Optical module provided with heat sink and suitable for co-packaging optical architecture, and optical communication system

Abstract

The invention discloses an optical module suitable for a CPO framework. The optical module comprises a shell, a substrate, a plurality of optical communication components and a plurality of heat dissipation pieces, the substrate is arranged in the shell. The optical communication assembly is arranged on the mounting surface of the substrate. The heat dissipation pieces are arranged between the installation face of the substrate and the shell at intervals, and the heat dissipation pieces are arranged corresponding to the optical communication assemblies respectively.

Description

Technical Field

[0001] The present invention relates to an optical module, and in particular to an optical module comprising a heat sink and suitable for a co-packaged optics (CPO) architecture. Background Art

[0002] CPO technology co-packages electronic integrated circuits (EICs) and photonic integrated circuits (PICs) onto the same substrate. This technology brings optical communication components closer to the processing chip, addressing challenges faced by small form-factor pluggable optical transceivers, including thermal management, power consumption, bandwidth, and port density.

[0003] However, there are still some problems to be overcome in the application of co-packaging optical technology in existing optical modules. Summary of the Invention

[0004] The present invention provides an optical module, which helps to solve the problem of applying co-packaging optical technology in existing optical modules.

[0005] The optical module disclosed in this invention is suitable for a CPO architecture and comprises a housing, a substrate, multiple optical communication components, and multiple heat sinks. The substrate is disposed within the housing. The optical communication components are mounted on a mounting surface of the substrate. The heat sinks are spaced apart between the mounting surface of the substrate and the housing, and are positioned corresponding to the optical communication components.

[0006] The present invention further discloses an optical communication system having a CPO architecture, comprising a carrier board and an optical module. The carrier board includes a special application integrated circuit chip. The optical module is disposed on the carrier board and is communicatively connected to the special application integrated circuit chip. The optical module includes a housing, a substrate, a plurality of optical communication components, and a plurality of heat sinks. The substrate is disposed within the housing. The substrate has a mounting surface and an electrical connection surface facing each other, and the electrical connection surface has a plurality of conductive terminals in contact with the carrier board. The optical communication components are disposed on the mounting surface of the substrate. The heat sinks are spaced apart from each other between the mounting surface of the substrate and the housing, and these heat sinks are respectively disposed corresponding to these optical communication components.

[0007] The optical module disclosed in the present invention is suitable for a CPO architecture, and includes a housing, a substrate, a first optical communication component, a second optical communication component, a first heat sink and a second heat sink. The substrate is disposed in the housing. The substrate includes a main board and a daughter board, the main board and the daughter board each having a mounting surface, and the daughter board is disposed on the mounting surface of the main board. The first optical communication component is disposed on the mounting surface of the main board. The second optical communication component is disposed on the mounting surface of the daughter board. The first heat sink is disposed between the mounting surface of the main board and the housing, and the first optical communication component is in thermal contact with the first heat sink through the main board. At least a portion of the second heat sink is between the second optical communication component and the housing, and the second optical communication component is in thermal contact with the second heat sink. The main board has relative mounting surfaces and an electrical connection surface, and the electrical connection surface has a plurality of conductive terminals.

[0008] According to the optical module and optical communication system disclosed in the present invention, multiple heat sinks are arranged between the mounting surface of the substrate and the housing, which can realize a thermal management method in which multiple heat sinks are used to share the heat dissipation work in an optical module suitable for a CPO architecture, thereby preventing heat accumulation in any heat sink.

[0009] The above description of the content of the present invention and the following description of the embodiments are intended to demonstrate and explain the spirit and principles of the present invention, and to provide further explanation for the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 FIG. 4 is a perspective schematic diagram of an optical module according to an embodiment of the present invention.

[0011] Figure 2 for Figure 1 A three-dimensional schematic diagram of the light module from another perspective.

[0012] Figure 3 for Figure 1 Schematic diagram of the optical module in the figure.

[0013] Figure 4 for Figure 3 Schematic side view of the optical module in FIG.

[0014] Figures 5 to 7 for Figure 4 Schematic diagram of the heat dissipation path of the optical module.

[0015] Figure 8 for Figure 4 A three-dimensional schematic diagram of the internal optical fiber of the optical module crossing the heat sink.

[0016] Figure 9 FIG. 1 is a schematic diagram of an optical communication system according to an embodiment of the present invention.

