antioxidant accounts for 0.5 wt.% to 2 wt.%; the inhibitor accounts for 0.5 wt.% to 3 wt.%; and the first filler accounts for 10 wt.% to 30 wt.%. The total of the first resin, the photoinitiator, the light stabilizer, the antioxidant, the inhibitor, and the first filler in the UV-curable glue is 100 wt.%.

[0084] For example, in the UV-curing glue, the first resin may account for 70 wt.%, the photoinitiator may account for 4 wt.%, the light stabilizer may account for 3.5 wt.%, the antioxidant may account for 1 wt.%, the inhibitor may account for 1.5 wt.%, and the first filler may account for 20 wt.%.

[0085] Specifically, in the UV-curing glue, the first resin serves as the main polymer monomer, providing the UV-curing glue with adhesive properties and adhesive strength; the photoinitiator is used to stimulate the polymerization reaction of the monomers in the UV-curing glue; the light stabilizer is used to absorb ultraviolet light in sunlight, reduce the damage of ultraviolet light to the UV-curing glue body, and extend the service life of the UV-curing glue; the antioxidant is used to reduce the problem of reduced curing rate caused by free radicals in the UV-curing glue, and improve the durability of the UV-curing glue; the inhibitor is used to control or delay the curing or hardening process of the UV-curing glue. If the working time required in step S101 is long, or the UV-curing glue is required to have a slower curing speed, the proportion of the inhibitor in the UV-curing glue can be appropriately increased; the first filler is used to adjust the viscosity and fluidity of the UV-curing glue, and to increase the wear resistance and mechanical strength of the first cured product corresponding to the UV-curing glue.

[0086] Optionally, in one embodiment, the first resin is at least one of epoxy resin, acrylic resin, and silicone resin; the photoinitiator is at least one of phenylacetone, hydroxycyclohexyl benzophenone, and diphenylethane; the light stabilizer is at least one of polyurethane light stabilizers, acrylate light stabilizers, and hindered amine light stabilizers; the antioxidant is at least one of halogen salt antioxidants, phenolic antioxidants, and selenium compound antioxidants; the inhibitor is a vulcanizing agent; the first filler includes a first sub-filler and a second sub-filler; the first sub-filler is at least one of diatomaceous earth, talc, cellulose powder, and polyacrylate; the second sub-filler is at least one of calcium carbonate, aluminum hydroxide, zinc oxide, polyethylene powder, glass beads, and rubber powder.

[0087] It should be noted that when the first resin includes at least two of an epoxy resin, an acrylic resin, and a silicone resin, the components of the first resin have the same proportion in the UV-curable adhesive, and the total proportion of each component in the UV-curable adhesive is 55wt.% to 80wt.%. When the photoinitiator includes at least two of a polyurethane light stabilizer, an acrylate light stabilizer, and a hindered amine light stabilizer, the components of the photoinitiator have the same proportion in the UV-curable adhesive, and the total proportion of each component in the UV-curable adhesive is 3wt.% to 5wt.%. When the light stabilizer includes at least two of a polyurethane light stabilizer, an acrylate light stabilizer, and a hindered amine light stabilizer, the components of the light stabilizer have the same proportion in the UV-curable adhesive, and the total proportion of each component in the UV-curable adhesive is 2wt.% to 5wt.%. When the antioxidant includes at least two of a halogenated antioxidant, a phenolic antioxidant, and a selenium compound antioxidant, the proportion of each component in the antioxidant in the UV-curable glue is the same, and the sum of the proportions of each component in the UV-curable glue is 0.5 wt.% to 2 wt.%.

[0088] Additionally, the vulcanizing agent may include diphenylamine dimercapto (DMTP) and ammonium pyrosulfate.

[0089] When the first filler includes a first sub-filler and a second sub-filler, the first sub-filler is used to adjust the viscosity and fluidity of the UV-curing glue, and the second sub-filler is used to increase the wear resistance and mechanical strength of the first cured product corresponding to the UV-curing glue, and the first sub-filler and the second sub-filler account for 5wt.% to 15wt.% in the UV-curing glue respectively.

[0090] When the first sub-filler includes at least two of diatomaceous earth, talc, cellulose powder, and polyacrylate, the components in the first sub-filler have the same proportion in the UV-curable adhesive, and the total proportion of the components in the UV-curable adhesive is 5 wt.% to 15 wt.%. When the second sub-filler includes at least two of calcium carbonate, aluminum hydroxide, zinc oxide, polyethylene powder, glass microbeads, and rubber powder, the components in the second sub-filler have the same proportion in the UV-curable adhesive, and the total proportion of the components in the UV-curable adhesive is 5 wt.% to 15 wt.%.

