Mold monitoring sensor for production management and control

Abstract

The invention provides a mold monitoring sensor for production management and control. The mold monitoring sensor comprises a shell, an infrared correlation counter, a temperature sensor, an anti-disassembly device, a vibration sensor, an embedded processor and a Bluetooth communication module. The infrared correlation counter monitors the production takt and number, the temperature sensor monitors the mold temperature, the anti-dismantling device prevents illegal dismantling, the vibration sensor prevents cheating, the embedded processor processes data and judges abnormity, and the Bluetooth communication module achieves data interaction with a Bluetooth base station and an internet cloud. The device is novel in structural design, can comprehensively monitor parameters such as the mold position, the production takt, the temperature and the production quantity, and has reliable anti-disassembly and anti-cheating functions. Through the Bluetooth communication technology, the system can be connected with the Internet cloud and then is in butt joint with an MES system, intelligent management of the production process is achieved, the production efficiency and the product quality are effectively improved, and the high-precision and intelligent requirements of the modern manufacturing industry for mold monitoring are met.

Description

Technical Field

[0001] The present invention relates to the field of mold monitoring technology, and in particular to a mold monitoring sensor for production control. Background Art

[0002] In modern manufacturing, molds are essential production tools, widely used in numerous fields, including automotive, electronics, and machinery. The operating status of molds directly impacts product quality, production efficiency, and the company's economic benefits. However, existing mold monitoring technologies suffer from numerous flaws, severely limiting the effectiveness of production control.

[0003] Existing mold monitoring methods are often limited to one method: counting or temperature monitoring. Counting alone only captures the mold's production quantity, but fails to reveal other critical parameters, such as temperature fluctuations and movement. Temperature monitoring alone only reflects the mold's thermal state, but offers no information on the mold's production cycle or abnormal movement. This one-sided monitoring approach fails to fully reflect the mold's actual operating status, making it difficult to detect many potential problems during production.

[0004] Existing mold monitoring technology is susceptible to fraudulent activity, resulting in inaccurate data. In scenarios requiring precise production counts or process monitoring, unscrupulous individuals may tamper with counting devices or intentionally damage monitoring equipment like temperature sensors to conceal production issues or seek personal gain. Inaccurate data can mislead production decisions, impacting product quality and efficiency, and causing significant financial losses to businesses.

[0005] Traditional mold monitoring equipment has limited functionality and cannot effectively connect to the Manufacturing Execution System (MES). MES systems play a vital role in modern manufacturing, responsible for comprehensive monitoring and management of the production process, including the development and execution of production plans, the allocation of production resources, and product quality tracking. Because monitoring equipment cannot effectively connect to the MES system, data from the production process cannot be transmitted to the MES system in a timely and accurate manner. This prevents companies from achieving comprehensive monitoring and refined management of the production process, and makes it difficult to quickly respond to various changes and issues in the production process. Therefore, it is necessary to design a mold monitoring sensor for production control. Summary of the Invention

[0006] The present invention provides a mold monitoring sensor for production control to solve the problems of existing mold monitoring technology, such as incomplete monitoring, susceptibility to cheating interference, and inability to effectively connect with the MES system. It realizes intelligent management of the production process and provides accurate and efficient data support for the company's production control.

[0007] The present invention provides a mold monitoring sensor for production control, including a housing, an infrared radiation counter, a temperature sensor, a vibration sensor, an embedded processor, and a Bluetooth communication module:

[0008] The housing is composed of an upper cover and a lower cover, which are buckled and connected to each other, forming a storage space between the upper cover and the lower cover;

[0009] The infrared radiation counter, temperature sensor, vibration sensor, embedded processor and Bluetooth communication module are all arranged in the accommodation space and fixedly mounted on the circuit board. The transmitting end and receiving end of the infrared radiation counter are both connected to the circuit board. The circuit board is connected to the electrical connection structure on the inner surface of the upper cover and the lower cover of the product through the conductive voltage strip to achieve electrical conduction;

[0010] A display screen is installed on the surface of the product cover, and the display screen is connected to the product cover through a display screen fixing bracket. The display screen is connected to the circuit board through wires to achieve data transmission and power supply. A screen sealing ring is also installed at the connection between the display screen and the product cover.

