Rotating electric machine unit

Abstract

This dynamo-electric machine unit is provided with a dynamo-electric machine and a power conversion device. The power conversion device is provided with: a plurality of power modules; a plurality of AC wirings; and a plurality of drive circuit boards that are provided corresponding to the plurality of power modules, respectively, and on which drive circuits for driving the plurality of power modules are mounted, the plurality of drive circuit boards being formed such that the lengths in the circumferential direction become smaller toward the inside in the radial direction when viewed from the axial direction, respectively, the drive circuits comprising: a first electronic processing unit of a low-voltage system, and a second electronic processing unit of a low-voltage system; the first substrate is provided with a first electronic component and a first wiring pattern connected with the first electronic component; and a second electronic processing unit of a high-voltage system having a second electronic component and a second wiring pattern connected to the second electronic component and having a potential higher than that of the low-voltage system, each of the plurality of drive circuit boards having a first region on which the first electronic processing unit is mounted and a second region on which the second electronic processing unit is mounted. The first region is disposed radially inward of the second region.

Description

Technical Field

[0001] The present disclosure relates to a rotating electrical machine unit.

[0002] This application claims priority based on Japanese Patent Application No. 2023-017270 filed in Japan on February 8, 2023, and the contents are incorporated herein by reference. Background Art

[0003] Conventionally, rotary electric machine units are known that integrate a rotary electric machine and a power conversion device to achieve overall miniaturization. For example, Patent Document 1 discloses a rotary electric machine unit comprising a rotary electric machine and a power conversion device arranged in an axial direction. The power conversion device includes multiple power modules and a single circular drive circuit substrate on which a drive circuit for driving the multiple power modules is mounted.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent No. 4708951 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] In the structure of Patent Document 1, the area of ​​the driver circuit substrate where the driver circuit is not mounted is large, resulting in low efficiency in the area utilization of the driver circuit substrate. Furthermore, in the structure of Patent Document 1, the driver circuit substrate is circular, resulting in a low yield rate during manufacturing of the driver circuit substrate and low productivity of the driver circuit substrate.

[0009] The present disclosure has been made in view of the above circumstances, and an object thereof is to provide a rotary motor unit that can improve the utilization efficiency of the area of ​​a drive circuit substrate to achieve miniaturization of the drive circuit substrate and improve the productivity of the drive circuit substrate.

[0010] Means for solving problems

[0011] The rotary electric machine unit disclosed in the present invention comprises: a rotary electric machine having a stator on which a plurality of coils are wound and mounted, and a rotor that rotates about an axis relative to the stator; and a power conversion device arranged in an axial direction along the axis of the rotor with respect to the rotary electric machine, the power conversion device comprising: a plurality of power modules that are respectively provided corresponding to the plurality of coils and arranged in a circumferential direction; a plurality of AC wirings that electrically connect the plurality of coils to the plurality of power modules; and a plurality of drive circuit substrates that are respectively provided corresponding to the plurality of power modules and on which drive circuits that drive the plurality of power modules are mounted, and when viewed from the axial direction When observed, the multiple driving circuit substrates are respectively formed so that the circumferential length becomes smaller as it moves radially inward, and the driving circuit has: a first electronic processing part of a low-voltage system, which has a first electronic component and a first wiring pattern connected to the first electronic component; and a second electronic processing part of a high-voltage system, which has a second electronic component and a second wiring pattern connected to the second electronic component, and the potential is higher than that of the low-voltage system. The multiple driving circuit substrates respectively have a first area for installing the first electronic processing part and a second area for installing the second electronic processing part, and the first area is arranged at a position radially inward than the second area.

[0012] Effects of the Invention

[0013] According to the present disclosure, it is possible to provide a rotary electric machine unit capable of improving the utilization efficiency of the area of ​​a drive circuit substrate to achieve miniaturization of the drive circuit substrate and improving the productivity of the drive circuit substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a circuit diagram of the rotating electrical machine unit according to the first embodiment.

[0015] Figure 2 This is a perspective view of the rotating electrical machine unit according to the first embodiment.

[0016] Figure 3 It is a cross-sectional view of the rotating electrical machine according to the first embodiment.

[0017] Figure 4 It is a top view of the power conversion device according to the first embodiment.

[0018] Figure 5 This is a plan view of the power conversion device according to the first embodiment, showing a state in which a control circuit board is removed.

[0019] Figure 6 This is a plan view of the capacitor module, AC wiring, and drive circuit board according to the first embodiment.

[0020] Figure 7 yes Figure 6AA line section view.

[0021] Figure 8 This is a plan view of the power module, capacitor module, and AC wiring according to the first embodiment.

[0022] Figure 9A This is a diagram showing an example of the shape of the driving circuit substrate according to the first embodiment.

[0023] Figure 9B This is a diagram showing another example of the shape of the driving circuit substrate according to the first embodiment.

[0024] Figure 9C This is a diagram showing another example of the shape of the driving circuit substrate according to the first embodiment.

[0025] Figure 9D This is a diagram showing another example of the shape of the driving circuit substrate according to the first embodiment.

[0026] Figure 10A This is a plan view of the control circuit board according to the first embodiment.

[0027] Figure 10B This is a bottom view of the control circuit board according to the first embodiment.

[0028] Figure 11A Is used to illustrate Figure 9A The manufacturing diagram of the driving circuit substrate is shown.

[0029] Figure 11B Is used to illustrate Figure 9D The manufacturing diagram of the driving circuit substrate is shown.

[0030] Figure 12 This is a plan view of a capacitor module, AC wiring, a drive circuit board, and a current detection unit according to a second embodiment.

[0031] Figure 13 yes Figure 12 BB line cross-sectional view.

[0032] Figure 14 This is a plan view of a capacitor module, AC wiring, a drive circuit substrate, and a current detection unit according to a modification of the second embodiment.

[0033] Figure 15 This is a plan view of a capacitor module, AC wiring, a drive circuit board, and a current detection unit according to a third embodiment.

[0034] Figure 16 yes Figure 15 CC line cross-sectional view.

[0035] Figure 17This is a plan view of a capacitor module, AC wiring, a drive circuit substrate, and a current detection unit according to a modification of the third embodiment.

[0036] Figure 18 This is a plan view of a capacitor module, AC wiring, a drive circuit board, and a current detection unit according to a fourth embodiment. DETAILED DESCRIPTION

[0037] Implementation method 1.

[0038] Hereinafter, a rotary electric machine unit 1 according to an embodiment will be described with reference to the drawings.

[0039] First, refer to Figure 1 , the circuit structure (electrical structure) of the rotating electrical machine unit 1 will be described. Figure 1 1 is a circuit diagram of the rotating electrical machine unit 1 according to the present embodiment.

[0040] The rotating electrical machine unit 1 includes a rotating electrical machine 2 and a power conversion device 3. The rotating electrical machine unit 1 is mounted on a vehicle such as an electric vehicle, for example.

[0041] DC power is input to the power converter 3 from an onboard battery E (DC power supply) mounted on the vehicle. The onboard battery E is, for example, a lithium-ion battery with an output voltage ranging from several tens to several hundred volts. The power converter 3 converts the DC power output from the onboard battery E into AC power and supplies it to the rotating electrical machine 2. The AC power supplied from the power converter 3 causes the rotating electrical machine 2 to rotate, driving the vehicle.

[0042] In this embodiment, the rotating electrical machine 2 is a double three-phase motor having two sets of three-phase windings (three-phase coils). The double three-phase refers to the U1 phase, V1 phase, W1 phase, U2 phase, V2 phase, and W2 phase. The rotating electrical machine 2 includes a plurality of coils 25 (six in this embodiment). The six coils 25 are provided corresponding to each phase of the double three-phase (U1 phase, V1 phase, W1 phase, U2 phase, V2 phase, and W2 phase).

[0043] The power converter 3 is a dual three-phase power converter equipped with an inverter circuit comprising two sets of three-phase AC full-bridge circuits. The power converter 3 includes a plurality (six in this embodiment) of power modules 5 constituting a power converter 50, an input capacitor 6, a drive circuit 7, a control circuit 8, a power supply circuit 9, and a plurality (six in this embodiment) of current detectors 10.

[0044] Input capacitor 6 is provided on the input side of power converter 50. Input capacitor 6 is a smoothing capacitor that stabilizes the voltage supplied from vehicle-mounted battery E, preventing it from fluctuating significantly. Input capacitor 6 includes multiple capacitor elements 6a connected in parallel. Input capacitor 6 is, for example, an aluminum electrolytic capacitor, a film capacitor, a ceramic capacitor, or an electric double-layer capacitor.

[0045] Six power modules 5 are provided corresponding to each of the two three-phase circuits (U1, V1, W1, U2, V2, and W2). The three power modules 5 corresponding to the U1, V1, and W1 phases form a first three-phase AC full-bridge circuit, while the three power modules 5 corresponding to the U2, V2, and W2 phases form a second three-phase AC full-bridge circuit.

[0046] Each power module 5 includes a pair of switching elements 5a and 5b. The switching elements 5a and 5b are, for example, IGBTs (Insulated Gate Bipolar Transistors) or MOSFETs (Metal Oxide Semiconductor Field Effect Transistors). The switching elements 5a and 5b are connected in series. The switching element 5a is the upper arm-side switching element connected to the positive electrode of the onboard battery E. The switching element 5b is the lower arm-side switching element connected to the negative electrode of the onboard battery E. The connection point between the switching elements 5a and 5b is electrically connected to the coil 25 of the corresponding phase of the rotating electrical machine 2.

[0047] like Figure 1 As shown, each power module 5 may also include a diode 5c connected in parallel with the switching element 5a and a diode 5d connected in parallel with the switching element 5b. In this case, the cathode of the diode 5c is connected to the high-potential terminal of the switching element 5a, and the anode of the diode 5c is connected to the low-potential terminal of the switching element 5a. The cathode of the diode 5d is connected to the high-potential terminal of the switching element 5b, and the anode of the diode 5d is connected to the low-potential terminal of the switching element 5b.

