Method for manufacturing resin molded article, molding die, and resin molding device

Abstract

Provided is a method for producing a resin molded article, which, in compression molding using a mold release film, suppresses the occurrence of wrinkles in the mold release film, and suppresses the occurrence of resin protrusions that fall off during conveyance of the resin molded article after resin molding. In this method for manufacturing a resin molded article, a resin molding step is a step in which an object to be molded is disposed between an upper mold and a lower mold (200), a mold release film is disposed on the bottom surface and side surfaces of a cavity (200A), and a resin material is disposed on the mold release film, the molding molds are closed, and resin molding is performed by compression molding to manufacture the resin molded article. The conveyance step is a step in which the molding die is opened after the resin molding step, and the resin molded article is taken out from the molding die and conveyed, and a step (201D) having a depth equal to or less than the thickness of the mold release film is formed on the upper surface of the lower mold side member (201) at a location adjacent to the inner peripheral surface of the lower mold side member (201).

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a resin molded product, a molding die, and a resin molding device. Background Art

[0002] In the manufacture of resin molded products, compression molding utilizing a molding die is widely used. In addition, in this compression molding, in order to prevent resin from leaking out from the molding die, a release film is sometimes used.

[0003] Patent Document 1 describes a structure in which, in the lower mold of a molding die using a release film for compression molding, a protrusion is formed on the outer peripheral edge of the upper surface of the lower mold bottom surface component (compression mold), and a step is formed on the inner peripheral surface of the lower mold side component (frame). According to Patent Document 1, this structure can eliminate wrinkles that form on the release film during mold closing for compression molding with the release film positioned on the upper surface of the lower mold. By preventing wrinkles from forming on the release film, defects in the resin molded product caused by such wrinkles can be suppressed.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2013-180461 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] However, in the molding die described in Patent Document 1, protrusions corresponding to the step differences of the lower mold side member remain on the outer periphery of the resin molded product after resin molding. If these protrusions remain, there is a risk of them falling off when the resin molded product is removed from the molding die and transported. Such falling protrusions could potentially lead to defective products or cause the resin molding equipment to stop operating, potentially reducing productivity.

[0009] Therefore, the object of the present disclosure is to provide a method for manufacturing a resin molded product, a molding die, and a resin molding device that suppress the generation of wrinkles in the release film during compression molding using the release film and suppress the generation of resin protrusions that fall off during transportation of the resin molded product after resin molding.

[0010] Solutions to the Problem

[0011] In order to achieve the above-mentioned object, the manufacturing method of the resin molded product disclosed in the present invention is a manufacturing method of the resin molded product using a molding die, wherein

[0012] The forming die includes an upper die and a lower die,

[0013] The upper mold and the lower mold are arranged relative to each other,

[0014] The lower mold includes a lower mold bottom component and a lower mold side component,

[0015] A cavity is formed by a space surrounded by the upper surface of the lower mold bottom member and the inner peripheral surface of the lower mold side member, wherein the upper surface of the lower mold bottom member forms the bottom surface of the cavity, and the inner peripheral surface of the lower mold side member forms the side surface of the cavity.

[0016] The resin molded product manufacturing method includes a resin molding process and a conveying process.

[0017] The resin molding process is a process of placing a molding object between the upper mold and the lower mold, placing a release film on the bottom and side surfaces of the cavity, and clamping the molding mold to perform resin molding by compression molding in a state where a resin material is placed on the release film to manufacture the resin molded product.

[0018] The conveying step is a step of opening the molding die after the resin molding step, taking the resin molded product out of the molding die, and conveying the product.

[0019] A step having a depth equal to or less than the thickness of the release film is formed on the upper surface of the lower mold side member at a portion adjacent to the inner peripheral surface of the lower mold side member.

[0020] The first molding die of the present disclosure is the molding die used in the method for producing a resin molded article of the present disclosure.

[0021] The second molding die of the present disclosure is a compression molding die used in a method for manufacturing a resin molded product, wherein

[0022] The forming die includes an upper die and a lower die,

[0023] The upper mold and the lower mold are arranged relative to each other,

[0024] The lower mold includes a lower mold bottom component and a lower mold side component,

[0025] A cavity is formed by a space surrounded by the upper surface of the lower mold bottom member and the inner peripheral surface of the lower mold side member, wherein the upper surface of the lower mold bottom member forms the bottom surface of the cavity, and the inner peripheral surface of the lower mold side member forms the side surface of the cavity.

[0026] In the method for manufacturing a resin molded product, a molding object is arranged between the upper mold and the lower mold, a mold release film is arranged on the bottom and side surfaces of the cavity, and a resin material is arranged on the mold release film. The molding mold is then clamped and resin molding is performed by compression molding, thereby manufacturing the resin molded product.

[0027] A step having a depth equal to or less than the thickness of the release film is formed on the upper surface of the lower mold side member at a portion adjacent to the inner peripheral surface of the lower mold side member.

[0028] In addition, hereinafter, unless otherwise specified, “the molding die of the present disclosure” includes both the first molding die of the present disclosure and the second molding die of the present disclosure.

[0029] The resin molding device disclosed herein is a resin molding device comprising:

[0030] The forming die of the present disclosure; and

[0031] A mold clamping mechanism for clamping the upper mold and the lower mold of the molding die.

[0032] Effects of the Invention

[0033] The present disclosure can provide a method for manufacturing a resin molded product, a molding die, and a resin molding apparatus that suppress wrinkles in a release film during compression molding using a release film and suppress the generation of resin protrusions that fall off during transportation of the resin molded product after resin molding. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] [ Figure 1 ] Figure 1 This is a diagram showing an example of the structure of the molding die of the present disclosure. Figure 1 (a) is a plan view. Figure 1 (b) is a cross-sectional view.

