Cutting method of slicing machine and slicing machine

Abstract

The invention relates to the technical field of silicon rod machining, in particular to a slicing method of a slicing machine and the slicing machine, and the slicing machine comprises at least two main rollers, a plurality of auxiliary rollers and a plurality of auxiliary rollers, the diamond wire is wound between the main rollers, so that the diamond wire forms a wire net between the main rollers, and a silicon rod is positioned on the wire net to be cut; the cutting method comprises the steps that a diamond wire is driven, and a silicon rod is cut by the diamond wire; the main roller is divided into a plurality of areas along the axial direction; the temperature variation of the main roller in unit time is obtained on each area; and based on the temperature variation and a preset threshold value, whether the diamond wire has a wear section or not is judged.

Description

Technical Field

[0001] The present application relates to the technical field of silicon rod processing, and in particular to a cutting method of a slicer and a slicer. Background Art

[0002] In fields such as photovoltaics and semiconductors, slicers are core equipment for cutting hard and brittle materials such as silicon rods into thin slices. Their performance directly determines product precision and production efficiency. As a key executive component of the slicer, the cutting wire has undergone a technological iteration from slurry cutting to diamond wire cutting. Diamond wire achieves material separation by consolidating diamond abrasives on the surface of a metal wire substrate and utilizing the grinding action of high-speed motion. It features high cutting efficiency, minimal kerf loss, and excellent silicon wafer surface quality, making it a mainstream technology.

[0003] In existing technologies, diamond wire is the core executive component of a slicer to achieve efficient cutting. Parameters such as its surface abrasive distribution, wire diameter uniformity, and tensile strength directly determine the silicon wafer cutting accuracy, surface integrity, and production stability. Therefore, its performance testing is of critical significance. Generally, diamond wire testing is mostly carried out after the cutting operation is shut down, and the overall performance is evaluated through offline sampling and analysis. This method requires interrupting the production process and reducing the equipment utilization rate.

[0004] Therefore, the technical problem of the prior art is that diamond wire detection reduces equipment utilization rate. Summary of the Invention

[0005] The present application provides a cutting method of a slicer and a slicer, which avoids the problem of equipment downtime due to diamond wire detection affecting the equipment utilization rate.

[0006] The present application provides a cutting method of a slicer, which adopts the following technical solution: A cutting method for a slicer, applied to a slicer, the slicer comprising: Main rollers, at least two of which are provided; Diamond wires, the diamond wires being wound between the main rollers to form a wire mesh between the main rollers, and the silicon rods being cut on the wire mesh; The cutting method comprises: The diamond wire is driven and the silicon rod is cut by the diamond wire; Dividing the main roller into a plurality of areas along the axial direction; Obtaining the temperature change of the main roller per unit time in each of the regions; Based on the temperature change and a preset threshold, it is determined whether the diamond wire has a worn section.

[0007] Preferably, the “determining whether the diamond wire has a worn segment based on the temperature change and a preset threshold value” includes a first-level determination: In any of the areas, if the temperature change is greater than a preset threshold; Determine if the diamond wire is abnormal.

[0008] As an advantage, a second level of determination is also included: In each of the areas at the same time, if the temperature change is greater than a preset threshold; Determine if the diamond wire has no worn sections.

[0009] As an advantage, a second level of determination is also included: At the same time, if the temperature change in any area is greater than the preset threshold, the temperature change in the remaining areas does not exceed the preset threshold; It is determined that the diamond wire has at least one worn segment.

[0010] As an option, a third level of determination is also included: In the time sequence, the temperature variation in the areas along the main roller direction is greater than the preset threshold value. The wear segment is determined to be transmitted along the main roller direction along with the diamond wire.

[0011] As an example, the area corresponding to the transmission wire mesh portion is defined as the wire mesh area; the area where the wear segment is located is defined as the target area; The slicer also includes a tension assembly, the number of which is the same as the number of zones and is arranged in a one-to-one correspondence, and the tension assembly is transmission-connected to the wire mesh area corresponding to the zone to adjust the tension of the wire mesh area; In the next reciprocating cycle of the diamond wire, when it is determined that the worn section is located in the target area, the tension component corresponding to the target area increases the tension of the corresponding wire mesh area to perform cutting tension compensation.