[0017] [Description of Reference Numerals]

[0018] Optical module 1

[0019] Optical communication system 2

[0020] Carrier board 21

[0021] External optical fiber 22

[0022] Application-specific integrated circuit chips 23

[0023] Housing 10

[0024] Optical coupler 20

[0025] Motherboard 30

[0026] Mounting surface 310

[0027] Electrical connection surface 320

[0028] Conductive terminal 321

[0029] Daughterboard 40

[0030] Mounting surface 410

[0031] Optical communication components 50

[0032] Optical communication unit 510

[0033] Electronic components 520

[0034] Optical communication components 60

[0035] Optical communication unit 610

[0036] Electronic components 620

[0037] Optical communication components 70

[0038] Optical communication unit 710

[0039] Electronic components 720

[0040] Heat sinks 81, 82, 83

[0041] Strip groove 821

[0042] Internal fiber 90

[0043] Heat transfer paths P1, P2, P3 DETAILED DESCRIPTION

[0044] The following detailed description of the features and advantages of the present invention is intended to enable one of ordinary skill in the art to understand the technical content of the present invention and implement it accordingly. Furthermore, based on the disclosure, scope of protection, and accompanying drawings, one of ordinary skill in the art can readily understand the relevant objectives and advantages of the present invention. The following examples further illustrate the concepts of the present invention and are not intended to limit the scope of the present invention in any way.

[0045] With the increasing demand for higher transmission rates, such as 1.6Tbps, 3.2Tbps, and even 6.4Tbps, CPO technology is widely considered a promising solution. Currently, the Optical Internetworking Forum (OIF) has developed a Co-Packaging Framework for CPO to promote the compatibility of global optical internet products. While meeting the OIF's CPO framework, providing optical modules equipped with more active components related to optical communications while also ensuring effective thermal management is one of the challenges currently facing the relevant industry.

[0046] According to an optical module of one embodiment of the present invention, multiple heat sinks are arranged between the mounting surface of the substrate and the housing, which can realize a thermal management method of using multiple heat sinks to share the heat dissipation work in an optical module applicable to the CPO architecture, so as to prevent heat accumulation in any heat sink.

[0047] Part or all of the technical features disclosed in one or more embodiments of the present invention may be configured in combination to achieve corresponding effects.

[0048] The terms "coupled" or "coupled" refer to any connection, link, or similar relationship, and "optical coupling" or "optical coupling" refers to a relationship in which light is transferred (Impart) from one device to another. Unless otherwise specified, devices that are "coupled" or "coupled" to each other do not need to be directly connected to each other and may be separated by intermediate objects.

[0049] Please refer to Figures 1 to 4 ,in Figure 1 is a three-dimensional schematic diagram of an optical module according to an embodiment of the present invention, Figure 2 for Figure 1 A three-dimensional schematic diagram of the light module from another perspective, Figure 3 for Figure 1 The exploded diagram of the optical module in Figure 4 for Figure 3Schematic side view of the optical module in FIG. In this embodiment, the optical module 1 may include a housing 10, an optical coupling element 20, a substrate, an optical communication component 50, an optical communication component 60, an optical communication component 70, and a plurality of internal optical fibers (not shown). The optical module 1 can be understood as an optical transceiver.

[0050] The housing 10 may be a housing that complies with the CPO architecture established by the OIF. Furthermore, the housing 10 may be made of metal. The housing 10 may be a single housing or comprise an upper housing and a lower housing that are assembled together.

[0051] The optical coupler 20 can be disposed within the housing 10. Specifically, at least a portion of the optical coupler 20 can be exposed. One end of the internal optical fiber can be optically coupled to the optical coupler 20. The optical coupler 20 can be understood as a fiber connector or an active optical cable (AOC). Figures 1 to 3 The optical module 1 is exemplarily shown to include three optical coupling elements 20 , but the number of the optical coupling elements 20 is not intended to limit the present invention.

[0052] The substrate can be understood as a single printed circuit board assembly (PCBA) or as including multiple PCBAs. In this embodiment, the substrate may include a main board 30 and a daughter board 40, which are two independent PCBAs. The main board 30 and the daughter board 40 can be accommodated in the housing 10, and the daughter board 40 can be arranged on the mounting surface 310 of the main board 30. Further, the mounting surface 310 can be the top surface of the main board 30, and the daughter board 40 is arranged on the top surface of the main board 30 to allow electrical connection between the circuit of the daughter board 40 and the circuit of the main board 30. In addition, the daughter board 40 can have a mounting surface 410 relative to the mounting surface 310. Further, the mounting surface 410 can be the top surface of the daughter board 40. Here, the combination of the mounting surfaces 310 and 410 can be understood as the mounting surface of the substrate. In other embodiments where the substrate is a single PCBA, the top surface of the single PCBA can be understood as the mounting surface of the substrate.