[0011] Preferably, an anti-dismantling device is further included, which includes an anti-dismantling button, a reset spring and a reset button. The anti-dismantling button is installed on the side of the product lower cover close to the mold mounting surface, and one end of the anti-dismantling button passes through the product lower cover and is partially exposed on the surface of the product lower cover. The reset spring is sleeved on the part of the anti-dismantling button located inside the product lower cover. The reset button is arranged on the side of the anti-dismantling button close to the reset spring and contacts the anti-dismantling button. The anti-dismantling button, reset spring and reset button are all electrically connected to the circuit board.

[0012] Preferably, it also includes a product fixing bolt, which passes through the mounting hole provided on the lower cover of the product to fix the sensor on the mold, and a sealing gasket is provided between the product fixing bolt and the mounting hole of the lower cover of the product.

[0013] Preferably, a fixing bracket is provided at the bottom of the lower cover of the product, and the bottom of the fixing bracket contacts the surface of the mold, and the fixing bracket is fixedly connected to the lower cover of the product by welding or bolting.

[0014] Preferably, the temperature sensor is installed close to the surface of the mold, the temperature sensor is connected to the mold via a thermally conductive adhesive or a thermally conductive pad, and the signal output end of the temperature sensor is electrically connected to the circuit board.

[0015] Preferably, a Bluetooth communication module is also installed on the circuit board, and the antenna portion of the Bluetooth communication module extends to the edge of the product upper cover or the product lower cover.

[0016] Beneficial effects:

[0017] (1) The present invention has a novel structural design and can comprehensively monitor parameters such as mold position, production rhythm, temperature, and production quantity, and has reliable anti-dismantling and anti-cheating functions. Through Bluetooth communication technology, it can connect to the Internet cloud and then connect to the MES system to achieve intelligent management of the production process, effectively improve production efficiency and product quality, and meet the high-precision and intelligent mold monitoring needs of modern manufacturing.

[0018] (2) The present invention is equipped with an anti-disassembly device that can record the removal time and issue an alarm when the sensor is removed, effectively preventing illegal removal of the sensor and ensuring the integrity and authenticity of the monitoring data. The application of the vibration sensor can monitor the movement state of the mold in real time. Once abnormal vibration is detected, it can be determined whether there is cheating behavior in a timely manner and take corresponding measures to ensure the reliability of the monitoring data and avoid economic losses to the enterprise caused by data falsification.

[0019] The above description is only an overview of the technical solutions of the embodiments of the present invention. In order to more clearly understand the technical means of the embodiments of the present invention, they can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiments of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0021] Figure 1 It is a schematic diagram of the structure of the present invention;

[0022] Figure 2 This is a working principle diagram of the present invention;

[0023] Explanation of the accompanying symbols: product fixing bolt 1, product upper cover 2, screen sealing ring 3, display screen 4, display screen fixing bracket 5, conductive voltage bar 6, circuit board 7, anti-tamper button 8, fixing bracket 9, reset spring 10, reset button 11, product lower cover 12. DETAILED DESCRIPTION

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0025] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0026] See also Figure 1-Figure 2 The present invention discloses a mold monitoring sensor for production control, including a housing, an infrared radiation counter, a temperature sensor, a vibration sensor, an embedded processor and a Bluetooth communication module:

[0027] The housing is composed of a product upper cover 2 and a product lower cover 12, the product upper cover 2 and the product lower cover 12 are buckled and connected to each other, and a receiving space is formed between the product upper cover 2 and the product lower cover 12;

[0028] The infrared counter, temperature sensor, vibration sensor, embedded processor, and Bluetooth communication module are all located within the housing space and fixedly mounted on a circuit board 7. The infrared counter's transmitter and receiver are both connected to the circuit board 7. The mounting positions of the transmitter and receiver ensure that the mold can reliably block infrared light during normal opening and closing of the mold, thereby enabling the infrared counter to accurately count. The circuit board 7 is connected to the electrical connection structures on the inner surfaces of the upper and lower product covers 2 and 12 via conductive strips 6 to achieve electrical continuity.