[0048] The power conversion unit 50 converts DC power output from the onboard battery E into AC power by switching the switching elements 5a and 5b between on and off. The converted AC power is supplied to the rotating electric machine 2. Furthermore, the power conversion unit 50 rectifies AC power generated in the rotating electric machine 2 through regenerative braking and other processes, converting it into DC power. The converted DC power is smoothed by the input capacitor 6 and stored in the onboard battery E.

[0049] Six current detection units 10 are provided corresponding to each of the two three-phase circuits (U1, V1, W1, U2, V2, and W2). In each phase, the current detection unit 10 detects the current flowing from the power module 5 to the coil 25. The detection results of the current detection unit 10 are output to the control circuit 8.

[0050] The drive circuit 7 and control circuit 8 drive and control the multiple power modules 5 so that the rotating electrical machine 2 is driven at a current, rotational speed, and torque based on control commands from an external control device mounted on a vehicle or the like. Furthermore, the drive circuit 7 and control circuit 8 control the rotating electrical machine 2 so that if an abnormality such as damage occurs in the rotating electrical machine 2, driving the power modules 5 and stopping the power supply to the power modules 5 are immediately stopped in a safe manner. The power supply circuit 9 supplies operating power (electrical power) to the drive circuit 7 and control circuit 8.

[0051] The power supply circuit 9 generates the power supply voltage required for the operation of the drive circuit 7 and the control circuit 8. The power supply voltage generated by the power supply circuit 9 is lower than the voltage of the DC power supplied from the vehicle battery E. The power supply circuit 9 is composed of, for example, a power supply IC (Integrated Circuit) 91 and a power supply IC peripheral component section 92. The power supply IC 91 generates signals for operating the power supply circuit 9. The power supply IC peripheral component section 92 is used to enable the power supply IC 91 to perform the desired operation. The power supply IC peripheral component section 92 includes, for example, an inductor for step-up and step-down operation, a transformer, a protection diode, a capacitor, a switching element and a digital IC for control and protection, and resistors.

[0052] The control circuit 8 operates using the power supply voltage generated by the power supply circuit 9. The control circuit 8 controls the drive circuit 7. The control circuit 8 comprises, for example, a microcontroller (microcomputer) 81, microcomputer peripheral components 82, and a control circuit connector 83. The control circuit 8 may also include a protection circuit for electrically isolating the power module 5 from the rotating electric machine 2. The control circuit 8 may also include a communication IC and peripheral components for the communication IC for communicating with the vehicle.

[0053] The detection result of the current detection unit 10 is input to the control circuit 8. The control circuit 8 may also receive detection results from various sensors such as a rotation sensor 26 of the rotating electrical machine 2 and a temperature sensor provided in the power module 5, which will be described later.

[0054] The microcontroller 81 generates a control signal for controlling the drive circuit 7 based on a control command from an external control device and a detection result of the current detection unit 10 , and outputs the control signal to the drive circuit 7 .

[0055] The microcomputer peripheral component section 82 is used to make the microcontroller 81 perform desired operations. The microcomputer peripheral component section 82 includes, for example, an inductor for step-up and step-down operation, a transformer, a diode for protection, a capacitor, a switching element and a digital IC for control and protection, and a resistor.

[0056] The control circuit connector 83 is used to electrically connect the drive circuit 7 and the control circuit 8 .

[0057] The drive circuit 7 operates using the power supply voltage generated by the power supply circuit 9. The drive circuit 7 drives the multiple power modules 5. Specifically, the drive circuit 7 drives the switching elements 5a and 5b to switch the states of the switching elements 5a and 5b between the on and off states. The drive circuit 7 is composed of a drive control IC (Integrated Circuit) 71, a drive control IC peripheral component unit 72, a gate resistor unit 73, and a drive circuit connector 74.

[0058] A control signal generated by the microcontroller 81 is input to the drive control IC 71 . Based on the control signal generated by the microcontroller 81 , the drive control IC 71 generates a drive signal for driving the power module 5 and outputs the drive signal to the power module 5 .

[0059] The drive control IC peripheral component section 72 is used to make the drive control IC 71 perform desired operations. The drive control IC peripheral component section 72 includes, for example, a protective diode, a capacitor, a switching element and a digital IC for control / protection, and a resistor.

[0060] The gate resistor 73 is located between the drive control IC 71 and the power module 5. It is located close to the power module 5. The gate resistor 73 is used to characterize the behavior of the switching elements 5a and 5b when switching between the on and off states. The gate resistor 73 includes a gate resistor and a diode connected to the gates of the switching elements 5a and 5b.

[0061] The drive circuit connector 74 is used to electrically connect the drive circuit 7 and the control circuit 8. The drive circuit connector 74 is connected to the control circuit connector 83.

[0062] From the perspective of electrical potential, the power conversion device 3 is divided into a high-voltage system, which represents the potential of the main circuit, the circuit that generates the power for driving the rotating electrical machine 2, and a low-voltage system, which represents the potential of the control unit that controls the main circuit. The main circuit includes, for example, the power conversion unit 50, the gate resistor unit 73, and the input capacitor 6. The high-voltage system is insulated from the low-voltage system.

[0063] The control circuit 8 is a low-voltage system.

[0064] The drive circuit 7 serves as an interface between the low-voltage and high-voltage systems. Specifically, the input side of the drive circuit 7 is the low-voltage system, and the output side of the drive circuit 7 is the high-voltage system. The drive circuit 7 is integrated with an insulating unit to insulate the low-voltage system from the high-voltage system. For example, the insulating unit is a pulse transformer or an optical coupler.

[0065] Next, refer to Figures 2 to 10B , the structure of the rotating electrical machine unit 1 will be described.

[0066] In this specification, the axis O (refer to Figure 3 ) is called the "axial direction." In addition, the direction intersecting the axis O of the rotor 22 when viewed from the axial direction is called the "radial direction," and the direction of rotation around the axis O of the rotor 22 is called the "circumferential direction."

[0067] Figure 2 1 is a perspective view of the rotating motor unit 1. Figure 2 As shown, the rotating electrical machine 2 and the power conversion device 3 are arranged in the axial direction. In the axial direction, the side where the power conversion device 3 is located is called the upper side, and the side where the rotating electrical machine 2 is located is called the lower side.

[0068] Figure 3 2 is a cross-sectional view of the rotating electrical machine 2. Figure 3 As shown, the rotary electric machine 2 includes a stator 21 , a rotor 22 , a rotary shaft 23 , a housing 24 , a plurality of coils 25 , and a rotation sensor 26 .

[0069] The stator 21 is annular and is provided so as to surround the outer circumference of the rotor 22. The stator 21 is fixed to the housing 24.

[0070] The rotor 22 is provided inside the stator 21. The rotor 22 is rotatable around the axis O relative to the stator 21.

[0071] A rotating shaft 23 is disposed at the center of the rotor 22. A lower end portion of the rotating shaft 23 serves as an output end for transmitting the rotation of the rotor 22 to a vehicle or the like.

[0072] The housing 24 houses the stator 21, rotor 22, and rotating shaft 23. The upper end of the rotating shaft 23 is inserted through the top of the housing 24. A first bearing 27a is mounted on the top of the housing 24 to rotatably support the upper end of the rotating shaft 23. The lower end of the rotating shaft 23 is inserted through the bottom of the housing 24. A second bearing 27b is mounted on the bottom of the housing 24 to rotatably support the lower end of the rotating shaft 23.

[0073] The coils 25 are wound around the stator 21. The ends of the coils 25 extend axially upward (i.e., toward the power converter 3) through the top of the housing 24. The ends of the coils 25 of each phase form connection portions 25a that are electrically connected to the power modules 5 of the corresponding phase via the AC wiring 11 described later.

[0074] Rotation sensor 26 is attached to the upper end of rotating shaft 23. Rotation sensor 26 detects the rotation angle of rotating shaft 23. Rotation sensor 26 is, for example, a resolver. Alternatively, rotation sensor 26 may be a sensor using another detection method, such as a magnetoresistive element or a Hall effect element. The detection results of rotation sensor 26 are output to control circuit 8.

[0075] The power conversion device 3 includes multiple power modules 5, multiple (six in this embodiment) capacitor modules 61 that constitute the input capacitor 6, multiple (six in this embodiment) AC wirings 11, multiple (six in this embodiment) drive circuit boards 12, a control circuit board 13, a cooler 14, a base 15, and a fixing member 16. The multiple capacitor modules 61 are provided corresponding to the multiple power modules 5. The capacitor modules 61 are provided in parallel with the power modules 5. The multiple AC wirings 11 are provided corresponding to the multiple power modules 5. The multiple drive circuit boards 12 are provided corresponding to the multiple power modules 5. The number of the multiple drive circuit boards 12 is equal to the number of phases of the stator 21.

[0076] like Figure 2 As shown, the power converter 3 is covered from above by an upper cover 17. This ensures insulation between various components constituting the power converter 3 and components mounted around the rotating electrical machine unit 1, preventing foreign matter from entering the rotating electrical machine unit 1 from outside.

[0077] Figure 4 It is a top view of the power conversion device 3 . Figure 5 It is a plan view of the power conversion device 3 , showing a state in which the control circuit board 13 is removed. Figure 6 It is a plan view of the capacitor module 61 , the AC wiring 11 , and the drive circuit board 12 . Figure 7 yes Figure 6 AA line section view. Figure 8 It is a plan view of the power module 5 , the capacitor module 61 , and the AC wiring 11 . Figures 9A to 9D 1 is a diagram showing an example of the shape of the driving circuit board 12 . Figure 10A is a top view of the control circuit substrate 13, Figure 10B It is a bottom view of the control circuit board 13 .

[0078] The base 15 has a cylindrical shape and is fixed to the top of the housing 24. A plurality of capacitor modules 61 and the cooler 14 are fixed to the upper surface of the base 15.