[0053] The optical communication component 50 can be mounted on the mounting surface 310 of the mainboard 30. The optical communication component 50 may include an optical communication unit 510 and an electronic component 520. The optical communication unit 510 may be, for example, a laser diode, and the electronic component 520 may be, for example, a driver chip. Specifically, the electronic component 520 may be a PIC. The optical communication component 50 may further include an optical modulator, a wavelength division multiplexer, a collimating lens, and / or a digital signal processor (DSP). Figure 3 Two optical communication components 50 are shown as an example, and each optical communication component 50 includes two optical communication units 510 . However, the number of optical communication components 50 is not intended to limit the present invention.

[0054] The optical communication component 60 can be mounted on the mounting surface 410 of the daughterboard 40. The optical communication component 60 may include an optical communication unit 610 and an electronic component 620. The optical communication unit 610 may be, for example, a laser diode, and the electronic component 620 may be, for example, a driver chip. Specifically, the electronic component 620 may be understood as a PIC. The optical communication component 60 may further include an optical modulator, a wavelength division multiplexer, a collimating lens, and / or a DSP. Figure 3 Two optical communication components 60 are shown as an example, and each optical communication component 60 includes two optical communication units 610 . However, the number of optical communication components 60 is not intended to limit the present invention.

[0055] The optical communication component 70 can be mounted on the mounting surface 310 of the mainboard 30. The optical communication component 70 may include an optical communication unit 710 and an electronic component 720. The optical communication unit 710 may be, for example, a photodiode, and the electronic component 720 may be, for example, a transimpedance amplifier. Specifically, the electronic component 720 may be understood as an EIC. The optical communication component 70 may also include a wavelength division multiplexer (WDM) and / or a DSP. Figure 3 Eight optical communication components 70 are shown as an example, and each optical communication component 70 includes four optical communication units 710 . However, the number of optical communication components 70 is not intended to limit the present invention.

[0056] In some embodiments, the optical communication unit 510 of the optical communication component 50 may be a photodiode, and the electronic component 520 may be a transimpedance amplifier. In some embodiments, the optical communication unit 610 of the optical communication component 60 may be a photodiode, and the electronic component 520 may be a transimpedance amplifier. In some embodiments, the optical communication unit 710 of the optical communication component 70 may be a laser diode, and the electronic component 720 may be a driver chip.

[0057] In some embodiments, the optical module 1 may not include Figure 1 In some embodiments, the optical module 1 may not include the optical communication component 50 or the optical communication component 60 shown. Figure 1 The optical communication components 50 and 60 are shown, while only the optical communication component 70 is included.

[0058] In some embodiments, the optical communication components 50 and 60 can be understood as transmitter optical sub-assemblies (TOSAs). In some embodiments, the optical communication component 70 can be understood as receiver optical sub-assemblies (ROSAs).

[0059] The internal optical fiber can be understood as a pigtail or patch cord disposed within the housing 10, which is used to optically couple the optical communication component 50 to the optical coupler 20, the optical communication component 60 to the optical coupler 20, and the optical communication component 70 to the optical coupler 20. The optical signal generated by the optical communication component 50 can be transmitted to the external optical fiber via the internal optical fiber and the optical coupler 20. The optical signal generated by the optical communication component 60 can be transmitted to the external optical fiber via the internal optical fiber and the optical coupler 20. The optical signal transmitted by the external optical fiber can be received by the optical communication component 70 via the optical coupler 20 and the internal optical fiber. The internal optical fiber optically coupled to the optical communication component 70 can be included in a bent fiber array.

[0060] According to one embodiment of the present invention, optical communication component 60 may be further away from optical coupler 20 than optical communication component 50, and optical communication component 70 may be further away from optical coupler 20 than optical communication component 60. More specifically, along the length direction of optical module 1, optical communication component 50, optical communication component 60, and optical communication component 70 are sequentially arranged from optical coupler 20.

[0061] According to one embodiment of the present invention, the substrate may have an electrical connection surface opposite to the mounting surface. Figure 2 As shown, the motherboard 30 may have an electrical connection surface 320 opposite the mounting surfaces 310 and 410. The electrical connection surface 320 can be understood as the substrate or bottom surface of the motherboard 30. The electrical connection surface 320 can have a plurality of conductive terminals 321, each of which can be understood as an exposed metal pad or metal pin formed on the bottom surface of the motherboard 30. The conductive terminals 321 are used to electrically connect the optical communication components 50, 60, and 70 to external circuits, which will be further described below.