[0012] Preferably, the tension assembly includes a plurality of tension rollers; a position between the wire mesh area corresponding to the target area and the previous wire mesh area is defined as a first transition area; a position between the wire mesh area corresponding to the target area and the next wire mesh area is defined as a second transition area; The “when determining that the worn section is located in the target area, causing the tension component corresponding to the target area to increase the tension of the corresponding wire mesh area to perform cutting tension compensation” includes: The tension value of the tension roller applied to the corresponding wire mesh area is linearly increased from the reference value to the compensation value along the direction from the first transition area to the second transition area, and linearly decreased from the compensation value to the reference value, so that the tension transitions smoothly.

[0013] Preferably, the tension compensation time range is: Start when the temperature change in the current target area exceeds the preset threshold; and The process ends when the temperature change in the next target area exceeds a preset threshold.

[0014] The present application provides a slicer, which adopts the following technical solution: A slicer, comprising: Main rollers, there are at least two main rollers, and the main rollers are divided into several areas along the axial direction; Diamond wires, the diamond wires being wound between the main rollers to form a wire mesh between the main rollers, and the silicon rods being cut on the wire mesh; A non-contact temperature sensor, wherein the non-contact temperature sensor comprises a plurality of non-contact temperature sensors, each of the non-contact temperature sensors corresponds to the regions one by one, and the non-contact temperature sensor is used to obtain a temperature change in the corresponding region within a unit time.

[0015] As an advantage, it also includes: Tension components, the number of tension components is the same as the number of areas and is arranged in a one-to-one correspondence, and the tension components are transmission-connected to the wire mesh area corresponding to the area to adjust the tension of the wire mesh area.

[0016] In summary, this application includes at least one of the following beneficial technical effects: This application determines whether there is a section of the diamond wire that is more severely worn based on the temperature change of the main roller. It can monitor the status of the diamond wire in real time during the silicon rod slicing process. The monitoring is accurate and will not miss any detections, and there is no need to stop the machine, avoiding the problem of the diamond wire detection stopping and affecting the equipment utilization rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic flow chart of the cutting method described in this application; Figure 2 It is a schematic diagram of the main roller and area in the slicer described in this application; Figure 3 It is a schematic diagram of the coordination of the area and the wire mesh area in the slicer described in this application; Figure 4 It is a schematic diagram of the tension component in the slicer described in this application.

[0018] Description of reference numerals: 100, main roller; 110, area; 200, diamond wire; 210, wire mesh area; 220, first transition area; 230, second transition area; 300, tension assembly; 310, tension roller; 400, non-contact temperature sensor; M, silicon rod. DETAILED DESCRIPTION

[0019] The serial numbers assigned to the components herein, such as "first," "second," etc., are used solely to distinguish the objects being described and do not convey any order or technical meaning. The terms "connection" and "coupling" used in this application, unless otherwise specified, include both direct and indirect connections (couplings). In the description of this application, it should be understood that the terms "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," "counterclockwise," and the like, indicating positions or positional relationships, are based on the positions or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0021] The embodiment of the present application provides a cutting method of a slicer and a slicer, which avoids the problem of the diamond wire 200 being shut down during detection and affecting the equipment utilization rate.

[0022] In order to better understand the above technical solution, the following will be described in detail with reference to the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0023] During the cutting process of photovoltaic and semiconductor silicon ingots M, diamond wire 200 serves as the core cutting tool. The diamond particles attached to its surface are ground at high speed to remove the silicon material. Due to local quality variations that may occur during the manufacturing process of the diamond wire 200 (such as uneven distribution of diamond particles in a certain section or variations in the thickness of the electroplating layer), or due to abnormal local forces during the cutting process (such as instantaneous impact wear caused by hard spots on the silicon ingot M or increased friction caused by local defects in the wire grooves of the main roller 100), the diamond wire 200 may experience abnormal wear in certain sections. This means that the diamond particles in a certain section of the diamond wire 200 are significantly more detached and passivated than in other sections, forming a worn section.

