Pin expanding type probe card device and probe head thereof

Abstract

The invention discloses a needle expanding type probe card device and a probe head thereof. The probe head includes two guide plate modules spaced apart from each other, a plurality of conductive probes mounted on the two guide plate modules, and an auxiliary probe. At least one conductive probe abuts against the connecting line of one guide plate module. One end of each conductive probe penetrates out of one guide plate module and is used for abutting against an object to be detected in a separable mode. The auxiliary probes abut against the connecting line so as to be electrically coupled to the corresponding conductive probes. One end of the auxiliary probe is fixed in one guide plate module and is used for facing but not contacting the object to be detected. Accordingly, by arranging the auxiliary probe which is not in contact with the object to be tested, the test efficiency is effectively improved according to the electrical requirements of the conductive probe which is electrically coupled to the auxiliary probe and corresponds to the conductive probe.

Description

Technical Field

[0001] The present invention relates to a probe card device, in particular to an expanded needle type probe card device and a probe head thereof. Background Art

[0002] Existing probe card systems typically use the same number of probes as the metal pads on the object under test. However, the multiple metal pads on the object under test each have different electrical requirements. However, the multiple probes on existing probe card systems employ a roughly identical structure, requiring the same needle pressure. This makes it difficult to adjust the probes to meet the varying electrical requirements of the metal pads. The inventors, believing these deficiencies could be addressed, conducted intensive research and applied scientific principles, ultimately developing a rationally designed, effective solution to these deficiencies. Summary of the Invention

[0003] An object of the embodiments of the present invention is to provide an expanded needle probe card device and a probe head thereof, which can effectively improve the defects that may occur in the existing probe card device.

[0004] An embodiment of the present invention discloses an expanded needle probe card device, which includes: a circuit board; a first guide plate module formed with a connecting circuit; a second guide plate module arranged at a distance from the first guide plate module along a thickness direction, and the second guide plate module is located between the circuit board and the first guide plate module; a plurality of conductive probes mounted on the first guide plate module and the second guide plate module, and at least one conductive probe abuts the connecting circuit; wherein each conductive probe has: a fixing section extending through the second guide plate module and fixed to the circuit board; and a testing section extending through the first guide plate module, and the testing section is used to detachably abut one of a plurality of metal pads of an object to be tested; and at least one auxiliary probe mounted on the first guide plate module and the second guide plate module, and at least one auxiliary probe abuts the connecting circuit to electrically couple to the corresponding conductive probe; wherein at least one auxiliary probe has: a connecting section extending through the second guide plate module and fixed to the circuit board; and a mounting section fixed within the first guide plate module, and the mounting section is used to face but not contact the object to be tested along the thickness direction.

[0005] Preferably, the number of the conductive probes is equal to the number of the metal pads of the object to be tested, and a portion of the object to be tested that is faced by at least one auxiliary probe in the thickness direction is not provided with any metal pad.

[0006] Preferably, the plurality of conductive probes and the at least one auxiliary probe are distributed in a matrix shape.

[0007] Preferably, the plurality of conductive probes are respectively defined as a plurality of ground probes and a plurality of signal probes, the plurality of ground probes are all in contact with the connection lines, and the plurality of signal probes are divided into two probe groups, and the plurality of ground probes, the connection lines and at least one auxiliary probe separate the two probe groups.

[0008] Preferably, the needle diameter of at least one auxiliary probe is equal to the needle diameter of any one of the conductive probes.

[0009] Preferably, the expanded needle probe card device further includes: a spacer plate clamped between the first guide plate module and the second guide plate module; and a first electronic component connected to the connecting line; wherein at least one auxiliary probe is electrically coupled to the corresponding conductive probe through the connecting line and the first electronic component.

[0010] Preferably, in a cross section perpendicular to the thickness direction and passing through the first electronic component, the plurality of conductive probes, the at least one auxiliary probe, and the first electronic component are distributed in a matrix.

[0011] Preferably, the number of at least one auxiliary probe is plural, and the plurality of auxiliary probes are connected to the connecting circuit; wherein the expanded needle probe card device further includes a second electronic component connected to the connecting circuit, which is located between two adjacent auxiliary probes.