[0035] [ Figure 2 ] Figure 2 This is a cross-sectional view illustrating one step in the method for producing a resin molded article of the present disclosure.

[0036] [ Figure 3 ] Figure 3 This is a cross-sectional view illustrating another step in the method for producing a resin molded article of the present disclosure.

[0037] [ Figure 4 ] Figure 4 This is a cross-sectional view illustrating another step in the method for producing a resin molded article of the present disclosure.

[0038] [ Figure 5 ] Figure 5 This is a cross-sectional view illustrating another step in the method for producing a resin molded article of the present disclosure.

[0039] [ Figure 6 ] Figure 6 This is a cross-sectional view illustrating another step in the method for producing a resin molded article of the present disclosure.

[0040] [ Figure 7 ] Figure 7 This is a cross-sectional view illustrating another step in the method for producing a resin molded article of the present disclosure.

[0041] [ Figure 8 ] Figure 8 It is a plan view showing an example of the structure of the resin molding device of the present disclosure. DETAILED DESCRIPTION

[0042] In the present disclosure, the molding die is not particularly limited, and may be, for example, a metal mold or a ceramic mold.

[0043] In this disclosure, when referring to "suppression" of phenomena such as the formation of resin protrusions, relaxation of the release film, and the generation of wrinkles in the release film, unless otherwise specified, it is not limited to suppressing the occurrence of these phenomena to a small extent, but also includes reducing the occurrence of these phenomena to zero.

[0044] In the present disclosure, resin molded products are not particularly limited, and may be, for example, electronic components formed by resin-sealing electronic elements such as ICs and semiconductor chips (hereinafter sometimes referred to as "chips"). More specifically, for example, by resin-sealing a chip, the chip can become a resin-sealed electronic component (also referred to as an electronic component or package as a finished product, etc., hereinafter sometimes referred to as an "electronic component"). In addition, in general, "electronic component" can refer to the case of a chip before resin sealing and the state of a chip sealed with resin. However, in the present disclosure, a chip before resin sealing is referred to as an "electronic component", and a chip after resin sealing is referred to as an "electronic component" (an electronic component as a finished product). That is, in the present disclosure, "chip" and "electronic component" have the same meaning, and specifically, for example, chips such as ICs, semiconductor chips, semiconductor elements for power control, resistor elements, capacitor elements, etc. can be cited. In addition, "semiconductor element" refers to, for example, a circuit element made of a semiconductor. "Chip" or "electronic element" in the present disclosure is not particularly limited as long as it is a chip before resin sealing, and it does not need to be in the form of a chip.

[0045] In the present disclosure, there are no particular restrictions on the resin material before molding and the resin after molding. For example, it can be a thermosetting resin such as epoxy resin or silicone resin, or it can be a thermoplastic resin. In addition, it can also be a composite material that partially contains a thermosetting resin or a thermoplastic resin. In the present disclosure, as the form of the resin material before molding, for example, powdered resin (including granular resin), liquid resin, sheet resin, flat plate resin, etc. can be cited. In addition, in the present disclosure, the liquid resin can be liquid at room temperature, and also includes molten resin that becomes liquid by melting through heating. The form of the resin can be any other form as long as it can be supplied to the cavity or tank of the molding mold.

[0046] Next, specific embodiments of the present disclosure will be described based on the accompanying drawings. For ease of description, each drawing is schematically drawn, and appropriate omissions, exaggerations, etc. are made.

[0047] [Implementation Method 1]

[0048] In this embodiment, an example of the molding die disclosed herein and an example of a method for producing a resin molded article using the same will be described.

[0049] Figure 1 An example of the structure of the molding die disclosed in the present invention is shown. Figure 1 (a) is a plan view (top view). Figure 1 (b) is along Figure 1 (a) is a cross-sectional view viewed in the II direction. Figure 1 In order to simplify the illustration, the illustration of the upper mold of the forming mold is omitted, and the illustration of the lower mold is also simplified.

[0050] like Figure 1 As shown, the molding die includes a lower die 200. In addition, although not shown, the molding die includes an upper die as described above. The upper die and the lower die 200 are arranged in such a manner that the lower surface of the upper die and the upper surface of the lower die 200 are opposite to each other. The structure of the upper die is not particularly limited, and for example, it may be as described later. Figures 2 to 7 This allows the molding object to be fixed to the lower surface of the upper mold.

[0051] As shown in the figure, the lower mold 200 includes a lower mold bottom member 202 and a lower mold side member 201. The space surrounded by the upper surface of the lower mold bottom member 202 and the inner peripheral surface of the lower mold side member 201 forms a cavity 200A. The upper surface of the lower mold bottom member 202 forms the bottom surface of the cavity 200A, and the inner peripheral surface of the lower mold side member 201 forms the side surface of the cavity 200A. As described later Figures 2 to 7 As described, a molding object is arranged between the upper mold and the lower mold 200, a release film is arranged on the bottom and side surfaces of the cavity 200A, and the molding mold is closed with the resin material arranged on the release film, and resin molding is performed by compression molding to manufacture a resin molded product.

[0052] In addition, Figure 1 In the lower mold 200 , no protrusions are formed on the outer peripheral edge of the upper surface of the lower mold bottom surface member 202 so that the surface is flush.