[0091] Optionally, in one embodiment, the conductive adhesive comprises: a second resin, metal particles, additives, oxide particles, a dispersant, and a nucleating agent;

[0092] In the conductive adhesive, the second resin accounts for 5wt.% to 15wt.%; the metal particles account for 70wt.% to 90wt.%; the additive accounts for 0.5wt.% to 5wt.%; the oxide particles account for 1wt.% to 3wt.%; the dispersant accounts for 3wt.% to 5wt.%; the nucleating agent accounts for 0.1wt.% to 3wt.%; wherein the sum of the second resin, the metal particles, the additive, the oxide particles, the dispersant and the nucleating agent in the conductive adhesive is 100wt.%.

[0093] For example, in the conductive adhesive, the second resin may account for 13 wt.%, the metal particles may account for 80 wt.%, the additives may account for 0.5 wt.%, the oxide particles may account for 2 wt.%, the dispersant may account for 4 wt.%, and the nucleating agent may account for 0.5 wt.%.

[0094] Specifically, in the conductive adhesive, the second resin is used to provide the conductive adhesive with strength, toughness and good adhesion; metal particles can form a conductive path in the conductive adhesive, so that the conductive adhesive has conductive properties; additives are used to improve the conductive properties and mechanical properties of the conductive adhesive; oxide particles are nano-scale particles, which are used to improve the adhesion and conductivity of the conductive adhesive; dispersants are used to improve the dispersibility of conductive particles in the second resin and improve the conductive properties of the conductive adhesive; nucleating agents are used to lower the curing temperature threshold of the conductive adhesive, increase the cross-linking density of the conductive adhesive, and accelerate the curing speed of the conductive adhesive.

[0095] Optionally, in one embodiment, the second resin is at least one of epoxy resin, acrylic resin, silicone, polyurethane, and rubber; wherein epoxy resin is a common conductive adhesive matrix with good adhesion, toughness and strength; acrylic resin has excellent light resistance, weather resistance and electrical insulation properties; silicone has good thermal conductivity, insulation and high and low temperature resistance; polyurethane has excellent elasticity and wear resistance; rubber has good oil resistance and solvent resistance.

[0096] It should be noted that when the second resin includes at least two of epoxy resin, acrylic resin, silicone, polyurethane, and rubber, the proportion of each component in the second resin in the conductive adhesive is the same, and the sum of the proportions of each component in the conductive adhesive is 5wt.% to 15wt.%.

[0097] Optionally, in one embodiment, the metal particles are at least one of copper particles, silver particles, gold particles, nickel particles, and silver-coated copper particles.

[0098] It should be noted that when the metal particles include at least two of copper particles, silver particles, gold particles, nickel particles, and silver-coated copper particles, the proportion of each component in the metal particles in the conductive adhesive is the same, and the sum of the proportions of each component in the conductive adhesive is 70wt.% to 90wt.%.

[0099] Optionally, in one embodiment, the additive is at least one of carbon nanotubes, graphene, conductive carbon fibers and conductive carbon black.

[0100] It should be noted that when the additive includes at least two of carbon nanotubes, graphene, conductive carbon fibers and conductive carbon black, the proportion of each component in the additive in the conductive adhesive is the same, and the sum of the proportions of each component in the conductive adhesive is 0.5wt.% to 5wt.%.

[0101] Optionally, in one embodiment, the oxide particles are at least one of zinc oxide particles, indium oxide particles, copper oxide particles, and aluminum oxide particles; wherein the zinc oxide particles have photocatalytic properties, optoelectronic properties, and excellent photosensitivity, and are used to improve the adhesion and conductivity of the conductive adhesive colloid; indium tin oxide particles can improve the conductivity and optical transparency of the conductive adhesive; copper oxide particles have good conductivity and impedance matching properties; aluminum oxide particles have excellent insulation and heat resistance, and can be used to make high-temperature resistant conductive adhesive.

[0102] It should be noted that when the oxide particles include at least two of zinc oxide particles, indium oxide particles, copper oxide particles, and aluminum oxide particles, the proportion of each component in the oxide particles in the conductive adhesive is the same, and the sum of the proportions of each component in the conductive adhesive is 1wt.% to 3wt.%.

[0103] Alternatively, in one embodiment, the dispersant is at least one of polyvinyl alcohol, hydroxyethyl cellulose, and carboxymethyl cellulose.

[0104] It should be noted that when the dispersant includes at least two of polyvinyl alcohol, hydroxyethyl cellulose, and carboxymethyl cellulose, the proportion of each component in the dispersant in the conductive adhesive is the same, and the sum of the proportions of each component in the conductive adhesive is 3wt.% to 5wt.%.