[0024] Diamond wire 200 performance testing (such as abrasive distribution, wire diameter uniformity, and localized wear) often relies on shutting down the cutting process, using offline sampling and analysis to assess overall performance. This method requires interrupting the production process, significantly reducing equipment utilization (the percentage of time the equipment is actually running), severely impacting production efficiency and reducing equipment utilization. Furthermore, traditional testing methods have the following drawbacks: Poor detection timeliness: Offline detection cannot reflect the state changes of the diamond wire 200 in real time during the cutting process. The worn section may continue to cut when it is not detected, resulting in defects such as scratches on the silicon wafer surface and uneven thickness. The compensation method is unreasonable: If the cutting ability of the worn section is restored through global tension compensation, the normal wire segment will be subjected to excessive tension, increasing the risk of wire breakage and damage to the silicon wafer surface. Interference factors are difficult to eliminate: Single temperature monitoring is easily affected by interference such as silicon rod M deflection and coolant abnormalities, making it difficult to distinguish between "local wear" and "normal system fluctuations." Most importantly, the high rate of missed detection of local wear: offline sampling inspection is prone to missing worn sections (only part of the wire segment is inspected), and the reduced cutting ability of the worn section will directly cause fluctuations in silicon wafer quality. Even if the machine is shut down for inspection, random inspection is usually adopted, that is, a local section of the diamond wire 200 is selected for parameter analysis. However, during the high-speed cutting process of the diamond wire 200, the degree of wear of different sections varies significantly, and sections with severe local wear may not be covered by the random inspection. In other words, local wear is extremely hidden. The length of the diamond wire 200 is usually several thousand meters. If "sampling inspection" is used in production (such as randomly intercepting a 10cm wire segment for inspection), if a normal section happens to be selected, the entire diamond wire 200 will be mistakenly judged to be in good condition, resulting in inaccurate performance evaluation of the entire diamond wire 200. The worn section continues to participate in cutting, which in turn causes defects such as scratches on the silicon wafer surface, uneven thickness, and edge collapse. In severe cases, it may even lead to the scrapping of batches of silicon wafers. If local wear is found during the cutting process and the machine is shut down for maintenance, the current silicon rod M cutting process will be interrupted (the cutting cycle of a single silicon rod M is usually 1-2 hours), resulting in reduced equipment utilization and delayed production plans. Especially in large-scale mass production scenarios, a single unplanned shutdown may result in a production capacity loss of tens of thousands of yuan.

[0025] Therefore, it is urgent to propose a cutting method for a slicer, which includes how to detect the local wear of the diamond wire 200 in real time without stopping the machine, and avoid the efficiency loss caused by offline detection; how to accurately distinguish the local wear of the diamond wire 200 from system interference through multi-dimensional judgment logic, and reduce the misjudgment rate; how to realize directional tension compensation for the worn segment, and avoid the influence of global compensation on the normal wire segment, so as to ensure the cutting quality.

[0026] In the present application, it is necessary to understand that during the cutting process of the diamond wire 200, it is necessary to distinguish between the "tolerable wear" and "fatal defects" of the diamond wire 200. Specifically, although the cutting ability of the worn segment decreases, the basic cutting accuracy can still be maintained within a short period of time (such as 1-2 hours to complete the cutting of the current silicon rod M) (controlling defects within the qualified threshold through auxiliary means such as dynamic tension compensation), and there is no need to shut down immediately; after detecting local wear, the system records the position of the worn segment and continues to execute the current cutting task. After the cutting of this batch of silicon rods M is completed, the diamond wire 200 is subjected to targeted maintenance (such as local replacement of the worn segment, replacement of the entire line), which not only avoids the interference of unplanned shutdowns on the production rhythm, but also prevents the silicon wafer quality from being out of control due to long-term operation of the worn segment.

[0027] The present invention aims to solve the problem in the prior art that the diamond wire 200 detection requires shutdown, resulting in low equipment utilization rate, and at the same time solve the technical defects of insufficient local wear detection accuracy and unreasonable compensation method, provide an online detection and dynamic compensation cutting method, realize real-time monitoring of the diamond wire 200 status without shutdown detection; accurately identify the wear segment and eliminate system interference; directionally compensate for the cutting capacity of the wear segment to avoid overload of normal wire segments; improve silicon wafer cutting quality and equipment production efficiency.

[0028] This application proposes a cutting method for a slicer, which is applied to a slicer, such as Figure 1 As shown, the slicer includes a main roller 100 and a diamond wire 200. The diamond wire 200 is wound on the main roller 100 and driven by the main roller 100 to cut the silicon rod M. Specifically, the main roller 100 has at least two; the diamond wire 200 is wound between the main rollers 100 so that the diamond wire 200 forms a wire mesh between the main rollers 100, and the silicon rod M is located on the wire mesh and cut.