[0053] On the upper surface of the lower mold side part 201, a step 201D having a depth less than the thickness of the release film is formed at a portion adjacent to the inner peripheral surface of the lower mold side part 201. The outer end of the step 201D is located on the inner side of the outer edge of the configuration area α of the molding object. In addition, an exhaust groove 201C extending further outward than the step 201D is formed on the upper surface of the lower mold side part 201. The exhaust groove 201C is a groove formed on the upper surface of the lower mold side part 201. There are multiple exhaust grooves 201C, which are formed radially around a portion of the step 201D. Figure 1 In the embodiment, step 201D is connected to vent groove 201C. The outer end of vent groove 201C is located outside the outer edge of area α where the molded object is positioned. For example, gas (such as air) within cavity 200A can be released into vent groove 201C. Alternatively, a mold release film or the like can be sucked through vent groove 201C.

[0054] The width W1 of the step 201D (the distance from the side in contact with the inner circumferential surface of the lower mold side member 201 to the opposite side) is not particularly limited, but is preferably 0.05 mm or greater, for example, from the perspective of more easily suppressing wrinkles in the release film. The upper limit is not particularly limited and depends on the distance from the end surface of the molding object (e.g., a substrate) to the step 201D, and is, for example, 30 mm or less, 20 mm or less, 10 mm or less, 5 mm or less, 4 mm or less, 3 mm or less, 2 mm or less, 1 mm or less, 0.5 mm or less, 0.4 mm or less, 0.3 mm or less, 0.2 mm or less, or 0.1 mm or less.

[0055] In addition, Figure 1 In the embodiment, steps 201D are formed on the upper surface of the lower mold side member 201 along the entire circumference (all portions) of the portion adjacent to the inner circumferential surface of the lower mold side member 201. However, the present disclosure is not limited to this, and steps 201D may not be formed along the entire circumference. For example, steps 201D may be provided only in a portion of the portion of the upper surface of the lower mold side member 201 adjacent to the inner circumferential surface of the lower mold side member 201, while steps 201D may not be provided in other portions. Specifically, for example, steps 201D may not be provided in portions where even a very small amount of resin material must not leak.

[0056] Moreover, a through hole 201A and a through hole 201B are formed on the upper surface of the lower mold side part 201. The through hole 201A is arranged at a portion of the outer side of the step difference 201D and the exhaust groove 201C, and passes through from the upper surface to the lower surface of the lower mold side part 201. As shown in the figure, the through hole 201A has the following structure: a groove with a V-shaped cross section when viewed from the side is formed on the upper surface of the lower mold side part 201, and a plurality of through holes with a circular planar shape are formed at the bottom of the V-shaped groove. The through hole 201B is arranged in a manner to surround the entire circumference of the outer side of the through hole 201A, and passes through from the upper surface to the lower surface of the lower mold side part 201. As described later Figures 2 to 7 As described above, the mold release film can be sucked through the through-holes 201A and 201B and adsorbed onto the cavity surface of the cavity 200A. In addition, as described later, a resin for resin molding can be accommodated in the cavity 200A.

[0057] Next, use Figures 2 to 7 Schematic process cross-section diagram, illustrating the use of Figure 1 The molding die and the method for manufacturing the resin molded product of the present disclosure using the resin molding device of the present disclosure including the molding die. Figures 2 to 7 In, with Figure 1 The same components are represented by the same symbols. However, for the sake of convenience, the shapes and the like may be different. Figure 1 different.

[0058] First, use Figure 2 The structure of the resin molding device is described. As shown in the figure, the molding die in the resin molding device is Figure 1 In addition to the lower mold 200 shown, it also has an upper mold 100. Figure 1 As shown, the resin molding device includes, in addition to the molding mold, an external air blocking component 300 and a release film adsorption mechanism (not shown). The mold surface of the upper mold 100 and the mold surface of the lower mold 200 are opposite to each other. The upper mold 100 is fixed to the lower surface of the upper mold holding component 110. The lower mold 200 is fixed to the upper surface of the lower mold holding component 210. As described later, the upper mold 100 is a mold for fixing the substrate 10. The substrate 10 is equivalent to the "molding object" of the present disclosure. As described later, the lower mold 200 is a mold for forming a cavity on the mold surface and adsorbing the release film on the mold surface. The external air blocking component 300 is installed on the lower surface of the upper mold holding component 110 and the upper surface of the lower mold holding component 210 in a manner surrounding the upper mold 100 and the lower mold 200, respectively. As will be described later, outside air blocking member 300 can surround the molding dies (upper die 100 and lower die 200 ) together with upper die holding member 110 and lower die holding member 210 , thereby isolating them from outside air.

[0059] The upper mold 100 is formed by installing a film pressing member 103 and a clamp 104 on the upper mold body 102. The film pressing member 103 is installed on the lower part of the upper mold body 102 via the upper mold elastic member 103s. In this embodiment, a spring is used as the upper mold elastic member. The film pressing member 103 can move up and down by the expansion and contraction of the upper mold elastic member 103s. And, as described later, the release film can be pressed against the lower mold side member 201 by the film pressing member 103. As shown in the figure, the clamp 104 can clamp and fix the substrate 10 between the lower surface of the upper mold body 102 and the clamp 104. In addition, the configuration positions of the film pressing member 103 and the clamp 104 are not limited to Figure 2 The configuration is arbitrary.

[0060] The upper mold body 102 and the upper mold holding member 110 are provided with through holes 100B and 300B that pass through from the upper surface to the lower surface thereof. The lower end of the through hole 100B opens on the fixed surface of the substrate 10 on the lower surface of the upper mold body 102. As described later, by suctioning the interior of the through hole 100B to reduce pressure, the substrate 10 can be adsorbed on the upper mold body 102. The lower end of the through hole 300B opens on the peripheral portion of the fixed surface of the substrate 10. As described later, by suctioning the interior of the through hole 300B to reduce pressure, the space surrounded by the external air blocking member 300 can be made into a negative pressure.