[0105] Alternatively, in one embodiment, the nucleating agent is at least one of stearic acid, calcium hydroxide, aluminum silicate, an organic peroxide, calcium silicate, and cerium dioxide. Nucleating agents are novel functional additives that modify the crystallization behavior of the resin, accelerating the crystallization rate, increasing the crystallization density, and miniaturizing the grain size, thereby shortening the molding cycle and improving physical and mechanical properties such as product transparency, surface gloss, tensile strength, rigidity, heat distortion temperature, impact resistance, and creep resistance.

[0106] It should be noted that when the nucleating agent includes at least two of stearic acid, calcium hydroxide, aluminum silicate, organic peroxide, calcium silicate, and cerium dioxide, the proportion of each component in the nucleating agent in the conductive adhesive is the same, and the sum of the proportions of each component in the conductive adhesive is 0.1wt.% to 3wt.%.

[0107] Optionally, in one embodiment, when the second resin is an epoxy resin, the nucleating agent is at least one of stearic acid, calcium hydroxide, and aluminum silicate; when the second resin is an acrylic resin, the nucleating agent is an organic peroxide; when the second resin is a silicone conductive adhesive, the nucleating agent is at least one of aluminum silicate and calcium silicate; when the second resin is a polyurethane conductive adhesive, the nucleating agent is cerium dioxide.

[0108] While ensuring the conductive performance of the conductive adhesive, the embodiment of the present invention also improves the solid solubility between the second resin and the nucleating agent, improves the compatibility between the nucleating agent and the resin matrix, and further improves the physicochemical properties of the resin matrix in the conductive adhesive.

[0109] Optionally, in one embodiment, the step S102 of performing a curing process on the first surface printed with the UV curable glue includes:

[0110] Step S1021: irradiate the first surface printed with the ultraviolet curing glue with an ultraviolet lamp.

[0111] Among them, the irradiation power is 1000mw / m 2 Up to 3500mw / m 2 , for example, it can be 1000mw / m 2 、1500mw / m 2 , 2000mw / m 2 、2500mw / m 2 、3000mw / m 2 、3500mw / m 2 The range of values ​​for one or both of .

[0112] In an embodiment of the present invention, during the primary curing process of the first surface printed with the UV curable glue, the first surface printed with the UV curable glue may be irradiated with an UV lamp to accelerate the curing speed of the UV curable glue.

[0113] It can be understood that when the first surface printed with UV curing glue is subjected to a primary curing treatment through step S1021, the first surface printed with UV curing glue can be irradiated with an ultraviolet lamp at normal temperature or room temperature without the need for a heating process, thereby reducing the energy consumption of the primary curing treatment and improving the efficiency of the primary curing treatment.

[0114] Optionally, in one embodiment, the first surface after the primary curing treatment comprises a first cured product; the volume resistivity of the first cured product is 1×10 15 Ω·cm to 1×10 18 Ω·cm; the first cured product is formed after the ultraviolet curing glue is cured once.

[0115] Optionally, in one embodiment, the step S106 of preparing a target photovoltaic module based on the target cell string includes:

[0116] Step S1061 : stacking the front plate, the first adhesive film, the target battery string, the second adhesive film, and the back plate in sequence to obtain a stacked component.

[0117] Among them, the front plate can be at least one of ETFE plate, PVDF plate, PVF plate, PET plate, PO plate, and glass fiber prepreg plate; the thickness of the front plate is 30μm to 700μm; the front plate is made of transparent material, and mainly plays the role of light transmission, insulation, protection of the front side of the target battery cell, impact resistance, water vapor blocking, and ultraviolet blocking.

[0118] The first adhesive film and the second adhesive film can be the same adhesive film or different adhesive films; the first adhesive film and the second adhesive film can be any one of silicone, POE, EVA, PVB, EPE, and EP.

[0119] The target battery string is the target battery string prepared through steps S101 to S105 .

[0120] The back plate can be CPC board, PC board, PET board, KPF board, TPC board, PO board, glass fiber prepreg board, etc.; the thickness of the back plate is 100μm to 700μm; the back plate is generally white or black, and its main function is to reflect light to increase the light received by the target cell, insulate, and protect the back of the cell.

[0121] It can be understood that in the stack, the first surface of the target cell in the target cell string is stacked with the second adhesive film, and the second surface of the target cell opposite to the first surface is stacked with the first adhesive film.

[0122] Optionally, in one embodiment, before step S1061, the method further includes:

[0123] Step A11: performing stress release treatment on the front plate and the rear plate, wherein the temperature of the stress release treatment is 100° C. to 160° C., and the duration of the stress release treatment is 1 minute to 20 minutes.