[0079] The cooler 14 has a cylindrical shape. When viewed from the axial direction, the cooler 14 is a circle centered on the axis O. Figure 7 As shown, the power module 5 is mounted on the mounting surface 14a of the cooler 14. The power module 5 is bonded to the mounting surface 14a of the cooler 14 by welding, for example. The cooler 14 and the power module 5 are thermally coupled. Furthermore, the drive circuit board 12 is provided above the power module 5. The power module 5 and the drive circuit board 12 are arranged separately from each other.

[0080] The cooler 14 cools the power module 5. A refrigerant flow path (not shown) through which refrigerant flows is formed in the cooler 14. A supply port 14c (see FIG. 1 ) is provided in the cooler 14 to communicate with the refrigerant flow path and to supply refrigerant from the outside. Figure 2 ). When viewed from the axial direction, the refrigerant flow path is formed so as to overlap with the power module 5. In addition, cooling fins for improving the heat transfer rate may be provided in the refrigerant flow path.

[0081] The cooler 14 is provided with a base portion 14b protruding upward from the mounting surface 14a. The drive circuit substrate 12 and the control circuit substrate 13 are fixed to the base portion 14b by a fixing member 16. The fixing member 16 is, for example, a screw, a rivet, or a pin. A fastening hole for fastening the fixing member 16 is formed in the base portion 14b. For example, when the fixing member 16 is a screw, the fastening hole is a threaded hole for screwing the fixing member 16. The base portion 14b can also be formed by cutting out from the cooler 14. A structure corresponding to the base portion 14b can also be formed in the casting mold used to manufacture the cooler 14.

[0082] like Figure 4 As shown in FIG. 1 , a plurality of capacitor modules 61 are arranged at equal intervals in the circumferential direction. The capacitor modules 61 are arranged radially outward of the drive circuit board 12 (ie, the power module 5). Each capacitor module 61 has one or more capacitor elements 6a (see FIG. 1 ). Figure 1 In this embodiment, the capacitor module 61 has a rectangular shape when viewed from the axial direction. Alternatively, the capacitor module 61 may have an arc shape along the outer circumference of the cooler 14 when viewed from the axial direction.

[0083] The plurality of power modules 5 are arranged at equal intervals in the circumferential direction. Figure 8 As shown, each power module 5 includes a main body 51 , an input terminal 52 , an output terminal 53 , a signal terminal 54 a on the upper arm side, and a signal terminal 54 b on the lower arm side.

[0084] The main body 51 includes switch elements 5a, 5b (see Figure 1 ). When viewed from the axial direction, the main body portion 51 has a rectangular shape.

[0085] The input terminal 52 is arranged to extend radially outward from the main body 51. The input terminal 52 is connected to the capacitor module 61. The input terminal 52 is fixed to the terminal of the capacitor module 61 using screws, for example. The input terminal 52 may also be joined to the terminal of the capacitor module 61 by welding.

[0086] The output terminal 53 is arranged to extend radially inward from the main body 51 . The output terminal 53 is connected to the AC wiring 11 .

[0087] The signal terminal 54a on the upper arm side is configured to extend from the main body 51 to one side in the circumferential direction. The signal terminal 54b on the lower arm side is configured to extend from the main body 51 to the other side in the circumferential direction. Thereafter, the signal terminals 54a and 54b extend upward in the axial direction and are connected to the drive circuit substrate 12. The signal terminal 54a on the upper arm side is connected to the switching element 5a. The signal terminal 54b on the lower arm side is connected to the switching element 5b. The signal terminals 54a and 54b become the conduction path of the drive signal from the drive circuit 7 (i.e., the drive signal generated by the drive control IC 71). The drive signal from the drive circuit 7 is input to the switching elements 5a and 5b respectively through the signal terminals 54a and 54b.

[0088] Furthermore, the arrangement of the input terminal 52, the output terminal 53, and the signal terminals 54a and 54b is not limited to that described above. The output terminal 53 may also be arranged to extend radially outward from the main body 51. Alternatively, one of the signal terminal 54a and the signal terminal 54b and the input terminal 52 may be arranged to extend from the main body 51 to one circumferential side, while the other of the signal terminal 54a and the signal terminal 54b and the output terminal 53 may be arranged to extend from the main body 51 to the other circumferential side.

[0089] Multiple AC wirings 11 are arranged between the multiple drive circuit boards 12 (multiple power modules 5). The multiple AC wirings 11 are arranged at equal intervals in the circumferential direction. The multiple AC wirings 11 electrically connect the multiple coils 25 to the multiple power modules 5. Due to the large current flowing through the AC wirings 11, the AC wirings 11 are prone to high temperatures. To improve the heat dissipation of the AC wirings 11, the AC wirings 11 are preferably constructed from busbars or wire harnesses with large cross-sectional areas, for example.

[0090] The first end of the AC wiring 11 is electrically and mechanically connected to the output terminal 53 of the power module 5, for example, by welding. The second end of the AC wiring 11 is electrically and mechanically connected to the connection portion 25a by TIG welding, laser welding, or the like. The AC wiring 11 extends radially outward from the first end connected to the output terminal 53, and the second end of the AC wiring 11 is positioned radially outward from the cooler 14.

[0091] The AC wiring 11 has a portion that does not overlap with the drive circuit board 12 when viewed from the axial direction. In the present embodiment, the entire AC wiring 11 extends so as not to overlap with the drive circuit board 12.

[0092] like Figure 5 As shown, multiple drive circuit substrates 12 are arranged at equal intervals in the circumferential direction. Drive circuit 7 is mounted on the drive circuit substrates 12. The drive circuit substrates 12 are single-layer or multi-layer printed circuit boards. Examples of printed circuit boards include phenolic paper substrates, epoxy paper substrates, epoxy glass substrates, ceramic substrates, and composite substrates.

[0093] like Figure 5 and Figure 9A As shown in FIG. 1 , in this embodiment, the driving circuit substrate 12 is trapezoidal. The driving circuit substrate 12 has a long side S3 and a short side S4 that are parallel to each other, and a pair of opposite sides S1 and S2 that connect the long side S3 and the short side S4 and are not parallel to each other. Figure 5 As shown, the drive circuit substrate 12 is configured with its long side S3 facing radially outward and its short side S4 facing radially inward. In other words, the drive circuit substrate 12 is configured so that its pair of opposing sides S1 and S2 approach each other as they move radially inward. The line connecting the midpoint of the long side S3 and the midpoint of the short side S4 is referred to as the center line of the drive circuit substrate 12. The drive circuit substrate 12 is configured so that the direction in which the center line extends coincides with the radial direction. The drive circuit substrate 12 is preferably line-symmetrical about the center line (i.e., an isosceles trapezoid).

[0094] In addition, if Figure 9B As shown in FIG. 1 , the driving circuit substrate 12 may also be triangular. In this case, the driving circuit substrate 12 is configured such that a pair of opposing sides S1 and S2 approach each other as they go radially inward. Figure 9C As shown, a chamfered portion 12 c may be formed on the top of the driving circuit substrate 12 .

[0095] The driving circuit board 12 only needs to be formed so that its circumferential length decreases toward the radially inner side when viewed from the axial direction.

[0096] exist Figures 9A to 9C In the embodiment, when viewed from the axial direction, the drive circuit substrate 12 is formed so that the length in the circumferential direction gradually decreases as it goes toward the radial inner side. Figure 9D As shown in FIG. 1 , when viewed from the axial direction, the drive circuit substrate 12 may be formed so that its circumferential length decreases in a step-like manner as it moves radially inward. In other words, the drive circuit substrate 12 may be convex. Figure 9D In the example, the pair of opposing sides S1 and S2 are bent in a step-like manner at the central portion in the radial direction. The pair of opposing sides S1 and S2 may also be bent in multiple stages.

[0097] like Figure 6As shown, electronic components such as a drive control IC 71, a drive control IC peripheral component unit 72, a gate resistor unit 73, and a drive circuit connector 74 are mounted on the drive circuit substrate 12. Furthermore, solder pads for mounting these electronic components are formed on the drive circuit substrate 12. A wiring pattern for electrically connecting these electronic components is formed on the drive circuit substrate 12. The solder pads and wiring pattern are made of, for example, copper or a copper alloy. Furthermore, a plurality of connection through-holes 12a are formed on the drive circuit substrate 12, through which the signal terminals 54a and 54b of the power module 5 are inserted. The signal terminals 54a and 54b are connected to the inner surfaces of the connection through-holes 12a. The signal terminals 54a and 54b are joined to the inner surfaces of the connection through-holes 12a, for example, by soldering.

[0098] The multiple drive circuit substrates 12 have the same shape. The electronic components, wiring patterns, and connection through-holes 12a are arranged identically on the multiple drive circuit substrates 12. When viewing the power conversion device 3 as a whole, the multiple drive control ICs 71, the multiple drive control IC peripheral components 72, the multiple gate resistors 73, and the multiple drive circuit connectors 74 are provided corresponding to the multiple power modules 5, respectively.

[0099] As described above, the drive circuit 7 becomes the interface between the two potentials of the low-voltage system and the high-voltage system. In other words, the drive circuit 7 has a first electronic processing unit E1 for the low-voltage system and a second electronic processing unit E2 for the high-voltage system. Specifically, in the drive circuit 7, the first electronic processing unit E1 includes a drive circuit connector 74 (the first electronic component of the low-voltage system), a drive control IC peripheral component unit 72 (the first electronic component of the low-voltage system), and the low-voltage side (input terminal side) of the drive control IC 71, as well as a first wiring pattern connected thereto. The first electronic processing unit E1 is set to the same reference potential as the control circuit 8 system. In the drive circuit 7, the second electronic processing unit E2 includes the high-voltage side (output terminal side) of the drive control IC 71, a gate resistor unit 73 (the second electronic component of the high-voltage system), a connection through-hole 12a, and a second wiring pattern connected thereto. The second electronic processing unit E2 is set to the same reference potential as the main circuit system.