[0029] Cutting methods include: The diamond wire 200 is driven and the silicon rod M is cut by the diamond wire 200; The main roller 100 is divided into a plurality of regions 110 along the axial direction; Obtain the temperature change of the main roller 100 per unit time in each area 110; Based on the temperature change amount and a preset threshold, it is determined whether the diamond wire 200 has a worn section.

[0030] First, the basic cutting process is executed, that is, the diamond wire 200 is started to cut the silicon rod M; the diamond wire 200 is driven to transmit along with the main roller 100, and the rotation of the main roller 100 drives the diamond wire 200 to move at a certain speed, forming a high-speed moving wire network; the silicon rod M is controlled to feed in the direction of the wire network so that the diamond wire 200 contacts the silicon rod M, and the silicon rod M is cut through the grinding action of the diamond abrasive grains; at this time, the diamond wire 200 is in a normal transmission state, the wire network tension remains stable, the silicon rod M is evenly stressed, and the cutting process continues.

[0031] Further, such as Figure 2 As shown, in the above basic cutting process, the main roller 100 partitioning and temperature monitoring are deployed; the main roller 100 is evenly divided into a number of continuous and non-overlapping areas 110 along the axial direction (such as divided into 4-20 areas 110), and the width of the area 110 is set according to the length of the main roller 100 and the detection accuracy requirements; a non-contact temperature sensor 400 is set at the corresponding position of each area 110. In one embodiment, the non-contact temperature sensor 400 can be an infrared temperature sensor, which is used to obtain the temperature change of the surface of the main roller 100 per unit time in real time (such as collecting the temperature once per second and calculating the temperature difference between two adjacent collections).

[0032] It is understandable that, taking a main roller 100 as an example, Figure 2 As shown, the main roller 100 is divided into independent detection units. The temperature changes in each area 110 can be monitored separately, and the location of the temperature anomaly can be accurately located. Of course, for accurate detection and positioning, the method of the present application can also be performed on each main roller 100. Furthermore, when the diamond wire 200 contacts the main roller 100, the wear segment generates more heat due to increased friction, which will cause the temperature of the corresponding area 110 of the main roller 100 to rise. The wear segment can be located through partitioned monitoring, avoiding the ambiguity of overall monitoring. The continuous main roller 100 is converted into discrete detection areas 110, providing a spatial reference for local wear positioning. The temperature change can directly reflect the friction state between the wear segment of the diamond wire 200 and the main roller 100.

[0033] By comparing the temperature change with the preset threshold, a three-level judgment is made based on the time sequence and spatial position to accurately identify the local wear of the diamond wire 200: The first level determination includes: in any area 110 , if the temperature change is greater than a preset threshold, determining that the diamond wire 200 is abnormal.

[0034] The second level of determination includes: if the temperature change in each region 110 at the same time exceeds a preset threshold, the diamond wire 200 is determined to have no worn segments. Alternatively, if the temperature change in any region 110 at the same time exceeds the preset threshold, while the temperature changes in the remaining regions 110 do not exceed the preset threshold, the diamond wire 200 is determined to have at least one worn segment.

[0035] Level 3 judgment: In the time sequence, the temperature variation in the area 110 along the direction of the main roller 100 is greater than the preset threshold; it is determined that the wear segment is transmitted along the direction of the main roller 100 with the diamond wire 200.

[0036] Specifically, the first-level judgment is used for preliminary abnormality detection of the diamond wire 200, and the judgment logic is: in any area 110, if the temperature change is greater than a preset threshold value (such as 3°C, 4°C, 5°C), the diamond wire 200 is judged to be abnormal; when the diamond wire 200 is cutting normally, the friction between the diamond wire 200 and the main roller 100 is stable, and the temperature change is small (such as ≤2°C). Local wear will increase the friction coefficient and significantly increase the temperature change; the temperature abnormality in a single area 110 indicates that the diamond wire 200 segment corresponding to the area 110 may be worn or interfered with by other factors, and further verification is required; the temperature abnormality is an intuitive manifestation of the abnormal state of the diamond wire 200. By setting a reasonable threshold, the potential problem area 110 can be quickly screened out, providing a basis for subsequent judgment; in this way, the area 110 where the problem may exist can be quickly identified to avoid missing the potential wear segment, and the efficiency of the initial screening is improved.