[0062] According to one embodiment of the present invention, the optical module 1 may further include a plurality of heat sinks. Figure 3 and Figure 4 As shown, the optical module 1 may include a heat sink 81, a heat sink 82, and a heat sink 83. The heat sinks 81, 82, and 83 may be spaced apart and disposed between the mounting surface 310 of the motherboard 30 and the housing 10. The heat sink 81 may be disposed corresponding to the optical communication component 50, the heat sink 82 may be disposed corresponding to the optical communication component 60, and the heat sink 83 may be disposed corresponding to the optical communication component 70. Figure 3 and Figure 4 The optical module 1 is shown as including three heat sinks, but the specific number of heat sinks is not limited to this. Each heat sink can be understood as a metal member, or a combination of a metal member and a thermal pad. The metal member can be understood as a metal block processed by cutting or a metal sheet processed by stamping.

[0063] According to one embodiment of the present invention, the projection of at least one of the heat dissipating elements 81, 82, 83 on the electrical connection surface 320 may overlap with at least a portion of the conductive terminal 321. Figure 2 and Figure 4 As shown, the projections of the heat sink 82 and the heat sink 83 on the electrical connection surface 320 may overlap with some of the conductive terminals 321 . Figure 4 The projections of the heat sinks 82 and 83 on the electrical connection surface 320 are shown as overlapping with the conductive terminals 321, while the projection of the heat sink 81 on the electrical connection surface 320 does not overlap with the conductive terminals 321. However, the present invention is not limited to this. In some embodiments, the projection of the heat sink 83 on the electrical connection surface 320 overlaps with the conductive terminals 321, while the projections of the heat sinks 81 and 82 on the electrical connection surface 320 do not overlap with the conductive terminals 321.

[0064] According to one embodiment of the present invention, the optical communication component 50 can be in thermal contact with the heat sink 81 through the substrate. Figure 5 , which shows a schematic diagram of the heat dissipation path of the optical communication component 50. The heat sink 81 is arranged between the mounting surface 310 of the mainboard 30 and the housing 10, and the heat sink 81 can be between the optical coupler 20 and the optical communication component 50 in the length direction of the optical module 1. A copper plating that is conducive to heat conduction can be formed on the mounting surface 310 of the mainboard 30, and a part of the optical communication component 50 can be in contact with the copper plating. The optical communication component 50 will generate heat energy during operation. For example, at least one of the laser diode and the driver chip therein will generate heat. This heat energy can be transferred to the upper half of the housing 10 via the mainboard 30 and the heat sink 81. Furthermore, a certain proportion of the heat energy will be as follows Figure 5 As shown in the heat transfer path P1 in FIG, the heat is transferred to the upper half of the housing 10 via the heat sink 81 .

[0065] According to one embodiment of the present invention, the optical communication component 60 can be in thermal contact with the heat sink 82. Figure 6 , which shows a schematic diagram of the heat dissipation path of the optical communication component 60. The heat sink 82 is arranged between the mounting surface 310 of the mainboard 30 and the housing 10, and at least a portion of the heat sink 82 is between the mounting surface 410 of the daughter board 40 and the housing 10. More specifically, the heat sink 82 can extend into the gap between the housing 10 and the optical communication component 60. The bottom of the heat sink 82 can be in thermal contact with at least one of the optical communication unit 610 and the electronic component 620 of the optical communication component 60, and the top of the heat sink 82 can be in thermal contact with the inner side surface of the housing 10. The optical communication component 60 generates heat energy during operation, for example, at least one of the laser diode and the driver chip therein will generate heat. This heat energy can be transferred to the upper half of the housing 10 via the heat sink 82. Further, a certain proportion of the heat energy will be as follows Figure 6 As shown in the heat transfer path P2 in FIG, the heat is transferred to the upper half of the housing 10 via the heat sink 82 .