[0100] like Figure 6 As shown, the driver circuit board 12 has a first region R1, where the first electronic processing unit E1 is mounted, and a second region R2, where the second electronic processing unit E2 is mounted. The first region R1 is positioned radially inward of the second region R2. An insulating region is formed between the first and second regions R1 and R2, where no electronic components other than the driver control IC 71 and wiring patterns are located. The radial dimension of this insulating region is, for example, approximately 2 mm.

[0101] That is, the first region R1 is provided with a drive circuit connector 74, a drive control IC peripheral component portion 72, a low-voltage side of the drive control IC 71, and a first wiring pattern connected thereto. The second region R2 is provided with a high-voltage side of the drive control IC 71, a gate resistor portion 73, a through-hole 12a for connection, and a second wiring pattern connected thereto. In other words, the drive circuit connector 74, the drive control IC peripheral component portion 72, and the low-voltage side of the drive control IC 71 are concentrated radially inward in the drive circuit substrate 12. The high-voltage side of the drive control IC 71, the gate resistor portion 73, and the through-hole 12a for connection are concentrated radially outward in the drive circuit substrate 12. The drive control IC 71 is configured to span the first region R1 and the second region R2. An insulating portion such as an optocoupler may also be provided inside the drive control IC 71.

[0102] exist Figure 6 In the figure, the boundary between the first region R1 and the second region R2 is represented by an imaginary line L1. The boundary between the first region R1 and the second region R2 may be arranged, for example, to pass through the radial center of the drive circuit substrate 12. The arrangement of the boundary between the first region R1 and the second region R2 is not limited thereto and may be arranged radially inward of the radial center of the drive circuit substrate 12 or radially outward of the radial center of the drive circuit substrate 12.

[0103] Here, in the first electronic processing unit E1, the first electronic components and first wiring pattern that constitute the first electronic processing unit E1 can be arranged with a narrower spacing than in the second electronic processing unit E2. For example, when the first electronic processing unit E1 processes signals with a maximum voltage of 24 V relative to the housing reference potential, the first electronic components and first wiring pattern of the first electronic processing unit E1 are spaced at least 0.5 mm apart. On the other hand, in the second electronic processing unit E2, voltages exceeding 24 V may sometimes be applied to the driver circuit board 12 to account for potential fluctuations on the main circuit side. When the second electronic processing unit E2 processes signals with a maximum voltage of 48 V relative to the housing reference potential, the second electronic components and second wiring pattern of the second electronic processing unit E2 are spaced at least 1.2 mm apart. Furthermore, in this case, the first electronic processing unit E1 and the second electronic processing unit E2 are spaced at least 2.4 mm apart.

[0104] The drive circuit substrate 12 is formed so that its circumferential length decreases radially inward when viewed from the axial direction. Therefore, the width (circumferential length) of the drive circuit substrate 12 is narrower in the first region R1 than in the second region R2. By mounting the first electronic processing unit E1, where the spacing between the first electronic component and the first wiring pattern is narrow, in the first region R1, and mounting the second electronic processing unit E2, where the spacing between the second electronic component and the second wiring pattern is wide, in the second region R2, the drive circuit 7 can be efficiently mounted on the drive circuit substrate 12.

[0105] In this embodiment, the capacitor module 61 and the wiring portion 25a, which experience large changes in current and voltage, are positioned radially outward from the cooler 14. The capacitor module 61 and the wiring portion 25a are positioned radially outward from the first electronic processing unit E1 installed in the first region R1. That is, the capacitor module 61 and the wiring portion 25a are configured separately from the first electronic processing unit E1 installed in the first region R1. This prevents the first electronic processing unit E1 from being affected by the conducted noise and radiated noise generated by the capacitor module 61 and the wiring portion 25a. Therefore, it is possible to suppress the occurrence of abnormalities in the drive and control of the power module 5 caused by these conducted noise and radiated noise. In addition, the wiring portion 25a is configured separately from the rotation sensor 26. This prevents the influence of the magnetic field caused by the current passing through the wiring portion 25a, thereby improving the detection accuracy of the rotation sensor 26.

[0106] A fixing through hole 12b for inserting a fixing component 16 is formed in the driving circuit substrate 12. The driving circuit substrate 12 is fixed to the base portion 14b by the fixing component 16. In the present embodiment, the driving circuit substrate 12 is fixed to the cooler 14 using three fixing components 16. One fixing component 16 is provided at the end portion on the radial inner side (i.e., the short side S4 side) of the driving circuit substrate 12. Two fixing components 16 are provided at both circumferential ends of the end portion on the radial outer side (i.e., the long side S3 side) of the driving circuit substrate 12. In addition, the number of fixing components 16 is not limited to three. For example, in addition to the above-mentioned three fixing components 16, a fixing component 16 may also be provided in the radial central portion of the driving circuit substrate 12, or a fixing component 16 may also be provided at the circumferential central portion of the end portion on the radial outer side of the driving circuit substrate 12.

[0107] Alternatively, the potential of cooler 14 may be the case reference potential, and base portion 14b and fixing member 16 may be conductive. Cooler 14 may also be electrically connected to a wiring pattern formed on driver circuit substrate 12. In this case, cooler 14 may be electrically connected to a solid pattern formed on an inner layer of driver circuit substrate 12, or to a first wiring pattern of a low-voltage system formed on the upper or lower surface of driver circuit substrate 12.

[0108] like Figure 4 As shown, the control circuit substrate 13 is arranged above the drive circuit substrate 12. The control circuit substrate 13 is arranged separately from the drive circuit substrate 12. The control circuit substrate 13 is square (rectangular). The midpoint of the control circuit substrate 13 (i.e., the intersection of the diagonals) is arranged on the axis O. The control circuit substrate 13 is a multilayer printed substrate with two or more layers. The control circuit substrate 13 is preferably a printed substrate with four or more layers. In this case, the control circuit substrate 13 preferably has one or more inner layers consisting of a solid pattern electrically connected to the housing reference potential. The solid pattern is provided in a large area other than the through hole for electrically connecting the layers.

[0109] The control circuit board 13 is mounted with the control circuit 8 and the power supply circuit 9. Specifically, electronic components such as the microcontroller 81, the microcomputer peripheral component unit 82, the control circuit connector 83, the power supply IC 91, and the power supply IC peripheral component unit 92 are mounted on the control circuit board 13. Furthermore, pads for mounting these electronic components are formed on the control circuit board 13. Wiring patterns for electrically connecting these electronic components are formed on the control circuit board 13. Sensor circuits, protective circuits, and the like may also be mounted on the control circuit board 13.

[0110] like Figure 10A As shown, a microcontroller 81 and a plurality (six in this embodiment) of microcomputer peripheral components 82 are provided on the upper surface (first surface) 13a of the control circuit board 13. The microcontroller 81 is arranged on the axis O. The plurality of microcomputer peripheral components 82 are provided corresponding to the plurality of power modules 5, respectively. The plurality of microcomputer peripheral components 82 are arranged along the circumferential direction.

[0111] like Figure 10B As shown, multiple control circuit connectors 83, a power supply IC 91, and multiple power supply IC peripheral components 92 are provided on the lower surface (second surface) 13b of the control circuit substrate 13. The power supply IC 91 is arranged on the axis O. The multiple control circuit connectors 83 are provided corresponding to the multiple power modules 5. The multiple control circuit connectors 83 are arranged along the circumference. The multiple power supply IC peripheral components 92 are provided corresponding to the multiple power modules 5. The multiple power supply IC peripheral components 92 are arranged along the circumference.

[0112] Alternatively, the power IC 91 and the plurality of power IC peripheral components 92 may be provided on the upper surface 13 a , and the microcontroller 81 and the plurality of microcomputer peripheral components 82 may be provided on the lower surface 13 b .

[0113] The microcontroller 81 and the power IC 91 are arranged so as to overlap in the axial direction. Preferably, a solid pattern formed on the inner layer of the control circuit board 13 is arranged between the microcontroller 81 and the power IC 91 .

[0114] The control circuit connector 83 is arranged so as to overlap the drive circuit connector 74 in the axial direction. The control circuit connector 83 is connected to the drive circuit connector 74. This electrically connects the control circuit board 13 to the drive circuit board 12. Furthermore, the control circuit connector 83 and the drive circuit connector 74 are preferably electrically connected on each board via a wiring cable or pins of equal length.

[0115] To prevent contact between the control circuit board 13 and the drive circuit board 12 and to ensure insulation between them, a spacer is preferably provided between them. The drive circuit connector 74 attached to the drive circuit board 12 and the control circuit connector 83 attached to the control circuit board 13 can also function as a spacer to ensure separation between the control circuit board 13 and the drive circuit board 12. For example, the control circuit connector 83 can be a male connector having a first resin housing and a plurality of conductive pins disposed within the first housing, while the drive circuit connector 74 can be a female connector having a second resin housing that fits into the first housing and a plurality of sockets disposed within the second housing that are connected to the conductive pins. In this case, the control circuit board 13 and the drive circuit board 12 are electrically connected by mating the control circuit connector 83 with the drive circuit connector 74 from above. Furthermore, the abutment between the first and second housings can function as the spacer.

[0116] The microcontroller 81 is arranged on the axis O, and the lengths of the multiple wiring patterns connecting the microcontroller 81 to the multiple control circuit connectors 83 (i.e., the conduction paths for the control signals output from the microcontroller 81 to the drive circuit substrate 12) are equal to each other. Furthermore, the power supply IC 91 is arranged on the axis O, and the lengths of the multiple wiring patterns connecting the power supply IC 91 to the multiple control circuit connectors 83 (i.e., the conduction paths for the power output from the power supply IC 91 to the drive circuit substrate 12) are equal to each other. Furthermore, as described above, the electronic components, wiring patterns, and connection through-holes 12a are arranged identically in the multiple drive circuit substrates 12. That is, the wiring lengths and wiring inductances from the multiple drive circuit substrates 12 to the multiple power modules 5 are equal. As a result, it is possible to suppress deviations in the degree of delay of the control and drive signals between the phases. Therefore, for example, it is possible to prevent current from the power modules 5 of other phases from concentrating on the power module 5 of the phase with the largest degree of delay in the control and drive signals. Furthermore, since a temperature rise of the power module 5 can be suppressed and the size of the cooler 14 for cooling the power module 5 can be reduced, the rotary electric machine unit 1 can be miniaturized.