[0037] The second level of determination is used to eliminate interference and confirm wear of the diamond wire 200. Based on the abnormal results of the first level of determination, system interference is eliminated by comparing the temperatures of multiple regions 110: In the first case, at the same time, the temperature change in each area 110 is greater than the preset threshold, and it is determined that the diamond wire 200 has no worn section. It should be noted that in this case, the deflection and cutting of the silicon rod M may cause the overall pressure of the wire mesh to increase, and the friction is generally enhanced. In the second case: at the same moment, the temperature change of only any one area 110 is greater than the preset threshold, and the temperature change of the remaining areas 110 does not exceed the preset threshold, and it is determined that the diamond wire 200 has at least one wear segment. It should be noted that, in this case, the wear segment generates heat by friction with the main roller 100 when passing through the area 110.

[0038] Synchronous temperature anomalies in multiple regions 110 indicate systemic factors (such as silicon rod M offset and deflection), while anomalies in a single region 110 point to local wear, enabling a preliminary distinction between interference and wear. Systemic interference such as silicon rod M offset will affect the stress state of the entire wire network, causing the temperature of all regions 110 to rise synchronously. Local wear only affects the corresponding region 110, and temperature anomalies are localized, which can be effectively distinguished by comparing multiple regions 110. This eliminates misjudgments caused by systemic interference and improves the accuracy of wear determination.

[0039] The third-level judgment is used to verify the movement state of the wear segment. The judgment logic is: in terms of timing, the subsequent areas 110 along the axial direction of the main roller 100 (i.e., the movement direction of the diamond wire 200) successively have temperature changes greater than the preset threshold, and it is determined that the wear segment is transmitted along the direction of the main roller 100 with the diamond wire 200; the timing association is based on the fact that the diamond wire 200 continuously moves along the main roller 100, and the wear segment will pass through different areas 110 in turn, causing the temperature of the corresponding area 110 to increase in time sequence, and the temperature rise interval matches the movement speed of the diamond wire 200.

[0040] The temperature-abnormal area 110 migrates sequentially along the movement direction of the diamond wire 200, forming a continuous temperature-abnormal trajectory, which is consistent with the movement path of the wear segment. The wear segment moves with the diamond wire 200, and its corresponding temperature-abnormal area 110 will also move axially along the main roller 100 over time. The existence and movement state of the wear segment can be confirmed through time series analysis to avoid misjudging it as an equipment failure in the fixed area 110. In this way, the authenticity and movement characteristics of the wear segment can be further verified, and interference factors such as local failure of the main roller 100 can be eliminated, thereby improving the judgment accuracy.

[0041] Further, such as Figure 3 、 4 As shown, the present application also includes tension compensation based on the area 110 where the wear segment is located. After confirming the existence of the wear segment and locating its motion trajectory, directional compensation is achieved through tension adjustment of the area 110. The wire mesh portion corresponding to the transmission of the area 110 is defined as the wire mesh area 210; the area 110 where the wear segment is located is defined as the target area 110; the slicer also includes a tension component 300, the number of tension components 300 is the same as the number of areas 110 and is arranged one-to-one, the tension component 300 is connected to the wire mesh area 210 corresponding to the area 110 to adjust the tension of the wire mesh area 210; in the next reciprocating cycle of the diamond wire 200, when it is determined that the wear segment is located in the target area 110, the tension component 300 corresponding to the target area 110 increases the tension of the corresponding wire mesh area 210 to perform cutting tension compensation.

[0042] Specifically, for ease of understanding, such as Figure 3 As shown, defining the wire mesh area 210 means: the portion of the wire mesh corresponding to the area 110 of each main roller 100 is the wire mesh area 210, that is, the wire mesh portion composed of the diamond wire 200 segments in the area 110; defining the target area 110 means: the area 110 of the main roller 100 where the current wear segment is located; as shown Figure 4 As shown, the slicer also includes a tension assembly 300, which is used to perform tension compensation on the target area 110. The number of tension assemblies 300 is the same as the number of areas 110 and is arranged in a one-to-one correspondence. The tension assembly 300 is transmission-connected to the corresponding wire mesh area 210 and can adjust the tension of the wire mesh area 210; that is, the tension assembly 300 corresponds one-to-one with the wire mesh area 210 and can independently control the wire mesh tension of each area 110, providing a structural basis for directional compensation. It should be noted that since the rigidity of the silicon rod M cannot be locally pressurized, by adjusting the tension of the wire mesh area 210 where the wear segment is located, the present application specifically improves the cutting force of this area 110 to compensate for the insufficient cutting capacity of the wear segment.