[0061] like Figure 1 As described above, the lower mold 200 includes a lower mold bottom member 202 and a lower mold side member 201. The lower mold side member 201 is mounted on the peripheral portion of the upper surface of the lower mold bottom member 202 via the lower mold elastic member 201s. In this embodiment, a spring is used as the lower mold elastic member. The lower mold side member 201 can move up and down by the expansion and contraction of the lower mold elastic member 201s. In addition, as shown in the figure, a cavity 200A is formed by the space surrounded by the central portion of the upper surface of the lower mold bottom member 202 (the portion where the lower mold side member 201 is not mounted) and the inner side surface of the lower mold side member 201. As described later, a resin for resin molding can be accommodated in the cavity 200A.

[0062] As described above, no protrusions are formed on the outer peripheral edge of the upper surface of the lower mold bottom member 202 so that the surface is flush.

[0063] The upper surface of the lower mold side member 201 is formed with Figure 1 The configuration and structure of the step difference 201D and the exhaust groove 201C are as follows: Figure 1 As described in .

[0064] As described above, through-holes 201A and 201B are provided in the lower mold side member 201. Furthermore, through-hole 200B is provided in the lower mold bottom member 202 and the lower mold holding member 210. The lower end of through-hole 200B extends from the lower surface of the lower mold bottom member 202 to the lower surface of the lower mold holding member 210, while the other end is connected to the gap between the lower mold bottom member 202 and the lower mold side member 201, thereby forming through-hole 200B together with this gap. Through-hole 201A penetrates the lower mold holding member 210 and extends from the lower surface of the lower mold bottom member 202 to the upper surface of the inner edge of the lower mold side member 201. Through-hole 201B penetrates the lower mold holding member 210 and extends from the lower surface of the lower mold bottom member 202 to the upper surface of the outer edge of the lower mold side member 201. As described later, by using a release film suction mechanism to reduce the pressure inside through-holes 200B, 201A, and 201B, the release film can be sucked onto the mold surface of lower mold 200. Then, as described later, resin molding is performed with the release film sucked between the mold surfaces of upper mold 100 and lower mold 200. Lower mold side member 201 may or may not have through-holes for sucking the release film. Even if it does, their placement is arbitrary.

[0065] Although not shown, as the release film adsorption mechanism, a vacuum pump etc. can be used. In addition, although not shown, the resin molding apparatus further includes a conveying mechanism that opens the molding die after resin molding, removes the resin molded product from the molding die and conveys it.

[0066] Outside air blocking members 300 are attached to the peripheries of upper mold holding member 110 and lower mold holding member 210. Elastic O-rings 300A are provided between upper mold holding member 110 and upper outside air blocking member 300, between upper outside air blocking member 300 and lower outside air blocking member 300, and between lower outside air blocking member 300 and lower mold holding member 210.

[0067] Next, an example of a resin molding method using the resin molding apparatus will be described. Figure 2As shown, the substrate 10 is clamped and fixed by the lower surface of the upper mold body 102 and the clamp 104. As described above, the substrate 10 is equivalent to the "molding object" of the present disclosure. As shown in the figure, a chip 10a is fixed on the lower surface of the substrate 10 (the surface on the opposite side of the fixed surface relative to the upper mold body 102). During resin molding, the chip 10a can be resin-sealed to manufacture an electronic component (resin molded product). However, the present disclosure is not limited to this. For example, components such as chips may not be fixed on the substrate. In addition, for example, other components other than chips (such as metal wires, etc.) may also be fixed on the substrate. Furthermore, as shown in the figure, the release film 11 is transported to the position of the mold surface of the lower mold 200 together with the resin material 20a placed thereon. The means and method for placing the resin material 20a on the release film 11 are not particularly limited. For example, well-known means and methods such as feeders may be appropriately used. The means and method for conveying the release film 11 and the resin material 20a to the position on the mold surface of the lower mold 200 are not particularly limited. For example, a known means and method such as a loader may be used as appropriate. In addition, the resin material 20a is a granular resin in this embodiment, but is not limited to this. For example, it may also be a sheet-like resin, a liquid resin, a flat plate-like resin, a semi-solid fluid resin, etc.

[0068] Next, if Figures 3 and 4 As shown, the release film adsorption process is carried out. Figure 3 As shown, the release film 11 and the resin material 20a are handed over to the lower mold 200. Furthermore, as shown by arrows 201a and 201b, the interior of the through holes 201A and 201B in the lower mold side part 201 is decompressed by using a release film adsorption mechanism (not shown). The release film adsorption mechanism is not particularly limited, and it may be, for example, a vacuum pump or the like. Thus, the release film 11 is adsorbed on the upper surface of the lower mold side part 201, and tension is applied to the release film 11 arranged on the cavity 200A, and the wrinkles of the release film are stretched. At this time, by forming a step difference 201D on the lower mold side part 201, the release film is stretched by the step difference 201D, thereby further promoting the elongation of the release film. Thus, the relaxation of the release film is suppressed. Therefore, the generation of wrinkles on the release film can be suppressed, and the defects of the resin molded product caused by the wrinkles can also be suppressed. Furthermore, by forming the air vent groove 201C in the lower mold side member 201, it is possible to further suppress the loosening of the release film and the generation of wrinkles, and to suppress defects in the resin molded product caused by the wrinkles.

[0069] Furthermore, if Figure 4As shown by the arrow 200b, the through hole 200B connected to the gap between the lower mold side part 201 and the lower mold bottom part 202 is decompressed and sucked by the release film adsorption mechanism. As a result, further tension is applied to the release film 11, the wrinkles are stretched, and the release film 11 is adsorbed on the cavity surface of the cavity 200A. As a result, the release film 11 is arranged on the bottom and side surfaces of the cavity 200A. As a result, as shown in the figure, the resin material 20a is placed (arranged) in the cavity 200A in a state of being placed (arranged) on the release film 11. In addition, at this time, as shown in the figure, it is preferred to arrange the release film 11 on at least the upper surface of the step difference 201D of the lower mold side part 201. The order of sucking the release film 11 onto the lower mold 200 is not limited to the above order, and any order can be appropriately changed according to the type of the release film 11 as long as the release film 11 can be sucked onto the cavity surface of the cavity 200A without wrinkles.