[0124] Specifically, the front plate and the rear plate are placed in a stress release device, the device temperature is set to any temperature between 100°C and 160°C, and the time it takes for the front plate and the rear plate to move from the entrance of the stress release device to the exit of the stress release device through the conveying device of the stress release device is any time between 1 minute and 20 minutes.

[0125] It is understood that when the front panel and / or back panel are thicker, the stress relief process takes a relatively longer time; when the front panel and / or back panel are thinner, the stress relief process takes a relatively shorter time. For example, when the front panel is 30 μm thick, the stress relief process takes 1 to 2 minutes; when the front panel is 300 μm thick, the stress relief process takes 5 to 10 minutes; and when the front panel is 700 μm thick, the stress relief process takes 15 to 20 minutes.

[0126] In the embodiment of the present invention, before stacking the front plate, the first adhesive film, the target battery string, the second adhesive film and the back plate in sequence to obtain the stacked component, the front plate and the back plate are subjected to stress release treatment to release the stress in the front plate and the back plate in the photovoltaic module, thereby reducing the probability of the photovoltaic module causing warping and deformation problems.

[0127] Step S1062: laminating the stacked component to obtain a laminated component.

[0128] Wherein, the temperature of the lamination treatment is 120°C to 150°C, for example, it can be one of 120°C, 125°C, 130°C, 135°C, 140°C, 145°C, and 150°C or any two of the range values; the duration of the lamination treatment is 5min to 20min, for example, it can be one of 5min, 10min, 15min, and 20min or any two of the range values; the pressure of the lamination treatment is -80kpa to -20kpa, for example, it can be one of -80kpa, -70kpa, -60kpa, -50kpa, -40kpa, -30kpa, and -20kpa or any two of the range values.

[0129] In an embodiment of the present invention, the lamination treatment of the stack may include a primary lamination treatment, a secondary lamination treatment and a tertiary lamination treatment; wherein, the pressure of the primary lamination treatment is -80kpa to -60kpa, and the duration is 20s; the pressure of the secondary lamination treatment is -60kpa to -40kpa, and the duration is 20s; the pressure of the tertiary lamination treatment is -40kpa to -20kpa, and the duration is 260s to 1160s.

[0130] Reference Figure 3 , shows a schematic structural diagram of a laminate provided by an embodiment of the present invention. In the laminate 01, the front plate 20, the first adhesive film 30, the target battery string 10, the second adhesive film 40 and the back plate 50 are stacked in sequence.

[0131] Step S1063: preparing a target photovoltaic module based on the laminate.

[0132] In an embodiment of the present invention, the target photovoltaic module is prepared based on the laminate as follows: first, the laminate is bonded to the backboard to obtain a bonded member; then, the bonded member is subjected to roller pressing and static flat pressing to obtain the target photovoltaic module.

[0133] Specifically, the backsheet may include a third surface and a fourth surface, the third surface and the fourth surface being opposite each other. The third surface is in contact with the laminate, and the fourth surface may be flat or corrugated. During the process of laminating the laminate to the backsheet to obtain the laminated component, glue may be first applied to the third surface of the backsheet, and then the glued third surface is laminated to the laminate to obtain the laminated component. The glue applied to the third surface may be any adhesive suitable for photovoltaic modules.

[0134] When the fourth surface is a plane, the third surface is also a plane, and glue spraying equipment can be used to evenly spray glue on the third surface to obtain the glue-sprayed third surface.

[0135] When the fourth surface is a corrugated surface, the third surface is also a corrugated surface corresponding to the fourth surface, and glue spraying equipment can be used to spray glue on the convex area, concave area and edge area of ​​the third surface respectively.

[0136] During the glue spraying process on the third surface, the first height of the adhesive in the concave area can be made greater than the second height of the adhesive in the convex area to improve the bonding effect between the laminate and the third surface. The difference between the first height and the second height can be greater than or equal to 0.5 mm. It should be noted that the order of glue spraying on the convex area, concave area and edge area in the third surface can be adjusted according to space and process requirements, and this is not limited in the embodiment of the present invention. In the embodiment of the present invention, setting the fourth surface of the backplane as a corrugated surface can improve the resistance to deformation of the target photovoltaic module.

[0137] In the process of rolling and statically pressing the bonded parts to obtain the target photovoltaic modules, the gap between the pressing roller and the lower tray in the rolling equipment can be adjusted to ensure that the thickness of the adhesive layer after rolling and statically pressing is between 0.2mm and 2mm. The pressing roller is then used to roll the bonded parts from the front to the back end. After rolling, if there is any glue overflow around, it should be wiped off with a clean non-woven fabric in time. Finally, the static pressing equipment is used to statically press the bonded parts after rolling to obtain the target photovoltaic modules. The purpose of the rolling process is to roll the glue-coated strips flat, and the pressure of the rolling process can be 300Pa to 1000Pa. The purpose of the static pressing process is to prevent the back sheet 17 and the rear sheet 15 from bouncing apart during the curing process of the glue, and the pressure of the static pressing process is 50Pa to 250Pa.