[0043] like Figure 4As shown, the tension assembly 300 includes a plurality of tension rollers 310; a position between the wire mesh area 210 corresponding to the target area 110 and the previous wire mesh area 210 is defined as a first transition area 220; a position between the wire mesh area 210 corresponding to the target area 110 and the next wire mesh area 210 is defined as a second transition area 230; The “previous wire mesh area 210” refers to the wire mesh portion corresponding to the adjacent area 110 located before the current target area 110 in the direction of movement of the diamond wire 200, and corresponds to the wire mesh portion of the previous target area 110 (i.e., the area 110 passed by the wear segment before entering the current target area 110); the “next wire mesh area 210” refers to the wire mesh portion corresponding to the adjacent area 110 located after the current target area 110 in the direction of movement of the diamond wire 200, and corresponds to the wire mesh portion of the next target area 110 (i.e., the area 110 that the wear segment is about to enter after leaving the current target area 110).

[0044] “When it is determined that the wear segment is located in the target area 110, the tension component 300 corresponding to the target area 110 increases the tension of the corresponding wire mesh area 210 to perform cutting tension compensation” includes: the tension value of the tension roller 310 acting on the corresponding wire mesh area 210 increases linearly from the reference value to the compensation value along the direction from the first transition area 220 to the second transition area 230, and linearly decreases from the compensation value to the reference value to make the tension transition smoothly.

[0045] More specifically, in the next reciprocating cycle of the diamond wire 200, when it is determined that the wear segment is located in the target area 110, the corresponding tension component 300 is started; the tension component 300 corresponding to the target area 110 is controlled to increase the tension of the wire mesh area 210 (such as from the reference value 10N to 12N) to enhance the cutting force; the present application performs tension smoothing processing near the transition area, and defines the transition between the target area 110 and the previous wire mesh area 210 as the first transition area 220, and the transition with the next wire mesh area 210 as the second transition area 230. The tension roller 310 is used to linearly increase the tension value from the reference value to the compensation value along the direction from the first transition area 220 to the second transition area 230, and then linearly decrease to the reference value. The tension changes smoothly in the transition zone to avoid sudden changes that may cause wire mesh vibration and ensure a stable cutting process. Sudden changes in tension can cause the wire mesh to deviate laterally and cause chipping of the silicon wafer edge. The linear transition can make the wire mesh bear the force evenly and ensure the edge quality of the silicon wafer. The cutting force in the compensation area 110 is increased by 20%-30%, and the cutting capacity of the worn section is restored. At the same time, the tension in the transition zone is stable, and the chipping rate of the silicon wafer is reduced by 60%.

[0046] It should be noted that a complete "reciprocating cycle" refers to the unidirectional movement of the diamond wire 200 from "paying out from the pay-off shaft → passing through the wire mesh cutting area of ​​the main roller 100 → winding up to the take-up shaft", and the reverse movement of "paying out from the take-up shaft in the reverse direction → passing through the wire mesh cutting area again → winding up to the pay-off shaft", forming a "forward → reverse" cycle. After the wear section is detected in the current cycle, the diamond wire 200 completes this cycle (such as from paying out to taking up) and enters the next cycle stage of passing through the wire mesh area 210; "the diamond wire 200 in the next reciprocating cycle" means that after the diamond wire 200 completes a movement from paying out to taking up, The reverse motion cycle can use the wear segment position information detected in the previous cycle to prepare for compensation in advance when it passes through the target area 110 next time; to ensure the accuracy of compensation, since it takes time to detect the wear segment, the wear segment position detected in the current cycle will repeatedly pass through the same area 110 in the next cycle. By using this periodicity, compensation can be started in advance to avoid untimely compensation due to detection delays in the current cycle; at the same time, combined with the previous detection results, the position and movement trajectory of the wear segment can be accurately known, and targeted compensation can be performed in the next cycle to improve efficiency and accuracy and avoid incorrect compensation.