[0070] In addition, if Figure 4 As shown by the arrow 100b, the interior of the through hole 100B of the upper mold body 102 is decompressed and sucked by the molding object adsorption mechanism (not shown). The molding object adsorption mechanism is not particularly limited, and it can also be, for example, a vacuum pump. As a result, the entire upper surface of the substrate 10 is adsorbed on the lower surface of the upper mold body 102 and is fixed more firmly. In addition, for example, the adsorption of the substrate 10 to the upper mold body 102 can also be Figure 2 or Figure 3 The stage begins.

[0071] Furthermore, in this embodiment, in addition to clamping with a clamp, reduced-pressure suction is used as a mechanism for holding (fixing) the substrate (molding object) to the upper mold. This increases the force holding the substrate and the force for peeling the release film. However, in this disclosure, the mechanism for holding the molding object to the upper mold is not limited to this; for example, clamping alone may also be used.

[0072] In this embodiment, the forming mold is always preheated by a heater (not shown) provided inside the forming mold. The resin material 20a begins to melt when placed in the cavity 200A together with the release film 11, and eventually becomes molten resin 20b. The molten resin 20b corresponds to the molten "resin material". In addition, the preheating of the forming mold can also be performed during the release film adsorption process ( Figures 3 and 4 ) before or simultaneously with the release film adsorption process. In addition, the preheating of the forming mold can also be started after the release film adsorption process.

[0073] Then, if Figures 5 to 7As shown, the resin molding process and the conveying process are performed. As mentioned above, the resin molding process is a process in which the molding object is placed between the upper and lower molds, release films are placed on the bottom and side surfaces of the cavity, and the resin material is placed on the release films. The molds are then closed and the resin is compressed to produce a resin molded product. As mentioned above, the conveying process is a process in which the molds are opened after the resin molding process, and the resin molded product is removed from the molds and conveyed.

[0074] First, the lower mold holding member 210 is raised, and the lower mold 200 and the external air blocking member 300 are raised together. Figure 5 As shown, first, the upper and lower air-blocking members 300 are closed by O-rings 300A, and the molding dies (upper mold 100 and lower mold 200) are isolated from the outside air by the upper mold holding member 110, the lower mold holding member 210, and the air-blocking members 300. Hereinafter, the space S enclosed by the upper mold holding member 110, the lower mold holding member 210, and the air-blocking members 300 will sometimes be referred to as the "inside air-blocking space." Simultaneously with the air-blocking members 300 closing, the film retainer 103 comes into contact with the lower mold side member 201 via the release film 11, which is sandwiched between the lower mold side member 201 and the film retainer 103. At this point, the upper mold 100 and the lower mold 200 have not yet been clamped, and the substrate 10 and the molten resin 20b have not yet come into contact. In this state, as indicated by arrow 300b, the interior of through-hole 300B of upper mold 100 is depressurized by an internal decompression mechanism (not shown) within the air-blocking member. This creates a negative pressure within air-blocking space S. The internal decompression mechanism within the air-blocking member is not particularly limited and may be, for example, a vacuum pump.

[0075] Then, if Figure 6As shown, the lower mold holding member 210 (lower mold 200) is further raised. This causes the chip 10a to be immersed in the molten resin 20b, and the substrate 10 to come into contact with the molten resin 20b. The molten resin 20b is then filled into the mold cavity 200A, and the upper mold 100 and lower mold 200 are clamped. At this time, since there are no protrusions formed on the outer periphery of the upper surface of the lower mold bottom member 202, resulting in a flush surface, the height of the outer periphery of the upper surface of the lower mold bottom member 202 is lower than the height of the step 201D of the lower mold side member 201. As a result, the manufactured resin molded product does not produce protrusions corresponding to the protrusions (steps) on the outer periphery of the upper surface of the lower mold bottom member 202. Therefore, when the resin molded product is removed from the mold and transported, such protrusions do not fall off. Consequently, there is no risk that such protrusions could fall off, causing defective products or causing the resin molding equipment to stop operating, thereby reducing productivity. Furthermore, since the resin material is not wasted due to the generation of such protrusions, the yield is also good. In addition, since the effective area of ​​the substrate 10 is not reduced, the substrate 10 can be effectively utilized.

[0076] Furthermore, as described above, the depth of step 201D is less than the thickness of release film 11. This prevents molten resin 20b from entering the portion of step 201D and solidifying, thereby forming excess resin (resin burrs). Furthermore, if the depth of step 201D is less than the thickness of release film 11, even if molten resin 20b enters the portion of step 201D, the amount of molten resin 20b that enters is minimal. Therefore, even if excess resin is formed, it is very thin and lightweight, making it less likely to cause problems caused by the excess resin falling off.

[0077] In this case, as long as the step 201D is formed inward of the end surface of the substrate 10 in a plan view, for example, the distance W2 from the outer end surface of the step 201D to the end surface of the substrate 10 can be set to 1 mm or more. The upper limit of the distance W2 is not particularly limited, and for example, it can be 50 mm or less, 40 mm or less, 30 mm or less, 20 mm or less, 10 mm or less, 5 mm or less, 4 mm or less, 3 mm or less, or 2 mm or less. Alternatively, the distance W2 can be expressed as the distance between the outer end surface of the step 201D and the outer edge of the placement area of ​​the molding object (substrate 10).