[0029] A display screen 4 is mounted on the surface of the product cover 2, and the display screen 4 is connected to the product cover 2 via a display screen fixing bracket 5. The display screen 4 is connected to the circuit board 7 via wires to achieve data transmission and power supply. A screen sealing ring 3 is also installed at the connection between the display screen 4 and the product cover 2.

[0030] The present invention also includes an anti-dismantling device, which includes an anti-dismantling button 8, a reset spring 10, and a reset button 11. The anti-dismantling button 8 is installed on the side of the product lower cover 12 close to the mold mounting surface, and one end of the anti-dismantling button 8 passes through the product lower cover 12 and is partially exposed on the surface of the product lower cover 12. The reset spring 10 is sleeved on the part of the anti-dismantling button 8 located inside the product lower cover 12. The reset button 11 is arranged on the side of the anti-dismantling button 8 close to the reset spring 10 and contacts the anti-dismantling button 8. The anti-dismantling button 8, the reset spring 10, and the reset button 11 are all electrically connected to the circuit board 7. Once someone attempts to remove the sensor, the anti-dismantling button will pop out under the action of the reset spring. At this time, the device will immediately record the removal time and trigger an alarm signal through the embedded processor. The alarm signal can be sent to the relevant monitoring terminal through the Bluetooth communication module to alert the staff, effectively preventing the illegal removal of the sensor and ensuring the integrity and authenticity of the monitoring data.

[0031] The present invention also includes a product fixing bolt 1, which passes through the mounting hole set on the product lower cover 12 to fix the sensor on the mold. A sealing gasket is provided between the product fixing bolt 1 and the mounting hole of the product lower cover 12 to prevent dust and water vapor from entering the interior of the sensor.

[0032] In addition, a fixing bracket 9 is provided at the bottom of the product lower cover 12, and the bottom of the fixing bracket 9 contacts the mold surface, providing auxiliary support for the sensor. The fixing bracket 9 is fixedly connected to the product lower cover 12 by welding or bolting.

[0033] In the present invention, the temperature sensor is installed close to the mold surface, and the temperature sensor is connected to the mold through thermal conductive glue or thermal conductive pad, and the signal output end of the temperature sensor is electrically connected to the circuit board 7; a Bluetooth communication module is also installed on the circuit board 7, and the antenna part of the Bluetooth communication module extends to the edge of the product upper cover 2 or the product lower cover 12.

[0034] Working Principle: Infrared radiometers, temperature sensors, vibration sensors, and other sensors collect mold-related data and transmit it to an embedded processor. The embedded processor processes and analyzes this data to determine whether the mold is operating normally. If an abnormality is detected, the embedded processor triggers an alarm and records the relevant data. The processed data is transmitted to a Bluetooth base station via a Bluetooth communication module. The Bluetooth base station then transmits the data to the internet cloud via 4G, Wi-Fi, or a network interface. The internet cloud can exchange data with the MES system, enabling intelligent management of the production process. At the same time, staff can access the internet cloud through terminal devices (such as computers and mobile phones) to view mold monitoring data and operating status in real time.

[0035] Once integrated into the mold monitoring system, this equipment can include mold monitoring sensors, a Bluetooth base station, an MES system, and a cloud platform. The mold monitoring sensor collects data such as mold location, production rhythm, temperature, and production quantity, and features anti-tampering and anti-cheating capabilities. The Bluetooth base station, equipped with 4G, Wi-Fi, and a network interface, receives sensor data and connects to the cloud platform via the internet. The MES system receives data from the cloud platform and performs production planning, quality management, and preventive maintenance. The cloud platform stores and analyzes data and provides data visualization services. The mold monitoring method and system enable comprehensive monitoring of the mold's operating status, features anti-tampering and anti-cheating capabilities, and provides accurate and reliable data. The system can exchange data with the internet cloud via Bluetooth communication technology, enabling intelligent management of the production process.