[0012] An embodiment of the present invention also discloses a probe head of an expanded needle probe card device, which includes: a first guide plate module, formed with a connecting circuit; a second guide plate module, arranged at a distance from the first guide plate module along a thickness direction; a plurality of conductive probes, mounted on the first guide plate module and the second guide plate module, and at least one conductive probe abuts the connecting circuit; wherein each conductive probe has: a fixed section, passing through the second guide plate module; and a test section, passing through the first guide plate module, and the test section is used to detachably abut against one of a plurality of metal pads of a test object; and at least one auxiliary probe, mounted on the first guide plate module and the second guide plate module, and at least one auxiliary probe abuts against the connecting circuit to electrically couple to the corresponding conductive probe; wherein at least one auxiliary probe has a mounting section, which is fixed within the first guide plate module, and the mounting section is used to face but not contact the test object.

[0013] Preferably, the probe head further includes: a spacer, clamped between the first guide plate module and the second guide plate module; and a first electronic component, connected to the connecting line; wherein, at least one auxiliary probe is electrically coupled to the corresponding conductive probe through the connecting line and the first electronic component; wherein, in the cross section perpendicular to the thickness direction and passing through the first electronic component, multiple conductive probes, at least one auxiliary probe and the first electronic component are distributed in a matrix shape.

[0014] In summary, the expanded needle probe card device and its probe head disclosed in the embodiment of the present invention are provided with at least one auxiliary probe that does not contact the object to be tested, so as to effectively improve the test performance according to the electrical requirements of the corresponding conductive probe electrically coupled to at least one auxiliary probe.

[0015] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional schematic diagram of the probe head of the expanded needle probe card device according to the first embodiment of the present invention being applied to an object to be tested.

[0017] Figure 2 for Figure 1 Schematic cross-sectional view along section line II-II.

[0018] Figure 3 for Figure 1 A partial three-dimensional schematic diagram of .

[0019] Figure 4 FIG1 is a cross-sectional schematic diagram of an expanded needle probe card device according to a second embodiment of the present invention applied to a test object.

[0020] Figure 5 FIG. 1 is a partial three-dimensional schematic diagram of an expanded-needle probe card device according to a second embodiment of the present invention.

[0021] Figure 6 This is a three-dimensional schematic diagram of the probe head of the expanded needle probe card device according to the third embodiment of the present invention being applied to an object to be tested.

[0022] Figure 7 for Figure 6 Schematic cross-sectional view along section line VII-VII.

[0023] Figure 8 for Figure 6 A partial three-dimensional schematic diagram of .

[0024] Figure 9 This is a three-dimensional schematic diagram of a probe head of an expanded needle probe card device according to a fourth embodiment of the present invention being applied to an object to be tested.

[0025] Figure 10 for Figure 9 Schematic cross-sectional view along section line XX.

[0026] Figure 11 for Figure 9 A partial three-dimensional schematic diagram of . DETAILED DESCRIPTION

[0027] The following is an explanation of the implementation of the "expanded needle probe card device and its probe head" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. Please note in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0028] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.

[0029] [Example 1]

[0030] See also Figures 1 to 3 FIG. 1 is a diagram illustrating a first embodiment of the present invention. This embodiment discloses an expanded needle probe card apparatus 1000 comprising a probe head 100 and a circuit board 200 (or a pitch conversion board) fixed to one side of the probe head 100. The other side of the probe head 100 can be used to detachably abut a device under test (DUT) M for testing.

[0031] It should be noted that, to facilitate understanding of this embodiment, the accompanying drawings only show a partial cross-sectional view of the expanded-needle probe card apparatus 1000, thereby clearly illustrating the structure and connection relationships of the various components of the expanded-needle probe card apparatus 1000. However, the present invention is not limited to the accompanying drawings. The following describes the structure and connection relationships of the various components of the expanded-needle probe card apparatus 1000.

[0032] The probe head 100 includes a first guide plate module 1, a second guide plate module 2 spaced apart from the first guide plate module 1 along a thickness direction H, a spacer 3 sandwiched between the first and second guide plate modules 1 and 2, a plurality of conductive probes 4 mounted on the first and second guide plate modules 1 and 2, and a plurality of auxiliary probes 5 mounted on the first and second guide plate modules 1 and 2. The circuit board 200 is adjacent to the second guide plate module 2; that is, the second guide plate module 2 is located between the circuit board 200 and the first guide plate module 1.

[0033] It should be noted that the spacer 3 can be a frame-shaped structure, and the spacer 3 is clamped at the corresponding peripheral parts of the first guide plate module 1 and the second guide plate module 2, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the spacer 3 of the expanded needle probe card device 1000 can also be omitted or replaced by other components. In addition, the probe head 100 is described as being in combination with the circuit board 200, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the probe head 100 can also be used alone (e.g., sold) or in combination with other components.