[0066] According to one embodiment of the present invention, the optical communication component 70 can be in thermal contact with the heat sink 83. Figure 7 , which shows a schematic diagram of the heat dissipation path of the optical communication component 70. The heat sink 83 is arranged between the mounting surface 310 of the mainboard 30 and the housing 10, and at least a portion of the heat sink 83 may be between the housing 10 and the optical communication component 70. The bottom of the heat sink 83 may be in thermal contact with at least one of the optical communication unit 710 and the electronic component 720 of the optical communication component 70, and the top of the heat sink 83 may be in thermal contact with the inner side surface of the housing 10. The optical communication component 70 generates heat energy during operation, for example, at least one of the transimpedance amplifier and the DSP therein will generate heat. This heat energy can be transferred to the upper half of the housing 10 via the heat sink 83. Furthermore, a certain proportion of the heat energy will be as follows Figure 7 As shown in the heat transfer path P3 in FIG, the heat is transferred to the upper half of the housing 10 via the heat sink 83 .

[0067] According to one embodiment of the present invention, the internal optical fiber of the optical module 1 can cross the heat sink 82. Figure 4 and Figure 8 ,in Figure 8 for Figure 4 A three-dimensional schematic diagram of an optical module's internal optical fiber crossing a heat sink. The internal optical fiber 90 that optically couples the optical communication component 70 with the optical coupling element 20 can cross the heat sink 82. Specifically, the heat sink 82 can have a strip-shaped groove 821, and the internal optical fiber 90 can be accommodated within the strip-shaped groove 821. Figure 3 and 8 The heat sink 82 is exemplarily shown as having four strip grooves 821 , which respectively accommodate four inner optical fibers 90 of the optical fiber ribbon. However, the number of the strip grooves 821 is not intended to limit the present invention.

[0068] According to one embodiment of the present invention, in addition to the aforementioned heat sinks 81, 82, and 83, the optical module 1 may further include a fourth heat sink (not shown). The fourth heat sink may be disposed on the mounting surface 310 of the motherboard 30 and positioned between the heat sink 81 and the heat sink 82. The fourth heat sink may be in thermal contact with a heat source disposed on the mounting surface 310 (e.g., a microprocessor or circuit wiring for providing drive current to the optical communication component).

[0069] Figure 9 FIG. 2 is a schematic diagram of an optical communication system according to an embodiment of the present invention. The optical communication system 2 with a CPO architecture may include: Figure 1 The optical module 1 is shown, and the optical module 1 can be fixed on a carrier board 21 containing an application-specific integrated circuit (ASIC) chip 23. The optical interface of the optical module 1 can be adapted to the external optical fiber 22, and the electrical interface of the optical module 1 can be electrically connected to the ASIC chip 23. Figure 9An optical communication system 2 comprising a total of sixteen optical modules 1 is exemplarily depicted, wherein each optical module 1 can have a signal transmission rate of 3.2 Tbps, and the application-specific integrated circuit chip 23 can have a signal transmission rate of 51.2 Tbps. Figure 2 The conductive terminals 321 of the electrical connection surface 320 of the mainboard 30 can contact the carrier 21. More specifically, the optical communication components 50, 60, 70 of the optical module 1 can be electrically connected to the ASIC chip 23 via the conductive terminals 321 and the carrier 21.

[0070] In a CPO architecture, since the substrate (mainboard 30) needs to directly contact the carrier board 21, a heat sink cannot be placed underneath the substrate. As a result, heat generated by optical or electronic components cannot be transferred from the lower half of the housing 10 (e.g., the lower shell) to the upper half of the housing 10 (e.g., the upper shell), leading to serious heat accumulation. According to one embodiment of the present invention, multiple heat sinks 81, 82, and 83 are arranged between the mounting surface 310 of the substrate and the housing 10. This enables a thermal management approach in which multiple heat sinks share the heat dissipation burden, thereby preventing heat accumulation in any of the heat sinks.

Claims

1. An optical module suitable for a co-packaged optical architecture, characterized in that: Include: a housing; a substrate disposed in the housing; A plurality of optical communication components are disposed on a mounting surface of the substrate; as well as A plurality of heat dissipating elements are spaced apart from each other and disposed between the mounting surface of the substrate and the housing. The plurality of heat dissipating elements are respectively disposed corresponding to the plurality of optical communication components.

2. The optical module suitable for co-packaged optical architecture according to claim 1, wherein: An electrical connection surface of the substrate is opposite to the mounting surface, and the electrical connection surface has a plurality of conductive terminals.

3. The optical module suitable for co-packaged optical architecture according to claim 2, wherein: A projection of at least one of the plurality of heat dissipating elements on the electrical connection surface overlaps with at least a portion of the plurality of conductive terminals.