[0117] Furthermore, in this embodiment, the capacitor module 61 and the connection portion 25a, which experience significant current and voltage fluctuations, are located separately from the control circuit board 13, which is positioned on the axis O. This prevents the control circuit 8 mounted on the control circuit board 13 from being affected by the conducted noise and radiated noise generated by the capacitor module 61 and the connection portion 25a. Consequently, it is possible to suppress the occurrence of abnormalities in the driving and control of the power module 5 caused by these conducted noise and radiated noise. Furthermore, the control circuit board 13 is located separately from the second electronic processing unit E2. This prevents the influence of the switching noise of the power module 5 superimposed on the input signal of the microcontroller 81, thereby improving the accuracy of the detection signals of the current detection unit 10 and the rotation sensor 26.

[0118] The control circuit board 13 is secured to the cooler 14 using a fixing member 16 shared with the drive circuit board 12. The control circuit board 13 has a fixing through-hole 13c formed therein, through which the fixing member 16 is inserted. In this embodiment, the control circuit board 13 is secured to the cooler 14 using the fixing member 16 located at the radially inner end of the drive circuit board 12, among the three fixing members 16 used to secure the drive circuit board 12. Specifically, this fixing member 16 is inserted through the fixing through-hole 13c formed in the control circuit board 13 and the fixing through-hole 12b formed at the radially inner end of the drive circuit board 12, and is then fastened to the fastening holes of the cooler 14.

[0119] The plurality of current detection units 10 detect the current flowing through the plurality of AC wirings 11. In this embodiment, the current detection unit 10 includes a current sensor IC 10a. The current sensor IC 10a is mounted on the control circuit board 13. Figure 10B As shown, the current sensor IC 10 a is provided on the lower surface 13 b of the control circuit board 13 . A plurality of current sensor ICs 10 a are arranged along the circumferential direction. Alternatively, the current sensor IC 10 a may be provided on the upper surface 13 a of the control circuit board 13 .

[0120] like Figure 4 As shown, the current sensor IC 10a is arranged to overlap the AC wiring 11 in the axial direction. The current sensor IC 10a detects changes in the magnetic field caused by changes in the current flowing through the AC wiring 11. For example, the current sensor IC 10a is a Hall element, a magnetoresistive element, or a fluxgate sensor.

[0121] As described above, the rotating electrical machine unit 1 includes: a rotating electrical machine 2 having a stator 21 around which a plurality of coils 25 are wound, and a rotor 22 that rotates relative to the stator 21 about an axis O; and a power conversion device 3 arranged axially alongside the rotating electrical machine 2. The power conversion device 3 includes: a plurality of power modules 5, each provided corresponding to the plurality of coils 25 and arranged circumferentially; a plurality of AC wiring 11, each electrically connecting the plurality of coils 25 to the plurality of power modules 5; and a plurality of drive circuit boards 12, each provided corresponding to the plurality of power modules 5 and equipped with a drive circuit 7 for driving the plurality of power modules 5. When viewed axially, the plurality of drive circuit boards 12 are each formed so that their circumferential length decreases as they move radially inward. The drive circuit 7 includes a low-voltage first electronic processing unit E1, which includes first electronic components (e.g., the driver control IC peripheral component unit 72 and the drive circuit connector 74) and a first wiring pattern connected to the first electronic components; and a high-voltage second electronic processing unit E2, which includes second electronic components (e.g., the gate resistor unit 73) and a second wiring pattern connected to the second electronic components, and has a higher potential than the low-voltage system. Each of the multiple drive circuit substrates 12 includes a first region R1 for mounting the first electronic processing unit E1 and a second region R2 for mounting the second electronic processing unit E2. The first region R1 is positioned radially inward of the second region R2.

[0122] When a single driver circuit substrate is used, the area of ​​the driver circuit substrate where the driver circuit is not mounted is large, such as the portion between multiple power modules, resulting in low area utilization efficiency of the driver circuit substrate. In this embodiment, multiple driver circuit substrates 12 are provided corresponding to the multiple power modules 5, respectively. Therefore, compared to the case of using a single driver circuit substrate, the area of ​​the driver circuit substrate 12 where the driver circuit 7 is not mounted can be reduced. This improves the area utilization efficiency of the driver circuit substrate 12 and enables miniaturization of the driver circuit substrate 12.

[0123] Furthermore, by concentrating the first electronic processing unit E1 in the first region R1 and the second electronic processing unit E2 in the second region R2 , the drive circuit 7 can be efficiently mounted on the drive circuit substrate 12 , further improving the area utilization efficiency of the drive circuit substrate 12 .

[0124] The drive circuit substrate 12 is formed so that its circumferential length decreases radially inward. Therefore, the first region R1 is narrower than the second region R2 in terms of the circumferential length of the drive circuit substrate 12. By mounting the first electronic processing unit E1, where the spacing between the first electronic component and the first wiring pattern is narrow, in the first region R1, and mounting the second electronic processing unit E2, where the spacing between the second electronic component and the second wiring pattern is wide, in the second region R2, the drive circuit 7 can be mounted on the drive circuit substrate 12 more efficiently.

[0125] Furthermore, since the plurality of drive circuit boards 12 are each formed so that their circumferential length decreases as they move radially inward, the plurality of drive circuit boards 12 can be efficiently arranged circumferentially, compared to, for example, a case where the drive circuit boards are rectangular. Consequently, the entire rotary electric machine unit 1 can be miniaturized.

[0126] Furthermore, the closer the power module 5 and the drive circuit board 12 are arranged to the axis O, the more compact the entire rotating electrical machine unit 1 can be.

[0127] Furthermore, since the plurality of drive circuit boards 12 are each formed so that their circumferential length decreases as they move radially inward, the number of locations for securing the drive circuit boards 12 can be reduced compared to, for example, a case where the drive circuit boards are rectangular. For example, while a rectangular drive circuit board requires securing at least four locations, a trapezoidal or triangular drive circuit board 12 only requires securing at at least three locations.

[0128] Furthermore, for example, if the driver circuit substrate is rectangular, it is difficult to distinguish between the radially inner and outer portions of the driver circuit substrate, potentially leading to incorrect placement of the driver circuit substrate. To prevent such errors, it is also conceivable to provide a positioning structure on the driver circuit substrate, but this increases manufacturing costs. In this embodiment, since the driver circuit substrate 12 is formed so that its circumferential length decreases toward the radial inner side, it is easy to distinguish between the radially inner and outer portions of the driver circuit substrate 12, allowing for reliable placement of the driver circuit substrate 12.

[0129] Figure 11A Is used to illustrate Figure 9A FIG. 1 is a diagram showing the manufacturing process of the driving circuit substrate 12 . Figure 11B Is used to illustrate Figure 9D The driving circuit substrate 12 is manufactured by cutting the driving circuit substrate 12 from the base substrate. Figure 11AAs shown in FIG11B and FIG11B , when the driver circuit substrate 12 is formed so that its circumferential length decreases as it moves radially inward, the driver circuit substrate 12 can be efficiently cut out from the base substrate. Therefore, compared to, for example, the case of manufacturing a circular driver circuit substrate, the yield rate during the manufacture of the driver circuit substrate 12 can be improved, thereby increasing the productivity of the driver circuit substrate 12. Furthermore, since the amount of waste after the driver circuit substrate 12 is cut out of the base substrate can be reduced, the environmental impact can be reduced.

[0130] Furthermore, when using a single driver circuit substrate, if the driver circuit substrate is found to be defective during an operational test after the driver circuit is mounted on the driver circuit substrate, even if the defect is caused by a single defective part, the entire driver circuit substrate must be discarded. In this embodiment, by providing multiple driver circuit substrates 12, only the defective driver circuit substrates 12 can be discarded and replaced, while the remaining driver circuit substrates 12 can be used as products without being discarded. Therefore, compared to using a single driver circuit substrate, the productivity of the driver circuit substrates 12 can be improved, and manufacturing costs can be reduced.

[0131] Furthermore, in this embodiment, the amount of warping of the drive circuit substrate 12 can be reduced compared to a case where a single drive circuit substrate is used. Consequently, poor connection between the power module 5 and the drive circuit substrate 12 (for example, poor connection between the signal terminals 54a, 54b of the power module 5 and the connection through-holes 12a of the drive circuit substrate 12) caused by warping of the drive circuit substrate 12 can be suppressed. Furthermore, if the amount of warping of the drive circuit substrate is large, residual stress generated by warping correction continues to be applied to the drive circuit substrate. Therefore, if external stress is applied to the drive circuit substrate due to vibration of the rotary motor unit, for example, the drive circuit substrate may be damaged. As described above, in this embodiment, the amount of warping of the drive circuit substrate 12 can be reduced, thereby preventing damage to the drive circuit substrate 12 caused by vibration of the rotary motor unit 1, for example.

[0132] The power conversion device 3 also includes a control circuit board 13 that is disposed on the axis O and on which a control circuit 8 that controls the drive circuit 7 is mounted.

[0133] This enables reduction in the radial size of the rotary electric machine unit 1 .

[0134] Furthermore, since the control circuit board 13 is positioned on the axis O, the wiring from the control circuit board 13 to the multiple drive circuit boards 12 can be arranged radially, for example, to provide equal wiring lengths. Consequently, the noise caused by the control processing of the power module 5 affects the drive circuit boards 12 equally across all phases. As a result, noise suppression measures commensurate with the magnitude of the noise impact are no longer necessary, simplifying the noise suppression structure and enabling more effective miniaturization of the rotating electrical machine unit 1.

[0135] Implementation method 2.