[0034] In this embodiment, the first guide plate module 1 includes two first guide plates 11, a first spacer 12 sandwiched between the two first guide plates 11 along the thickness direction H, and a connecting line 13 formed on one of the first guide plates 11. The first spacer 12 is sandwiched between the outer portions of the two first guide plates 11, and the first guide plate 11 on which the connecting line 13 is formed is closer to the second guide plate module 2 than the other first guide plate 11.

[0035] Furthermore, in this embodiment, the two first guide plates 11 have substantially the same structure. Therefore, for ease of explanation, the following description focuses solely on the upper first guide plate 11 and the connecting lines 13 formed thereon. However, the present invention is not limited thereto. For example, in other embodiments not shown, the structures of the two first guide plates 11 may be slightly different; alternatively, each first guide plate 11 may have its own connecting line 13 formed thereon.

[0036] More specifically, the first guide plate 11 is flat and has two first plate surfaces 111 located on opposite sides thereof, and a plurality of first through-holes 112 extending through the two first plate surfaces 111. In this embodiment, the plurality of first through-holes 112 preferably have the same size and are arranged in a matrix. The plurality of first through-holes 112 are divided into a first through-hole group G1, a second through-hole group G2, and a third through-hole group G3. The first through-hole group G1 separates the second through-hole group G2 and the third through-hole group G3, but the present invention is not limited thereto.

[0037] Furthermore, the connecting line 13 is generally arranged along one of the first through-hole groups G1. In other words, the connecting line 13 is arranged on the surface of the first guide plate 11 along the first through-hole group G1 corresponding to the first through-hole group G1 and on the wall of the first through-holes 112 corresponding to the first through-hole group G1, so that the connecting line 13 can abut against and electrically connect the plurality of conductive probes 4 and the auxiliary probes 5 passing through the corresponding first through-hole group G1.

[0038] Furthermore, the second guide plate module 2 includes two second guide plates 21 and a second spacer 22 sandwiched between the two second guide plates 21 along the thickness direction H. Each second guide plate 21 is flat and has two second plate surfaces 211 located on opposite sides thereof and a plurality of second through-holes 212 extending through the two second plate surfaces 211. The second spacer 22 is sandwiched between the outer portions of the two second guide plates 21.

[0039] Furthermore, in this embodiment, the two second guide plates 21 employ substantially identical structures, and each second guide plate 21 is substantially identical in structure to any one of the first guide plates 11, but lacks the connecting line 13. However, the present invention is not limited thereto. For example, in other embodiments not shown, the structures of the two second guide plates 21 may differ slightly; or the size of the second through-hole 212 of each second guide plate 21 may differ from the size of the first through-hole 112 of the first guide plate 11.

[0040] The plurality of conductive probes 4 respectively pass through the plurality of first through-holes 112 of each first guide plate 11, and the plurality of conductive probes 4 also respectively pass through the plurality of second through-holes 212 of each second guide plate 21. At least one of the plurality of conductive probes 4 abuts against the connection line 13. Accordingly, in actual use, each conductive probe 4 can be positioned by offsetting the first guide plate module 1 and the second guide plate module 2 (not shown in the figure).

[0041] Specifically, each conductive probe 4 has a fixed section 41 and a testing section 42 located at opposite ends, and an extension section 43 connecting the fixed section 41 and the testing section 42. In each conductive probe 4, the fixed section 41 extends through the second guide plate module 2 and is fixed to the circuit board 200, while the testing section 42 extends through the first guide plate module 1 and is configured to detachably contact one of the plurality of metal pads M1 of the object under test M.

[0042] Furthermore, in actual application (not shown in the figure), the test section 42 of each of the conductive probes 4 can be positioned by the mutual misalignment of the two first guide plates 11, and the fixed section 41 of each of the conductive probes 4 can be positioned by the mutual misalignment of the two second guide plates 21, and the extension section 43 of each of the conductive probes 4 can be elastically deformed due to the mutual misalignment of the first guide plate module 1 and the second guide plate module 2, but is not limited to this.

[0043] From another perspective, the structures of the plurality of conductive probes 4 are substantially the same in this embodiment and are respectively defined as a plurality of ground probes 4a and a plurality of signal probes 4b, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the structures of the plurality of conductive probes 4 may also be slightly different; or, the conductive probes 4 may be defined as types other than the ground probes 4a and the signal probes 4b (e.g., power probes) based on actual needs.