4. The optical module suitable for co-packaged optical architecture according to claim 1, wherein: It further includes an optical coupling member disposed on the housing, wherein the multiple optical communication components include a first optical communication component, a second optical communication component, and a third optical communication component, the second optical communication component is farther away from the optical coupling member than the first optical communication component, and the third optical communication component is farther away from the optical coupling member than the second optical communication component, and the multiple heat dissipation members are respectively disposed corresponding to the first optical communication component, the second optical communication component, and the third optical communication component.

5. The optical module suitable for co-packaged optical architecture according to claim 4, wherein: The first optical communication component and the second optical communication component are each a light transmitting sub-module, and the third optical communication component is a light receiving sub-module.

6. The optical module suitable for co-packaged optical architecture according to claim 4, wherein: The plurality of heat dissipation elements include a first heat dissipation element between the optical coupling element and the first optical communication component, and the first optical communication component is in thermal contact with the first heat dissipation element through the substrate.

7. The optical module suitable for co-packaged optical architecture according to claim 4, wherein: The plurality of heat dissipating elements include a second heat dissipating element. At least a portion of the second heat dissipating element is located between the housing and the second optical communication component. The second optical communication component is in thermal contact with the second heat dissipating element.

8. The optical module suitable for co-packaged optical architecture according to claim 7, wherein: The substrate includes a main board and a daughter board, the main board and the daughter board each having a mounting surface, the daughter board is arranged on the mounting surface of the main board, the first optical communication component and the third optical communication component are arranged on the mounting surface of the main board, the second optical communication component is arranged on the mounting surface of the daughter board, and the second heat dissipation member is arranged on the mounting surface of the main board and extends between the housing and the mounting surface of the daughter board.

9. The optical module suitable for co-packaged optical architecture according to claim 7, wherein: The invention further comprises an optical fiber for optically coupling the third optical communication component to the optical coupling element, wherein the optical fiber spans the second heat dissipation element.

10. The optical module suitable for co-packaged optical architecture according to claim 9, wherein: The second heat dissipation component has a strip-shaped groove, and the optical fiber is arranged in the strip-shaped groove.

11. The optical module suitable for co-packaged optical architecture according to claim 4, wherein: The plurality of heat dissipating elements include a third heat dissipating element. At least a portion of the third heat dissipating element is located between the housing and the third optical communication component. The third optical communication component is in thermal contact with the third heat dissipating element.

12. An optical communication system with a co-packaged optical architecture, characterized in that: Include: a carrier board including an application-specific integrated circuit chip; and An optical module, disposed on the carrier board and communicatively connected to the application-specific integrated circuit chip, the optical module comprising: a housing; A substrate is disposed in the housing, the substrate having a mounting surface and an electrical connection surface opposite to each other, and the electrical connection surface has a plurality of conductive terminals in contact with the carrier; A plurality of optical communication components are disposed on the mounting surface of the substrate; as well as A plurality of heat dissipating elements are spaced apart from each other and disposed between the mounting surface of the substrate and the housing. The plurality of heat dissipating elements are respectively disposed corresponding to the plurality of optical communication components.

13. The optical communication system with a co-packaged optical architecture according to claim 12, wherein: A portion of at least one of the plurality of heat dissipating elements is located between the housing and the corresponding optical communication component.

14. The optical communication system with a co-packaged optical architecture according to claim 12, wherein: A projection of at least one of the plurality of heat dissipating elements on the electrical connection surface overlaps with at least a portion of the plurality of conductive terminals.

15. An optical module suitable for co-packaged optical architecture, characterized in that: Include: a housing; a substrate disposed in the housing, the substrate comprising a main board and a daughter board, the main board and the daughter board each having a mounting surface, and the daughter board being disposed on the mounting surface of the main board; a first optical communication component, disposed on the mounting surface of the mainboard; a second optical communication component, disposed on the mounting surface of the daughterboard; a first heat sink disposed between the mounting surface of the mainboard and the housing, wherein the first optical communication component is in thermal contact with the first heat sink through the mainboard; as well as a second heat sink, at least partially disposed between the second optical communication component and the housing, the second optical communication component being in thermal contact with the second heat sink; The mainboard has the mounting surface and an electrical connection surface opposite to each other, and the electrical connection surface has a plurality of conductive terminals.

16. The optical module suitable for co-packaged optical architecture according to claim 15, wherein: A projection of at least one of the first heat dissipation element and the second heat dissipation element on the electrical connection surface overlaps with at least a portion of the plurality of conductive terminals.

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