[0078] After the mold is closed, the pressure in the air-blocking space S is returned to atmospheric pressure. The timing for returning the air-blocking space S to atmospheric pressure may be after the mold is closed and before the molten resin 20b is completely solidified.

[0079] Furthermore, if Figure 7As shown, the molten resin 20b is solidified to complete the resin molding process, produce a resin molded product, and the release film is peeled off from the resin molded product.

[0080] First, if Figure 6 As shown, in the state of mold clamping, the molten resin 20b is solidified. For example, when the molten resin 20b is a thermosetting resin, the molding die can be further heated by the heater inside to form a solidified resin ( Figure 7 In addition, for example, when the molten resin 20b is a thermoplastic resin, the molten resin 20b can be solidified by stopping the heating of the molding die and cooling it or by quenching the molding die to form the solidified resin 20. In addition, even after the mold is closed, a force is applied to the lower mold holding member 210 to raise the lower mold 200, so that the molten resin 20b is solidified while being compressed. In this way, a resin molded product 30 ( Figure 7 ).

[0081] Then, the molding die is opened and the resin molded product is taken out from the molding die and transported. Specifically, first, Figure 7 As shown, lower mold holding member 210 is lowered, lower mold 200 and ambient air shutoff member 300 are lowered, and upper mold 100 and lower mold 200 are opened. As a result, as shown in the figure, release film 11, which is in close contact with cured resin 20, is peeled off from cured resin 20. Then, a transport mechanism (not shown) removes resin molded article 30 from the mold and transports it.

[0082] As described above, by carrying out the method for manufacturing a resin molded article according to the present embodiment, it is possible to manufacture the resin molded article 30 in which one surface of the base material 10 is resin-molded with the cured resin 20 .

[0083] According to the molding die of the present disclosure, for example, the releasability of a resin molded product from a release film can be improved with an extremely simple structure, regardless of molding conditions and without providing a resin block outside the molding area.

[0084] [Implementation Method 2]

[0085] In this embodiment, an example of the overall structure of the resin molding apparatus disclosed herein and a method for manufacturing a resin molded product using the apparatus will be described.

[0086] Reference Figure 8 An example of a resin molding method using the resin molding apparatus 1 will be described. In the resin molding apparatus 1, a granular resin 20a (see Figures 2 to 4First, in the substrate supply / storage module 41, the substrate 10 is sent from the substrate supply unit 44 to the substrate placement unit 50 (see Figures 2 to 7 ). Next, the substrate conveying mechanism 51 is moved from the prescribed position S1 in the -Y direction to receive the substrate 10 from the substrate loading portion 50. The substrate conveying mechanism 51 is returned to the prescribed position S1. Next, in the present resin molding apparatus 1, among the three molding modules 42A to 42C, for example, the substrate conveying mechanism 51 is moved along the +X direction to the prescribed position P1 of the molding module 42B. Next, in the molding module 42B, the substrate conveying mechanism 51 is moved along the -Y direction and stopped at the prescribed position C1 on the lower mold 200. Next, the substrate conveying mechanism 51 is raised to fix the substrate 10 on the upper mold 100. Then, the substrate conveying mechanism 51 is returned to the prescribed position S1 of the substrate supply / storage module 41.

[0087] Furthermore, as will be described later, the substrate transport mechanism 51 may also be used as a "transport mechanism" for taking out the resin molded product from the mold that has been opened after resin molding and transporting it.

[0088] Next, the material conveying mechanism 56 receives the release film 11 stored in the release film supply mechanism 53 , conveys it to the lower mold 200 of the molding die of the molding module 42B, and sets it in the cavity 200A of the lower mold 200 .

[0089] Next, the XY table 52 is moved from the predetermined position T1 in the -Y direction and is stopped at a predetermined position below the resin material storage frame 54. The resin material storage frame 54 is placed on the XY table 52. The XY table 52 on which the resin material storage frame 54 is placed is moved in the +X direction and is stopped at a predetermined position below the resin material feeding mechanism 55. By moving the XY table 52 in the X and Y directions, a predetermined amount of resin material 20a (see FIG. 2 ) is supplied from the resin material feeding mechanism 55 to the resin material storage frame 54. Figures 2 to 4 ) The XY table 52 on which the resin material storage frame 54 is placed is returned to the predetermined position T1.

[0090] Next, the material conveying mechanism 56 moves from the predetermined position M1 in the -Y direction to receive the resin material storage frame 54 placed on the XY table 52. The material conveying mechanism 56 returns to the predetermined position M1. Next, the material conveying mechanism 56 moves in the -X direction to the predetermined position P1 of the molding module 42B. Next, in the molding module 42B, the material conveying mechanism 56 moves in the -Y direction and stops at the predetermined position C1 on the lower mold 200. The material conveying mechanism 56 is lowered to supply the resin material 20a to the upper surface of the release film 11 provided in the mold cavity 200A. After the supply is completed, the material conveying mechanism 56 returns to the predetermined position M1.

[0091] Next, in the molding module 42B, the "resin molding step" of the method for manufacturing a resin molded product of the present disclosure is performed. In this "resin molding step", a substrate (molding object) 10 is placed between the upper mold and the lower mold, and a release film 11 is placed on the bottom and side surfaces of the cavity 200A (see Figures 2 to 7 ), and with the resin material disposed on the release film 11, the molding die is clamped and the resin is molded by compression molding, thereby manufacturing the resin molded product 30. In this embodiment, the lower mold 200 is raised by the clamping mechanism 60, and the upper mold 100 and the lower mold 200 are clamped to perform resin molding, thereby manufacturing the resin molded product 30. More specifically, this "resin molding process" can be, for example, as follows Figures 5 to 7 Proceed as described in .