[0138] An embodiment of the present invention further provides a photovoltaic module, which is prepared by the method for preparing a photovoltaic module as described in any one of the above items.

[0139] The present invention is described in detail below by way of examples.

[0140] Example 1

[0141] (1) Printing ultraviolet curing glue on the first surface of the target cell; wherein the target cell is an interdigitated back contact cell, the first surface includes a positive electrode grid line and a negative electrode grid line, and the ultraviolet curing glue is used to separate the positive electrode grid line and the negative electrode grid line; the ultraviolet curing glue includes epoxy resin, phenyl acetone, polyurethane light stabilizer, halogen salt antioxidant, vulcanizing agent, diatomaceous earth and calcium carbonate, and in the ultraviolet curing glue, the epoxy resin accounts for 55wt.%, phenyl acetone 5wt.%, polyurethane light stabilizer 5wt.%, halogen salt antioxidant 2wt.%, vulcanizing agent 3wt.%, diatomaceous earth 15wt.% and calcium carbonate 15wt.%.

[0142] (2) Using an ultraviolet lamp to irradiate the first surface printed with ultraviolet curing glue; the irradiation power is 1000mw / m 2 , the irradiation time is 2s; the first surface after the primary curing treatment includes a first cured product, the first cured product is formed after the UV curing glue is cured once, and the volume resistance of the first cured product is 1×10 15 Ω·cm.

[0143] (3) Printing a conductive adhesive at the positive electrode grid lines and / or the negative electrode grid lines in the first surface after a single curing treatment; wherein the conductive adhesive includes epoxy resin, copper particles, carbon nanotubes, zinc oxide particles, polyvinyl alcohol and stearic acid, and in the conductive adhesive, the epoxy resin accounts for 5wt.%, the copper particles account for 90wt.%, the carbon nanotubes account for 0.9wt.%, the zinc oxide particles account for 1wt.%, the polyvinyl alcohol accounts for 3wt.% and the stearic acid accounts for 0.1wt.%.

[0144] (4) Pasting a soldering tape on the positive electrode grid line printed with conductive glue and / or the negative electrode grid line printed with conductive glue to connect at least one of the target battery cells through the soldering tape.

[0145] (5) The conductive adhesive is subjected to a secondary curing treatment to obtain a target battery string; wherein the target battery string includes at least one target battery cell; the temperature of the secondary curing treatment is 120° C., and the duration of the secondary curing treatment is 30 seconds.

[0146] (6) The front plate, the first adhesive film, the target battery string, the second adhesive film and the back plate are stacked in sequence to obtain a stacked component.

[0147] (7) The laminated parts are sequentially laminated to obtain a laminate; the lamination temperature is 120° C.; the lamination time is 20 min; and the lamination pressure is -20 kPa.

[0148] (8) Preparing a target photovoltaic module based on the laminate.

[0149] Example 2

[0150] The difference between Example 2 and Example 1 is that in step (1), in the ultraviolet curing glue, the proportion of epoxy resin is 74wt.%, phenyl acetone is 3wt.%, polyurethane light stabilizer is 2wt.%, halogen salt antioxidant is 0.5wt.%, vulcanizing agent is 0.5wt.%, diatomaceous earth is 10wt.% and calcium carbonate is 10wt.%.

[0151] Example 3

[0152] The difference between Example 3 and Example 1 is that in step (1), in the ultraviolet curing glue, the proportion of epoxy resin is 80wt.%, phenylacetone is 4wt.%, polyurethane light stabilizer is 3wt.%, halogen salt antioxidant is 1wt.%, vulcanizing agent is 1wt.%, diatomaceous earth is 5wt.% and calcium carbonate is 5wt.%.

[0153] Example 4

[0154] The difference between Example 4 and Example 1 is that in step (1), the UV curing glue further includes acrylic resin; in the UV curing glue, the proportion of epoxy resin and acrylic resin is 27.5wt.% respectively.

[0155] Example 5

[0156] The difference between Example 5 and Example 1 is that in step (1), the UV-curable glue further includes hydroxycyclohexyl benzophenone; in the UV-curable glue, the proportions of phenylacetone and hydroxycyclohexyl benzophenone are 2.5 wt.%, respectively.

[0157] Example 6

[0158] The difference between Example 6 and Example 1 is that in step (1), the UV-curable glue further includes an acrylate light stabilizer; in the UV-curable glue, the polyurethane light stabilizer and the acrylate light stabilizer account for 2.5 wt.% respectively.