[0136] Below, refer to Figure 12 and Figure 13 A rotary electric machine unit 1 according to Embodiment 2 will be described. Components having the same functions and effects as those in Embodiment 1 are denoted by the same reference numerals and their description will be omitted.

[0137] Figure 12 It is a plan view of the capacitor module 61 , the AC wiring 11 , the drive circuit board 12 , and the current detection unit 10 according to the second embodiment. Figure 13 yes Figure 12 BB line cross-sectional view.

[0138] In this embodiment, the current sensor IC 10a is mounted on the driver circuit substrate 12. The current sensor IC 10a is mounted in the first region R1. The current sensor IC 10a is provided on the upper surface of the driver circuit substrate 12. Alternatively, the current sensor IC 10a may be provided on the lower surface of the driver circuit substrate 12. The current sensor IC 10a is preferably surface-mountable on the driver circuit substrate 12 by soldering or other means. The output signal of the current sensor IC 10a is output to the control circuit 8 via the driver circuit connector 74.

[0139] In addition, in this embodiment, the AC wiring 11 has a bent portion 11a that bends toward the drive circuit substrate 12. When viewed from the axial direction, the bent portion 11a is arranged to overlap with the drive circuit substrate 12. The portion of the AC wiring 11 other than the bent portion 11a is arranged not to overlap with the drive circuit substrate 12. Figure 13 As shown, the current sensor IC 10 a is arranged so as to overlap with the bent portion 11 a in the axial direction.

[0140] Figure 14 1 is a plan view of a capacitor module 61 , an AC wiring 11 , a drive circuit board 12 , and a current detection unit 10 according to a modification of the second embodiment.

[0141] like Figure 14As shown, the AC wiring 11 may not have the bent portion 11a, and a portion of the AC wiring 11 extending linearly may overlap the drive circuit board 12 in the axial direction. In this case, the current sensor IC 10a may overlap the portion of the AC wiring 11 in the axial direction.

[0142] As described above, in this embodiment, the plurality of current detection units 10 each include a current sensor IC 10a mounted on a corresponding one of the plurality of drive circuit boards 12. The current sensor IC 10a is arranged to overlap with a corresponding one of the plurality of AC wirings 11 when viewed in the axial direction.

[0143] By mounting the current sensor IC 10a on the driver circuit board 12, the current detection unit 10 can be provided. This reduces the manufacturing cost of the current detection unit 10 and enables miniaturization. Furthermore, the current sensor IC 10a can be positioned close to the corresponding AC wiring 11. This allows the current sensor IC 10a to reliably detect the current flowing through the corresponding AC wiring 11, and the current sensor IC 10a is less susceptible to the effects of currents flowing through other AC wirings 11, thereby improving the signal-to-noise ratio (SN ratio). Furthermore, by mounting the current sensor IC 10a on the driver circuit board 12, the current sensor IC 10a is precisely positioned relative to the AC wiring 11, thereby improving the detection accuracy of the current detection unit 10.

[0144] Implementation method 3.

[0145] Below, refer to Figure 15 and Figure 16 A rotary electric machine unit 1 according to Embodiment 3 will be described. Components having the same functions and effects as those in Embodiment 2 are denoted by the same reference numerals and their description will be omitted.

[0146] Figure 15 1 is a plan view of the capacitor module 61 , the AC wiring 11 , the drive circuit board 12 , and the current detection unit 10 according to the third embodiment. Figure 16 yes Figure 15 CC line cross-sectional view.

[0147] In this embodiment, the current detection unit 10 includes a current sensor IC 10a and a substantially U-shaped magnetic body 10b. In the example shown in the figure, the magnetic body 10b is U-shaped with right angles. Specifically, Figure 16As shown, the magnetic body 10b includes a first magnetic body portion 10b1 disposed above the drive circuit substrate 12, a second magnetic body portion 10b2 disposed below the drive circuit substrate 12, and a third magnetic body portion 10b3 connecting the first magnetic body portion 10b1 and the second magnetic body portion 10b2. The first magnetic body portion 10b1 and the second magnetic body portion 10b2 are disposed so as to sandwich the drive circuit substrate 12 in the axial direction. An opening (magnetic gap) is formed between the first magnetic body portion 10b1 and the second magnetic body portion 10b2. When viewed from the axial direction, the third magnetic body portion 10b3 is disposed outside the drive circuit substrate 12. That is, when viewed from the axial direction, the third magnetic body portion 10b3 is disposed between adjacent drive circuit substrates 12.

[0148] The magnetic body 10b can be composed of a single magnetic body, or it can be composed of three rectangular parallelepiped magnetic body parts corresponding to the first magnetic body part 10b1, the second magnetic body part 10b2, and the third magnetic body part 10b3. The magnetic body 10b can also be composed of a rectangular parallelepiped magnetic body part and an L-shaped magnetic body part. The magnetic body 10b can also be shaped like a C-shaped arc with rounded corners. The magnetic body 10b can also be composed by stacking multiple magnetic plates in the thickness direction. The material of the magnetic body 10b is, for example, an electromagnetic steel plate, a silicon steel plate, an Mn-Zn ferrite core, a Ni-Zn ferrite core, an amorphous core, an iron powder core, or Permalloy.

[0149] A recess 14d for fixing the magnetic body 10b is formed in the cooler 14. The lower portion of the second magnetic body 10b2 is accommodated in the recess 14d. The magnetic body 10b is fixed to the cooler 14 by fixing the second magnetic body 10b2 and the recess 14d with an adhesive.

[0150] As in the second embodiment, the current sensor IC 10a is mounted on the driver circuit board 12. The current sensor IC 10a is provided on the upper surface of the driver circuit board 12. Alternatively, the current sensor IC 10a may be provided on the lower surface of the driver circuit board 12. Furthermore, the AC wiring 11 has a bent portion 11a that curves toward the driver circuit board 12. When viewed from the axial direction, the bent portion 11a is arranged so as to overlap the driver circuit board 12.

[0151] A portion (bent portion 11a) of the AC wiring 11 and the current sensor IC 10a are disposed within the space (i.e., the opening) enclosed by the first magnetic portion 10b1, the second magnetic portion 10b2, and the third magnetic portion 10b3. The current sensor IC 10a is disposed such that its current detection direction is perpendicular to the surface on which the current sensor IC 10a is mounted on the driver circuit board 12.

[0152] In this embodiment, the axial position of the current sensor IC 10a can be adjusted. The current sensor IC 10a is preferably arranged so that the axial position of the current sensor IC 10a coincides with the axial center of the opening. This further improves the detection accuracy of the current detection unit 10.

[0153] Figure 17 1 is a plan view of a capacitor module 61 , an AC wiring 11 , a drive circuit board 12 , and a current detection unit 10 according to a modification of the third embodiment.

[0154] like Figure 17 As shown, the AC wiring 11 may not have the bent portion 11a, and a portion of the AC wiring 11 extending linearly may be arranged so as to overlap the drive circuit board 12 in the axial direction. In this case, the portion of the AC wiring 11 and the current sensor IC 10a are arranged within the space surrounded by the first magnetic portion 10b1, the second magnetic portion 10b2, and the third magnetic portion 10b3.

[0155] As described above, in this embodiment, each of the multiple current detection units 10 further includes a magnetic body 10b. Each magnetic body 10b includes a first magnetic portion 10b1 and a second magnetic portion 10b2, which are arranged axially to sandwich a corresponding one of the multiple drive circuit boards 12, and a third magnetic portion 10b3 connecting the first magnetic portion 10b1 and the second magnetic portion 10b2. When viewed axially, the third magnetic portion 10b3 is arranged outside the corresponding drive circuit board 12. The current sensor IC 10a and the corresponding AC wiring 11 are arranged within the space enclosed by the first magnetic portion 10b1, the second magnetic portion 10b2, and the third magnetic portion 10b3 of the magnetic body 10b.

[0156] By providing the magnetic body 10b, the detection accuracy of the current detection unit 10 can be further improved. Furthermore, when using a single drive circuit substrate, the magnetic body needs to be arranged, for example, below the drive circuit substrate. In this case, the axial dimension of the rotating motor unit increases. In this embodiment, the gap between adjacent drive circuit substrates 12 can be utilized to provide the magnetic body 10b. Therefore, compared to the case of using a single drive circuit substrate, the axial dimension of the rotating motor unit 1 can be reduced. Furthermore, compared to the case of using a single drive circuit substrate, the axial distance between the drive circuit substrate 12 and the power module 5 can be reduced. As a result, the length of the signal terminals 54a, 54b of the power module 5 connected to the drive circuit substrate 12 can be shortened, thereby reducing the wiring inductance of the signal terminals 54a, 54b, reducing the delay of the drive signal, and reducing overshoot and undershoot.

[0157] Implementation method 4.

[0158] Below, refer to Figure 18 A rotary electric machine unit 1 according to Embodiment 4 will be described. Components having the same functions and effects as those in Embodiments 1, 2, and 3 are denoted by the same reference numerals, and their description will be omitted.

[0159] Figure 18 1 is a plan view of the capacitor module 61 , the AC wiring 11 , the drive circuit board 12 , and the current detection unit 10 according to the fourth embodiment.

[0160] In this embodiment, a low-voltage system protection circuit 75 and a high-voltage system protection circuit 76 are mounted on the drive circuit substrate 12. The low-voltage system protection circuit 75 and the high-voltage system protection circuit 76 have the following function: when an abnormality is detected in the high-voltage system circuit of the power conversion device 3, the low-voltage system protection circuit 75 and the high-voltage system protection circuit 76 have the following function: when an abnormality is detected in the high-voltage system circuit ... of the power conversion device 3, the drive signal of the drive control IC 71 is cut off, thereby stopping the operation of the high-voltage system circuit (for example, the operation of the power module 5).