[0092] After the resin molding process, the "conveying process" in the method for manufacturing the resin molded product disclosed in the present invention is carried out. This conveying process is a process of opening the molding die, taking out the resin molded product 30 from the molding die, and conveying it. Specifically, first, after the resin molding is completed, the upper mold 100 and the lower mold 200 of the molding die are opened. After the molding die is opened, the substrate conveying mechanism 51 is moved from the specified position S1 of the substrate supply / storage module 41 to the specified position C1 on the lower mold 200 to receive the resin molded product 30. Next, the substrate conveying mechanism 51 is moved to hand over the resin molded product 30 to the substrate loading section 50. The resin molded product 30 is stored from the substrate loading section 50 into the resin molded product storage section 45.

[0093] In this embodiment, three molding modules 42A, 42B, and 42C are installed along the X-direction between the substrate supply / storage module 41 and the material supply module 43. However, the number of molding modules is not limited to three and is arbitrary. Alternatively, the substrate supply / storage module 41 and the material supply module 43 can be combined into a single module, with a single molding module 42A installed on top of this module along the X-direction. This allows for the addition or removal of molding modules 42A, 42B, and so on. Therefore, the structure of the resin molding apparatus 1 can be optimized according to production type and volume, thereby improving productivity.

[0094] In this embodiment, a release film supply mechanism 53 for supplying the release film 11 is provided within the material supply module 43. However, this is not limiting. The release film supply mechanism 53 for supplying the release film 11 may be provided as a separate release film supply module, rather than within the material supply module 43. In this case, for example, the release film supply module may be installed between the molding module 42C and the material supply module 43, or next to the material supply module 43 on the opposite side of the molding module 42C. In this manner, the resin molding apparatus 1 can be constructed by simply adding the release film supply module to an existing apparatus.

[0095] Furthermore, the present disclosure is not limited to the above embodiments, and they can be arbitrarily and appropriately combined, changed, or selected for use as needed without departing from the scope of the present disclosure.

[0096] A part or all of the above-mentioned embodiments may be described as follows, but are not limited to the following.

[0097] (Note 1)

[0098] A method for manufacturing a resin molded product using a molding die, wherein

[0099] The forming die includes an upper die and a lower die,

[0100] The upper mold and the lower mold are arranged relative to each other,

[0101] The lower mold includes a lower mold bottom component and a lower mold side component,

[0102] A cavity is formed by a space surrounded by the upper surface of the lower mold bottom member and the inner peripheral surface of the lower mold side member, wherein the upper surface of the lower mold bottom member forms the bottom surface of the cavity, and the inner peripheral surface of the lower mold side member forms the side surface of the cavity.

[0103] The resin molded product manufacturing method includes a resin molding process and a conveying process.

[0104] The resin molding process is a process of placing a molding object between the upper mold and the lower mold, placing a release film on the bottom and side surfaces of the cavity, and clamping the molding mold to perform resin molding by compression molding in a state where a resin material is placed on the release film to manufacture the resin molded product.

[0105] The conveying step is a step of opening the molding die after the resin molding step, taking the resin molded product out of the molding die, and conveying the product.

[0106] A step having a depth equal to or less than the thickness of the release film is formed on the upper surface of the lower mold side member at a portion adjacent to the inner peripheral surface of the lower mold side member.

[0107] (Note 2)

[0108] The method for manufacturing a resin molded product according to Supplementary Note 1, wherein the resin molding step is performed in a state where the release film is disposed on at least the upper surface of the step of the lower mold side member.

[0109] (Note 3)

[0110] The method for manufacturing a resin molded product according to Supplementary Note 1 or 2, wherein the step of the lower mold side surface member is formed in an annular shape.

[0111] (Note 4)

[0112] The method for manufacturing a resin molded product according to any one of Supplementary Notes 1 to 3, wherein an outer end portion of the step of the lower mold side member is located inside an outer edge of a placement region of the molding object.

[0113] (Note 5)

[0114] The method for manufacturing a resin molded product according to any one of Supplementary Notes 1 to 4, wherein a venting groove extending outward from the step is formed on the upper surface of the lower mold side member.

[0115] (Note 6)

[0116] The method for manufacturing a resin molded product according to Supplementary Note 5, wherein in the lower mold side surface member, the step is connected to the exhaust groove.

[0117] (Note 7)

[0118] The method for producing a resin molded product according to Supplementary Note 5 or 6, wherein an outer end portion of the exhaust groove is located outside an outer edge of a placement region of the molding object.

[0119] (Note 8)

[0120] The method for producing a resin molded product according to any one of Supplementary Notes 1 to 7, wherein in the resin molding step, the molding object is arranged on a lower surface of the upper mold.

[0121] (Note 9)

[0122] The molding die used in the method for producing a resin molded product according to any one of Supplementary Notes 1 to 8.

[0123] (Note 10)

[0124] A compression molding die for use in a method for manufacturing a resin molded product,

[0125] The forming die includes an upper die and a lower die,

[0126] The upper mold and the lower mold are arranged relative to each other,

[0127] The lower mold includes a lower mold bottom component and a lower mold side component,

[0128] A cavity is formed by a space surrounded by the upper surface of the lower mold bottom member and the inner peripheral surface of the lower mold side member, wherein the upper surface of the lower mold bottom member forms the bottom surface of the cavity, and the inner peripheral surface of the lower mold side member forms the side surface of the cavity.

[0129] In the method for manufacturing a resin molded product, a molding object is placed between the upper mold and the lower mold, a release film is placed on the bottom and side surfaces of the cavity, and a resin material is placed on the release film. The molding molds are then clamped together to perform resin molding by compression molding to manufacture the resin molded product.