[0159] Example 7

[0160] The difference between Example 7 and Example 1 is that in step (1), the UV-curable glue further includes a phenolic antioxidant; in the UV-curable glue, the halide antioxidant and the phenolic antioxidant each account for 1 wt.%.

[0161] Example 8

[0162] The difference between Example 8 and Example 1 is that in step (1), the UV-curing glue also includes talcum powder, cellulose powder, polyacrylate, as well as aluminum hydroxide, zinc oxide, polyethylene powder, glass microbeads, and rubber powder; in the UV-curing glue, diatomaceous earth, talcum powder, cellulose powder, and polyacrylate account for 3.75wt.%, respectively, and calcium carbonate, aluminum hydroxide, zinc oxide, polyethylene powder, glass microbeads, and rubber powder account for 2.5wt.%, respectively.

[0163] Example 9

[0164] The difference between Example 9 and Example 1 is that in step (2), the irradiation time is 5 seconds.

[0165] Example 10

[0166] The difference between Example 10 and Example 1 is that in step (2), the irradiation time is 3 seconds.

[0167] Example 11

[0168] The difference between Example 11 and Example 1 is that in step (2), the irradiation power is 3500mw / m 2 .

[0169] Example 12

[0170] The difference between Example 12 and Example 1 is that in step (2), the irradiation power is 2000mw / m 2 .

[0171] Example 13

[0172] The difference between Example 13 and Example 1 is that in step (2), the volume resistance of the first solidified material is 1×10 18 Ω·cm.

[0173] Example 14

[0174] The difference between Example 14 and Example 1 is that in step (2), the volume resistance of the first solidified material is 1×10 16 Ω·cm.

[0175] Example 15

[0176] The difference between Example 15 and Example 1 is that in step (3), in the conductive adhesive, the proportion of epoxy resin is 15wt.%, the proportion of copper particles is 70wt.%, the proportion of carbon nanotubes is 5wt.%, the proportion of zinc oxide particles is 3wt.%, the proportion of polyvinyl alcohol is 4wt.% and the proportion of stearic acid is 3wt.%.

[0177] Example 16

[0178] The difference between Example 16 and Example 1 is that in step (3), in the conductive adhesive, the proportion of epoxy resin is 10wt.%, the proportion of copper particles is 80wt.%, the proportion of carbon nanotubes is 0.5wt.%, the proportion of zinc oxide particles is 2wt.%, the proportion of polyvinyl alcohol is 5wt.% and the proportion of stearic acid is 2.5wt.%.

[0179] Example 17

[0180] The difference between Example 17 and Example 1 is that in step (3), the conductive adhesive further includes acrylic resin, silicone, and polyurethane; in the conductive adhesive, the proportions of epoxy resin, acrylic resin, silicone, and polyurethane are 1.25 wt.% respectively.

[0181] Example 18

[0182] The difference between Example 18 and Example 17 is that in step (3), the conductive adhesive further includes organic peroxide, aluminum silicate, and cerium dioxide; in the conductive adhesive, the proportions of stearic acid, organic peroxide, aluminum silicate, and cerium dioxide are 0.025 wt.%, respectively.

[0183] Example 19

[0184] The difference between Example 19 and Example 1 is that in step (3), the conductive adhesive further includes silver particles and gold particles; in the conductive adhesive, the proportion of copper particles, silver particles, and gold particles is 30 wt.%, respectively.

[0185] Example 20

[0186] The difference between Example 20 and Example 1 is that in step (3), the conductive adhesive further includes graphene and conductive carbon fibers; in the conductive adhesive, the proportions of carbon nanotubes, graphene, and conductive carbon fibers are 0.3 wt. %, respectively.

[0187] Example 21

[0188] The difference between Example 21 and Example 1 is that in step (3), the conductive adhesive further includes indium oxide particles; in the conductive adhesive, the proportion of zinc oxide particles and indium oxide particles is 0.5 wt.%, respectively.

[0189] Example 22

[0190] The difference between Example 22 and Example 1 is that in step (3), the conductive adhesive further includes hydroxyethyl cellulose and carboxymethyl cellulose; in the conductive adhesive, the proportions of polyvinyl alcohol, hydroxyethyl cellulose and carboxymethyl cellulose are 1 wt.% respectively.

[0191] Example 23

[0192] The difference between Example 23 and Example 1 is that in step (5), the temperature of the secondary curing treatment is 130°C.

[0193] Example 24

[0194] The difference between Example 24 and Example 1 is that in step (5), the temperature of the secondary curing treatment is 150°C.

[0195] Example 25

[0196] The difference between Example 25 and Example 1 is that in step (5), the duration of the secondary curing treatment is 20 seconds.