[0047] In one embodiment, the tension value can be adjusted by intuitively changing the height of the tension roller 310. When the height of the tension roller 310 is raised, the diamond wire 200 is lifted upward, the wire web tension increases, and the tension value increases; lowering the height decreases the tension. In this embodiment, the linear change in tension corresponds to the linear adjustment of the height of the tension roller 310. From the first transition zone 220 to the second transition zone 230, the height of the tension roller 310 gradually increases from the reference position to the compensation position and then gradually returns to the reference position. This continuous change in height achieves a smooth transition of tension from the reference value to the compensation value, avoiding tension fluctuations caused by sudden height changes. At the same time, multiple groups of tension rollers 310 can be provided, each group of tension rollers 310 can transmit one or more diamond wires 200, ensuring that the tension of all diamond wires 200 in the area 110 is adjusted in a coordinated manner, improving the consistency of compensation.

[0048] It should be noted that the lifting method of the tension roller 310 can be: linearly driving the tension roller 310 or deflecting the tension roller 310 through the bracket so that the tension roller 310 can be lifted and lowered. The bracket can be set inside the space surrounded by the diamond wire 200, and the bracket can be connected to a liquid receiving tank, an external frame or other fixedly mounted structure.

[0049] Furthermore, the compensation time range is also included. The tension compensation time range is: started when the temperature change of the current target area 110 exceeds the preset threshold; and ended when the temperature change of the next target area 110 exceeds the preset threshold.

[0050] Activation time: The temperature change in the current target area 110 exceeds a preset threshold. When the worn segment enters the current target area 110, the friction between the diamond wire 200 and the main roller 100 intensifies due to the increased friction coefficient caused by wear. The surface temperature of the main roller 100 rises significantly within a short period of time (typically 0.5-1 second). When the temperature change exceeds a preset threshold (such as 3°C, 4°C, or 5°C), it can be determined that the worn segment has fully entered the target area 110. At this time, initiating tension compensation can accurately match the cutting time of the worn segment. At this time, the worn segment is in full contact with the wire web in the current area 110, and insufficient cutting force is most prominent. Increasing tension immediately enhances the grinding effect, avoiding localized undercutting of the silicon wafer (such as excessive thickness or surface scratches) caused by delayed compensation.

[0051] Ending moment: The temperature change in the next target area 110 is greater than the preset threshold. The diamond wire 200 moves along the main roller 100 at a constant speed, and the wear segment will pass through the adjacent areas 110 in sequence with the diamond wire 200; when the wear segment of the current target area 110 leaves and enters the next area 110, the temperature of the main roller 100 in the next area 110 will exceed the preset threshold due to increased friction. At this time, the wear segment of the previous area 110 has completely detached, and tension compensation can be stopped to ensure that the compensation time is completely matched with the actual elapsed time of the wear segment; "next target area 110" specifically refers to "when the diamond wire 200 is driven along the axial direction of the main roller 100, the movement direction of the diamond wire 200 is the adjacent area 110 of the axial direction of the main roller 100", that is, the next target area is the adjacent area along the direction of movement of the diamond wire.

[0052] The present application also provides a slicer, such as Figure 1 As shown, the slicer includes a main roller 100, a diamond wire 200, a non-contact temperature sensor 400 and a tension assembly 300. The main roller 100 has at least two, which are divided into several areas 110 along the axial direction for supporting and transmitting the diamond wire 200; the diamond wire 200 is wound between the main rollers 100 to form a wire mesh, and the silicon rod M is located on the wire mesh and cut; the non-contact temperature sensor 400 is arranged above, to the side or near the main roller 100, and the number of the non-contact temperature sensors 400 corresponds one-to-one to the area 110, and is used to obtain the temperature change of the main roller 100 in the corresponding area 110; the number of the tension assembly 300 is the same as that of the area 110 and corresponds one-to-one, and is transmission-connected to the wire mesh area 210 corresponding to the area 110, and is used to adjust the tension of the wire mesh area 210.