[0161] The low-voltage system protection circuit 75 protects against overcurrent in the phase current flowing through the AC wiring 11. For example, the low-voltage system protection circuit 75 comprises a comparator 75c, a switching element 75d, a resistor 75a, and a capacitor 75b. The low-voltage system protection circuit 75 is a low-voltage system circuit connected to the first electronic processing unit E1 of the drive circuit 7. The low-voltage system protection circuit 75 is mounted in the first region R1. It is preferably located radially inward within the first region R1.

[0162] The comparator 75c is connected to the current sensor IC10a mounted on the drive circuit substrate 12 and compares the signal voltage output from the current sensor IC10a with the reference voltage. The output signal as the above-mentioned comparison result is input from the comparator 75c to the switching element 75d. According to the output signal from the comparator 75c, the on / off state of the switching element 75d is switched. Specifically, if an overcurrent occurs and the signal voltage output from the current sensor IC10a exceeds the reference voltage, the switching element 75d becomes the on state. The switching element 75d is connected to the input terminal side (low-voltage side) of the drive control IC71. When the switching element 75d becomes the on state, the drive signal output from the drive control IC71 is cut off by the switching element 75d and is not transmitted to the power module 5. The resistor 75a and the capacitor 75b are connected in series or in parallel with the comparator 75c and / or the switching element 75d. In addition, the low-voltage system protection circuit 75 may also include electronic components such as an operational amplifier. The low-voltage system protection circuit 75 may be configured to include a magnetic sensor or the like for detecting overcurrent in addition to the current sensor IC 10 a .

[0163] The high-voltage system protection circuit 76 is a protection circuit for overvoltage of the power module 5. For example, the high-voltage system protection circuit 76 is composed of a voltage detection terminal 76a (detection unit), a voltage dividing resistor 76b, a capacitor 76c, and a terminal of the high-voltage system of the drive control IC 71 (not shown). In addition, the capacitor 76c can also be omitted. The high-voltage system protection circuit 76 is a circuit of the high-voltage system connected to the second electronic processing unit E2 of the drive circuit 7. The high-voltage system protection circuit 76 is installed in the second region R2. The high-voltage system protection circuit 76 is preferably configured at a position away from the first region R1. The high-voltage system protection circuit 76 is preferably configured at a position away from the wiring pattern formed on the drive circuit substrate 12 that connects the drive control IC 71 to the signal terminals 54a and 54b of the power module 5.

[0164] In the illustrated example, the high-voltage system protection circuit 76 is provided separately for the switching element 5a on the upper arm side and the switching element 5b on the lower arm side. In the high-voltage system protection circuit 76 for the switching element 5a on the upper arm side, the voltage detection terminal 76a is one of the signal terminals 54a on the upper arm side of the power module 5 and is electrically connected to the switching element 5a, the input capacitor 6, and the on-board battery E (battery). The voltage-dividing resistor 76b is a resistor for dividing the voltage at the voltage-dividing terminal 76a. The capacitor 76c is provided on the output side of the voltage-dividing resistor 76b and functions as a noise filter. Furthermore, in the high-voltage system protection circuit 76 for the switching element 5b on the lower arm side, the voltage detection terminal 76a is one of the signal terminals 54b on the lower arm side of the power module 5 and is electrically connected to the switching element 5b, the input capacitor 6, and the on-board battery E. In the high-voltage system protection circuit 76 for the switching element 5b, a voltage-dividing resistor 76b and a capacitor 76c are provided, similar to the high-voltage system protection circuit 76 for the switching element 5a. Alternatively, the high-voltage system protection circuit 76 may be provided for only one of the switching element 5 a on the upper arm side and the switching element 5 b on the lower arm side.

[0165] If the signal voltage output by the voltage-dividing resistor 76b and the capacitor 76c exceeds a preset threshold, an overvoltage detection signal is input to the drive control IC 71. For example, a comparator may be provided in the high-voltage system protection circuit 76 to compare the signal voltage output by the voltage-dividing resistor 76b and the capacitor 76c with a reference voltage. When the signal voltage exceeds the reference voltage, an overvoltage detection signal is output from the comparator. In addition, the drive control IC 71 has a function of cutting off the drive signal. When the overvoltage detection signal is input to the high-voltage system terminal of the drive control IC 71, the drive control IC 71 cuts off the drive signal. In addition, the high-voltage system protection circuit 76 may also include a switching element connected to the output terminal side (high-voltage side) of the drive control IC 71, and the overvoltage detection signal is input to the switching element. In this case, when the overvoltage detection signal is input to the switching element, the drive signal is cut off by the switching element. In addition, the high-voltage system protection circuit 76 may also include electronic components such as operational amplifiers.

[0166] In addition, the structure of the protection circuits 75 and 76 is not limited to the above structure. As long as the protection circuits 75 and 76 have the function of cutting off the drive signal of the drive control IC 71 when an abnormality is detected in the circuit of the high-voltage system, they can also have structures other than the above. For example, the protection circuits 75 and 76 can also be configured to have a temperature detection unit that detects the temperature of the power module 5, and cut off the drive signal from the drive control IC 71 when the temperature of the power module 5 exceeds a predetermined threshold. The protection circuits 75 and 76 can also be protection circuits for arm short circuits between the upper arm / lower arm semiconductor elements built into the power module 5. Even in these cases, if it is a protection circuit for a low-voltage system, it is installed in the first region R1, and if it is a protection circuit for a high-voltage system, it is installed in the second region R2.

[0167] In this embodiment, protection circuits 75 and 76 are mounted on the drive circuit substrate 12. This allows the drive control IC 71 to quickly shut off the drive signal and stop the operation of the high-voltage circuit if an abnormality occurs in the high-voltage circuit, thereby preventing damage to the electronic components that make up the power module 5 and the drive circuit 7.

[0168] More specifically, the low-voltage system control circuit 8 typically monitors the status of the high-voltage system circuits and shuts off the drive signal when an abnormality occurs. However, due to factors such as the long wiring from the control circuit 8 to the drive control IC 71 and the time required for signal processing in the microcontroller 81, shutting off the drive signal using the control circuit 8 can sometimes take tens of μs or longer from the time an abnormality is detected to the time the drive signal is shut off.

[0169] When the protection circuits 75 and 76 are mounted on the drive circuit board 12, the wiring length from the protection circuits 75 and 76 to the drive control IC 71 is shortened, and the drive signal can be shut off without passing through the microcontroller 81. Therefore, when the drive signal is shut off using the protection circuits 75 and 76, the time required from detecting an abnormality to stopping the operation of the power module 5 can be shortened to, for example, approximately 0.1 μs to 10 μs.

[0170] Furthermore, the low-voltage system protection circuit 75 is mounted in the first region R1 , and the high-voltage system protection circuit 76 is mounted in the second region R2 .

[0171] More specifically, as described above, the protection circuits 75 and 76 function to halt the operation of the high-voltage circuit by cutting off the drive signal to the driver control IC 71 when an abnormality occurs in the high-voltage circuit. In this case, an abnormality in the high-voltage circuit can cause overcurrent or overvoltage, or rapid fluctuations in current and voltage, which can easily generate noise. If the low-voltage protection circuit 75 is placed close to the high-voltage circuit, this noise could potentially impede its operation. Therefore, by installing the low-voltage protection circuit 75 in the first region R1, the effects of this noise can be reduced, allowing the low-voltage protection circuit 75 to reliably function even when an abnormality occurs in the high-voltage circuit. Furthermore, by placing the low-voltage protection circuit 75 radially inward within the first region R1, noise that could impede its operation can be more effectively suppressed.

[0172] In addition, the high-voltage system protection circuit 76 itself can easily become a noise source. By installing the high-voltage system protection circuit 76 in the second region R2, it is possible to suppress the operation of the first electronic processing unit E1 installed in the first region R1 from being hindered. By arranging the high-voltage system protection circuit 76 in a position away from the first region R1 in the second region R2, it is possible to more effectively suppress the operation of the first electronic processing unit E1 installed in the first region R1 from being hindered. In addition, by arranging the high-voltage system protection circuit 76 in a position away from the wiring pattern formed on the drive circuit substrate 12 that connects the drive control IC 71 to the signal terminals 54a and 54b of the power module 5, it is possible to reduce the impact of the high-voltage system protection circuit 76 on the drive signal of the drive control IC 71. As a result, the power module 5 can be reliably driven and controlled regardless of normal or abnormal conditions.

[0173] As described above, in this embodiment, the low-voltage system protection circuit 75 is installed in the first area R1. The low-voltage system protection circuit 75 is configured to be connected to the first electronic processing unit E1 of the drive circuit 7, and to cut off the drive signal of the drive circuit 7 when an abnormality is detected in the circuit of the high-voltage system of the power conversion device 3.

[0174] According to the above structure, if an abnormality occurs in the high-voltage system circuit, the operation of the high-voltage system circuit can be quickly stopped. In addition, since the low-voltage system protection circuit 75 is installed in the first region R1, it is possible to suppress the operation of the low-voltage system protection circuit 75 from being hindered by noise generated from the high-voltage system circuit during an abnormality.

[0175] In addition, a high-voltage system protection circuit 76 is installed in the second region R2. The high-voltage system protection circuit 76 is connected to the second electronic processing unit E2 of the drive circuit 7. When an abnormality is detected in the circuit of the high-voltage system of the power conversion device 3, the drive signal of the drive circuit 7 is cut off.

[0176] According to the above structure, if an abnormality occurs in the high-voltage system circuit, the operation of the high-voltage system circuit can be quickly stopped. In addition, since the high-voltage system protection circuit 76 is installed in the second region R2, the operation of the first electronic processing unit E1 can be prevented from being hindered by the high-voltage system protection circuit 76.

[0177] In addition, the technical scope of the present disclosure is not limited to the above-described embodiment, and various modifications can be added without departing from the gist of the present disclosure.

[0178] For example, the rotating electrical machine unit 1 may be a single three-phase driving type rotating electrical machine unit. The rotating electrical machine unit 1 may be a multi-phase driving type rotating electrical machine unit with six or more phases.