[0197] Example 26

[0198] The difference between Example 26 and Example 1 is that in step (5), the duration of the secondary curing treatment is 25 seconds.

[0199] Example 27

[0200] The difference between Example 27 and Example 1 is that in step (7), the temperature of the lamination treatment is 140°C.

[0201] Example 28

[0202] The difference between Example 28 and Example 1 is that in step (7), the temperature of the lamination treatment is 150°C.

[0203] Example 29

[0204] The difference between Example 29 and Example 1 is that in step (7), the duration of the lamination treatment is 5 minutes.

[0205] Example 30

[0206] The difference between Example 30 and Example 1 is that in step (7), the duration of the lamination treatment is 15 minutes.

[0207] Example 31

[0208] The difference between Example 31 and Example 1 is that in step (7), the pressure of the lamination treatment is -80 kPa.

[0209] Example 32

[0210] The difference between Example 32 and Example 1 is that in step (7), the pressure of the lamination treatment is -60 kPa.

[0211] Comparative Example 1

[0212] The difference between Comparative Example 1 and Example 1 is:

[0213] In step (1), the first surface of the target cell is printed with a non-ultraviolet curing insulating glue commonly used in the industry;

[0214] In step (2), the first surface printed with the insulating glue is heated to 250° C. and subjected to a curing treatment for 60 seconds;

[0215] In step (3), solder paste is printed on the positive electrode grid lines and / or the negative electrode grid lines on the first surface after the primary curing treatment;

[0216] Excluding step (4)

[0217] In step (5), the solder paste is subjected to a secondary curing treatment to obtain a cured solder paste; wherein the temperature of the secondary curing treatment is 260° C., and the duration of the secondary curing treatment is 60 seconds;

[0218] After step (5), the solidified solder paste in the target battery string is heated to 350° C., and a solder strip is welded to the solder paste in the positive and / or negative grid lines within 5 seconds to connect at least one target battery cell through the solder strip to obtain a target battery string.

[0219] To sum up, the preparation method of the photovoltaic module provided by the embodiment of the present invention is as follows: first, ultraviolet curing glue is printed on the first surface of the target battery, and the positive and negative grid lines in the first surface are separated by the ultraviolet curing glue to avoid the positive and negative short circuit problem in the target battery cell; then, the first surface printed with ultraviolet curing glue is subjected to a primary curing treatment for a duration of 2s to 5s, and the primary curing treatment can be carried out at room temperature without the need for heating and curing; thereafter, conductive glue is printed at the positive grid lines and / or negative grid lines in the first surface after the primary curing treatment, and soldering strips are pasted at the positive grid lines printed with conductive glue and / or the negative grid lines printed with conductive glue to connect at least one target battery cell through the soldering strips; then, a target battery string including at least one target battery cell is obtained by performing a secondary curing treatment on the conductive glue, and the temperature of the secondary curing treatment is 120°C to 150°C, and the duration is 20s to 30s; after the secondary curing treatment, the soldering strip and the target battery cell can be welded without the need to perform welding operations at high temperature after the conductive glue is cured. Compared with the method for preparing photovoltaic modules in the related art, the temperature of the curing treatment in the embodiment of the present invention is greatly reduced, so that the energy consumption of preparing photovoltaic modules is reduced by about 50% compared with the related art, and the duration of the curing treatment is also significantly shortened, so that the time required for the entire process of preparing photovoltaic modules can be shortened to about 40s. Compared with the related art, the process time is shortened by about 70%. While reducing the energy consumption loss caused by the thermal curing process, it also shortens the process time and improves the process efficiency of preparing photovoltaic modules.

[0220] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0221] Through the description of the above embodiments, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better embodiment. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for enabling a terminal (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in each embodiment of the present invention.

[0222] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are protected by the present invention.

Claims

1. A method for preparing a photovoltaic module, characterized in that: The method comprises: Printing UV-curable glue on the first surface of a target cell; the target cell is an interdigitated back-contact cell, the first surface includes positive and negative grid lines, and the UV-curable glue is used to separate the positive and negative grid lines; Performing a primary curing treatment on the first surface printed with the UV curing glue; the duration of the primary curing treatment is 2s to 5s; Printing a conductive adhesive at the positive electrode grid lines and / or the negative electrode grid lines on the first surface after the primary curing treatment; Pasting a soldering tape on the positive electrode grid line printed with conductive glue and / or the negative electrode grid line printed with conductive glue, so as to connect at least one of the target solar cells through the soldering tape; Performing a secondary curing treatment on the conductive adhesive to obtain a target battery string; the target battery string includes at least one target battery cell; the temperature of the secondary curing treatment is 120° C. to 150° C., and the duration of the secondary curing treatment is 20 seconds to 30 seconds; Based on the target cell string, a target photovoltaic module is prepared.