[0053] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0054] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A cutting method for a slicer, characterized in that: Applicable to a slicer, the slicer comprising: Main rollers (100), there are at least two main rollers (100); A diamond wire (200), the diamond wire (200) being wound between the main rollers (100) so that the diamond wire (200) forms a wire mesh between the main rollers (100), and a silicon rod (M) is positioned on the wire mesh and cut; The cutting method comprises: The diamond wire (200) is driven and the silicon rod (M) is cut by the diamond wire (200); Based on the temperature change amount and a preset threshold, it is determined whether the diamond wire (200) has a worn section.

2. The cutting method of a slicer according to claim 1, characterized in that: The "determining whether the diamond wire (200) has a worn section based on the temperature change and the preset threshold value" includes a first-level determination: In any area (110), if the temperature change is greater than a preset threshold; It is determined that the diamond wire (200) is abnormal.

3. The cutting method of a slicer according to claim 2, characterized in that: Also includes the second level of determination: At the same moment, in each region (110), if the temperature change is greater than a preset threshold; It is determined that the diamond wire (200) has no worn section.

4. The cutting method of a slicer according to claim 2, characterized in that: Also includes the second level of determination: At the same time, in any one area (110), if the temperature change is greater than a preset threshold, the temperature change in the remaining areas (110) does not exceed the preset threshold; It is determined that the diamond wire (200) has at least one worn segment.

5. The cutting method of a slicer according to claim 4, characterized in that: Also includes the third level of determination: In a time sequence, the regions (110) along the direction of the main roller (100) successively have temperature changes greater than a preset threshold value; The wear segment is determined to be transmitted along the direction of the main roller (100) along the diamond wire (200).

6. The cutting method of a slicer according to claim 5, characterized in that: The wire mesh portion of the area (110) corresponding to the transmission is defined as the wire mesh area (210); and the area (110) where the wear section is located is defined as the target area (110); The slicer further includes a tension assembly (300), the number of the tension assemblies (300) being the same as the number of the areas (110) and being arranged in a one-to-one correspondence, and the tension assembly (300) being transmission-connected to the wire mesh area (210) corresponding to the area (110) to adjust the tension of the wire mesh area (210); In the next reciprocating cycle of the diamond wire (200), when it is determined that the worn section is located in the target area (110), the tension component (300) corresponding to the target area (110) increases the tension of the corresponding wire mesh area (210) to perform cutting tension compensation.

7. The cutting method of a slicer according to claim 6, characterized in that: The tension assembly (300) includes a plurality of tension rollers (310); a position between a wire mesh area (210) corresponding to the target area (110) and a previous wire mesh area (210) is defined as a first transition area (220); a position between a wire mesh area (210) corresponding to the target area (110) and a next wire mesh area (210) is defined as a second transition area (230); The method of "when it is determined that the wear section is located in the target area (110), causing the tension component (300) corresponding to the target area (110) to increase the tension of the corresponding wire mesh area (210) to perform cutting tension compensation" includes: The tension value of the tension roller (310) acting on the corresponding wire mesh area (210) is linearly increased from the reference value to the compensation value along the direction from the first transition area (220) to the second transition area (230), and linearly decreased from the compensation value to the reference value, so that the tension transitions smoothly.

8. The cutting method of a slicer according to claim 6, characterized in that: The tension compensation time range is: Start at the moment when the temperature change of the current target area (110) is greater than a preset threshold; and The process ends when the temperature change of the next target area (110) is greater than a preset threshold.

9. A slicer, characterized in that: include: Main rollers (100), there are at least two main rollers (100), and the main rollers (100) are divided into a plurality of areas (110) along the axial direction; A diamond wire (200), the diamond wire (200) being wound between the main rollers (100) so that the diamond wire (200) forms a wire mesh between the main rollers (100), and a silicon rod (M) is positioned on the wire mesh and cut; A non-contact temperature sensor (400), wherein the non-contact temperature sensor (400) comprises a plurality of non-contact temperature sensors (400), the non-contact temperature sensors (400) correspond one-to-one to the regions (110), and the non-contact temperature sensors (400) are used to obtain a temperature change corresponding to the region (110) within a unit time.

10. A slicer according to claim 9, characterized in that: Also includes: Tension components (300), the number of tension components (300) is the same as the number of areas (110) and is arranged in a one-to-one correspondence, and the tension components (300) are transmission-connected to the wire mesh area (210) corresponding to the area (110) to adjust the tension of the wire mesh area (210).

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