[0044] The plurality of ground probes 4a and the plurality of auxiliary probes 5 are inserted into the first through-hole group G1 and abut the connecting line 13 to be electrically coupled to each other. In other words, the connecting line 13 enables the plurality of auxiliary probes 5 abutting thereon to be electrically coupled to the corresponding conductive probes 4. Furthermore, the plurality of signal probes 4b pass through the second through-hole group G2 and the third through-hole group G3, respectively, to be divided into two probe groups. The plurality of ground probes 4a, the connecting line 13, and the two auxiliary probes 5 separate the two probe groups.

[0045] More specifically, the structures of the plurality of auxiliary probes 5 are substantially the same in this embodiment. Therefore, for ease of description, the following description focuses on only one of the auxiliary probes 5. However, the present invention is not limited thereto. For example, in other embodiments not shown, the structures of the plurality of auxiliary probes 5 may be slightly different.

[0046] In this embodiment, the auxiliary probe 5 has a connecting section 51 and a mounting section 52. The connecting section 51 passes through the second guide plate module 2 and is fixed to the circuit board 200, while the mounting section 52 is fixed within the first guide plate module 1 and is used to face but not contact the object under test M. In this embodiment, the auxiliary probe 5 (the mounting section 52) has at least one barb 53 formed at the end thereof for fixing within one of the first through-holes 112 of the first guide plate 11 where the connecting line 13 is not formed.

[0047] Furthermore, the plurality of conductive probes 4 and the plurality of auxiliary probes 5 are arranged in a matrix. The number of the conductive probes 4 is equal to the number of the metal pads M1 of the object M to be tested, and each auxiliary probe 5 faces a portion of the object M to be tested along the thickness direction H that is not equipped with any metal pads M1. Furthermore, the needle diameter of each auxiliary probe 5 is substantially equal to the needle diameter of any one of the conductive probes 4.

[0048] [Example 2]

[0049] See also Figure 4 and Figure 5 As shown, this is the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated here. The differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:

[0050] In this embodiment, the probe head 100 includes one auxiliary probe 5. Accordingly, according to the first and second embodiments, the probe head 100 may include at least one auxiliary probe 5. In other words, the probe head 100 may be provided with the auxiliary probe 5 in the thickness direction H corresponding to the portion not provided with the metal pad M1, depending on actual needs.

[0051] [Example 3]

[0052] See also Figures 6 to 8 As shown, this is the third embodiment of the present invention. Since this embodiment is similar to the above-mentioned second embodiment, the similarities between the two embodiments will not be described in detail. The differences between this embodiment and the above-mentioned second embodiment are roughly described as follows:

[0053] In this embodiment, the probe head 100 further includes a first electronic component 6 (e.g., a passive component) connected to the connection line 13. The first electronic component 6 is mounted on the first guide plate 11 on which the connection line 13 is formed, and the auxiliary probes 5 pass through the connection line 13 and the first electronic component 6 to be electrically coupled to the corresponding conductive probes 4.

[0054] Specifically, in a cross section perpendicular to the thickness direction H and passing through the first electronic component 6, the plurality of conductive probes 4, the auxiliary probes 5, and the first electronic component 6 are arranged in a matrix. To put it another way, on the first guide plate 11 having the connection circuits 13 formed thereon, the first electronic component 6 and the plurality of first through-holes 112 are arranged in a matrix, and the portion of the object under test M that the first electronic component 6 faces along the thickness direction H is not equipped with any of the metal pads M1.

[0055] [Example 4]

[0056] See also Figures 9 to 11 As shown, this is the fourth embodiment of the present invention. Since this embodiment is similar to the third embodiment, the similarities between the two embodiments will not be described in detail. The differences between this embodiment and the third embodiment are roughly described as follows:

[0057] In this embodiment, the probe head 100 includes a plurality of auxiliary probes 5, and the plurality of auxiliary probes 5 are connected to the connection line 13. Furthermore, the expanded needle probe card apparatus 1000 (or the probe head 100) further includes a second electronic component 7 (e.g., a passive component) connected to the connection line 13. The second electronic component 7 is mounted on the first guide plate 11 on which the connection line 13 is formed, and is located between two adjacent auxiliary probes 5, such that the second electronic component 7 is electrically coupled to the two adjacent auxiliary probes 5 through the connection line 13.