2. The method according to claim 1, characterized in that The ultraviolet curing glue comprises: a first resin, a photoinitiator, a light stabilizer, an antioxidant, an inhibitor, and a first filler; In the UV-curable glue, the first resin accounts for 55wt.% to 80wt.%; the photoinitiator accounts for 3wt.% to 5wt.%; the light stabilizer accounts for 2wt.% to 5wt.%; the antioxidant accounts for 0.5wt.% to 2wt.%; the inhibitor accounts for 0.5wt.% to 3wt.%; and the first filler accounts for 10wt.% to 30wt.%; The total weight of the first resin, the photoinitiator, the light stabilizer, the antioxidant, the inhibitor and the first filler in the UV-curable glue is 100 wt.%.

3. The method according to claim 2, characterized in that The first resin is at least one of epoxy resin, acrylic resin, and silicone resin; The photoinitiator is at least one of phenylacetone, hydroxycyclohexyl benzophenone, and diphenylethane; The light stabilizer is at least one of a polyurethane light stabilizer, an acrylate light stabilizer, and a hindered amine light stabilizer; The antioxidant is at least one of a halogen salt antioxidant, a phenolic antioxidant, and a selenium compound antioxidant; The inhibitor is a vulcanizing agent; The first filler includes a first sub-filler and a second sub-filler; the first sub-filler is at least one of diatomaceous earth, talc, cellulose powder, and polyacrylate; the second sub-filler is at least one of calcium carbonate, aluminum hydroxide, zinc oxide, polyethylene powder, glass beads, and rubber powder.

4. The method according to claim 1, wherein The conductive adhesive comprises: a second resin, metal particles, additives, oxide particles, a dispersant and a nucleating agent; In the conductive adhesive, the second resin accounts for 5wt.% to 15wt.%; the metal particles account for 70wt.% to 90wt.%; the additive accounts for 0.5wt.% to 5wt.%; the oxide particles account for 1wt.% to 3wt.%; the dispersant accounts for 3wt.% to 5wt.%; and the nucleating agent accounts for 0.1wt.% to 3wt.%. The total weight of the second resin, the metal particles, the additives, the oxide particles, the dispersant, and the nucleating agent in the conductive adhesive is 100 wt.%.

5. The method according to claim 4, characterized in that The second resin is at least one of epoxy resin, acrylic resin, silicone, polyurethane, and rubber; The metal particles are at least one of copper particles, silver particles, gold particles, nickel particles, and silver-coated copper particles; The additive is at least one of carbon nanotubes, graphene, conductive carbon fibers and conductive carbon black; The oxide particles are at least one of zinc oxide particles, indium oxide particles, copper oxide particles, and aluminum oxide particles; The dispersant is at least one of polyvinyl alcohol, hydroxyethyl cellulose, and carboxymethyl cellulose; The nucleating agent is at least one of stearic acid, calcium hydroxide, aluminum silicate, organic peroxide, calcium silicate, and cerium dioxide.

6. The method according to claim 5, characterized in that When the second resin is an epoxy resin, the nucleating agent is at least one of stearic acid, calcium hydroxide, and aluminum silicate; In the case where the second resin is an acrylic resin, the nucleating agent is an organic peroxide; In the case where the second resin is a silicone conductive adhesive, the nucleating agent is at least one of aluminum silicate and calcium silicate; When the second resin is polyurethane conductive adhesive, the nucleating agent is cerium dioxide.

7. The method according to claim 1, characterized in that The first surface printed with ultraviolet curing glue is subjected to a curing treatment, comprising: The first surface printed with UV curing glue is irradiated with an ultraviolet lamp; the irradiation power is 1000mw / m 2 Up to 3500mw / m 2 .

8. The method according to claim 1, characterized in that The first surface after the primary curing treatment includes a first cured product; the volume resistance of the first cured product is 1×10 15 Ω·cm to 1×10 18 Ω·cm; the first cured product is formed after the ultraviolet curing glue is cured once.

9. The method according to claim 1, characterized in that The step of preparing a target photovoltaic module based on the target cell string includes: stacking the front plate, the first adhesive film, the target battery string, the second adhesive film and the back plate in sequence to obtain a laminate; Performing a lamination process on the stacked part to obtain a laminated part; the temperature of the lamination process is 120° C. to 150° C.; the duration of the lamination process is 5 minutes to 20 minutes; and the pressure of the lamination process is -80 kPa to -20 kPa; A target photovoltaic module is prepared based on the laminate.

10. A photovoltaic module, characterized in that: The photovoltaic module is prepared by the method for preparing a photovoltaic module according to any one of claims 1 to 9.

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