[0036] In summary, the present invention boasts a novel structural design that comprehensively monitors parameters such as mold position, production rhythm, temperature, and production quantity, while providing reliable anti-tampering and anti-cheating features. Through Bluetooth communication technology, it can connect to the internet cloud and, in turn, the MES system, enabling intelligent management of the production process, effectively improving production efficiency and product quality, and meeting the modern manufacturing industry's demand for high-precision, intelligent mold monitoring.

[0037] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A mold monitoring sensor for production control, characterized in that: Including housing, infrared counter, temperature sensor, vibration sensor, embedded processor and Bluetooth communication module: The housing is composed of a product upper cover (2) and a product lower cover (12), wherein the product upper cover (2) and the product lower cover (12) are buckled and connected to each other, and a receiving space is formed between the product upper cover (2) and the product lower cover (12); The infrared radiation counter, temperature sensor, vibration sensor, embedded processor and Bluetooth communication module are all arranged in the accommodation space and fixedly mounted on the circuit board (7). The transmitting end and the receiving end of the infrared radiation counter are both connected to the circuit board (7). The circuit board (7) is connected to the electrical connection structure on the inner surface of the product upper cover (2) and the product lower cover (12) through the conductive voltage bar (6) to achieve electrical conduction; A display screen (4) is mounted on the surface of the product upper cover (2), and the display screen (4) is connected to the product upper cover (2) via a display screen fixing bracket (5). The display screen (4) is connected to a circuit board (7) via a wire to achieve data transmission and power supply. A screen sealing ring (3) is provided at the connection between the display screen (4) and the product upper cover (2), and a screen sealing ring (3) is also installed.

2. A mold monitoring sensor for production control according to claim 1, characterized in that: The invention also includes an anti-disassembly device, which includes an anti-disassembly button (8), a reset spring (10) and a reset button (11). The anti-disassembly button (8) is installed on a side of the product lower cover (12) close to the mold installation surface, and one end of the anti-disassembly button (8) passes through the product lower cover (12) and is partially exposed on the surface of the product lower cover (12). The reset spring (10) is sleeved on the part of the anti-disassembly button (8) located inside the product lower cover (12). The reset button (11) is arranged on a side of the anti-disassembly button (8) close to the reset spring (10) and contacts the anti-disassembly button (8). The anti-disassembly button (8), the reset spring (10) and the reset button (11) are all electrically connected to the circuit board (7).

3. A mold monitoring sensor for production control according to claim 1, characterized in that: The product further comprises a fixing bolt (1), which passes through a mounting hole provided on the lower cover (12) of the product to fix the sensor on the mold, and a sealing gasket is provided between the fixing bolt (1) and the mounting hole of the lower cover (12).

4. A mold monitoring sensor for production control according to claim 1, characterized in that: A fixing bracket (9) is provided at the bottom of the product lower cover (12), and the bottom of the fixing bracket (9) contacts the mold surface. The fixing bracket (9) is fixedly connected to the product lower cover (12) by welding or bolt connection.

5. A mold monitoring sensor for production control according to claim 1, characterized in that: The temperature sensor is installed close to the surface of the mold, the temperature sensor is connected to the mold via a thermally conductive adhesive or a thermally conductive pad, and the signal output end of the temperature sensor is electrically connected to the circuit board (7).

6. A mold monitoring sensor for production control according to claim 1, characterized in that: A Bluetooth communication module is also installed on the circuit board (7), and the antenna portion of the Bluetooth communication module extends to the edge of the product upper cover (2) or the product lower cover (12).

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