[0130] A step having a depth equal to or less than the thickness of the release film is formed on the upper surface of the lower mold side member at a portion adjacent to the inner peripheral surface of the lower mold side member.

[0131] (Note 11)

[0132] A resin molding device comprising

[0133] The molding die according to Supplementary Note 9 or 10; and

[0134] A mold clamping mechanism for clamping the upper mold and the lower mold in the molding die.

[0135] (Note 12)

[0136] The resin molding apparatus according to Supplementary Note 11 further includes a conveying mechanism for taking out the resin molded product from the mold opened and conveying the product after the resin molding.

[0137] This application claims priority based on Japanese patent application No. 2023-035729, filed on March 8, 2023, the disclosure of which is incorporated herein by reference in its entirety.

[0138] Description of Reference Numerals

[0139] 1 Resin molding device

[0140] 10. Substrate (molding object)

[0141] 10a chip

[0142] 11 Release film

[0143] 20 Cured resin (molded resin)

[0144] 20a Resin material

[0145] 20b Molten resin

[0146] 30 Resin molded products

[0147] 41 substrate supply / storage module

[0148] 42A, 42B, 42C forming modules

[0149] 43 Material Supply Module

[0150] 44. Substrate supply unit

[0151] 45 Resin molded product storage area

[0152] 50 substrate placement section

[0153] 51 substrate conveying mechanism

[0154] 52 XY table

[0155] 53 Release film supply mechanism

[0156] 54 Resin storage box

[0157] 55 Resin material feeding mechanism

[0158] 56 Material conveying mechanism

[0159] 60 clamping mechanism

[0160] 100 upper mold

[0161] 100B through hole

[0162] 102 Upper mold body

[0163] 103 film pressing piece

[0164] 103s Upper mold elastic component

[0165] 104 fixture

[0166] 110 Upper mold holding component

[0167] 200 lower die

[0168] 200A cavity

[0169] 200B through hole

[0170] 201A, 201B through holes

[0171] 201C exhaust slot

[0172] 201D Step Difference

[0173] 201 lower mold side parts

[0174] 201s lower mold elastic component

[0175] 202 lower mold bottom part

[0176] 210 lower mold holding component

[0177] 300 External gas shutoff components

[0178] 300B through hole

[0179] α Molding object placement area

[0180] S External gas shielding space

Claims

1. A method for producing a resin molded product, wherein the method comprises: The forming die includes an upper die and a lower die, The upper mold and the lower mold are arranged relative to each other, The lower mold includes a lower mold bottom component and a lower mold side component, A cavity is formed by a space surrounded by the upper surface of the lower mold bottom member and the inner peripheral surface of the lower mold side member, wherein the upper surface of the lower mold bottom member forms the bottom surface of the cavity, and the inner peripheral surface of the lower mold side member forms the side surface of the cavity. The resin molded product manufacturing method includes a resin molding process and a conveying process. The resin molding process is a process of placing a molding object between the upper mold and the lower mold, placing a release film on the bottom and side surfaces of the cavity, and clamping the molding mold to perform resin molding by compression molding in a state where a resin material is placed on the release film to manufacture the resin molded product. The conveying step is a step of opening the molding die after the resin molding step, taking the resin molded product out of the molding die, and conveying the product. A step having a depth equal to or less than the thickness of the release film is formed on the upper surface of the lower mold side member at a portion adjacent to the inner peripheral surface of the lower mold side member. 2 . The method for manufacturing a resin molded product according to claim 1 , wherein the resin molding step is performed in a state where the release film is disposed on at least the upper surface of the step of the lower mold side member. 3 . The method for manufacturing a resin molded product according to claim 1 , wherein the step of the lower mold side member is formed in an annular shape. 4 . The method for manufacturing a resin molded product according to claim 1 , wherein an outer end portion of the step of the lower mold side member is located inside an outer edge of a placement region of the molding object. 5 . The method for manufacturing a resin molded product according to claim 1 , wherein a venting groove extending outward from the step is formed on an upper surface of the lower mold side member. 6 . The method for manufacturing a resin molded product according to claim 5 , wherein in the lower mold side member, the step is connected to the exhaust groove. 7 . The method for manufacturing a resin molded product according to claim 5 , wherein an outer end portion of the exhaust groove is located outside an outer edge of a placement region of the molding object. 8 . The method for producing a resin molded product according to claim 1 , wherein in the resin molding step, the molding object is arranged on a lower surface of the upper mold. 9 . The molding die used in the method for producing a resin molded article according to claim 1 .

10. A molding die for compression molding used in a method for producing a resin molded product, wherein The forming die includes an upper die and a lower die, The upper mold and the lower mold are arranged relative to each other, The lower mold includes a lower mold bottom component and a lower mold side component, A cavity is formed by a space surrounded by the upper surface of the lower mold bottom member and the inner peripheral surface of the lower mold side member, wherein the upper surface of the lower mold bottom member forms the bottom surface of the cavity, and the inner peripheral surface of the lower mold side member forms the side surface of the cavity. In the method for manufacturing a resin molded product, a molding object is placed between the upper mold and the lower mold, a release film is placed on the bottom and side surfaces of the cavity, and a resin material is placed on the release film. The molding molds are then clamped together to perform resin molding by compression molding to manufacture the resin molded product. A step having a depth equal to or less than the thickness of the release film is formed on the upper surface of the lower mold side member at a portion adjacent to the inner peripheral surface of the lower mold side member.

11. A resin molding device comprising The molding die according to claim 9 or 10; and A mold clamping mechanism is used to clamp the upper mold and the lower mold in the molding mold.

12. The resin molding apparatus according to claim 11, further comprising a conveying mechanism for taking out the resin molded product from the mold opened and conveying the product after the resin is molded.

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