[0179] In the above embodiment, the control circuit board 13 is arranged above the plurality of drive circuit boards 12. However, the control circuit board 13 may be provided in a housing separate from the housing that houses the drive circuit boards 12 (i.e., the housing composed of the upper cover 17 and the base 15). In this case, the control circuit board 13 and the drive circuit boards 12 are electrically connected using a wiring harness.

[0180] Hereinafter, various aspects of the present disclosure are collectively described as supplementary notes.

[0181] (Note 1)

[0182] A rotating electrical machine unit comprising:

[0183] A rotating electric machine including a stator on which a plurality of coils are wound and a rotor that rotates about an axis relative to the stator; and

[0184] a power conversion device arranged in parallel with the rotating electrical machine in an axial direction along the axis of the rotor;

[0185] The power conversion device comprises:

[0186] a plurality of power modules, which are respectively provided corresponding to the plurality of coils and arranged along a circumferential direction;

[0187] a plurality of AC wirings electrically connecting the plurality of coils and the plurality of power modules, respectively; and

[0188] a plurality of drive circuit substrates, which are provided corresponding to the plurality of power modules, respectively, and on which drive circuits for driving the plurality of power modules are mounted;

[0189] When viewed from the axial direction, the plurality of drive circuit substrates are each formed so that the length in the circumferential direction decreases as it goes radially inward.

[0190] The drive circuit includes: a first electronic processing unit of a low-voltage system having a first electronic component and a first wiring pattern connected to the first electronic component; and a second electronic processing unit of a high-voltage system having a second electronic component and a second wiring pattern connected to the second electronic component, the potential of which is higher than that of the low-voltage system.

[0191] Each of the plurality of drive circuit substrates has a first area for mounting the first electronic processing unit and a second area for mounting the second electronic processing unit.

[0192] The first region is arranged radially inward of the second region.

[0193] (Note 2)

[0194] The rotating electrical machine unit according to Supplementary Note 1, wherein the power conversion device includes a control circuit substrate that is arranged on the axis and on which a control circuit for controlling the drive circuit is mounted.

[0195] (Note 3)

[0196] The rotary electric machine unit according to Supplementary Note 2, wherein a power supply circuit for supplying operating power (electric power) to the drive circuit and the control circuit is mounted on the control circuit substrate.

[0197] (Note 4)

[0198] The rotating electrical machine unit according to any one of Supplementary Notes 1 to 3, wherein:

[0199] The power conversion device further includes a plurality of current detection units for respectively detecting currents output from the plurality of power modules.

[0200] The plurality of current detection units each include a current sensor integrated circuit mounted on a corresponding drive circuit substrate among the plurality of drive circuit substrates.

[0201] The current sensor IC is arranged to overlap with a corresponding AC wiring among the plurality of AC wirings when viewed in the axial direction.

[0202] (Note 5)

[0203] The rotating electrical machine unit according to Supplementary Note 4, wherein:

[0204] Each of the plurality of current detection units further includes a magnetic body, the magnetic body including: a first magnetic body portion and a second magnetic body portion, which are arranged in the axial direction to sandwich corresponding drive circuit substrates among the plurality of drive circuit substrates; and a third magnetic body portion, which connects the first magnetic body portion and the second magnetic body portion.

[0205] When viewed from the axial direction, the third magnetic body is arranged outside the corresponding drive circuit substrate.

[0206] The current sensor IC and the corresponding AC wiring are arranged inside a space surrounded by the first magnetic body portion, the second magnetic body portion, and the third magnetic body portion of the magnetic body.

[0207] (Note 6)

[0208] The rotating electrical machine unit according to any one of Supplementary Notes 1 to 5, wherein:

[0209] A low-voltage system protection circuit is installed in the first area. The low-voltage system protection circuit is connected to the first electronic processing unit of the drive circuit and cuts off the drive signal of the drive circuit when an abnormality is detected in the high-voltage system circuit of the power conversion device.

[0210] (Note 7)

[0211] The rotating electrical machine unit according to any one of Supplementary Notes 1 to 6, wherein:

[0212] A high-voltage system protection circuit is installed in the second area. The high-voltage system protection circuit is connected to the second electronic processing unit of the drive circuit and cuts off the drive signal of the drive circuit when an abnormality is detected in the circuit of the high-voltage system of the power conversion device.

[0213] Label Description

[0214] 1: Rotating motor unit;

[0215] 2: Rotating motor;

[0216] 3: Power conversion device;

[0217] 5: Power module;

[0218] 6: Input capacitor;

[0219] 7: driving circuit;

[0220] 8: Control circuit;

[0221] 9: Power supply circuit;

[0222] 10: Current detection unit;

[0223] 10a: Current sensor IC;

[0224] 10b: magnetic body;

[0225] 10b1: first magnetic body;

[0226] 10b2: second magnetic body;

[0227] 10b3: third magnetic body;

[0228] 11: AC wiring;

[0229] 12: driving circuit substrate;

[0230] 13: Control circuit substrate;

[0231] 21: stator;

[0232] 22: rotor;

[0233] 23: Rotation axis;

[0234] 24: shell;

[0235] 25: coil;

[0236] 25a: connection portion (end of the coil);

[0237] 61: capacitor module;

[0238] 71: drive control IC;

[0239] 72: Driver control IC peripheral component unit (first electronic component);

[0240] 73: Gate resistor (second electronic component);

[0241] 74: drive circuit connector (first electronic component);

[0242] 75: low voltage system protection circuit;

[0243] 76: High voltage system protection circuit;

[0244] 91: Power IC;

[0245] E1: first electronic processing unit;

[0246] E2: Second electronic processing unit;

[0247] R1: first area;

[0248] R2: second region;

[0249] S1, S2: opposite sides;

[0250] O: axis.

Claims

1. A rotating electrical machine unit comprising: A rotating electric machine including a stator on which a plurality of coils are wound and a rotor that rotates about an axis relative to the stator; and a power conversion device arranged in parallel with the rotating electrical machine in an axial direction along the axis of the rotor; The power conversion device comprises: a plurality of power modules, which are respectively provided corresponding to the plurality of coils and arranged along a circumferential direction; a plurality of AC wirings electrically connecting the plurality of coils and the plurality of power modules respectively; as well as a plurality of drive circuit substrates, which are provided corresponding to the plurality of power modules, respectively, and on which drive circuits for driving the plurality of power modules are mounted; When viewed from the axial direction, the plurality of drive circuit substrates are each formed so that the length in the circumferential direction decreases as it goes radially inward. The drive circuit includes: a first electronic processing unit of a low-voltage system including a first electronic component and a first wiring pattern connected to the first electronic component; and a second electronic processing section of the high voltage system having a second electronic component and a second wiring pattern connected to the second electronic component, and having a higher potential than the low voltage system, Each of the plurality of drive circuit substrates has a first area for mounting the first electronic processing unit and a second area for mounting the second electronic processing unit. The first region is arranged radially inward of the second region.

2. The rotating electrical machine unit according to claim 1, wherein The plurality of drive circuit substrates are arranged at equal intervals in the circumferential direction.

3. The rotating electrical machine unit according to claim 1 or 2, wherein: The number of the plurality of drive circuit substrates is equal to the number of phases of the stator.

4. The rotating electrical machine unit according to any one of claims 1 to 3, wherein: The plurality of driving circuit substrates have the same shape as each other.

5. The rotating electrical machine unit according to any one of claims 1 to 4, wherein: A drive control integrated circuit of the drive circuit that generates a drive signal for driving the power module is arranged across the first area and the second area.

6. The rotating electrical machine unit according to any one of claims 1 to 5, wherein: The power conversion device includes a capacitor module that is provided in parallel with the power module and smoothes the DC power. The capacitor module is arranged radially outward of the second region.

7. The rotating electrical machine unit according to any one of claims 1 to 6, wherein: Ends of the plurality of coils are arranged radially outward of the first region.

8. The rotating electrical machine unit according to any one of claims 1 to 7, wherein: The power conversion device includes a control circuit substrate that is arranged on the axis and on which a control circuit for controlling the drive circuit is mounted.

9. The rotary electric machine unit according to claim 8, wherein A power supply circuit for supplying power to the drive circuit and the control circuit is mounted on the control circuit substrate.

10. The rotating electrical machine unit according to claim 9, wherein A power supply integrated circuit that generates a signal for operating the power supply circuit is arranged on the axis.

11. The rotating electrical machine unit according to any one of claims 1 to 10, wherein: The power conversion device further includes a plurality of current detection units for respectively detecting currents output from the plurality of power modules. The plurality of current detection units each include a current sensor integrated circuit mounted on a corresponding drive circuit substrate among the plurality of drive circuit substrates. The current sensor IC is arranged to overlap with a corresponding AC wiring among the plurality of AC wirings when viewed in the axial direction.

12. The rotating electrical machine unit according to claim 11, wherein Each of the plurality of current detection units further includes a magnetic body having a first magnetic body portion and a second magnetic body portion, which are arranged in the axial direction to sandwich a corresponding drive circuit substrate among the plurality of drive circuit substrates; and a third magnetic body portion connecting the first magnetic body portion and the second magnetic body portion, When viewed from the axial direction, the third magnetic body is arranged outside the corresponding drive circuit substrate. The current sensor IC and the corresponding AC wiring are arranged inside a space surrounded by the first magnetic body portion, the second magnetic body portion, and the third magnetic body portion of the magnetic body.

13. The rotating electrical machine unit according to any one of claims 1 to 12, wherein: A low-voltage system protection circuit is installed in the first area. The low-voltage system protection circuit is connected to the first electronic processing unit of the drive circuit and cuts off the drive signal of the drive circuit when an abnormality is detected in the high-voltage system circuit of the power conversion device.

14. The rotating electrical machine unit according to any one of claims 1 to 13, wherein: A high-voltage system protection circuit is installed in the second area. The high-voltage system protection circuit is connected to the second electronic processing unit of the drive circuit and cuts off the drive signal of the drive circuit when an abnormality is detected in the circuit of the high-voltage system of the power conversion device.

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