[0058] [Technical Effects of the Embodiments of the Invention]

[0059] In summary, the expanded needle probe card device and its probe head disclosed in the embodiment of the present invention are provided with at least one auxiliary probe that does not contact the object to be tested, so as to effectively improve the test performance according to the electrical requirements of the corresponding conductive probe electrically coupled to at least one auxiliary probe.

[0060] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the patent scope of the present invention.

Claims

1. An expanded needle probe card device, characterized in that: The expanded needle probe card device comprises: a circuit board; A first guide plate module is formed with a connecting circuit; a second guide plate module, spaced apart from the first guide plate module along a thickness direction, and located between the circuit board and the first guide plate module; A plurality of conductive probes are mounted on the first guide plate module and the second guide plate module, and at least one of the conductive probes abuts against the connecting line; wherein each of the conductive probes has: a fixing section passing through the second guide plate module and fixed to the circuit board; and a testing section passing through the first guide plate module and configured to detachably abut against one of the plurality of metal pads of a test object; and At least one auxiliary probe is mounted on the first guide plate module and the second guide plate module, and at least one auxiliary probe abuts against the connecting line to electrically couple to the corresponding conductive probe; wherein at least one auxiliary probe has: a connecting section passing through the second guide plate module and fixed to the circuit board; and A mounting section is fixed in the first guide plate module, and the mounting section is used to face the object to be measured along the thickness direction but not to contact the object to be measured.

2. The expanded needle probe card device according to claim 1, wherein: The number of the conductive probes is equal to the number of the metal pads of the object to be tested, and a portion of the object to be tested that at least one auxiliary probe faces along the thickness direction is not provided with any metal pad.

3. The expanded needle probe card device according to claim 2, wherein: The plurality of conductive probes and at least one auxiliary probe are distributed in a matrix shape.

4. The expanded needle probe card device according to claim 1, wherein: The plurality of conductive probes are respectively defined as a plurality of ground probes and a plurality of signal probes. The plurality of ground probes are all in contact with the connection line, and the plurality of signal probes are divided into two probe groups. The plurality of ground probes, the connection line and at least one auxiliary probe separate the two probe groups.

5. The expanded needle probe card device according to claim 1, wherein: The needle diameter of at least one of the auxiliary probes is equal to the needle diameter of any one of the conductive probes.

6. The expanded needle probe card device according to claim 1, wherein: The expanded needle probe card device further comprises: a spacer plate, clamped between the first guide plate module and the second guide plate module; and A first electronic component is connected to the connection circuit; wherein at least one auxiliary probe is electrically coupled to the corresponding conductive probe through the connection circuit and the first electronic component.

7. The expanded needle probe card device according to claim 6, wherein: In a cross section perpendicular to the thickness direction and passing through the first electronic component, the plurality of conductive probes, at least one auxiliary probe, and the first electronic component are distributed in a matrix.

8. The expanded needle probe card device according to claim 6, wherein: There are multiple auxiliary probes, and the multiple auxiliary probes are connected to the connecting circuit. The expanded needle probe card device further includes a second electronic component connected to the connecting circuit, which is located between two adjacent auxiliary probes.

9. A probe head of an expanded needle probe card device, characterized in that: The probe head of the expanded needle probe card device includes: A first guide plate module is formed with a connecting circuit; a second guide plate module, spaced apart from the first guide plate module along a thickness direction; A plurality of conductive probes are mounted on the first guide plate module and the second guide plate module, and at least one of the conductive probes abuts against the connecting line; wherein each of the conductive probes has: a fixed section extending through the second guide plate module; and a testing section passing through the first guide plate module and configured to detachably abut against one of the plurality of metal pads of a test object; and At least one auxiliary probe is installed on the first guide plate module and the second guide plate module, and at least one auxiliary probe abuts the connecting line to be electrically coupled to the corresponding conductive probe; wherein, at least one auxiliary probe has a mounting section, which is fixed within the first guide plate module, and the mounting section is used to face but not contact the object to be tested.

10. The probe head of the expanded needle probe card device according to claim 9, wherein: The probe head further comprises: a spacer plate, clamped between the first guide plate module and the second guide plate module; and a first electronic component connected to the connecting circuit; wherein at least one auxiliary probe is electrically coupled to the corresponding conductive probe through the connecting circuit and the first electronic component; In a cross section perpendicular to the thickness direction and passing through the first electronic component, the plurality of conductive probes, at least one auxiliary probe, and the first electronic component are distributed in a matrix shape.

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